WO2013099771A1 - Préimprégné, plaque à circuit imprimé et dispositif à semi-conducteurs - Google Patents

Préimprégné, plaque à circuit imprimé et dispositif à semi-conducteurs Download PDF

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Publication number
WO2013099771A1
WO2013099771A1 PCT/JP2012/083125 JP2012083125W WO2013099771A1 WO 2013099771 A1 WO2013099771 A1 WO 2013099771A1 JP 2012083125 W JP2012083125 W JP 2012083125W WO 2013099771 A1 WO2013099771 A1 WO 2013099771A1
Authority
WO
WIPO (PCT)
Prior art keywords
prepreg
resin
resin composition
circuit board
base material
Prior art date
Application number
PCT/JP2012/083125
Other languages
English (en)
Japanese (ja)
Inventor
大輔 北原
孝幸 馬塲
飛澤　晃彦
Original Assignee
住友ベークライト株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友ベークライト株式会社 filed Critical 住友ベークライト株式会社
Priority to KR20147018627A priority Critical patent/KR20140113665A/ko
Priority to CN201280064774.XA priority patent/CN104024312A/zh
Publication of WO2013099771A1 publication Critical patent/WO2013099771A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/24—Thermosetting resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Definitions

  • An object of the present invention includes a prepreg capable of preventing occurrence of migration and manufacturing a circuit board having high electrical connection reliability, a circuit board having high electrical connection reliability, and such a circuit board. Another object is to provide a highly reliable semiconductor device.
  • a fiber substrate A resin composition impregnated in the fiber base material, The said resin composition contains a thermosetting resin and the hardening
  • the reaction rate of the resin composition in the prepreg 1 is not particularly limited, but is preferably 50% or less, more preferably about 0.1 to 40%.
  • production of powder in the prepreg 1 can be prevented.
  • migration can be more effectively prevented in a circuit board or the like manufactured using the prepreg 1.
  • the resin composition 12 includes a curing agent containing a novolac type phenol resin. By including such a curing agent, crosslinking of the thermosetting resin is promoted, and the mechanical strength of the cured product of the resin composition 12 can be increased. Moreover, since novolak-type phenol resin does not become a generation factor of ammonium ion, generation
  • curing accelerator examples include organic metal salts such as zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonate cobalt (II), trisacetylacetonate cobalt (III), triethylamine, triethylamine, and the like.
  • spherical silica (particularly spherical fused silica) is preferably used as the inorganic filler.
  • the melt viscosity of the resin composition 12 can be reduced, and the impregnation property to the sheet-like base material 11 can be more reliably ensured.
  • other inorganic fillers may be used.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

Ce préimprégné contient une base de fibre et une composition de résine qui est imprégnée dans la base et est caractérisé en ce que la composition de résine a une concentration en ion ammonium de 30 ppm ou moins et contient une résine thermodurcissable et un agent de durcissement qui contient une résine phénolique novolaque. En conséquence, il peut être proposé un préimprégné qui est apte à empêcher l'apparition d'une migration et est apte à produire une plaque à circuit imprimé qui a une fiabilité de connexion électrique élevée. La présente invention est également apte à fournir une plaque à circuit imprimé qui a une fiabilité de connexion électrique élevée et un dispositif à semi-conducteurs hautement fiable qui est doté de cette plaque à circuit imprimé. A cet égard, la résine thermodurcissable est de préférence une résine époxy.
PCT/JP2012/083125 2011-12-29 2012-12-20 Préimprégné, plaque à circuit imprimé et dispositif à semi-conducteurs WO2013099771A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR20147018627A KR20140113665A (ko) 2011-12-29 2012-12-20 프리프레그, 회로 기판 및 반도체 장치
CN201280064774.XA CN104024312A (zh) 2011-12-29 2012-12-20 预浸料坯、电路基板和半导体装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011290419 2011-12-29
JP2011290418 2011-12-29
JP2011-290419 2011-12-29
JP2011-290418 2011-12-29

Publications (1)

Publication Number Publication Date
WO2013099771A1 true WO2013099771A1 (fr) 2013-07-04

Family

ID=48697260

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/083125 WO2013099771A1 (fr) 2011-12-29 2012-12-20 Préimprégné, plaque à circuit imprimé et dispositif à semi-conducteurs

Country Status (4)

Country Link
KR (1) KR20140113665A (fr)
CN (1) CN104024312A (fr)
TW (1) TW201336923A (fr)
WO (1) WO2013099771A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003033997A (ja) * 2001-07-25 2003-02-04 Sumitomo Bakelite Co Ltd 積層板の製造方法
JP2008239826A (ja) * 2007-03-27 2008-10-09 Matsushita Electric Works Ltd 樹脂フィルム積層プリプレグの製造方法
JP2011027563A (ja) * 2009-07-27 2011-02-10 Fuji Electric Systems Co Ltd プリント基板に付着した汚損物の分析方法及びプリント基板の洗浄方法
JP2011225740A (ja) * 2010-04-21 2011-11-10 Dic Corp 新規エポキシ樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP2012077123A (ja) * 2010-09-30 2012-04-19 Nippon Steel Chem Co Ltd 接着剤樹脂組成物、その硬化物、及び接着剤フィルム
JP2012092297A (ja) * 2010-09-30 2012-05-17 Nippon Steel Chem Co Ltd 接着剤樹脂組成物、その硬化物、及び接着剤フィルム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003033997A (ja) * 2001-07-25 2003-02-04 Sumitomo Bakelite Co Ltd 積層板の製造方法
JP2008239826A (ja) * 2007-03-27 2008-10-09 Matsushita Electric Works Ltd 樹脂フィルム積層プリプレグの製造方法
JP2011027563A (ja) * 2009-07-27 2011-02-10 Fuji Electric Systems Co Ltd プリント基板に付着した汚損物の分析方法及びプリント基板の洗浄方法
JP2011225740A (ja) * 2010-04-21 2011-11-10 Dic Corp 新規エポキシ樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP2012077123A (ja) * 2010-09-30 2012-04-19 Nippon Steel Chem Co Ltd 接着剤樹脂組成物、その硬化物、及び接着剤フィルム
JP2012092297A (ja) * 2010-09-30 2012-05-17 Nippon Steel Chem Co Ltd 接着剤樹脂組成物、その硬化物、及び接着剤フィルム

Also Published As

Publication number Publication date
CN104024312A (zh) 2014-09-03
KR20140113665A (ko) 2014-09-24
TW201336923A (zh) 2013-09-16

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