WO2013111720A1 - Dispositif d'inspection de substrat - Google Patents

Dispositif d'inspection de substrat Download PDF

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Publication number
WO2013111720A1
WO2013111720A1 PCT/JP2013/051135 JP2013051135W WO2013111720A1 WO 2013111720 A1 WO2013111720 A1 WO 2013111720A1 JP 2013051135 W JP2013051135 W JP 2013051135W WO 2013111720 A1 WO2013111720 A1 WO 2013111720A1
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WIPO (PCT)
Prior art keywords
substrate
light
reflected light
unit
reflected
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PCT/JP2013/051135
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English (en)
Japanese (ja)
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政則 関
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シャープ株式会社
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Publication of WO2013111720A1 publication Critical patent/WO2013111720A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness

Definitions

  • the present invention relates to a substrate inspection apparatus, and more particularly to a substrate inspection apparatus for inspecting a flat plate-shaped substrate moving in a surface direction.
  • an inspection apparatus for inspecting a substrate is based on information on position coordinates of a position where light on the surface of the substrate is irradiated and information on the height of the substrate based on a detection signal of light reflected from the substrate.
  • An apparatus for detecting the amount of warpage has been proposed (see, for example, Japanese Patent Application Laid-Open No. 2010-175551 (Patent Document 1)).
  • a substrate processing apparatus such as a dry etching apparatus
  • the substrate when a flat substrate is moved in the surface direction, the substrate may be displaced in the movement direction due to deterioration of a substrate support member such as an O-ring.
  • a substrate support member such as an O-ring.
  • problems such as collision of the substrate with peripheral devices occur when the substrate is processed.
  • the substrate surface is irradiated with inspection light, the reflected light that is reflected from the substrate surface is detected, and the time for receiving the reflected light during substrate transport is measured to detect substrate misalignment. is doing.
  • the surface direction of the substrate refers to a direction in which the front surface and the back surface of the flat substrate extend and is orthogonal to the thickness direction of the substrate.
  • the substrate moving in the substrate processing apparatus may be warped and the substrate may be deformed in the thickness direction.
  • This warpage is assumed to be caused by, for example, residual stress generated in the substrate in a pretreatment process such as polishing of the substrate surface, or stress acting on the substrate when the substrate is moved or the weight of the substrate. Is done.
  • the amount of warpage generated on the substrate varies depending on the type of substrate. The reason why the amount of warpage differs for each type of substrate is that the variation in the thickness of the film formed on the substrate surface varies for each type of substrate, resulting in different residual stresses on the substrate, or etching in the etching process. It is assumed that the amount varies from substrate to substrate.
  • the position of the reflected light reflected on the substrate surface changes, so the light reception time of the reflected light changes.
  • the alarm is erroneous because the light reception time of the reflected light is different from the predetermined time even though there is no actual displacement in the substrate movement direction. There was a problem that productivity was lowered.
  • a change in reflected light intensity at a convex portion when a stage on which a substrate is mounted is moved up and down is detected by an upper sensor, and a change in reflected light intensity at a concave portion is detected by a lower sensor.
  • the warp of the substrate is detected by obtaining the height position at which the sensitivity is obtained for both the convex portion and the concave portion and tracing the height position to obtain the height position of the reflecting surface. That is, in the inspection apparatus described in Patent Document 1, the warpage of the substrate is detected by repeating the movement in the surface direction and the movement in the thickness direction of the substrate. Therefore, it has been difficult to detect the warpage of the substrate that continuously moves in the surface direction during the movement.
  • the present invention has been made in view of the above-mentioned problems, and its main purpose is to provide a substrate inspection apparatus that can improve the detection accuracy of the amount of warpage of the substrate.
  • a substrate inspection apparatus includes a substrate transport unit that moves a flat substrate having a surface in a plane direction, and a light irradiation unit that irradiates inspection light in a direction inclined with respect to the surface of the substrate being moved in the plane direction. And a light receiving unit that receives the reflected light reflected by the inspection light on the surface.
  • the light receiving unit includes a plurality of light receiving elements, and is provided so that the intensity of reflected light received by each of the light receiving elements can be output.
  • the substrate inspection apparatus further includes a calculation unit. The calculation unit detects the position of the center of gravity of the reflected light according to the intensity of the reflected light received by each of the light receiving elements, and calculates the amount of warpage of the substrate from the detection result of the position of the center of gravity.
  • the calculation unit calculates the amount of warpage of the substrate based on the position of the surface of the substrate obtained from the position of the center of gravity of the reflected light.
  • the substrate inspection apparatus includes a position detection unit that detects a position in the movement direction of the substrate based on a time during which the light reception unit receives the reflected light, and the position detection unit receives the light reception unit based on the amount of warpage of the substrate. Corrects the set time for receiving reflected light.
  • the substrate inspection apparatus may include an alarm generation unit that issues an alarm according to a difference between a set value of a time at which the light receiving unit receives the reflected light and an actual time at which the light receiving unit receives the reflected light. .
  • the substrate inspection apparatus of the present invention it is possible to improve the detection accuracy of the warpage amount of the substrate moving in the surface direction.
  • FIG. 1 is a schematic diagram showing a configuration of a substrate inspection apparatus 100 according to the present embodiment.
  • a substrate inspection apparatus 100 shown in FIG. 1 is an apparatus for detecting a positional shift of the substrate 1 in the moving direction DR1 of the substrate 1 based on the amount of warpage of the flat substrate 1 having the surface 2.
  • the substrate inspection apparatus 100 includes a substrate transport unit 15, a light irradiation unit 11, and a light receiving unit 12.
  • the substrate transport unit 15 translates the substrate 1 in the movement direction DR1 along the surface direction.
  • the light irradiation unit 11 irradiates the inspection light 21 in a direction inclined with respect to the surface 2 of the substrate 1 moving in the movement direction DR1.
  • the light receiving unit 12 receives the reflected light 22 reflected by the inspection light 21 on the surface 2 of the substrate 1.
  • the substrate transfer unit 15 may be, for example, a vacuum transfer robot or a transfer roller.
  • the inspection light 21 is irradiated from the light irradiation unit 11 onto the surface 2 of the substrate 1 that is moving in the movement direction DR1 by driving the substrate transfer unit 15.
  • the reflected light 22 reflected by the surface 2 of the inspection light 21 is received by the light receiving unit 12.
  • the optical paths of the inspection light 21 and the reflected light 22 are indicated by dotted arrows in FIG.
  • the optical path of the inspection light 21 extends with an inclination with respect to the normal to the surface 2 of the substrate 1. Therefore, the optical path of the reflected light 22 also extends with an inclination with respect to the normal to the surface 2 of the substrate 1.
  • the arrangement of the light irradiation unit 11 and the light receiving unit 12 of the present embodiment is not limited to the example shown in FIG. 1.
  • the inspection light 21 is irradiated perpendicularly to the surface 2 of the substrate 1 through an arbitrary optical member.
  • the reflected light 22 may be reflected perpendicularly to the surface 2 of the substrate 1.
  • the board inspection apparatus 100 also includes a control unit 10 that controls the operation of the board inspection apparatus 100.
  • the control unit 10 includes a calculation unit 13 that calculates the amount of warpage of the substrate 1, a position detection unit 16 that detects the position of the substrate 1 in the movement direction DR 1, and a calculation result and position detection of the amount of warpage of the substrate 1 by the calculation unit 13 And an output unit 14 that outputs a detection result of the position of the substrate 1 by the unit 16.
  • the control unit 10 also includes a substrate drive command unit 17 that commands the drive and stop of the substrate transport unit 15, and a light emission command unit 18 that commands the light irradiation unit 11 to irradiate and stop the inspection light 21.
  • the substrate drive command unit 17 transmits a control signal S1 for instructing the substrate transport unit 15 to drive or stop the substrate transport unit 15.
  • the substrate transport unit 15 that has received the control signal S1 moves the substrate 1 in the movement direction DR1 at a predetermined movement speed, or stops the substrate 1.
  • the light emission command unit 18 transmits a control signal S ⁇ b> 2 for instructing the light irradiation unit 11 to emit or stop the inspection light 21 from the light irradiation unit 11.
  • the light irradiation unit 11 irradiates the inspection light 21 toward the surface 2 of the substrate 1 or stops the irradiation of the inspection light 21.
  • FIG. 2 is an enlarged view showing details of the structure of the light receiving unit 12.
  • the light receiving unit 12 includes a plurality of light receiving elements 32.
  • the light receiving unit 12 is provided so that the intensity of the reflected light 22 received by each of the light receiving elements 32 can be output.
  • the light receiving unit 12 includes a light receiving element 32a that receives reflected light 22 indicated by a solid line arrow in FIG. 2, a light receiving element 32b that receives reflected light 22 indicated by a two-dot chain line arrow in FIG. 2, and one point in FIG. It includes a light receiving element 32c that receives reflected light 22 indicated by a chain line arrow.
  • the light receiving unit 12 may be, for example, a CCD (Charge Coupled Device) sensor.
  • the light receiving unit 12 is provided so that a signal V1 (see FIG. 1) indicating the intensity of the reflected light 22 received by each of the light receiving elements 32 can be output.
  • the signal V1 output from the light receiving unit 12 is input to the calculation unit 13 of the control unit 10.
  • the calculation unit 13 detects the position of the center of gravity of the reflected light 22 according to the intensity of the reflected light 22 received by each of the light receiving elements 32.
  • the calculation unit 13 further calculates the amount of warpage of the substrate 1 based on the position of the surface 2 of the substrate 1 obtained from the detection result of the center of gravity position of the reflected light 22.
  • the position detection unit 16 corrects the set value of the time during which the light receiving unit 12 receives the reflected light 22 based on the amount of warpage of the substrate 1 calculated by the calculating unit 13, and then the light receiving unit 12 receives the reflected light 22.
  • the position in the movement direction DR1 of the substrate 1 is detected based on the time to perform the detection, and it is detected whether or not the position shift in the movement direction DR1 of the substrate 1 has occurred.
  • the positional deviation in the moving direction DR1 of the substrate 1 is detected by obtaining the difference between the set value of the time when the light receiving unit 12 receives the reflected light 22 and the actual time when the light receiving unit 12 received the reflected light. .
  • the difference between the set value of the light reception time of the reflected light 22 and the actual measurement value is equal to or greater than a predetermined threshold value, it is determined that the substrate 1 has been displaced.
  • the output unit 14 outputs that the positional deviation of the substrate 1 has occurred, and transmits a control signal S3 to the alarm generation unit 40.
  • the alarm generation unit 40 receives the control signal S3 and issues an alarm in order to notify the operator that the position shift of the substrate 1 has occurred.
  • the output unit 14 has a display for displaying the amount of warpage of the substrate 1 and / or the amount of displacement of the substrate 1 in the moving direction DR1.
  • the output unit 14 also has an interface unit for transmitting the control signal S3 to the alarm generation unit 40 in accordance with the amount of positional deviation of the substrate 1.
  • the alarm generation unit 40 is configured to visually notify the worker of an alarm, such as a lamp, or to be configured to audibly notify the worker of an alarm, such as a buzzer, or both, or to recognize the occurrence of the alarm to the worker. It may have any other configuration that can be made.
  • FIG. 3 is a schematic diagram showing the reflection of the inspection light 21 in a state where the substrate 1 is not warped.
  • FIG. 4 is a schematic diagram showing the reflection of the inspection light 21 in a state where the convex warpage of the substrate 1 has occurred.
  • FIG. 5 is a schematic diagram showing the reflection of the inspection light 21 in a state where the concave warp of the substrate 1 has occurred.
  • the substrate 1 is warped due to the influence of residual stress or its own weight.
  • the substrate 1 is deformed in the thickness direction so as to be convex toward the surface 2 as shown in FIG. 4 or concave toward the surface 2 as shown in FIG.
  • a convex warp a warp concave toward the surface 2 shown in FIG. 5 is referred to as a concave warp.
  • the amount of warping of the substrate 1 in the case of convex warping is positive, and the amount of warping of the substrate 1 in the case of concave warping is negative.
  • the substrate 1 in a state where an excessive warpage exaggerated more than the warp actually generated in the substrate 1 is generated for easy understanding.
  • the warp actually generated in the substrate 1 is much smaller than the warp shown in FIGS.
  • the reflection angle of the reflected light 22 reflected by the surface 2 of the substrate 1 differs depending on the magnitude of the warp occurring on the substrate 1, but the actual deviation of the reflection angle is negligible. Therefore, it can be considered that the reflection angle of the reflected light 22 does not change. In this case, the amount of change in the height of the surface 2 due to the warp of the substrate 1 can be easily calculated from the intensity of the reflected light 22 received by each light receiving element 32 of the light receiving unit 12.
  • the distance from the emission end 11a from which the inspection light 21 is emitted from the light irradiation unit 11 to the surface 2 of the substrate 1 is denoted by L1.
  • the inspection light 21 is reflected by the surface 2 of the substrate 1, passes through the optical path of the reflected light 22 a shown in FIG. 3, and is received by one of the light receiving elements 32 of the light receiving unit 12.
  • the distance from the emission end 11a of the light irradiation unit 11 to the surface 2 of the substrate 1 when convex warpage occurs in the substrate 1 is L2, which is larger than L1.
  • the inspection light 21 is reflected by the surface 2 having a convex shape, passes through the optical path of the reflected light 22 b shown in FIG. 4, and is received by one of the light receiving elements 32 of the light receiving unit 12.
  • the distance from the emission end 11a of the light irradiation section 11 to the surface 2 of the substrate 1 when the substrate 1 is warped is L3 smaller than L1.
  • the inspection light 21 is reflected by the surface 2 warped in a concave shape, passes through the optical path of the reflected light 22 c shown in FIG. 5, and is received by one of the light receiving elements 32 of the light receiving unit 12.
  • FIG. 6 is a graph showing the gravity center position G of the reflected light 22a when the substrate 1 is not warped.
  • FIG. 7 is a graph showing the gravity center position G of the reflected light 22b when the convex warpage of the substrate 1 occurs.
  • FIG. 8 is a graph showing the center-of-gravity position G of the reflected light 22c when the concave warp of the substrate 1 occurs. 6 to 8, the vertical axis represents the intensity of the reflected light 22, and the horizontal axis represents the positions of the plurality of light receiving elements 32.
  • the intensity of the reflected light 22 received by each of the plurality of light receiving elements 32 is indicated by a solid curve, and the center of gravity G of the reflected light 22 is indicated by a one-dot chain line extending in the vertical direction in the drawings. It is shown as a straight line.
  • the gravity center position G of the reflected light 22 indicates a position where the intensity of the reflected light 22 is maximum when light having a Gaussian distribution intensity as in the TEM00 mode is used, as shown in FIGS.
  • the position of the center of gravity of the reflected light 22 indicates the position of the center of the area where the reflected light 22 is received.
  • the position where the intensity of the reflected light 22a, 22b, 22c is the maximum is the gravity center position G of each of the reflected lights 22a, 22b, 22c.
  • the center of gravity G of the reflected light 22 reflected by the surface 2 of the substrate 1 and received by the light receiving unit 12 differs in each of FIGS. 6 to 8 due to the difference in the warping state of the substrate 1 shown in FIGS. .
  • the gravity center position G of the reflected light 22c when the concave warp of the substrate 1 shown in FIG. 8 occurs is larger than the gravity center position G of the reflected light 22a shown in FIG.
  • FIG. 9 is a graph showing the relationship between the center of gravity position G of the reflected light 22 and the amount of warpage of the substrate 1.
  • the horizontal axis of the graph shown in FIG. 9 indicates the gravity center position G of the reflected light 22, and the vertical axis indicates the amount of warpage of the substrate 1.
  • the optical path of the reflected light 22 differs depending on the warping state of the substrate 1, and the light receiving element 32 that receives the reflected light 22 among the plurality of light receiving elements 32 included in the light receiving unit 12 is different.
  • the gravity center position G of the reflected light 22 varies depending on the position of the light receiving element 32 that receives the reflected light 22.
  • FIG. 9 simply shows a graph in the case where a linear relationship is established between the gravity center position G of the reflected light 22 and the amount of warpage of the substrate 1.
  • the calculation unit 13 shown in FIG. 1 calculates the center of gravity position G from the intensity distribution of the reflected light 22, and further calculates the amount of warpage of the substrate 1 with reference to the relationship between the center of gravity position G and the amount of warpage.
  • FIG. 10 is a schematic diagram showing the light reception time of the reflected light 22 when the substrate 1 is not warped.
  • FIG. 11 is a schematic diagram illustrating the light reception time of the reflected light 22 when the convex warpage of the substrate 1 occurs.
  • the substrate 1 is moved in the movement direction DR1 by the substrate transfer unit 15 (not shown in FIGS. 10 and 11). 10 and 11, the front light edge 11s in the moving direction DR1 of the substrate 1 moving in the plane direction is irradiated with the inspection light 21s from the light irradiation unit 11s, and the reflected light 22s reflected on the surface 2 of the substrate 1 is reflected.
  • a state in which the light receiving unit 12s receives light is illustrated.
  • the reflected light reflected from the surface 2 of the substrate 1 is irradiated with the inspection light 21e from the light irradiation unit 11e on the rear edge in the movement direction DR1 of the substrate 1 moving in the plane direction.
  • a state in which 22e is received by the light receiving unit 12e is illustrated.
  • the light receiving time of the reflected light 22 is that the light receiving unit 12e receives the reflected light 22e reflected from the rear edge of the substrate 1 after the light receiving unit 12s receives the reflected light 22s reflected from the front edge of the substrate 1. Indicates the time until it stops.
  • the light receiving time of the reflected light 22 when the substrate 1 shown in FIG. 11 is warped is a time obtained by adding the correction value t1 to the reference time T.
  • FIG. 12 is a diagram showing the relationship between the amount of warpage of the substrate 1 and the correction value of the light reception time of the reflected light 22.
  • the correction value of the light reception time of the reflected light 22 is determined in accordance with the amount of warpage of the substrate 1.
  • the amount of warpage of the substrate 1 is 0, and the correction value of the light receiving time of the reflected light 22 is also 0.
  • the correction value of the light reception time of the reflected light 22 when the warp amount + w1 is generated on the substrate 1 is t1
  • the reflected light 22 when the convex warp amount + w2 is generated on the substrate 1 is t1.
  • the correction value of the light reception time is t2.
  • the correction value of the light receiving time of the reflected light 22 when the warp amount ⁇ w1 occurs in the substrate 1 is t3, and the reflected light 22 is received when the substrate 1 undergoes the warp amount ⁇ w2 concave warp.
  • the time correction value is t4.
  • the position detection unit 16 illustrated in FIG. 1 detects the position of the substrate 1 in the movement direction DR1 in consideration of the correction value of the light reception time of the reflected light 22 according to the warpage amount of the substrate 1.
  • FIG. 13 is a flowchart for detecting a positional shift of the substrate 1 in the moving direction DR1.
  • the position detector 16 shown in FIG. 1 has a displacement in the movement direction DR1 on the substrate 1 in consideration of the correction value of the light receiving time of the reflected light 22 corresponding to the amount of warpage of the substrate 1 shown in FIG. Detect that.
  • step (S10) irradiation of the inspection light 21 is started.
  • a control signal S2 for instructing emission of the inspection light 21 is transmitted from the light emission command unit 18 illustrated in FIG. 1 to the light irradiation unit 11, and the light irradiation unit 11 that has received the control signal S2 starts emission of the inspection light 21.
  • step (S20) the substrate 1 is moved.
  • a control signal S1 is transmitted from the substrate drive command unit 17 shown in FIG. 1 to the substrate transport unit 15 to start the movement of the substrate 1 in the movement direction DR1, and the substrate transport unit 15 that receives the control signal S1 is activated. By doing so, the movement in the surface direction of the substrate 1 is started.
  • step (S30) detection of the reflected light 22 is started.
  • the inspection light 21 is reflected on the surface 2 of the front edge of the substrate 1.
  • the reflected light 22 from which the inspection light 21 is reflected is received by one of the light receiving elements 32 included in the light receiving unit 12.
  • the arithmetic unit 13 that has received the signal V1 from the light receiving unit 12 is based on the position of each light receiving element 32 that receives the reflected light 22 and the intensity distribution of the reflected light 22 received by each light receiving element 32.
  • the gravity center position G of the reflected light 22 is determined.
  • step (S40) the calculation unit 13 calculates the amount of warpage of the substrate 1 from the center of gravity position G of the reflected light 22 according to the relationship between the center of gravity position G of the reflected light 22 and the amount of warpage of the substrate 1 shown in FIG. Ask.
  • the arithmetic unit 13 further refers to a table showing the relationship between the warpage amount of the substrate 1 and the correction value of the light reception time of the reflected light 22 shown in FIG. Determine the correction value for the light reception time.
  • step (S60) the detection of the reflected light 22 is completed.
  • the inspection light 21 is separated from the surface 2 of the substrate 1. Will not be irradiated.
  • the inspection light 21 is not reflected on the surface 2, and the light receiving unit 12 does not receive the reflected light 22. Therefore, the detection of the reflected light 22 in the light receiving unit 12 is completed.
  • step (S70) it is determined whether or not the light reception time of the reflected light 22 is equal to the set value.
  • the position detection unit 16 adds the correction value obtained in step (S50) to the reference time T of the light reception time when the substrate 1 is not warped, and determines the set value of the light reception time of the reflected light 22. To do. Further, the position detection unit 16 compares the determined set value of the light reception time of the reflected light 22 with the actually measured value of the time from the start of detection of the reflected light 22 to the end of detection in the light reception unit 12 and moves to the substrate 1. It is determined whether or not a positional deviation in the direction DR1 has occurred.
  • step (S70) if the light reception time of the reflected light 22 is different from the set value, it is determined that the substrate 1 is misaligned. In this case, the process proceeds to the next step (S80), the occurrence of misalignment is displayed on the display of the output unit 14, and the control signal S3 is transmitted from the output unit 14 to the alarm generating unit 40. Issues an alarm indicating that the substrate 1 has been displaced. The worker who has detected the alarm stops the conveyance of the substrate 1 once and moves the substrate 1 to an appropriate position before moving the substrate 1 for the next processing of the substrate 1.
  • step (S70) If it is determined in step (S70) that the reception time of the reflected light 22 is equal to the set value, it is determined that the substrate 1 is not displaced. In this case, since step (S80) is skipped, no alarm is issued from the alarm generation unit 40. In this way, the flow for detecting the positional deviation of the substrate 1 using the substrate inspection apparatus 100 of the present embodiment is completed.
  • the inspection light 21 is irradiated on the surface 2 of the substrate 1 and the center of gravity G of the reflected light 22 reflected by the inspection light 21 is detected.
  • the warpage state of the substrate 1 can be detected. Therefore, it is possible to improve the detection accuracy of the warpage amount of the substrate 1 moving in the moving direction DR1 along the surface direction of the substrate 1, and to detect the warpage state of the substrate 1 more accurately.
  • the productivity of the processing of the substrate 1 such as dry etching can be detected.
  • a predetermined threshold value related to the warpage amount of the substrate 1 is compared with the actual warpage amount of the substrate 1, and when the warpage amount of the substrate 1 exceeds the threshold value, the conveyance of the substrate 1 is stopped once, and the substrate 1 is stopped. Can be excluded from the processing apparatus. In this case, the processing quality of the substrate 1 can be improved.
  • the present invention is suitably applied to various production apparatuses that transport a substrate in the surface direction, and the present invention makes it possible to avoid problems during substrate transportation caused by the occurrence of warping of the substrate.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

Le but de la présente invention est de fournir un dispositif d'inspection de substrat capable d'augmenter la précision de détection de la quantité de gauchissement d'un substrat. Un dispositif d'inspection de substrat (100) comprend : une unité de transfert de substrat (15) pour transférer horizontalement dans le plan un substrat plat (1) ayant une surface (2) ; une unité d'irradiation de lumière (11) pour irradier obliquement la surface (2) avec une lumière d'inspection (21) du substrat (1) tandis que le substrat est transféré horizontalement dans le plan ; et une unité de réception de lumière (12) pour recevoir la lumière de réflexion (22) de la lumière d'inspection (21) réfléchie à partir de la surface (2). L'unité de réception de lumière (12), qui comprend plusieurs éléments de réception de lumière, est prévue pour être capable de délivrer en sortie l'intensité de la lumière de réflexion (22) reçue par chacun des éléments de réception de lumière. Le dispositif d'inspection de substrat (100) comprend également une unité de calcul (13). L'unité de calcul (13) détecte la position du centre de gravité pour la lumière de réflexion (22) en fonction de l'intensité de la lumière de réflexion (22) reçue par chacun des éléments de réception de lumière, et calcule la quantité de gauchissement du substrat (1) à partir des résultats de détection de la position du centre de gravité.
PCT/JP2013/051135 2012-01-25 2013-01-22 Dispositif d'inspection de substrat WO2013111720A1 (fr)

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JP2012012890 2012-01-25
JP2012-012890 2012-01-25

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07110966A (ja) * 1993-10-13 1995-04-25 Nikon Corp 基板の反り測定方法及び測定装置
JPH10311709A (ja) * 1997-05-09 1998-11-24 Denso Corp 薄膜が形成されたウェハの厚さ測定方法
JP2007225480A (ja) * 2006-02-24 2007-09-06 Hitachi High-Technologies Corp 表面検査装置
JP2008258365A (ja) * 2007-04-04 2008-10-23 Dainippon Screen Mfg Co Ltd 位置検出装置、パターン描画装置および位置検出方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07110966A (ja) * 1993-10-13 1995-04-25 Nikon Corp 基板の反り測定方法及び測定装置
JPH10311709A (ja) * 1997-05-09 1998-11-24 Denso Corp 薄膜が形成されたウェハの厚さ測定方法
JP2007225480A (ja) * 2006-02-24 2007-09-06 Hitachi High-Technologies Corp 表面検査装置
JP2008258365A (ja) * 2007-04-04 2008-10-23 Dainippon Screen Mfg Co Ltd 位置検出装置、パターン描画装置および位置検出方法

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