WO2013093073A3 - Mehrschichtkörper mit elektrisch leitenden elementen und herstellungsverfahren - Google Patents
Mehrschichtkörper mit elektrisch leitenden elementen und herstellungsverfahren Download PDFInfo
- Publication number
- WO2013093073A3 WO2013093073A3 PCT/EP2012/076797 EP2012076797W WO2013093073A3 WO 2013093073 A3 WO2013093073 A3 WO 2013093073A3 EP 2012076797 W EP2012076797 W EP 2012076797W WO 2013093073 A3 WO2013093073 A3 WO 2013093073A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrically conductive
- conductive elements
- multilayer body
- producing same
- case
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/118—Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/113—Anti-reflection coatings using inorganic layer materials only
- G02B1/115—Multilayers
- G02B1/116—Multilayers including electrically conducting layers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
Durch die Erfindung wird eine große Anzahl von Möglichkeiten bereitgestellt, wie bei einem Mehrschichtkörper mit elektrisch leitfähigen Elementen, die für das bloße Auge nicht sichtbar sind, verhindert werden kann, dass die elektrisch leitfähigen Elemente übermäßig Licht zurückreflektieren. Hierbei kann eine geeignete Oberflächenrauigkeit für die elektrisch leitfähigen Elemente gewählt werden, oder es kann zumindest eine zusätzliche Schicht (54) auf den elektrisch leitfähigen Elementen (51l) vorgesehen werden.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201280070414.0A CN104126134B (zh) | 2011-12-23 | 2012-12-21 | 具有导电元件的多层体以及用于生产多层体的方法 |
US14/367,541 US20150334824A1 (en) | 2011-12-23 | 2012-12-21 | Multilayer Body Having Electrically Conductive Elements and Method for Producing Same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011122152.6 | 2011-12-23 | ||
DE102011122152A DE102011122152A1 (de) | 2011-12-23 | 2011-12-23 | Mehrschichtkörper und Verfahren zum Herstellen eines solchen |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2013093073A2 WO2013093073A2 (de) | 2013-06-27 |
WO2013093073A3 true WO2013093073A3 (de) | 2013-08-29 |
Family
ID=47630230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2012/076797 WO2013093073A2 (de) | 2011-12-23 | 2012-12-21 | Mehrschichtkörper und verfahren zum herstellen eines solchen |
Country Status (4)
Country | Link |
---|---|
US (1) | US20150334824A1 (de) |
CN (1) | CN104126134B (de) |
DE (1) | DE102011122152A1 (de) |
WO (1) | WO2013093073A2 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103857189A (zh) * | 2013-12-10 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | 绝缘基板上制作导电线路的方法以及该方法制作的电路板 |
PE20171683A1 (es) * | 2015-03-09 | 2017-11-27 | Vision Ease Lp | Revestimiento antiestatico, antirreflejante |
JP6143909B1 (ja) * | 2016-03-29 | 2017-06-07 | 株式会社フジクラ | 配線体、配線基板、タッチセンサ、及び配線体の製造方法 |
JP6436124B2 (ja) | 2016-03-30 | 2018-12-12 | トヨタ自動車株式会社 | ハイブリッド自動車 |
DE102016007122A1 (de) * | 2016-06-11 | 2017-12-14 | GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) | Sensorbildschirm |
KR102297722B1 (ko) * | 2017-12-08 | 2021-09-03 | 주식회사 엘지화학 | 발열필름 및 이의 제조방법 |
CN109960434B (zh) * | 2017-12-25 | 2022-04-12 | 瀚宇彩晶股份有限公司 | 触控面板、触控显示装置及制作触控面板的方法 |
DE102018206140A1 (de) * | 2018-04-20 | 2019-10-24 | Bayerische Motoren Werke Aktiengesellschaft | Abdeckelement, System und Vorrichtung |
JP2019197727A (ja) * | 2018-05-02 | 2019-11-14 | 大日本印刷株式会社 | 発熱板、導電体付きフィルム及び発熱板の製造方法 |
WO2021102728A1 (zh) * | 2019-11-27 | 2021-06-03 | 南昌欧菲光科技有限公司 | 天线及电子设备 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006343758A (ja) * | 2006-06-26 | 2006-12-21 | Mitsubishi Chemicals Corp | 反射防止方法及び反射防止構造並びに反射防止構造を有する反射防止構造体及びその製造方法 |
US20080188033A1 (en) * | 2007-01-18 | 2008-08-07 | Applied Materials, Inc. | Multi-junction solar cells and methods and apparatuses for forming the same |
CN201138662Y (zh) * | 2007-11-28 | 2008-10-22 | 高霞 | 高效光电转换装置 |
JP2009053894A (ja) * | 2007-08-27 | 2009-03-12 | Epson Imaging Devices Corp | 静電容量型入力装置 |
JP2010109012A (ja) * | 2008-10-28 | 2010-05-13 | Dainippon Printing Co Ltd | フィルタ、及びその製造方法 |
DE202008017988U1 (de) * | 2008-05-26 | 2011-02-10 | C.R.F. Società Consortile per Azioni, Orbassano | Transparente Anzeigevorrichtung mit Leiterbahnen, die mit undurchsichtiger Beschichtung versehen sind |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003280029A (ja) * | 2002-03-25 | 2003-10-02 | Alps Electric Co Ltd | 液晶表示装置 |
JP2006011523A (ja) * | 2004-06-22 | 2006-01-12 | Three M Innovative Properties Co | タッチパネルセンサー |
US7564628B2 (en) * | 2006-06-06 | 2009-07-21 | Cpfilms, Inc. | Multiple band reflector with metal and dielectric layers |
CN101452351B (zh) * | 2007-12-03 | 2010-11-17 | 义强科技股份有限公司 | 高透光率的触控装置 |
JP5440165B2 (ja) * | 2009-12-28 | 2014-03-12 | デクセリアルズ株式会社 | 導電性光学素子、タッチパネル、および液晶表示装置 |
US8653378B2 (en) * | 2010-03-24 | 2014-02-18 | Li-Li Fan | Structure of bridging electrode |
US20110279398A1 (en) * | 2010-05-12 | 2011-11-17 | Harald Philipp | Touch screen electrode enhancements |
US8629944B2 (en) * | 2011-05-03 | 2014-01-14 | Innovation & Infinity Global Corp. | Transparent conductive structure applied to a touch panel and method of making the same |
-
2011
- 2011-12-23 DE DE102011122152A patent/DE102011122152A1/de not_active Ceased
-
2012
- 2012-12-21 US US14/367,541 patent/US20150334824A1/en not_active Abandoned
- 2012-12-21 WO PCT/EP2012/076797 patent/WO2013093073A2/de active Application Filing
- 2012-12-21 CN CN201280070414.0A patent/CN104126134B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006343758A (ja) * | 2006-06-26 | 2006-12-21 | Mitsubishi Chemicals Corp | 反射防止方法及び反射防止構造並びに反射防止構造を有する反射防止構造体及びその製造方法 |
US20080188033A1 (en) * | 2007-01-18 | 2008-08-07 | Applied Materials, Inc. | Multi-junction solar cells and methods and apparatuses for forming the same |
JP2009053894A (ja) * | 2007-08-27 | 2009-03-12 | Epson Imaging Devices Corp | 静電容量型入力装置 |
CN201138662Y (zh) * | 2007-11-28 | 2008-10-22 | 高霞 | 高效光电转换装置 |
DE202008017988U1 (de) * | 2008-05-26 | 2011-02-10 | C.R.F. Società Consortile per Azioni, Orbassano | Transparente Anzeigevorrichtung mit Leiterbahnen, die mit undurchsichtiger Beschichtung versehen sind |
JP2010109012A (ja) * | 2008-10-28 | 2010-05-13 | Dainippon Printing Co Ltd | フィルタ、及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104126134A (zh) | 2014-10-29 |
DE102011122152A1 (de) | 2013-06-27 |
WO2013093073A2 (de) | 2013-06-27 |
US20150334824A1 (en) | 2015-11-19 |
CN104126134B (zh) | 2016-10-12 |
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