WO2013107026A1 - 无注液管的均温装置制造方法及以该制法制成的均温装置 - Google Patents

无注液管的均温装置制造方法及以该制法制成的均温装置 Download PDF

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Publication number
WO2013107026A1
WO2013107026A1 PCT/CN2012/070611 CN2012070611W WO2013107026A1 WO 2013107026 A1 WO2013107026 A1 WO 2013107026A1 CN 2012070611 W CN2012070611 W CN 2012070611W WO 2013107026 A1 WO2013107026 A1 WO 2013107026A1
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Prior art keywords
casing
capillary material
temperature
manufacturing
liquid injection
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PCT/CN2012/070611
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English (en)
French (fr)
Inventor
金积德
Original Assignee
极致科技股份有限公司
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Publication date
Application filed by 极致科技股份有限公司 filed Critical 极致科技股份有限公司
Priority to JP2014552463A priority Critical patent/JP2015512020A/ja
Priority to EP12865722.8A priority patent/EP2806242B1/en
Priority to KR1020147022117A priority patent/KR20140116479A/ko
Priority to PCT/CN2012/070611 priority patent/WO2013107026A1/zh
Priority to US13/823,702 priority patent/US20140014304A1/en
Priority to CA2861406A priority patent/CA2861406A1/en
Publication of WO2013107026A1 publication Critical patent/WO2013107026A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • F28F3/027—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements with openings, e.g. louvered corrugated fins; Assemblies of corrugated strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2225/00—Reinforcing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2240/00—Spacing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/06—Fastening; Joining by welding
    • F28F2275/067—Fastening; Joining by welding by laser welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Definitions

  • the invention relates to heat transfer technology, and in particular to a method for manufacturing a temperature equalizing device without a liquid injection tube and a temperature equalizing device made by the method.
  • Conventional heat transfer devices such as flat-plate heat pipes, loop heat pipes, or uniform temperature heat transfer plates, all employ a working fluid phase change principle to achieve heat transfer effects.
  • the conventional uniform temperature heat transfer plate When the conventional uniform temperature heat transfer plate is manufactured, it must be welded around the hole, followed by drilling, welding, vacuum injection, sealing nozzle and spot welding. The other way is When the upper and lower plate covers of the warm heat transfer plate are punched, a liquid injection hole is reserved to omit the above drilling step.
  • the uniform temperature heat transfer plate produced by the above-mentioned method generally leaves a liquid injection pipe having a length of 0.5 to 3 cm, and often because of the control on the process, it is often caused by uniform temperature or heat transfer. The benefits are not good.
  • the exposed liquid injection tube tends to become a stress concentration place, which is liable to be damaged, has poor reliability, and is easily damaged by collision due to its convexity.
  • Taiwan Patent Publication No. 1324541 which provides a heat transfer device without a liquid injection pipe, which solves the problems of the aforementioned conventional heat transfer device.
  • the inventor of the present invention has separately developed a technique different from the previous case, and has filed an application for this patent.
  • a primary object of the present invention is to provide a method for manufacturing a temperature equalizing device without a liquid injection tube and a temperature equalizing device made by the method, which is different from the prior art and still has good reliability and heat dissipation performance.
  • Another object of the present invention is to provide a method for manufacturing a temperature equalizing device without a liquid injection tube and a temperature equalizing device made by the method, wherein the liquid working medium filling portion (i.e., the slit) is a flat sealing surface.
  • a method for manufacturing a temperature equalizing device without a liquid injection tube comprises the following steps: a) preparing an upper casing and a lower casing, the upper casing and the lower casing Forming an accommodating space between the bodies; b) placing a capillary material and a supporting frame in the accommodating space, soldering and sealing the joint between the upper casing and the lower casing, and leaving a gap;
  • the capillary material has at least an upper portion and a lower portion, the support frame being located between the upper portion and the lower portion, and separating the upper portion and the lower portion;
  • the upper housing welded to the step b) versus The composition of the lower casing is sintered; d) injecting a liquid working medium into the accommodating space from the gap, the amount of injection is a predetermined amount; and e) the step of injecting the liquid working medium in step d)
  • the combination of the housing and the lower housing is placed in a vacuum environment and the gap is quickly welded to
  • the present invention provides a temperature-free device for a liquid-free tube, comprising: an upper casing and a lower casing, and forming an accommodating space therebetween, the accommodating space is built into a capillary material, a support frame and a liquid working medium; the capillary material has at least an upper portion and a lower portion; the support frame is located between the upper portion and the lower portion, and the upper portion and the lower portion are opened; the liquid working medium is a predetermined amount; a capillary material, the support frame is sintered to be combined with the upper casing and the lower casing; the peripheral edge of the upper and lower casings is welded and a gap is left, and the gap is welded by high energy welding seal.
  • FIG. 1 is a schematic view of a first preferred embodiment of the present invention showing an upper housing and a lower housing.
  • Figure 2 is a schematic view showing the combination of the first preferred embodiment of the present invention.
  • Figure 3 is a cross-sectional view taken along line 3-3 of Figure 2.
  • Figure 4 is an exploded view of a first preferred embodiment of the present invention.
  • Figure 5 is a partial structural view of a first preferred embodiment of the present invention showing the structure of the support frame.
  • Figure 6 is a schematic view of the finished product of the first preferred embodiment of the present invention.
  • Figure 7 is a schematic view showing a second preferred embodiment of the present invention, showing the state in which the upper and lower casings have upper and lower capillary structures.
  • Figure 8 is an exploded view of a third preferred embodiment of the present invention.
  • FIG. 9 is a cross-sectional view showing a third preferred embodiment of the present invention.
  • a method for manufacturing a temperature equalization device without a liquid injection tube has the following steps:
  • FIG. 1 As shown in FIG. 1, an upper casing 11 and a lower casing 15 are disposed, and an accommodation space 19 is formed between the upper casing 11 and the lower casing 15.
  • a capillary material 21 and a support frame 25 are placed in the accommodating space 19, and the joint between the upper casing 11 and the lower casing 15 is welded and sealed, and
  • a capillary material 21 is provided with at least an upper portion 211 and a lower portion 212.
  • the upper portion 211 is in contact with the bottom surface of the upper casing 11, and the lower portion 212 is in contact with the top surface of the lower casing 15, the support
  • the frame 25 is located between the upper portion 211 and the lower portion 212, and supports the upper portion 211 and the lower portion 212 to be spaced apart.
  • the capillary material 21 is a metal mesh, and is formed in an endless belt shape.
  • the upper portion 211 and the lower portion 212 are naturally formed when placed in the accommodating space 19, and due to the capillary material 21
  • the upper portion 211 is connected to both sides of the lower portion 212.
  • the support frame 25 can be a grid or a plurality of support columns. In the embodiment, the grid frame is taken as an example.
  • the structure of the grid frame is as shown in FIG. 5, and the structure of the plurality of support sheets is formed up and down.
  • step b) sintering the composition of the upper casing 11 and the lower casing 15 welded together in step b).
  • a liquid working medium (which is not shown by the liquid and which is known as a component, not shown in the icon) is injected into the accommodating space 19 by the slit 18, and the amount of the injection is a predetermined amount.
  • a fine needle tube (which is not shown) is inserted into the slit 18, and the liquid working medium is injected into the accommodating space 19 through the thin needle tube.
  • step d) first clamping the composition of the upper casing 11 and the lower casing 15 into which the liquid working medium has been injected in step d) by a clamp (known in the art, not shown), and then placing it in a vacuum environment. And the gap 18 is quickly welded and sealed, that is, a finished product of the temperature equalizing device 10 is produced, as shown in FIG.
  • the welding of the slit 18 is exemplified by a high-energy welding method which is one of electron beam welding, high-frequency argon arc welding, or laser welding.
  • the temperature equalizing device 10 can be manufactured, and the structure thereof comprises:
  • the upper casing 11 and the lower casing 15 form the accommodating space 19 therebetween, and the accommodating space 19 is built into the capillary material 21, the support frame 25 and the liquid working medium.
  • the capillary material 21 has an upper portion 211 and a lower portion 212, and the upper portion 211 is in contact with the bottom surface of the upper casing 11, and the lower portion 212 is in contact with the top surface of the lower casing 15.
  • the support frame 25 is located between the upper portion 211 and the lower portion 212, and the upper portion 211 and the lower portion 212 are opened.
  • the liquid working medium is a predetermined amount.
  • the capillary material 21, the support frame 25 is sintered to be combined with the upper casing 11 and the lower casing 15.
  • the peripheral edges of the upper and lower casings 11, 15 are welded and leave a gap 18, and the gap 18 is welded by a high-energy welding method.
  • the contact portions between the upper and lower casings 11 and 15 are sealed, and the upper portion 211 and the lower portion 212 of the capillary material 21 in the inner accommodating space 19 are respectively in contact with the upper and lower casings.
  • the inner surface of 11, 15, and the support frame 25 extends the upper portion 211 and the lower portion 212.
  • the liquid working medium can be supported by the support frame 25
  • the open space and the capillary action of the capillary material 21 can have a good gaseous and liquid circulation path during phase change, thereby achieving a rapid average temperature effect.
  • the liquid working fluid filling portion i.e., the location where the slit 18 is located
  • the liquid working fluid filling portion is a flat sealing surface without the disclosed prior art liquid infusion tube, and there is no reliability problem of the exposed liquid filling tube.
  • the first embodiment differs from the prior art in the manufacturing method and the completed structure, and has the advantages of good reliability and heat dissipation performance in addition to the elimination of the volume of the liquid pipe.
  • the capillary material is a metal mesh, which is merely an example, and is not intended to limit the material or composition thereof.
  • the capillary material may also be a copper powder sintered material. Since the copper powder sintered material belongs to a known component, The setting method is also well known, so it is not described here.
  • a method for manufacturing a temperature equalizing device without a liquid injection tube according to a second preferred embodiment of the present invention is mainly related to the first embodiment disclosed above, except that:
  • the bottom surface of the upper casing 31 is provided with an upper capillary structure 32
  • the top surface of the lower casing 35 is provided with a lower capillary structure 36.
  • the upper capillary structure 32 and the lower capillary structure 36 are a plurality of grooves.
  • the plurality of disposed upper capillary structures 32 and the lower capillary structure 36 can further increase the flow path of the liquid, and the liquid working medium can have a better reflow effect than the first embodiment.
  • the upper capillary structure and the lower capillary structure are a plurality of grooves, which are not limited to the material or composition.
  • the upper capillary structure and the lower capillary structure may also be a copper powder.
  • a method for manufacturing a temperature equalizing device without a liquid injection tube according to a third preferred embodiment of the present invention is mainly related to the first embodiment disclosed above, except that:
  • a capillary material 61 and a support frame 65 are placed in the accommodating space 59, and an upper capillary material 681 is disposed between the capillary material 61 and the upper casing 51. And a sub-capillary material 682 is further disposed between the capillary material 61 and the lower casing 55.
  • the upper auxiliary capillary material 681 and the lower secondary capillary material 682 are one of a metal mesh or a copper powder sintered material. In the third embodiment, a metal mesh is taken as an example.
  • the third embodiment further adds an upper sub-coarse material 681 and a lower sub-capillary material 682 to the first embodiment, which can increase the return path of the liquid working medium and further enhance the effect of rapid average temperature.
  • the addition of a layer of the secondary capillary material between the capillary material and the upper and lower casings can increase the return path. It can be understood that the addition of two or more layers of the secondary capillary material is only a simple change of the third embodiment, and should be covered by the patent protection scope of the present invention. The remaining structure, the operation mode and the achievable functions of the third embodiment are the same as those of the first embodiment, and are not described herein.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种无注液管的均温装置制造方法及该制法制成的均温装置，其制造方法包含步骤：a）备置上壳体（11）以及下壳体（15），上壳体（11）与下壳体（15）之间形成容置空间（19）；b）将毛细材料（21）以及支撑架（25）置于该容置空间（19）内，通过焊接密封该上壳体（11）与下壳体（15）间的接缝，并且预留一个缝隙（18）；c）对焊接在一起的该上壳体（11）与下壳体（15）的组合物进行烧结；d）将液态工质由缝隙（18）注入容置空间（19）；e）将步骤d）中已注入液态工质的该上壳体（11）与下壳体（15）的组合物置入真空环境，且利用高能量焊接法迅速焊接密封该缝隙（18）。该均温装置的容置空间（19）内设置有毛细材料（21）和支撑架（25）。上壳体（11）与下壳体（15）相接触的周缘焊接并预留一个缝隙（18），且该缝隙（18）由高能量焊接法焊接密封。该均温装置具有优良的散热特性，且不具有外露的注液管。

Description

无注液管的均温装置制造方法及以该制法制成的均温装置
技术领域
本发明与传热技术有关，特别是指一种无注液管的均温装置制造方法及以该制法制成 的均温装置。 背景技术 传统的传热装置， 例如平板式热管、 回路热管或均温传热板等， 均采用工质液体相变 原理来达到传热效果。
传统的均温传热板在制造时， 须先将其四周焊接好， 再依循钻孔、 焊管、 真空注液、 封管口以及点焊等步骤才能完成；另一种方式为，预先于均温传热板的上、下板盖冲模时， 预留注液孔， 以省略上述钻孔步骤。 然而， 利用上述制法所制成的均温传热板， 一般会留 下 0. 5~3公分长度不等的注液管， 且往往因为制程上的控制不易， 常常造成均温或传热的 效益不彰。 再者， 外露的注液管易成为应力集中处， 导致该处容易坏损， 可靠度不佳， 并 容易因为其外凸而容易受到碰撞导致断裂的情况发生。
有鉴于此， 本案发明人提出了中国台湾公告第 1324541号专利， 其提供了一种无注液 管的传热装置， 解决了前述传统传热装置的问题。 同时本案发明人另外又研究出与前案不 同的技术， 而提出本专利的申请。 发明内容 本发明的主要目的在于提供一种无注液管的均温装置制造方法及以该制法制成的均 温装置， 其不同于先前技术， 而仍具有良好的可靠度与散热性能。
本发明的另一目的在于提供一种无注液管的均温装置制造方法及以该制法制成的均 温装置， 其液态工质充填处（即隙缝)为一平坦密合面。
为了达成前述目的， 依据本发明所提供的一种无注液管的均温装置制造方法， 包含有 下列步骤： a)备置一上壳体以及一下壳体， 该上壳体与该下壳体之间形成一容置空间； b) 将一毛细材料以及一支撑架置于该容置空间内， 焊接密封该上壳体与该下壳体间的接缝， 并且预留一个缝隙； 其中， 该毛细材料至少具有一上部以及一下部， 该支撑架位于该上部 与该下部之间， 且将该上部及下部支撑而隔开； c)对步骤 b)的焊接在一起的该上壳体与 该下壳体的组合物进行烧结； d)将一液态工质由该缝隙注入该容置空间， 注入的量为一预 定份量； 以及 e)将步骤 d)中已注入液态工质的该上壳体与该下壳体的组合物置入一真空 环境， 且迅速焊接密封该缝隙。
另外， 本发明所提供的一种无注液管的均温装置， 包含有： 一上壳体以及一下壳体， 并于其间形成一容置空间， 该容置空间内置入一毛细材料、 一支撑架以及一液态工质； 该 毛细材料至少具有一上部以及一下部； 该支撑架位于该上部与该下部之间， 且将该上部及 下部撑开； 该液态工质为一预定份量； 该毛细材料、 该支撑架经过烧结而与该上壳体及该 下壳体结合； 该上、 下壳体之间相接触的周缘焊接并留下一缝隙， 且该缝隙是由高能量焊 接法焊接密封。
因此， 本发明的方法及所制成的均温装置即不同于先前技术， 而仍具有良好的可靠度 与散热性能， 并且其液态工质充填处（即隙缝)为一平坦密合面。 附图说明 图 1是本发明第一较佳实施例的示意图， 显示上壳体及下壳体。
图 2是本发明第一较佳实施例的组合示意图。
图 3是沿图 2中 3-3剖线的剖视图。
图 4是本发明第一较佳实施例的爆炸图。
图 5是本发明第一较佳实施例的局部构件示意图， 显示支撑架的结构。
图 6是本发明第一较佳实施例的成品示意图。
图 7是本发明第二较佳实施例的示意图，显示上、下壳体具有上、下毛细结构的状态。 图 8是本发明第三较佳实施例的爆炸图。
图 9是本发明第三较佳实施例的剖视示意图。 具体实施方式 为了详细说明本发明的构造及特点所在， 兹举以下较佳实施例并配合附图说明如后， 其巾：
如图 1至图 6所示，本发明第一较佳实施例所提供的一种无注液管的均温装置制造方 法， 主要具有下列步骤：
a)如图 1所示， 备置一上壳体 11以及一下壳体 15， 该上壳体 11与该下壳体 15之间 形成一容置空间 19。 b)如图 2至图 4所示， 将一毛细材料 21以及一支撑架 25置于该容置空间 19内， 焊 接密封该上壳体 11与该下壳体 15间的接缝， 并且预留一个缝隙 18; 其中， 该毛细材料 21至少具有一上部 211以及一下部 212， 该上部 211接触于该上壳体 11的底面， 该下部 212接触于该下壳体 15的顶面， 该支撑架 25位于该上部 211与该下部 212之间， 且将该 上部 211及下部 212支撑而隔开。 于本实施例中， 该毛细材料 21为一金属织网， 而呈环 带状， 在置于该容置空间 19内时即自然的形成该上部 211 以及该下部 212， 且由于该毛 细材料 21呈环带状， 因此该上部 211与该下部 212的两侧系相连接。该支撑架 25可为一 网架或为数个支撑柱， 于本实施例中以网架为例， 其网架的结构如图 5所示， 为一网板而 上下形成多数支撑片的结构。
c)对步骤 b)的焊接在一起的该上壳体 11与该下壳体 15的组合物进行烧结。
d)将一液态工质（由于液体难以表示， 且属公知元件， 容不在图标中表示之）由该缝隙 18注入该容置空间 19， 注入的量为一预定份量。 于本实施例中， 系借由一细针管 (属公知 技术， 图中未示）穿入缝隙 18， 并将该液态工质循该细针管注入该容置空间 19。
e)先将步骤 d)中已注入液态工质的该上壳体 11与该下壳体 15的组合物以一夹具 (属 公知技术， 图中未示)夹紧， 再置入一真空环境， 且迅速对该缝隙 18进行焊接密封， 即制 造出一均温装置 10的成品， 如图 6所示。 于本实施例中， 对该缝隙 18的焊接系以高能量 焊接法为例， 此高能量焊接法为电子束焊接法、 高频氩弧焊接法、 或雷射焊接法的其中一 种。
藉由上述步骤， 可制造出的均温装置 10， 其结构即包含有：
该上壳体 11 以及该下壳体 15， 并且于其间形成了该容置空间 19， 于该容置空间 19 内置入该毛细材料 21、 该支撑架 25以及该液态工质。 该毛细材料 21具有一上部 211 以 及一下部 212， 且该上部 211接触于该上壳体 11的底面， 该下部 212接触于该下壳体 15 的顶面。 该支撑架 25位于该上部 211与该下部 212之间， 且将该上部 211及下部 212撑 开。 该液态工质为一预定份量。
该毛细材料 21、 该支撑架 25经过烧结而与该上壳体 11及该下壳体 15结合。
该上、 下壳体 11， 15之间相接触的周缘焊接并留下一缝隙 18， 且该缝隙 18是由高能 量焊接法焊接密封。
由上可知， 该上、 下壳体 11， 15之间的接触部位均被密封， 且内部的容置空间 19内 具有该毛细材料 21的上部 211及下部 212分别接触于该上、 下壳体 11， 15的内部表面， 且该支撑架 25撑开该上部 211及下部 212。 藉此， 该液态工质系可藉由该支撑架 25所撑 开的空间以及该毛细材料 21 的毛细作用， 在相变时能有良好的气态及液态的循环路径， 进而达到快速均温的效果。 此外， 其液态工质充填处（即该缝隙 18所在位置)为一平坦的 密合面， 而不具有公知技术的外露注液管， 不会有外露注液管的可靠性问题。
由此可见， 本第一实施例在制法及所完成的结构上均不同于先前技术， 除了不具有外 露注液管而可减少体积的占用外， 还具有良好的可靠度及散热性能。
本第一实施例中， 该毛细材料为一金属织网仅为举例而已， 并非用以限制其材质或构 成，该毛细材料亦可为一铜粉烧结物， 由于铜粉烧结物属公知元件，其设置方式亦属公知， 因此容不赘述。
请再参阅图 7， 本发明第二较佳实施例所提供的一种无注液管的均温装置制造方法， 主要概同于前揭第一实施例， 不同之处在于：
于步骤 a)中， 该上壳体 31的底面设有一上毛细结构 32， 该下壳体 35之顶面设有一 下毛细结构 36。 于本第二实施例中， 该上毛细结构 32与该下毛细结构 36均为数个沟槽。
藉此， 多设置出来的该上毛细结构 32与该下毛细结构 36可更为增加液体的流道， 而 可使该液态工质较第一实施例具有更佳的回流效果。
本第二实施例中， 该上毛细结构与该下毛细结构为数个沟槽亦为举例而已， 并非用以 限制其材质或构成， 该上毛细结构与该下毛细结构亦可分别为一铜粉绕结物或一金属织 网， 由于铜粉烧结物及金属织网均属公知元件， 其设置方式亦属公知， 因此容不赘述。
本第二实施例的其余结构、操作方式及所能达成的功效均概同于前揭第一实施例， 容 不赘述。
请再参阅图 8至图 9， 本发明第三较佳实施例所提供的一种无注液管的均温装置制造 方法， 主要概同于前揭第一实施例， 不同之处在于：
于步骤 b)中， 在将一毛细材料 61以及一支撑架 65置于该容置空间 59内的同时， 于 该毛细材料 61与该上壳体 51之间还设置一上副毛细材料 681， 以及于该毛细材料 61与 该下壳体 55之间还设置一下副毛细材料 682。 且该上副毛细材料 681与该下副毛细材料 682为一金属织网或一铜粉烧结物的其中一种， 于本第三实施例中以金属织网为例。
藉此，本第三实施例较第一实施例更增加了一上副毛细材料 681以及一下副毛细材料 682， 可增加了液态工质的回流路径， 进一步强化快速均温的效果。
此外， 由本第三实施例可知， 在该毛细材料与上、 下壳体之间增设一层副毛细材料是 可以增加回流路径的。 可以理解的是， 增加两层或两层以上的副毛细材料亦仅为本第三实 施例之简单变化而已， 仍应为本案专利保护范围所涵盖。 本第三实施例的其余结构、操作方式及所能达成的功效均概同于前揭第一实施例， 容 不赘述。

Claims

权利要求
1. 一种无注液管的均温装置制造方法， 其特征在于： 包含有下列步骤：
a)备置一上壳体以及一下壳体， 该上壳体与该下壳体之间形成一容置空间； b)将一毛细材料以及一支撑架置于该容置空间内，焊接密封该上壳体与该下壳体间的 接缝， 并且预留一个缝隙； 其中， 该毛细材料至少具有一上部以及一下部， 该支撑架位于 该上部与该下部之间， 且将该上部及下部支撑而隔开；
c)对步骤 b)的焊接在一起的该上壳体与该下壳体的组合物进行烧结；
d)将一液态工质由该缝隙注入该容置空间， 注入的量为一预定份量； 以及
e)将步骤 d)中已注入液态工质的该上壳体与该下壳体的组合物置入一真空环境， 且 迅速焊接密封该缝隙。
2.根据权利要求 1所述的无注液管的均温装置制造方法，其特征在于：该上壳体的底 面设有一上毛细结构， 该下壳体的顶面设有一下毛细结构。
3.根据权利要求 2所述的无注液管的均温装置制造方法，其特征在于：该上毛细结构 与该下毛细结构为数个沟槽、 一铜粉烧结物或一金属织网的其中一种。
4.根据权利要求 1所述的无注液管的均温装置制造方法， 其特征在于： 于步骤 d)中， 借由一细针管穿入缝隙， 并将该液态工质循该细针管注入该容置空间。
5.根据权利要求 1所述的无注液管的均温装置制造方法， 其特征在于： 在步骤 e)中， 系先使用一夹具夹紧该上壳体以及该下壳体， 再进行步骤 e)的动作。
6.根据权利要求 1所述的无注液管的均温装置制造方法， 其特征在于： 于步骤 e)中， 在焊接密封该缝隙时使用高能量焊接法。
7.根据权利要求 6所述的无注液管的均温装置制造方法，其特征在于：该高能量焊接 法为电子束焊接法、 高频氩弧焊接法、 或雷射焊接法的其中一种。
8.根据权利要求 1所述的无注液管的均温装置制造方法， 其特征在于： 于步骤 b)中， 该毛细材料为一金属织网或一铜粉烧结物的其中一种。
9.根据权利要求 1所述的无注液管的均温装置制造方法， 其特征在于： 于步骤 b)中， 该支撑架为一网架或数个支撑柱。
10.根据权利要求 1所述的无注液管的均温装置制造方法， 其特征在于： 该上部接触 于该上壳体的底面， 该下部接触于该下壳体的顶面。
11.根据权利要求 1所述的无注液管的均温装置制造方法，其特征在于：于步骤 b)中， 在将一毛细材料以及一支撑架置于该容置空间内的同时，于该毛细材料与该上壳体之间更 设置一上副毛细材料， 以及于该毛细材料与该下壳体之间更设置一下副毛细材料。
12.根据权利要求 11所述的无注液管的均温装置制造方法，其特征在于：该上副毛细 材料与该下副毛细材料为一金属织网或一铜粉烧结物的其中一种。
13.—种以权利要求 1所述的制造方法所制成的均温装置， 其特征在于， 包含有： 一上壳体以及一下壳体， 并于其间形成一容置空间， 该容置空间内置入一毛细材料、 一支撑架以及一液态工质；该毛细材料至少具有一上部以及一下部；该支撑架位于该上部 与该下部之间， 且将该上部及下部撑开； 该液态工质为一预定份量；
该毛细材料、 该支撑架经过烧结而与该上壳体及该下壳体结合；
该上、下壳体之间相接触的周缘系焊接并留下一缝隙，且该缝隙是由高能量焊接法焊 接密封。
14. 根据权利要求 13所述的均温装置， 其特征在于： 该高能量焊接法为电子束焊接 法、 高频氩弧焊接法、 或雷射焊接法的其中一种。
15. 根据权利要求 13所述的均温装置， 其特征在于： 该毛细材料为一金属织网或一 铜粉烧结物的其中一种。
16. 根据权利要求 13所述的均温装置， 其特征在于： 该支撑架为一网架或数个支撑 柱。
17.根据权利要求 13所述的均温装置，其特征在于：该上壳体的底面设有一上毛细结 构， 该下壳体的顶面设有一下毛细结构。
18.根据权利要求 17所述的均温装置，其特征在于：该上毛细结构与该下毛细结构为 数个沟槽、 一铜粉烧结物或一金属织网的其中一种。
19.根据权利要求 13所述的均温装置， 其特征在于： 该上部接触于该上壳体的底面， 该下部接触于该下壳体的顶面。
20.根据权利要求 13所述的均温装置，其特征在于：该毛细材料与该上壳体之间更设 有一上副毛细材料， 该毛细材料与该下壳体之间更设有一下副毛细材料。
21.根据权利要求 20所述的均温装置，其特征在于：该上副毛细材料与该下副毛细材 料为一金属织网或一铜粉烧结物的其中一种。
PCT/CN2012/070611 2012-01-19 2012-01-19 无注液管的均温装置制造方法及以该制法制成的均温装置 WO2013107026A1 (zh)

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