WO2013127153A1 - 双层电路板系统 - Google Patents

双层电路板系统 Download PDF

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Publication number
WO2013127153A1
WO2013127153A1 PCT/CN2012/079297 CN2012079297W WO2013127153A1 WO 2013127153 A1 WO2013127153 A1 WO 2013127153A1 CN 2012079297 W CN2012079297 W CN 2012079297W WO 2013127153 A1 WO2013127153 A1 WO 2013127153A1
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WO
WIPO (PCT)
Prior art keywords
lever
gusset
circuit board
layer circuit
main board
Prior art date
Application number
PCT/CN2012/079297
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English (en)
French (fr)
Inventor
敖峰
Original Assignee
华为技术有限公司
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Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2013127153A1 publication Critical patent/WO2013127153A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force

Definitions

  • the present invention relates to circuit board technology, and more particularly to a two-layer circuit board system. Background technique
  • the gusset plate is also a circuit board, and the power source and the signal are connected through the connector between the main board and the gusset board.
  • the conventional motherboard gusset assembly method is as shown in FIG. 1.
  • Several support columns 12 are fixed on the main board 11, and then the gusset 13 is fixed to the support column 12 of the main board 11 by screws.
  • the conventional assembly method is suitable for the traditional small gusset plate. installation.
  • IT Information Technology
  • CT computed tomography
  • the upper and lower boards of the double-layer circuit board system (where the lower board is the main board 31, the upper board, ie the gusset 32) are powerful, the number of signals and the power connector between the two boards is increased. The insertion and extraction force required for the connector between the two boards is correspondingly larger and larger, and the power of pure examination is no longer sufficient.
  • a boosting structure is added to the double-layer circuit board system.
  • the power assisting structure is two large power-assisting wrenches (there are one card points on each side of the large power-assisted wrench), and each hand holds a large wrench.
  • the relative force can be used to pull out the large gusset plate. Now insert the large gusset into the motherboard.
  • two large wrenches are connected by one of the left and right connecting rods, one handle can be operated with only one hand to realize the insertion or extraction between the large fastening plate and the main board.
  • the gussets are fastened to the side walls of the chassis by the power wrenches on both sides, so the force is applied in the inserted state as shown in FIG. 4, and the edge regions on both sides of the gusset 41 are under the action of a large wrench. Pressing down (see the downward arrow in Figure 4), the middle area is subjected to the upward resistance of the inter-board connector (see the upward arrow in Figure 4), thus creating a strong tendency to deform. When the gusset is pulled out, the reverse deformation trend occurs. Therefore, when the existing double-layer circuit board system is inserted or removed, the gusset is easily deformed. Summary of the invention
  • the present invention provides a two-layer circuit board system for solving the problem that deformation occurs when the gusset plate is inserted and removed.
  • the present invention provides a two-layer circuit board system, which includes a main board and a gusset plate located above the main board, wherein the main board and the gusset board are electrically connected through a connector, wherein a peripheral portion of the connector is provided with a power assisting mechanism,
  • the power assisting mechanism comprises: a support column, the bottom end is fixed on the main board, and the top end passes through the gusset plate;
  • a lever assembly comprising a fulcrum and a lever, the fulcrum fixing the gusset, the lever being rotatable about the fulcrum, the first end of the lever being hangable on the support column, and the second end being an operation end
  • the technical effect of the invention is: by providing a power assist mechanism near the connector, the resistance of the connector to the insertion and removal process of the gusset plate is overcome, the deformation caused by the gusset plate is avoided, and the area is completely locked, which is helpful. Insert and remove the gusset plate.
  • Figure 1 is a schematic view of a conventional motherboard gusset assembly
  • FIG. 3 is a schematic diagram of a two-layer circuit board system with a relatively complicated and bulky double-layer board structure
  • 4 is a structural diagram of a conventional two-layer circuit board system when a gusset is inserted
  • FIG. 5A to FIG. 5D are schematic diagrams showing the structure of a two-layer circuit board system according to Embodiment 1 of the present invention
  • FIG. Schematic diagram of the two-layer circuit board system structure is detailed description
  • the double-layer circuit board system provided by the embodiment of the present invention includes a main board and a gusset plate located above the main board, wherein the main board and the gusset board are electrically connected through a connector, wherein the connector is provided with a power assisting mechanism, and the power assisting mechanism includes: a column, the bottom end is fixed on the main board, and the top end passes through the gusset plate;
  • a lever assembly comprising a fulcrum and a lever, the fulcrum fixing the gusset, the lever being rotatable about the fulcrum, the first end of the lever being hangable on the support column, and the second end being an operation end, when the operation end is received
  • the gusset is pressed against the main board; when the operating end is subjected to an upward force, the gusset is pulled out of the main board.
  • the double-layer circuit board system provided by the embodiment of the present invention overcomes the resistance generated by the connector during the insertion and removal of the gusset plate by providing a power assist mechanism near the connector, thereby avoiding deformation caused by the gusset plate and completely locking This area helps to insert and remove the gusset plate.
  • the support column may be prismatic or cylindrical, and the top end may be tapered, such as a pyramid, a cone or the like.
  • the gusset relies on this tapered tip to achieve an accurate fit of the connector to the connector on the motherboard.
  • a flange may be disposed in the middle of the support column, and the gusset is located on the flange. If the flange is a larger diameter than the support column, this area can be used to support the gusset.
  • the first end of the lever may be in the shape of a fork so that both the insertion and the withdrawal can be hung on the support post for assistance.
  • the support post is provided with a receiving portion matching the first end, and the first end of the lever is placed.
  • the second end of the lever is provided with a latch for locking the lever.
  • the connector of the gusset is connected to the connector of the motherboard. This latch automatically locks the lever to prevent accidental opening.
  • the support post and the lever assembly are both plurality, and the plurality of lever assemblies pass through the second end of the lever Connected, the plurality of levers form a combined power-assisted wrench, further improving the stability of the connection between the gusset plate and the main board.
  • the number of the power assist mechanisms is equal to the number of connector groups, and no more than two, so as to operate with both hands.
  • the double-layer circuit board system includes a main board 51, a gusset 52, a connector pair 53, and a boosting mechanism 54.
  • the gusset 52 is transparently processed here.
  • the connector pairs between the main board and the gusset are assigned as one or two groups, and the connectors in each group are as close as possible.
  • the connector pairs 53 between the main board 51 and the gusset 52 are two groups, each group has two connector pairs 53, and the boosting mechanism 54 is disposed between the two connector pairs 53 of each group.
  • the assist mechanism 54 includes a guide pin 541, a lever assembly, and a latch 542.
  • the lever assembly includes a wrench 543 and a seat 544.
  • the guide pin 541 is a support column, and the wrench 543 is a lever.
  • the bottom end of the guide pin 541 is fixed to the main plate 51.
  • the top end has a conical shape, passes through the gusset 52, and has a flange 5411 in the middle to support the gusset 52.
  • the first end of the wrench 543 has a fork shape, and the second end is an operation end.
  • the holder 544 is fixed to the upper surface of the gusset 52, and the wrench 543 is movably coupled to the holder 544 near the first end.
  • the wrench 543 is sleeved on the shaft, and the wrench 543 can be rotated around the support 544.
  • the support 544 is sleeved on the shaft of the wrench 543, and the wrench 543 can still rotate around the support 544.
  • the support 544 is provided with a shaft, and the wrench 543 is sleeved on the shaft.
  • the guide pin 541 necessary for accurately guiding the gusset plate is simply deformed, and a small number of slots are added to generate the reaction force required for inserting and removing the gusset plate, and is fixed as a gusset plate to the gusset plate.
  • the guide pin 541 is provided with a first receiving portion 5412 and a second holding portion. 5413.
  • the first receiving portion 5412 is a hole
  • the second receiving portion 5413 is a slit.
  • the first receiving portion 5412 and the second receiving portion 5413 are located above the flange 5411.
  • the latch 542 has a lower hook portion 5421.
  • the connector 52 of the gusset 52 and the main plate 51 are butted together, the latch 542 is pressed, and the lower hook portion 5421 is hooked to the gusset 52.
  • the lower surface of the lock is achieved.
  • the buckle 542 is pressed to unlock, and the lower hook portion 5421 is disengaged from the lower surface of the gusset 52. Then, the second end of the wrench 543 is lifted, the wrench 543 is rotated around the support 544, and the upper end of the first end fork is pressed against the second receiving portion 5413, and the force applied to the second end of the wrench 543 is passed upward.
  • the holder 544 is applied to the gusset 52 to separate the connector pair between the gusset 52 and the main board 51, and the gusset 52 is pulled out.
  • a boosting mechanism is disposed at a position adjacent to the connector, so that the assisting mechanism directly generates a force beside the connector, so that when the main force mechanism is directly pressed against the connector pair, the deformation force is not substantially generated on the circuit board.
  • two or more wrenches can be combined into one large wrench, so that the large gusset can be completely fixed by directly using the wrench structure without using screws.
  • Embodiment 2 This embodiment is basically the same as Embodiment 1.
  • the power assist mechanism in this embodiment is a combination of the power assist mechanisms in Embodiment 1.
  • the assisting mechanism 61 includes two assisting mechanisms 54, that is, one assisting mechanism 61 includes two guiding pins 541, two locking buckles 542, two wrenches 543, and two supports 544.
  • the two wrenches 543 are connected by a connecting rod 62 to form a large wrench, so that the large gusset can be completely fixed by directly using the assisting mechanism, without using screws for fixing.
  • the wrench directly acts on the guide pin on the main board instead of the side wall of the chassis, and the wrench and the connector group are disposed one to one and adjacent to each other, thereby solving the existing solution insertion.
  • the board is deformed, the mechanism is complicated, the production and assembly are difficult, and the structure of the large wrench is wind-proof.
  • the quick-assisted insertion and removal of the upper and lower boards is realized in the most simple way, which is not only lower in cost but also more reliable. high.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

一种双层电路板系统，包括主板（51）及位于主板上方的扣板（52），主板与扣板通过连接器（53）电连接，其中，连接器周边设置有助力机构（54），助力机构包括：支撑柱（541），底端固定在主板上，顶端穿过扣板；杠杆组件，包括支点（544）和杠杆（543），支点固定扣板上，杠杆可绕支点转动，杠杆的第一端可挂在支撑柱上，第二端为操作端，当操作端受到向下作用力时，扣板被压向主板；当操作端受到向上作用力时，扣板被拔离主板。该双层电路板系统避免了扣板插拔时产生的变形。

Description

双层电路板系统
技术领域
本发明涉及电路板技术， 尤其涉及一种双层电路板系统。 背景技术
为了扩展电路板的能力， 或者为了实现电路板的模块化应用， 常常在一 块主电路板（以下简称主板）上再扩展安装一块扣板。 扣板也是电路板， 主 板与扣板间通过连接器实现电源与信号的连通。
传统的主板扣板装配方式如图 1所示， 在主板 11 上先固定几个支撑柱 12, 然后用螺钉将扣板 13固定在主板 11的支撑柱 12上。
其中， 部分或全部螺钉可用图 2所示的弹性卡柱 24来代替， 以提高装配 效率。
由于小扣板与主板间的连接器数量少且插拔力很小， 完全可以用人力直 接实现连接器对的插入与拔出操作， 因此， 传统的装配方式比较适合于传统 的小扣板的安装。 但是随着 IT ( Information Technology , 信息技术) 与 CT ( computed tomography, 计算机断层扫描）产品的发展， 要求单个主扣板系统提供越来 越强的能力， 也就要求提供越来越大的扣板， 从而形成了如图 3所示的较为 复杂和庞大的主板 31和扣板 32的双层电路板系统。
由于双层电路板系统的上下板（其中， 下板即主板 31， 上板即扣板 32 ) 功能都很强大， 使得两块电路板间的信号与电源连接器的针数越来越多， 两 板间的连接器所需的插拔力也就相应的越来越大 , 纯粹考人手的力量已经不 能满足要求。 为了使得主板与扣板间连接器的插拔更容易， 在双层电路板系统中增加 了助力结构。
通常， 助力结构为两个大助力扳手（此大助力扳手左右各有 1个卡点）， 双手各拉住一个大扳手， 相对用力就可实现大扣板的拔出， 相反用力就可实 现大扣板插入主板。 或者用左右各一根连杆将两个大扳手连接起来， 则可以 只用一只手操作一个把手， 来实现大扣板与主板之间的插入配合或者拔出。
以上方案中， 扣板都是通过两侧边的助力扳手扣到机箱侧壁上， 所以在 插入状态下其受力如图 4所示，扣板 41两边的板边区域在大扳手作用下往下 压 （见图 4中向下的箭头）， 中间区域受到板间连接器的往上的阻力 （见图 4 中向上的箭头） ， 所以产生一个很强的变形的趋势。 拔出扣板时则产生相 反的变形趋势， 因此， 现有双层电路板系统在插拔扣板时， 易导致扣板产生 变形。 发明内容
本发明提供一种双层电路板系统， 用于解决扣板插拔时易产生变形的 问题。
本发明提供的一种双层电路板系统， 包括主板及位于主板上方的扣 板， 所述主板与所述扣板通过连接器电连接， 其中， 所述连接器周边设置 有助力机构， 所述助力机构包括： 支撑柱， 底端固定在所述主板上， 顶端穿过所述扣板；
杠杆组件， 包括支点和杠杆， 所述支点固定所述扣板上， 所述杠杆可 绕所述支点转动， 所述杠杆的第一端可挂在所述支撑柱上， 第二端为操作 端， 当所述操作端受到向下作用力时， 所述扣板被压向所述主板； 当所述 操作端受到向上作用力时， 所述扣板被拔离所述主板。
本发明的技术效果是： 通过在连接器附近设置助力机构， 克服了连接 器对在扣板插拔过程中产生的阻力， 避免了扣板由此产生的变形， 同时完 全锁定此区域， 有助于扣板的插拔。 附图说明
图 1为一种传统的主板扣板装配方式图；
图 2为另一种传统的主板扣板装配方式图；
图 3为较为复杂和庞大的双层板结构的双层电路板系统示意图； 图 4为现有的双层电路板系统在插入扣板时的受力图； 图 5A~ 5D为本发明实施例一提供的双层电路板系统结构示意图； 图 6为本发明实施例二提供的双层电路板系统结构示意图。 具体实施方式
本发明实施例提供的双层电路板系统包括主板及位于主板上方的扣 板， 该主板与该扣板通过连接器电连接， 其中， 该连接器周边设置有助力 机构， 该助力机构包括： 支撑柱， 底端固定在该主板上， 顶端穿过该扣板；
杠杆组件， 包括支点和杠杆， 该支点固定该扣板上， 该杠杆可绕该支 点转动， 该杠杆的第一端可挂在该支撑柱上， 第二端为操作端， 当该操作 端受到向下作用力时， 该扣板被压向该主板； 当该操作端受到向上作用力 时， 该扣板被拔离该主板。 本发明实施例提供的双层电路板系统， 通过在连接器附近设置助力机 构， 克服了连接器对在扣板插拔过程中产生的阻力， 避免了扣板由此产生 的变形， 同时完全锁定此区域， 有助于扣板的插拔。
其中， 该支撑柱可棱柱状， 也可为圆柱状， 其顶端可为锥状， 如棱锥、 圓锥等。 扣板依靠此锥状顶端可实现其连接器与主板上连接器的准确配 合。
该支撑柱中部可设有一凸缘， 该扣板位于该凸缘上。 如该凸缘可为一 直径较支撑柱大的区域， 此区域可用于支撑扣板。
该杠杆的第一端可为叉口状， 以便于插入和拔出都可以挂在上述支撑 柱上实现助力。 相应地， 该支撑柱上设置有与该第一端相匹配的盛放部， 放置该杠杆的第一端。
该杠杆的第二端设置有用于锁定该杠杆的锁扣。 当杠杆到位后， 扣板 的连接器已与主板的连接器连接， 此锁扣可以自动锁定杠杆， 避免意外打 开。
该支撑柱和该杠杆组件均为多个， 该多个杠杆组件通过杠杆的第二端 相连， 使得多个杠杆形成组合助力扳手， 进一步提高扣板与主板连接的稳 固性。
该助力机构的数量等于连接器组的数量， 且不多于 2个， 以便于用双 手操作。
实施例一 如图 5 A所示， 本实施例中， 双层电路板系统包括主板 51、 扣板 52、 连接器对 53及助力机构 54。 为了使得双层电路板系统更清晰， 这里将扣 板 52做了透明处理。 一般将主板与扣板间的连接器对分配为 1组或 2组， 每组内的连接器 尽量靠近。 本实施例中， 主板 51与扣板 52间的连接器对 53为两组， 每 组有两个连接器对 53 , 助力机构 54设置于每组的两个连接器对 53之间。 如图 5B所示， 助力机构 54包括导向销 541、 杠杆组件及锁扣 542。 杠杆组件包括扳手 543、 支座 544。 其中， 导向销 541为支撑柱， 扳手 543 为杠杆。 导向销 541的底端固定在主板 51上， 顶端为圆锥状， 穿过扣板 52, 中部具有凸缘 5411 , 支撑住扣板 52。 扳手 543的第一端为叉口状， 第二端为操作端。 支座 544固定在扣板 52的上表面， 扳手 543上靠近第一端的地方与 支座 544可活动地连接。如支座 544上设置有轴，扳手 543套设在该轴上， 扳手 543可绕支座 544转动。 或者如扳手 543上设置有轴， 支座 544套设 在扳手 543的轴上， 扳手 543仍然可绕支座 544转动。 本实施例中， 支座 544上设置有轴， 扳手 543套设在该轴上。 本实施例中， 将精确导向定位扣板所必须的导向销 541 , 加以简单变 形设计， 增加少量切槽， 以用来产生插入与拔出扣板所需的反作用力， 同 时作为扣板固定到主板上的一个支撑点。 如图 5C所示， 导向销 541上设置有第一盛放部 5412和第二盛放部 5413。 第一盛放部 5412为孔， 第二盛放部 5413为切槽。 第一盛放部 5412 和第二盛放部 5413位于凸缘 5411的上方。 当下压扳手 543时， 扳手 543 的第一端叉口状的两个凸起分别嵌入在第一盛放部 5412和第二盛放部 5413中。 锁扣 542具有下钩部 5421 , 当扳手 543在作用力下下压， 使扣板 52 与主板 51之间的连接器对对接后， 按下锁扣 542, 下钩部 5421钩住扣板 52的下表面， 实现锁定。 扣板 52安装后， 双层电路板系统的扣板 52上的 局部结构如图 5D所示， 锁扣 542的下钩部 5421穿过扣板 52。 将扣板 52从双层电路板系统拔出时，按下锁扣 542解锁，下钩部 5421 脱离扣板 52的下表面。 然后抬起扳手 543的第二端， 扳手 543绕支座 544 旋转， 第一端叉口状的上凸起抵住第二盛放部 5413 , 施加在扳手 543第二 端上向上的作用力通过支座 544施加到扣板 52上， 从而将扣板 52与主板 51之间的连接器对分离， 拔出扣板 52。 对应每组连接器在其邻近位置设置 1个助力机构， 使得助力机构直接 在连接器旁边产生作用力， 从而直接下压主力机构对接连接器对时， 基本 不对电路板产生变形力。 为了使扣板安装后的整体更可靠固定， 还可以适当增加螺钉以实现扣 板可靠固定到主板上。 或者， 可将两个或两个以上的扳手组合为一个大扳 手， 从而实现直接利用扳手结构就可完全固定大扣板， 无需采用螺钉来固 定。 实施例二 本实施例与实施例一基本相同， 区别在于： 本实施例中的助力机构是 实施例一中的助力机构的组合。 如图 6所示， 助力机构 61包含了两个助力机构 54, 即一个助力机构 61包括两个导向销 541、 两个锁扣 542、 两个扳手 543及两个支座 544。 两个扳手 543之间通过连杆 62连接， 成为一个大扳手， 实现直接利用助 力机构就可完全固定大扣板， 无需采用螺钉来固定。 上述实施例提供的双层电路板系统中， 扳手直接作用在主板上的导向 销上， 而不是机箱侧壁上， 并且扳手与连接器组 1对 1设置且相互临近， 解决了现有方案插拔过程中电路板变形、 机构复杂、 生产装配困难、 大扳 手结构挡风等问题， 以最筒单的方式实现了上下两块电路板的快速助力插 拔， 不仅成本更低， 且可靠性更高。
最后应说明的是： 以上各实施例仅用以说明本发明的技术方案， 而非 对其限制； 尽管参照前述各实施例对本发明进行了详细的说明， 本领域的 普通技术人员应当理解： 其依然可以对前述各实施例所记载的技术方案进 行修改， 或者对其中部分或者全部技术特征进行等同替换； 而这些修改或 者替换， 并不使相应技术方案的本质脱离本发明各实施例技术方案的范 围。

Claims

权 利 要 求 书
1、 一种双层电路板系统， 包括主板及位于主板上方的扣板， 所述主 板与所述扣板通过连接器电连接， 其特征在于， 所述连接器周边设置有助 力机构， 所述助力机构包括：
支撑柱， 底端固定在所述主板上， 顶端穿过所述扣板；
杠杆组件， 包括支点和杠杆， 所述支点固定所述扣板上， 所述杠杆可 绕所述支点转动， 所述杠杆的第一端可挂在所述支撑柱上， 第二端为操作 端， 当所述操作端受到向下作用力时， 所述扣板被压向所述主板； 当所述 操作端受到向上作用力时， 所述扣板被拔离所述主板。
2、 根据权利要求 1所述的双层电路板系统， 其特征在于， 所述支撑 柱为圆柱状， 顶端为锥状。
3、 根据权利要求 1或 2所述的双层电路板系统， 其特征在于， 所述 支撑柱中部有一凸缘， 所述扣板位于所述凸缘上。
4、 根据权利要求 1或 2所述的双层电路板系统， 其特征在于， 所述 杠杆的第一端为叉口状， 所述支撑柱上设置有与所述第一端相匹配的盛放 部， 放置所述杠杆的第一端。
5、 根据权利要求 1或 2所述的双层电路板系统 , 其特征在于， 所述 杠杆的第二端设置有用于锁定所述杠杆的锁扣。
6、 根据权利要求 1或 2所述的双层电路板系统， 其特征在于， 所述 支撑柱和所述杠杆组件均为多个， 所述多个杠杆组件通过杠杆的第二端相 连。
7、 根据权利要求 1或 2所述的双层电路板系统， 其特征在于， 所述 助力机构不多于 2个。
8、 根据权利要求 1或 2所述的双层电路板系统， 其特征在于， 所述 助力机构的数量等于连接器组的数量。
PCT/CN2012/079297 2012-02-27 2012-07-27 双层电路板系统 WO2013127153A1 (zh)

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