JP2010219209A - Substrate detecting device, and substrate conveying device with the same - Google Patents

Substrate detecting device, and substrate conveying device with the same Download PDF

Info

Publication number
JP2010219209A
JP2010219209A JP2009062799A JP2009062799A JP2010219209A JP 2010219209 A JP2010219209 A JP 2010219209A JP 2009062799 A JP2009062799 A JP 2009062799A JP 2009062799 A JP2009062799 A JP 2009062799A JP 2010219209 A JP2010219209 A JP 2010219209A
Authority
JP
Japan
Prior art keywords
substrate
sensor
sensors
sensor support
optical axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009062799A
Other languages
Japanese (ja)
Other versions
JP5353336B2 (en
Inventor
Masayuki Matsumoto
正幸 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yaskawa Electric Corp
Original Assignee
Yaskawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Electric Corp filed Critical Yaskawa Electric Corp
Priority to JP2009062799A priority Critical patent/JP5353336B2/en
Publication of JP2010219209A publication Critical patent/JP2010219209A/en
Application granted granted Critical
Publication of JP5353336B2 publication Critical patent/JP5353336B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate detecting device capable of detecting a jumping out of a substrate stored in a cassette with a minimum number of sensors. <P>SOLUTION: The substrate detecting device that detects substrates W stored horizontally in the cassette in multiple vertical stages includes sensor supports 6a, 6b, first sensors 9a, 9b disposed on the sensor supports so as to have axes horizontally, second sensors 9c, 9d installed on the sensor supports to have optical axes inclined at a certain angle from the horizontal, and a sensor support driving means 5 of moving the sensor supports in front-rear and up-down directions with respect to a peripheral edge of the substrate W. The optical axes of the first and the second sensors are moved up and down to block the optical axes H, S by the substrate W, thereby detecting at least whether the substrate is present, the slanting state of the substrate, and the substrate jumping out on the basis of the interval at which the optical axes of the first and the second sensors are blocked. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、カセット内に収納された半導体ウェハやガラス基板の状態を検出する装置およびそれを備えた基板搬送装置に関する。   The present invention relates to an apparatus for detecting a state of a semiconductor wafer or a glass substrate housed in a cassette, and a substrate transfer apparatus including the apparatus.

半導体製造装置、液晶製造装置、あるいはこれらの検査装置において、半導体ウェハ、ガラス基板といった基板を所望の位置に精度良くかつクリーンに搬送するために、基板搬送装置が使用されている。基板搬送装置はアームやそれに類する機構に設けられたハンド上で基板を保持してこれを搬送する。基板搬送装置は、基板が多段に収納されたカセットから基板を搬送することが多いため、基板がカセット内でどのように収容されているか、という情報を把握する必要がある。つまり、基板の有無のほか、斜めに挿入されていないか、カセット１段に複数枚挿入されていないか、所定位置よりも飛び出していないか、などを把握した後、搬送を開始する必要がある。
よってこのような基板検出をおこなうための基板検出装置としては、例えば特許文献１などに記載されているものが知られている。特に特許文献１に開示された装置では、カセットからの基板の飛び出しを検出するために、複数回の上下運動をおこなっている。または、上下運動の回数を減らすために、複数のセンサを設けている。 In a semiconductor manufacturing apparatus, a liquid crystal manufacturing apparatus, or these inspection apparatuses, a substrate transfer apparatus is used to accurately and cleanly transfer a substrate such as a semiconductor wafer or a glass substrate to a desired position. The substrate transport device holds and transports a substrate on a hand provided on an arm or a similar mechanism. Since the substrate transport apparatus often transports a substrate from a cassette in which the substrates are stored in multiple stages, it is necessary to grasp information about how the substrate is stored in the cassette. In other words, in addition to the presence / absence of a substrate, it is necessary to start conveyance after grasping whether it is not inserted diagonally, whether a plurality of cassettes are inserted in one stage of the cassette, or protruded from a predetermined position. .
Therefore, as a substrate detection apparatus for performing such substrate detection, for example, a device described in Patent Document 1 is known. In particular, in the apparatus disclosed in Patent Document 1, the vertical movement is performed a plurality of times in order to detect the jumping out of the substrate from the cassette. Alternatively, a plurality of sensors are provided to reduce the number of up and down movements.

特開２００４−２１４４６２号公報JP 2004-214462 A

このように特許文献１など従来の基板検出装置は、カセットからの基板の飛び出しを検出するために複数回の上下運動が必要であったため、基板の検出時間を短縮することができないという問題があった。また、多数のセンサを設けると検出装置構造が複雑になる、コストが上昇するという問題があった。
本発明はこのような問題点に鑑みてなされたものであり、最小限のセンサでカセットに収納されている基板の飛び出しを早く検出することができる基板検出装置を提供することを目的とする。 As described above, the conventional substrate detection apparatus such as Patent Document 1 requires a plurality of vertical movements in order to detect the jumping-out of the substrate from the cassette, and thus has a problem that the substrate detection time cannot be shortened. It was. In addition, when a large number of sensors are provided, there is a problem that the structure of the detection apparatus becomes complicated and the cost increases.
The present invention has been made in view of such problems, and an object of the present invention is to provide a substrate detection apparatus that can quickly detect the jumping out of a substrate stored in a cassette with a minimum number of sensors.

上記問題を解決するため、本発明は、次のように構成したのである。
請求項１に記載の発明は、水平な状態で上下多段にカセット内に収容された基板を検出する基板検出装置において、センサ支持体と、光軸が水平になるよう前記センサ支持体に設置される第１のセンサと、光軸が水平よりも一定角度傾斜するよう前記センサ支持体に設置される第２のセンサと、前記センサ支持体を前記基板の周縁に対して前後及び上下させるセンサ支持体駆動手段と、を備え、前記センサ支持体駆動手段によって前記第１と第２のセンサの光軸を上下させて前記基板によって前記光軸を遮光させ、そのときの前記第１と第２のセンサの光軸が遮光された間隔によって、少なくとも、前記基板の有無と、前記基板の斜め状態と、前記基板の飛び出しと、を検出すること、を特徴とする基板検出装置とするものである。
請求項２に記載の発明は、前記第１のセンサの光軸が遮光された間隔によって、前記基板の有無と、前記基板の斜め状態と、を検出することを特徴とする請求項１記載の基板検出装置とするものである。
請求項３に記載の発明は、前記第２のセンサの光軸が遮光された間隔によって、前記基板の飛び出しを検出することを特徴とする請求項１記載の基板検出装置とするものである。
請求項４に記載の発明は、前記第１と第２のセンサは、受光器と発光器とからなる透過型光センサであることを特徴とする請求項１記載の基板検出装置とするものである。
請求項５に記載の発明は、前記第１と第２のセンサは、反射型センサであることを特徴とする請求項１記載の基板検出装置とするものである。
請求項６に記載の発明は、前記第１と第２のセンサは、前記第１のセンサの光軸と前記第２のセンサの光軸とが、水平方向にずれて前後に並ぶように前記センサ支持体に設置されることを特徴とする請求項１記載の基板検出装置とするものである。
請求項７に記載の発明は、前記基板の有無と、前記基板の斜め状態と、前記基板の飛び出しと、を検出する際、前記第１と第２のセンサが遮光される間隔が、予め記憶している閾値よりも大きいときにそれらの検出を判断することを特徴とする請求項１記載の基板検出装置とするものである。
請求項８に記載の発明は、前記第２のセンサが前記基板の飛び出しを検出し、かつ前記第１のセンサが前記基板の有無及び前記基板の斜め状態を検出したとき、前記第１のセンサの前記基板の斜め状態の検出を検出結果とすることを特徴とする請求項１記載の基板検出装置とするものである。
請求項９に記載の発明は、水平な状態で上下多段にカセット内に収容された基板を検出する基板検出装置を備え、前記基板検出装置が検出した前記基板の情報に基づいて前記基板を搬送する基板搬送装置において、前記基板検出装置が、センサ支持体と、光軸が水平になるよう前記センサ支持体に設置される第１のセンサと、光軸が水平よりも一定角度傾斜するよう前記センサ支持体に設置される第２のセンサとを備え、前記基板搬送装置が、前記センサ支持体を前記基板の周縁に対して前後及び上下させるセンサ支持体駆動手段を備え、前記センサ支持体駆動手段によって前記第１と第２のセンサの光軸を上下させて前記基板によって前記光軸を遮光させ、そのときの前記第１と第２のセンサの光軸が遮光された間隔によって、少なくとも、前記基板の有無と、前記基板の斜め状態と、前記基板の飛び出しと、を検出し、その検出結果に基づいて前記基板を搬送すること、を特徴とする基板搬送装置とするものである。
請求項１０に記載の発明は、前記基板検出装置が、前記第１のセンサの光軸が遮光された間隔によって、前記基板の有無と、前記基板の斜め状態と、を検出することを特徴とする請求項９記載の基板搬送装置とするものである。
請求項１１に記載の発明は、前記基板検出装置が、前記第２のセンサの光軸が遮光された間隔によって、前記基板の飛び出しを検出することを特徴とする請求項９記載の基板搬送装置とするものである。
請求項１２に記載の発明は、前記基板検出装置の前記第１と第２のセンサは、受光器と発光器とからなる透過型光センサであることを特徴とする請求項９記載の基板搬送装置とするものである。
請求項１３に記載の発明は、前記基板検出装置の前記第１と第２のセンサは、反射型センサであることを特徴とする請求項９記載の基板検出装置とするものである。
請求項１４に記載の発明は、前記基板検出装置の前記第１と第２のセンサは、前記第１のセンサの光軸と前記第２のセンサの光軸とが、水平方向にずれて前後に並ぶように前記センサ支持体に設置されることを特徴とする請求項９記載の基板搬送装置とするものである。
請求項１５に記載の発明は、前記基板検出装置が、前記基板の有無と、前記基板の斜め状態と、前記基板の飛び出しと、を検出する際、前記第１と第２のセンサが遮光される間隔が、予め記憶している閾値よりも大きいときにそれらの検出を判断することを特徴とする請求項９記載の基板搬送装置とするものである。
請求項１６に記載の発明は、前記基板検出装置が、前記第２のセンサが前記基板の飛び出しを検出し、かつ前記第１のセンサが前記基板の有無及び前記基板の斜め状態を検出したとき、前記第１のセンサの前記基板の斜め状態の検出を検出結果とすることを特徴とする請求項９記載の基板搬送装置とするものである。
請求項１７に記載の発明は、前記基板検出装置の前記センサ支持体が、前記基板を保持するハンドであって、前記ハンドの先端に前記第１と第２のセンサが設置されることを特徴とする請求項９記載の基板搬送装置とするものである。
請求項１８に記載の発明は、前記センサ支持体駆動手段が、水平多関節のアームであることを特徴とする請求項１７記載の基板搬送装置とするものである。
請求項１９に記載の発明は、前記基板検出装置が、少なくとも、前記基板の有無と、前記基板の斜め状態と、前記基板の飛び出しと、を検出したとき、アラームを出力して停止することを特徴とする請求項９記載の基板搬送装置とするものである。
請求項２０に記載の発明は、前記基板検出装置が、少なくとも、前記基板の有無と、前記基板の斜め状態と、前記基板の飛び出しと、を検出したとき、その検出結果から、前記基板の搬送に支障が無いことを判断すると、前記基板の搬送を開始することを特徴とする請求項９記載の基板搬送装置とするものである。
請求項２１に記載の発明は、請求項９記載の基板搬送装置を備えたことを特徴とする半導体製造装置とするものである。
請求項２２に記載の発明は、請求項９記載の基板搬送装置を備えたことを特徴とする液晶製造装置とするものである。
請求項２３に記載の発明は、請求項９記載の基板搬送装置を備えたことを特徴とする検査装置とするものである。
請求項２４に記載の発明は、センサ支持体と、光軸が水平になるよう前記センサ支持体に設置される第１のセンサと、光軸が水平よりも一定角度傾斜するよう前記センサ支持体に設置される第２のセンサと、前記センサ支持体を前記基板の周縁に対して前後及び上下させるセンサ支持体駆動手段と、を備えた基板検出装置において、水平な状態で上下多段にカセット内に収容された基板を検出する方法であって、前記センサ支持体駆動手段によって前記第１と第２のセンサの光軸を前記基板の周縁に近づけるステップと、前記センサ支持体駆動手段によって前記第１と第２のセンサの光軸を上方又は下方に垂直に移動させるステップと、前記移動させるステップを行ないながら、前記第１と第２のセンサの光軸が遮光された間隔を検出するステップと、前記第１のセンサの光軸が遮光された間隔によって、前記基板の有無と、前記基板の斜め状態と、を検出するステップと、前記第２のセンサの光軸が遮光された間隔によって、前記基板の飛び出しを検出するステップと、を備えたことを特徴とする基板検出方法とするものである。 In order to solve the above problem, the present invention is configured as follows.
The invention described in claim 1 is a substrate detection apparatus for detecting substrates accommodated in a cassette in a vertical state in a horizontal state, and is installed on the sensor support so that the optical axis is horizontal. A first sensor, a second sensor installed on the sensor support so that the optical axis is inclined at a certain angle from the horizontal, and a sensor support that moves the sensor support back and forth and up and down with respect to the periphery of the substrate. Body driving means, the optical axis of the first and second sensors is moved up and down by the sensor support driving means, and the optical axis is shielded by the substrate, and the first and second at that time According to the present invention, there is provided a substrate detection device that detects at least the presence / absence of the substrate, the oblique state of the substrate, and the protrusion of the substrate by an interval at which the optical axis of the sensor is shielded.
According to a second aspect of the present invention, the presence / absence of the substrate and the oblique state of the substrate are detected based on an interval at which the optical axis of the first sensor is shielded. A substrate detection apparatus is provided.
According to a third aspect of the present invention, there is provided the substrate detection apparatus according to the first aspect, wherein the protrusion of the substrate is detected by an interval at which the optical axis of the second sensor is shielded.
According to a fourth aspect of the present invention, there is provided the substrate detecting apparatus according to the first aspect, wherein the first and second sensors are transmissive optical sensors each including a light receiver and a light emitter. is there.
According to a fifth aspect of the present invention, in the substrate detection apparatus according to the first aspect, the first and second sensors are reflective sensors.
According to a sixth aspect of the present invention, in the first and second sensors, the optical axis of the first sensor and the optical axis of the second sensor are shifted in the horizontal direction and aligned in the front-rear direction. The substrate detection device according to claim 1, wherein the substrate detection device is installed on a sensor support.
According to a seventh aspect of the present invention, when the presence / absence of the substrate, the oblique state of the substrate, and the protrusion of the substrate are detected, an interval at which the first and second sensors are shielded from light is stored in advance. The substrate detection apparatus according to claim 1, wherein the detection is determined when the threshold value is larger than a threshold value.
According to an eighth aspect of the present invention, when the second sensor detects the protrusion of the substrate, and the first sensor detects the presence or absence of the substrate and the oblique state of the substrate, the first sensor The substrate detection apparatus according to claim 1, wherein detection of the oblique state of the substrate is a detection result.
The invention according to claim 9 is provided with a substrate detection device for detecting the substrates accommodated in the cassette in the upper and lower stages in a horizontal state, and transports the substrate based on the information on the substrate detected by the substrate detection device. In the substrate transfer device, the substrate detection device includes a sensor support, a first sensor installed on the sensor support so that the optical axis is horizontal, and the optical axis is inclined at a certain angle from the horizontal. A second sensor installed on the sensor support, and the substrate transport device includes sensor support driving means for moving the sensor support back and forth and up and down with respect to a peripheral edge of the substrate, and driving the sensor support The optical axes of the first and second sensors are moved up and down by means to block the optical axis by the substrate, and at least the interval between the optical axes of the first and second sensors being blocked is at least And the presence or absence of the substrate, an oblique state of the substrate, the protrusion of the substrate to detect, that transports the substrate on the basis of the detection result, is to the substrate transfer apparatus according to claim.
The invention according to claim 10 is characterized in that the substrate detection device detects presence / absence of the substrate and an oblique state of the substrate based on an interval at which an optical axis of the first sensor is shielded. The substrate transfer device according to claim 9 is provided.
According to an eleventh aspect of the present invention, the substrate detection device detects the jumping-out of the substrate by an interval at which the optical axis of the second sensor is shielded. It is what.
The invention according to claim 12 is the substrate transport according to claim 9, wherein the first and second sensors of the substrate detection device are transmissive optical sensors each including a light receiver and a light emitter. It is a device.
The invention described in claim 13 is the substrate detection apparatus according to claim 9, wherein the first and second sensors of the substrate detection apparatus are reflection type sensors.
According to a fourteenth aspect of the present invention, in the first and second sensors of the substrate detection device, the optical axis of the first sensor and the optical axis of the second sensor are shifted in the horizontal direction. The substrate transfer apparatus according to claim 9, wherein the substrate transfer apparatus is installed on the sensor support so as to line up with each other.
According to a fifteenth aspect of the present invention, the first and second sensors are shielded from light when the substrate detection device detects the presence or absence of the substrate, the oblique state of the substrate, and the protrusion of the substrate. 10. The substrate transfer apparatus according to claim 9, wherein the detection of the detection is judged when the interval is larger than a threshold value stored in advance.
In the invention described in claim 16, when the substrate detection device detects the jumping out of the substrate, and the first sensor detects the presence or absence of the substrate and the oblique state of the substrate. The substrate transport apparatus according to claim 9, wherein the detection result is detection of the oblique state of the substrate of the first sensor.
The invention according to claim 17 is characterized in that the sensor support of the substrate detection apparatus is a hand that holds the substrate, and the first and second sensors are installed at the tip of the hand. The substrate transfer apparatus according to claim 9.
The invention according to claim 18 is the substrate transfer apparatus according to claim 17, wherein the sensor support driving means is a horizontal articulated arm.
The invention according to claim 19 outputs an alarm and stops when the substrate detection device detects at least the presence / absence of the substrate, the oblique state of the substrate, and the protrusion of the substrate. The substrate transfer device according to claim 9 is characterized.
In the invention according to claim 20, when the substrate detection device detects at least the presence / absence of the substrate, the oblique state of the substrate, and the protrusion of the substrate, the substrate is transferred from the detection result. 10. The substrate transfer apparatus according to claim 9, wherein the substrate transfer is started when it is determined that there is no hindrance to the substrate.
According to a twenty-first aspect of the present invention, there is provided a semiconductor manufacturing apparatus including the substrate transfer apparatus according to the ninth aspect.
According to a twenty-second aspect of the present invention, there is provided a liquid crystal manufacturing apparatus including the substrate transfer apparatus according to the ninth aspect.
According to a twenty-third aspect of the present invention, there is provided an inspection apparatus including the substrate transfer apparatus according to the ninth aspect.
The invention according to claim 24 is the sensor support, the first sensor installed on the sensor support so that the optical axis is horizontal, and the sensor support so that the optical axis is inclined at a certain angle from the horizontal. In a substrate detection apparatus comprising: a second sensor installed on the substrate; and a sensor support driving means for moving the sensor support back and forth and up and down with respect to the peripheral edge of the substrate. Detecting the substrate accommodated in the substrate, wherein the sensor support driving means brings the optical axes of the first and second sensors closer to the periphery of the substrate; and the sensor support driving means The step of vertically moving the optical axes of the first and second sensors upward and downward, and the step of detecting the interval at which the optical axes of the first and second sensors are shielded while performing the moving step. And detecting the presence / absence of the substrate and the oblique state of the substrate by the interval at which the optical axis of the first sensor is shielded, and the optical axis of the second sensor is shielded And a step of detecting the jumping-out of the substrate according to the interval.

本発明は、従来のように、カセットからの基板の飛び出しを検出するためにセンサの複数回の上下運動を必要とせず、少なくとも基板の有無と、基板の斜め状態と、基板の飛び出しを同時に検出して、基板の検出時間を短縮することができる。
また、基板の飛び出しを検出する時間を短くするためには、より多数のセンサを設ける必要があったが、本発明は、必要最小限の数のセンサにするとともに、それに伴い検出装置の構造を簡単にしてコストを下げることができる。 The present invention does not require a plurality of vertical movements of the sensor to detect the jumping out of the substrate from the cassette as in the prior art, and simultaneously detects at least the presence or absence of the substrate, the oblique state of the substrate, and the jumping out of the substrate. Thus, the substrate detection time can be shortened.
Further, in order to shorten the time for detecting the jumping out of the substrate, it is necessary to provide a larger number of sensors. However, the present invention reduces the number of sensors to the minimum and accordingly the structure of the detection device. It can be simplified and the cost can be reduced.

本発明の基板検出装置が適用される基板搬送装置の側面図Side view of substrate transport apparatus to which substrate detection apparatus of the present invention is applied 本発明の基板検出装置が適用される基板搬送装置の平面図The top view of the board | substrate conveyance apparatus with which the board | substrate detection apparatus of this invention is applied 本発明の基板検出装置の正面図Front view of substrate detection apparatus of the present invention 遮光型光センサ９ａ、９ｂがビームＨを照射しながら上昇する際に、受光器が発する受光信号ＳＬの波形を示す説明図Explanatory drawing which shows the waveform of the light reception signal SL which a light receiver emits when the light-shielding type optical sensors 9a and 9b rise while irradiating the beam H 遮光型光センサ９ｃ、９ｄがビームＳを照射しながら上昇する際に、受光器が発する受光信号ＳＬの波形を示す説明図Explanatory drawing which shows the waveform of the light reception signal SL which a light receiver emits when the light-shielding type optical sensors 9c and 9d rise while irradiating the beam S.

以下、本発明の実施の形態について図を参照して説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１は、本発明の基板検出装置が適用される基板搬送装置の側面図、図２は、本発明の基板検出装置が適用される基板搬送装置の平面図である。図において１はベース、２は基板搬送装置で、上記ベース１上に設置されている。基板搬送装置２は、次のように構成されている。すなわち、ベース１上に固定ベース３が固定され、この固定ベース３に、旋回および上下動可能な搬送装置本体４が取り付けられている。また、搬送装置本体４の上面に、搬送用アーム５が旋回可能に取り付けられている。搬送用アーム５は、基板検出装置６を回転可能に支持する第２アーム５ａと、この第２アーム５ａを回転可能に支持する第１アーム５ｂとからなっている。基板検出用装置６は、カセット８からの基板搬出、カセット８への基板搬入の基板搬送にも使用されるよう、基板Ｗを保持可能にハンド型に形成されている。なお、基板検出装置６と、基板搬送用のハンドを別々に設けることも可能である。７はベース１上に載置されたカセット台で、その上面に、内部に基板Ｗを収納するカセット８を載置している。   FIG. 1 is a side view of a substrate transfer apparatus to which the substrate detection apparatus of the present invention is applied, and FIG. 2 is a plan view of the substrate transfer apparatus to which the substrate detection apparatus of the present invention is applied. In the figure, reference numeral 1 denotes a base, and 2 denotes a substrate transfer device, which is installed on the base 1. The substrate transfer device 2 is configured as follows. That is, a fixed base 3 is fixed on the base 1, and a transport device main body 4 that can turn and move up and down is attached to the fixed base 3. A transfer arm 5 is turnably attached to the upper surface of the transfer device body 4. The transfer arm 5 includes a second arm 5a that rotatably supports the substrate detection device 6 and a first arm 5b that rotatably supports the second arm 5a. The substrate detection device 6 is formed in a hand shape so as to be able to hold the substrate W so as to be used for carrying out the substrate from the cassette 8 and carrying the substrate into the cassette 8. In addition, it is also possible to provide the board | substrate detection apparatus 6 and the hand for board | substrate conveyance separately. Reference numeral 7 denotes a cassette table placed on the base 1, and a cassette 8 for accommodating the substrate W therein is placed on the upper surface thereof.

次に、本発明の要点である基板検出装置６について、詳細に説明する。図２に概略を示すとおり、基板検出装置６は、水平方向に互いに離間した左右一対のセンサ支持体６ａ、６ｂと、センサ支持体６ａ、６ｂにそれぞれが設置され、水平方向に一定の距離を置いて取り付けられた、二組の透過型光センサ９を備えている。前記二組の透過型光センサ９のうち一組（第１の透過型光センサ９ａ、９ｂ）は、センサ支持体６の先端側に取り付けられ、基板有無および基板姿勢検出に使用する。また、もう一組（第２の透過型光センサ９ｃ、９ｄ）は、センサ支持体６の後端側に取り付けられ、基板飛び出し検出に使用する。   Next, the board | substrate detection apparatus 6 which is the principal point of this invention is demonstrated in detail. As schematically shown in FIG. 2, the substrate detection device 6 is installed on a pair of left and right sensor supports 6a and 6b and sensor supports 6a and 6b that are spaced apart from each other in the horizontal direction, and has a certain distance in the horizontal direction. Two sets of transmissive optical sensors 9 are installed. Of the two sets of transmissive photosensors 9, one set (first transmissive photosensors 9a and 9b) is attached to the distal end side of the sensor support 6 and is used for detecting the presence / absence of the substrate and the substrate attitude. Another set (second transmission type optical sensors 9c and 9d) is attached to the rear end side of the sensor support 6 and is used for detecting the jumping out of the substrate.

センサ支持体の先端側に取り付けられた第１の透過型光センサ９ａ，９ｂは、左右のセンサ支持体６ａ、６ｂのうちの一方に取り付けられた発光器９ａ、および他方に取り付けられた受光器９ｂの組み合わせによって構成される。図３は、基板検出装置６の正面図である。図３（Ａ）に示すとおり、発光器９ａおよび受光器９ｂは、互いに光軸を合わせて、センサ支持体６の裏面に、水平に取り付けられている。発光器９ａから受光器９ｂに向けて水平ビームＨを照射し、その際の受光器９ｂの受光信号により、ビームＨの進路途中にある基板Ｗの有無および姿勢を検出する。 The first transmissive optical sensors 9a and 9b attached to the front end side of the sensor support are a light emitter 9a attached to one of the left and right sensor supports 6a and 6b, and a light receiver attached to the other. It is comprised by the combination of 9b. FIG. 3 is a front view of the substrate detection device 6. As shown in FIG. 3A, the light emitter 9a and the light receiver 9b are horizontally attached to the back surface of the sensor support 6 with their optical axes aligned with each other. The horizontal beam H is emitted from the light emitter 9a toward the light receiver 9b, and the presence and posture of the substrate W in the course of the beam H are detected by the light reception signal of the light receiver 9b at that time.

また、第２の透過型光センサ９ｃ，９ｄは、左右のセンサ支持体６ａ、６ｂのうちの一方に取り付けられた発光器９ｃ、および他方に取り付けられた受光器９ｄの組み合わせによって構成される。図３（Ｂ）に示すとおり、発光器９ｃは、センサ支持体６の表面付近、受光器９ｄは、センサ支持体６の裏面に取り付けられている。また、発光器９ｃと受光器９ｄは、互いに光軸を合わせて、水平から一定角度傾けて取り付けられている。発光器９ｃから受光器９ｄに向けて傾斜ビームＳを照射し、その際の受光器９ｄの受光信号により、ビームＳの進路途中にある基板Ｗの飛び出しを検出する。
なお、本実施例では、基板検出に透過型光センサを使用したが、反射型光センサを使用してもよい。 The second transmissive optical sensors 9c and 9d are configured by a combination of a light emitter 9c attached to one of the left and right sensor supports 6a and 6b and a light receiver 9d attached to the other. As shown in FIG. 3B, the light emitter 9 c is attached to the vicinity of the front surface of the sensor support 6, and the light receiver 9 d is attached to the back surface of the sensor support 6. Further, the light emitter 9c and the light receiver 9d are mounted so as to be inclined at a certain angle from the horizontal with their optical axes aligned. The inclined beam S is irradiated from the light emitter 9c toward the light receiver 9d, and the jumping of the substrate W in the course of the beam S is detected by the light reception signal of the light receiver 9d at that time.
In this embodiment, the transmission type optical sensor is used for substrate detection, but a reflection type optical sensor may be used.

図１に概略を示すように、カセット８の内部には、カセット８の内側壁に形成された溝（図示略）に挿入されることで、多数の基板Ｗが各々水平姿勢で上下方向に多段に整列させられた状態で収納保持されている。基板搬送装置２は、カセット８の前面のカセット基板出入り口８ａからこのカセット８の内部に、基板検出装置６の左右のセンサ支持体６ａ、６ｂの先端を挿入させることで、透過型光センサ９の発光器９ａ、９ｃと、受光器９ｂ、９ｄを基板Ｗの端の左右両側に位置決めする。そして、搬送装置本体４を上下方向に移動させることによって基板検出装置６を上下方向に移動させ、ビームＨ、ビームＳの位置を一定間隔で上下方向の走査をおこない、ビームＨ、ビームＳの上下方向の各位置における受光信号を取得する。
本実施例の場合、基板搬送装置２のコントローラでもある制御演算装置１０により、取得したデータと、基板Ｗの有無、姿勢と飛び出しを判定するための閾値を比較することにより、カセット８内の各段における基板Ｗの有無、姿勢と飛び出しを判定する。 As schematically shown in FIG. 1, a large number of substrates W are vertically arranged in a horizontal posture in the cassette 8 by being inserted into grooves (not shown) formed in the inner wall of the cassette 8. It is stored and held in an aligned state. The substrate transfer device 2 inserts the front ends of the left and right sensor supports 6a and 6b of the substrate detection device 6 into the cassette 8 from the cassette substrate entrance 8a on the front surface of the cassette 8, thereby The light emitters 9a and 9c and the light receivers 9b and 9d are positioned on both the left and right sides of the end of the substrate W. Then, the substrate detection device 6 is moved in the vertical direction by moving the transfer device body 4 in the vertical direction, the positions of the beams H and S are scanned in the vertical direction at regular intervals, and the beams H and S are moved up and down. A light reception signal at each position in the direction is acquired.
In the case of the present embodiment, the control arithmetic unit 10 which is also a controller of the substrate transport apparatus 2 compares the acquired data with the threshold values for determining the presence / absence, posture and pop-out of the substrate W, thereby The presence / absence, posture, and pop-out of the substrate W in the stage are determined.

次に、基板Ｗの有無および姿勢検出方法について詳細に説明する。図４は、第１の遮光型光センサ９ａ、９ｂがビームＨを照射しながら上昇する際に、受光器が発する受光信号ＳＬの波形を示す説明図である。すなわち、図４（Ｂ）は、カセット８の構造を模式的に示しており、図４（Ａ）は、これに対応する受光信号ＳＬの波形を示している。図４（Ｂ）に示すように、この実施例ではカセット８内に基板Ｗが２５枚格納できるものと仮定しており、その一部に基板Ｗが実際に収納されているものとしている。受光器が受光状態と判断した場合は、受光信号ＳＬは０レベル（Ｌレベル）を示し、非受光状態（遮光状態）にある時には受信信号ＬＳは１レベル（Ｈレベル）を示す。図４（Ｂ）に示すように、水平に収納されている基板Ｗに対しては、受光信号ＳＬが１レベル（Ｈレベル）である時間が基板Ｗの厚みにほぼ相当している。一方、傾いて収納されている基板Ｗに対しては、受光信号ＳＬが１レベル（Ｈレベル）である時間は、基板Ｗを水平方向の光で投影した時の厚みに相当するので、基板Ｗの厚みよりもかなり広い。そこで、この実施例では、制御演算装置１０により、受光信号ＳＬが１レベル（Ｈレベル）の時間と、基板Ｗの有無と姿勢を判断するための閾値を比較することにより、基板Ｗの有無および姿勢（斜め挿入）を検出する。   Next, the presence / absence of the substrate W and the attitude detection method will be described in detail. FIG. 4 is an explanatory diagram showing the waveform of the light reception signal SL generated by the light receiver when the first light-shielding optical sensors 9a and 9b rise while irradiating the beam H. That is, FIG. 4B schematically shows the structure of the cassette 8, and FIG. 4A shows the waveform of the light reception signal SL corresponding thereto. As shown in FIG. 4B, in this embodiment, it is assumed that 25 substrates W can be stored in the cassette 8, and the substrate W is actually stored in a part thereof. When the light receiver determines that it is in the light receiving state, the light receiving signal SL indicates 0 level (L level), and when it is in the non-light receiving state (light shielding state), the reception signal LS indicates 1 level (H level). As shown in FIG. 4B, for the substrate W accommodated horizontally, the time during which the light reception signal SL is 1 level (H level) substantially corresponds to the thickness of the substrate W. On the other hand, for the substrate W stored in an inclined state, the time during which the light reception signal SL is 1 level (H level) corresponds to the thickness when the substrate W is projected with light in the horizontal direction. It is considerably wider than the thickness. Therefore, in this embodiment, the control arithmetic device 10 compares the time when the light reception signal SL is 1 level (H level) with the threshold value for determining the presence / absence and the posture of the substrate W, and Detect posture (oblique insertion).

次に、基板Ｗの飛び出し検出方法について詳細に説明する。図５は、第２の遮光型光センサ９ｃ、９ｄがビームＳを照射しながら上昇する際に、受光器が発する受光信号ＳＬの波形を示す説明図である。すなわち、図５（Ｂ）は、カセット８の構造を模式的に示しており、図５（Ａ）は、これに対応する受光信号ＳＬの波形を示している。また、図５（Ｃ）は、カセット８の平面図である。図５（Ｂ）に示すように、この実施例ではカセット８内に基板Ｗが２５枚格納できるものと仮定しており、その一部に基板Ｗが実際に傾斜なく収納されているものとしている。図５（Ｂ）に示す基板Ｗは、図２のビームＳの光軸によって切断された断面図である。すなわち、図５（Ｃ）に示すように、カセット８の１段目に収納された基板Ｗのほうが、カセット８の２５段目に収納された基板Ｗより、前方に飛び出していることを意味する。また、この実施例では、カセット８の２５段目に収納されている基板は、前方に飛び出すことなく、正確に収納されているものとする。図５（Ｂ）に示すように、受光器が受光状態と判断した場合は、受光信号ＳＬは０レベル（Ｌレベル）を示し、非受光状態（遮光状態）にある時には受信信号ＬＳは１レベル（Ｈレベル）を示す。発光器９ｃ、受光器９ｄは、互いに光軸を合わせて、水平から一定角度傾けて取り付けられており、ビームＳの光軸が、水平より一定角度傾いているため、受光信号ＳＬが１レベル（Ｈレベル）である時間は、基板Ｗの切断面の長さに比例する。そのため、受光信号ＳＬが１レベル（Ｈレベル）である時間は、正確に収納されている基板Ｗより、前方に飛び出している基板Ｗのほうが長くなる。そこで、この実施例では、制御演算装置１０により、受光信号ＳＬが１レベル（Ｈレベル）の時間と、基板Ｗの飛び出しを判断するための閾値を比較することにより、基板Ｗの飛び出しを検出する。
また、カセット８に対して基板Ｗが飛び出し、かつ傾いて収納されている場合は、受光信号ＳＬが１レベル（Ｈレベル）である時間が、基板Ｗの切断面の長さに比例しないが、この場合は、前記のように第１の透過型光センサによって検出された基板Ｗの有無および姿勢検出により、基板Ｗの傾きが検出されており、それを検出結果とする。 Next, a method for detecting the jumping out of the substrate W will be described in detail. FIG. 5 is an explanatory diagram showing the waveform of the light reception signal SL generated by the light receiver when the second light-shielding optical sensors 9c and 9d rise while irradiating the beam S. FIG. That is, FIG. 5 (B) schematically shows the structure of the cassette 8, and FIG. 5 (A) shows the waveform of the light reception signal SL corresponding thereto. FIG. 5C is a plan view of the cassette 8. As shown in FIG. 5B, in this embodiment, it is assumed that 25 substrates W can be stored in the cassette 8, and the substrate W is actually stored in a part thereof without inclination. . The substrate W shown in FIG. 5B is a cross-sectional view taken along the optical axis of the beam S in FIG. That is, as shown in FIG. 5C, it means that the substrate W stored in the first stage of the cassette 8 protrudes forward from the substrate W stored in the 25th stage of the cassette 8. . In this embodiment, it is assumed that the substrate stored in the 25th stage of the cassette 8 is accurately stored without jumping forward. As shown in FIG. 5B, when the light receiver is determined to be in the light receiving state, the light receiving signal SL indicates 0 level (L level), and when it is in the non-light receiving state (light shielding state), the reception signal LS is 1 level. (H level). The light emitter 9c and the light receiver 9d are mounted with their optical axes aligned with each other and inclined at a certain angle from the horizontal, and the optical axis of the beam S is inclined at a certain angle from the horizontal, so that the light reception signal SL is at one level ( (H level) is proportional to the length of the cut surface of the substrate W. For this reason, the time during which the light reception signal SL is 1 level (H level) is longer for the substrate W protruding forward than for the substrate W stored accurately. Therefore, in this embodiment, the control arithmetic unit 10 detects the protrusion of the substrate W by comparing the time during which the light reception signal SL is 1 level (H level) with the threshold value for determining the protrusion of the substrate W. .
In addition, when the substrate W protrudes from the cassette 8 and is stored at an angle, the time during which the light reception signal SL is 1 level (H level) is not proportional to the length of the cut surface of the substrate W. In this case, as described above, the inclination of the substrate W is detected by the presence / absence detection and the posture detection of the substrate W detected by the first transmission optical sensor, and this is used as the detection result.

次に、基板検出装置２による、基板Ｗの有無、姿勢および飛び出しの検出の一連の動作について説明する。まず、基板搬送装置２は、カセット８の前面のカセット基板出入り口８ａから、基板検出装置６の左右のセンサ支持体６ａ、６ｂの先端を、カセット８の最下段の基板Ｗ収納位置の更に下側に挿入させる。次に、左右のセンサ支持体６ａ、６ｂの先端（厳密にはビームＨおよびビームＳの照射位置）を、カセット８内に多段に整列された基板Ｗの左右両側における前後方向の基準位置（基板Ｗの有無、姿勢および飛び出し検出位置）に位置決めする。そして、その位置で、水平にビームＨを、水平より一定角度傾斜してビームＳを、それぞれ照射しながら、センサ支持体６ａ、６ｂを上方に移動させることにより、ビームＨ、ビームＳを上方に走査させながら、ビームＨ、ビームＳの上下方向の各位置における受光信号を取得する。最後に、走査が終了したら、取得したデータに基づいてカセット８内の各段における基板Ｗの有無、姿勢および飛び出しの検出をおこなう。
この場合、前記のように、第２の透過型光センサによる受光信号ＳＬが１レベル（Ｈレベル）である時間を基に基板Ｗの飛び出し検出をおこなっているため、基板Ｗの飛び出し検出のために、センサ支持体６ａ、６ｂを複数回、上方へ移動させる必要はなく、迅速に検出をおこなうことが可能である。そして飛び出し検出と同時に基板の有無、姿勢を検出する。検出動作をおこなった後、カセット８内の基板Ｗの収納状態に異常がなければ、あるいは異常があっても基板搬送装置２の基板搬送に問題が無いときは、基板搬送装置２は、基板Ｗの搬送を開始する。基板Ｗの収納状態に異常があり、基板搬送装置２の基板搬送に問題があるときは、アラームを出して異常を知らせる。この場合、作業者が異常な状態を修復した後、基板搬送装置２は、基板Ｗの搬送を開始する。
Next, a series of operations for detecting the presence / absence, posture, and pop-out of the substrate W by the substrate detection apparatus 2 will be described. First, the substrate transfer device 2 is arranged so that the front ends of the left and right sensor supports 6a and 6b of the substrate detection device 6 are further below the lowermost substrate W storage position of the cassette 8 from the cassette substrate entrance 8a on the front surface of the cassette 8. To insert. Next, the front and rear reference positions (substrates) on the left and right sides of the substrates W aligned in multiple stages in the cassette 8 are arranged at the tips of the left and right sensor supports 6a and 6b (strictly speaking, the irradiation positions of the beams H and S). (W presence / absence, posture, and pop-out detection position). At that position, the sensor supports 6a and 6b are moved upward while irradiating the beam H horizontally and at a certain angle with respect to the horizontal beam S, thereby moving the beams H and S upward. While scanning, a light reception signal at each position in the vertical direction of the beams H and S is acquired. Finally, when scanning is completed, the presence / absence, posture, and pop-out of the substrate W at each stage in the cassette 8 are detected based on the acquired data.
In this case, as described above, the detection of jumping out of the substrate W is performed based on the time during which the light reception signal SL by the second transmission type optical sensor is 1 level (H level). In addition, it is not necessary to move the sensor supports 6a and 6b upward a plurality of times, and it is possible to detect quickly. The presence / absence of the substrate and the posture are detected simultaneously with the pop-up detection. After performing the detection operation, if there is no abnormality in the storage state of the substrate W in the cassette 8 or if there is no problem in the substrate conveyance of the substrate conveyance device 2 even if there is an abnormality, the substrate conveyance device 2 Start transporting. When there is an abnormality in the storage state of the substrate W and there is a problem with the substrate transfer of the substrate transfer device 2, an alarm is issued to notify the abnormality. In this case, the substrate transport apparatus 2 starts transporting the substrate W after the operator repairs the abnormal state.

１ ベース
２ 基板搬送装置
３ 固定ベース
４ 搬送装置本体
５ 搬送用アーム
５ａ 第２アーム
５ｂ 第１アーム
６ 基板検出装置
６ａ， ６ｂ センサ支持体
７ カセット台
８ カセット
８ａ カセット基板出入り口
９ 遮光型光センサ
９ａ， ９ｃ 発光器
９ｂ， ９ｄ 受光器
１０ 制御演算装置 DESCRIPTION OF SYMBOLS 1 Base 2 Substrate transfer apparatus 3 Fixed base 4 Transfer apparatus main body 5 Transfer arm 5a Second arm 5b First arm 6 Substrate detection apparatus 6a, 6b Sensor support 7 Cassette stand 8 Cassette 8a Cassette substrate entrance / exit 9 Light-shielding type optical sensor 9a , 9c Light emitter 9b, 9d Light receiver 10 Control arithmetic unit

Claims (24)

水平な状態で上下多段にカセット内に収容された基板を検出する基板検出装置において、
センサ支持体と、
光軸が水平になるよう前記センサ支持体に設置される第１のセンサと、
光軸が水平よりも一定角度傾斜するよう前記センサ支持体に設置される第２のセンサと、
前記センサ支持体を前記基板の周縁に対して前後及び上下させるセンサ支持体駆動手段と、を備え、
前記センサ支持体駆動手段によって前記第１と第２のセンサの光軸を上下させて前記基板によって前記光軸を遮光させ、そのときの前記第１と第２のセンサの光軸が遮光された間隔によって、少なくとも、前記基板の有無と、前記基板の斜め状態と、前記基板の飛び出しと、を検出すること、を特徴とする基板検出装置。 In the substrate detection apparatus for detecting the substrates accommodated in the cassette in the upper and lower stages in a horizontal state,
A sensor support;
A first sensor installed on the sensor support so that the optical axis is horizontal;
A second sensor installed on the sensor support so that the optical axis is inclined at a certain angle from the horizontal;
Sensor support driving means for moving the sensor support back and forth and up and down with respect to the peripheral edge of the substrate,
The optical axes of the first and second sensors are shielded by the substrate by moving the optical axes of the first and second sensors up and down by the sensor support driving means, and the optical axes of the first and second sensors at that time are shielded from light. An apparatus for detecting a substrate, comprising: detecting at least the presence / absence of the substrate, the oblique state of the substrate, and the protrusion of the substrate based on the interval. 前記第１のセンサの光軸が遮光された間隔によって、前記基板の有無と、前記基板の斜め状態と、を検出することを特徴とする請求項１記載の基板検出装置。   The substrate detection apparatus according to claim 1, wherein presence / absence of the substrate and an oblique state of the substrate are detected based on an interval at which an optical axis of the first sensor is shielded. 前記第２のセンサの光軸が遮光された間隔によって、前記基板の飛び出しを検出することを特徴とする請求項１記載の基板検出装置。   The substrate detection apparatus according to claim 1, wherein the protrusion of the substrate is detected based on an interval at which the optical axis of the second sensor is shielded. 前記第１と第２のセンサは、受光器と発光器とからなる透過型光センサであることを特徴とする請求項１記載の基板検出装置。   The substrate detection apparatus according to claim 1, wherein the first and second sensors are transmissive optical sensors each including a light receiver and a light emitter. 前記第１と第２のセンサは、反射型センサであることを特徴とする請求項１記載の基板検出装置。   The substrate detection apparatus according to claim 1, wherein the first and second sensors are reflective sensors. 前記第１と第２のセンサは、前記第１のセンサの光軸と前記第２のセンサの光軸とが、水平方向にずれて前後に並ぶように前記センサ支持体に設置されることを特徴とする請求項１記載の基板検出装置。   The first and second sensors are installed on the sensor support so that the optical axis of the first sensor and the optical axis of the second sensor are shifted in the horizontal direction and lined up forward and backward. The board | substrate detection apparatus of Claim 1 characterized by the above-mentioned. 前記基板の有無と、前記基板の斜め状態と、前記基板の飛び出しと、を検出する際、前記第１と第２のセンサが遮光される間隔が、予め記憶している閾値よりも大きいときにそれらの検出を判断することを特徴とする請求項１記載の基板検出装置。   When detecting the presence / absence of the substrate, the slanted state of the substrate, and the protruding of the substrate, the interval at which the first and second sensors are shielded from light is greater than a threshold value stored in advance. The substrate detection apparatus according to claim 1, wherein the detection is determined. 前記第２のセンサが前記基板の飛び出しを検出し、かつ前記第１のセンサが前記基板の有無及び前記基板の斜め状態を検出したとき、前記第１のセンサの前記基板の斜め状態の検出を検出結果とすることを特徴とする請求項１記載の基板検出装置。   When the second sensor detects the jumping out of the substrate and the first sensor detects the presence of the substrate and the oblique state of the substrate, the first sensor detects the oblique state of the substrate. The substrate detection apparatus according to claim 1, wherein the detection result is a detection result. 水平な状態で上下多段にカセット内に収容された基板を検出する基板検出装置を備え、前記基板検出装置が検出した前記基板の情報に基づいて前記基板を搬送する基板搬送装置において、
前記基板検出装置が、
センサ支持体と、
光軸が水平になるよう前記センサ支持体に設置される第１のセンサと、
光軸が水平よりも一定角度傾斜するよう前記センサ支持体に設置される第２のセンサとを備え、
前記基板搬送装置が、前記センサ支持体を前記基板の周縁に対して前後及び上下させるセンサ支持体駆動手段を備え、
前記センサ支持体駆動手段によって前記第１と第２のセンサの光軸を上下させて前記基板によって前記光軸を遮光させ、そのときの前記第１と第２のセンサの光軸が遮光された間隔によって、少なくとも、前記基板の有無と、前記基板の斜め状態と、前記基板の飛び出しと、を検出し、その検出結果に基づいて前記基板を搬送すること、を特徴とする基板搬送装置。 In a substrate transport apparatus that includes a substrate detection device that detects substrates accommodated in a cassette in a horizontal state in a horizontal state, and that transports the substrate based on information on the substrate detected by the substrate detection device,
The substrate detection apparatus is
A sensor support;
A first sensor installed on the sensor support so that the optical axis is horizontal;
A second sensor installed on the sensor support so that the optical axis is inclined at a certain angle from the horizontal,
The substrate transport apparatus includes sensor support driving means for moving the sensor support back and forth and up and down with respect to the periphery of the substrate,
The optical axes of the first and second sensors are shielded by the substrate by moving the optical axes of the first and second sensors up and down by the sensor support driving means, and the optical axes of the first and second sensors at that time are shielded from light. A substrate transport apparatus characterized by detecting at least the presence / absence of the substrate, the slanted state of the substrate, and the protrusion of the substrate according to the interval, and transporting the substrate based on the detection result. 前記基板検出装置が、前記第１のセンサの光軸が遮光された間隔によって、前記基板の有無と、前記基板の斜め状態と、を検出することを特徴とする請求項９記載の基板搬送装置。   10. The substrate transfer device according to claim 9, wherein the substrate detection device detects the presence / absence of the substrate and the oblique state of the substrate based on an interval at which the optical axis of the first sensor is shielded. . 前記基板検出装置が、前記第２のセンサの光軸が遮光された間隔によって、前記基板の飛び出しを検出することを特徴とする請求項９記載の基板搬送装置。   The substrate transfer device according to claim 9, wherein the substrate detection device detects popping out of the substrate by an interval at which an optical axis of the second sensor is shielded. 前記基板検出装置の前記第１と第２のセンサは、受光器と発光器とからなる透過型光センサであることを特徴とする請求項９記載の基板搬送装置。   10. The substrate transfer apparatus according to claim 9, wherein the first and second sensors of the substrate detection device are transmissive optical sensors each including a light receiver and a light emitter. 前記基板検出装置の前記第１と第２のセンサは、反射型センサであることを特徴とする請求項９記載の基板検出装置。   The substrate detection apparatus according to claim 9, wherein the first and second sensors of the substrate detection apparatus are reflective sensors. 前記基板検出装置の前記第１と第２のセンサは、前記第１のセンサの光軸と前記第２のセンサの光軸とが、水平方向にずれて前後に並ぶように前記センサ支持体に設置されることを特徴とする請求項９記載の基板搬送装置。   The first sensor and the second sensor of the substrate detection device are arranged on the sensor support body so that the optical axis of the first sensor and the optical axis of the second sensor are aligned in the horizontal direction. The substrate transfer apparatus according to claim 9, wherein the substrate transfer apparatus is installed. 前記基板検出装置が、前記基板の有無と、前記基板の斜め状態と、前記基板の飛び出しと、を検出する際、前記第１と第２のセンサが遮光される間隔が、予め記憶している閾値よりも大きいときにそれらの検出を判断することを特徴とする請求項９記載の基板搬送装置。   When the substrate detection device detects the presence / absence of the substrate, the oblique state of the substrate, and the protrusion of the substrate, the interval at which the first and second sensors are shielded is stored in advance. 10. The substrate transfer apparatus according to claim 9, wherein the detection of the detection is judged when the value is larger than the threshold value. 前記基板検出装置が、前記第２のセンサが前記基板の飛び出しを検出し、かつ前記第１のセンサが前記基板の有無及び前記基板の斜め状態を検出したとき、前記第１のセンサの前記基板の斜め状態の検出を検出結果とすることを特徴とする請求項９記載の基板搬送装置。   When the second sensor detects the jumping out of the substrate and the first sensor detects the presence / absence of the substrate and the oblique state of the substrate, the substrate detection device detects the substrate of the first sensor. The substrate transfer apparatus according to claim 9, wherein detection of an oblique state is a detection result. 前記基板検出装置の前記センサ支持体が、前記基板を保持するハンドであって、前記ハンドの先端に前記第１と第２のセンサが設置されることを特徴とする請求項９記載の基板搬送装置。   10. The substrate transport according to claim 9, wherein the sensor support of the substrate detection device is a hand that holds the substrate, and the first and second sensors are installed at the tip of the hand. apparatus. 前記センサ支持体駆動手段が、水平多関節のアームであることを特徴とする請求項１７記載の基板搬送装置。   18. The substrate transfer apparatus according to claim 17, wherein the sensor support driving means is a horizontal articulated arm. 前記基板検出装置が、少なくとも、前記基板の有無と、前記基板の斜め状態と、前記基板の飛び出しと、を検出したとき、アラームを出力して停止することを特徴とする請求項９記載の基板搬送装置。   10. The substrate according to claim 9, wherein when the substrate detection device detects at least the presence / absence of the substrate, the oblique state of the substrate, and the protrusion of the substrate, an alarm is output and stopped. Conveying device. 前記基板検出装置が、少なくとも、前記基板の有無と、前記基板の斜め状態と、前記基板の飛び出しと、を検出したとき、その検出結果から、前記基板の搬送に支障が無いことを判断すると、前記基板の搬送を開始することを特徴とする請求項９記載の基板搬送装置。   When the substrate detection device detects at least the presence / absence of the substrate, the oblique state of the substrate, and the protrusion of the substrate, from the detection result, it is determined that there is no hindrance to the conveyance of the substrate, The substrate transfer apparatus according to claim 9, wherein transfer of the substrate is started. 請求項９記載の基板搬送装置を備えたことを特徴とする半導体製造装置。   A semiconductor manufacturing apparatus comprising the substrate transfer apparatus according to claim 9. 請求項９記載の基板搬送装置を備えたことを特徴とする液晶製造装置。   A liquid crystal manufacturing apparatus comprising the substrate transfer apparatus according to claim 9. 請求項９記載の基板搬送装置を備えたことを特徴とする検査装置。   An inspection apparatus comprising the substrate transfer apparatus according to claim 9. センサ支持体と、光軸が水平になるよう前記センサ支持体に設置される第１のセンサと、光軸が水平よりも一定角度傾斜するよう前記センサ支持体に設置される第２のセンサと、前記センサ支持体を前記基板の周縁に対して前後及び上下させるセンサ支持体駆動手段と、を備えた基板検出装置において、水平な状態で上下多段にカセット内に収容された基板を検出する方法であって、
前記センサ支持体駆動手段によって前記第１と第２のセンサの光軸を前記基板の周縁に近づけるステップと、
前記センサ支持体駆動手段によって前記第１と第２のセンサの光軸を上方又は下方に垂直に移動させるステップと、
前記移動させるステップを行ないながら、前記第１と第２のセンサの光軸が遮光された間隔を検出するステップと、
前記第１のセンサの光軸が遮光された間隔によって、前記基板の有無と、前記基板の斜め状態と、を検出するステップと、
前記第２のセンサの光軸が遮光された間隔によって、前記基板の飛び出しを検出するステップと、を備えたことを特徴とする基板検出方法。 A sensor support, a first sensor installed on the sensor support so that the optical axis is horizontal, and a second sensor installed on the sensor support so that the optical axis is inclined at a certain angle from the horizontal. And a sensor support driving means for moving the sensor support back and forth and up and down with respect to the peripheral edge of the substrate, and a method for detecting a substrate accommodated in a cassette in multiple stages in a horizontal state in a horizontal state Because
Bringing the optical axes of the first and second sensors closer to the periphery of the substrate by the sensor support driving means;
Vertically moving the optical axes of the first and second sensors upward or downward by the sensor support driving means;
Detecting the interval at which the optical axes of the first and second sensors are shielded while performing the moving step;
Detecting the presence / absence of the substrate and the oblique state of the substrate by an interval at which the optical axis of the first sensor is shielded;
And a step of detecting protrusion of the substrate based on an interval at which the optical axis of the second sensor is shielded.
JP2009062799A 2009-03-16 2009-03-16 Substrate detection device and substrate transfer device including the same Expired - Fee Related JP5353336B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009062799A JP5353336B2 (en) 2009-03-16 2009-03-16 Substrate detection device and substrate transfer device including the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009062799A JP5353336B2 (en) 2009-03-16 2009-03-16 Substrate detection device and substrate transfer device including the same

Publications (2)

Publication Number Publication Date
JP2010219209A true JP2010219209A (en) 2010-09-30
JP5353336B2 JP5353336B2 (en) 2013-11-27

Family

ID=42977740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009062799A Expired - Fee Related JP5353336B2 (en) 2009-03-16 2009-03-16 Substrate detection device and substrate transfer device including the same

Country Status (1)

Country Link
JP (1) JP5353336B2 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102779771A (en) * 2011-05-09 2012-11-14 株式会社安川电机 Robot system
WO2014103299A1 (en) 2012-12-28 2014-07-03 川崎重工業株式会社 End effector
JP2014143388A (en) * 2012-12-25 2014-08-07 Tokyo Electron Ltd Substrate transfer apparatus, substrate transfer method and storage medium
KR101462602B1 (en) * 2013-10-01 2014-11-20 주식회사 에스에프에이 Wafer mapping device and method using the same
KR20140137311A (en) 2013-05-22 2014-12-02 가부시키가이샤 야스카와덴키 Substrate transfer robot, substrate transfer system and method for detecting placement state of substrate
CN104899887A (en) * 2015-06-17 2015-09-09 北京七星华创电子股份有限公司 Method and device of detecting silicon chip distribution status images within semiconductor equipment load bearing region
TWI628733B (en) * 2016-03-04 2018-07-01 川崎重工業股份有限公司 Teaching of a position of a substrate mounting portion
JP2018117106A (en) * 2017-01-21 2018-07-26 東レエンジニアリング株式会社 Mounting method and mounting device
JP2019083337A (en) * 2019-02-05 2019-05-30 東京エレクトロン株式会社 Substrate processing device, substrate transfer method, and computer-readable storage medium for storing substrate transfer program
JP2020145333A (en) * 2019-03-07 2020-09-10 東京エレクトロン株式会社 Storage container partition plate, storage container, substrate processing system, and substrate transport method
CN114424328A (en) * 2019-08-19 2022-04-29 应用材料公司 Mapping of replacement part storage containers
CN114551308A (en) * 2022-01-28 2022-05-27 上海广川科技有限公司 Vacuum side wafer state obtaining method for semiconductor vacuum transmission system
CN114551295A (en) * 2022-01-28 2022-05-27 上海广川科技有限公司 Atmospheric side wafer state acquisition method for semiconductor vacuum transmission system
JP7389182B1 (en) 2022-07-27 2023-11-29 上銀科技股▲分▼有限公司 Load port and its mapping device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102178727B1 (en) * 2019-04-15 2020-11-13 주식회사 영우디에스피 Appatatus for sensing display panel

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07153818A (en) * 1993-11-30 1995-06-16 Daihen Corp Semiconductor wafer recognition equipment
JPH08148546A (en) * 1994-11-22 1996-06-07 Sumitomo Metal Ind Ltd Wafer arrangement detection device
JPH09186217A (en) * 1996-01-05 1997-07-15 Canon Inc Wafer loading/unloading device
JPH1148057A (en) * 1997-08-05 1999-02-23 Daihen Corp Detecting device board thin
JP2000036528A (en) * 1998-07-17 2000-02-02 Yaskawa Electric Corp Wafer carrying device
JP2004327501A (en) * 2003-04-21 2004-11-18 Kawasaki Heavy Ind Ltd Mapping system
JP2006013123A (en) * 2004-06-25 2006-01-12 Applied Materials Inc Wafer detector and method therefor
JP2006196676A (en) * 2005-01-13 2006-07-27 Tokyo Electron Ltd Processing device and processing method
JP2007324365A (en) * 2006-05-31 2007-12-13 Sunx Ltd Detecting sensor, detection apparatus, sensor head

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07153818A (en) * 1993-11-30 1995-06-16 Daihen Corp Semiconductor wafer recognition equipment
JPH08148546A (en) * 1994-11-22 1996-06-07 Sumitomo Metal Ind Ltd Wafer arrangement detection device
JPH09186217A (en) * 1996-01-05 1997-07-15 Canon Inc Wafer loading/unloading device
JPH1148057A (en) * 1997-08-05 1999-02-23 Daihen Corp Detecting device board thin
JP2000036528A (en) * 1998-07-17 2000-02-02 Yaskawa Electric Corp Wafer carrying device
JP2004327501A (en) * 2003-04-21 2004-11-18 Kawasaki Heavy Ind Ltd Mapping system
JP2006013123A (en) * 2004-06-25 2006-01-12 Applied Materials Inc Wafer detector and method therefor
JP2006196676A (en) * 2005-01-13 2006-07-27 Tokyo Electron Ltd Processing device and processing method
JP2007324365A (en) * 2006-05-31 2007-12-13 Sunx Ltd Detecting sensor, detection apparatus, sensor head

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102779771A (en) * 2011-05-09 2012-11-14 株式会社安川电机 Robot system
KR20120125946A (en) 2011-05-09 2012-11-19 가부시키가이샤 야스카와덴키 Robot system
JP2012235058A (en) * 2011-05-09 2012-11-29 Yaskawa Electric Corp Robot system
US8892242B2 (en) 2011-05-09 2014-11-18 Kabushiki Kaisha Yaskawa Denki Robot system
JP2014143388A (en) * 2012-12-25 2014-08-07 Tokyo Electron Ltd Substrate transfer apparatus, substrate transfer method and storage medium
US10128138B2 (en) 2012-12-25 2018-11-13 Tokyo Electron Limited Substrate transfer method and storage medium
US9627238B2 (en) 2012-12-25 2017-04-18 Tokyo Electron Limited Substrate transfer apparatus, substrate transfer method, and storage medium
WO2014103299A1 (en) 2012-12-28 2014-07-03 川崎重工業株式会社 End effector
US9455171B2 (en) 2012-12-28 2016-09-27 Kawasaki Jukogyo Kabushiki Kaisha End effector
KR20140137311A (en) 2013-05-22 2014-12-02 가부시키가이샤 야스카와덴키 Substrate transfer robot, substrate transfer system and method for detecting placement state of substrate
US9390954B2 (en) 2013-05-22 2016-07-12 Kabushiki Kaisha Yaskawa Denki Substrate transfer robot, substrate transfer system, and method for detecting arrangement state of substrate
KR101462602B1 (en) * 2013-10-01 2014-11-20 주식회사 에스에프에이 Wafer mapping device and method using the same
CN104899887A (en) * 2015-06-17 2015-09-09 北京七星华创电子股份有限公司 Method and device of detecting silicon chip distribution status images within semiconductor equipment load bearing region
CN104899887B (en) * 2015-06-17 2018-06-22 北京北方华创微电子装备有限公司 The silicon chip distribution image detecting method and device of semiconductor equipment bearing area
TWI628733B (en) * 2016-03-04 2018-07-01 川崎重工業股份有限公司 Teaching of a position of a substrate mounting portion
US10395956B2 (en) 2016-03-04 2019-08-27 Kawasaski Jukogyo Kabushiki Kaisha Substrate transfer apparatus and method of teaching substrate transfer robot
KR20180127388A (en) 2016-03-04 2018-11-28 카와사키 주코교 카부시키 카이샤 Substrate transporting apparatus and substrate transporting robot teaching method
JP2018117106A (en) * 2017-01-21 2018-07-26 東レエンジニアリング株式会社 Mounting method and mounting device
JP2019083337A (en) * 2019-02-05 2019-05-30 東京エレクトロン株式会社 Substrate processing device, substrate transfer method, and computer-readable storage medium for storing substrate transfer program
JP2020145333A (en) * 2019-03-07 2020-09-10 東京エレクトロン株式会社 Storage container partition plate, storage container, substrate processing system, and substrate transport method
US11735448B2 (en) 2019-03-07 2023-08-22 Tokyo Electron Limited Container, container partition plate, substrate processing system, and substrate transfer method
JP7357453B2 (en) 2019-03-07 2023-10-06 東京エレクトロン株式会社 Substrate processing system and substrate transport method
CN114424328A (en) * 2019-08-19 2022-04-29 应用材料公司 Mapping of replacement part storage containers
JP2022546679A (en) * 2019-08-19 2022-11-07 アプライド マテリアルズ インコーポレイテッド Spare parts storage container mapping
US12014944B2 (en) 2019-08-19 2024-06-18 Applied Materials, Inc. Mapping of a replacement parts storage container
CN114551308A (en) * 2022-01-28 2022-05-27 上海广川科技有限公司 Vacuum side wafer state obtaining method for semiconductor vacuum transmission system
CN114551295A (en) * 2022-01-28 2022-05-27 上海广川科技有限公司 Atmospheric side wafer state acquisition method for semiconductor vacuum transmission system
CN114551308B (en) * 2022-01-28 2023-12-01 上海广川科技有限公司 Vacuum side wafer state acquisition method for semiconductor vacuum transmission system
JP7389182B1 (en) 2022-07-27 2023-11-29 上銀科技股▲分▼有限公司 Load port and its mapping device

Also Published As

Publication number Publication date
JP5353336B2 (en) 2013-11-27

Similar Documents

Publication Publication Date Title
JP5353336B2 (en) Substrate detection device and substrate transfer device including the same
JP2868645B2 (en) Wafer transfer device, wafer inclination detecting method, and wafer detecting method
JP4276440B2 (en) Substrate detection method and apparatus, and substrate processing apparatus
TWI545672B (en) Substrate transport device, substrate transport method, and storage medium
JP5949741B2 (en) Robot system and detection method
KR101800935B1 (en) Substrate treating apparatus and substrate treating methods
TWI362081B (en)
JPH06244268A (en) Transfer equipment
KR20160055010A (en) wafer transfer robot and control method thereof
JP4863985B2 (en) Substrate processing equipment
JP2006278819A (en) Substrate positioning device and method, and program
JP2013161915A (en) Substrate transfer device, substrate transfer method, and storage medium
JP2006061854A (en) Substrate processing apparatus
WO2018168962A1 (en) Substrate transport apparatus
JPH0447976B2 (en)
JPH09148404A (en) Substrate carrier
KR20220024899A (en) Substrate mapping apparatus, mapping method thereof, and mapping teaching method
JPS61248839A (en) Takeout device for housed wafer
JP2008290877A (en) Component detecting method, component detector, and ic handler
JP5889814B2 (en) Substrate transport apparatus, substrate processing apparatus, and substrate accommodation method
JP3573634B2 (en) Substrate transfer device
JP2000068360A (en) Wafer detector
JPH09148403A (en) In-cassette substrate detector
JPH05243347A (en) Controlling method for movement and detecting device for position of processed object
CN210922587U (en) Automatic induction device for inclined fixed point of crystal boat

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20111118

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20120216

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121109

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130108

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130304

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130730

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130812

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees