WO2013111720A1 - Substrate inspection device - Google Patents

Substrate inspection device Download PDF

Info

Publication number
WO2013111720A1
WO2013111720A1 PCT/JP2013/051135 JP2013051135W WO2013111720A1 WO 2013111720 A1 WO2013111720 A1 WO 2013111720A1 JP 2013051135 W JP2013051135 W JP 2013051135W WO 2013111720 A1 WO2013111720 A1 WO 2013111720A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
light
reflected light
unit
reflected
Prior art date
Application number
PCT/JP2013/051135
Other languages
French (fr)
Japanese (ja)
Inventor
政則 関
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2013111720A1 publication Critical patent/WO2013111720A1/en

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness

Definitions

  • the present invention relates to a substrate inspection apparatus, and more particularly to a substrate inspection apparatus for inspecting a flat plate-shaped substrate moving in a surface direction.
  • an inspection apparatus for inspecting a substrate is based on information on position coordinates of a position where light on the surface of the substrate is irradiated and information on the height of the substrate based on a detection signal of light reflected from the substrate.
  • An apparatus for detecting the amount of warpage has been proposed (see, for example, Japanese Patent Application Laid-Open No. 2010-175551 (Patent Document 1)).
  • a substrate processing apparatus such as a dry etching apparatus
  • the substrate when a flat substrate is moved in the surface direction, the substrate may be displaced in the movement direction due to deterioration of a substrate support member such as an O-ring.
  • a substrate support member such as an O-ring.
  • problems such as collision of the substrate with peripheral devices occur when the substrate is processed.
  • the substrate surface is irradiated with inspection light, the reflected light that is reflected from the substrate surface is detected, and the time for receiving the reflected light during substrate transport is measured to detect substrate misalignment. is doing.
  • the surface direction of the substrate refers to a direction in which the front surface and the back surface of the flat substrate extend and is orthogonal to the thickness direction of the substrate.
  • the substrate moving in the substrate processing apparatus may be warped and the substrate may be deformed in the thickness direction.
  • This warpage is assumed to be caused by, for example, residual stress generated in the substrate in a pretreatment process such as polishing of the substrate surface, or stress acting on the substrate when the substrate is moved or the weight of the substrate. Is done.
  • the amount of warpage generated on the substrate varies depending on the type of substrate. The reason why the amount of warpage differs for each type of substrate is that the variation in the thickness of the film formed on the substrate surface varies for each type of substrate, resulting in different residual stresses on the substrate, or etching in the etching process. It is assumed that the amount varies from substrate to substrate.
  • the position of the reflected light reflected on the substrate surface changes, so the light reception time of the reflected light changes.
  • the alarm is erroneous because the light reception time of the reflected light is different from the predetermined time even though there is no actual displacement in the substrate movement direction. There was a problem that productivity was lowered.
  • a change in reflected light intensity at a convex portion when a stage on which a substrate is mounted is moved up and down is detected by an upper sensor, and a change in reflected light intensity at a concave portion is detected by a lower sensor.
  • the warp of the substrate is detected by obtaining the height position at which the sensitivity is obtained for both the convex portion and the concave portion and tracing the height position to obtain the height position of the reflecting surface. That is, in the inspection apparatus described in Patent Document 1, the warpage of the substrate is detected by repeating the movement in the surface direction and the movement in the thickness direction of the substrate. Therefore, it has been difficult to detect the warpage of the substrate that continuously moves in the surface direction during the movement.
  • the present invention has been made in view of the above-mentioned problems, and its main purpose is to provide a substrate inspection apparatus that can improve the detection accuracy of the amount of warpage of the substrate.
  • a substrate inspection apparatus includes a substrate transport unit that moves a flat substrate having a surface in a plane direction, and a light irradiation unit that irradiates inspection light in a direction inclined with respect to the surface of the substrate being moved in the plane direction. And a light receiving unit that receives the reflected light reflected by the inspection light on the surface.
  • the light receiving unit includes a plurality of light receiving elements, and is provided so that the intensity of reflected light received by each of the light receiving elements can be output.
  • the substrate inspection apparatus further includes a calculation unit. The calculation unit detects the position of the center of gravity of the reflected light according to the intensity of the reflected light received by each of the light receiving elements, and calculates the amount of warpage of the substrate from the detection result of the position of the center of gravity.
  • the calculation unit calculates the amount of warpage of the substrate based on the position of the surface of the substrate obtained from the position of the center of gravity of the reflected light.
  • the substrate inspection apparatus includes a position detection unit that detects a position in the movement direction of the substrate based on a time during which the light reception unit receives the reflected light, and the position detection unit receives the light reception unit based on the amount of warpage of the substrate. Corrects the set time for receiving reflected light.
  • the substrate inspection apparatus may include an alarm generation unit that issues an alarm according to a difference between a set value of a time at which the light receiving unit receives the reflected light and an actual time at which the light receiving unit receives the reflected light. .
  • the substrate inspection apparatus of the present invention it is possible to improve the detection accuracy of the warpage amount of the substrate moving in the surface direction.
  • FIG. 1 is a schematic diagram showing a configuration of a substrate inspection apparatus 100 according to the present embodiment.
  • a substrate inspection apparatus 100 shown in FIG. 1 is an apparatus for detecting a positional shift of the substrate 1 in the moving direction DR1 of the substrate 1 based on the amount of warpage of the flat substrate 1 having the surface 2.
  • the substrate inspection apparatus 100 includes a substrate transport unit 15, a light irradiation unit 11, and a light receiving unit 12.
  • the substrate transport unit 15 translates the substrate 1 in the movement direction DR1 along the surface direction.
  • the light irradiation unit 11 irradiates the inspection light 21 in a direction inclined with respect to the surface 2 of the substrate 1 moving in the movement direction DR1.
  • the light receiving unit 12 receives the reflected light 22 reflected by the inspection light 21 on the surface 2 of the substrate 1.
  • the substrate transfer unit 15 may be, for example, a vacuum transfer robot or a transfer roller.
  • the inspection light 21 is irradiated from the light irradiation unit 11 onto the surface 2 of the substrate 1 that is moving in the movement direction DR1 by driving the substrate transfer unit 15.
  • the reflected light 22 reflected by the surface 2 of the inspection light 21 is received by the light receiving unit 12.
  • the optical paths of the inspection light 21 and the reflected light 22 are indicated by dotted arrows in FIG.
  • the optical path of the inspection light 21 extends with an inclination with respect to the normal to the surface 2 of the substrate 1. Therefore, the optical path of the reflected light 22 also extends with an inclination with respect to the normal to the surface 2 of the substrate 1.
  • the arrangement of the light irradiation unit 11 and the light receiving unit 12 of the present embodiment is not limited to the example shown in FIG. 1.
  • the inspection light 21 is irradiated perpendicularly to the surface 2 of the substrate 1 through an arbitrary optical member.
  • the reflected light 22 may be reflected perpendicularly to the surface 2 of the substrate 1.
  • the board inspection apparatus 100 also includes a control unit 10 that controls the operation of the board inspection apparatus 100.
  • the control unit 10 includes a calculation unit 13 that calculates the amount of warpage of the substrate 1, a position detection unit 16 that detects the position of the substrate 1 in the movement direction DR 1, and a calculation result and position detection of the amount of warpage of the substrate 1 by the calculation unit 13 And an output unit 14 that outputs a detection result of the position of the substrate 1 by the unit 16.
  • the control unit 10 also includes a substrate drive command unit 17 that commands the drive and stop of the substrate transport unit 15, and a light emission command unit 18 that commands the light irradiation unit 11 to irradiate and stop the inspection light 21.
  • the substrate drive command unit 17 transmits a control signal S1 for instructing the substrate transport unit 15 to drive or stop the substrate transport unit 15.
  • the substrate transport unit 15 that has received the control signal S1 moves the substrate 1 in the movement direction DR1 at a predetermined movement speed, or stops the substrate 1.
  • the light emission command unit 18 transmits a control signal S ⁇ b> 2 for instructing the light irradiation unit 11 to emit or stop the inspection light 21 from the light irradiation unit 11.
  • the light irradiation unit 11 irradiates the inspection light 21 toward the surface 2 of the substrate 1 or stops the irradiation of the inspection light 21.
  • FIG. 2 is an enlarged view showing details of the structure of the light receiving unit 12.
  • the light receiving unit 12 includes a plurality of light receiving elements 32.
  • the light receiving unit 12 is provided so that the intensity of the reflected light 22 received by each of the light receiving elements 32 can be output.
  • the light receiving unit 12 includes a light receiving element 32a that receives reflected light 22 indicated by a solid line arrow in FIG. 2, a light receiving element 32b that receives reflected light 22 indicated by a two-dot chain line arrow in FIG. 2, and one point in FIG. It includes a light receiving element 32c that receives reflected light 22 indicated by a chain line arrow.
  • the light receiving unit 12 may be, for example, a CCD (Charge Coupled Device) sensor.
  • the light receiving unit 12 is provided so that a signal V1 (see FIG. 1) indicating the intensity of the reflected light 22 received by each of the light receiving elements 32 can be output.
  • the signal V1 output from the light receiving unit 12 is input to the calculation unit 13 of the control unit 10.
  • the calculation unit 13 detects the position of the center of gravity of the reflected light 22 according to the intensity of the reflected light 22 received by each of the light receiving elements 32.
  • the calculation unit 13 further calculates the amount of warpage of the substrate 1 based on the position of the surface 2 of the substrate 1 obtained from the detection result of the center of gravity position of the reflected light 22.
  • the position detection unit 16 corrects the set value of the time during which the light receiving unit 12 receives the reflected light 22 based on the amount of warpage of the substrate 1 calculated by the calculating unit 13, and then the light receiving unit 12 receives the reflected light 22.
  • the position in the movement direction DR1 of the substrate 1 is detected based on the time to perform the detection, and it is detected whether or not the position shift in the movement direction DR1 of the substrate 1 has occurred.
  • the positional deviation in the moving direction DR1 of the substrate 1 is detected by obtaining the difference between the set value of the time when the light receiving unit 12 receives the reflected light 22 and the actual time when the light receiving unit 12 received the reflected light. .
  • the difference between the set value of the light reception time of the reflected light 22 and the actual measurement value is equal to or greater than a predetermined threshold value, it is determined that the substrate 1 has been displaced.
  • the output unit 14 outputs that the positional deviation of the substrate 1 has occurred, and transmits a control signal S3 to the alarm generation unit 40.
  • the alarm generation unit 40 receives the control signal S3 and issues an alarm in order to notify the operator that the position shift of the substrate 1 has occurred.
  • the output unit 14 has a display for displaying the amount of warpage of the substrate 1 and / or the amount of displacement of the substrate 1 in the moving direction DR1.
  • the output unit 14 also has an interface unit for transmitting the control signal S3 to the alarm generation unit 40 in accordance with the amount of positional deviation of the substrate 1.
  • the alarm generation unit 40 is configured to visually notify the worker of an alarm, such as a lamp, or to be configured to audibly notify the worker of an alarm, such as a buzzer, or both, or to recognize the occurrence of the alarm to the worker. It may have any other configuration that can be made.
  • FIG. 3 is a schematic diagram showing the reflection of the inspection light 21 in a state where the substrate 1 is not warped.
  • FIG. 4 is a schematic diagram showing the reflection of the inspection light 21 in a state where the convex warpage of the substrate 1 has occurred.
  • FIG. 5 is a schematic diagram showing the reflection of the inspection light 21 in a state where the concave warp of the substrate 1 has occurred.
  • the substrate 1 is warped due to the influence of residual stress or its own weight.
  • the substrate 1 is deformed in the thickness direction so as to be convex toward the surface 2 as shown in FIG. 4 or concave toward the surface 2 as shown in FIG.
  • a convex warp a warp concave toward the surface 2 shown in FIG. 5 is referred to as a concave warp.
  • the amount of warping of the substrate 1 in the case of convex warping is positive, and the amount of warping of the substrate 1 in the case of concave warping is negative.
  • the substrate 1 in a state where an excessive warpage exaggerated more than the warp actually generated in the substrate 1 is generated for easy understanding.
  • the warp actually generated in the substrate 1 is much smaller than the warp shown in FIGS.
  • the reflection angle of the reflected light 22 reflected by the surface 2 of the substrate 1 differs depending on the magnitude of the warp occurring on the substrate 1, but the actual deviation of the reflection angle is negligible. Therefore, it can be considered that the reflection angle of the reflected light 22 does not change. In this case, the amount of change in the height of the surface 2 due to the warp of the substrate 1 can be easily calculated from the intensity of the reflected light 22 received by each light receiving element 32 of the light receiving unit 12.
  • the distance from the emission end 11a from which the inspection light 21 is emitted from the light irradiation unit 11 to the surface 2 of the substrate 1 is denoted by L1.
  • the inspection light 21 is reflected by the surface 2 of the substrate 1, passes through the optical path of the reflected light 22 a shown in FIG. 3, and is received by one of the light receiving elements 32 of the light receiving unit 12.
  • the distance from the emission end 11a of the light irradiation unit 11 to the surface 2 of the substrate 1 when convex warpage occurs in the substrate 1 is L2, which is larger than L1.
  • the inspection light 21 is reflected by the surface 2 having a convex shape, passes through the optical path of the reflected light 22 b shown in FIG. 4, and is received by one of the light receiving elements 32 of the light receiving unit 12.
  • the distance from the emission end 11a of the light irradiation section 11 to the surface 2 of the substrate 1 when the substrate 1 is warped is L3 smaller than L1.
  • the inspection light 21 is reflected by the surface 2 warped in a concave shape, passes through the optical path of the reflected light 22 c shown in FIG. 5, and is received by one of the light receiving elements 32 of the light receiving unit 12.
  • FIG. 6 is a graph showing the gravity center position G of the reflected light 22a when the substrate 1 is not warped.
  • FIG. 7 is a graph showing the gravity center position G of the reflected light 22b when the convex warpage of the substrate 1 occurs.
  • FIG. 8 is a graph showing the center-of-gravity position G of the reflected light 22c when the concave warp of the substrate 1 occurs. 6 to 8, the vertical axis represents the intensity of the reflected light 22, and the horizontal axis represents the positions of the plurality of light receiving elements 32.
  • the intensity of the reflected light 22 received by each of the plurality of light receiving elements 32 is indicated by a solid curve, and the center of gravity G of the reflected light 22 is indicated by a one-dot chain line extending in the vertical direction in the drawings. It is shown as a straight line.
  • the gravity center position G of the reflected light 22 indicates a position where the intensity of the reflected light 22 is maximum when light having a Gaussian distribution intensity as in the TEM00 mode is used, as shown in FIGS.
  • the position of the center of gravity of the reflected light 22 indicates the position of the center of the area where the reflected light 22 is received.
  • the position where the intensity of the reflected light 22a, 22b, 22c is the maximum is the gravity center position G of each of the reflected lights 22a, 22b, 22c.
  • the center of gravity G of the reflected light 22 reflected by the surface 2 of the substrate 1 and received by the light receiving unit 12 differs in each of FIGS. 6 to 8 due to the difference in the warping state of the substrate 1 shown in FIGS. .
  • the gravity center position G of the reflected light 22c when the concave warp of the substrate 1 shown in FIG. 8 occurs is larger than the gravity center position G of the reflected light 22a shown in FIG.
  • FIG. 9 is a graph showing the relationship between the center of gravity position G of the reflected light 22 and the amount of warpage of the substrate 1.
  • the horizontal axis of the graph shown in FIG. 9 indicates the gravity center position G of the reflected light 22, and the vertical axis indicates the amount of warpage of the substrate 1.
  • the optical path of the reflected light 22 differs depending on the warping state of the substrate 1, and the light receiving element 32 that receives the reflected light 22 among the plurality of light receiving elements 32 included in the light receiving unit 12 is different.
  • the gravity center position G of the reflected light 22 varies depending on the position of the light receiving element 32 that receives the reflected light 22.
  • FIG. 9 simply shows a graph in the case where a linear relationship is established between the gravity center position G of the reflected light 22 and the amount of warpage of the substrate 1.
  • the calculation unit 13 shown in FIG. 1 calculates the center of gravity position G from the intensity distribution of the reflected light 22, and further calculates the amount of warpage of the substrate 1 with reference to the relationship between the center of gravity position G and the amount of warpage.
  • FIG. 10 is a schematic diagram showing the light reception time of the reflected light 22 when the substrate 1 is not warped.
  • FIG. 11 is a schematic diagram illustrating the light reception time of the reflected light 22 when the convex warpage of the substrate 1 occurs.
  • the substrate 1 is moved in the movement direction DR1 by the substrate transfer unit 15 (not shown in FIGS. 10 and 11). 10 and 11, the front light edge 11s in the moving direction DR1 of the substrate 1 moving in the plane direction is irradiated with the inspection light 21s from the light irradiation unit 11s, and the reflected light 22s reflected on the surface 2 of the substrate 1 is reflected.
  • a state in which the light receiving unit 12s receives light is illustrated.
  • the reflected light reflected from the surface 2 of the substrate 1 is irradiated with the inspection light 21e from the light irradiation unit 11e on the rear edge in the movement direction DR1 of the substrate 1 moving in the plane direction.
  • a state in which 22e is received by the light receiving unit 12e is illustrated.
  • the light receiving time of the reflected light 22 is that the light receiving unit 12e receives the reflected light 22e reflected from the rear edge of the substrate 1 after the light receiving unit 12s receives the reflected light 22s reflected from the front edge of the substrate 1. Indicates the time until it stops.
  • the light receiving time of the reflected light 22 when the substrate 1 shown in FIG. 11 is warped is a time obtained by adding the correction value t1 to the reference time T.
  • FIG. 12 is a diagram showing the relationship between the amount of warpage of the substrate 1 and the correction value of the light reception time of the reflected light 22.
  • the correction value of the light reception time of the reflected light 22 is determined in accordance with the amount of warpage of the substrate 1.
  • the amount of warpage of the substrate 1 is 0, and the correction value of the light receiving time of the reflected light 22 is also 0.
  • the correction value of the light reception time of the reflected light 22 when the warp amount + w1 is generated on the substrate 1 is t1
  • the reflected light 22 when the convex warp amount + w2 is generated on the substrate 1 is t1.
  • the correction value of the light reception time is t2.
  • the correction value of the light receiving time of the reflected light 22 when the warp amount ⁇ w1 occurs in the substrate 1 is t3, and the reflected light 22 is received when the substrate 1 undergoes the warp amount ⁇ w2 concave warp.
  • the time correction value is t4.
  • the position detection unit 16 illustrated in FIG. 1 detects the position of the substrate 1 in the movement direction DR1 in consideration of the correction value of the light reception time of the reflected light 22 according to the warpage amount of the substrate 1.
  • FIG. 13 is a flowchart for detecting a positional shift of the substrate 1 in the moving direction DR1.
  • the position detector 16 shown in FIG. 1 has a displacement in the movement direction DR1 on the substrate 1 in consideration of the correction value of the light receiving time of the reflected light 22 corresponding to the amount of warpage of the substrate 1 shown in FIG. Detect that.
  • step (S10) irradiation of the inspection light 21 is started.
  • a control signal S2 for instructing emission of the inspection light 21 is transmitted from the light emission command unit 18 illustrated in FIG. 1 to the light irradiation unit 11, and the light irradiation unit 11 that has received the control signal S2 starts emission of the inspection light 21.
  • step (S20) the substrate 1 is moved.
  • a control signal S1 is transmitted from the substrate drive command unit 17 shown in FIG. 1 to the substrate transport unit 15 to start the movement of the substrate 1 in the movement direction DR1, and the substrate transport unit 15 that receives the control signal S1 is activated. By doing so, the movement in the surface direction of the substrate 1 is started.
  • step (S30) detection of the reflected light 22 is started.
  • the inspection light 21 is reflected on the surface 2 of the front edge of the substrate 1.
  • the reflected light 22 from which the inspection light 21 is reflected is received by one of the light receiving elements 32 included in the light receiving unit 12.
  • the arithmetic unit 13 that has received the signal V1 from the light receiving unit 12 is based on the position of each light receiving element 32 that receives the reflected light 22 and the intensity distribution of the reflected light 22 received by each light receiving element 32.
  • the gravity center position G of the reflected light 22 is determined.
  • step (S40) the calculation unit 13 calculates the amount of warpage of the substrate 1 from the center of gravity position G of the reflected light 22 according to the relationship between the center of gravity position G of the reflected light 22 and the amount of warpage of the substrate 1 shown in FIG. Ask.
  • the arithmetic unit 13 further refers to a table showing the relationship between the warpage amount of the substrate 1 and the correction value of the light reception time of the reflected light 22 shown in FIG. Determine the correction value for the light reception time.
  • step (S60) the detection of the reflected light 22 is completed.
  • the inspection light 21 is separated from the surface 2 of the substrate 1. Will not be irradiated.
  • the inspection light 21 is not reflected on the surface 2, and the light receiving unit 12 does not receive the reflected light 22. Therefore, the detection of the reflected light 22 in the light receiving unit 12 is completed.
  • step (S70) it is determined whether or not the light reception time of the reflected light 22 is equal to the set value.
  • the position detection unit 16 adds the correction value obtained in step (S50) to the reference time T of the light reception time when the substrate 1 is not warped, and determines the set value of the light reception time of the reflected light 22. To do. Further, the position detection unit 16 compares the determined set value of the light reception time of the reflected light 22 with the actually measured value of the time from the start of detection of the reflected light 22 to the end of detection in the light reception unit 12 and moves to the substrate 1. It is determined whether or not a positional deviation in the direction DR1 has occurred.
  • step (S70) if the light reception time of the reflected light 22 is different from the set value, it is determined that the substrate 1 is misaligned. In this case, the process proceeds to the next step (S80), the occurrence of misalignment is displayed on the display of the output unit 14, and the control signal S3 is transmitted from the output unit 14 to the alarm generating unit 40. Issues an alarm indicating that the substrate 1 has been displaced. The worker who has detected the alarm stops the conveyance of the substrate 1 once and moves the substrate 1 to an appropriate position before moving the substrate 1 for the next processing of the substrate 1.
  • step (S70) If it is determined in step (S70) that the reception time of the reflected light 22 is equal to the set value, it is determined that the substrate 1 is not displaced. In this case, since step (S80) is skipped, no alarm is issued from the alarm generation unit 40. In this way, the flow for detecting the positional deviation of the substrate 1 using the substrate inspection apparatus 100 of the present embodiment is completed.
  • the inspection light 21 is irradiated on the surface 2 of the substrate 1 and the center of gravity G of the reflected light 22 reflected by the inspection light 21 is detected.
  • the warpage state of the substrate 1 can be detected. Therefore, it is possible to improve the detection accuracy of the warpage amount of the substrate 1 moving in the moving direction DR1 along the surface direction of the substrate 1, and to detect the warpage state of the substrate 1 more accurately.
  • the productivity of the processing of the substrate 1 such as dry etching can be detected.
  • a predetermined threshold value related to the warpage amount of the substrate 1 is compared with the actual warpage amount of the substrate 1, and when the warpage amount of the substrate 1 exceeds the threshold value, the conveyance of the substrate 1 is stopped once, and the substrate 1 is stopped. Can be excluded from the processing apparatus. In this case, the processing quality of the substrate 1 can be improved.
  • the present invention is suitably applied to various production apparatuses that transport a substrate in the surface direction, and the present invention makes it possible to avoid problems during substrate transportation caused by the occurrence of warping of the substrate.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The purpose of the present invention is to provide a substrate inspection device capable of increasing the accuracy of detecting the amount of warping for a substrate. A substrate inspection device (100) includes: a substrate transfer unit (15) for transferring horizontally in-plane a planar substrate (1) having a surface (2); a light irradiation unit (11) for obliquely irradiating the surface (2) of the substrate (1) with inspection light (21) while the substrate is being transferred horizontally in-plane; and a light receiving unit (12) for receiving the reflection light (22) of the inspection light (21) reflected from the surface (2). The light receiving unit (12), which includes a plurality of light-receiving elements, is provided so as to be capable of outputting the intensity of the reflection light (22) received by each of the light-receiving elements. The substrate inspection device (100) also includes a computation unit (13). The computation unit (13) detects the position of the center of gravity for the reflection light (22) in accordance with the intensity of the reflection light (22) received by each of the light-receiving elements, and computes the amount of warping of the substrate (1) from the results of detecting the position of the center of gravity.

Description

基板検査装置Board inspection equipment
　本発明は、基板検査装置に関し、特に、面方向に移動する平板形状の基板を検査するための基板検査装置に関する。 The present invention relates to a substrate inspection apparatus, and more particularly to a substrate inspection apparatus for inspecting a flat plate-shaped substrate moving in a surface direction.
　基板を検査するための検査装置に関し、従来、基板表面の光が照射される位置の位置座標の情報と、基板から反射した光の検出信号に基づく基板の高さ情報と、に基づいて、基板の反り量を検出する装置が提案されている（たとえば、特開２０１０－１７５５５１号公報（特許文献１）参照）。 Conventionally, an inspection apparatus for inspecting a substrate is based on information on position coordinates of a position where light on the surface of the substrate is irradiated and information on the height of the substrate based on a detection signal of light reflected from the substrate. An apparatus for detecting the amount of warpage has been proposed (see, for example, Japanese Patent Application Laid-Open No. 2010-175551 (Patent Document 1)).
特開２０１０－１７５５５１号公報JP 2010-175551 A
　ドライエッチング装置などの基板処理装置において、平板形状の基板を面方向に移動する場合、Ｏリングなどの基板支持部材の劣化などを原因として、移動方向における基板の位置ずれが発生する場合がある。基板の位置ずれが発生すると、基板の処理の際に周辺の装置に基板が衝突するなどの不具合が発生する。そのため従来は、基板表面へ検査光を照射し、その検査光が基板表面で反射した反射光を検知し、基板の搬送時の反射光の受光時間を測定することで、基板の位置ずれを検出している。反射光の受光時間が所定の時間と異なる場合に警報を発報することにより、位置ずれした状態で基板の処理が開始されることを回避している。ここで、基板の面方向とは、平板形状の基板の表面および裏面の延びる方向であって、基板の厚さ方向に直交する方向をいう。 In a substrate processing apparatus such as a dry etching apparatus, when a flat substrate is moved in the surface direction, the substrate may be displaced in the movement direction due to deterioration of a substrate support member such as an O-ring. When the substrate is displaced, problems such as collision of the substrate with peripheral devices occur when the substrate is processed. For this reason, conventionally, the substrate surface is irradiated with inspection light, the reflected light that is reflected from the substrate surface is detected, and the time for receiving the reflected light during substrate transport is measured to detect substrate misalignment. is doing. By issuing an alarm when the light reception time of the reflected light is different from the predetermined time, the processing of the substrate is prevented from being started in a misaligned state. Here, the surface direction of the substrate refers to a direction in which the front surface and the back surface of the flat substrate extend and is orthogonal to the thickness direction of the substrate.
　しかしながら、基板処理装置内を移動する基板には、反りが発生し、基板が厚さ方向に変形する場合がある。この反りは、たとえば基板表面の研磨などの前処理工程において基板内部に残留応力が生じること、または、基板の移動に際し基板を保持する際の基板に作用する応力もしくは基板の自重などが原因として想定される。さらに、基板に発生する反り量は、基板の種類によって異なる。反り量が基板の種類毎に異なる理由は、基板の種類毎に基板表面に成膜される膜の厚みのばらつき度合いが異なり、その結果基板に生じる残留応力が異なること、または、エッチング工程におけるエッチング量が基板毎にばらつくこと、などが想定される。 However, the substrate moving in the substrate processing apparatus may be warped and the substrate may be deformed in the thickness direction. This warpage is assumed to be caused by, for example, residual stress generated in the substrate in a pretreatment process such as polishing of the substrate surface, or stress acting on the substrate when the substrate is moved or the weight of the substrate. Is done. Further, the amount of warpage generated on the substrate varies depending on the type of substrate. The reason why the amount of warpage differs for each type of substrate is that the variation in the thickness of the film formed on the substrate surface varies for each type of substrate, resulting in different residual stresses on the substrate, or etching in the etching process. It is assumed that the amount varies from substrate to substrate.
　基板の反り量が異なると、基板表面で反射する反射光の位置が変わるため、反射光の受光時間が変化する。その結果、複数の種類の基板を搬送するときに、実際には基板の移動方向の位置ずれは発生していないにもかかわらず、反射光の受光時間が所定の時間と異なるために警報が誤って発報され、生産性が低下する問題があった。 If the amount of warpage of the substrate is different, the position of the reflected light reflected on the substrate surface changes, so the light reception time of the reflected light changes. As a result, when a plurality of types of substrates are transported, the alarm is erroneous because the light reception time of the reflected light is different from the predetermined time even though there is no actual displacement in the substrate movement direction. There was a problem that productivity was lowered.
　特許文献１に記載の検査装置では、基板を搭載するステージを上下させた場合の凸部での反射光強度の変化を上方センサで、凹部での反射光強度の変化を下方センサでそれぞれ検知し、凸部および凹部ともに感度が得られる高さ位置を求め、その高さ位置をトレースして反射面の高さ位置を得ることにより、基板の反りを検出している。すなわち、特許文献１に記載の検査装置では、基板の面方向の移動と厚み方向の移動とを繰り返すことにより基板の反りを検出している。そのため、面方向に連続移動する基板の反りを移動中に検出することは困難であった。 In the inspection apparatus described in Patent Document 1, a change in reflected light intensity at a convex portion when a stage on which a substrate is mounted is moved up and down is detected by an upper sensor, and a change in reflected light intensity at a concave portion is detected by a lower sensor. The warp of the substrate is detected by obtaining the height position at which the sensitivity is obtained for both the convex portion and the concave portion and tracing the height position to obtain the height position of the reflecting surface. That is, in the inspection apparatus described in Patent Document 1, the warpage of the substrate is detected by repeating the movement in the surface direction and the movement in the thickness direction of the substrate. Therefore, it has been difficult to detect the warpage of the substrate that continuously moves in the surface direction during the movement.
　本発明は上記の課題に鑑みてなされたものであり、その主たる目的は、基板の反り量の検出精度を向上できる、基板検査装置を提供することである。 The present invention has been made in view of the above-mentioned problems, and its main purpose is to provide a substrate inspection apparatus that can improve the detection accuracy of the amount of warpage of the substrate.
　本発明に係る基板検査装置は、表面を有する平板形状の基板を面方向に移動させる基板搬送部と、面方向に移動中の基板の表面に対し傾斜した方向に検査光を照射する光照射部と、表面で検査光が反射した反射光を受光する受光部と、を備える。受光部は、複数の受光素子を含み、受光素子の各々が受光した反射光の強度を出力可能に設けられている。基板検査装置はさらに、演算部を備える。演算部は、受光素子の各々が受光した反射光の強度に従い反射光の重心位置を検出し、重心位置の検出結果より基板の反り量を演算する。 A substrate inspection apparatus according to the present invention includes a substrate transport unit that moves a flat substrate having a surface in a plane direction, and a light irradiation unit that irradiates inspection light in a direction inclined with respect to the surface of the substrate being moved in the plane direction. And a light receiving unit that receives the reflected light reflected by the inspection light on the surface. The light receiving unit includes a plurality of light receiving elements, and is provided so that the intensity of reflected light received by each of the light receiving elements can be output. The substrate inspection apparatus further includes a calculation unit. The calculation unit detects the position of the center of gravity of the reflected light according to the intensity of the reflected light received by each of the light receiving elements, and calculates the amount of warpage of the substrate from the detection result of the position of the center of gravity.
　上記基板検査装置において好ましくは、演算部は、反射光の重心位置から求められる基板の表面の位置により、基板の反り量を演算する。 Preferably, in the substrate inspection apparatus, the calculation unit calculates the amount of warpage of the substrate based on the position of the surface of the substrate obtained from the position of the center of gravity of the reflected light.
　上記基板検査装置において好ましくは、受光部が反射光を受光する時間に基づいて基板の移動方向の位置を検出する位置検出部を備え、位置検出部は、基板の反り量に基づいて、受光部が反射光を受光する時間の設定値を補正する。基板検査装置は、受光部が反射光を受光する時間の設定値と、受光部が反射光を受光した実際の時間と、の差に応じて警報を発報する警報発生部を備えてもよい。 Preferably, the substrate inspection apparatus includes a position detection unit that detects a position in the movement direction of the substrate based on a time during which the light reception unit receives the reflected light, and the position detection unit receives the light reception unit based on the amount of warpage of the substrate. Corrects the set time for receiving reflected light. The substrate inspection apparatus may include an alarm generation unit that issues an alarm according to a difference between a set value of a time at which the light receiving unit receives the reflected light and an actual time at which the light receiving unit receives the reflected light. .
　本発明の基板検査装置によると、面方向に移動する基板の反り量の検出精度を向上することができる。 According to the substrate inspection apparatus of the present invention, it is possible to improve the detection accuracy of the warpage amount of the substrate moving in the surface direction.
本実施の形態の基板検査装置の構成を示す模式図である。It is a schematic diagram which shows the structure of the board | substrate inspection apparatus of this Embodiment. 受光部の構造の詳細を示す拡大図である。It is an enlarged view which shows the detail of the structure of a light-receiving part. 基板の反りが発生していない状態の検査光の反射を示す模式図である。It is a schematic diagram which shows reflection of the test | inspection light in the state in which the curvature of the board | substrate has not generate | occur | produced. 基板の凸反りが発生した状態の検査光の反射を示す模式図である。It is a mimetic diagram showing reflection of inspection light in the state where convex curvature of a substrate occurred. 基板の凹反りが発生した状態の検査光の反射を示す模式図である。It is a schematic diagram which shows reflection of the test | inspection light of the state which the concave curvature of the board | substrate generate | occur | produced. 基板の反りが発生していないときの反射光の重心位置を示すグラフである。It is a graph which shows the gravity center position of the reflected light when the curvature of a board | substrate has not generate | occur | produced. 基板の凸反りが発生したときの反射光の重心位置を示すグラフである。It is a graph which shows the gravity center position of reflected light when the convex curvature of a board | substrate generate | occur | produced. 基板の凹反りが発生したときの反射光の重心位置を示すグラフである。It is a graph which shows the gravity center position of the reflected light when the concave curvature of a board | substrate generate | occur | produced. 反射光の重心位置と基板の反り量との関係を示すグラフである。It is a graph which shows the relationship between the gravity center position of reflected light, and the curvature amount of a board | substrate. 基板の反りが発生していないときの反射光の受光時間を示す模式図である。It is a schematic diagram which shows the light reception time of the reflected light when the curvature of a board | substrate has not generate | occur | produced. 基板の凸反りが発生したときの反射光の受光時間を示す模式図である。It is a schematic diagram which shows the light reception time of the reflected light when the convex curvature of a board | substrate generate | occur | produces. 基板の反り量と反射光の受光時間の補正値との関係を示す図である。It is a figure which shows the relationship between the curvature amount of a board | substrate, and the correction value of the light reception time of reflected light. 基板の移動方向の位置ずれを検出するフローチャートである。It is a flowchart which detects the position shift of the moving direction of a board | substrate.
　以下、図面に基づいてこの発明の実施の形態を説明する。なお、以下の図面において、同一または相当する部分には同一の参照番号を付し、その説明は繰返さない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated.
　図１は、本実施の形態の基板検査装置１００の構成を示す模式図である。図１に示す基板検査装置１００は、表面２を有する平板形状の基板１の反り量に基づいて、基板１の移動方向ＤＲ１における基板１の位置ずれを検出するための装置である。基板検査装置１００は、基板搬送部１５と、光照射部１１と、受光部１２とを備える。基板搬送部１５は、面方向に沿う移動方向ＤＲ１に、基板１を平行移動させる。光照射部１１は、移動方向ＤＲ１に移動中の基板１の表面２に対し傾斜した方向に、検査光２１を照射する。受光部１２は、基板１の表面２で検査光２１が反射した反射光２２を受光する。 FIG. 1 is a schematic diagram showing a configuration of a substrate inspection apparatus 100 according to the present embodiment. A substrate inspection apparatus 100 shown in FIG. 1 is an apparatus for detecting a positional shift of the substrate 1 in the moving direction DR1 of the substrate 1 based on the amount of warpage of the flat substrate 1 having the surface 2. The substrate inspection apparatus 100 includes a substrate transport unit 15, a light irradiation unit 11, and a light receiving unit 12. The substrate transport unit 15 translates the substrate 1 in the movement direction DR1 along the surface direction. The light irradiation unit 11 irradiates the inspection light 21 in a direction inclined with respect to the surface 2 of the substrate 1 moving in the movement direction DR1. The light receiving unit 12 receives the reflected light 22 reflected by the inspection light 21 on the surface 2 of the substrate 1.
　基板搬送部１５は、たとえば真空搬送ロボットまたは搬送ローラであってもよい。基板搬送部１５の駆動によって移動方向ＤＲ１に移動中の基板１の表面２に、光照射部１１から検査光２１が照射される。検査光２１が表面２で反射した反射光２２が、受光部１２により受光される。検査光２１および反射光２２の光路を図１中の点線矢印で示す。検査光２１の光路は、基板１の表面２に対する法線に対して、傾斜して延びる。そのため反射光２２の光路もまた、基板１の表面２に対する法線に対して傾斜して延びている。本実施の形態の光照射部１１および受光部１２の配置は図１に示す例に限るものではなく、たとえば任意の光学部材を介して基板１の表面２に垂直に検査光２１が照射され、基板１の表面２に垂直に反射光２２が反射してもよい。 The substrate transfer unit 15 may be, for example, a vacuum transfer robot or a transfer roller. The inspection light 21 is irradiated from the light irradiation unit 11 onto the surface 2 of the substrate 1 that is moving in the movement direction DR1 by driving the substrate transfer unit 15. The reflected light 22 reflected by the surface 2 of the inspection light 21 is received by the light receiving unit 12. The optical paths of the inspection light 21 and the reflected light 22 are indicated by dotted arrows in FIG. The optical path of the inspection light 21 extends with an inclination with respect to the normal to the surface 2 of the substrate 1. Therefore, the optical path of the reflected light 22 also extends with an inclination with respect to the normal to the surface 2 of the substrate 1. The arrangement of the light irradiation unit 11 and the light receiving unit 12 of the present embodiment is not limited to the example shown in FIG. 1. For example, the inspection light 21 is irradiated perpendicularly to the surface 2 of the substrate 1 through an arbitrary optical member. The reflected light 22 may be reflected perpendicularly to the surface 2 of the substrate 1.
　基板検査装置１００はまた、基板検査装置１００の動作を制御する制御部１０を備える。制御部１０は、基板１の反り量を演算する演算部１３と、基板１の移動方向ＤＲ１の位置を検出する位置検出部１６と、演算部１３による基板１の反り量の演算結果および位置検出部１６による基板１の位置の検出結果を出力する出力部１４と、を含む。制御部１０はまた、基板搬送部１５の駆動および停止を指令する基板駆動指令部１７と、光照射部１１に対し検査光２１の照射および停止を指令する発光指令部１８と、を含む。 The board inspection apparatus 100 also includes a control unit 10 that controls the operation of the board inspection apparatus 100. The control unit 10 includes a calculation unit 13 that calculates the amount of warpage of the substrate 1, a position detection unit 16 that detects the position of the substrate 1 in the movement direction DR 1, and a calculation result and position detection of the amount of warpage of the substrate 1 by the calculation unit 13 And an output unit 14 that outputs a detection result of the position of the substrate 1 by the unit 16. The control unit 10 also includes a substrate drive command unit 17 that commands the drive and stop of the substrate transport unit 15, and a light emission command unit 18 that commands the light irradiation unit 11 to irradiate and stop the inspection light 21.
　基板駆動指令部１７は、基板搬送部１５に対し、基板搬送部１５の駆動または停止を指令するための制御信号Ｓ１を伝送する。制御信号Ｓ１を受けた基板搬送部１５は、所定の移動速度で基板１を移動方向ＤＲ１へ移動させ、または基板１を停止させる。発光指令部１８は、光照射部１１に対し、光照射部１１からの検査光２１の出射または停止を指令するための制御信号Ｓ２を伝送する。制御信号Ｓ２を受けた光照射部１１は、基板１の表面２へ向けて検査光２１を照射し、または検査光２１の照射を停止する。 The substrate drive command unit 17 transmits a control signal S1 for instructing the substrate transport unit 15 to drive or stop the substrate transport unit 15. The substrate transport unit 15 that has received the control signal S1 moves the substrate 1 in the movement direction DR1 at a predetermined movement speed, or stops the substrate 1. The light emission command unit 18 transmits a control signal S <b> 2 for instructing the light irradiation unit 11 to emit or stop the inspection light 21 from the light irradiation unit 11. Upon receiving the control signal S2, the light irradiation unit 11 irradiates the inspection light 21 toward the surface 2 of the substrate 1 or stops the irradiation of the inspection light 21.
　図２は、受光部１２の構造の詳細を示す拡大図である。受光部１２は、複数の受光素子３２を含む。受光部１２は、受光素子３２の各々が受光した反射光２２の強度を出力可能に設けられている。たとえば受光部１２は、図２中に実線矢印で示す反射光２２を受光する受光素子３２ａ、図２中に二点差線矢印で示す反射光２２を受光する受光素子３２ｂ、および図２中に一点鎖線矢印で示す反射光２２を受光する受光素子３２ｃを含む。複数の受光素子３２の各々の受光面が小さいほど、受光素子３２の数が多いほど、また複数の受光素子３２の受光面間の隙間が小さいほど、反射光２２の強度分布をより精度よく検出できるので好ましい。受光部１２は、たとえばＣＣＤ（Charge　Coupled　Device）センサであってもよい。 FIG. 2 is an enlarged view showing details of the structure of the light receiving unit 12. The light receiving unit 12 includes a plurality of light receiving elements 32. The light receiving unit 12 is provided so that the intensity of the reflected light 22 received by each of the light receiving elements 32 can be output. For example, the light receiving unit 12 includes a light receiving element 32a that receives reflected light 22 indicated by a solid line arrow in FIG. 2, a light receiving element 32b that receives reflected light 22 indicated by a two-dot chain line arrow in FIG. 2, and one point in FIG. It includes a light receiving element 32c that receives reflected light 22 indicated by a chain line arrow. The smaller the light receiving surface of each of the plurality of light receiving elements 32, the greater the number of light receiving elements 32, and the smaller the gap between the light receiving surfaces of the plurality of light receiving elements 32, the more accurately the intensity distribution of the reflected light 22 is detected. It is preferable because it is possible. The light receiving unit 12 may be, for example, a CCD (Charge Coupled Device) sensor.
　受光部１２は、受光素子３２の各々が受光した反射光２２の強度を示す信号Ｖ１（図１参照）を出力可能に設けられている。受光部１２が出力した信号Ｖ１は、制御部１０の演算部１３に入力される。演算部１３は、受光素子３２の各々が受光した反射光２２の強度に従い、反射光２２の重心位置を検出する。演算部１３はさらに、反射光２２の重心位置の検出結果から求められる基板１の表面２の位置に基づいて、基板１の反り量を演算する。位置検出部１６は、演算部１３が演算した基板１の反り量に基づいて、受光部１２が反射光２２を受光する時間の設定値を補正した上で、受光部１２が反射光２２を受光する時間に基づいて基板１の移動方向ＤＲ１の位置を検出し、基板１の移動方向ＤＲ１における位置ずれが発生しているか否かを検出する。 The light receiving unit 12 is provided so that a signal V1 (see FIG. 1) indicating the intensity of the reflected light 22 received by each of the light receiving elements 32 can be output. The signal V1 output from the light receiving unit 12 is input to the calculation unit 13 of the control unit 10. The calculation unit 13 detects the position of the center of gravity of the reflected light 22 according to the intensity of the reflected light 22 received by each of the light receiving elements 32. The calculation unit 13 further calculates the amount of warpage of the substrate 1 based on the position of the surface 2 of the substrate 1 obtained from the detection result of the center of gravity position of the reflected light 22. The position detection unit 16 corrects the set value of the time during which the light receiving unit 12 receives the reflected light 22 based on the amount of warpage of the substrate 1 calculated by the calculating unit 13, and then the light receiving unit 12 receives the reflected light 22. The position in the movement direction DR1 of the substrate 1 is detected based on the time to perform the detection, and it is detected whether or not the position shift in the movement direction DR1 of the substrate 1 has occurred.
　基板１の移動方向ＤＲ１における位置ずれは、受光部１２が反射光２２を受光する時間の設定値と、受光部１２が反射光を受光した実際の時間と、の差を求めることによって検出される。反射光２２の受光時間の設定値と実測値との差が所定の閾値以上である場合、基板１の位置ずれが発生したと判断される。このとき出力部１４は基板１の位置ずれが発生したことを出力するとともに、警報発生部４０へ制御信号Ｓ３を伝送する。警報発生部４０は、制御信号Ｓ３を受けて、基板１の位置ずれが発生したことを作業者に通知するために警報を発報する。 The positional deviation in the moving direction DR1 of the substrate 1 is detected by obtaining the difference between the set value of the time when the light receiving unit 12 receives the reflected light 22 and the actual time when the light receiving unit 12 received the reflected light. . When the difference between the set value of the light reception time of the reflected light 22 and the actual measurement value is equal to or greater than a predetermined threshold value, it is determined that the substrate 1 has been displaced. At this time, the output unit 14 outputs that the positional deviation of the substrate 1 has occurred, and transmits a control signal S3 to the alarm generation unit 40. The alarm generation unit 40 receives the control signal S3 and issues an alarm in order to notify the operator that the position shift of the substrate 1 has occurred.
　出力部１４は、基板１の反り量および／または基板１の移動方向ＤＲ１の位置ずれ量を表示するための表示ディスプレイを有する。出力部１４はまた、基板１の位置ずれ量に応じて警報発生部４０へ制御信号Ｓ３を伝送するためのインターフェイス部を有する。警報発生部４０は、ランプなどの視覚的に作業者に警報を通知する構成、ブザーなどの聴覚的に作業者に警報を通知する構成、もしくはこれらの両方、または警報の発生を作業者に認識させることが可能な任意のその他の構成を有してもよい。 The output unit 14 has a display for displaying the amount of warpage of the substrate 1 and / or the amount of displacement of the substrate 1 in the moving direction DR1. The output unit 14 also has an interface unit for transmitting the control signal S3 to the alarm generation unit 40 in accordance with the amount of positional deviation of the substrate 1. The alarm generation unit 40 is configured to visually notify the worker of an alarm, such as a lamp, or to be configured to audibly notify the worker of an alarm, such as a buzzer, or both, or to recognize the occurrence of the alarm to the worker. It may have any other configuration that can be made.
　図３は、基板１の反りが発生していない状態の検査光２１の反射を示す模式図である。図４は、基板１の凸反りが発生した状態の検査光２１の反射を示す模式図である。図５は、基板１の凹反りが発生した状態の検査光２１の反射を示す模式図である。上述した通り、基板１には、残留応力または自重の影響によって反りが発生する。基板１に反りが発生すると、図４に示すように表面２側に凸になるか、または図５に示すように表面２側に凹になるように、基板１が厚さ方向に変形する。本明細書中では、図４に示す表面２側に凸になる反りを凸反りと称し、図５に示す表面２側に凹になる反りを凹反りと称する。また、凸反りの場合の基板１の反り量を正とし、凹反りの場合の基板１の反り量を負とするものとする。 FIG. 3 is a schematic diagram showing the reflection of the inspection light 21 in a state where the substrate 1 is not warped. FIG. 4 is a schematic diagram showing the reflection of the inspection light 21 in a state where the convex warpage of the substrate 1 has occurred. FIG. 5 is a schematic diagram showing the reflection of the inspection light 21 in a state where the concave warp of the substrate 1 has occurred. As described above, the substrate 1 is warped due to the influence of residual stress or its own weight. When the substrate 1 is warped, the substrate 1 is deformed in the thickness direction so as to be convex toward the surface 2 as shown in FIG. 4 or concave toward the surface 2 as shown in FIG. In the present specification, a warp convex toward the surface 2 shown in FIG. 4 is referred to as a convex warp, and a warp concave toward the surface 2 shown in FIG. 5 is referred to as a concave warp. Further, it is assumed that the amount of warping of the substrate 1 in the case of convex warping is positive, and the amount of warping of the substrate 1 in the case of concave warping is negative.
　なお、図４，図５には、理解を容易にするために、実際に基板１に生じる反りよりも誇張された過大な反りが発生した状態の基板１が図示されている。しかし、実際に基板１に生じる反りは、図４，図５に示す反りよりも遥かに微小である。基板１に生じる反りの大小に対応して、基板１の表面２で反射する反射光２２の反射角は異なるが、実際に発生する反射角のずれは無視できる程度である。そのため、反射光２２の反射角は変化しないものと考えることができる。この場合、受光部１２の各受光素子３２で受光される反射光２２の強度から、基板１の反りによる表面２の高さの変化量を簡易的に算出することが可能となる。 4 and 5 show the substrate 1 in a state where an excessive warpage exaggerated more than the warp actually generated in the substrate 1 is generated for easy understanding. However, the warp actually generated in the substrate 1 is much smaller than the warp shown in FIGS. The reflection angle of the reflected light 22 reflected by the surface 2 of the substrate 1 differs depending on the magnitude of the warp occurring on the substrate 1, but the actual deviation of the reflection angle is negligible. Therefore, it can be considered that the reflection angle of the reflected light 22 does not change. In this case, the amount of change in the height of the surface 2 due to the warp of the substrate 1 can be easily calculated from the intensity of the reflected light 22 received by each light receiving element 32 of the light receiving unit 12.
　図３に示す、基板１に反りが発生せず表面２が平坦である場合の、光照射部１１から検査光２１が出射される出射端１１ａから基板１の表面２までの距離をＬ１とする。このとき検査光２１は、基板１の表面２で反射され、図３に示す反射光２２ａの光路を通り、受光部１２のいずれかの受光素子３２に受光される。 When the substrate 1 is not warped and the surface 2 is flat as shown in FIG. 3, the distance from the emission end 11a from which the inspection light 21 is emitted from the light irradiation unit 11 to the surface 2 of the substrate 1 is denoted by L1. . At this time, the inspection light 21 is reflected by the surface 2 of the substrate 1, passes through the optical path of the reflected light 22 a shown in FIG. 3, and is received by one of the light receiving elements 32 of the light receiving unit 12.
　図４に示す、基板１に凸反りが発生した場合の光照射部１１の出射端１１ａから基板１の表面２までの距離は、Ｌ１よりも大きいＬ２である。このとき検査光２１は、凸形状に反った表面２で反射され、図４に示す反射光２２ｂの光路を通り、受光部１２のいずれかの受光素子３２に受光される。 As shown in FIG. 4, the distance from the emission end 11a of the light irradiation unit 11 to the surface 2 of the substrate 1 when convex warpage occurs in the substrate 1 is L2, which is larger than L1. At this time, the inspection light 21 is reflected by the surface 2 having a convex shape, passes through the optical path of the reflected light 22 b shown in FIG. 4, and is received by one of the light receiving elements 32 of the light receiving unit 12.
　図５に示す、基板１に凹反りが発生した場合の光照射部１１の出射端１１ａから基板１の表面２までの距離は、Ｌ１よりも小さいＬ３である。このとき検査光２１は、凹形状に反った表面２で反射され、図５に示す反射光２２ｃの光路を通り、受光部１２のいずれかの受光素子３２に受光される。 As shown in FIG. 5, the distance from the emission end 11a of the light irradiation section 11 to the surface 2 of the substrate 1 when the substrate 1 is warped is L3 smaller than L1. At this time, the inspection light 21 is reflected by the surface 2 warped in a concave shape, passes through the optical path of the reflected light 22 c shown in FIG. 5, and is received by one of the light receiving elements 32 of the light receiving unit 12.
　図６は、基板１の反りが発生していないときの反射光２２ａの重心位置Ｇを示すグラフである。図７は、基板１の凸反りが発生したときの反射光２２ｂの重心位置Ｇを示すグラフである。図８は、基板１の凹反りが発生したときの反射光２２ｃの重心位置Ｇを示すグラフである。図６～図８に示すグラフの縦軸は反射光２２の強度を示し、横軸は複数の受光素子３２の位置を示す。図６～図８には、複数の受光素子３２の各々が受光した反射光２２の強度が実線の曲線で示されており、反射光２２の重心位置Ｇが図中上下方向に延びる一点鎖線の直線で示されている。 FIG. 6 is a graph showing the gravity center position G of the reflected light 22a when the substrate 1 is not warped. FIG. 7 is a graph showing the gravity center position G of the reflected light 22b when the convex warpage of the substrate 1 occurs. FIG. 8 is a graph showing the center-of-gravity position G of the reflected light 22c when the concave warp of the substrate 1 occurs. 6 to 8, the vertical axis represents the intensity of the reflected light 22, and the horizontal axis represents the positions of the plurality of light receiving elements 32. 6 to 8, the intensity of the reflected light 22 received by each of the plurality of light receiving elements 32 is indicated by a solid curve, and the center of gravity G of the reflected light 22 is indicated by a one-dot chain line extending in the vertical direction in the drawings. It is shown as a straight line.
　反射光２２の重心位置Ｇとは、図６～図８に示すように、ＴＥＭ００モードのようなガウシアン分布の強度の光を使用した場合には、反射光２２の強度が最大の位置を示す。または、均一強度のトップハット型の光を使用した場合には、反射光２２の重心位置とは、反射光２２を受光した領域の中心の位置を示す。 The gravity center position G of the reflected light 22 indicates a position where the intensity of the reflected light 22 is maximum when light having a Gaussian distribution intensity as in the TEM00 mode is used, as shown in FIGS. Alternatively, when top-hat type light having a uniform intensity is used, the position of the center of gravity of the reflected light 22 indicates the position of the center of the area where the reflected light 22 is received.
　図６～図８に示すグラフでは、反射光２２ａ，２２ｂ，２２ｃの強度が最大となる位置が、反射光２２ａ，２２ｂ，２２ｃの各々の重心位置Ｇとなる。基板１の表面２で反射し受光部１２で受光される反射光２２の重心位置Ｇは、図３～図５に示す基板１の反り状態の違いにより、図６～図８でそれぞれ異なっている。図６に示す基板１の反りが発生していないときの反射光２２ａの重心位置Ｇに対し、図７に示す基板１の凸反りが発生したときの反射光２２ｂの重心位置Ｇは、横軸の座標がより小さい位置にある。図６に示す反射光２２ａの重心位置Ｇに対し、図８に示す基板１の凹反りが発生したときの反射光２２ｃの重心位置Ｇは、横軸の座標がより大きい位置にある。 In the graphs shown in FIG. 6 to FIG. 8, the position where the intensity of the reflected light 22a, 22b, 22c is the maximum is the gravity center position G of each of the reflected lights 22a, 22b, 22c. The center of gravity G of the reflected light 22 reflected by the surface 2 of the substrate 1 and received by the light receiving unit 12 differs in each of FIGS. 6 to 8 due to the difference in the warping state of the substrate 1 shown in FIGS. . The center of gravity G of the reflected light 22b when the convex warp of the substrate 1 shown in FIG. 7 occurs with respect to the center of gravity G of the reflected light 22a when the substrate 1 shown in FIG. Is at a smaller position. The gravity center position G of the reflected light 22c when the concave warp of the substrate 1 shown in FIG. 8 occurs is larger than the gravity center position G of the reflected light 22a shown in FIG.
　図９は、反射光２２の重心位置Ｇと基板１の反り量との関係を示すグラフである。図９に示すグラフの横軸は反射光２２の重心位置Ｇを示し、縦軸は基板１の反り量を示す。図３～図５に示すように、基板１の反り状態によって反射光２２の光路が異なり、受光部１２に含まれる複数の受光素子３２のうち反射光２２を受光する受光素子３２が異なる。反射光２２を受光する受光素子３２の位置によって、反射光２２の重心位置Ｇは異なる。そのため、反射光２２の重心位置Ｇと基板１の反り量との間には、所定の関係が成立する。図９には、反射光２２の重心位置Ｇと基板１の反り量との間に線形の関係が成立する場合のグラフを、簡易的に示している。図１に示す演算部１３は、反射光２２の強度分布から重心位置Ｇを演算し、さらに重心位置Ｇと反り量との関係を参照して基板１の反り量を演算する。 FIG. 9 is a graph showing the relationship between the center of gravity position G of the reflected light 22 and the amount of warpage of the substrate 1. The horizontal axis of the graph shown in FIG. 9 indicates the gravity center position G of the reflected light 22, and the vertical axis indicates the amount of warpage of the substrate 1. As shown in FIGS. 3 to 5, the optical path of the reflected light 22 differs depending on the warping state of the substrate 1, and the light receiving element 32 that receives the reflected light 22 among the plurality of light receiving elements 32 included in the light receiving unit 12 is different. The gravity center position G of the reflected light 22 varies depending on the position of the light receiving element 32 that receives the reflected light 22. Therefore, a predetermined relationship is established between the center of gravity position G of the reflected light 22 and the amount of warpage of the substrate 1. FIG. 9 simply shows a graph in the case where a linear relationship is established between the gravity center position G of the reflected light 22 and the amount of warpage of the substrate 1. The calculation unit 13 shown in FIG. 1 calculates the center of gravity position G from the intensity distribution of the reflected light 22, and further calculates the amount of warpage of the substrate 1 with reference to the relationship between the center of gravity position G and the amount of warpage.
　図１０は、基板１の反りが発生していないときの反射光２２の受光時間を示す模式図である。図１１は、基板１の凸反りが発生したときの反射光２２の受光時間を示す模式図である。基板１は、基板搬送部１５（図１０および図１１には不図示）によって、移動方向ＤＲ１に移動する。図１０および図１１には、面方向に移動中の基板１の移動方向ＤＲ１における前側縁部に、光照射部１１ｓから検査光２１ｓが照射され、基板１の表面２で反射した反射光２２ｓを受光部１２ｓで受光する状態が、図示されている。図１０および図１１にはまた、面方向に移動中の基板１の移動方向ＤＲ１における後側縁部に、光照射部１１ｅから検査光２１ｅが照射され、基板１の表面２で反射した反射光２２ｅを受光部１２ｅで受光する状態が、図示されている。 FIG. 10 is a schematic diagram showing the light reception time of the reflected light 22 when the substrate 1 is not warped. FIG. 11 is a schematic diagram illustrating the light reception time of the reflected light 22 when the convex warpage of the substrate 1 occurs. The substrate 1 is moved in the movement direction DR1 by the substrate transfer unit 15 (not shown in FIGS. 10 and 11). 10 and 11, the front light edge 11s in the moving direction DR1 of the substrate 1 moving in the plane direction is irradiated with the inspection light 21s from the light irradiation unit 11s, and the reflected light 22s reflected on the surface 2 of the substrate 1 is reflected. A state in which the light receiving unit 12s receives light is illustrated. 10 and 11, the reflected light reflected from the surface 2 of the substrate 1 is irradiated with the inspection light 21e from the light irradiation unit 11e on the rear edge in the movement direction DR1 of the substrate 1 moving in the plane direction. A state in which 22e is received by the light receiving unit 12e is illustrated.
　反射光２２の受光時間とは、基板１の前側縁部で反射した反射光２２ｓを受光部１２ｓが受光したときから、基板１の後側縁部で反射した反射光２２ｅを受光部１２ｅが受光しなくなるまでの時間を示す。図１０に示す、基板１に反りが発生していないときの反射光２２の受光時間を、基準時間Ｔとする。図１１に示す基板１に反りが発生しているときの反射光２２の受光時間は、基準時間Ｔに対し補正値ｔ１を加えた時間になる。 The light receiving time of the reflected light 22 is that the light receiving unit 12e receives the reflected light 22e reflected from the rear edge of the substrate 1 after the light receiving unit 12s receives the reflected light 22s reflected from the front edge of the substrate 1. Indicates the time until it stops. The light receiving time of the reflected light 22 when the substrate 1 is not warped as shown in FIG. The light receiving time of the reflected light 22 when the substrate 1 shown in FIG. 11 is warped is a time obtained by adding the correction value t1 to the reference time T.
　図１２は、基板１の反り量と反射光２２の受光時間の補正値との関係を示す図である。図１２に示すように、基板１の反り量に対応して、反射光２２の受光時間の補正値が決定される。図１０に示す基板１に反りが発生していないときは、基板１の反り量は０であり、反射光２２の受光時間の補正値も０である。これに対し、基板１に反り量＋ｗ１の凸反りが発生したときの反射光２２の受光時間の補正値はｔ１であり、基板１に反り量＋ｗ２の凸反りが発生した時の反射光２２の受光時間の補正値はｔ２である。また基板１に反り量－ｗ１の凹反りが発生したときの反射光２２の受光時間の補正値はｔ３であり、基板１に反り量－ｗ２の凹反りが発生した時の反射光２２の受光時間の補正値はｔ４である。 FIG. 12 is a diagram showing the relationship between the amount of warpage of the substrate 1 and the correction value of the light reception time of the reflected light 22. As shown in FIG. 12, the correction value of the light reception time of the reflected light 22 is determined in accordance with the amount of warpage of the substrate 1. When the substrate 1 shown in FIG. 10 is not warped, the amount of warpage of the substrate 1 is 0, and the correction value of the light receiving time of the reflected light 22 is also 0. On the other hand, the correction value of the light reception time of the reflected light 22 when the warp amount + w1 is generated on the substrate 1 is t1, and the reflected light 22 when the convex warp amount + w2 is generated on the substrate 1 is t1. The correction value of the light reception time is t2. The correction value of the light receiving time of the reflected light 22 when the warp amount −w1 occurs in the substrate 1 is t3, and the reflected light 22 is received when the substrate 1 undergoes the warp amount −w2 concave warp. The time correction value is t4.
　上述した通り、基板１に発生する反り量は、基板１の種類によって異なる。そのため、基板１の種類毎に図１２に対応する反り量と補正値との関係を予め設定しておき、対象の基板１の種類に対応して反り量と補正値との関係が選択される。図１に示す位置検出部１６は、基板１の反り量に従った反射光２２の受光時間の補正値を考慮して、移動方向ＤＲ１における基板１の位置を検出する。基板１の反り量を考慮してもなお反射光２２の受光時間が設定値と異なる場合に、位置検出部１６から出力部１４に基板１の位置ずれが発生したことを示す信号が伝送され、出力部１４は制御信号Ｓ３を出力して警報発生部４０にアラームを発報させる。 As described above, the amount of warpage generated on the substrate 1 varies depending on the type of the substrate 1. Therefore, the relationship between the warpage amount and the correction value corresponding to FIG. 12 is set in advance for each type of the substrate 1, and the relationship between the warpage amount and the correction value is selected corresponding to the type of the target substrate 1. . The position detection unit 16 illustrated in FIG. 1 detects the position of the substrate 1 in the movement direction DR1 in consideration of the correction value of the light reception time of the reflected light 22 according to the warpage amount of the substrate 1. Even when the amount of warpage of the substrate 1 is taken into account, if the light receiving time of the reflected light 22 is different from the set value, a signal indicating that the positional deviation of the substrate 1 has occurred is transmitted from the position detection unit 16 to the output unit 14, The output unit 14 outputs a control signal S3 to cause the alarm generation unit 40 to issue an alarm.
　図１３は、基板１の移動方向ＤＲ１の位置ずれを検出するフローチャートである。図１に示す位置検出部１６は、図１２に示す基板１の反り量に対応する反射光２２の受光時間の補正値を考慮して、基板１に移動方向ＤＲ１の位置ずれが発生していることを検出する。 FIG. 13 is a flowchart for detecting a positional shift of the substrate 1 in the moving direction DR1. The position detector 16 shown in FIG. 1 has a displacement in the movement direction DR1 on the substrate 1 in consideration of the correction value of the light receiving time of the reflected light 22 corresponding to the amount of warpage of the substrate 1 shown in FIG. Detect that.
　図１３に示すように、まずステップ（Ｓ１０）において、検査光２１の照射が開始される。図１に示す発光指令部１８から光照射部１１に対し、検査光２１の出射を指令する制御信号Ｓ２が伝送され、制御信号Ｓ２を受けた光照射部１１は検査光２１の出射を開始する。次にステップ（Ｓ２０）において、基板１を移動させる。図１に示す基板駆動指令部１７から基板搬送部１５に対し、基板１の移動方向ＤＲ１への移動の開始を指令する制御信号Ｓ１が伝送され、制御信号Ｓ１を受けた基板搬送部１５が起動することにより、基板１の面方向への移動が開始される。 As shown in FIG. 13, first, in step (S10), irradiation of the inspection light 21 is started. A control signal S2 for instructing emission of the inspection light 21 is transmitted from the light emission command unit 18 illustrated in FIG. 1 to the light irradiation unit 11, and the light irradiation unit 11 that has received the control signal S2 starts emission of the inspection light 21. . Next, in step (S20), the substrate 1 is moved. A control signal S1 is transmitted from the substrate drive command unit 17 shown in FIG. 1 to the substrate transport unit 15 to start the movement of the substrate 1 in the movement direction DR1, and the substrate transport unit 15 that receives the control signal S1 is activated. By doing so, the movement in the surface direction of the substrate 1 is started.
　次にステップ（Ｓ３０）において、反射光２２の検出が開始される。移動方向ＤＲ１における基板１の移動に伴い、基板１の前側縁部が検査光２１の光路に到達すると、基板１の前側縁部の表面２において検査光２１は反射される。検査光２１が反射された反射光２２は、受光部１２に含まれるいずれかの受光素子３２によって受光される。このとき、受光部１２から信号Ｖ１を受けた演算部１３は、反射光２２を受光した各々の受光素子３２の位置と、各々の受光素子３２が受光した反射光２２の強度分布と、に基づいて、反射光２２の重心位置Ｇを決定する。 Next, in step (S30), detection of the reflected light 22 is started. When the front edge of the substrate 1 reaches the optical path of the inspection light 21 as the substrate 1 moves in the movement direction DR1, the inspection light 21 is reflected on the surface 2 of the front edge of the substrate 1. The reflected light 22 from which the inspection light 21 is reflected is received by one of the light receiving elements 32 included in the light receiving unit 12. At this time, the arithmetic unit 13 that has received the signal V1 from the light receiving unit 12 is based on the position of each light receiving element 32 that receives the reflected light 22 and the intensity distribution of the reflected light 22 received by each light receiving element 32. Thus, the gravity center position G of the reflected light 22 is determined.
　演算部１３はさらに、ステップ（Ｓ４０）において、図９に一例を示す反射光２２の重心位置Ｇと基板１の反り量との関係に従って、反射光２２の重心位置Ｇから基板１の反り量を求める。演算部１３はさらに、次のステップ（Ｓ５０）において、図１２に一例を示す基板１の反り量と反射光２２の受光時間の補正値とを関係を示すテーブルを参照して、反射光２２の受光時間の補正値を決定する。 Further, in step (S40), the calculation unit 13 calculates the amount of warpage of the substrate 1 from the center of gravity position G of the reflected light 22 according to the relationship between the center of gravity position G of the reflected light 22 and the amount of warpage of the substrate 1 shown in FIG. Ask. In the next step (S50), the arithmetic unit 13 further refers to a table showing the relationship between the warpage amount of the substrate 1 and the correction value of the light reception time of the reflected light 22 shown in FIG. Determine the correction value for the light reception time.
　その後ステップ（Ｓ６０）において、反射光２２の検出が終了する。移動方向ＤＲ１における基板１の移動に伴い、基板１の後側縁部が検査光２１の光路に到達し、さらに基板１が検査光２１の光路から外れると、検査光２１は基板１の表面２に照射されなくなる。その結果、表面２で検査光２１が反射されず、受光部１２が反射光２２を受光することもなくなるので、受光部１２における反射光２２の検出が終了する。 Thereafter, in step (S60), the detection of the reflected light 22 is completed. With the movement of the substrate 1 in the movement direction DR1, when the rear edge of the substrate 1 reaches the optical path of the inspection light 21, and the substrate 1 is further out of the optical path of the inspection light 21, the inspection light 21 is separated from the surface 2 of the substrate 1. Will not be irradiated. As a result, the inspection light 21 is not reflected on the surface 2, and the light receiving unit 12 does not receive the reflected light 22. Therefore, the detection of the reflected light 22 in the light receiving unit 12 is completed.
　続いてステップ（Ｓ７０）において、反射光２２の受光時間が設定値と比較して等しいか否かが判断される。位置検出部１６は、基板１に反りが発生していないときの受光時間の基準時間Ｔに、ステップ（Ｓ５０）で求められた補正値を加えて、反射光２２の受光時間の設定値を決定する。位置検出部１６はさらに、決定された反射光２２の受光時間の設定値と、受光部１２における反射光２２の検出開始から検出終了までの時間の実測値とを比較して、基板１に移動方向ＤＲ１の位置ずれが発生しているか否かを判断する。 Subsequently, in step (S70), it is determined whether or not the light reception time of the reflected light 22 is equal to the set value. The position detection unit 16 adds the correction value obtained in step (S50) to the reference time T of the light reception time when the substrate 1 is not warped, and determines the set value of the light reception time of the reflected light 22. To do. Further, the position detection unit 16 compares the determined set value of the light reception time of the reflected light 22 with the actually measured value of the time from the start of detection of the reflected light 22 to the end of detection in the light reception unit 12 and moves to the substrate 1. It is determined whether or not a positional deviation in the direction DR1 has occurred.
　ステップ（Ｓ７０）の判断において、反射光２２の受光時間が設定値と異なっている場合、基板１に位置ずれが発生していると判断される。この場合、次にステップ（Ｓ８０）に進み、出力部１４の表示ディスプレイに位置ずれの発生が表示されるとともに、出力部１４から警報発生部４０へ制御信号Ｓ３が伝送されて、警報発生部４０は基板１の位置ずれが発生したことを示すアラームを発報する。アラームを感知した作業者は、次なる基板１の処理のために基板１を移動させる前に、基板１の搬送を一端停止し、基板１を適正な位置に戻す。 In the determination of step (S70), if the light reception time of the reflected light 22 is different from the set value, it is determined that the substrate 1 is misaligned. In this case, the process proceeds to the next step (S80), the occurrence of misalignment is displayed on the display of the output unit 14, and the control signal S3 is transmitted from the output unit 14 to the alarm generating unit 40. Issues an alarm indicating that the substrate 1 has been displaced. The worker who has detected the alarm stops the conveyance of the substrate 1 once and moves the substrate 1 to an appropriate position before moving the substrate 1 for the next processing of the substrate 1.
　ステップ（Ｓ７０）の判断において反射光２２の受光時間が設定値と等しい場合、基板１は位置ずれしていないと判断される。この場合ステップ（Ｓ８０）はスキップされるので、警報発生部４０からアラームは発報されない。このようにして、本実施の形態の基板検査装置１００を使用した基板１の位置ずれを検出するためのフローが終了する。 If it is determined in step (S70) that the reception time of the reflected light 22 is equal to the set value, it is determined that the substrate 1 is not displaced. In this case, since step (S80) is skipped, no alarm is issued from the alarm generation unit 40. In this way, the flow for detecting the positional deviation of the substrate 1 using the substrate inspection apparatus 100 of the present embodiment is completed.
　以上説明したように、本実施の形態の基板検査装置１００によれば、基板１の表面２に検査光２１を照射し、検査光２１が表面２で反射した反射光２２の重心位置Ｇを検出することで、基板１の反り状態を検出することができる。したがって、基板１の面方向に沿う移動方向ＤＲ１に移動する基板１の反り量の検出精度を向上でき、より正確に基板１の反り状態を検出することができる。 As described above, according to the substrate inspection apparatus 100 of the present embodiment, the inspection light 21 is irradiated on the surface 2 of the substrate 1 and the center of gravity G of the reflected light 22 reflected by the inspection light 21 is detected. By doing so, the warpage state of the substrate 1 can be detected. Therefore, it is possible to improve the detection accuracy of the warpage amount of the substrate 1 moving in the moving direction DR1 along the surface direction of the substrate 1, and to detect the warpage state of the substrate 1 more accurately.
　面方向に連続移動中の基板１の反り量をリアルタイムで検出し、反り量に基づいて基板１の移動方向ＤＲ１の位置ずれをリアルタイムで検出できるので、ドライエッチングなどの基板１の処理の生産性を向上することができる。または、基板１の反り量に係る所定の閾値と実際の基板１の反り量とを比較して、基板１の反り量が閾値を上回った場合、基板１の搬送を一端停止し、当該基板１を処理装置から除外することも可能である。この場合、基板１の処理の品質を向上することができる。 Since the amount of warpage of the substrate 1 that is continuously moving in the surface direction can be detected in real time, and the displacement in the movement direction DR1 of the substrate 1 can be detected in real time based on the amount of warpage, the productivity of the processing of the substrate 1 such as dry etching can be detected. Can be improved. Alternatively, a predetermined threshold value related to the warpage amount of the substrate 1 is compared with the actual warpage amount of the substrate 1, and when the warpage amount of the substrate 1 exceeds the threshold value, the conveyance of the substrate 1 is stopped once, and the substrate 1 is stopped. Can be excluded from the processing apparatus. In this case, the processing quality of the substrate 1 can be improved.
　以上のように本発明の実施の形態について説明を行なったが、今回開示された実施の形態はすべての点で例示であって、制限的なものではないと考えられるべきである。この発明の範囲は上記した説明ではなくて請求の範囲によって示され、請求の範囲と均等の意味、および範囲内でのすべての変更が含まれることが意図される。 As described above, the embodiment of the present invention has been described. However, it should be considered that the embodiment disclosed this time is illustrative and not restrictive in all respects. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
　本発明は、基板を面方向に搬送する様々な生産装置に好適に適用され、本発明により基板の反りの発生を原因とした基板搬送時の不具合を回避することが可能になる。 The present invention is suitably applied to various production apparatuses that transport a substrate in the surface direction, and the present invention makes it possible to avoid problems during substrate transportation caused by the occurrence of warping of the substrate.
　１　基板、２　表面、１０　制御部、１１　光照射部、１２　受光部、１３　演算部、１４　出力部、１５　基板搬送部、１６　位置検出部、２１　検査光、２２　反射光、３２　受光素子、４０　警報発生部、１００　基板検査装置、ＤＲ１　移動方向、Ｇ　重心位置。 1 substrate, 2 surface, 10 control unit, 11 light irradiation unit, 12 light receiving unit, 13 calculation unit, 14 output unit, 15 substrate transport unit, 16 position detection unit, 21 inspection light, 22 reflected light, 32 light receiving element, 40 Alarm generation unit, 100 substrate inspection device, DR1, moving direction, G center of gravity position.

Claims (4)

  1. 　表面を有する平板形状の基板を面方向に移動させる基板搬送部と、
    　面方向に移動中の前記基板の前記表面に対し傾斜した方向に検査光を照射する光照射部と、
    　前記表面で前記検査光が反射した反射光を受光する受光部と、を備え、
    　前記受光部は、複数の受光素子を含み、前記受光素子の各々が受光した前記反射光の強度を出力可能に設けられており、さらに、
    　前記受光素子の各々が受光した前記反射光の強度に従い前記反射光の重心位置を検出し、前記重心位置の検出結果より前記基板の反り量を演算する演算部を備える、基板検査装置。     A substrate transport section for moving a flat substrate having a surface in a plane direction;
    A light irradiation unit that irradiates inspection light in a direction inclined with respect to the surface of the substrate being moved in a plane direction;
    A light receiving unit that receives the reflected light reflected by the inspection light on the surface, and
    The light receiving unit includes a plurality of light receiving elements, and is provided so as to be able to output the intensity of the reflected light received by each of the light receiving elements,
    A substrate inspection apparatus comprising: an arithmetic unit that detects a center of gravity position of the reflected light according to the intensity of the reflected light received by each of the light receiving elements, and calculates a warpage amount of the substrate from a detection result of the center of gravity position.
  2. 　前記演算部は、前記反射光の前記重心位置から求められる前記表面の位置により前記基板の反り量を演算する、請求項１に記載の基板検査装置。 2. The substrate inspection apparatus according to claim 1, wherein the calculation unit calculates a warpage amount of the substrate based on a position of the surface obtained from the position of the center of gravity of the reflected light.
  3. 　前記受光部が前記反射光を受光する時間に基づいて前記基板の移動方向の位置を検出する位置検出部を備え、
    　前記位置検出部は、前記基板の反り量に基づいて、前記受光部が前記反射光を受光する時間の設定値を補正する、請求項１または請求項２に記載の基板検査装置。     A position detection unit that detects a position of the substrate in the moving direction based on a time during which the light receiving unit receives the reflected light;
    The substrate inspection apparatus according to claim 1, wherein the position detection unit corrects a set value of a time during which the light receiving unit receives the reflected light based on a warp amount of the substrate.
  4. 　前記受光部が前記反射光を受光する時間の設定値と、前記受光部が前記反射光を受光した実際の時間と、の差に応じて警報を発報する警報発生部を備える、請求項３に記載の基板検査装置。 The alarm generation part which alert | reports an alarm according to the difference of the setting value of the time when the said light-receiving part receives the said reflected light, and the actual time when the said light-receiving part received the said reflected light is provided. The board inspection apparatus according to 1.
PCT/JP2013/051135 2012-01-25 2013-01-22 Substrate inspection device WO2013111720A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012012890 2012-01-25
JP2012-012890 2012-01-25

Publications (1)

Publication Number Publication Date
WO2013111720A1 true WO2013111720A1 (en) 2013-08-01

Family

ID=48873440

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/051135 WO2013111720A1 (en) 2012-01-25 2013-01-22 Substrate inspection device

Country Status (1)

Country Link
WO (1) WO2013111720A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07110966A (en) * 1993-10-13 1995-04-25 Nikon Corp Method and apparatus for measurement of warp of substance
JPH10311709A (en) * 1997-05-09 1998-11-24 Denso Corp Method for measuring thickness of wafer where thin film is formed
JP2007225480A (en) * 2006-02-24 2007-09-06 Hitachi High-Technologies Corp Surface inspection device
JP2008258365A (en) * 2007-04-04 2008-10-23 Dainippon Screen Mfg Co Ltd Position detection device, pattern drawing apparatus, and position detecting method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07110966A (en) * 1993-10-13 1995-04-25 Nikon Corp Method and apparatus for measurement of warp of substance
JPH10311709A (en) * 1997-05-09 1998-11-24 Denso Corp Method for measuring thickness of wafer where thin film is formed
JP2007225480A (en) * 2006-02-24 2007-09-06 Hitachi High-Technologies Corp Surface inspection device
JP2008258365A (en) * 2007-04-04 2008-10-23 Dainippon Screen Mfg Co Ltd Position detection device, pattern drawing apparatus, and position detecting method

Similar Documents

Publication Publication Date Title
US20170161889A1 (en) Laser projection system and method
US9030656B2 (en) Inspection device, inspection method and non-transitory storage medium for inspecting deformation of substrate holding member, and substrate processing system including the inspection device
JP2013137197A (en) Laser type thickness measurement system and calibration method therefor
US20130141737A1 (en) Thickness measuring system for measuring a thickness of a plate-shaped member
JP2008232887A (en) Object sensing apparatus and irradiation axis adjustment method
JP2010219209A (en) Substrate detecting device, and substrate conveying device with the same
JP6606441B2 (en) Inspection system and inspection method
TW201837424A (en) Object thickness measurement system, method, detecting apparatus, computer readable medium, and computer program product
EP3370035B1 (en) Gap measurement device and gap measurement method
JP6116710B2 (en) Appearance inspection apparatus and appearance inspection method
JP5470885B2 (en) Film flatness inspection apparatus and flatness inspection method
JP4412180B2 (en) Laser ultrasonic inspection method and laser ultrasonic inspection device
WO2013111720A1 (en) Substrate inspection device
JP2012242138A (en) Shape measuring device
TW201350241A (en) Laser processing apparatus and laser processing method
JP2010044004A (en) Apparatus, method and program for detecting transmitted light, and method of manufacturing sheet material
WO2021079541A1 (en) Appearance inspection device and defect inspection method
JP2008241612A (en) Defect inspection device and method
JP6464595B2 (en) Sensor mounting angle detection device and sensor mounting angle detection program
JP6111495B2 (en) Optical measuring device
JP7395950B2 (en) Visual inspection equipment and visual inspection method
CN107210255B (en) Wafer transfer apparatus
JP4716433B2 (en) Measuring system and measuring method for track plate for endless track
JP4973294B2 (en) Component mounting equipment
JP5594217B2 (en) Inspection method and inspection system

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13740800

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13740800

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP