WO2013143262A1 - 微型扬声器及其使用该微型扬声器的电子装置 - Google Patents

微型扬声器及其使用该微型扬声器的电子装置 Download PDF

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Publication number
WO2013143262A1
WO2013143262A1 PCT/CN2012/081702 CN2012081702W WO2013143262A1 WO 2013143262 A1 WO2013143262 A1 WO 2013143262A1 CN 2012081702 W CN2012081702 W CN 2012081702W WO 2013143262 A1 WO2013143262 A1 WO 2013143262A1
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WO
WIPO (PCT)
Prior art keywords
housing
electronic device
microspeaker
sound hole
circuit board
Prior art date
Application number
PCT/CN2012/081702
Other languages
English (en)
French (fr)
Inventor
李运海
宁尚磊
刘光磊
Original Assignee
歌尔声学股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔声学股份有限公司 filed Critical 歌尔声学股份有限公司
Priority to KR1020147030640A priority Critical patent/KR101558226B1/ko
Priority to US14/389,687 priority patent/US9307306B2/en
Publication of WO2013143262A1 publication Critical patent/WO2013143262A1/zh

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/06Arranging circuit leads; Relieving strain on circuit leads
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10General applications
    • H04R2499/11Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers

Definitions

  • the present invention relates to the field of electrical engineering, and in particular to a microspeaker and an electronic device using the same. Background technique
  • the microspeaker includes a vibration system, a housing that houses the fixed vibration system, and an electrical connection that electrically connects the internal circuit and the external circuit.
  • the vibration system includes a diaphragm and a voice coil coupled to the lower side of the diaphragm, and the housing includes an upper side coupled to the diaphragm and a lower side opposite the upper side.
  • the electrical connector includes a conductive portion that is electrically coupled to the external circuit.
  • the conductive portion is usually disposed on the lower side surface of the housing.
  • the micro-speaker of this structure is assembled in a single manner with the electronic device of the terminal, and the position of the micro-speaker in the electronic device cannot be flexibly adjusted, which is disadvantageous for improving the adaptability of the micro-speaker to the assembly of different electronic devices.
  • the mounting position of the microspeaker needs to be determined according to the internal space of the electronic device, and the micro-speaker with a single mounting method is not conducive to the overall deployment of the internal space components of the electronic device, so that the electronic device It is difficult for the device to meet certain performance requirements, such as product thickness, size, and the like.
  • an object of the present invention is to provide a microspeaker and an electronic device using the same, so as to improve the assembly manner of the microspeaker and the electronic device, thereby improving the adaptability of the microspeaker and the electronic device. And it is beneficial to realize the design requirements of the electronic device.
  • the present invention provides a microspeaker including a vibration system, a housing that houses the vibration system, and an electrical connector;
  • the vibration system includes a diaphragm and is coupled to a voice coil on the lower side of the diaphragm, the housing includes an upper side fixedly coupled to the diaphragm and a lower side facing away from the upper side surface, and the electrical connector is fixedly coupled to the housing, wherein
  • the electrical connector is an elastic sheet structure, including a first deformation portion, a second deformation portion, and a connecting portion;
  • the first deformation portion is located at one side of the upper side of the casing, the second deformation portion is located at a side of the lower side of the casing, and the connecting portion electrically connects the first deformation portion and the second portion a deformation portion; the first deformation portion is a structure bent upward; the second deformation portion is a structure bent downward, and a top end of the first deformation portion and a bottom end of the second deformation portion are respectively A first conductive portion and a second conductive portion for electrically connecting to an external circuit are provided.
  • the electrical connector includes an inner pad electrically connected to the lead of the voice coil, the inner pad being electrically connected to the first deformation portion and the second deformation portion at the same time.
  • a preferred solution further includes a front cover coupled to an upper side of the diaphragm, the first conductive portion being higher than a plane where the top end of the front cover is located, and the second conductive portion is lower than the housing The plane at the bottom end.
  • the housing has a rectangular structure, and mounting portions of the electrical connector are mounted on both sides of the short shaft of the housing.
  • the two electrical connectors are symmetrically coupled to both sides of the short axis of the housing.
  • the electrical connector is injection molded in combination with the housing.
  • the electronic device includes the microspeaker; the electronic device further includes a housing, a first sound hole disposed on the housing, and being located inside the housing and facing the first a circuit board of the sound hole; wherein the first conductive portion or the second conductive portion of the micro speaker is electrically connected to the circuit board.
  • a preferred embodiment is that the micro-speaker is coupled to a side of the circuit board away from the first sound hole, the first conductive portion is electrically connected to the circuit board, and the circuit board is directly opposite
  • the first sound hole is provided with a second sound hole formed by the blanking, and the diaphragm is disposed opposite to the second sound hole.
  • a preferred embodiment is that the micro-speaker is coupled to a side of the circuit board adjacent to the first sound hole, the second conductive portion is electrically connected to the circuit board, and the diaphragm is facing the same
  • the first sound hole setting is described.
  • the first conductive portion and the second conductive portion are respectively disposed on the upper side and the lower side of the casing, so that the assembly manner of the micro speaker and the electronic device is diverse, thereby The adaptability of the micro-speaker to the assembly of the electronic device is improved, and the design requirements of the electronic device are facilitated.
  • FIG. 1 is a schematic exploded perspective view of a microspeaker of the present invention
  • FIG. 2 is a schematic perspective view of a microspeaker of the present invention
  • FIG. 3 is a schematic perspective view of a microspeaker of the present invention.
  • FIG. 4 is a schematic perspective view of the electrical connector of the present invention.
  • Figure 5 is a side view showing the structure of the microspeaker of the present invention.
  • FIG. 6 is a schematic structural view of an electronic device of the present invention.
  • Figure 7 is a cross-sectional view showing the structure of the A-A of the electronic device shown in Figure 6;
  • Fig. 8 is a structural schematic view showing the assembly of the microspeaker and the electronic device according to another aspect of the present invention.
  • the same reference numerals are used throughout the drawings to refer to the DETAILED DESCRIPTION OF THE INVENTION
  • FIG. 8 shows well-known structures and devices in block diagram form in order to facilitate describing one or more embodiments.
  • the microspeaker includes a vibration system, a magnetic circuit system, and a housing 12 that houses the fixed vibration system and the magnetic circuit system.
  • the vibration system includes a diaphragm 21 and a voice coil 22 coupled to the lower side of the diaphragm 21, and the housing 12 includes an upper side that is fixedly coupled to the diaphragm 21 and a lower side opposite to the upper side.
  • the magnetic circuit system includes a washer 31, a magnet 32, and a basin frame 33 which are sequentially combined.
  • the magnetic circuit system is housed and fixed by the housing 12, and the magnetic circuit system forms a magnetic gap for accommodating the voice coil 22.
  • the front cover 11 is coupled to the upper side of the diaphragm 21 to form a peripheral frame of the microspeaker together with the housing 12.
  • the microspeaker further includes an electrical connector 4 electrically connecting the internal circuit of the microspeaker to the external circuit, and the electrical connector is fixedly coupled to the housing.
  • the electrical connector 4 and the housing 12 are injection molded. The way is fixed.
  • the electrical connector 4 in this embodiment is an elastic sheet structure, which is two parts that are independent and symmetrical, each of which includes a first deformation portion 41 on the upper side of the housing 12 and a second deformation on the lower side of the housing 12.
  • the first deforming portion 41 and the diaphragm 21 are located on the same side of the housing 12, and the second deforming portion 42 is located on the same side as the bottom wall 331 of the basin frame 33, as shown in FIG. And Figure 3 shows.
  • FIG. 4 is a schematic perspective view of the electrical connector of the present invention. As shown in FIG. 4, the first deformed portion 41 and the second deformed portion 42 are electrically connected by a connecting portion 43 for electrically connecting to the lead of the voice coil 22.
  • the inner pad 44 is electrically connected to the first deformation portion 41 and the second deformation portion 42, that is, the electrical signal passing through the first deformation portion 41 or the second deformation portion 42.
  • the electrical signals in the voice coil 22 can be individually controlled.
  • first deformation portion 41 is a structure bent upward, and the second deformation portion 42 is a structure bent downward; the first deformation portion 41 is provided with a first conductive portion 411 for electrically connecting to an external circuit (for example) As shown in FIG. 2, the bottom end of the second deforming portion 42 is provided with a second conductive portion 421 (shown in FIG. 3) electrically connected to an external circuit, and the first conductive portion 411 and the second conductive portion 421 can directly External circuit contacts make electrical connections.
  • the first conductive portion 411 is higher than the plane of the top end of the front cover 11, and the second conductive portion 421 is lower than the plane where the lower end of the housing 12 is located, as shown in FIG. 2, FIG. 3 and FIG.
  • FIG. 5 such a structure facilitates direct contact between the first conductive portion 411 and the second conductive portion 421 and an external circuit.
  • the housing 12 has a rectangular structure. As shown in FIG. 1 and FIG. 2, the electrical connector 4 is fixedly coupled to the short shaft of the housing 12, and the upper side of the housing 12 is disposed adjacent to the edge of the diaphragm 21. Installation department 121. The electrical connector 4 is fixedly mounted on the mounting portion 121.
  • the electrical connector 4 is not limited to being mounted on the short shaft of the housing 12, and may be mounted on the long axis thereof; or the housing 12
  • Other objects such as a circular shape, a racetrack type, or an elliptical shape, may be used without affecting the practice of the present invention.
  • Figure 6 is a schematic view showing the structure of an electronic device to which the above-described microspeaker is applied
  • Figure 7 is a schematic view showing the structure of the A-A of the electronic device shown in Figure 6 (i.e., a schematic view of the structure after assembly of the microspeaker and the electronic device).
  • the electronic device includes a casing 10, and the casing 10 is provided with a first sound hole 20, and the first sound hole 20 needs to communicate with the diaphragm 21 so that the sound of the micro-speaker can pass through the first sound hole 20.
  • the electronic device includes a casing 10, and the casing 10 is provided with a first sound hole 20, and the first sound hole 20 needs to communicate with the diaphragm 21 so that the sound of the micro-speaker can pass through the first sound hole 20.
  • a circuit board 6 is provided inside the electronic device. As shown, the circuit board 6 is disposed opposite to the first sound hole 20.
  • the micro speaker is disposed on a side of the circuit board 6 facing away from the first sound hole 20, the first conductive portion 411 is electrically connected to the circuit board 6, and the diaphragm 21 is disposed at a position facing the first sound hole 20;
  • a second sound hole 20' is formed on the circuit board 6 facing the first sound hole 20, and the second sound hole 20 is connected to the first sound hole 20 so that the front side of the diaphragm 21 communicates with the first sound hole 20, thereby The sound can be transmitted through the first sound hole 20.
  • the first conductive portion 411 at the top end of the first deforming portion 41 communicates with the circuit of the un-removed portion on both sides of the second sound hole 20' of the wiring board 6, so that the electric signal in the voice coil 22 can be controlled by the first conductive portion 411.
  • Fig. 8 is a schematic view showing the structure of the microspeaker and the electronic device according to another aspect of the present invention.
  • the microspeaker in the present embodiment is disposed on the side of the circuit board 6 adjacent to the first sound hole 20.
  • the diaphragm 21 of the microspeaker is disposed opposite to the first acoustic hole 20, and the second conductive portion 421 at the bottom end of the second deforming portion 42 is electrically connected to the circuit board 6, and the electrical signal in the voice coil 22 can be controlled by the second conductive portion 421.
  • Micro speakers work.
  • the design of the first conductive portion 411 and the second conductive portion 421 on both sides of the micro-speaker can flexibly set the position of the micro-speaker in the electronic device, so that the same micro-speaker can be assembled differently and can be applied.
  • the electronic device of the microspeaker provided by the invention can have more matching options in the process of adjusting the position of the internal components of the electronic device, thereby facilitating the realization of the specific design of the electronic device for thickness, size and the like.
  • the microspeaker according to the present invention and the use of the micro are described by way of example with reference to the accompanying drawings The electronic device of the speaker.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Telephone Set Structure (AREA)

Abstract

本发明公开了一种微型扬声器,微型扬声器的壳体包括上侧面和下侧面,电连接件为弹性片结构,包括位于壳体上侧面的一侧且向上侧弯曲的第一形变部,位于壳体下侧面一侧且向下侧弯曲的第二形变部,以及电连接第一形变部和第二形变部的连接部;并且第一形变部的顶端和第二形变部的底端分别设有第一导电部和第二导电部。这种的微型扬声器装配方式具有多样性,从而提高了微型扬声器与电子装置装配的适配性。一种电子装置包含上述微型扬声器,外壳,第一声孔,以及线路板;其中微型扬声器的第一导电部或第二导电部与线路板电连接。使用这种微型扬声器的电子装置有利于实现电子装置的设计需求。

Description

微型扬声器及使用该微型扬声器的电子装置
技术领域
本发明涉及电学领域, 具体涉及一种微型扬声器及使用该微型扬声器的 电子装置。 背景技术
微型扬声器包括振动系统、 收容固定振动系统的壳体, 以及电连接内部 电路和外部电路的电连接件。 振动系统包括振膜和结合于振膜下侧的音圈, 壳体包括与振膜结合的上侧面和与上侧面相对的下侧面。 电连接件包括与外 部电路电连接的导电部。
现有技术中, 导电部通常设置于壳体的下侧表面。 这种结构的微型扬声 器与终端的电子装置装配时装配的方式单一, 不能灵活地调整微型扬声器在 电子装置中的位置, 不利于提高微型扬声器与不同的电子装置装配的适配性。
再者, 对于需要安装微型扬声器的手机等电子装置, 微型扬声器的安装 位置需要根据电子装置的内部空间而定, 安装方式单一的微型扬声器不利于 电子装置内部空间元器件等的统筹调配, 使电子装置难以达到对某些性能, 如对产品厚度、 尺寸等的要求。
因此, 有必要对上述结构的微型扬声器及其使用该微型扬声器的电子装 置进行改进, 以避免上述缺陷。 发明内容
鉴于上述问题, 本发明的目的是提供一种微型扬声器及使用该微型扬声 器的电子装置, 以使微型扬声器与电子装置的装配方式具有多样性, 从而提 高微型扬声器与电子装置安装的适配性, 并且有利于实现电子装置的设计需 求。
为了实现上述目的, 本发明提供一种微型扬声器, 包括振动系统, 收容 固定所述振动系统的壳体, 以及电连接件; 所述振动系统包括振膜和结合于 所述振膜下侧的音圈, 所述壳体包括固定结合所述振膜的上侧面以及背离所 述上侧表面的下侧面, 所述电连接件与所述壳体固定结合, 其中,
所述电连接件为弹性片结构, 包括第一形变部、 第二形变部和连接部; 其中,
所述第一形变部位于所述壳体上侧面的一侧, 所述第二形变部位于所述 壳体下侧面一侧, 所述连接部电连接所述第一形变部和所述第二形变部; 所 述第一形变部为向上侧弯曲的结构, 所述第二形变部为向下侧弯曲的结构, 并且所述第一形变部的顶端和所述第二形变部的底端分别设有用于与外部电 路电连接的第一导电部和第二导电部。
此外, 优选的方案是, 所述电连接件包括与所述音圈的引线电连接的内 部焊盘, 所述内部焊盘同时与所述第一形变部和所述第二形变部电连接。
此外, 优选的方案是, 还包括结合于所述振膜上侧的前盖, 所述第一导 电部高于所述前盖顶端所在的平面, 所述第二导电部低于所述壳体底端所在 的平面。
此外, 优选的方案是, 所述壳体为矩形结构, 所述壳体短轴的两侧设有 安装所述电连接件的安装部。
此外, 优选的方案是, 所述电连接件有两个, 分别对称结合在所述壳体 短轴的两侧。
此外, 优选的方案是, 所述电连接件与所述壳体注塑结合。
一种电子装置, 其中, 所述电子装置包含所述微型扬声器; 所述电子装 置还包括外壳, 设置于所述外壳上的第一声孔, 以及位于所述外壳内部且正 对所述第一声孔的线路板; 其中所述微型扬声器的第一导电部或第二导电部 与所述线路板电连接。
此外, 优选的方案是, 所述微型扬声器结合于所述线路板远离所述第一 声孔的一侧, 所述第一导电部与所述线路板电连接, 并且所述线路板上正对 所述第一声孔的位置设有去料形成的第二声孔, 所述振膜正对所述第二声孔 设置。
此外, 优选的方案是, 所述微型扬声器结合于所述线路板靠近所述第一 声孔的一侧, 所述第二导电部与所述线路板电连接, 并且所述振膜正对所述 第一声孔设置。 采用上述技术方案后, 与传统结构相比, 本发明在壳体的上侧面和下侧 面上分别设置第一导电部和第二导电部, 使微型扬声器与电子装置的装配方 式具有多样性, 从而提高了微型扬声器与电子装置装配的适配性, 并且有利 于实现电子装置设计需求。 为了实现上述以及相关目的, 本发明的一个或多个方面包括后面将详细 说明并在权利要求中特别指出的特征。 下面的说明以及附图详细说明了本发 明的某些示例性方面。 然而, 这些方面指示的仅仅是可使用本发明的原理的 各种方式中的一些方式。 此外, 本发明旨在包括所有这些方面以及它们的等 同物。 附图说明
通过参考以下结合附图的说明及权利要求书的内容, 并且随着对本发明 的更全面理解, 本发明的其它目的及结果将更加明白及易于理解。 在附图中: 图 1是本发明微型扬声器的立体分解结构示意图;
图 2是本发明微型扬声器的立体结构示意图;
图 3是本发明微型扬声器的立体结构示意图;
图 4是本发明电连接件的立体结构示意图;
图 5是本发明微型扬声器的侧面结构示意图;
图 6是本发明电子装置的结构示意图;
图 7是图 6所示电子装置的 A-A剖面结构示意图;
图 8是本发明另一种方案的微型扬声器与电子装置装配后的结构示意图。 在所有附图中相同的标号指示相似或相应的特征或功能。 具体实施方式 在下面的描述中, 出于说明的目的, 为了提供对一个或多个实施例的全 面理解, 阐述了许多具体细节。 然而, 很明显, 也可以在没有这些具体细节 的情况下实现这些实施例。 在其它例子中, 为了便于描述一个或多个实施例, 公知的结构和设备以方框图的形式示出。
下面结合附图和具体实施例对本发明做进一步详细的描述。 图 1至图 5分别示出了根据本发明实施例的微型扬声器的立体分解和组 合结构示意图。 如图 1至图 5所示, 微型扬声器包括振动系统、 磁路系统、 以及收容固定振动系统和磁路系统的壳体 12。振动系统包括振膜 21和结合于 振膜 21下侧的音圈 22,壳体 12包括与振膜 21固定结合的上侧面以及与上侧 面相对的下侧面。 磁路系统包括依次结合的华司 31、 磁铁 32和盆架 33, 磁 路系统由壳体 12收容固定, 磁路系统形成收容音圈 22的磁间隙。 前盖 11结 合于振膜 21的上侧, 与壳体 12共同形成微型扬声器的外围框架。
此外, 微型扬声器还包括电连接微型扬声器内部电路与外部电路的电连 接件 4, 电连接件与壳体固定结合, 在本发明的一个优选实施方式中, 电连接 件 4与壳体 12通过注塑方式固定结合。 本实施例中的电连接件 4为弹性片结 构, 为相互独立且对称的两部分, 每部分均包括位于壳体 12上侧面的第一形 变部 41和位于壳体 12下侧面的第二形变部 42,其中第一形变部 41和第二形 变部 42均可以用于与外部电路的电连接, 如图 2至图 5所示。 电连接件 4与 壳体 12固定结合后, 其第一形变部 41与振膜 21位于壳体 12的同一侧, 第 二形变部 42与盆架 33的底壁 331位于同一侧, 如图 2和图 3所示。
图 4是本发明电连接件的立体结构示意图。 如图 4所示, 第一形变部 41 与第二形变部 42通过连接部 43电连接, 内部焊盘 44用于与音圈 22的引线 电连接。 本发明提供的这种结构的电连接件 4, 内部焊盘 44同时与第一形变 部 41和第二形变部 42电连接, 即通过第一形变部 41或第二形变部 42上的 电信号均可单独控制音圈 22中的电信号。
此外, 第一形变部 41为向上侧弯曲的结构, 第二形变部 42为向下侧弯 曲的结构;第一形变部 41的顶端设有用于与外部电路电连接的第一导电部 411 (如图 2所示), 第二形变部 42的底端设有与外部电路电连接的第二导电部 421 (如图 3所示), 第一导电部 411和第二导电部 421均可直接与外部电路 接触实现电连接。 其中, 在微型扬声器的各部件组合后, 第一导电部 411 高 于前盖 11顶端所在的平面, 第二导电部 421低于壳体 12低端所在的平面, 如图 2、 图 3和图 5所示, 这种结构有利于实现第一导电部 411和第二导电部 421与外部电路的直接接触。
本实施例中, 壳体 12为矩形结构, 如图 1和图 2所示, 电连接件 4固定 结合于壳体 12的短轴上, 壳体 12上侧面靠近振膜 21边缘的位置设有安装部 121, 电连接件 4固定安装于安装部 121上。
此外, 对于本发明提供的微型扬声器的结构, 还可以进行其他的改进, 例如: 电连接件 4不限于安装于壳体 12的短轴上, 也可以安装于其长轴上; 或者壳体 12也可以为圆形、 跑道型或椭圆形等其他形状, 均不影响本发明的 实施, 均可实现上述目的。
图 6是本发明应用上述微型扬声器的电子装置的结构示意图,图 7是图 6 所示电子装置的 A-A剖面结构示意图 (即微型扬声器与电子装置装配后的结 构示意图)。 如图 6和图 7所示, 电子装置包括外壳 10, 外壳 10上设有第一 声孔 20, 第一声孔 20需要与振膜 21连通使微型扬声器的声音能够通过第一 声孔 20传出。
电子装置内部设有线路板 6, 如图所示, 线路板 6正对第一声孔 20设置。 本方案中, 微型扬声器设置于线路板 6背离第一声孔 20的一侧, 第一导电部 411与线路板 6电连接, 振膜 21设置于正对第一声孔 20的位置; 此外, 线路 板 6上正对第一声孔 20的位置设有去料形成的第二声孔 20', 第二声孔 20, 使振膜 21的前侧与第一声孔 20相连通, 从而使声音可以通过第一声孔 20传 出。第一形变部 41顶端的第一导电部 411与线路板 6第二声孔 20 ' 两侧未去 料部分的电路连通, 从而可以通过第一导电部 411控制音圈 22中的电信号。
图 8是本发明另一种方案的微型扬声器与电子装置装配后的结构示意图, 如图 8所示,本方案中的微型扬声器设置于线路板 6靠近第一声孔 20的一侧。 微型扬声器的振膜 21正对第一声孔 20设置, 第二形变部 42底端的第二导电 部 421与线路板 6电连接, 可以通过第二导电部 421控制音圈 22中的电信号 使微型扬声器工作。
这种微型扬声器的两面分别具有第一导电部 411和第二导电部 421 的设 计可以灵活的设置微型扬声器在电子装置中的位置, 从而使同一款微型扬声 器可以有不同的装配方式, 并且可以应用于不同的产品中, 以提高微型扬声 器与电子装置安装的适配性。 采用本发明提供的这种微型扬声器的电子装置, 在电子装置内部元件位置的调配过程中可以有更多的调配选择, 从而有利于 实现电子装置对于厚度、 尺寸等特定设计的需求。 如上参照附图以示例的方式描述根据本发明的微型扬声器及使用该微型 扬声器的电子装置。 但是, 本领域技术人员应当理解, 对于上述本发明所提 出的微型扬声器及使用该微型扬声器的电子装置, 上述的具体描述只是更好 的解释本发明的目的, 在本发明的上述教导下, 本领域技术人员可以在上述 实施例的基础上进行其他的改进和变形, 而这些改进和变形, 都落在本发明 的保护范围内。 因此, 本发明的保护范围应当由所附的权利要求书的内容及 其等同物确定。

Claims

权 利 要 求 书
1、 一种微型扬声器, 包括振动系统、 收容固定所述振动系统的壳体以及 电连接件; 所述振动系统包括振膜和结合于所述振膜下侧的音圈, 所述壳体 包括固定结合所述振膜的上侧面以及背离所述上侧表面的下侧面, 所述电连 接件与所述壳体固定结合, 其特征在于,
所述电连接件为弹性片结构, 包括第一形变部、 第二形变部和连接部; 其中,
所述第一形变部位于所述壳体上侧面的一侧, 所述第二形变部位于所述 壳体下侧面一侧, 所述连接部电连接所述第一形变部和所述第二形变部; 所述第一形变部为向上侧弯曲的结构;
所述第二形变部为向下侧弯曲的结构; 并且,
所述第一形变部的顶端和所述第二形变部的底端分别设有用于与外部电 路电连接的第一导电部和第二导电部。
2、 根据权利要求 1所述的微型扬声器, 其特征在于,
所述电连接件包括与所述音圈的引线电连接的内部焊盘, 所述内部焊盘 同时与所述第一形变部和所述第二形变部电连接。
3、 根据权利要求 2所述的微型扬声器, 其特征在于,
还包括结合于所述振膜上侧的前盖, 所述第一导电部高于所述前盖顶端 所在的平面, 所述第二导电部低于所述壳体底部所在的平面。
4、 根据权利要求 3所述的微型扬声器, 其特征在于,
所述壳体为矩形结构, 所述壳体短轴的两侧设有安装所述电连接件的安 装部。
5、 根据权利要求 4所述的微型扬声器, 其特征在于,
所述电连接件有两个, 分别对称结合在所述壳体短轴的两侧。
6、 根据权利要求 4所述的微型扬声器, 其特征在于,
所述电连接件与所述壳体注塑结合。
7、 一种电子装置, 其特征在于,
所述电子装置包含权利要求 1至 6中任一权利要求所述的微型扬声器; 所述电子装置还包括外壳、 设置于所述外壳上的第一声孔, 以及位于所 述外壳内部且正对所述第一声孔的线路板; 其中
所述微型扬声器的第一导电部或第二导电部与所述线路板电连接。
8、 根据权利要求 7所述的电子装置, 其特征在于,
所述微型扬声器结合于所述线路板远离所述第一声孔的一侧, 所述第一 导电部与所述线路板电连接; 并且
所述线路板上正对所述第一声孔的位置设有去料形成的第二声孔, 所述 振膜正对所述第二声孔设置。
9、 根据权利要求 7所述的电子装置, 其特征在于,
所述微型扬声器结合于所述线路板靠近所述第一声孔的一侧, 所述第二 导电部与所述线路板电连接, 并且所述振膜正对所述第一声孔设置。
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