WO2013094286A1 - 基板処理装置、デバイス製造システム、及びデバイス製造方法 - Google Patents

基板処理装置、デバイス製造システム、及びデバイス製造方法 Download PDF

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Publication number
WO2013094286A1
WO2013094286A1 PCT/JP2012/076326 JP2012076326W WO2013094286A1 WO 2013094286 A1 WO2013094286 A1 WO 2013094286A1 JP 2012076326 W JP2012076326 W JP 2012076326W WO 2013094286 A1 WO2013094286 A1 WO 2013094286A1
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WIPO (PCT)
Prior art keywords
optical system
illumination
projection
substrate
processing apparatus
Prior art date
Application number
PCT/JP2012/076326
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English (en)
French (fr)
Japanese (ja)
Inventor
加藤　正紀
Original Assignee
株式会社ニコン
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Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to JP2013550164A priority Critical patent/JP6056770B2/ja
Priority to KR1020147016863A priority patent/KR101737680B1/ko
Priority to KR1020187034105A priority patent/KR101961605B1/ko
Priority to KR1020187009744A priority patent/KR101924309B1/ko
Priority to KR1020177010559A priority patent/KR101848590B1/ko
Priority to CN201280063563.4A priority patent/CN104011597B/zh
Priority to KR1020177010558A priority patent/KR101849508B1/ko
Publication of WO2013094286A1 publication Critical patent/WO2013094286A1/ja

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B17/00—Systems with reflecting surfaces, with or without refracting elements
    • G02B17/008—Systems specially adapted to form image relays or chained systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/22—Telecentric objectives or lens systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/24—Optical objectives specially designed for the purposes specified below for reproducing or copying at short object distances
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B17/00—Systems with reflecting surfaces, with or without refracting elements
    • G02B17/08—Catadioptric systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B17/00—Systems with reflecting surfaces, with or without refracting elements
    • G02B17/08—Catadioptric systems
    • G02B17/0804—Catadioptric systems using two curved mirrors
    • G02B17/0812—Catadioptric systems using two curved mirrors off-axis or unobscured systems in which all of the mirrors share a common axis of rotational symmetry
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces

Definitions

  • the present invention relates to a substrate processing apparatus, a device manufacturing system, and a device manufacturing method.
  • This application claims priority based on Japanese Patent Application No. 2011-278290 filed on December 20, 2011 and Japanese Patent Application No. 2012-024058 filed on February 7, 2012, the contents of which are incorporated herein by reference. Incorporate.
  • a substrate processing apparatus such as an exposure apparatus is used for manufacturing various devices as described in Patent Document 1 below, for example.
  • the substrate processing apparatus can project an image of a pattern formed on the mask M arranged in the illumination area onto a substrate or the like arranged in the projection area.
  • the mask M used in the substrate processing apparatus includes a planar one and a cylindrical one.
  • the roll-to-roll system is a system in which various processes are performed on a substrate on a transport path while a substrate such as a film is transported from a delivery roll to a collection roll.
  • the substrate may be processed in a substantially flat state, for example, between transport rollers. Further, the substrate may be processed in a curved state, for example, on the surface of a roller.
  • the above-described substrate processing apparatus forms an image of a projection optical system used for exposure when one or both of an illumination area on a mask and a projection area on a substrate are curved with a predetermined curvature.
  • a projection optical system used for exposure when one or both of an illumination area on a mask and a projection area on a substrate are curved with a predetermined curvature.
  • the surface of a substrate film, sheet, web, etc.
  • a mask pattern formed on the outer peripheral cylindrical surface of a cylindrical rotary mask with a radius R is wound around a cylindrical rotary drum (roller) with a radius R by a projection optical system
  • the principal ray of the imaging light beam from the mask pattern (cylindrical surface shape) to the surface of the substrate (cylindrical surface shape) is the rotation center axis of the cylindrical rotation mask and the rotation center axis of the cylindrical rotation drum. It is sufficient to provide a projection optical system that forms an optical path that linearly connects the two.
  • the projection visual fields (projection areas) of each projection optical system are equal to the thickness of the hardware such as a lens barrel.
  • the cost of the apparatus may increase and the size of the apparatus may increase. As a result, device manufacturing costs can be high.
  • the substrate processing equipment illuminates a mask on which an electronic device or display device pattern is drawn, and a photosensitive layer (photoresist, etc.) forms light from the mask pattern.
  • An exposure apparatus that performs projection exposure on the formed substrate is used. Even when a mask pattern is repeatedly exposed to a flexible long substrate (film, sheet, web, etc.) that is continuously transported using the roll-to-roll method, the transport direction of the long substrate is the scanning direction.
  • a scanning exposure apparatus having a cylindrical rotating mask as a mask it is expected that productivity can be dramatically improved.
  • a transmission method in which a pattern is formed with a light shielding layer on the outer peripheral surface of a transparent cylindrical body such as glass, and a reflecting portion and an absorbing portion on the outer peripheral surface of a metallic cylindrical body (may be a cylindrical body).
  • a reflection method in which a pattern is formed.
  • an illumination optical system an optical member such as a mirror or lens
  • a metal cylinder (or column) can be used, so that the mask can be made at low cost, but illumination that irradiates exposure light to the outer peripheral space of the cylindrical mask It is necessary to provide an optical system and a projection optical system that projects reflected light from the pattern formed on the outer peripheral surface toward the substrate, and the configuration on the exposure apparatus side to satisfy the required resolution and transfer fidelity Can be complicated.
  • An aspect of the present invention is to enable a large mask pattern to be faithfully exposed even if one or both of a mask and a substrate (a flexible substrate such as a film, a sheet, and a web) are arranged in a cylindrical shape. It is an object of the present invention to provide a substrate processing apparatus equipped with a projection optical system. Another object is to provide a device manufacturing system and a device manufacturing method capable of faithfully exposing a large mask pattern.
  • Another object is to provide a substrate processing apparatus that can simplify the configuration of the apparatus. Another object is to provide a device manufacturing system and a device manufacturing method capable of reducing manufacturing costs.
  • a projection optical system that projects a light beam from an illumination area on a first object (mask) onto a projection area on a second object (substrate), and one of the illumination area and the projection area
  • a first support member that supports one of the first object and the second object so as to be along a first surface curved in a cylindrical shape with a predetermined curvature in the region, and the other region of the illumination region and the projection region
  • a second support member that supports the other of the first object and the second object so as to be along the predetermined second surface.
  • a light deflecting member for propagating an imaging light beam so that a principal ray between the first surface and the projection optical system of the light rays is directed in a radial direction that is non-perpendicular to the second surface in a radial direction of the first surface;
  • a substrate processing apparatus is provided.
  • a device manufacturing system including the substrate processing apparatus of the above aspect is provided.
  • the pattern of the first object is formed by exposing the second object by the substrate processing apparatus of the above aspect and processing the exposed second object.
  • a device manufacturing method is provided.
  • a substrate processing apparatus that projects and exposes an image of a reflective mask pattern onto a sensitive substrate, and is set on a mask holding member that holds the mask pattern and a part of the mask pattern.
  • a projection optical system that forms an image of a part of the mask pattern on the sensitive substrate by projecting a reflected light beam generated from the illumination area toward the sensitive substrate, and a projection optical system for obliquely illuminating the illumination region.
  • An optical member that is disposed in the optical path and includes an illumination light that travels toward the illumination area and a reflected light flux that is generated from the illumination area, a portion that allows one to pass and a part that reflects the other, and a light source that is a source of the illumination light
  • An image is generated, and the illumination light from the light source image is directed to the illumination region through a part of the optical path and the optical member of the projection optical system, and a conjugate surface optically conjugate with the light source image is reflected on the optical member.
  • An illumination optical system for the position or formed in the vicinity, a substrate processing apparatus including a is provided.
  • a substrate processing apparatus that projects and exposes an image of a reflective mask pattern onto a sensitive substrate, and is set on a mask holding member that holds the mask pattern and a part of the mask pattern.
  • a projection optical system that forms an image of a part of the mask pattern on the sensitive substrate by projecting a reflected light beam generated from the illumination area toward the sensitive substrate, and a projection optical system for obliquely illuminating the illumination region.
  • An optical member that is disposed in the optical path and includes a portion that allows one to pass and a portion that reflects the other of the reflected light generated from the illumination region and the reflected light generated from the illumination region, and a plurality of sources serving as a source of illumination light
  • a substrate processing apparatus including an illumination optical system that regularly or randomly forms the light source image of the light source image at or near the position of the reflection portion or the passage portion of the optical member.
  • a device manufacturing system including the substrate processing apparatus of the above aspect is provided.
  • a device manufacturing method including exposing an object by the substrate processing apparatus according to the above aspect and developing the exposed object.
  • a device manufacturing method for forming a pattern for a device on a sheet substrate while continuously feeding a flexible sheet substrate in the longitudinal direction.
  • a cylindrical body having a cylindrical outer peripheral surface with a constant radius from a second center line parallel to the first center line is supported by curving and supporting a part of the sheet substrate in the longitudinal direction.
  • the mask pattern of the cylindrical mask is supported by the object surface and the cylindrical body, and is arranged substantially symmetrically with respect to a central plane including the first central line and the second central line.
  • the extension of the principal ray passing through the object plane is directed toward the first center line, and the principal ray passing through the image plane Exposing a projection image of the mask pattern onto the sheet substrate with a set of projection optical systems configured such that the extension line is directed to the second center line.
  • a large mask pattern can be faithfully exposed by a substrate processing apparatus (exposure apparatus) having a compact projection optical system even when one or both of the mask and the substrate are cylindrical. Become. Moreover, according to the aspect of the present invention, it is possible to provide a device manufacturing system and a device manufacturing method capable of faithfully exposing a large mask pattern.
  • the aspect of the present invention it is possible to provide a substrate processing apparatus capable of simplifying the configuration of the apparatus. Moreover, according to the aspect of this invention, the device manufacturing system and device manufacturing method which can reduce manufacturing cost can be provided.
  • FIG. 9 It is a figure which shows the whole structure of the exposure apparatus by 3rd Embodiment. It is a figure explaining the conditions of the positional relationship of the projection area
  • FIG. 14 It is the figure which looked at the multiple projection optical system shown in FIG. 14 from another direction. It is a figure which shows the structure of the projection optical system by 7th Embodiment. It is a figure which shows the structure of the projection optical system by 8th Embodiment. It is a figure which shows the structure of the projection optical system by 9th Embodiment. It is a figure which shows the structure of the projection optical system by 10th Embodiment. It is a figure which shows the structure of the device manufacturing system of 11th Embodiment. It is a figure which shows the structure of the substrate processing apparatus (exposure apparatus) of 11th Embodiment. It is a figure which shows the structure of the optical member of 11th Embodiment.
  • FIG. 1 is a diagram illustrating a configuration of a device manufacturing system 1001 according to the present embodiment.
  • a device manufacturing system 1001 illustrated in FIG. 1 includes a substrate supply apparatus 1002 that supplies a substrate P, a processing apparatus 1003 that performs a predetermined process on the substrate P supplied by the substrate supply apparatus 2, and a process performed by the processing apparatus 1003.
  • a substrate recovery apparatus 1004 that recovers the substrate P subjected to the above and a host control apparatus 1005 that controls each part of the device manufacturing system 1001.
  • the substrate P is a (sheet) substrate having flexibility such as a so-called flexible substrate.
  • the device manufacturing system 1001 of this embodiment can manufacture a flexible device by using the flexible substrate P.
  • the substrate P is selected so as not to be broken when bent in the device manufacturing system 1001.
  • the flexibility of the substrate P at the time of device manufacture can be adjusted by, for example, the material, size, thickness, etc. of the substrate P, and is adjusted by environmental conditions such as humidity and temperature at the time of device manufacture. You can also.
  • the substrate P may be a substrate that does not have flexibility, such as a so-called rigid substrate. Further, the substrate P may be a composite substrate in which a flexible substrate and a rigid substrate are combined.
  • the flexible substrate P is, for example, a resin film, a foil (foil) made of a metal or an alloy such as stainless steel, or the like.
  • the material of the resin film is, for example, one of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Or two or more.
  • the substrate P has characteristics such as a coefficient of thermal expansion so that the amount of deformation caused by heat in various processing steps performed on the substrate P can be substantially ignored.
  • a substrate having a not significantly large thermal expansion coefficient can be selected.
  • the thermal expansion coefficient may be set smaller than a threshold corresponding to the process temperature or the like, for example, by mixing an inorganic filler with a resin film.
  • the inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like.
  • the substrate P may be a single layer of ultrathin glass having a thickness of about 100 ⁇ m manufactured by a float process or the like, or a laminate in which the above resin film, foil, or the like is bonded to the ultrathin glass. It may be.
  • the substrate P is a so-called multi-sided substrate.
  • the device manufacturing system 1001 repeatedly executes various processes for manufacturing one device on the substrate P.
  • the substrate P that has been subjected to various types of processing is divided (diced) for each device to form a plurality of devices.
  • the dimension in the width direction (short direction) is about 1 m to 2 m
  • the dimension in the length direction (long direction) is 10 m or more.
  • substrate P is suitably set according to the dimension etc. of the device to manufacture.
  • the dimension of the substrate P may be 1 m or less or 2 m or more in the width direction, or may be 10 m or less in the longitudinal direction.
  • the substrate P when it is a multi-sided substrate, it may be a single band-shaped substrate or a substrate in which a plurality of substrates are connected.
  • the device manufacturing system 1001 may manufacture devices using independent substrates for each device. In this case, the substrate P may be a substrate having a size corresponding to one device.
  • the substrate supply apparatus 1002 of this embodiment supplies the substrate P to the processing apparatus 1003 by feeding out the substrate P wound around the supply roll 1006.
  • the substrate supply apparatus 1002 includes, for example, a shaft around which the substrate P is wound, a rotation drive unit that rotates the shaft, and the like.
  • the substrate P is transported in the longitudinal direction and sent to the processing apparatus 1003. That is, in the present embodiment, the transport direction of the substrate P is substantially the same as the longitudinal direction of the substrate P.
  • the substrate supply device 1002 may include a cover portion that covers the substrate P wound around the supply roll 1006. Further, the substrate supply apparatus 1002 may include a mechanism for sequentially feeding the substrates P in the longitudinal direction, such as a nip type driving roller.
  • the substrate recovery apparatus 1004 of this embodiment recovers the substrate P by winding the substrate P that has passed through the processing apparatus 1003 around a recovery roll 1007.
  • the substrate recovery apparatus 1004 includes, for example, a shaft portion around which the substrate P is wound, a rotation drive portion that rotates the shaft portion, a cover portion that covers the substrate P wound around the recovery roll 1007, and the like. including.
  • the processed substrate P may be cut by a cutting device, and the substrate collecting device 1004 may collect the cut substrate.
  • the substrate recovery apparatus 1004 may be an apparatus that collects and recovers the cut substrates.
  • the cutting apparatus may be a part of the processing apparatus 1003, or may be a separate apparatus from the processing apparatus 1003.
  • the cutting apparatus may be a part of the substrate recovery apparatus 1004.
  • the processing apparatus 1003 transports the substrate P supplied from the substrate supply apparatus 1002 to the substrate recovery apparatus 1004 and processes the surface to be processed of the substrate P during the transport process.
  • the processing apparatus 1003 includes a processing apparatus 1010 that performs processing on the surface to be processed of the substrate P, and a transport apparatus 1009 including a transport roller 1008 that sends the substrate P under conditions corresponding to the processing.
  • the processing apparatus 1010 includes one or more apparatuses that perform various processes for forming elements constituting the device on the surface to be processed of the substrate P.
  • apparatuses for performing various processes are appropriately provided along the transport path of the substrate P, and devices such as a flexible display can be produced by a so-called roll-to-roll method. According to the roll-to-roll method, devices can be produced efficiently.
  • various apparatuses of the processing apparatus 1010 include a film forming apparatus, an exposure apparatus, a coater developer apparatus, and an etching apparatus.
  • the film forming apparatus include a plating apparatus, a vapor deposition apparatus, and a sputtering apparatus.
  • the film forming apparatus forms a functional film such as a conductive film, a semiconductor film, or an insulating film on the substrate P.
  • the coater / developer apparatus forms a photosensitive material such as a photoresist film on a substrate P on which a functional film is formed by a film forming apparatus.
  • the exposure apparatus performs an exposure process on the substrate P by projecting an image of a pattern corresponding to the film pattern constituting the device onto the substrate P on which the photosensitive material is formed.
  • the coater / developer apparatus develops the exposed substrate P.
  • the etching apparatus etches the functional film using the developed photosensitive material of the substrate P as a mask M. In this way, the processing apparatus 1010 forms a functional film having a desired pattern on the substrate P.
  • the processing apparatus 1010 may include an apparatus that directly forms a film pattern without using etching, such as an imprint film formation apparatus or a droplet discharge apparatus. At least one of the various apparatuses of the processing apparatus 1010 may be omitted.
  • the host control device 1005 controls the substrate supply device 1002 to cause the substrate supply device 1002 to execute a process of supplying the substrate P to the processing apparatus 1010.
  • the host controller 1005 controls the processing apparatus 1010 to cause the processing apparatus 1010 to execute various processes on the substrate P.
  • the host controller 1005 controls the substrate recovery apparatus 1004 to cause the substrate recovery apparatus 1004 to execute a process of recovering the substrate P on which the processing apparatus 1010 has performed various processes.
  • FIG. 2 is a diagram showing the overall configuration of the substrate processing apparatus 1011 of the present embodiment.
  • a substrate processing apparatus 1011 shown in FIG. 2 is at least a part of the processing apparatus 1010 as described above.
  • the substrate processing apparatus 1011 of the present embodiment includes an exposure apparatus EX that performs an exposure process and at least a part of the transfer apparatus 1009.
  • the exposure apparatus EX of the present embodiment is a so-called scanning exposure apparatus, and is formed on the mask M while synchronously driving the rotation of the cylindrical mask (cylindrical mask) M and the feeding of the flexible substrate P.
  • the pattern image is projected onto the substrate P via the projection optical system PL (PL1001 to PL1006) having a projection magnification of equal magnification ( ⁇ 1).
  • the Y axis of the orthogonal coordinate system XYZ is set parallel to the rotation center line (first center line) AX1001 of the cylindrical mask M, and the X axis is the direction of scanning exposure, that is, The transport direction of the substrate P at the exposure position is set.
  • the exposure apparatus EX includes a mask holding device 1012, an illumination device 1013, a projection optical system PL, and a control device 1014.
  • the substrate processing apparatus 1011 rotates and moves the mask M held by the mask holding apparatus 1012 and transfers the substrate P by the transfer apparatus 1009.
  • the illuminating device 1013 illuminates a part of the mask M (illumination region IR) held by the mask holding device 1012 with uniform brightness using the illumination light beam EL1.
  • the projection optical system PL projects the image of the pattern in the illumination area IR on the mask M onto a part of the substrate P (projection area PA) being transported by the transport device 1009.
  • the control device 1014 controls each part of the exposure apparatus EX and causes each part to execute processing. In the present embodiment, the control device 1014 controls at least a part of the transport device 1009.
  • control device 1014 may be a part or all of the host control device 1005 of the device manufacturing system 1001.
  • the control device 1014 may be a device that is controlled by the host control device 1005 and is different from the host control device 1005.
  • the control device 1014 includes, for example, a computer system.
  • the computer system includes, for example, a CPU, various memories, an OS, and hardware such as peripheral devices.
  • the operation process of each unit of the substrate processing apparatus 1011 is stored in a computer-readable recording medium in the form of a program, and various processes are performed by the computer system reading and executing this program.
  • the computer system can be connected to the Internet or an intranet system, it also includes a homepage providing environment (or display environment).
  • Computer-readable recording media include portable media such as flexible disks, magneto-optical disks, ROMs, CD-ROMs, and storage devices such as hard disks built into computer systems.
  • a computer-readable recording medium is one that dynamically holds a program for a short time, such as a communication line when transmitting a program via a network such as the Internet or a communication line such as a telephone line. Some of them hold programs for a certain period of time, such as volatile memory inside computer systems that serve as servers and clients.
  • the program may be a program for realizing a part of the functions of the substrate processing apparatus 1011 or a program that can realize the functions of the substrate processing apparatus 1011 in combination with a program already recorded in the computer system.
  • the host control device 1005 can be realized using a computer system in the same manner as the control device 1014.
  • FIG. 3 is a diagram illustrating the configuration of the mask holding device 1012
  • FIG. 4 is a diagram illustrating the configuration of the first drum member 1021 and the illumination optical system IL.
  • the mask holding device 1012 includes a first member that holds the mask M (hereinafter referred to as a first drum member 1021), a guide roller 1023 that supports the first drum member 1021, and a first member.
  • a driving roller 1024 for driving the drum member 1021, a first detector 1025 for detecting the position of the first drum member 1021, and a first driving unit 1026 are provided.
  • the first drum member 1021 forms a first surface p1001 on which the illumination region IR on the mask M is arranged.
  • the first surface p1001 includes a surface (hereinafter referred to as a cylindrical surface) obtained by rotating a line segment (bus line) around an axis (first central axis AX1001) parallel to the line segment.
  • the cylindrical surface is, for example, an outer peripheral surface of a cylinder, an outer peripheral surface of a column, or the like.
  • the first drum member 1021 is made of, for example, glass or quartz and has a cylindrical shape having a certain thickness, and an outer peripheral surface (cylindrical surface) forms the first surface p1001.
  • the illumination area IR on the mask M is curved in a cylindrical surface shape having a constant radius r1001 (see FIG. 1) from the rotation center line AX1001.
  • the light beam EL1001 has translucency.
  • the mask M is created as a transmission type planar sheet mask in which a pattern is formed with a light-shielding layer such as chrome on one surface of a strip-shaped ultrathin glass plate having a good flatness (for example, a thickness of 100 to 500 ⁇ m), It is used in a state in which it is curved along the outer peripheral surface of the first drum member 21 and wound (attached) around this outer peripheral surface.
  • the mask M has a pattern non-formation region in which no pattern is formed, and is attached to the first drum member 1021 in the pattern non-formation region. The mask M can be removed (released) from the first drum member 1021.
  • the mask M is made of chromium or the like directly on the outer peripheral surface of the first drum member 1021 made of the transparent cylindrical base material.
  • a mask pattern by the light shielding layer may be drawn and integrated.
  • the first drum member 1021 functions as a support member for the mask (first object).
  • the first drum member 1021 may have a structure in which a thin plate-like mask M is attached to the inner peripheral surface thereof by being curved.
  • the mask M may be formed with all or part of a panel pattern corresponding to one display device, or may be formed with a panel pattern corresponding to a plurality of display devices.
  • a plurality of panel patterns may be repeatedly arranged in the circumferential direction around the first central axis AX1001 on the mask M, or a small panel pattern may be repeated in a direction parallel to the first central axis AX1001. A plurality of them may be arranged.
  • the mask M may include a panel pattern for the first display device and a panel pattern for a second display device that is different in size and the like from the first display device.
  • the guide roller 1023 and the driving roller 1024 shown in FIG. 3 extend in the Y-axis direction parallel to the first central axis AX1001 of the first drum member 1021.
  • the guide roller 1023 and the driving roller 1024 are provided to be rotatable around an axis parallel to the first central axis AX1001.
  • Each of the guide roller 1023 and the drive roller 1024 has an outer diameter at the end portion in the axial direction larger than the outer shape of the other portion, and this end portion circumscribes the first drum member 1021.
  • the guide roller 1023 and the driving roller 1024 are provided so as not to contact the mask M held by the first drum member 1021.
  • the driving roller 1024 is connected to the first driving unit 1026.
  • the drive roller 1024 rotates the first drum member 1021 around the first central axis AX1001 by transmitting the torque supplied from the first drive unit 1026 to the first drum member 1021.
  • the mask holding device 1012 includes one guide roller 1023 and one drive roller 1024, but the number of guide rollers 1023 may be two or more, and the number of drive rollers 1024 may be two or more. At least one of the guide roller 1023 and the driving roller 1024 is disposed inside the first drum member 1021 and may be inscribed in the first drum member 1021. Further, portions of the first drum member 1021 that do not overlap with the pattern of the mask M when viewed from the radial direction of the first drum member 1021 (both ends in the Y-axis direction) have translucency with respect to the illumination light beam EL1. Or may not have translucency.
  • one or both of the guide roller 1023 and the driving roller 1024 may have a truncated cone shape, for example, and the central axis (rotating axis) thereof may be non-parallel to the first central axis AX1001.
  • the first detector 1025 optically detects the rotational position of the first drum member 1021.
  • the first detector 1025 includes, for example, a rotary encoder.
  • the first detector 1025 supplies information indicating the detected rotational position of the first drum member 1021 to the control device 1014.
  • the first drive unit 1026 including an actuator such as an electric motor adjusts the torque for rotating the drive roller 1024 in accordance with a control signal supplied from the control device 1014.
  • the control device 1014 controls the rotational position of the first drum member 1021 by controlling the first drive unit 1026 based on the detection result of the first detector 1025. In other words, the control device 1014 controls one or both of the rotational position and the rotational speed of the mask M held by the first drum member 1021.
  • a sensor that optically measures the position of the first drum member 1021 in the Y-axis direction in FIG. 3 may be added to the first detector 1025.
  • the position of the first drum member 1021 shown in FIG. 2 and FIG. 3 in the Y direction is basically constrained so as not to fluctuate, but the exposure area on the substrate P, the alignment mark, and the pattern of the mask M are relative to each other. It is conceivable to incorporate a mechanism (actuator) for finely moving the first drum member 1021 (mask M) in the Y direction for proper alignment. In such a case, the Y-direction fine movement mechanism of the first drum member 1021 can be controlled using measurement information from the Y-direction position measurement sensor.
  • the transport device 1009 includes a first support roller 1030, a first guide member 1031 and a second support member (hereinafter referred to as a first support member) that forms a second surface p1002 on which the projection area PA on the substrate P is disposed. 2 drum member 1022), a second guide member 1033, a second transport roller 1034, a second detector 1035, and a second drive unit 1036.
  • the transport roller 1008 illustrated in FIG. 1 includes a first transport roller 1030 and a second transport roller 1034.
  • the substrate P that has been transported from the upstream of the transport path to the first transport roller 1030 is transported to the first guide member 1031 via the first transport roller 1030.
  • the substrate P that has passed through the first guide member 1031 is supported on the surface of a cylindrical or columnar second drum member (cylindrical body) 1022 having a radius r1002, and is conveyed to the second guide member 1033.
  • the substrate P that has passed through the second guide member 1033 is transported downstream of the transport path via the second transport roller 1034.
  • the rotation center line (second center line) AX1002 of the second drum member 1022 and the rotation center lines of the first conveyance roller 1030 and the second conveyance roller 1034 are all parallel to the Y axis. Is set.
  • the first guide member 1031 and the second guide member 1033 move, for example, in the direction intersecting the width direction of the substrate P (move in the XZ plane in FIG. 2), and thereby tension acting on the substrate P in the transport path, etc. Adjust. Further, the first guide member 1031 (and the first transport roller 1030) and the second guide member 1033 (and the second transport roller 1034) are configured to be movable in the width direction (Y direction) of the substrate P, for example. Thus, the position in the Y direction of the substrate P wound around the outer periphery of the second drum member 1022 can be adjusted.
  • the transfer device 1009 only needs to be able to transfer the substrate P along the projection area PA of the projection optical system PL, and the configuration thereof can be changed as appropriate.
  • the second drum member 1022 forms a second surface p1002 that supports a part including the projection area PA on the substrate P onto which the imaging light beam from the projection optical system PL is projected in an arc shape.
  • the second drum member 1022 is a part of the transport apparatus 1009 and also serves as a support member (substrate stage) that supports the substrate P to be exposed. That is, the second drum member 1022 may be a part of the exposure apparatus EX.
  • the second drum member 1022 is rotatable around its central axis (hereinafter referred to as a second central axis AX1002), and the substrate P is a cylindrical surface along the outer peripheral surface (cylindrical surface) on the second drum member 1022.
  • the projection area PA is arranged in a part of the curved portion.
  • the radius r1001 of the portion of the outer peripheral surface of the first drum member 1021 around which the mask M is wound and the radius r1002 of the portion of the outer peripheral surface of the second drum member 1022 around which the substrate P is wound are: It is set substantially the same. This is because it is assumed that the thickness of the thin plate-like mask M and the thickness of the substrate P are substantially equal. On the other hand, for example, when a pattern is formed directly on the outer peripheral surface of the first drum member 1021 (transmission cylindrical base material) with a chromium layer or the like, the thickness of the chromium layer can be ignored, so the radius of the pattern surface of the mask remains r1001.
  • the radius of the surface of the substrate P in the projection area PA is r1002 + 200 ⁇ m.
  • the radius r1002 of the portion around which the substrate P is wound on the outer peripheral surface of the second drum member 1022 may be reduced by the thickness of the substrate P. Therefore, in order to set the conditions strictly, the radius of the pattern surface (cylindrical surface) of the mask supported on the outer peripheral surface of the first drum member 1021 is the substrate supported on the outer peripheral surface of the second drum member 1022.
  • Each radius of the first drum member 1021 and the second drum member 1022 may be determined so as to be equal to the radius of the surface of P.
  • the second drum member 1022 is rotated by torque supplied from the second drive unit 1036 including an actuator such as an electric motor.
  • the second detector 1035 includes, for example, a rotary encoder or the like, and optically detects the rotational position of the second drum member 1022.
  • the second detector 1035 supplies information indicating the detected rotational position of the second drum member 1022 to the control device 1014.
  • the second drive unit 1036 adjusts the torque for rotating the second drum member 1022 in accordance with the control signal supplied from the control device 1014.
  • the control device 1014 controls the rotational position of the second drum member 1022 by controlling the second driving unit 1036 based on the detection result of the second detector 1035, and the first drum member 1021 and the second drum member 1022 are controlled. Are moved synchronously (synchronous rotation).
  • the control device 1014 controls the second drive unit 1036 so that the rotational speed unevenness of the second drum member 1022 becomes extremely small.
  • a plane including the first central axis AX1001 of the first drum member 1021 and the second central axis AX1002 of the second drum member 1022 is a central plane p1003 (parallel to the YZ plane)
  • the central plane p1003 In the vicinity of the position where the first surface p1001 intersects with the cylindrical surface, the center surface p1003 and the first surface p1001 are approximately orthogonal to each other.
  • the center surface p1003 and the second cylindrical surface p1002 In the vicinity of the position where the two intersect, the center plane p1003 and the second plane p1002 are approximately orthogonal to each other.
  • the exposure apparatus EX of the present embodiment is an exposure apparatus that is assumed to be equipped with a so-called multi-lens projection optical system.
  • the projection optical system PL includes a plurality of projection modules that project some images in the pattern of the mask M.
  • three projection modules (projection optical systems) PL1001, PL1003, and PL1005 are arranged at regular intervals in the Y direction on the left side of the center plane p1003, and three projection modules (projection optics) are also arranged on the right side of the center plane p1003.
  • System) PL1002, PL1004, and PL1006 are arranged at regular intervals in the Y direction.
  • the end portions in the Y direction of the areas exposed by the plurality of projection modules PL1001 to PL1006 are overlapped with each other by scanning to form a desired pattern. Project the whole picture.
  • the projection module and the illumination corresponding thereto Since it is only necessary to add modules on the apparatus 1013 side in the Y direction, there is an advantage that it can be easily applied to an increase in panel size (width of the substrate P).
  • the exposure apparatus EX may not be a multi-lens system.
  • the exposure apparatus EX may project an image of the full width of the pattern onto the substrate P by one projection module.
  • each of the plurality of projection modules PL1001 to PL1006 may project a pattern corresponding to one device. That is, the exposure apparatus EX may project a plurality of device patterns in parallel by a plurality of projection modules.
  • the illumination device 1013 of this embodiment includes a light source device (not shown) and an illumination optical system IL.
  • the illumination optical system IL includes a plurality (for example, six) of illumination modules IL1001 to IL1006 arranged in the Y-axis direction corresponding to each of the plurality of projection modules PL1001 to PL1006.
  • the light source device includes a lamp light source such as a mercury lamp, or a solid light source such as a laser diode or a light emitting diode (LED).
  • Illumination light emitted from the light source device includes, for example, bright lines (g-line, h-line, i-line) emitted from a lamp light source, far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (Wavelength 193 nm).
  • the illumination light emitted from the light source device has a uniform illuminance distribution and is distributed to a plurality of illumination modules IL1001 to IL1006 via a light guide member such as an optical fiber.
  • the light source device may be disposed inside the first drum member 1021 or may be disposed outside the first drum member 1021. Further, the light source device may be a device (external device) different from the exposure device EX.
  • Each of the plurality of illumination modules IL1001 to IL1006 includes a plurality of optical members such as lenses.
  • the light emitted from the light source device and passing through any of the plurality of illumination modules IL1001 to IL1006 is referred to as an illumination light beam EL1.
  • Each of the plurality of illumination modules IL1001 to IL1006 includes, for example, an integrator optical system, a rod lens, a fly-eye lens, and the like, and illuminates the illumination region IR with an illumination light beam EL1 having a uniform illuminance distribution.
  • the plurality of illumination modules IL1001 to IL1006 are arranged inside the first drum member 1021.
  • Each of the plurality of illumination modules IL1001 to IL1006 passes through the first drum member 1021 from the inside of the first drum member 1021, passes through each illumination region IR (IR1001 to IR1001 to IR1001) on the mask M held on the outer peripheral surface of the first drum member 1021. Illuminate IR1006).
  • the lighting modules are arranged in the order from the ⁇ Y side (front side of the paper in FIG. 2) to the + Y side (back side of the paper in FIG. 2), the first lighting module IL1001, the second lighting module IL1002, and the third lighting module.
  • the illumination module IL1003, the fourth illumination module IL1004, the fifth illumination module IL1005, and the sixth illumination module IL1006 are referred to. That is, among the plurality of illumination modules IL1001 to IL1006, the first illumination module IL1001 is disposed on the most ⁇ Y side, and the sixth illumination module IL1006 is disposed on the most + Y side.
  • the number of projection modules included in the projection optical system PL may be 1 or more and 5 or less, or 7 or more.
  • the plurality of illumination modules IL1001 to IL1006 are arranged apart from each other so as not to interfere with each other in the direction intersecting the first central axis AX1001 (for example, the X-axis direction).
  • the first illumination module IL1001, the third illumination module IL1003, and the fifth illumination module IL1005 are arranged at positions overlapping each other when viewed from the Y-axis direction.
  • the first illumination module IL1001, the third illumination module IL1003, and the fifth illumination module IL1005 are arranged away from each other in the Y-axis direction.
  • the second illumination module IL1002 is disposed symmetrically with the first illumination module IL1001 with respect to the center plane p1003 when viewed from the Y-axis direction.
  • the fourth illumination module IL1004 and the sixth illumination module IL1006 are arranged at a position overlapping the second illumination module IL1002 when viewed from the Y-axis direction.
  • the second illumination module IL1002, the fourth illumination module IL1004, and the sixth illumination module IL1006 are arranged away from each other in the Y-axis direction.
  • Each of the plurality of illumination modules IL1001 to IL1006 is arranged in a first radial direction D1001 or a second radial direction D1002 that intersects the central plane p1003 in the radial direction (radial direction) with respect to the first central axis AX1001 of the first drum member 1021.
  • Irradiation light beam EL1 is directed toward it.
  • the irradiation direction of the illumination light beam EL1 of each illumination module changes alternately in the order in which the illumination modules are arranged in the Y-axis direction.
  • the irradiation direction of the illumination light beam from the first illumination module IL1 (first radial direction D1001) is inclined to the ⁇ X side with respect to the Z-axis direction
  • the irradiation direction of the illumination light beam from the second illumination module IL1002 (the first radial direction D1001).
  • the two radial directions D1002) are inclined to the + X side with respect to the ⁇ Z axis direction.
  • the irradiation direction of the illumination light beam from each of the third illumination module IL1003 and the fifth illumination module IL1005 is substantially parallel to the irradiation direction of the first illumination module IL1001, and the fourth illumination module IL1004 and the sixth illumination module IL1004.
  • the irradiation direction of the illumination light beam from each of the illumination modules IL1006 is substantially parallel to the irradiation direction of the second illumination module IL1002.
  • FIG. 5 is a diagram showing the arrangement of the illumination area IR and the projection area PA in the present embodiment.
  • FIG. 5 is a plan view of the illumination area IR on the mask M arranged on the first drum member 1021 as viewed from the ⁇ Z side (the left figure in FIG. 5) and the second drum member 1022.
  • a plan view (right view in FIG. 5) of the projection area PA on the substrate P viewed from the + Z side is shown.
  • a symbol Xs in FIG. 5 indicates the moving direction (rotating direction) of the first drum member 1021 or the second drum member 1022.
  • the first to sixth illumination modules IL1001 to IL1006 illuminate the first to sixth illumination regions IR1001 to IR1006 on the mask M, respectively.
  • the first illumination module IL1001 illuminates the first illumination region IR1001
  • the second illumination module IL1002 illuminates the second illumination region IR1002.
  • the first illumination region IR1001 in the present embodiment will be described as a trapezoidal region elongated in the Y direction, but depending on the configuration of the projection optical system (projection module) PL described later, a rectangular region including this trapezoidal region. It is also good.
  • the third illumination region IR1003 and the fifth illumination region IR1005 are regions having the same shape as the first illumination region IR1001, respectively, and are arranged with a certain interval in the Y-axis direction.
  • the second illumination region IR1002 is a trapezoidal (or rectangular) region symmetrical to the first illumination region IR1001 with respect to the center plane p1003.
  • the fourth illumination region IR1004 and the sixth illumination region IR1006 are regions having the same shape as the second illumination region IR1002, respectively, and are arranged at a constant interval in the Y-axis direction.
  • each of the first to sixth illumination regions IR1001 to IR1006 has a triangular portion on the hypotenuse of adjacent trapezoidal illumination regions when viewed along the circumferential direction of the first surface p1001. They are arranged so that they overlap (overlapping). Therefore, for example, the first region A1001 on the mask M that passes through the first illumination region IR1001 by the rotation of the first drum member 1021 is on the mask M that passes through the second illumination region IR1002 by the rotation of the first drum member 1021. It partially overlaps with the second area A1002.
  • the mask M has a pattern formation region A1003 where a pattern is formed and a pattern non-formation region A1004 where a pattern is not formed.
  • the pattern non-formation region A1004 is arranged so as to surround the pattern formation region A1003 in a frame shape, and has a characteristic of shielding the illumination light beam EL1.
  • the pattern formation area A1003 of the mask M moves in the direction Xs with the rotation of the first drum member 1021, and the partial areas in the Y-axis direction of the pattern formation area A1003 are first to sixth illumination areas IR1001 to IR1001. Pass through any of IR1006.
  • the first to sixth illumination regions IR1001 to IR1006 are arranged so as to cover the entire width of the pattern formation region A1003 in the Y-axis direction.
  • the projection optical system PL includes a plurality of projection modules PL1001 to PL1006 arranged in the Y-axis direction.
  • Each of the plurality of projection modules PL1001 to PL1006 has a one-to-one correspondence with each of the first to sixth illumination modules IL1006, and a portion of the mask M that appears in the illumination region IR illuminated by the corresponding illumination module.
  • An image of a simple pattern is projected onto each projection area PA on the substrate P.
  • the first projection module PL1001 corresponds to the first illumination module IL1001, and an image of the pattern of the mask M in the first illumination region IR1001 (see FIG. 5) illuminated by the first illumination module IL1001 is displayed on the substrate P. Projecting to the first projection area PA1001.
  • the third projection module PL1003 and the fifth projection module PL1005 correspond to the third illumination module IL1003 and the fifth illumination module IL1005, respectively.
  • the third projection module PL1003 and the fifth projection module PL1005 are arranged at positions overlapping the first projection module PL1001 when viewed from the Y-axis direction.
  • the second projection module PL1002 corresponds to the second illumination module IL1002, and an image of the pattern of the mask M in the second illumination region IR1002 (see FIG. 5) illuminated by the second illumination module IL1002 is displayed on the substrate P. Projecting to the second projection area PA1002. When viewed from the Y-axis direction, second projection module PL1002 is arranged at a symmetrical position with respect to first projection module PL1001 with center plane p1003 interposed therebetween.
  • the fourth projection module PL1004 and the sixth projection module PL1006 are arranged corresponding to the fourth illumination module IL1004 and the sixth illumination module IL1006, respectively.
  • the fourth projection module PL1004 and the sixth projection module PL1006 are arranged from the Y-axis direction. As seen, the second projection module PL1002 is disposed at a position overlapping it.
  • the light reaching the illumination areas IR1001 to IR1006 on the mask M from the illumination modules IL1001 to IL1006 of the illumination device 1013 is used as the illumination light beam EL1, and the portion of the mask M that appears in the illumination areas IR1001 to IR1006.
  • the light that has undergone intensity distribution modulation according to the pattern and enters the projection modules PL1001 to PL1006 and reaches the projection areas PA1001 to PA1006 is defined as an imaging light beam EL2.
  • the pattern image in the first illumination area IR1001 is projected onto the first projection area PA1001
  • the pattern image in the third illumination area IR1003 is projected onto the third projection area PA1003
  • the pattern image in the fifth illumination area IR1005 is projected onto the fifth projection area PA1005.
  • the first projection area PA1001, the third projection area PA1003, and the fifth projection area PA1005 are arranged in a line in the Y-axis direction.
  • the pattern image in the second illumination area IR1002 is projected onto the second projection area PA1002.
  • the second projection area PA1002 is arranged symmetrically with the first projection area PA1001 with respect to the center plane p1003 when viewed from the Y-axis direction.
  • the pattern image in the fourth illumination area IR1004 is projected onto the fourth projection area PA1004, and the pattern image in the sixth illumination area IR1006 is projected onto the sixth projection area PA1006.
  • the second projection area PA1002, the fourth projection area PA1004, and the sixth projection area PA1006 are arranged in a line in the Y-axis direction.
  • the first projection area PA1001 and the second projection area PA1002 are set so that the exposure amount in the region where the third region A1005 and the fourth region A1006 overlap is substantially the same as the exposure amount in the non-overlapping region.
  • the shape etc. are set.
  • an exposure target region (hereinafter referred to as an exposure region A1007) on the substrate P moves in the direction Xs as the second drum member 1022 rotates as shown in the right diagram in FIG.
  • Each partial region in the Y-axis direction in the region A1007 passes through any of the first to sixth projection regions PA1001 to PA1006.
  • the first to sixth projection areas PA1001 to PA1006 are arranged so as to cover the entire width of the exposure area A1007 in the Y-axis direction.
  • the irradiation direction of the illumination light beam EL1 with respect to the first projection module PL1001 may be, for example, the traveling direction of the principal ray passing through any position in the first illumination region IR1001, or the principal passing through the center of the first illumination region IR1001.
  • the traveling direction of the light beam may be used. The same applies to the irradiation direction of the illumination light beam EL1 on the second to sixth projection modules PL1002 to PL1006.
  • the first to sixth projection areas PA1001 to PA1006 may be arranged so that areas on the substrate P passing through any one of them do not overlap with each other at the end portions.
  • the third area A1005 passing through the first projection area PA1001 may not partially overlap the fourth area A1006 passing through the second projection area PA1002. That is, even with the multi-lens method, it is possible not to perform joint exposure by each projection module.
  • the third area A1005 is an area where a pattern corresponding to the first device is projected
  • the fourth area A1006 is an area where a pattern corresponding to the second device is projected. Good.
  • Said 2nd device is a device of the same kind as a 1st device, Comprising: The same pattern as 3rd area
  • the second device may be a different type of device from the first device, and a pattern different from the third region A1005 may be projected onto the fourth region A1006.
  • each of the second to sixth projection modules PL1001 to PL1006 has the same configuration as that of the first projection module PL1001. Therefore, the configuration of the first projection module PL1001 will be described on behalf of the projection optical system PL.
  • the first projection module PL1001 shown in FIG. 6 is formed by the first optical system 1041 and the first optical system 1041 that form an image of the pattern of the mask M arranged in the first illumination region IR1001 on the intermediate image plane p1007.
  • a second optical system 1042 that re-images at least a part of the intermediate image on the first projection area PA1001 of the substrate P, and a first field stop 1043 disposed on the intermediate image plane p1007 on which the intermediate image is formed.
  • the first projection module PL1001 has a focus correction optical member 1044 for finely adjusting the focus state of a mask pattern image (hereinafter referred to as a projection image) formed on the substrate P, and the projection image is very small in the image plane.
  • the focus correction optical member 1044 is disposed at a position where the imaging light beam EL2 emitted from the first illumination region IR1001 is incident, and the image shift correction optical member 1045 is incident with the imaging light beam EL2 emitted from the focus correction optical member 1044. Placed in position.
  • the magnification correcting optical member 1047 is disposed at a position where the imaging light beam EL2 emitted from the second optical system 1042 enters.
  • the imaging light beam EL2 from the pattern of the mask M exits from the first illumination region IR1001 in the normal direction and enters the image shift correction optical member 1045 through the focus correction optical member 1044.
  • the imaging light beam EL2 transmitted through the image shift correcting optical member 1045 is reflected by the first reflecting surface (planar mirror) p1004 of the first deflecting member 1050 that is an element of the first optical system 1041, and passes through the first lens group 1051.
  • the light is reflected by the first concave mirror 1052, passes through the first lens group 1051 again, is reflected by the second reflecting surface (plane mirror) p1005 of the first deflecting member 1050, and enters the first field stop 1043.
  • the imaging light beam EL2 that has passed through the first field stop 1043 is reflected by the third reflecting surface (planar mirror) p1008 of the second deflecting member 1057, which is an element of the second optical system 1042, and passes through the second lens group 1058 for the second.
  • the light is reflected by the second concave mirror 1059, passes through the second lens group 1058 again, is reflected by the fourth reflecting surface (plane mirror) p1009 of the second deflecting member 1057, and enters the magnification correcting optical member 1047.
  • the imaging light beam EL2 emitted from the magnification correcting optical member 1047 enters the first projection area PA1001 on the substrate P, and an image of the pattern appearing in the first illumination area IR1001 is equal to the first projection area PA1001 ( ⁇ Projected in 1).
  • the first optical system 1041 and the second optical system 1042 are, for example, telecentric catadioptric optical systems obtained by modifying a Dyson system.
  • the optical axis of the first optical system 1041 (hereinafter referred to as the first optical axis AX1003) is substantially orthogonal to the center plane p1003.
  • the first optical system 1041 includes a first deflecting member 1050, a first lens group 1051, and a first concave mirror 1052.
  • the imaging light beam EL2 emitted from the image shift correcting optical member 1045 is reflected by the first reflecting surface p1004 of the first deflecting member 1050 and travels toward one side ( ⁇ X side) of the first optical axis AX1003,
  • the light enters the first concave mirror 1052 disposed on the pupil plane through one lens group 1051.
  • the imaging light beam EL2 reflected by the first concave mirror 1052 travels to the other side (+ X side) of the first optical axis AX1003, passes through the first lens group 1051, and is reflected by the second reflecting surface p1005 of the first deflecting member 1050. Then, it enters the first field stop 1043.
  • the first deflection member 1050 is a triangular prism that extends in the Y-axis direction.
  • each of the first reflecting surface p1004 and the second reflecting surface p1005 includes a mirror surface (the surface of the reflecting film) formed on the surface of the triangular prism.
  • the principal ray EL3 of the imaging light beam EL2 passing through the center of the first illumination region IR1001 travels along the first radial direction D1001 inclined in the XZ plane with respect to the center plane p1003, and enters the first projection module PL1001. To do.
  • the first deflecting member 1050 includes a principal ray EL3 reaching the first reflecting surface p1004 from the first illumination region IR1001 and a principal ray EL3 (parallel to the center plane p1003) reaching the intermediate image plane p1007 from the second reflecting surface p1005.
  • the imaging light beam EL2 is deflected so as to be non-parallel (intersect) in the XZ plane.
  • the first deflecting member 1050 includes a ridge line where the first reflecting surface p1004 and the second reflecting surface p1005 intersect with the first optical axis AX1003, and an XY plane.
  • the parallel surface is designated as p1006
  • the first reflecting surface p1004 and the second reflecting surface p1005 are arranged at an asymmetric angle with respect to the surface p1006.
  • the angle ( ⁇ 1001 + ⁇ 1002) is set to be less than 90 °, and the angle ⁇ 1001 is 45.
  • the angle ⁇ 1002 is set to substantially 45 °.
  • the principal ray EL3 is the center of the first concave mirror 1052, that is, the optical axis of the pupil plane. It can pass through the intersection with AX1003, and a telecentric imaging state can be secured.
  • the first reflecting surface p1004 is obtained.
  • each of the plurality of lenses belonging to the first lens group 1051 has an axisymmetric shape around the first optical axis AX1003.
  • the imaging light beam EL2 reflected by the first reflecting surface p1004 enters the first lens group 1051 from one side (+ Z side) with respect to the surface p1006.
  • the first concave mirror 1052 is disposed at or near the pupil plane of the first optical system 1041.
  • the principal ray EL3 of the imaging light beam EL2 that has passed through the first lens group 1051 is incident on the intersection of the first optical axis AX1003 and the first concave mirror 1052.
  • the imaging light beam EL2 reflected by the first concave mirror 1052 travels in the first lens group 1051 along a symmetric optical path with respect to the plane p1006 as compared to before entering the first concave mirror 1052.
  • the imaging light beam EL2 reflected by the first concave mirror 1052 is emitted from the other side ( ⁇ Z side) of the first lens group 1051, reflected by the second reflecting surface p1005 of the first deflecting member 1050, and the center surface p1003. Proceed along parallel principal ray EL3.
  • the first field stop 1043 has an opening that defines the shape of the first projection area PA1001. That is, the shape of the opening of the first field stop 1043 defines the shape of the first projection area PA1001. Therefore, as shown in FIG. 6, when the field stop 1043 can be arranged on the intermediate image plane p1007, the aperture shape of the field stop 1043 can be made trapezoidal as shown in the right figure of FIG. In this case, the shapes of the first to sixth illumination regions IR1001 to IR1006 do not have to be similar to the shapes (trapezoids) of the first to sixth projection regions PA1001 to PA1006. A rectangular shape including the trapezoidal shape of the aperture of the field stop 1043 can be used.
  • the second optical system 1042 has the same configuration as the first optical system 1041, and is provided symmetrically with the first optical system 1041 with respect to the intermediate image plane p1007 including the first field stop 1043.
  • the optical axis of the second optical system 1042 (hereinafter referred to as the second optical axis AX1004) is substantially orthogonal to the center plane p1003.
  • the second optical system 1042 includes a second deflecting member 1057, a second lens group 1058, and a second concave mirror 1059.
  • the imaging light beam EL2 emitted from the first optical system 1041 and passed through the first field stop 1043 is reflected by the third reflecting surface p1008 of the second deflecting member 1057, passes through the second lens group 1058, and the second concave mirror 1059. Is incident on.
  • the imaging light beam EL2 reflected by the second concave mirror 1059 is reflected again by the fourth reflecting surface p1009 of the second deflecting member 1057 through the second lens group 1058 and enters the magnification correcting optical member 1047.
  • the second deflection member 1057, the second lens group 1058, and the second concave mirror 1059 of the second optical system 1042 are the same as the first deflection member 1050, the first lens group 1051, and the first concave mirror 1052 of the first optical system 1041, respectively. It is.
  • the angle ⁇ 1003 formed by the third reflecting surface p1008 of the second deflecting member 1057 and the second optical axis AX1004 is substantially the same as the angle ⁇ 1002 formed by the second reflecting surface p1005 of the first deflecting member 1050 and the first optical axis AX1003. is there.
  • the angle ⁇ 1004 formed by the fourth reflecting surface p1009 of the second deflecting member 1057 and the second optical axis AX1004 is substantially the same as the angle ⁇ 1001 formed by the first reflecting surface p1004 of the first deflecting member 1050 and the first optical axis AX1003.
  • Each of the plurality of lenses belonging to the second lens group 1058 has an axisymmetric shape around the second optical axis AX1004.
  • the second concave mirror 1059 is disposed at or near the position of the pupil plane of the second optical system 1042.
  • the imaging light beam EL2 that has passed through the first field stop 1043 travels in the direction along the principal ray parallel to the center plane p1003 and enters the third reflecting surface (plane) p1008.
  • the inclination angle ⁇ 1003 of the third reflecting surface p1008 with respect to the second optical axis AX1004 (or the surface p1006 or the intermediate image surface p1007) of the second optical system 1042 is 45 ° in the XZ plane, and the imaging light beam EL2 reflected here is , And enters the upper half field of view of the second lens group 1058.
  • the principal ray EL3 of the imaging light beam EL2 incident on the second lens group 1058 is parallel to the second optical axis AX1004 and is incident on the intersection of the second optical axis AX1004 and the second concave mirror 1059.
  • the imaging light beam EL2 reflected by the second concave mirror 1059 travels symmetrically with respect to the second optical axis AX1004 as compared to before entering the second concave mirror 1059.
  • the imaging light beam EL2 reflected by the second concave mirror 1059 again passes through the lower half field of view of the second lens group 1058, is reflected by the fourth reflecting surface p1009 of the second deflecting member 1057, and intersects the center surface p1003. Proceed in the direction you want.
  • the traveling direction of the principal ray EL3 of the imaging light beam EL2 emitted from the second optical system 1042 toward the first projection area PA1001 is first from the first illumination area IR1001 with respect to the intermediate image plane p1007 including the first field stop 1043. It is set symmetrically with the traveling direction of the principal ray EL3 of the imaging light beam EL2 incident on the optical system 1041. That is, when viewed in the XZ plane, the angle ⁇ 1004 of the fourth reflecting surface p1009 of the second deflecting member 1057 with respect to the second optical axis AX1004 satisfies the following formula (2), as in the previous formula (1). Is set as follows.
  • the focus correction optical member 1044, the image shift correction optical member 1045, the rotation correction mechanism 1046, and the magnification correction optical member 1047 constitute an image formation characteristic adjustment mechanism that adjusts the image formation characteristic of the first projection module PL1001.
  • the projection conditions here include one or more items of the translation position, rotation position, magnification, and focus of the projection area on the substrate P.
  • the projection condition can be determined for each position of the projection area with respect to the substrate P at the time of synchronous scanning.
  • By adjusting the projection condition of the projection image it is possible to correct the distortion of the projection image when compared with the pattern of the mask M.
  • the configuration of the imaging characteristic adjusting mechanism can be changed as appropriate, and at least a part thereof can be omitted.
  • the focus correction optical member 1044 is formed by, for example, superposing two wedge-shaped prisms in opposite directions (reverse directions in the X direction in FIG. 6) so as to form a transparent parallel plate as a whole. By sliding the pair of prisms in the direction of the slope without changing the distance between the faces facing each other, the thickness of the parallel plate is made variable. As a result, the effective optical path length of the first optical system 1041 is finely adjusted, and the focus state of the pattern image formed on the intermediate image plane p1007 and the projection area PA1001 is finely adjusted.
  • the image shift correction optical member 1045 is composed of a transparent parallel flat glass that can be tilted in the XZ plane in FIG. 6 and a transparent parallel flat glass that can be tilted in a direction perpendicular thereto. By adjusting the respective tilt amounts of the two parallel flat glass plates, the pattern image formed on the intermediate image plane p1007 and the projection area PA1001 can be slightly shifted in the X direction or the Y direction.
  • magnification correcting optical member 1047 for example, a concave lens, a convex lens, and a concave lens are arranged coaxially at a predetermined interval, the front and rear concave lenses are fixed, and the convex lens between them is moved in the optical axis (principal ray) direction. It is configured. As a result, the pattern image formed in the projection area PA1001 is isotropically enlarged or reduced by a minute amount while maintaining a telecentric imaging state.
  • the optical axes of the three lens groups constituting the magnification correcting optical member 1047 are tilted in the XZ plane so as to be parallel to the tilted principal ray EL3 passing therethrough.
  • the rotation correction mechanism 1046 is a mechanism that slightly rotates the first deflecting member 1050 around an axis parallel to the first optical axis AX1003 by an actuator (not shown), for example.
  • the rotation correction mechanism 1046 can slightly rotate the pattern image formed on the intermediate image plane p1007 within the intermediate image plane p1007.
  • the imaging light beam EL2 emitted from the first projection module PL1001 has a pattern that appears in the first illumination area IR1001 in the first projection area PA1001 of the substrate P disposed on the outer peripheral surface of the second drum member 1022.
  • the principal ray EL3 of the imaging light beam EL2 passing through the center of the first illumination area IR1001 exits from the first illumination area IR1001 in the normal direction, and from the normal direction to the first projection area PA1001.
  • the pattern image of the mask M appearing in the cylindrical surface-shaped first illumination region IR1001 is projected onto the first projection region PA1001 on the cylindrical surface-shaped substrate P.
  • the image of the pattern of the mask M appearing in each of the second to sixth illumination areas IR1002 to IR1006 is projected onto each of the second to sixth projection areas PA1002 to PA1006 on the cylindrical substrate P. Is done.
  • each of the six projection modules can have the same configuration, the components of the projection optical system can be shared, the assembly process and the inspection process are simplified, and the imaging characteristics (aberrations) of each projection module can be simplified.
  • Etc. can be evenly aligned. This means that the quality (transfer fidelity) of the panel pattern formed on the substrate P can be determined in the position and area in the panel, particularly when joint exposure is performed between the projection areas of the individual projection modules by the multi-lens method. It is advantageous in keeping it constant regardless of.
  • defocusing may occur depending on the position of the projection area, for example, when an imaging light beam enters from a direction non-perpendicular to the projection area. May grow. As a result, exposure failure may occur and a defective device may occur.
  • the first deflection member 1050 (first reflection surface p1004) and the second deflection member 1057 (fourth reflection surface p1009) of the projection optical system PL (for example, the first projection module PL1001) are the first illumination.
  • the principal ray EL3 is deflected so that the principal ray EL3 emitted in the normal direction from the region IR1001 is projected from the normal direction to the first projection region PA1001.
  • the substrate processing apparatus 1011 is configured so that the focus error of the projection image in the projection area PA1001, in particular, the entire best focus plane of the projection image in each of the projection areas PA1001 to PA1006 shown in FIG.
  • the deviation from the width of the depth of focus (Depth of Focus) of PL1006 can be reduced, and the occurrence of defective exposure or the like can be suppressed. As a result, the occurrence of defective devices by the device manufacturing system 1001 is suppressed.
  • the substrate processing apparatus 1011 can reduce, for example, the overlay error of the first to sixth projection areas PA1001 to PA1006, and the occurrence of exposure failure or the like is suppressed.
  • the second reflecting surface p1005 of the first deflecting member 1050 deflects the principal ray EL3 from the first illumination region IR1001 so as to be orthogonal to the field stop 1043. Therefore, the substrate processing apparatus 1011 can manage the shape and the like of the projected image with higher accuracy.
  • each of the first to sixth projection modules PL1001 to PL1006 projects the image of the pattern of the mask M as an erect image. Therefore, when the substrate processing apparatus 1011 projects the pattern of the mask M separately from the first to sixth projection modules PL1001 to PL1006, for example, the region on which the projection image is projected (for example, the third region A1005 and the fourth region). Since the joint exposure that partially overlaps A1006) is possible, the mask M can be easily designed.
  • the substrate processing apparatus 1011 increases the exposure processing productivity because the exposure apparatus EX exposes the substrate P while the transport apparatus 1009 continuously transports the substrate P along the second surface p1002 at a constant speed. be able to. As a result, the device manufacturing system 1001 can manufacture devices efficiently.
  • the first reflection surface p1004 and the second reflection surface p1005 are arranged on the surface of the same deflection member (first deflection member 1050), but may be arranged on the surfaces of different members. Good.
  • One or both of the first reflecting surface p1004 and the second reflecting surface p1005 are disposed on the inner surface of the first deflecting member 1050, and may have a characteristic that light is reflected by, for example, total reflection conditions.
  • the deformation related to the first reflection surface p1004 and the second reflection surface p1005 as described above can be applied to one or both of the third reflection surface p1008 and the fourth reflection surface p1009.
  • the fourth reflecting surface p1009 of the second deflecting member 1057 is such that the imaging light beam EL2 is incident on the first projection area PA1001 from the normal direction.
  • the angle ⁇ 1004 is set, and the arc-shaped perimeter between the center point of the first projection area PA1001 and the center point of the second projection area PA1002 is set in the corresponding illumination area IR1001 on the mask M (radius r1001).
  • the arrangement is set so as to coincide with the arcuate circumference between the center point and the center point of the illumination region IR1002.
  • FIG. 7 is a diagram showing a configuration of the substrate processing apparatus 1011 of the present embodiment.
  • the transport apparatus 1009 of this embodiment includes a first transport roller 1030, a first guide member (air turn bar, etc.) 1031, a fourth transport roller 1071, a fifth transport roller 1072, a sixth transport roller 1073, and a second guide.
  • a member (air turn bar or the like) 1033 and a second transport roller 1034 are provided.
  • the substrate P that has been transported from the upstream of the transport path to the first transport roller 1030 is transported to the first guide member 1031 via the first transport roller 1030.
  • the substrate P that has passed through the first guide member 1031 is transported to the fifth transport roller 1072 through the fourth transport roller 1071.
  • the fifth transport roller 1072 has a central axis disposed on the central plane p1003.
  • the substrate P that has passed through the fifth transport roller 1072 is transported to the second guide member 1033 via the sixth transport roller 1073.
  • the sixth transport roller 1073 is disposed symmetrically with the fourth transport roller 1071 with respect to the center plane p1003.
  • the substrate P that has passed through the second guide member 1033 is transported downstream of the transport path via the second transport roller 1034.
  • the first guide member 1031 and the second guide member 1033 adjust the tension acting on the substrate P in the transport path, similarly to the first guide member 1031 and the second guide member 1033 shown in FIG.
  • the first projection area PA1001 in FIG. 7 is set on the substrate P that is linearly transported between the fourth transport roller 1071 and the fifth transport roller 1072.
  • the substrate P is supported between the fourth transport roller 1071 and the fifth transport roller 1072 so that a predetermined tension is applied in the transport direction, and the substrate P is sent along the planar second surface p1002.
  • the first projection area PA1001 (second surface p1002) is inclined so as to be non-perpendicular to the center plane p1003.
  • the normal direction of the first projection area PA1001 (hereinafter referred to as the first normal direction D1003) is a plane perpendicular to the center plane p1003, for example, the first radial direction D1001 with respect to the intermediate image plane p1007 shown in FIG. Arranged symmetrically.
  • the principal ray EL3 of the imaging light beam EL2 emitted from the first projection module PL1001 is incident on the first projection area PA1001 from the first normal direction D1003.
  • the first normal direction D1003 of the substrate P spanned between the fourth transport roller 1071 and the fifth transport roller 1072 is symmetrical to the first radial direction D1001 with respect to the intermediate image plane p1007 orthogonal to the center plane p1003.
  • the 4th conveyance roller 1071 and the 5th conveyance roller 1072 are arrange
  • the second projection area PA1002 is set on the substrate P being transported between the fifth transport roller 1072 and the sixth transport roller 1073.
  • the substrate P is supported between the fifth transport roller 1072 and the sixth transport roller 1073 so that a constant tension is applied, and is sent along the planar second surface p1002.
  • the second projection area PA1002 is inclined so as to be non-perpendicular to the center plane p1003.
  • the normal direction (second normal direction D1004) of the second projection area PA1002 is symmetrical to the second radial direction D1002 with respect to the intermediate image plane p1007 orthogonal to the center plane p1003.
  • the principal ray EL3 of the imaging light beam EL2 emitted from the second projection module PL1002 enters the second projection area PA1002 from the second normal direction D1004.
  • the second normal direction D1004 of the substrate P spanned between the fifth transport roller 1072 and the sixth transport roller 1073 is symmetrical with the second radial direction D1002 with respect to the intermediate image plane p1007 orthogonal to the center plane p1003.
  • the 5th conveyance roller 1072 and the 6th conveyance roller 1073 are arrange
  • the substrate processing apparatus 1011 of the present embodiment approximates the cylindrical second surface p1002 shown in FIG. 2 by the fourth transport roller 1071, the fifth transport roller 1072, and the sixth transport roller 1073.
  • the transfer fidelity of the pattern image projected on the substrate P in each of the projection areas PA1001 to PA1006 is further improved from the viewpoint of the depth of focus (DOF).
  • DOF depth of focus
  • the overall height of the transport apparatus 1009 in the Z direction can be kept lower than when the second drum member 1022 having the radius r1002 is used to support and transport the substrate P.
  • the entire apparatus can be made small.
  • the fourth transport roller 1071, the fifth transport roller 1072, and the sixth transport roller 1073 are part of the transport apparatus 1009 and support members (supporting the substrate P to be exposed) It also serves as a substrate stage on the exposure apparatus EX side.
  • the bell nu is that supports the back side of the substrate P in a non-contact manner by a fluid bearing between the fourth transport roller 1071 and the fifth transport roller 1072 and between the fifth transport roller 1072 and the sixth transport roller 1073.
  • a type of pad plate may be provided to further improve the flatness of the partial area of the substrate P where the projection areas PA1001 to PA1006 are located.
  • At least one of the transport rollers of the transport apparatus 1009 shown in FIG. 7 may be fixed with respect to the projection optical system PL, or may be movable.
  • the fifth transport roller 1072 has three translation directions, ie, a translation direction parallel to the X-axis direction, a translation direction parallel to the Y-axis direction, and a translation direction parallel to the Z-axis direction, and an axis parallel to the X-axis direction.
  • At least one direction (one degree of freedom) among six directions (6 degrees of freedom), including a rotation direction of Y, a rotation direction around an axis parallel to the Y axis direction, and three rotation directions around an axis parallel to the Z axis direction ) May be slightly movable.
  • the first normal line of the first projection area PA1001 can be adjusted by finely adjusting the relative position of one or both of the fourth transport roller 1071 and the sixth transport roller 1073 with respect to the fifth transport roller 1072.
  • the angle formed by the direction D1003 or the second normal direction D1004 of the second projection area PA1002 and the surface of the planarized and supported substrate P can be finely adjusted.
  • the posture of the surface of the substrate P with respect to the pattern projection image plane in each of the projection areas PA1001 to PA1006 can be adjusted with high accuracy.
  • FIG. 8 shows the configuration of an exposure apparatus EX as the substrate processing apparatus 1011 of this embodiment, and the basic configuration is the same as that of FIG. However, compared to the configuration of FIG. 7, the angle ⁇ 1004 with respect to the optical axis AX1004 of the fourth reflecting surface p1009 of the second deflecting member 1057 provided in each of the projection modules PL1001 to PL1006 of the projection optical system PL is set to 45 °. The point is that the substrate P transported by the transport apparatus 1009 is supported so as to be a plane orthogonal to the center plane p1003 (parallel to the XY plane in FIG. 8) at the positions of the projection areas PA1001 to PA1006. Different.
  • the substrate P passes from the upstream of the transport path to the eighth transport roller 1076 via the first transport roller 1030, the first guide member 1031 (air turn bar, etc.), and the fourth transport roller 1071. Be transported.
  • the substrate P that has passed through the eighth transport roller 1076 is transported downstream of the transport path via the second guide member 1033 (air turn bar, etc.) and the second transport roller 1034.
  • the substrate P is supported and transported with a predetermined tension so as to be parallel to the XY plane.
  • the second surface p1002 on which the substrate P is supported is a flat surface, and the projection areas PA1001 to PA1006 are arranged in the second surface p1002.
  • the third reflecting surface p1008 and the fourth reflecting surface p1009 of the second deflecting member 1057 are imaged emitted from the second optical system 1042 to the substrate P.
  • the principal ray EL3 of the luminous flux EL2 is arranged so as to be substantially parallel to the center plane p1003.
  • the first deflecting member 1050 and the second deflecting member 1057 of the projection optical system PL receive the principal rays EL3 emitted in the normal direction from the cylindrical illumination regions IR1001 to IR1006, respectively.
  • the imaging optical path is deflected so as to enter the projection areas PA1001 to PA1006 set on a common plane from the normal direction.
  • the center point of the projection area PA1002 (and PA1004, PA1006) from the center point of the projection area PA1001 (and PA1003, PA1005).
  • the distance DFx along the second surface p1002 (the surface of the substrate P) until the first surface p1001 from the center point of the illumination region IR1001 (and IR1003, IR1005) to the center point of the illumination region IR1002 (and IR1004, IR1006). It is set to be substantially equal to the distance (chord length or circumference) DMx along the (cylindrical surface of radius r).
  • symbol ⁇ indicates an angle (open angle) [°] formed by the first radial direction D1001 and the second radial direction D1002, and symbol r indicates a radius [mm] of the first surface p1001.
  • the circumference DMx is about 94.248 mm
  • the distance Ds is about 93.175 mm. That is, if the X coordinate of the center point of the illumination area IR1001 matches the X coordinate of the center point of the projection area PA1001, the X coordinate of the center point of the illumination area IR1002 matches the X coordinate of the center point of the projection area PA1002. Assuming that two points separated in the circumferential direction by a circumferential length DMx in the pattern of the mask M are projected onto the substrate P via the projection areas PA1001 and PA1002, respectively, the two points are distances Ds in the X direction on the substrate P.
  • the exposure is performed with (Ds ⁇ DMx). That is, according to the previous numerical example, the pattern exposed on the substrate P through the odd-numbered projection areas PA1001, PA1003, and PA1005 and the exposure on the substrate P through the even-numbered projection areas PA1002, PA1004, and PA1006. This means that the pattern to be shifted is displaced by about 1.073 mm at the maximum in the X direction.
  • the projection optical system is such that the linear distance DFx between the center point of the projection area PA1001 and the center point of the projection area PA1002 is substantially equal to the circumference DMx.
  • the arrangement condition of the specific optical member in the system PL is changed from the condition shown in FIG.
  • the fourth reflecting surface p1009 of the second deflecting member 1057 is slightly shifted from the position shown in FIG. 6 in the direction parallel to the optical axis AX1004 (X axis), resulting in the linear distance DFx. Is installed so as to coincide with the circumference DMx. According to the numerical example given above, the difference between the circumference DMx and the distance Ds is 1.073 mm.
  • the position of the fourth reflecting surface p1009 of the second deflecting member 1057 mounted on all the projection modules PL1001 to PL1006 is parallel to the second concave mirror 1059 side along the optical axis AX1004 by about 0.5 mm which is half of the above 1 mm. If it is moved, the parts can be shared.
  • FIG. 10 shows the difference between the circumferential length DMx along the pattern surface (first surface p1001) of the mask M described in FIG. 9 and the linear distance Ds between the centers of the odd-numbered and even-numbered illumination regions, It is a graph which shows the correlation with angle (alpha), a vertical axis
  • a plurality of curves in the graph of FIG. 10 represent a case where the radius r of the pattern surface (cylindrical first surface p1001) of the mask M is changed to 180 mm, 210 mm, 240 mm, and 300 mm.
  • the circumference DMx is about 94.248 mm
  • the distance Ds is about 93.175 mm.
  • the difference shown on the vertical axis of the ten graphs is about 1.073 mm.
  • the difference amount between the circumference DMx on the pattern surface (first surface p1001) of the mask M and the linear distance Ds from the center point of the illumination region IR1001 to the center point of the illumination region IR1002 is Since it changes according to the radius r and the angle ⁇ of the first surface p1001, the position of the fourth reflecting surface p1009 of the second deflecting member 1057 may be set based on the relationship of the graph of FIG.
  • the position of the fourth reflecting surface p1009 of the second deflecting member 1057 in the X direction may be optimally arranged. Since it may be difficult to finally fit in the submicron order, the residual difference of several ⁇ m to several tens of ⁇ m or less is projected using the image shift correcting optical member 1045 shown in FIG. Is slightly shifted in the X direction, the linear distance DFx and the circumference DMx can be made to coincide with each other with sufficient accuracy.
  • the projected image is slightly shifted in the X direction by using the image shift correction optical member 1045, and the distance (peripheral length) between the two object points in the scanning exposure direction within the mask pattern surface, and the two object points.
  • the method of adjusting each projection module PL1001 to PL1006 so that the interval distance (peripheral length) in the scanning exposure direction of each image point when the image is projected onto the substrate P is equal to the submicron order is as described above. The same applies to the apparatus configurations of FIGS. 2 to 6 and the apparatus configuration of FIG.
  • FIG. 11 is a view showing a configuration of an exposure apparatus EX as the substrate processing apparatus 1011.
  • the configuration of the transport device 1009 for the substrate P is the same as the configuration of the transport device 1009 shown in FIG.
  • the configuration of the substrate processing apparatus 1011 shown in FIG. 11 is different from the respective apparatus configurations of FIG. 2, FIG. 7, and FIG. 8 in that the mask M is not a rotating cylindrical mask but a normal transmission type planar mask.
  • the angle ⁇ 1001 of the first reflecting surface p1004 of the first deflecting member 1050 provided in each of the projection modules PL1001 to PL1006 of the projection optical system PL with respect to the optical axis AX1003 (surface p1006) is set to 45 °.
  • a mask holding device 1012 is a mask stage 1078 that holds a planar mask M, and a moving device (not shown) that scans and moves the mask stage 1078 along the X direction in a plane orthogonal to the central plane p1003.
  • each principal ray EL3 on the mask M side of the projection modules PL1001 to PL1006 is perpendicular to the XY plane, and each illumination on the mask M
  • the optical axes (chief rays) of the illumination modules IL1001 to IL1006 that illuminate the regions IR1001 to IR1006 are also arranged to be perpendicular to the XY plane.
  • the first reflecting surface p1004 and the second reflecting surface p1005 of the first deflecting member 1050 included in the first optical system 1041 of the projection modules PL1001 to PL1006 are imaged light flux EL2 emitted from the first optical system 1041.
  • the principal ray EL3 is arranged so as to be substantially parallel to the center plane p1003. That is, the first deflecting member 1050 and the second deflecting member 1057 included in each of the projection modules PL1001 to PL1006 are such that the principal ray EL3 traveling in the normal direction from the illumination regions IR1001 to IR1006 on the mask M is along the cylindrical surface.
  • the imaging light beam EL2 is deflected so as to enter the projection areas PA1001 to PA1006 formed on the substrate P from the normal direction.
  • the first reflecting surface p1004 and the second reflecting surface p1005 of the first deflecting member 1050 are arranged to be orthogonal to each other, and both the first reflecting surface p1004 and the second reflecting surface p1005 have the first optical axis AX1003 (XY). Substantially 45 ° with respect to the surface).
  • the third reflecting surface p1008 of the second deflecting member 1057 is asymmetric with respect to the fourth reflecting surface p1009 with respect to a plane (parallel to the XY plane) that includes the second optical axis AX1004 and is orthogonal to the center plane p1003.
  • the angle ⁇ 1003 formed by the third reflecting surface p1008 and the second optical axis AX1004 is substantially 45 °
  • the angle ⁇ 1004 formed by the fourth reflecting surface p1009 and the second optical axis AX1004 is substantially less than 45 °.
  • the setting of the angle ⁇ 1004 is as described above with reference to FIG.
  • the illumination region IR1002 from the center point of the illumination region IR1001 (and IR1003, IR1005) on the mask M (first surface p1001) when viewed in the XZ plane.
  • the distance to the center point of (and IR1004, IR1006) is from the center point of the projection area PA1001 (and PA1003, PA1005) on the cylindrical substrate P to the center point of the second projection area PA1002 (and PA1004, PA1006). It is set substantially equal to the length (circumferential length) along the cylindrical second surface p1002.
  • the control device 1014 shown in FIG. 2 controls the moving device (linear motor for scanning exposure, actuator for fine movement, etc.) of the mask holding device 1012, and the second The mask stage 1078 is driven in synchronization with the rotation of the drum member 1022.
  • the substrate processing apparatus 1011 shown in FIG. 11 requires an operation (rewinding) of returning the mask M to the initial position in the ⁇ X direction after performing scanning exposure by synchronous movement of the mask M in the + X direction.
  • the second drum member 1022 is continuously rotated at a constant speed and the substrate P is continuously fed at a constant speed, the pattern exposure is not performed on the substrate P during the rewinding operation of the mask M, and the transport direction of the substrate P In this case, the panel pattern is formed in a jump (separated) manner.
  • the speed of the substrate P here, the peripheral speed
  • the speed of the mask M at the time of scanning exposure are assumed to be 50 to 100 mm / s in practice
  • the mask stage 1078 is used when the mask M is rewound. For example, if the driving is performed at the maximum speed of 500 mm / s, the margin in the substrate transport direction between the panel patterns formed on the substrate P can be narrowed.
  • the mask M in FIG. 12 uses the same cylindrical mask M as in FIGS. 2, 7, and 8, but a pattern is created with a high reflection portion and a low reflection (light absorption) portion with respect to illumination light. It is configured as a reflective mask. Therefore, the transmissive illumination device 1013 (illumination optical system IL) as in the previous embodiments cannot be used, and the illumination light is projected from the projection modules PL1001 to PL1006 side toward the reflective mask M. A configuration like an oblique illumination system is required.
  • a polarizing beam splitter PBS and a quarter wavelength plate PK are provided between the first reflecting surface p1004 of the first deflecting member 1050 constituting the first optical system 1041 and the reflective mask M.
  • the focus correction optical member 1044 and the image shift correction optical member 1045 are provided at the positions. However, in this embodiment, the focus correction optical member 1044 and the image shift correction are provided.
  • the optical member 1045 is moved to a space before or behind the intermediate image plane p1007 (field stop 1043).
  • the wavefront splitting surface of the polarization beam splitter PBS has an angle ⁇ / 2 ( ⁇ d) with respect to the center plane p1003 by an angle ⁇ 1001 ( ⁇ 45 °) with respect to the optical axis AX1003 (surface p6) of the first reflecting surface p1004 of the first deflecting member 1050.
  • ⁇ d angle ⁇ / 2
  • ⁇ 1001 ⁇ 45 °
  • AX1003 surface p6
  • the principal ray EL3 traveling in the radial direction (normal direction) from the illumination area IR1001 on the reflective mask M with a tilt of about 45 °.
  • the illumination light beam EL1 is emitted from, for example, a laser light source having good polarization characteristics, and is converted into linearly polarized light (S-polarized light) through a beam shaping optical system, an illuminance uniformizing optical system (such as a fly-eye lens or a rod element), and the like.
  • the light enters the beam splitter PBS.
  • Most of the illumination light beam EL1 is reflected on the wavefront splitting surface of the polarization beam splitter PBS, and the illumination light beam EL1 is converted into circularly polarized light through the quarter-wave plate PK, and the illumination region IR1001 on the reflective mask M is mounted. Irradiate shape or rectangle.
  • the light (imaging light beam) reflected by the pattern surface (first surface p1001) of the mask M is converted again into linearly polarized light (P-polarized light) through the quarter-wave plate PK, and is divided into wavefronts of the polarizing beam splitter PBS.
  • the light almost passes through the surface and travels toward the first reflecting surface p1004 of the first deflecting member 1050.
  • the configuration after the first reflecting surface p1004 and the optical path of the imaging light beam (principal ray EL3) are the same as those described with reference to FIG. 6, and the reflecting portion appearing in the illumination region IR1001 on the reflective mask M.
  • the pattern image is projected into the projection area PA1001.
  • a reflective cylindrical mask is obtained simply by adding the polarizing beam splitter PBS and the quarter-wave plate PK to the first optical system 1041 of the projection module PL1001 (and PL1002 to PL1006). Even so, it is possible to easily realize a sloping illumination system. Further, the illumination light beam EL1 is made incident on the polarization beam splitter PBS from a direction intersecting the direction of the principal light beam EL3 of the imaging light beam reflected by the reflective mask M and directed to the reflective mask M. ing.
  • the extinction ratio (separation characteristic) between the P-polarized light and the S-polarized light of the polarizing beam splitter PBS is somewhat small, a part of the illumination light beam EL1 as stray light is directly from the wavefront dividing surface of the polarizing beam splitter PBS.
  • the first reflective surface p1004 of 1050 does not go to the projection area PA1001 of the substrate P, and the quality (contrast, etc.) of the image projected and exposed on the substrate P is kept good, and the mask pattern can be faithfully transferred. .
  • FIG. 13 is a diagram showing a configuration of the projection optical system PL (first projection module PL1001) according to the sixth embodiment.
  • the first projection module PL1001 includes a third deflecting member (planar mirror) 1120, a first lens group (equal magnification projection) 1051, a first concave mirror 1052 disposed on the pupil plane, a fourth deflecting member (planar mirror) 1121, and A fifth optical system (enlarged projection system) 1122 is provided.
  • the first surface p1001 on which the illumination region IR (first illumination region IR1001) is arranged is a pattern surface of the mask M (transmission type or reflection type) held by the cylindrical first drum member 1021, and the cylindrical surface and It has become.
  • the second surface p1002 on the substrate P where the projection area PA (first projection area PA1001) is arranged is a plane here.
  • the polarizing beam splitter and 1 are provided between the mask M and the third deflection member 1120.
  • a / 4 wavelength plate is provided.
  • the imaging light beam EL2 emitted from the first illumination region IR1001 is reflected by the fifth reflecting surface p1017 of the third deflecting member 1120 and enters the first lens group 1051.
  • the imaging light beam EL2 that has entered the first lens group 1051 is reflected by the first concave mirror 1052, folded back, emitted from the first lens group 1051, and incident on the sixth reflecting surface p1018 of the fourth deflecting member 1121.
  • the first lens group 1051 and the first concave mirror 1052 an intermediate image of the pattern of the mask M that appears in the first illumination region IR1001 is formed at the same magnification as in the above embodiment.
  • the imaging light beam EL2 reflected by the sixth reflecting surface p1018 enters the fifth optical system 1122 through the formation position of the intermediate image, and reaches the first projection area PA1001 through the fifth optical system 1122.
  • the fifth optical system 1122 re-images the intermediate image formed by the first lens group 1051 and the first concave mirror 1052 on the first projection area PA1001 at a predetermined magnification (for example, 2 times or more).
  • the fifth reflecting surface p1017 of the third deflecting member 1120 corresponds to the first reflecting surface p1004 of the first deflecting member 1050 described in FIG. 6, and the sixth reflecting surface p1018 of the fourth deflecting member 1121 is This corresponds to the second reflecting surface p5 of the first deflecting member 50 described in FIG.
  • the extension line of the principal ray EL3 between the third deflection member 1120 and the mask M (cylindrical first surface p1001) is set so as to pass through the rotation center line AX1001 of the mask M.
  • the principal ray EL3 of the imaging light beam EL2 between the second optical system 1122 having the optical axis AX1008 perpendicular to the surface (second surface p1002) of the substrate P supported by the plane and the projection area PA1001 on the substrate P is the first. It is set to be perpendicular to the two planes p1002, that is, to satisfy the telecentric imaging condition.
  • the projection optical system of FIG. 13 includes an adjustment mechanism that slightly rotates the third deflecting member 1120 or the fourth deflecting member 1121 within the XZ plane in FIG.
  • the third deflecting member 1120 and the fourth deflecting member 1121 are not only finely rotated in the YZ plane in FIG. 13 but also finely moved in the X-axis direction and Z-axis direction, and around the axis parallel to the Z-axis. You may make it the structure which enables a minute rotation.
  • the image projected in the projection area PA1001 can be slightly shifted in the X direction or can be slightly rotated in the XY plane.
  • the projection module PL1001 is an enlargement projection optical system as a whole, but may be an equal magnification projection optical system or a reduction projection optical system as a whole.
  • the first optical system including the first lens group 1051 and the first concave mirror 1052 is an equal magnification system, the projection magnification of the subsequent fifth optical system 1122 may be changed to equal magnification or reduction.
  • FIG. 14 is a view of the configuration of a modification using the projection optical system according to the sixth embodiment viewed from the Y-axis direction
  • FIG. 15 is a view of the configuration of FIG. 14 viewed from the X-axis direction.
  • the projection optical system shown in FIGS. 14 and 15 is a case where a plurality of the enlarged projection optical systems in FIG. 13 are arranged in the Y-axis direction, that is, in the axial direction of the rotation center axis AX1001 of the cylindrical mask M. A modification is shown.
  • the projection optical system PL of this modification includes a first projection module PL1001 and a second projection module PL1002, as shown in FIG.
  • the second projection module PL1002 has the same configuration as that of the first projection module PL1001, and is arranged in contrast to the first projection module PL1001 with respect to the center plane p1003 as shown in FIG. 14, but the Y axis in FIG. The directions are separated from each other as shown in FIG.
  • the first projection module PL1001 includes a third deflecting member 1120A, a first lens group 1051A, a first concave mirror 1052A, and a fourth deflecting member 1121A that receive the imaging light beam from the illumination region IR1001 on the mask M. And a fifth optical system (enlarged imaging system) 1122A.
  • the projection module PL1001 shown in FIGS. 14 and 15 changes the tilt direction of the principal ray between the mask M and the third deflecting member 1120A as compared to the previous projection optical systems (FIGS. 6 and 13). . That is, the reflecting surface p1004 of the first deflecting member 1050 in FIG. 6 and the reflecting surface of the third deflecting member 1120 in FIG. 13 transmit the principal ray EL3 from the illumination region IR1001 of the mask M to the first lens group 1051 (1051A). While the light beam is deflected at an obtuse angle (90 ° or more) so as to be parallel to the optical axis AX1003 of the first optical system configured by the first concave mirror 1052 (1052A), in the configuration of FIG. Is deflected at an acute angle (less than 90 °) so that the principal ray EL3 from the first optical system is parallel to the optical axis of the first optical system.
  • an obtuse angle 90 ° or more
  • Projection optical systems PL1001 and PL1002 shown in FIGS. 14 and 15 are enlarged projection optical systems as a whole, and as shown in FIG. 15, a mask M (first drum member 1021) in which a first illumination region IR1001 is arranged.
  • the upper first area A1001 and the second area A1002 on the mask M (first drum member 1021) where the second illumination area IR1002 is arranged are separated from each other in the Y direction.
  • the third region A1005 (image region) of the first region A1001 projected onto the projection region PA1001 on the substrate P and the projection region on the substrate P The fourth area A1006 (image area) of the second area A1002 projected on the PA1002 is set to have a relationship such that it partially overlaps in the Y direction when viewed in the YZ plane. Accordingly, the first area A1001 and the second area A1002 on the mask M (first drum member 1021) are formed on the substrate P so as to be connected in the Y direction, and a large panel pattern can be projected and exposed. .
  • the projection optical system shown in FIG. 13 is arranged symmetrically with respect to the center plane p1003, and the Y axis Compared to a case where a plurality of projection optical systems are arranged in the direction, the width dimension in the X direction of the entire projection optical system can be made compact, and the size in the X direction can be reduced as a processing apparatus.
  • the peripheral length between the center points of the illumination area IR1001 and the illumination area IR1002 defined on the mask M (first drum member 1021).
  • FIG. 16 is a diagram showing the configuration of the projection optical system according to the seventh embodiment.
  • the imaging light beam EL2 from the first illumination region IR1001 formed on the cylindrical first surface p1001 (mask pattern surface) is incident on the sixth optical system 1131 and passes through the sixth optical system 1131 to form a seventh deflecting member. (Flat Mirror)
  • the imaging light beam EL2 reflected by the ninth reflecting surface p1022 of the 1132 reaches the intermediate image plane p1007 where the first field stop 1043 is arranged, and an image of the pattern of the mask M is formed on the intermediate image plane p1007.
  • the imaging light beam EL2 having passed through the intermediate image plane p1007 is reflected by the tenth reflecting surface p1023 of the eighth deflecting member (plane mirror) 1133, and is supported along the cylindrical second surface p1002 through the seventh optical system 1134. Reaches the first projection area PA1001 on the substrate P.
  • the first projection module PL1001 in FIG. 16 projects an image of the pattern of the mask M in the first illumination area IR1001 onto the first projection area PA1001 as an erect image.
  • the sixth optical system 1131 is an equal-magnification imaging optical system, and its optical axis AX1010 is substantially coaxial with the principal ray of the imaging light beam EL2 passing through the center of the first illumination region IR1001. .
  • the optical axis AX1010 is substantially parallel to the first radial direction D1001 shown in FIG. 4 or FIGS.
  • the seventh optical system 1134 is an equal-magnification imaging optical system, and re-images the intermediate image formed by the sixth optical system 1131 on the first projection area PA1001.
  • the optical axis AX1011 of the seventh optical system 1134 is substantially parallel to the first normal direction (radial direction) D1003 of the cylindrical second surface p1002 passing through the center of the first projection area PA1001.
  • the two deflecting members 1132 and 1133 are symmetrically arranged on the XZ plane in FIG. 16 with the intermediate image plane p1007 interposed therebetween.
  • an intermediate image plane is formed at a position where the optical axis AX1010 of the sixth optical system 1131 and the optical axis AX1011 of the seventh optical system 1134 intersect, and the reflective surface parallel to the YZ plane is located at the position of the intermediate image plane. It is also conceivable to arrange a single plane mirror having a fold and bend the optical path.
  • the angle formed by the optical axis AX1010 of the sixth optical system 1131 and the optical axis AX1011 of the seventh optical system 1134 is larger than 90 ° in the XZ plane in FIG.
  • the angle formed by the reflecting surface of one plane mirror and each of the optical axes AX1010 and AX1011 becomes an acute angle of less than 45 °, and the imaging characteristics may be unfavorable.
  • the angle formed by the optical axes AX1010 and AX1011 is about 140 °
  • the angle formed by the reflection surface of one plane mirror and each optical axis AX1010 and AX1011 is 20 °. Therefore, when the optical path is bent using two deflecting members (planar mirrors) 1132 and 1133 as shown in FIG. 16, such a problem is alleviated.
  • the sixth optical system 1131 may be an imaging lens having an enlargement magnification Mf
  • the seventh optical system 1134 may be an imaging lens having a reduction magnification 1 / Mf
  • the entire projection system may be an equal magnification.
  • the sixth optical system 1131 may be an imaging lens having a reduction ratio of 1 / Mf
  • the seventh optical system 1134 may be an imaging lens having an enlargement ratio of Mf
  • the entire projection system may be an equal magnification.
  • FIG. 17 is a diagram showing a configuration of the projection optical system PL (first projection module PL1001) according to the eighth embodiment.
  • the basic optical system configuration is the same as that shown in FIG. 16 except that two deflecting members (plane mirrors) 1140 and 1143 are added.
  • an eighth optical system 1135 corresponding to the imaging optical system 1131 in FIG. 16 includes a third lens 1139 and a fourth lens 1141, and the optical axis thereof is along the cylindrical first surface p1001. Is set substantially parallel to the principal ray of the imaging light beam EL2 emitted in the normal direction from the center of the first illumination region IR1001 on the mask M supported.
  • a pupil plane of the eighth optical system 1135 is formed between the third lens 1139 and the fourth lens 1141, and an eleventh deflection member (plane mirror) 1140 is provided at that position.
  • the imaging light beam EL2 that has exited from the first illumination region IR1001 and passed through the third lens 1139 is bent at 90 ° or an angle close thereto by the thirteenth reflecting surface p1026 of the eleventh deflecting member 1140 and applied to the fourth lens 1141.
  • Incident light is reflected by the eleventh reflecting surface p1024 of the ninth deflecting member (planar mirror) 1136 corresponding to the deflecting member 1132 in FIG. 16, and reaches the field stop 1043 disposed on the intermediate image plane p1007.
  • the eighth optical system 1135 forms an image of the pattern of the mask M appearing in the first illumination region IR1001 at the position of the intermediate image plane p1007.
  • the eighth optical system 1135 is an equal-magnification imaging optical system, and the intermediate image plane p1007 is configured to be orthogonal to the center plane p1003. Further, the optical axis of the third lens 1139 is substantially coaxial with the principal ray of the imaging light beam EL2 emitted in the normal direction (radial direction of the cylindrical first surface p1001) from the center of the first illumination region IR1001. Parallel.
  • the ninth optical system 1138 in FIG. 17 has the same configuration as that of the eighth optical system 1135, and includes the first optical field stop 1043 and the eighth optical system 1135 with respect to the intermediate image plane p1007 that is substantially orthogonal to the center plane p1003. They are arranged symmetrically.
  • the imaging light beam EL2 having passed through the field stop 1043 through the eighth optical system 1135 and the ninth deflection member 1136 is reflected by the twelfth reflecting surface p1025 of the tenth deflection member (plane mirror) 1137, and passes through the ninth optical system 1138.
  • the optical axis of the sixth lens 1144 is substantially the same as the principal ray of the imaging light beam EL2 traveling in the normal direction (radial direction of the cylindrical second surface p1002) with respect to the first projection area PA1001. Is set to be coaxial or parallel.
  • FIG. 18 is a diagram showing a configuration of the projection optical system PL (first projection module PL1001) according to the ninth embodiment.
  • the first projection module PL1001 in FIG. 18 is a so-called inline catadioptric projection optical system.
  • the first projection module PL1001 includes a tenth optical system 1145 of the same magnification composed of two pieces of a fourth concave mirror 1146 and a fifth concave mirror 1147, a first field stop 1043 (intermediate image plane p1007), and FIGS.
  • a second optical system 1122 as shown is provided.
  • the tenth optical system 1145 forms an intermediate image of a pattern appearing in the first illumination region IR1001 on the mask M supported along the cylindrical first surface p1001 at the position of the field stop 1043.
  • the tenth optical system 1145 is an equal magnification optical system.
  • Each of the fourth concave mirror 1146 and the fifth concave mirror 1147 is configured as a part of a spheroid, for example.
  • This spheroidal surface is a surface formed by rotating an ellipse around the major axis (X-axis direction) or minor axis (Z-axis direction) of the ellipse.
  • the principal ray of the imaging light beam EL2 emitted from the center of the first illumination region IR1001 in the normal direction (radial direction) of the cylindrical first surface p1001 is the first surface when viewed in the XZ plane.
  • p1001 (first drum member 1021) is set so as to be directed to the rotation center axis AX1001. That is, the chief ray of the imaging light beam EL2 directed from the mask M (first surface p1001) toward the fourth concave mirror 1146 of the projection module PL1001 is tilted in the XZ plane with respect to the center plane p1003.
  • the fifth optical system 1122 is, for example, a refraction-type enlarged projection optical system as described with reference to FIG. 13, and an intermediate image formed at the position of the field stop 1043 by the tenth optical system 1145 is converted into a planar second surface. Projection is performed on the first projection area PA1001 on the substrate P supported along p1002.
  • the fourth concave mirror 1146 and the fifth concave mirror 1147 of the tenth optical system use the imaging light beam EL2 emitted in the normal direction from the first illumination region IR1001 through the fifth optical system 1122 and modulo the first projection region PA1001.
  • the imaging light beam EL2 is deflected so as to enter from the linear direction.
  • the substrate processing apparatus provided with such a projection optical system PL suppresses the occurrence of exposure failure and enables faithful projection exposure.
  • the fifth optical system 1122 may be a projection optical system of the same magnification or a reduction optical system.
  • FIG. 19 is a diagram showing a configuration of the projection optical system PL (first projection module PL1001) of the tenth embodiment.
  • a first projection module PL1001 in FIG. 19 is a refractive optical system that does not include a reflective member having power.
  • the first projection module PL1001 includes an eleventh optical system 1150, a thirteenth deflecting member 1151, a first field stop 1043, a fourteenth deflecting member 1152, and a twelfth optical system 1153.
  • the imaging light beam EL2 emitted from the first illumination region IR1001 on the mask M held along the cylindrical first surface p1001 passes through the eleventh optical system 1150 and is composed of a wedge-shaped prism.
  • the beam is deflected in the XZ plane by the thirteenth deflecting member 1151 to reach the first field stop 1043 disposed on the intermediate image plane p1007, where an intermediate image of the mask pattern is formed.
  • the imaging light beam EL2 that has passed through the first field stop 1043 is deflected in the XZ plane by the fourteenth deflecting member 1152 made of a wedge-shaped prism, and enters the twelfth optical system 1153, and enters the twelfth optical system 1153.
  • the first projection area PA1001 on the substrate P supported along the cylindrical second surface p1002 passes through.
  • the optical axis of the eleventh optical system 1150 is substantially coaxial with the principal ray of the imaging light beam EL2 emitted from the center of the first illumination region IR1001 in the normal direction (radial direction of the cylindrical first surface p1001), for example. Parallel.
  • the twelfth optical system 1153 has the same configuration as the eleventh optical system 1150, and is symmetric with the eleventh optical system 1150 with respect to an intermediate image plane p1007 (perpendicular to the center plane p1003) on which the first field stop 1043 is disposed. Arranged.
  • the optical axis of the twelfth optical system 1153 is set substantially parallel to the principal ray of the imaging light beam EL2 incident on the first projection area PA1001 along the normal line of the planar second surface p1002.
  • the thirteenth deflecting member 1151 has a ninth surface p1028 on which the imaging light beam EL2 having passed through the eleventh optical system 1150 is incident, and a tenth surface p1029 from which the imaging light beam incident from the ninth surface p1028 is emitted. It is arranged in front of or just before the first field stop 1043 (intermediate image plane p1007).
  • each of the ninth surface p1028 and the tenth surface p1029 forming a predetermined apex angle is inclined with respect to a surface (XY surface) orthogonal to the central surface p1003 and is a plane extending in the Y-axis direction. Composed.
  • the fourteenth deflecting member 1152 is a prism member similar to the thirteenth deflecting member 1151, and is arranged symmetrically with the thirteenth deflecting member 1151 with respect to the intermediate image plane p1007 where the first field stop 1043 is located.
  • the fourteenth deflecting member 1152 has an eleventh surface p1030 on which the imaging light beam EL2 having passed through the first field stop 1043 is incident, and a twelfth surface p1031 on which the imaging light beam EL2 incident from the eleventh surface p1030 is emitted.
  • the first field stop 1043 (intermediate image plane p1007) is disposed behind or immediately after.
  • the thirteenth deflecting member 1151 and the fourteenth deflecting member 1152 make the imaging light beam EL2 emitted from the first illumination region IR1001 in the normal direction enter the first projection region PA1001 from the normal direction.
  • the substrate processing apparatus provided with such a projection optical system PL suppresses the occurrence of exposure failure and enables faithful projection exposure.
  • the eleventh optical system 1150 or the twelfth optical system 1153 may be an enlargement projection system or a reduction projection system, but either one of the mask M and the substrate P may be a cylindrical surface (or When the projection exposure is performed while being supported along the circular arc surface), the distance (peripheral distance) of the field of view on the object surface side between the two projection modules separated in the circumferential direction of the cylindrical surface and the final image plane
  • the ratio to the projection visual field interval (circumferential distance) on the side may be set to coincide with the projection magnification.
  • FIG. 20 is a diagram showing a partial configuration of the device manufacturing system (flexible display manufacturing line) of the eleventh embodiment.
  • the flexible substrate P sheet, film, etc. pulled out from the supply roll FR1 passes through n processing devices U1, U2, U3, U4, U5,. The example until it winds up to FR2 is shown.
  • the host control device 2005 performs overall control of the processing devices U1 to Un constituting the production line.
  • an orthogonal coordinate system XYZ is set so that the front surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long direction) of the substrate P is set to the Y direction.
  • the substrate P may be activated by modifying the surface in advance by a predetermined pretreatment, or may have a fine partition structure (uneven structure) for precise patterning formed on the surface.
  • the substrate P wound around the supply roll FR1 is pulled out by the nipped drive roller DR1 and conveyed to the processing device U1, and the center of the substrate P in the Y direction (width direction) is set by the edge position controller EPC1.
  • Servo control is performed so as to be within a range of about ⁇ 10 ⁇ m to several tens ⁇ m with respect to the position.
  • the processing device U1 continuously applies a photosensitive functional liquid (photoresist, photosensitive silane coupling material, UV curable resin liquid, etc.) to the surface of the substrate P by a printing method with respect to the transport direction (long direction) of the substrate P or
  • a coating apparatus for selectively coating In the processing apparatus U1, a coating mechanism including a pressure drum DR2 around which the substrate P is wound, and a coating roller for uniformly coating the photosensitive functional liquid on the surface of the substrate P on the pressure drum DR2.
  • Gp1 a drying mechanism Gp2 for rapidly removing a solvent or moisture contained in the photosensitive functional liquid applied to the substrate P, and the like are provided.
  • the processing device U2 heats the substrate P conveyed from the processing device U1 to a predetermined temperature (for example, about several tens to 120 ° C.), and stabilizes the photosensitive functional layer applied on the surface. It is.
  • a predetermined temperature for example, about several tens to 120 ° C.
  • a plurality of rollers and an air turn bar for returning and conveying the substrate P, a heating chamber HA1 for heating the substrate P that has been carried in, and the temperature of the heated substrate P are as follows:
  • a cooling chamber HA2 and a nipped drive roller DR3 are provided for lowering the temperature so as to match the ambient temperature of the post-process (processing device U3).
  • the processing apparatus U3 as the substrate processing apparatus is an exposure apparatus that irradiates the photosensitive functional layer of the substrate P conveyed from the processing apparatus U2 with ultraviolet patterning light corresponding to a circuit pattern or a wiring pattern for display. is there.
  • an edge position controller EPC that controls the center of the substrate P in the Y direction (width direction) to a fixed position, the nipped drive roller DR4, and the substrate P are partially wound with a predetermined tension, and the substrate
  • a rotary drum DR5 that supports a pattern exposed portion on P in a uniform cylindrical surface, and two sets of drive rollers DR6 and DR7 for providing a predetermined slack (play) DL to the substrate P are provided. ing.
  • a projection optical system for projecting an image of a part of the mask pattern of the cylindrical mask M onto a part of the cylindrical mask M and the substrate P supported in a cylindrical surface by the rotary drum DR5.
  • alignment microscopes AM1 and AM2 for detecting an alignment mark or the like previously formed on the substrate P are provided. It has been.
  • the cylindrical mask M is of a reflective type (the pattern on the outer peripheral surface is formed by a high reflection part and a non-reflection part), so that it passes through some optical elements of the projection optical system PL.
  • a tilt-down illumination optical system that irradiates the exposure light to the cylindrical mask M is also provided. The configuration of the falling-down illumination optical system will be described in detail later.
  • the processing device U4 is a wet processing device that performs wet development processing, electroless plating processing, and the like on the photosensitive functional layer of the substrate P conveyed from the processing device U3.
  • the processing apparatus U4 there are provided three processing tanks BT1, BT2, and BT3 layered in the Z direction, a plurality of rollers for bending and transporting the substrate P, a nip driving roller DR8, and the like.
  • the processing apparatus U5 is a heating and drying apparatus that warms the substrate P transported from the processing apparatus U4 and adjusts the moisture content of the substrate P wetted by the wet process to a predetermined value, but the details are omitted.
  • the substrate P that has passed through several processing devices and passed through the last processing device Un in the series of processes is wound up on the collection roll FR2 via the nipped drive roller DR1.
  • the edge position controller EPC2 controls the Y of the drive roller DR1 and the recovery roll FR2 so that the center in the Y direction (width direction) of the substrate P or the substrate end in the Y direction does not vary in the Y direction.
  • the relative position in the direction is successively corrected and controlled.
  • the substrate P used in the present embodiment can be the same as that exemplified in the first embodiment, and the description thereof is omitted here.
  • the device manufacturing system 2001 of the present embodiment repeatedly executes various processes for manufacturing one device on the substrate P.
  • the substrate P that has been subjected to various types of processing is divided (diced) for each device to form a plurality of devices.
  • the dimension in the width direction (short Y direction) is about 10 cm to 2 m
  • the dimension in the length direction (long X direction) is 10 m or more.
  • An exposure apparatus U3 shown in FIG. 21 is a so-called scanning exposure apparatus, and includes a reflective cylindrical mask M having a circumferential surface with a radius r2001 from the rotation center axis AX2001, and a circumferential surface with a radius r2002 from the rotation center axis AX2002.
  • a rotating drum 2030 (DR5 in FIG. 1). Then, by rotating the cylindrical mask M and the rotating drum 2030 synchronously at a predetermined rotation speed ratio, a pattern image formed on the outer periphery of the cylindrical mask M becomes a part of the outer peripheral surface of the rotating drum 2030.
  • the projection exposure is continuously repeated on the surface of the substrate P wound around (a surface curved along the cylindrical surface).
  • the exposure apparatus U3 is provided with a transport mechanism 2009, a mask holding mechanism 2012, an illumination optical system IL, a projection optical system PL, and a control device 2013.
  • a cylindrical shape held by the control device 2013 on the mask holding mechanism 2012 is provided.
  • the rotational drive of the mask M and the fine movement in the direction of the rotation center axis AX2001, or the rotation drive of the rotary drum 2030 constituting a part of the transport mechanism 2009 for transporting the substrate P in the longitudinal direction and the fine movement in the direction of the rotation center axis AX2002 are controlled. Is done.
  • the mask holding mechanism 2012 applies a rotational driving force around the rotation center axis AX2001 to the rotary drum 2020 on which the reflective mask M (mask pattern) is formed on the outer peripheral surface, or the direction of the rotation center axis AX2001 parallel to the Y axis.
  • a first driving unit 2024 including a motor, a piezoelectric element, and the like.
  • the rotation angle position of the rotary drum 2020 (mask M) and the position in the direction of the rotation center axis AX2001 are measured by a first detector 2023 including a rotary encoder, a laser interferometer, a gap sensor, and the measurement information is real-time. It is sent to the control device 2013 and used for controlling the first drive unit 2024.
  • the rotary drum 2030 includes a rotation driving force around the rotation center axis AX2002 parallel to the Y axis and a rotation center axis AX2002 by a second drive unit 2032 including a rotation motor, a linear motor for fine movement, a piezoelectric element, and the like. Power is given in the direction of.
  • the rotation angle position of the rotary drum 2030 and the position in the direction of the rotation center axis AX2002 are measured by a second detector 2031 including a rotary encoder, a laser interferometer, a gap sensor, and the like, and the measurement information is sent to the control device 2013 in real time.
  • the second drive unit 2032 is used for control.
  • the rotation center axis AX2001 of the cylindrical mask M and the rotation center axis AX2002 of the rotary drum 2030 are parallel to each other and located in the center plane pc parallel to the YZ plane.
  • An illumination region IR of exposure illumination light is set at a portion intersecting with the central plane pc on the cylindrical pattern surface p2001 on which the cylindrical mask M is formed, and the cylinder is formed along the outer peripheral surface p2002 of the rotary drum 2030.
  • a projection area PA for projecting an image of a part of the mask pattern appearing in the illumination area IR is set at a portion intersecting with the center plane pc on the substrate P wound in a shape.
  • the projection optical system PL emits an illumination light beam EL1 toward the illumination region IR on the cylindrical mask M, and a light beam (imaging light beam) EL2 reflected and diffracted by the mask pattern in the illumination region IR. So that a pattern image is formed on the projection area PA on the substrate P, the illumination optical system IL is configured by a falling-down system that shares a part of the optical path of the projection optical system PL.
  • the projection optical system PL has a prism mirror 2041 that includes reflection planes 2041a and 2041b that are inclined by 45 ° in the XZ plane with respect to the center plane pc, and light that is orthogonal to the center plane pc.
  • a concave optical mirror 2040 having an axis 2015a and disposed on the pupil plane pd and a second optical system 2015 including a plurality of lenses are provided.
  • the angle ⁇ 2001 of the reflection plane 2041a with respect to the plane p2005 is + 45 °
  • the angle of the reflection plane 2041b with reference to the plane p2005 is ⁇ 2002 is ⁇ 45 °.
  • the projection optical system PL is telecentric as, for example, a half image field type catadioptric projection optical system (a modified type of Dyson optical system) in which a circular image field is divided by upper and lower reflection planes 2041a and 2041b of a prism mirror 2041. Composed. Therefore, the imaging light beam EL2 reflected and diffracted by the pattern in the illumination region IR is reflected by the reflection plane 2041a on the upper side of the prism mirror 2041, passes through a plurality of lenses, and is a concave mirror disposed on the pupil plane pd. 2040 (which may be a plane mirror) is reached.
  • a half image field type catadioptric projection optical system a modified type of Dyson optical system
  • the imaging light beam EL2 reflected by the concave mirror 2040 passes through a symmetrical optical path with respect to the plane p2005, reaches the reflection plane 2041b of the prism mirror 2041, is reflected there, and reaches the projection area PA on the substrate P.
  • An image of the pattern is formed on the substrate P at an equal magnification ( ⁇ 1).
  • a passing portion is formed in a part of the reflecting surface p2004 of the concave mirror 2040 arranged on the pupil plane pd.
  • the illumination light beam EL1 is configured to be incident from the surface p2003 (glass surface) side through the passage portion.
  • FIG. 21 shows only a part of the first optical system 2014 arranged behind the concave mirror 2040 in the illumination optical system IL of the present embodiment, and illumination from a light source, a fly-eye lens, an illumination field stop, etc., which will be described later. Of the light, only the illumination light beam EL1 related to one point light source image Sf of many point light source images generated on the pupil plane pd is shown.
  • the point light source image Sf is set in an optically conjugate relationship with, for example, a point light source image (light emission point of the light source) formed on each emission side of a plurality of lens elements constituting the fly-eye lens.
  • the illumination area IR on the mask M is illuminated with a uniform illuminance distribution by the Kohler illumination method by the illumination light beam EL1 through the second optical system 2015 of the projection optical system PL and the reflection plane 2041a on the upper side of the prism mirror 2041. .
  • the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is arranged coaxially with the optical axis 2015a of the projection optical system PL, and the illumination area IR on the cylindrical mask M is cylindrical.
  • the width of the pattern surface p2001 in the circumferential direction is narrow, and is set in a slit shape that is long in the direction of the rotation center axis AX2001.
  • the extent to which the width of the illumination area IR (or projection area PA) is set depends on the radius r2001 and r2002 of the cylindrical mask M and the rotating drum 2030, the fineness of the pattern to be transferred (line width, etc.), and the projection optics. It is determined by taking into account the depth of focus of the system PL.
  • the point light source image Sf is a position shifted from the center point 2044 in the ⁇ Z direction in the drawing (XZ plane). Therefore, the regular reflected light (0th order diffracted light) of the imaging light beam EL2 (including diffracted light) reflected by the illumination region IR on the cylindrical mask M is the center point on the reflective surface p2004.
  • a point light source image Sf ′ is converged so as to form a point symmetrical position with respect to 2044.
  • the imaging light beam EL2 from the illumination region IR is The projection area PA is reached through the plurality of lenses of the second optical system 2015 and the reflection plane 2041b of the prism mirror 2041 with almost no loss.
  • the concave mirror 2040 is a reflective surface p2004 formed by depositing a metallic reflective film such as aluminum on the concave surface of a concave lens made of a transmissive optical glass material (quartz or the like).
  • a metallic reflective film such as aluminum
  • the transmittance is extremely small. Therefore, in this embodiment, in order to cause the illumination light beam EL1 to enter from the surface p2003 on the back side of the reflection surface p2004, a part of the reflection film constituting the reflection surface p2004 is removed by etching or the like, and the converged illumination light beam EL1 passes ( Forming a transmissive) window.
  • FIG. 22 is a view of the state of the reflecting surface p2004 of the concave mirror 2040 as seen from the X direction.
  • the three windows 2042a and 2042b are located on the reflecting surface p2004 at positions shifted by a certain amount in the ⁇ Z direction from the plane p2005 including the optical axis 2015a (parallel to the XY plane).
  • 2042c are spaced apart in the Y direction.
  • the window portions 2042a, 2042b, and 2042c are formed by selectively removing the reflective film that forms the reflective surface p2004.
  • the point light source images Sfa, Sfb, and Sfc (illumination light beam EL1a).
  • the three point light source images Sfa, Sfb, Sfc are made by, for example, three lens elements arranged in the Y direction among a plurality of lens elements of a fly-eye lens provided in the illumination optical system IL.
  • the mutual positional relationship between the windows 2042a, 2042b, and 2042c is determined to be not point-symmetric with respect to the center point 2044 (optical axis 2015a), that is, a non-point-symmetric relationship. . Although only three window portions are shown here, even when more window portions are formed, the window portions are set in an asymmetrical positional relationship with respect to the center point 2044.
  • the illumination light beams EL1b and EL1c from the respective point light source images Sfb and Sfc generated in the windows 2042b and 2042c are also substantially parallel light beams and are irradiated on the illumination region IR of the cylindrical mask M.
  • the imaging light beams EL2b and EL2c, which are reflected lights, are converged as point light source images Sfb ′ and Sfc ′ at positions symmetrical to the windows 2042b and 2042c with respect to the center point 2044 on the reflecting surface p2004 of the concave mirror 2040. .
  • the imaging light beams EL2a, EL2b, and EL2c that become the point light source images Sfa ′, Sfb ′, and Sfc ′ include zero-order diffracted light (regular reflection light) and ⁇ first-order diffracted light.
  • each ⁇ first-order diffracted light DLa, DLb, DLc is spread and distributed in the Z-axis direction and the Y-axis direction across the zero-order diffracted light.
  • the point light source images Sfa ′, Sfb ′, Sfc ′ (particularly the 0th order diffracted light) formed on the reflection surface p2004 have a cylindrical surface in the illumination area IR of the cylindrical mask M.
  • each point light source image Sfa, Sfb, Sfc is located on the lower side ( ⁇ Z direction) than the plane p2005 including the center point 2044 (optical axis 2015a), it is within the paper surface shown in FIG. In (XZ plane), the illumination light beam EL1 (EL1a, EL1b, EL1c) reaches the cylindrical mask M via the second optical system 2015 and the reflection plane 2041a on the upper side of the prism mirror 2041.
  • These illumination light beams EL1 (EL1a, EL1b, EL1c) are all parallel light beams immediately before the cylindrical mask M, but are slightly inclined with respect to the center plane pc.
  • the amount of inclination corresponds to the amount of displacement in the Z direction from the center point 2044 (optical axis 2015a) of the point light source image Sf (Sfa, Sfb, Sfc) in the reflection surface p2004 (in the pupil plane pd).
  • the imaging light beam EL2 (EL2a, EL2b, EL2c) reflected and diffracted in the illumination region IR has a symmetric inclination with respect to the illumination light beam EL1 (EL1a, EL1b, EL1c) with respect to the center plane pc in the XZ plane. It reaches a reflection plane 2041a on the upper side of the mirror 2041, is reflected here and enters the second optical system 2015, and reaches a portion of the reflection surface p2004 of the concave mirror 2040 above the plane p2005 (center point 2044).
  • the point light source image (condensing point) Sf of the illumination light beam EL1 is distributed.
  • the conditions described above, that is, the positional relationship between the windows 2042 in the reflection surface p2004 through which the point light source image of the illumination light beam passes are as follows. If the relationship is not point-symmetric with respect to the center point 2044 (non-point-symmetric relationship), the position of the point light source image Sf (window portion 2042) on the reflection surface p2004 can be freely set.
  • the window 2042 through which a large number of point light source images Sf serving as the source of the illumination light beam EL1 passes is formed on the reflection surface p2004 of the concave mirror 2040, the illumination light beam is reflected on the reflection surface p2004 (pupil surface pd). And the imaging light flux can be efficiently spatially separated.
  • a large number of windows 2042 are uniformly distributed in the reflection surface p2004, and the spatial separation between the illumination light beam and the imaging light beam is kept good.
  • the size of each point light source image Sfa ′, Sfb ′, Sfc ′... Formed on the reflecting surface p2004 is formed by the convergence of the imaging light beam EL2.
  • the size may be set to be smaller than the distance between the adjacent window portions 2042 in the Y direction and the Z direction.
  • the pupil plane pd (reflective surface p2004) of each point light source image Sfa, Sfb, Sfc... Of the illumination light beam EL1 so that the individual dimensions of the windows 2042a, 2042b, 2042c. It is effective to reduce the dimensions in () as small as possible.
  • a mercury discharge lamp, a metal halide lamp, an ultraviolet LED, or the like can be used as a light source.
  • a laser light source that emits light having a narrow oscillation wavelength band can be used.
  • FIGS. 21 and 22 an example of the configuration of the illumination optical system IL (first optical system 2014) shown in FIGS. 21 and 22 will be described with reference to FIG.
  • the same members as those described in FIGS. 21 and 22 are denoted by the same reference numerals, and description thereof is omitted.
  • the prism mirror 2041 in FIG. 21 is omitted, the optical path between the illumination region IR on the cylindrical pattern surface p2001 of the cylindrical mask M and the second optical system 2015, and the rotating drum 2030.
  • the projection area PA on the outer peripheral surface (or the surface of the substrate P) p2002 and the optical path between the second optical system 2015 are shown.
  • the illumination optical system IL receives the light beam EL0 (illumination light beam EL0) from the light source and generates a large number of point light source images, and each of the large number of point light source images.
  • Condenser lens 2065 that superimposes the luminous flux on illumination field stop (blind) 2064 and lens system 2066 that guides the illumination light that has passed through the aperture of illumination field stop 2064 to concave mirror 2040 of projection optical system PL (second optical system 2015). And are provided.
  • the surface Ep on which the point light source image is generated on the exit side of the fly-eye lens 2062 is formed by the condenser lens 2065, the lens system 2066, and the glass material (concave lens shape) constituting the concave mirror 2040. It is set conjugate with the pupil plane pd on which the reflecting surface is located.
  • the center of the exit end of the fly-eye lens 2062 is disposed on the optical axis 2065a of the condenser lens 2065, and the center of the illumination field stop 2064 (opening) is disposed on the optical axis 2065a.
  • the illumination field stop 2064 includes a lens system 2066, a glass material (concave lens shape) constituting the concave mirror 2040, and a plurality of lenses of the second optical system 2015, and an illumination region IR (pattern surface p2001) on the cylindrical mask M. Is disposed on the surface 2014b optically conjugate with the above.
  • the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is disposed coaxially with the optical axis 2015a of the projection optical system PL (second optical system 2015), but the optical axis 2065a of the condenser lens 2065 is the first. With respect to the optical axis 2014a of the optical system 2014, it is decentered in the ⁇ Z direction within the plane (XZ plane) of FIG.
  • two point light source images SPa and SPd positioned asymmetrically in the Z direction across the optical axis 2065a among the plurality of point light source images generated on the exit-side surface Ep of the fly-eye lens 2062 are taken as an example.
  • the behavior of the illumination light beam will be described.
  • the light beam from the point light source image SPa becomes a substantially parallel light beam by the condenser lens 2065 and irradiates the illumination field stop 2064.
  • the illumination light beam EL1a transmitted through the opening of the illumination field stop 2064 (slit shape elongated in the Y direction) is converged as a point light source image Sfa in a window formed on the reflection surface of the concave mirror 2040 of the projection optical system PL by the lens system 2066. Is done.
  • the illumination light beam EL1a from the point light source image Sfa is illuminated on the cylindrical pattern surface p2001 of the cylindrical mask M via the second optical system 2015 of the projection optical system PL. Illuminate.
  • the imaging light beam EL2a generated on the pattern surface p2001 by irradiation of the illumination light beam EL1a from the point light source image Sfa moves backward in the second optical system 2015 to re-image the point light source image Sfa 'on the concave mirror 2040.
  • the point light source image Sfa created by the light beam from the illumination optical system IL and the point light source image Sfa 'created by the imaging light beam EL2a are positioned in a point-symmetric relationship in the pupil plane pd.
  • the light beam from the point light source image SPd is converted into a substantially parallel light beam by the condenser lens 2065 and irradiates the illumination field stop 2064.
  • the illumination light beam EL1d transmitted through the opening of the illumination field stop 2064 is converged as a point light source image Sfd in a window formed on the reflection surface of the concave mirror 2040 by the lens system 2066.
  • the illumination light beam EL1d from the point light source image Sfd illuminates the illumination region IR on the cylindrical pattern surface p2001 via the second optical system 2015.
  • the imaging light beam EL2d generated on the pattern surface p2001 by irradiation of the illumination light beam from the point light source image Sfd moves backward in the second optical system 2015 to re-image the point light source image Sfd 'on the concave mirror 2040.
  • the point light source image Sfd created by the light beam from the illumination optical system IL and the point light source image Sfd 'created by the imaging light beam EL2d are positioned in a point-symmetric relationship in the pupil plane pd.
  • the imaging light beams EL2a and EL2d in which the point light source images Sfa ′ and Sfd ′ are formed on the reflecting surface of the concave mirror 2040 are projected into the cylindrical projection area PA on the substrate P, and an image of the mask pattern in the illumination area IR. Is imaged and projected into the projection area PA of the substrate P.
  • FIG. 24 shows a configuration of a light source device 2055 that generates an illumination light beam EL0 incident on the fly-eye lens 2062 of the illumination optical system IL shown in FIG.
  • the light source device 2055 includes a solid light source 2057, an expander lens (concave lens) 2058, a condensing lens 2059, and a light guide member 2060.
  • the solid light source 2057 includes, for example, a laser diode (LD), a light emitting diode (LED), and the like.
  • the illumination light beam LB emitted from the solid-state light source 2057 is converted into a divergent light beam by the expander lens 2058, and is collected on the incident end surface 2060a of the light guide member 2060 at a predetermined convergence degree (NA) by the condenser lens 2059.
  • NA convergence degree
  • the light guide member 2060 is, for example, an optical fiber or the like, and the illumination light beam LB incident on the incident end face 2060a is emitted from the exit end face 2060b while storing NA (numerical aperture), and is substantially parallel illuminated by the lens system 2061 (collimator). It is converted into a luminous flux EL0.
  • the lens system 2061 adjusts the light beam diameter of the illumination light beam EL0 so as to irradiate the entire incident-side surface of the fly-eye lens 2062.
  • the diameter of a single optical fiber is, for example, about 300 ⁇ m. However, when the light intensity of the illumination light beam LB from the solid light source 2057 is high, a plurality of optical fibers may be bundled closely.
  • FIG. 25 shows the arrangement state of a large number of point light source images SP formed on the exit side surface Ep (parallel to the YZ plane) of the fly-eye lens 2062 in FIG. 23, as viewed from the condenser lens 2065 side.
  • the center point 2062a is located on the optical axis 2065a of the condenser lens 2065.
  • the fly-eye lens 2062 of this embodiment includes a plurality of lens elements 2062E arranged on a plane orthogonal to the optical axis 2065a of the condenser lens 2065.
  • Each of the plurality of lens elements 2062E has a rectangular cross section elongated in the Y direction and is tightly bundled in the Y direction and the Z direction.
  • a point light source image (spot) SP is formed at the center of the exit end of each lens element 2062E, which is a conjugate image of the exit end face 2060b of the light guide member 2060 (optical fiber) in FIG.
  • a plurality of lens elements 2062E are bundled so that each point light source image SP is asymmetric with respect to the center point 2062a (optical axis 2065a).
  • a set of lens elements 2062E located on the + Z side from the surface p2006 is an upper lens element group.
  • the dimension in the Y direction of the lens element 2062E is between the upper lens element group 2062U and the lower lens element group 2062D. The position is shifted by 1/2.
  • the plurality of point light source images SP scattered in the upper lens element group 2062U and the plurality of point light source images SP scattered in the lower lens element group 2062D are parallel to the Y axis passing through the center point 2062a.
  • the arrangement is also asymmetric with respect to the line.
  • each lens element 2062E of the fly-eye lens 2062 is configured to be a rectangle extending in the Y direction is to match the slit-like opening shape of the illumination field stop 2064 in FIG. . This will be described with reference to FIG.
  • FIG. 26 is a view of the illumination field stop 2064 in FIG. 23 as seen in the YZ plane.
  • the illumination field stop 2064 is formed with a rectangular (or trapezoidal) opening 2064A elongated in the Y direction, and the light flux from each point light source image SP of the fly-eye lens 2062 is illuminated by the condenser lens 2065. Above, it is superimposed as a rectangular illumination light beam EL1 including the opening 2064A.
  • the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is located at a position decentered in the + Z direction from the opening center of the opening 2064A. Pass through.
  • FIG. 27 shows the state of the reflection surface p2004 (arranged on the pupil plane pd) of the concave mirror 2040 that can be used for the distribution of the point light source image SP generated by the fly-eye lens 2062 of FIG. This is seen from the optical system 2015 side. Since the reflecting surface p2004 of the concave mirror 2040 is conjugate with the surface Ep on the exit side of the fly-eye lens 2062, the distribution of the plurality of point light source images SP (lens elements 2062E) shown in FIG. 25 is reflected on the reflecting surface p2004 (FIG. 27). In the pupil plane pd), the distribution of the point light source image Sf (black circle) is reversed left and right and up and down.
  • Sf black circle
  • the window portion 2042 for transmitting the plurality of point light source images Sf is disposed asymmetrically with respect to the center point 2044 (optical axis 2015a). Is done.
  • the window portion 2042 is formed in a slit shape elongated in the Z direction so that the illumination light beams from the plurality of point light source images Sf arranged in a line in the Z direction are transmitted together.
  • the image forming light beam from the pattern in the illumination area IR of the cylindrical mask M is a highly reflective part that efficiently reflects.
  • the plurality of point light source images Sf are arranged asymmetrically with respect to a plane p2005 that includes the optical axis 2015a of the second optical system 2015 and is orthogonal to the center plane pc (FIG. 21).
  • the direction dimension is set so narrow that the point light source image Sf is not shielded.
  • the light beam (illumination light beam EL1) from each of the plurality of point light source images Sf that has passed through each window portion 2042 passes through the second optical system 2015, and the pattern surface p2001 of the cylindrical mask M.
  • the upper illumination area IR is superimposed and irradiated. Thereby, the illumination area IR is illuminated with a uniform illuminance distribution.
  • the reflected light (imaging light beam EL2) from the mask pattern that appears in the illumination area IR of the pattern surface p2001 returns to the reflective surface p2004 of the concave mirror 2040, but the imaged light beam EL2 is struck again at the reflective surface p2004.
  • a light source image Sf ′ is obtained and separated.
  • the distribution of a large number of point light source images Sf ′ (particularly zero-order diffracted light) generated on the reflecting surface p2004 by the imaging light beam EL2 is a large number of illumination light beams EL1 with respect to the center point 2044.
  • the distribution of the point light source image Sf is point-symmetrical.
  • the illumination light flux is applied to a portion of the reflecting surface p2004 of the concave mirror 2040 on a line intersecting the plane p2005 (parallel to the XY plane) including the optical axis 2015a of the projection optical system PL (second optical system 2015).
  • the portion where the point light source image Sf is located is the window portion 2042 as in the previous arrangement conditions, and the center point 2044 is point-symmetrical with the window portion 2042. May be used as a reflection part (light-shielding part).
  • the point light source image Sf (window portion 2042) is located at the center point 2044
  • the illumination light beam originating from the point light source image Sf irradiates the illumination region IR on the cylindrical mask M
  • the light is reflected there.
  • the imaged light beam converges so as to form a point light source image Sf ′ at the center point 2044 (window portion 2042) of the reflection surface p2004
  • the imaged light beam may not be directed toward the substrate P.
  • the arrangement of many lens elements 2062E constituting the fly-eye lens 2062 is changed so that the point light source image Sf is not located near the center point 2044 of the reflection surface p2004, or the position of the center point 2044 is changed.
  • the corresponding lens element 2062E may be provided with a light shielding film (inked).
  • the window portions 2042 formed on the surface p2004 are arranged on a one-to-one basis, but this is not always necessary. That is, of the many point light source images SP formed on the exit-side surface Ep of the fly-eye lens 2062, a portion that can enter the back-side surface p2003 of the concave mirror 2040 and reach the reflecting surface p2004 (pupil surface pd).
  • the point light source image Sf may be shielded from light without leaving the window portion 2042 while remaining on the reflection surface.
  • the light shielding can be similarly realized by forming a light shielding film or a light absorption layer in a region where the point light source image Sf to be shielded is located in the back surface p2003 of the concave mirror 2040.
  • the imaging light beam EL2 (multiple point light source images Sf ′) incident on the concave mirror 2040 from the second optical system 2015 constituting the projection optical system PL does not necessarily have to be reflected entirely by the concave mirror 2040.
  • a plurality of point light source images Sf that are sources of the illumination light beam EL1 and a plurality of convergence formed by the image formation light beam EL2.
  • a light shielding portion may be provided to shield one or both of the point light source images Sf ′.
  • the illumination light from the illumination optical system IL is arranged on the pupil plane pd of the projection optical system PL.
  • the illumination light beam EL1 is incident on the illumination area IR on the cylindrical mask M through the second optical system 2015 that is incident from the back side of the concave mirror 2040 and constitutes the projection optical system PL and the upper reflection plane 2041a of the prism mirror 2041. Reach.
  • the imaging optical path of the projection optical system PL includes the first optical path from the illumination area IR (object plane) to the concave mirror 2040 (pupil plane pd), and the concave mirror 2040 (pupil plane pd) to the projection area PA (image plane). ),
  • the first optical path also serves as an oblique illumination optical path for guiding the illumination light beam from the illumination optical system IL to the illumination region IR.
  • the illumination light beam and the imaging light beam are efficiently spatially separated by the reflecting mirror disposed on or near the pupil plane of the projection optical system PL. Since the falling illumination system is used, the configuration of the apparatus can be simplified. In addition, compared with a method in which the illumination light beam and the imaging light beam are separated according to the difference in polarization state, it is not necessary to use a large polarizing beam splitter, a wave plate, or the like, and the apparatus configuration can be simplified.
  • the polarization separation of the illumination light beam and the imaging light beam must deal with the deterioration of the projected image characteristics (contrast, aberration, etc.) due to wavefront disturbance due to the wave plate and the extinction ratio problem in the polarization beam splitter.
  • the exposure apparatus U3 of the present embodiment incorporates a falling-down illumination method that irradiates the reflective mask M with illumination light through a part of the optical path of the projection optical system, the exposure apparatus U3 is incorporated inside the transmissive mask. Compared with the case where an illumination optical system is incorporated, the design flexibility of the illumination optical system is particularly high.
  • the light source device 2055 shown in FIG. 24 can reduce the size of the point light source image, it uses a laser light source (for example, excimer laser light such as KrF, ArF, XeF, etc.) having strong radiation directivity.
  • a laser light source for example, excimer laser light such as KrF, ArF, XeF, etc.
  • the present invention is not limited to this.
  • a lamp light source that emits bright line light such as g-line, h-line, and i-line, or a laser diode or a light-emitting diode (LED) that has low directivity of emitted light may be used.
  • the device manufacturing system 2001 (FIG. 20) of the present embodiment can simplify the configuration of the processing apparatus U3 (exposure apparatus), the manufacturing cost of the device can be reduced. Further, since the processing apparatus U3 performs scanning exposure while transporting the substrate P along the outer peripheral surface p2002 of the rotary drum 2030, the exposure processing can be performed efficiently. As a result, the device manufacturing system 2001 can manufacture devices efficiently.
  • FIG. 28 shows how the plurality of lens elements 2062E of the fly-eye lens 2062 are equivalently arranged in the reflecting surface p2004 of the concave mirror 2040 in the YZ plane orthogonal to the optical axis 2015a of the projection optical system PL.
  • FIG. The lens element closest to the center point 2044 so that the plurality of lens elements 2062E (point light source image Sf) are arranged in an asymmetry with respect to the center point 2044 (optical axis 2015a) of the reflecting surface p2004 of the concave mirror 2040.
  • the center of 2062E is displaced from the center point 2044 in the Y direction and the Z direction.
  • the cross-sectional shape (shape in the YZ plane) of each lens element 2062E of the fly-eye lens 2062 includes the rectangular opening 2064A of the illumination field stop 2064 as described above with reference to FIG.
  • the ratio Py / Pz between the cross-sectional dimension Py in the Y direction and the cross-sectional dimension Pz in the Z direction is set to approximately 4. Therefore, a large number of point light source images Sf distributed in the reflection surface p2004 (pupil surface pd) are also arranged at the pitch of the cross-sectional dimension Py in the Y direction and at the pitch of the cross-sectional dimension Pz in the Z direction.
  • the centers of the lens elements 2062E are arranged in a straight line in both the Y direction and the Z direction.
  • the lens elements 2062E adjacent in the Z direction are ⁇ Y in the Y direction. Displace them one by one.
  • each point light source image Sf is either ⁇ 45 degrees or ⁇ 135 degrees in the YZ plane. It will be located away in that direction.
  • a window portion 2042 that transmits each point light source image Sf is formed in the reflection surface p2004 of the concave mirror 2040.
  • the shape of the window portion Several forms can be considered for the dimensions and arrangement. Simply, as shown in FIG. 28, a circular window portion 2042H that transmits only one point light source image Sf is distributed over the entire reflection surface p2004 in accordance with the arrangement of the point light source images Sf. .
  • it may be a slot-like window 2042K that transmits all the point light source images Sf arranged in a line in the direction of 45 degrees obliquely with respect to the Y direction on the reflection surface p2004.
  • an illumination light beam from a series of point light source images Sf located in the window 2042K illuminates the illumination area IR of the cylindrical mask M
  • the reflected light beam (imaging light beam) is reflected on the reflecting surface of the concave mirror 2040.
  • the point light source image Sf ′ (including the first-order diffraction image) is converged on the reflection region 2042K ′ displaced from the window that transmits the point light source image Sf.
  • an oval (or gourd-shaped) window portion 2042L that allows two point light source images Sf arranged in a 45-degree oblique direction with respect to the Y direction to be transmitted as a set may be used.
  • Any of the windows 2042H, 2042K, and 2042L is formed as small as possible within a range that does not partially shield the illumination light from each point light source image Sf.
  • the amount of displacement ⁇ Y in the Y direction of the lens element 2062E of the fly-eye lens 2062 can be arbitrarily set, and the ratio Py / Pz of the cross-sectional dimensions of the lens element 2062E does not necessarily have to be an integral multiple. .
  • the present embodiment also relates to a modification of the configuration of the fly-eye lens 2062 and the arrangement of the point light source images Sf formed in the reflecting surface p2004 of the concave mirror 2040.
  • the centers of the plurality of lens elements 2062E of the fly-eye lens 2062 are linearly arranged in the Y direction and the Z direction within the YZ plane.
  • the point light source images Sf formed on the exit side of each lens element 2062E are arranged at a pitch of the cross-sectional dimension Py in the Y direction and arranged at a pitch of the cross-sectional dimension Pz in the Z direction.
  • the gravity center position Gc of the region (rectangle) surrounded by the four point light source images Sfv1 to Sfv4 is displaced from the center point 2044.
  • the gravity center position Gc is at a position different from the center point 2044.
  • circular window portions 2042H for individually transmitting the point light source images Sf are formed according to the arrangement pitch of the lens elements 2062E (point light source images Sf). Has been.
  • FIG. 30 a fourteenth embodiment will be described with reference to FIG.
  • This embodiment also relates to the modification of the configuration of the fly-eye lens 2062 and the arrangement of the point light source image Sf formed in the reflection surface p2004 of the concave mirror 2040, as in FIGS.
  • a plurality of lens elements 2062E (a cross-sectional shape is a rectangle elongated in the Y direction) of the fly-eye lens 2062 are arranged at a pitch of the cross-sectional dimension Py in the Y direction and densely at a pitch of the cross-sectional dimension Pz in the Z direction.
  • the lens elements 2062E for one row arranged in the Y direction are arranged by shifting (shifting) the positions in the Y direction alternately by Py / 2 for each row in the Z direction.
  • the point light source image Sf is generated on the exit end side of all the lens elements 2062E that receives illumination light (for example, EL0 in FIG. 24) from the light source.
  • the corresponding lens element 2062E is formed with a light shielding body 2062s so as to shield one of the two point light source images Sf having a point-symmetric arrangement relationship with each other.
  • a light shielding body 2062s (metal thin film or the like) is applied to the corresponding lens element 2062E so that the selected point light source image Sf is randomly and uniformly distributed in the reflection surface p2004 of the concave mirror 2040. Is formed. Even when such a fly-eye lens 2062 is used, a circular window 2042H for transmitting the point light source image Sf is formed on the reflection surface p2004 of the concave mirror 2040 as shown in FIG.
  • FIG. 31 shows a cross section of the concave mirror 2040 in a plane parallel to the XZ plane and including the optical axis 2015a (center point 2044).
  • each window portion 2042H is shown on the reflection surface p2004 on which the point light source image Sf (Sfa) is located. Is formed.
  • the concave mirror 2040 is formed by forming a reflective film on the concave surface side of a base material made of fine ceramics or glass ceramics having a low thermal expansion coefficient, for example.
  • a plurality of window portions 2042H are formed in accordance with the same conditions as in the previous embodiments.
  • the base material behind the window portion 2042H is a part of the illumination optical system IL.
  • a through hole (diameter of about 1 mm) through which the optical fiber Fbs passes is formed.
  • each optical fiber Fbs functions as a point light source image, and is installed on substantially the same surface as the reflection surface p2004.
  • the illumination light irradiated to the incident end of each optical fiber Fbs is set so that the illumination light beam (for example, EL1a) projected from the exit end of the optical fiber Fbs has a predetermined numerical aperture (divergence angle characteristic).
  • the direction of the illumination light beam from the exit end of each optical fiber Fbs is set so as to match the direction of the principal ray passing through the exit end (point light source image).
  • each of a large number of point light source images Sf is generated at the exit end of the optical fiber Fbs without using the fly-eye lens 2062, but an optical fiber corresponding to the number of the window portions 2042 ⁇ / b> H is required.
  • the system from the light source to the concave mirror 2040, that is, the entire illumination optical system IL can be made compact.
  • the concave mirror 2040 is provided with a small hole through which the exit end of the optical fiber Fbs passes.
  • a thin light pipe (cylindrical rod) made of quartz or the like is embedded in each small hole, and each of the light pipes is embedded.
  • An ultraviolet light emitting diode (LED) with a condensing lens may be installed on the incident end side, and the exit end side of each light pipe may be aligned with the reflecting surface p2004 of the concave mirror 2040.
  • FIGS. 32A and 32B, and FIGS. 33A, 33B, and 33C a sixteenth embodiment will be described with reference to FIGS. 32A and 32B, and FIGS. 33A, 33B, and 33C.
  • a rod lens rectangular glass or quartz
  • IR uniformly illuminate the illumination area IR on the cylindrical mask M.
  • FIG. 32A is a plan view of an optical path from the light guide member 2060 (optical fiber) that guides light of the light source to the projection optical system PL (second optical system 2015) as seen from the Y-axis direction
  • FIG. 32B is an optical path of FIG. 32A. It is the top view which looked at from the Z-axis direction.
  • the optical path configuration from the illumination field stop 2064 to the projection optical system PL is the same as the configuration of FIG.
  • 32A and 32B includes the light guide member 2060, the condenser lens 2093, the rod lens 2094, the illumination field stop 2064, the lens system 2066, and the like described in FIG.
  • the configuration of the projection optical system PL (second optical system 2015) after the concave mirror 2040 is the same as that shown in FIGS.
  • the illumination light beam EL0 emitted from the light guide member (optical fiber) 2060 is converged on or near the incident end face 2094a of the rod lens 2094 by the condenser lens 2093.
  • the cross-sectional shape (incident end face 2094a, exit end face 2094b) along the YZ plane of the rod lens 2094 is formed into a rectangle that includes the trapezoid of the illumination field stop 2064 and the rectangular opening 2064A (FIG. 26).
  • the cross-sectional shape is substantially similar to the cross-sectional shape of the lens element 2062E of the fly-eye lens 2062 shown in FIGS. 25 and 28-30.
  • the illumination light beam EL0 converged on the incident end surface 2094a is internally applied many times between the side surface 2094c parallel to the XZ plane and the side surface 2094d parallel to the XY plane inside the rod lens 2094.
  • the reflection is repeated and proceeds to the exit end face 2094b.
  • the illuminance distribution of illumination light is most uniform on the exit end face 2094b, but the uniformity improves as the number of internal reflection repetitions increases.
  • the emission end face 2094b is arranged so as to coincide with the face 2014b conjugate with the illumination region IR on the cylindrical mask M.
  • the rod lens 2094 of this embodiment has a rectangular cross section, the number of reflections of illumination light between the opposing side surfaces 2094c is less than the number of reflections of illumination light between the opposing side surfaces 2094d.
  • the length of the rod lens 2094 is set so that the number of times the illumination light beam EL0 is reflected by the inner surface of the rod lens 2094 is two or more from the viewpoint of improving the illuminance uniformity.
  • the illumination field stop 2064 may be omitted because the shape of the exit end face 2094b of the rod lens 2094 defines the outer edge of the illumination region IR.
  • the center axis AX2003 is the projection optical system PL. Is parallel to the optical axis 2015a (the optical axis 2014a of the lens system 2066), but is decentered in the Z direction. Furthermore, the exit end of the light guide member 2060 is disposed on the optical axis 2093a of the condenser lens 2093. The optical axis 2093a is displaced in the ⁇ Y direction with respect to the central axis AX2003 of the rod lens 2094. Is done.
  • FIGS. 33A to 33C are views of the condensing lens 2093 viewed from the exit end face 2094b side of the rod lens 2094 in the X-axis direction
  • FIG. 33B is a view of the rod lens 2094 viewed from the lens system 2066 side in the X-axis direction
  • FIG. 33C is a concave mirror 2040. It is the figure which looked at this reflective surface p2004 from the X-axis direction.
  • the cross section of the rod lens 2094 is a rectangle defined by a side surface 2094d parallel to the XY plane and a side surface 2094c parallel to the XZ plane, and the central axis AX2003 of the rod lens 2094 and the condensing lens 2093.
  • the optical axis 2093a is relatively eccentric in the Y direction.
  • the central axis AX2003 of the rod lens 2094 is decentered in the Z direction with respect to the optical axis 2014a (2015a) of the lens system 2066.
  • the concave lens and the lens system 2066 as the base material of the concave mirror 2040 are arranged such that the Fourier transform surface (pupil surface pd) of the surface 2014b on which the exit end surface 2094b of the rod lens 2094 is located is on the reflective surface p2004 of the concave mirror 2040.
  • the reflection surface p2004 of the concave mirror 2040 a large number of point light source images Sf are formed with a pitch DSy in the Y direction and a pitch DSz in the Z direction.
  • These point light source images Sf appear as virtual images of spot images of the illumination light beam EL0 converged on the incident end face 2094a of the rod lens 2094.
  • the pitch DSy of the array of the point light source images Sf in the direction parallel to the long side (Y direction) of the cross section is parallel to the short side. It becomes longer than the pitch DSz of the arrangement of the point light source images Sf in the direction (Z direction).
  • the number of internal reflections of the illumination light in the rod lens 2094 is generated on the reflection surface p2004 of the concave mirror 2040 because the Z direction is larger than the Y direction.
  • the number of point light source images Sf also increases in the Z direction compared to the Y direction.
  • five point light source images Sf are arranged in the Z direction, and three point light source images Sf are arranged in the Y direction.
  • the distribution of the point light source image Sf generated on the reflection surface p2004 of the concave mirror 2040 by decentering the central axis AX2003 of the rod lens 2094 and the optical axis 2093a of the condenser lens 2093 relative to each other in the Y direction is
  • the center point 2044 (optical axis 2015a) is entirely decentered in the Y direction, and each of the point light source images Sf can be arranged in an asymmetrical relationship with respect to the center point 2044.
  • the reflection surface p2004 of the concave mirror 2040 has a slot-like window 2042 that transmits a plurality of point light source images Sf arranged in a row in the Z direction in the Y direction. Three rows are formed at the pitch DSy.
  • the width in the Y direction of each window portion 2042 is set as small as possible within a range that does not block the illumination light beam that is generated from the point light source image Sf.
  • These slot-like window portions 2042 are also formed so as to be asymmetric with respect to the center point 2044.
  • the distance in the Y direction from the point light source image Sf closest to the center point 2044 (optical axis 2015a) to the center point 2044 on the reflection surface p2004 (pupil surface pd) of the concave mirror 2040 (denoted as Yk). Is set to be less than half of the interval (Yw) between the windows 2042 arranged in the Y direction, that is, Yk ⁇ (Yw / 2), the light from the central axis AX2003 of the rod lens 2094 and the condenser lens 2093.
  • the amount of eccentricity of the shaft 2093a in the Y direction is set.
  • the cylindrical mask M As described above, when the point light source image Sf that is the source of the illumination light beam EL1 that irradiates the illumination region IR of the cylindrical mask M is arranged on the reflection surface p2004 (pupil surface pd) of the concave mirror 2040, the cylindrical mask M As shown in FIG. 33C, the imaging light beam EL2 generated from the illumination area IR of the point is a diffracted image Sf ′ of the point light source image Sf (including 0th-order light and ⁇ 1st-order diffracted light) on the reflection surface p2004. Become distributed. On the reflecting surface p2004, the diffraction image Sf 'and the point light source image Sf that is the source of the illumination light beam EL1 are positioned point-symmetrically with respect to the center point 2044.
  • the relationship between the distance Yk and the interval Yw is set to Yk ⁇ (Yw / 2)
  • a plurality of images generated on the concave mirror 2040 (pupil surface pd) by the imaging light beam EL2 are used.
  • the diffracted images Sf ′ are all formed on the reflecting portion that is shifted from the window portion 2042.
  • the imaging light beam EL2 is reflected by the reflecting portion of the concave mirror 2040 with almost no loss, and as shown in FIG. 21, the projection area on the substrate P held along the outer peripheral surface p2002. Projected on PA.
  • each of the many point light source images Sf is obtained by displacing the convergence position of the illumination light beam EL0 on the incident end surface 2094a of the rod lens 2094 from the central axis AX2003.
  • the center point 2044 of the reflecting surface p2004 of the concave mirror 2040 can be set to be asymmetric with respect to each other.
  • the configuration of a processing apparatus (exposure apparatus) U3 according to the seventeenth embodiment will be described with reference to FIGS.
  • the dimension in the Y direction of the pattern area of the cylindrical mask M and the dimension in the Y direction of the pattern exposure area on the substrate P are illuminated by the projection optical system PL shown in FIG.
  • a plurality of projection optical systems are arranged in the Y direction, and an effective exposure range is expanded in the Y direction. For this purpose, it is necessary to project the pattern of the cylindrical mask M onto the substrate P as an erect image.
  • the X direction of the mask pattern image projected onto the substrate P is upright, but the Y direction is reversed. Therefore, by providing a projection optical system having the same configuration in tandem (serial), the projection image in which the Y direction is inverted is inverted again in the Y direction. As a result, in the projection area PA on the substrate P, X Erect image in both direction and Y direction.
  • FIG. 34 shows an overall schematic configuration of the exposure apparatus according to the present embodiment
  • FIG. 35 shows the arrangement relationship between the illumination area IR and the projection area PA by each of the plurality of projection optical systems, and the orthogonal coordinate system XYZ in each figure is These are combined with the coordinate system set in the previous embodiment of FIG. Also, the same reference numerals are given to the equivalent members and elements of the exposure apparatus shown in FIGS.
  • the substrate P transported from the upstream of the transport path is wound around a part of the outer peripheral surface of the rotary drum 2030 via a transport roller, a guide member, etc. (not shown), and then a guide member or transport roller (not shown) is attached to the substrate P.
  • the second drive unit 2032 drives the rotary drum 2030 to rotate clockwise around the rotation center axis AX2002, and the substrate P is fed at a constant speed.
  • the projection areas PA2001 to PA2006 of the six projection optical systems PL2001 to PL2006 are positioned on the portion of the cylindrical outer peripheral surface of the rotary drum 2030 where the substrate P is wound.
  • six illumination areas IR2001 to IR2006 are set on the outer peripheral surface (cylindrical mask pattern surface) of the cylindrical mask M.
  • the six projection optical systems PL2001 to PL2006 all have the same optical configuration, and the central plane pc (parallel to the YZ plane) including the rotation center axis AX2001 of the cylindrical mask M and the rotation drum 2030 as the rotation center axis AX2002.
  • projection optical systems PL2001, PL2003, PL2005 (collectively referred to as odd-numbered projection optical systems PLo) and on the right side (+ X direction). It is divided into PL2002, PL2004, and PL2006 (also collectively referred to as an even-numbered projection optical system PLe).
  • the projection optical systems PL2001 to PL2006 of the present embodiment include the projection optical system PL shown in FIG. 21 and illumination optical systems IL2001 to IL2006 for slanting illumination. Since the configuration is the same as that in FIG. 21, the projection optical system PL2001 and the illumination optical system IL2001 will be briefly described as a representative.
  • Illumination optical system IL2001 receives illumination light beam EL0 from light source device 2055, and enters from the back side of concave mirror 2040 disposed on the pupil plane of the upper unit of projection optical system PL2001 (projection optical system PL similar to FIG. 21). A large number of point light source images Sf are generated on the reflection surface p2004.
  • the illumination light beam EL1 using the point light source image Sf as a source is reflected by the reflection plane 2041a on the upper side of the prism mirror 2041, and irradiates the illumination region IR2001 on the outer peripheral surface of the cylindrical mask M.
  • the imaging light beam EL2 reflected from the mask pattern in the illumination area IR2001 is reflected by the reflecting plane 2041a, then reflected by the concave mirror 2040, and reflected by the lower reflecting surface (2041b) of the prism mirror 2041.
  • An aerial image (intermediate image) of the mask pattern is formed on the surface p2007 (intermediate image surface p2007).
  • the projection unit at the rear stage of the projection optical system PL2001 is also a half field equal magnification catadioptric projection system including a prism mirror, a plurality of lens elements, a concave mirror 2078 disposed on the pupil plane, and the like at an intermediate image plane p2007.
  • the imaging light beam EL2 forming the intermediate image is reflected by the concave mirror 2078, then reflected by the lower reflection plane 2076b of the prism mirror (2076), reaches the projection area PA2001 on the substrate P, and enters the projection area PA2001. Produces an erect image of the mask pattern.
  • the projection unit at the subsequent stage of the projection optical system PL2001 (from the intermediate image plane to the projection area) only needs to re-image the intermediate image formed on the intermediate image plane p2007 on the projection area PA2001 on the substrate P.
  • the reflection part of the concave mirror 2078 is not provided with the window part 2042 which is formed on the reflection surface p2004 of the concave mirror 2040.
  • the projection optical system PL2001 having the above-described configuration (the same applies to the other projection optical systems PL2002 to PL2006) is a so-called multi-lens type projection system, illumination is performed like the projection optical system PL of FIG.
  • the principal ray passing through the center point in the region IR and the principal ray passing through the center point in the projection region PA2001 may not be arranged in the center plane pc.
  • the projection optical system PL2001 (PL2003, PL2005 is the same so that the extension line D2001 of the principal ray passing through the center point in the illumination area IR2001 is directed to the rotation center axis AX2001 of the cylindrical mask M.
  • the angle ⁇ 2001 (see FIG. 21) of the reflection plane 2041a of the prism mirror 2041 of the upper projection unit of) is set to a value other than 45 °.
  • the reflection plane 2076b of the prism mirror 2076 of the projection unit below the projection optical system PL2001 is such that the principal ray extension D2001 passing through the center point in the projection area PA2001 is directed to the rotation center axis AX2002 of the rotary drum 2030. Is set to a value other than 45 ° with respect to the XY plane.
  • the angle ⁇ 2001 of the reflection plane 2041a of the prism mirror 2041 of the upper projection unit is set to a value other than 45 ° so as to be directed to the rotation center axis AX2001 of the mask M, and the principal ray passing through the center point in the projection area PA2002
  • the angle of the reflection plane 2076b of the prism mirror 2076 in the rear stage projection unit is set to a value other than 45 ° with respect to the XY plane so that the extended line D2002 of the projection unit D2002 faces the rotation center axis AX2002 of the rotary drum 2030.
  • the odd-numbered projection optical system PLo and the even-numbered projection optical system PLe in which the chief ray extension lines D2001 and D2002 are inclined with respect to the center plane pc are viewed from the center plane pc when viewed in the XZ plane. However, when viewed in the XY plane, they are displaced in the Y direction. Specifically, each projection is performed so that the illumination areas IR2001 to IR2006 formed on the pattern surface of the cylindrical mask M and the projection areas PA2001 to PA2006 formed on the substrate P have the arrangement relationship shown in FIG. Optical systems PL2001 to PL2006 are installed.
  • FIG. 35 is a view of the arrangement of the illumination areas IR2001 to IR2006 and the projection areas PA2001 to PA2006 in the XY plane, and the left figure shows the illumination areas IR2001 to IR2006 on the cylindrical mask M, with an intermediate image.
  • the image on the right side is viewed from the side of the intermediate image plane p2007, and the right side view shows the projection areas PA2001 to PA2006 on the substrate P supported by the rotary drum 2030 from the side of the intermediate image plane p2007.
  • a symbol Xs in FIG. 35 indicates a moving direction (rotational direction) of the cylindrical mask M (rotating drum 2020) and the rotating drum 2030.
  • each of the illumination regions IR2001 to IR2006 has a trapezoidal shape elongated in the Y direction, having an upper base and a lower base parallel to the center plane pc (parallel to the Y axis).
  • each of the illumination optical systems IL2001 to IL2006 shown in FIG. 34 includes the illumination field stop 2064 as shown in FIG.
  • each of the projection optical systems PL2001 to PL2006 in FIG. 34 forms an intermediate image on the intermediate image plane p2007. Therefore, when a field stop having a trapezoidal aperture is disposed there, the shape of each illumination region IR2001 to IR2006 is formed. May be a simple rectangular shape (a size including a trapezoidal opening).
  • the center point of each of the illumination regions IR2001, IR2003, IR2005 formed by the odd-numbered projection optical system PLo is a surface Lo (perpendicular to the XY plane) parallel to the center surface pc.
  • the center point of each of the illumination regions IR2002, IR2004, and IR2006 that are positioned above and formed by the even-numbered projection optical system PLe is positioned on a plane Le (perpendicular to the XY plane) parallel to the center plane pc.
  • each of the illumination areas IR2001 to IR2006 has a trapezoidal shape
  • the dimension of the lower base in the Y direction is A2002a
  • the dimension of the upper base in the Y direction is A2002b
  • the center points of the odd-numbered illumination areas IR2001, IR2003, and IR2005 are It is arranged at intervals (A2002a + A2002b) in the Y direction
  • the center points of the even-numbered illumination areas IR2002, IR2004, IR2006 are also arranged at intervals (A2002a + A2002b) in the Y direction.
  • the even-numbered illumination areas IR2002, IR2004, and IR2006 are shifted relative to the odd-numbered illumination areas IR2001, IR2003, and IR2005 by a dimension (A2002a + A2002b) / 2 in the Y direction.
  • the distances in the X direction from the center plane pc of the surface Lo and the surface Le are set to be equal to each other.
  • each of the illumination areas IR2001 to IR2006 when viewed along the circumferential direction (Xs direction) of the outer peripheral surface of the cylindrical mask M, the ends of the illumination areas adjacent to each other in the Y direction (trapezoidal).
  • the oblique sides are configured to overlap (overlap) each other.
  • the pattern area A2003 is surrounded by a frame-shaped pattern non-formation area A2004, but the pattern non-formation area A2004 is made of a material having an extremely low reflectance (or high light absorption rate) with respect to illumination light. ing.
  • the projection areas PA2001 to PA2006 on the substrate P are cylindrical when the illumination field stop 2064 as shown in FIG. 26 is provided in each of the illumination optical systems IL2001 to IL2006.
  • This is a reflection (similar relationship) reflecting the arrangement and shape of the illumination regions IR2001 to IR2006 formed on the outer peripheral surface of the mask M.
  • the center points of the odd-numbered projection areas PA2001, PA2003, and PA2005 are located on the plane Lo
  • the center points of the even-numbered projection areas PA2002, PA2004, and PA2006 are located on the plane Le.
  • the substrate P is fed at a constant speed in the circumferential direction (Xs direction) along the outer peripheral surface of the rotary drum 2030.
  • the area A2007 indicated by the oblique lines in FIG. This is a portion exposed by 100% of the target exposure amount (toe amount) by the two projection areas PA2001 to PA2006.
  • the partial area A2005a exposed at the end in the + Y direction does not reach the target exposure amount.
  • the substrate P is sent in the Xs direction (circumferential direction) and the area A2006 is exposed by the projection area PA2002 corresponding to the illumination area IR2002, the insufficient exposure amount is integrated, resulting in the partial area.
  • A2005a is also exposed at 100% of the target exposure amount.
  • the entire projected image of the pattern area A2003 formed on the outer peripheral surface of the cylindrical mask M is repeated at the same magnification in the longitudinal direction on the substrate P every rotation of the cylindrical mask M. It will be transcribed.
  • the principal rays of the imaging light beam EL2 from the illumination areas IR2001 to IR2006 on the cylindrical mask M toward the projection optical systems PL2001 to PL2006 the principal rays passing through the center points in the illumination areas IR2001 to IR2006
  • the extension lines D2001 and D2002 intersect with the rotation center axis AX2001 of the cylindrical mask M, but this is not always necessary, and the principal ray passing through any point in each of the illumination regions IR2001 to IR2006 is the rotation center. It only has to cross the axis AX2001.
  • any one of the principal rays is used as the rotation center axis of the rotary drum 2030. What is necessary is just to make it correspond with the extension line D2001, D2002 which cross
  • FIG. 36 representatively shows the detailed configurations of the projection optical system PL2001 and the illumination optical system IL2001, but the configurations of the other projection optical systems PL2002 to PL2006 and the illumination optical systems IL2002 to IL2006 are the same.
  • the illumination light beam EL0 from the light source device 2055 (see FIG. 24) including the light guide member 2060 and the lens system 2061 is a fly-eye lens 2062 (see FIGS. 25 and 28-30) of the illumination optical system IL2001. ).
  • Illumination luminous flux generated from a large number of point light source images generated on the surface Ep on the exit side of the fly-eye lens 2062 is uniformly illuminated by a condenser lens 2065 on a surface 2014b conjugate with a mask on which the illumination field stop 2064 is disposed. Be distributed.
  • the illumination light beam that has passed through the opening of the illumination field stop 2064 is reflected by the lens system 2066, the base material (quartz or the like) of the concave mirror 2040 of the second optical system 2015 on the upper side (first stage) of the projection optical system PL2001, and the concave mirror 2040.
  • a window (2042) formed on the surface p2004 is transmitted through the second optical system 2015, and further reflected by the reflection plane 2041a on the upper side of the prism mirror 2041 in the direction along the extension line D2001.
  • the illumination area IR is reached.
  • the reflecting surface p2004 of the concave mirror 2040 is disposed on the pupil plane pd in the imaging optical path of the projection optical system PL2001, and the reflecting surface p2004 is connected to the exit-side surface Ep of the fly-eye lens 2062. Since they are arranged substantially in a conjugate manner, a relay of a number of point light source images generated on the surface Ep on the exit end side of the fly-eye lens 2062 is generated in the window 2042 formed on the reflection surface p2004.
  • the focus correction optical member 2080 and the image shift optical member 2081 are inclined between the upper reflection plane 2041a of the prism mirror 2041 and the pattern surface p2001 of the cylindrical mask M.
  • the focus correction optical member 2080 is formed by superposing two wedge-shaped prisms in opposite directions (in the reverse direction in the X direction in FIG. 36) so as to form a transparent parallel plate as a whole. By sliding the pair of prisms to change the thickness of the parallel plate, the effective optical path length of the imaging optical path is finely adjusted, and the pattern image formed on the intermediate image plane p2007 and the projection area PA2001. The focus state is finely adjusted.
  • the image shift optical member 2081 is composed of a transparent parallel flat glass that can be tilted in the XZ plane in FIG. 36 and a transparent parallel flat glass that can be tilted in a direction perpendicular thereto.
  • the pattern image formed on the intermediate image plane p2007 and the projection area PA2001 can be slightly shifted in the X direction or the Y direction.
  • the image of the mask pattern appearing in the illumination area IR2001 includes the focus correction optical member 2080, the image shift optical member 2081, the reflection plane 2041a of the prism mirror 2041, and the second optical system on the upper side (first stage) of the projection optical system PL2001.
  • an image is formed on the intermediate image plane p2007 via the reflection plane 2041b of the prism mirror 2041.
  • a field stop 2075 having a trapezoidal shape as shown in FIG. 35 can be arranged.
  • the opening of the illumination field stop 2064 provided in the illumination optical system IL2001 may be a rectangle (rectangular shape) including the trapezoidal opening of the field stop 2075.
  • the imaging light beam that has become an intermediate image at the opening of the field stop 2075 is reflected by the reflection plane 2076a of the lower (second stage) prism mirror 2076 that constitutes the projection optical system PL2001, the second optical system 2077, and the prism mirror 2076.
  • the light is projected onto the projection area PA2001 on the substrate P wound around the outer peripheral surface p2002 of the rotary drum 2030 via the reflection plane 2076b.
  • the reflecting surface of the concave mirror 2078 included in the second optical system 2077 is disposed on the pupil plane pd, and the reflecting plane 2076b below the prism mirror 2076 is an extension line in which the principal ray of the imaging light beam is inclined with respect to the center plane pc.
  • the angle with respect to the XY plane is set to be less than 45 ° so as to proceed along D2001.
  • FIG. 36 there are three lenses, a concave lens, a convex lens, and a concave lens, between the lower reflection plane 2076b of the prism mirror 2076 and the projection area PA2001 on the substrate P wound around the rotary drum 2030.
  • the front and rear concave lenses are fixed, and a magnification correcting optical member 2083 is provided for moving the convex lens between them in the direction of the optical axis (chief ray).
  • the pattern image formed in the projection area PA2001 is isotropically enlarged or reduced by a minute amount while maintaining a telecentric imaging state.
  • a rotation correction mechanism is also provided that allows either one of the prism mirror 2041 or 2076 to be slightly rotated around an axis parallel to the Z axis.
  • This rotation correction mechanism for example, rotates each of the plurality of projection areas PA2001 to PA2006 (and the projected mask pattern image) shown in FIG. 35 in the XY plane.
  • each of the six sets of projection optical systems PL2001 to PL2006 includes each illumination on the outer peripheral surface (pattern surface) of the cylindrical mask M.
  • the areas IR2001 to IR2006 can be illuminated obliquely with illumination light having a principal ray that intersects the rotation center axis AX2001 of the cylindrical mask M.
  • the principal ray traveling in the normal direction of the pattern surface p2001 of the cylindrical mask M from each of the illumination regions IR2001 to IR2006 is also normal to each of the projection regions PA2001 to PA2006 on the substrate P along the outer peripheral surface p2002.
  • the imaging light beam is deflected so as to be incident from. Therefore, the defocus of the projected image can be reduced, the occurrence of processing failures such as exposure failures is suppressed, and as a result, the occurrence of defective devices is suppressed.
  • each of the projection optical systems PL2001 to PL2006 is configured so that the principal ray of the imaging light beam is inclined with respect to the center plane pc between the outer peripheral surface of the cylindrical mask M and the prism mirror 2041 (reflection plane 2041a). Since it is configured, in the spatial arrangement of the projection optical systems PL2001 to PL2006, the condition for mutual interference (collision) is relaxed.
  • the principal plane of the imaging light beam passing through the intermediate image plane p2007 of each of the projection optical systems PL2001 to PL2006 is parallel to the center plane pc so that the reflection plane 2041b below the prism mirror 2041 and the prism mirror 2076
  • the upper reflection plane 2076a is set at an angle of 45 ° with respect to the XY plane.
  • an image of a cylindrical surface mask pattern is projected and exposed on the surface of the substrate P supported in the cylindrical surface shape.
  • One of the M and the substrate P may be supported on a plane, or both may be supported on a plane.
  • the substrate P is wound around a rotating drum 2030 and supported in a cylindrical shape, and the mask M is formed on parallel flat glass (quartz) as in the prior art and is linearly moved in the X direction.
  • the mask M is supported by a rotating drum 2020 as shown in FIG. 34, and the substrate P is supported by a flat plane stage or an air pad type holder, and is scanned and sent linearly in the X direction. Any of these may be used.
  • the projection optical system and the illumination optical system according to the previous embodiments can be applied regardless of whether the mask M or the substrate P is supported in a cylindrical surface or a planar shape, but is parallel to the XY plane.
  • the inclination angle of the upper reflection plane 2041a of the prism mirror 2041 and the lower reflection plane 2076b of the prism mirror 2076 with respect to the XY plane may be set to 45 °.
  • the object plane of the projection optical system is matched with the normal passing through the center of the illumination area IR (object plane) on the mask M and the normal passing through the center of the projection area PA (image plane) on the substrate P.
  • the principal ray on the side and the principal ray on the image plane side may be tilted in the XZ plane.
  • FIG. 37 is a diagram showing a configuration of the projection optical system PL (PL2001 in the case of a multi-lens system) according to the eighteenth embodiment.
  • the projection optical system PL (PL2001) of the present embodiment uses an imaging light beam EL2 (the principal ray is EL6) from the mask pattern in the illumination area IR (IR2001) on the outer peripheral surface of the cylindrical mask M as a plane mirror.
  • the reflecting surface of the plane mirror 2101 is reflected through a second optical system 2015 (half-field type catadioptric imaging system) having a concave mirror 2040 that is reflected by the reflecting surface 2100a of 2100 and the reflecting surface p2004 is disposed on the pupil surface.
  • An intermediate image of the same size as the mask pattern reflected in 2101a and appearing in the illumination area IR (IR2001) is formed on the intermediate image plane Im.
  • the intermediate image formed on the intermediate image plane Im is formed on the outer peripheral surface p2002 parallel to the XY plane by an enlarged imaging system 2102 (having an optical axis 2102a parallel to the Z axis) having a magnification of 2 times or more, for example.
  • Projection is performed on a projection area PA (PA2001) on the substrate P supported along the projection.
  • the substrate P is supported via a fluid bearing layer on a planar holder HH having a fluid bearing pad with a flat surface.
  • a large number of point light source images Sf generated by illumination light from the back illumination optical system IL (IL2001) are applied to the reflection surface p2004 of the concave mirror 2040 constituting the projection optical system PL (PL2001).
  • a window portion 2042 for transmitting is formed.
  • the projection optical system PL including the illumination optical system IL (IL2001) and the plane mirrors 2100 and 2101 is used.
  • the XZ plane is symmetrically arranged with respect to the center plane pc in the XZ plane, and the Y direction end (triangle portion) of the projection area PA (PA2001) with respect to the Y direction.
  • the projection images are arranged apart from each other so as to partially overlap.
  • the center plane pc is a plane that includes the rotation center axis AX2001 of the cylindrical mask M and is perpendicular to the XY plane (outer peripheral plane p2002), the odd-numbered projection optical systems PL2001, PL2003.
  • the center points of the illumination areas IR2001, IR2003... are such that the principal ray EL6 on the mask side is inclined with respect to the center plane pc.
  • the circumference is separated by a distance DMx from the line of intersection with pc. Therefore, the center points of the illumination areas IR2002, IR2004,... Of the even-numbered projection optical systems PL2002, PL2004,...
  • the mask pattern for the odd-numbered illumination areas IR2001, IR2003... Formed on the cylindrical mask M and the even-numbered illumination area IR2002 are formed.
  • the mask pattern for IR2004... May be formed with a relative shift in the circumferential direction.
  • FIG. 38 is a diagram showing the configuration of the projection optical system PL of the nineteenth embodiment.
  • the projection optical system PL of this embodiment includes a lens system 2103, a lens system 2104, a concave mirror (reflection optical member) 2040 disposed on the pupil plane, deflection mirrors 2106 and 2107, and a lens system 2108.
  • the imaging light beam EL2 from the illumination region IR on the outer peripheral surface of the cylindrical mask M is incident on the lens system 2103 via the half field on the ⁇ X side with respect to the optical axis 2103a of the lens system 2103. Then, the light enters the lens system 2104 (its optical axis 2104a is coaxial with the optical axis 2103a).
  • the imaging light beam EL2 that has passed through the lens system 2104 is reflected by the reflecting surface p2004 of the concave mirror 2040 (its optical axis is 2104a), reflected by the reflecting surface 2106a of the deflecting mirror 2106 in the ⁇ X direction, and the lens systems 2103, 2104, After being guided out of the optical path formed by the concave mirror 2040, it is reflected in the ⁇ Z direction by the reflecting surface 2107 a of the deflecting mirror 2107.
  • the imaging light beam EL2 reflected by the deflection mirror 2107 passes through the lens system 2108 and is irradiated onto the projection area PA.
  • the projection optical system PL causes the image of the mask pattern appearing in the illumination area IR on the cylindrical mask M to be projected into the projection area PA on the substrate P that is planarly supported by the same configuration as in FIG. Form an image.
  • the projection optical system of the present embodiment is designed so as not to form an intermediate image plane, particularly in order to realize magnified projection with a compact system.
  • an extension line D2001 of the principal ray EL6 on the cylindrical mask M side of the projection optical system PL is set so as to intersect the rotation center axis AX2001 of the cylindrical mask M, and the principal ray EL6 on the substrate P side is It is set to be perpendicular to the surface of the substrate P to be plane supported.
  • the imaging light beam EL2 from within the illumination area IR is designed to pass through the ⁇ X side of the optical axis 2108a (parallel to the Z axis and perpendicular to the substrate P) of the lens system 2108 that gives the main magnification. can do. Therefore, the portion of the lens system 2108 on the + X side from the optical axis 2108a is not cut out and does not contribute to the projection of the mask pattern. Thereby, the size of the projection optical system PL in the X direction (scanning direction of the substrate P) can be reduced.
  • the illumination optical system IL and the light source device 2055 are arranged on the back side of the concave mirror 2040 as in FIGS. 21, 23, 31, 32A, 32B, and 37, and the reflecting surface of the concave mirror 2040 is provided.
  • a large number of point light source images Sf are generated in the window (2042) formed in p2004 (arranged on the pupil plane).
  • the distribution of the point light source image on the reflection surface p2004 and the shape and arrangement of the windows in the reflection surface p2004 are as shown in FIGS. 27 to 30 or FIGS. 33A to 33C in accordance with the conditions described in FIG. Set to
  • the cylindrical mask M is formed on the surface of a cylindrical base material such as metal, ceramics, glass, etc.
  • a sheet-like reflection type in which a pattern is formed with a reflection film on one surface of a strip-like ultrathin glass plate (for example, a thickness of 100 to 500 ⁇ m) with good flatness.
  • a mask may be formed by winding the mask along the outer peripheral surface of the metallic rotating drum 2020.
  • Such a sheet-like reflective mask may be permanently affixed to the outer peripheral surface of the rotating drum 2020 or may be fixed so as to be releasable (replaceable).
  • the reflective film of the sheet-like reflective mask includes a film made of a material having a high reflectance with respect to the illumination light beam EL1, such as aluminum, a dielectric multilayer film, and the like.
  • the rotary drum 2020 may be provided with a light shielding layer (film) that absorbs the illumination light beam EL1 that has passed through the transparent portion of the sheet-like reflective mask, and the light shielding layer also suppresses the generation of stray light.
  • the cylindrical mask M may be formed by forming only a pattern corresponding to one device (one display panel) over the entire circumference, or corresponds to one device (one display panel). A plurality of patterns to be formed may be formed. Furthermore, the device patterns on the cylindrical mask M may be repeatedly arranged in the circumferential direction of the outer peripheral surface, or a plurality of device patterns may be arranged in a direction parallel to the rotation center axis AX2001.
  • the cylindrical mask M may be provided with a pattern for manufacturing the first device and a pattern for manufacturing a second device different from the first device.
  • FIG. 39 is a flowchart showing the device manufacturing method of this embodiment.
  • the function / performance design of a device such as a display panel using a self-luminous element such as an organic EL is performed, and necessary circuit patterns and wiring patterns are designed by CAD or the like (step 201). .
  • a mask M (cylindrical or planar) for the necessary layers is manufactured based on the design of the device such as a pattern for each layer designed by CAD (step 202).
  • a transparent film or sheet as a substrate of the device, a substrate such as an extremely thin metal foil, or a flexible substrate (resin film, metal foil film, plastic, etc.) as a substrate of a display panel is wound.
  • a prepared roll is prepared by purchase, manufacture, or the like (step 203).
  • the roll-shaped substrate prepared in step 203 has a surface modified as necessary, a substrate in which an underlayer (for example, minute unevenness by an imprint method) is formed in advance, and a light-sensitive substrate.
  • a functional film or a transparent film (insulating material) previously laminated may be used.
  • the prepared substrate is put into a roll-type or patch-type production line, and is composed of electrodes, wiring, insulating films, TFTs such as semiconductor films (thin film semiconductors), etc. that constitute devices such as display panel devices on the substrate.
  • a backplane layer is formed, and a light emitting layer made of a self light emitting element such as an organic EL serving as a display pixel portion is formed so as to be laminated on the backplane layer (step 204).
  • Step 204 typically includes a step of forming a resist pattern on a film on the substrate and a step of etching the film using the resist pattern as a mask.
  • the exposure process which forms a pattern by irradiating the functional photosensitive layer with patterned exposure light and forming a hydrophilic part and a water-repellent part according to the pattern shape on the functional photosensitive layer.
  • a step of applying a plating base solution or the like to the highly hydrophilic portion of the layer and depositing and forming a metallic pattern by electroless plating is performed.
  • this step 204 includes a conventional photolithography process in which the photoresist layer is exposed using the exposure apparatus described in each of the previous embodiments.
  • the light-sensitive catalyst layer is subjected to pattern exposure and electroless.
  • the process includes a wet process for forming a metal film pattern (wiring, electrodes, etc.) by a plating method, a printing process for drawing a pattern with a conductive ink containing silver nanoparticles, or the like.
  • the substrate is diced or cut, or another substrate manufactured in a separate process
  • a process of bonding a protective film (to the environmental barrier layer), a sheet-like color filter having a sealing function, a thin glass substrate or the like to the surface of each display panel device is performed, and the device is assembled (step 205).
  • post-processing such as inspection is performed on the device, such as whether the display panel device functions normally or satisfies desired performance and characteristics (step 206).
  • a device such as a display panel (flexible display) can be manufactured.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lenses (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
PCT/JP2012/076326 2011-12-20 2012-10-11 基板処理装置、デバイス製造システム、及びデバイス製造方法 WO2013094286A1 (ja)

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JP2013550164A JP6056770B2 (ja) 2011-12-20 2012-10-11 基板処理装置、デバイス製造システム、及びデバイス製造方法
KR1020147016863A KR101737680B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
KR1020187034105A KR101961605B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
KR1020187009744A KR101924309B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
KR1020177010559A KR101848590B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
CN201280063563.4A CN104011597B (zh) 2011-12-20 2012-10-11 基底处理装置、器件制造系统、以及器件制造方法
KR1020177010558A KR101849508B1 (ko) 2011-12-20 2012-10-11 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014024594A1 (ja) * 2012-08-06 2014-02-13 株式会社ニコン 処理装置およびデバイス製造方法
WO2014097859A1 (ja) * 2012-12-18 2014-06-26 株式会社ニコン 基板処理装置、デバイス製造システム及びデバイス製造方法
JP2019117409A (ja) * 2012-11-06 2019-07-18 株式会社ニコン 投影露光装置
TWI709831B (zh) * 2014-09-04 2020-11-11 日商尼康股份有限公司 元件製造方法
WO2021073687A1 (de) * 2019-10-18 2021-04-22 Laser Imaging Systems Gmbh Vorrichtung zur mustereinbringung mittels strahlung an einem aufgewickelten endlossubstrat

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013094286A1 (ja) * 2011-12-20 2013-06-27 株式会社ニコン 基板処理装置、デバイス製造システム、及びデバイス製造方法
CN105652609B (zh) * 2012-07-13 2018-12-04 株式会社尼康 曝光装置及曝光方法
JP6424053B2 (ja) * 2014-09-26 2018-11-14 株式会社オーク製作所 ダイレクト露光装置
TW201624142A (zh) * 2014-09-26 2016-07-01 Orc Mfg Co Ltd 直接曝光裝置
CN106292187A (zh) * 2015-05-13 2017-01-04 鸿富锦精密工业（深圳）有限公司 曝光方法
US10983389B2 (en) 2016-03-04 2021-04-20 Applied Materials, Inc. Wire grid polarizer manufacturing method
JP6700936B2 (ja) * 2016-04-25 2020-05-27 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
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KR101856500B1 (ko) * 2016-07-26 2018-06-21 재단법인 대구경북첨단의료산업진흥재단 레이저 가공된 포토마스크를 이용한 미세유체칩 제조방법
AU2019206621B2 (en) 2018-01-14 2024-10-17 Light Field Lab, Inc. Systems and methods for transverse energy localization in energy relays using ordered structures
TWI730831B (zh) * 2020-07-02 2021-06-11 光群雷射科技股份有限公司 增亮膜的轉印式製造方法及增亮膜
JP2022023357A (ja) 2020-07-27 2022-02-08 デンカ株式会社 シグナルの低下を改善した検査試薬

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864497A (ja) * 1994-08-23 1996-03-08 Nikon Corp 投影露光装置
JPH11219892A (ja) * 1998-02-04 1999-08-10 Nikon Corp 走査型露光装置及びその視野絞り位置の測定方法
JP2004062205A (ja) * 2002-07-24 2004-02-26 Heidelberger Druckmas Ag 版に画像付けするコンパクトな装置
JP2006098719A (ja) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 露光装置
JP2007121998A (ja) * 2005-09-29 2007-05-17 Dainippon Screen Mfg Co Ltd 画像記録装置および画像記録方法
JP2007316589A (ja) * 2006-04-26 2007-12-06 Orc Mfg Co Ltd 投影露光装置
WO2008029917A1 (fr) * 2006-09-08 2008-03-13 Nikon Corporation Masque, appareil d'exposition et procédé de fabrication du dispositif
JP2011203311A (ja) * 2010-03-24 2011-10-13 Nikon Corp マスクホルダ、円筒型マスク、露光装置、基板処理装置及びデバイス製造方法
JP2011221538A (ja) * 2010-04-13 2011-11-04 Nikon Corp マスクケース、マスクユニット、露光装置、基板処理装置及びデバイス製造方法

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5748222A (en) * 1992-06-11 1998-05-05 Zed Instruments Ltd. Laser angroxing head employing acousto-optic modulator
JP3724517B2 (ja) * 1995-01-18 2005-12-07 株式会社ニコン 露光装置
JP3287698B2 (ja) * 1994-06-23 2002-06-04 キヤノン株式会社 走査映像装置
JP3359127B2 (ja) * 1993-10-08 2002-12-24 キヤノン株式会社 眼底カメラ
JP3448663B2 (ja) * 1994-05-13 2003-09-22 株式会社ニコン 投影露光装置
US6274294B1 (en) 1999-02-03 2001-08-14 Electroformed Stents, Inc. Cylindrical photolithography exposure process and apparatus
JP3376961B2 (ja) 1999-06-08 2003-02-17 ウシオ電機株式会社 マスクを移動させて位置合わせを行う露光装置
WO2001075501A1 (fr) * 2000-03-31 2001-10-11 Nikon Corporation Procede et dispositif de soutien d'un element optique, dispositif optique, appareil d'exposition, et procede de fabrication d'un dispositif
TW556044B (en) 2001-02-15 2003-10-01 Sipix Imaging Inc Process for roll-to-roll manufacture of a display by synchronized photolithographic exposure on a substrate web
JP4218418B2 (ja) * 2003-05-23 2009-02-04 ウシオ電機株式会社 帯状ワークの両面投影露光装置
JP4665759B2 (ja) * 2003-06-06 2011-04-06 株式会社ニコン 光学素子保持装置、鏡筒、露光装置、及びデバイスの製造方法
US9307648B2 (en) * 2004-01-21 2016-04-05 Microcontinuum, Inc. Roll-to-roll patterning of transparent and metallic layers
WO2005096098A2 (en) * 2004-03-30 2005-10-13 Carl Zeiss Smt Ag Projection objective, projection exposure apparatus and reflective reticle for microlithography
KR101157003B1 (ko) * 2004-09-30 2012-06-21 가부시키가이샤 니콘 투영 광학 디바이스 및 노광 장치
US7375795B2 (en) * 2004-12-22 2008-05-20 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
WO2007029852A1 (en) * 2005-09-07 2007-03-15 Fujifilm Corporation Pattern exposure method and pattern exposure apparatus
FR2893610B1 (fr) * 2005-11-23 2008-07-18 Saint Gobain Procede de structuration de surface d'un produit verrier, produit verrier a surface structuree et utilisations
JP2007227438A (ja) * 2006-02-21 2007-09-06 Nikon Corp 露光装置及び方法並びに光露光用マスク
JP4952182B2 (ja) * 2006-03-20 2012-06-13 株式会社ニコン 走査型露光装置、マイクロデバイスの製造方法、走査露光方法、及びマスク
CN100529970C (zh) * 2006-04-26 2009-08-19 株式会社Orc制作所 投影曝光装置
JP4984631B2 (ja) * 2006-04-28 2012-07-25 株式会社ニコン 露光装置及び方法、露光用マスク、並びにデバイス製造方法
JP5059382B2 (ja) 2006-11-20 2012-10-24 ディップ株式会社 職務経歴書自動作成システム及び方法
EP1950594A1 (de) * 2007-01-17 2008-07-30 Carl Zeiss SMT AG Abbildende Optik, Projektionsbelichtunsanlage für die Mikrolithographie mit einer derartigen abbildenden Optik, Verfahren zur Herstellung eines mikrostrukturierten Bauteils mit einer derartigen Projektionsbelichtungsanlage, durch das Herstellungsverfahren gefertigtes mikrostrukturiertes Bauelement sowie Verwendung einer derartigen abbildenden Optik
DE102008002377A1 (de) * 2007-07-17 2009-01-22 Carl Zeiss Smt Ag Beleuchtungssystem sowie Projektionsbelichtungsanlage für die Mikrolithografie mit einem derartigen Beleuchtungssystem
JP2009032749A (ja) * 2007-07-24 2009-02-12 Nikon Corp 露光装置およびデバイス製造方法
DE102007035387A1 (de) * 2007-07-26 2009-01-29 Leibnitz-Institut für neue Materialien Gemeinnützige GmbH Verfahren und Vorrichtung zur Herstellung von strukturierten optischen Materialien
JP2009099939A (ja) * 2007-09-25 2009-05-07 Dainippon Screen Mfg Co Ltd アライメントマーク形成装置
JP2009163133A (ja) * 2008-01-09 2009-07-23 Nikon Corp 露光方法及び露光装置
US8192920B2 (en) * 2008-04-26 2012-06-05 Rolith Inc. Lithography method
US8034540B2 (en) * 2008-07-31 2011-10-11 Eastman Kodak Company System and method employing secondary back exposure of flexographic plate
US8486593B2 (en) * 2008-12-23 2013-07-16 3M Innovative Properties Company Roll-to-roll digital photolithography
US8339573B2 (en) * 2009-05-27 2012-12-25 3M Innovative Properties Company Method and apparatus for photoimaging a substrate
TW201118509A (en) * 2009-08-26 2011-06-01 Nikon Corp Exposure device, exposure method and manufacturing method for device
JPWO2011129369A1 (ja) * 2010-04-13 2013-07-18 株式会社ニコン 露光装置、基板処理装置及びデバイス製造方法
JP2011221536A (ja) * 2010-04-13 2011-11-04 Nikon Corp マスク移動装置、露光装置、基板処理装置及びデバイス製造方法
WO2013094286A1 (ja) * 2011-12-20 2013-06-27 株式会社ニコン 基板処理装置、デバイス製造システム、及びデバイス製造方法
KR101988820B1 (ko) * 2012-12-18 2019-06-12 가부시키가이샤 니콘 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864497A (ja) * 1994-08-23 1996-03-08 Nikon Corp 投影露光装置
JPH11219892A (ja) * 1998-02-04 1999-08-10 Nikon Corp 走査型露光装置及びその視野絞り位置の測定方法
JP2004062205A (ja) * 2002-07-24 2004-02-26 Heidelberger Druckmas Ag 版に画像付けするコンパクトな装置
JP2006098719A (ja) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 露光装置
JP2007121998A (ja) * 2005-09-29 2007-05-17 Dainippon Screen Mfg Co Ltd 画像記録装置および画像記録方法
JP2007316589A (ja) * 2006-04-26 2007-12-06 Orc Mfg Co Ltd 投影露光装置
WO2008029917A1 (fr) * 2006-09-08 2008-03-13 Nikon Corporation Masque, appareil d'exposition et procédé de fabrication du dispositif
JP2011203311A (ja) * 2010-03-24 2011-10-13 Nikon Corp マスクホルダ、円筒型マスク、露光装置、基板処理装置及びデバイス製造方法
JP2011221538A (ja) * 2010-04-13 2011-11-04 Nikon Corp マスクケース、マスクユニット、露光装置、基板処理装置及びデバイス製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014024594A1 (ja) * 2012-08-06 2014-02-13 株式会社ニコン 処理装置およびデバイス製造方法
JP2019117409A (ja) * 2012-11-06 2019-07-18 株式会社ニコン 投影露光装置
WO2014097859A1 (ja) * 2012-12-18 2014-06-26 株式会社ニコン 基板処理装置、デバイス製造システム及びデバイス製造方法
KR101934228B1 (ko) 2012-12-18 2018-12-31 가부시키가이샤 니콘 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
TWI709831B (zh) * 2014-09-04 2020-11-11 日商尼康股份有限公司 元件製造方法
WO2021073687A1 (de) * 2019-10-18 2021-04-22 Laser Imaging Systems Gmbh Vorrichtung zur mustereinbringung mittels strahlung an einem aufgewickelten endlossubstrat
CN114586474A (zh) * 2019-10-18 2022-06-03 激光影像系统有限责任公司 借由辐射将图案施加在卷绕的连续基材上的装置
US11738579B2 (en) 2019-10-18 2023-08-29 Laser Imaging Systems Gmbh Device for introducing a pattern by radiation on a wound endless structure
CN114586474B (zh) * 2019-10-18 2024-02-27 激光影像系统有限责任公司 借由辐射将图案施加在卷绕的连续基材上的装置

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