WO2013082846A1 - 取向膜修复系统 - Google Patents

取向膜修复系统 Download PDF

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Publication number
WO2013082846A1
WO2013082846A1 PCT/CN2011/085218 CN2011085218W WO2013082846A1 WO 2013082846 A1 WO2013082846 A1 WO 2013082846A1 CN 2011085218 W CN2011085218 W CN 2011085218W WO 2013082846 A1 WO2013082846 A1 WO 2013082846A1
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WIPO (PCT)
Prior art keywords
alignment film
defect
pinhole
film repairing
substrate
Prior art date
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PCT/CN2011/085218
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English (en)
French (fr)
Inventor
宋玉
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US13/502,279 priority Critical patent/US20130139752A1/en
Publication of WO2013082846A1 publication Critical patent/WO2013082846A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like

Definitions

  • the present invention relates to a manufacturing process of a liquid crystal display device, and more particularly to a repair process for an alignment film for LCD. Background technique
  • a TFT/CF substrate 110 which is in contact with a liquid crystal is coated with an alignment film 120, which is used to restrict the alignment state of liquid crystal molecules.
  • the surface of the TFT/CF substrate 110 is insufficiently modified by the particles 130 on the surface of the TFT/CF substrate 110, and the alignment liquid (PI liquid) is attached to the surface of the TFT/CF substrate 110.
  • the unevenness of the surface of the TFT/CF substrate 110 affects the diffusion of the alignment liquid (PI liquid) on the TFT/CF substrate 110, and causes the dark spots of the particles to be formed on the alignment film 120, and the particles 130 are formed.
  • Pin hole 140 (shown in FIG. 2), after the alignment film 120 is baked and formed into a film, since the image cannot be normally displayed at the portion of the pinhole 140, it is necessary to peel off the alignment film 120 in the past. Film formation was resumed.
  • the alignment film 120 Since the alignment film 120 is used in a large amount of peeling liquid at the time of peeling, the alignment film 120 is peeled off.
  • the TFT/CF substrate 110 needs to be re-filmed by a series of processes such as cleaning, drying, alignment liquid coating, prebaking, inspection, and local hardening, thereby increasing additional production costs.
  • the technical problem to be solved by the present invention is to overcome the deficiencies of the prior art mentioned above, and to provide an oriented film repairing system capable of repairing the dark spots of particles generated during the coating of the oriented film and the local pinholes after removing the particles, eliminating the need for The alignment film peeling and cleaning, drying, orientation liquid coating, prebaking, inspection, and local hardening are re-filmed to achieve a reduction in manufacturing cost.
  • the technical solution adopted by the present invention to solve the above technical problems includes an oriented film repairing system comprising: an inspection device, an alignment film defect removal device, and an alignment film repair agent coating device.
  • the inspection device includes a charge coupled device (CCD) and a defect position detecting circuit.
  • the charge coupled device detects a defect position of an alignment film on the TFT/CF substrate, and the defect position detecting circuit records a position coordinate corresponding to the defect position.
  • the signal and alignment film defect removing device removes defects on the defect position on the TFT/CF substrate according to the position coordinate signal to form a pinhole, and the alignment film repairing agent coating device repairs an oriented film according to the position coordinate signal.
  • the agent is applied to the pinhole to repair the pinhole.
  • the above defect is an oriented film coated with fine particles.
  • the pinhole refers to a notch formed on the alignment film after the defect is removed.
  • the alignment film defect removing device is a plasma (AP Plasma) device. Set.
  • the alignment film repairing agent coating device is a printing device (Inkjet).
  • the above-mentioned printing device applies the alignment film repairing agent on the pinhole according to the area of the pinhole, the solid content of the alignment film repairing agent, and the target film thickness of 100 nm, thereby calculating The amount of dripping from the printing device.
  • the alignment film repairing system further includes a driving circuit.
  • the driving circuit controls the movement of the alignment film defect removing device and the alignment film repairing agent coating device, and functions to receive the position coordinate signal detected by the defect position detecting circuit, and move the alignment film defect removing device and the alignment film repairing agent coating device to The defect position is above to remove the alignment film and the particles on the defect position on the TFT/CF substrate.
  • the alignment film defect removing device further corrects pinhole defects on the alignment film to improve the adhesion of the substrate surface in the pinhole defect generation region.
  • the present invention removes an alignment film and a particle at a particle mura position through an alignment film defect removing device to form a pinhole.
  • the pin hole defect on the alignment film is modified by a plasma (AP Plasma) device to improve the adhesion of the substrate surface of the pin hole defect generation region, and the ink jet printing device (Inkjet) is used.
  • AP Plasma plasma
  • Inkjet ink jet printing device
  • the alignment film repairing agent is applied to a pinhole to repair the pinhole. It can be avoided that, as in the prior art, when a defect occurs on the alignment film, it is necessary to re-film, which is time consuming and costly.
  • Fig. 1 is a schematic view showing a coating process of a liquid crystal alignment film for a TFT-LCD.
  • Fig. 2 is a view showing the defects of a conventional liquid crystal alignment film for a TFT-LCD.
  • Fig. 3 is a block diagram showing the components of the oriented film repairing system of the present invention.
  • Fig. 4 is a schematic view showing the alignment film repairing system of Fig. 3.
  • Figure 5 is a schematic view showing a defect position of an alignment film on a TFT/CF substrate of the charge coupled device of the present invention.
  • Fig. 6 is a view showing the effect of the alignment film defect removing device of the present invention in addition to defects on the TFT/CF substrate.
  • Fig. 7 is a view showing a state in which an alignment film repairing agent coating device of the present invention applies an alignment film repairing agent to a pinhole.
  • Fig. 8 is a view showing the effect of the alignment film repairing agent of the present invention applied to a pinhole.
  • the present invention provides an alignment film repairing system comprising: an inspection device 310, a driving circuit 320, an alignment film defect removing device 330, and an alignment film repairing agent coating device 340.
  • the inspection device 310 includes a charge coupled device (CCD) 311 and a defect position detecting circuit 312, and a charge coupled device (CCD) 311.
  • CCD charge coupled device
  • CCD charge coupled device
  • the driving circuit 320 controls the movement of the alignment film defect removing device 330 and the alignment film repairing agent coating device 350, and functions to receive the position coordinate signal detected by the defect position detecting circuit 312, and to align the film defect removing device 330 and the alignment film repairing agent.
  • the coating device 340 is moved over the defect position to remove the alignment film 120 and the particles 130 on the defect position on the TFT/CF substrate 110.
  • the TFT/CF substrate 110 is transported by the transport device 350.
  • the inspection apparatus 310 detects the dark spots 500 of the particles which are wound by the alignment film 120 on the TFT/CF substrate 110, and the defect position detecting circuit 312 records a position coordinate signal corresponding to the position of the dark spots 500 of the particles.
  • the alignment film defect removing device 330 is preferably an plasma (AP Plasma) device.
  • the driving circuit 320 applies plasma (AP Plasma). The device moves above the dark spots 500 of the particles, removes the alignment film 120 and the particles 130 at the position of the dark spots 500, forms a pinhole 600; or performs pinhole 600 defects on the alignment film 120.
  • the alignment film repairing agent coating device 340 is preferably a printing device (Inkjet).
  • the driving circuit moves the printing device (Inkjet) above the particle dark spot 500 according to the position coordinate signal of the particle dark spot 500 provided by the inspection device 310, and applies the alignment film repairing agent 341 to the pinhole 600. , repair the pinhole 600.
  • the alignment film repairing agent 341 is formed by dissolving an alignment film in a solvent.
  • the alignment film repairing agent 341 When the alignment film repairing agent 341 is applied to the pinhole 600 by the ink jet printing apparatus (Inkjet), the area of the pinhole 600, the solid content of the alignment film repairing agent 341, and the target alignment film should be considered.
  • the thickness is 100 nm, thereby calculating the optimum amount of dripping of the printing device (Inkjet).
  • the alignment film repairing agent 341 is applied to the pinhole 600 to be bonded to the original alignment film 120.
  • the alignment film defect removing device further modifies pinhole defects on the alignment film to improve the adhesion of the substrate surface in the pinhole defect generation region.
  • the present invention checks whether there is a particulate mura or formation on the alignment film in the inspection process after the alignment film is coated, pre-baked, and hardened by a series of processes. There are pinhole defects and the position of the particle mura or pin hole defect is detected. Then, in the repair system, an alignment film and a particle at a particle mura position are removed by an AP plasma device to form a pinhole. Alternatively, the pinhole defect on the alignment film is modified by a plasma (AP Plasma) apparatus to improve the adhesion of the surface of the substrate in the pinhole defect generation region. Finally, the alignment film repair agent is applied to a pinhole by a printing device (Inkjet) to repair the pinhole.
  • AP Plasma plasma

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mathematical Physics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种取向膜修复系统，包括：一检查装置（310），包含一电荷耦合元件（311）及一缺陷位置检测电路（312），电路耦合元件（311）检测在TFT/CF基板上的一取向膜的一缺陷位置，缺陷位置检测电路（312）则记录对应缺陷位置的一位置坐标信号；一取向膜缺陷去除装置（330），根据位置坐标信号，去除在TFT/CF基板上的缺陷位置上的缺陷，以形成一针孔（600）；以及一取向膜修复剂涂布装置（340），根据位置坐标信号，将一取向膜修复剂（341）涂布在针孔（600）上，对针孔（600）进行修复。

Description

取向膜修复系统 技术领域
本发明涉及液晶显示装置的制造工艺， 特别是涉及 LCD用取向膜的修复工艺。 背景技术
参阅图 1及图 2， 在一般液晶面板中， 与液晶接触的 TFT/CF基板 110上分别涂布有 一层取向膜 120， 该取向膜 120可用于限制液晶分子的取向状态。
在取向膜 120涂布的过程中， 由于 TFT/CF基板 110表面的微粒 （Particle ) 130使 TFT/CF基板 110表面改性不足，配向液 (PI液)对 TFT/CF基板 110表面的贴合性差； TFT/CF 基板 110表面的凹凸不平影响了配向液（PI液）在 TFT/CF基板 110上的扩散等原因， 使 取向膜 120上产生微粒暗点， 而去除微粒（Particle ) 130所形成的针孔（Pin hole ) 140 (如图 2所示），在取向膜 120固烤成膜后， 因为在针孔 140的部位不能正常地显示图像， 以往必须将取向膜 120全部剥离后， 才能重新进行成膜。
由于取向膜 120 在剥离的时候要使用大量的剥离液， 而完成取向膜 120 剥离后的
TFT/CF基板 110需要经过清洗、 干燥、 取向液涂布、 预烘烤、 检查、 本硬化等一系列制 程重新成膜， 因此会增加额外的生产成本。 发明内容
本发明要解决的技术问题在于克服上述现有技术的不足，而提出一种取向膜修复系统 可以定点修复在取向膜涂布时产生的微粒暗点及去除微粒后的局部的针孔，免去取向膜剥 离和清洗、 干燥、 取向液涂布、 预烘烤、 检查、 本硬化等一系列制程重新成膜， 从而达到 降低制造成本的目的。
本发明解决上述技术问题采用的技术方案包括， 提出一种取向膜修复系统， 包括： 一 检查装置、一取向膜缺陷去除装置及一取向膜修复剂涂布装置。检查装置包括一电荷耦合 元件（CCD)及一缺陷位置检测电路， 电荷耦合元件检测在 TFT/CF基板上的一取向膜的一 缺陷位置，缺陷位置检测电路则记录对应该缺陷位置的一位置坐标信号，取向膜缺陷去除 装置是根据位置坐标信号， 去除在 TFT/CF基板上的缺陷位置上的缺陷， 以形成一针孔， 取向膜修复剂涂布装置根据位置坐标信号，将一取向膜修复剂涂布在针孔上，对针孔进行 修复。
在本发明的一实施例中， 上述的缺陷为包覆有微粒的取向膜。
在本发明的一实施例中， 上述的针孔是指去除缺陷后于取向膜上所形成的缺口。 在本发明的一实施例中， 上述的取向膜缺陷去除装置为一等离子体 （AP Plasma) 装 置。
在本发明的一实施例中， 上述的取向膜修复剂涂布装置为一喷印装置 （Inkjet )。 在本发明的一实施例中，上述的喷印装置将取向膜修复剂涂布在针孔上时， 是依据针 孔的面积、取向膜修复剂的固含量以及目标膜厚为 100nm，从而计算出喷印装置的滴下量。
在本发明的一实施例中，上述取向膜修复系统还包括一驱动电路。驱动电路控制取向 膜缺陷去除装置及取向膜修复剂涂布装置的移动，其作用为接收缺陷位置检测电路检测到 的位置坐标信号， 将取向膜缺陷去除装置及取向膜修复剂涂布装置移动至缺陷位置上方， 以去除在 TFT/CF基板上的缺陷位置上的取向膜和微粒。
在本发明的一实施例中，上述取向膜缺陷去除装置更是对取向膜上的针孔缺陷进行改 性， 改善针孔缺陷产生区域基板表面的贴合性。
与现有技术相比， 本发明透过取向膜缺陷去除装置去除微粒暗点 （Particle mura) 位置上的取向膜和微粒（Particle), 形成针孔（Pin hole)。或者用等离子体（AP Plasma) 装置对取向膜上的针孔 （Pin hole) 缺陷进行改性， 改善针孔 （Pin hole) 缺陷产生区域 基板表面的贴合性， 并通过喷印装置 （Inkjet ) 使取向膜修复剂涂布在针孔 （Pin hole) 上， 对针孔 （Pin hole)进行修复。 可避免如现有技术中， 每当取向膜上产生缺陷时， 都 需要重新成膜， 既耗时又耗费成本的缺失。 附图说明
图 1为现有的 TFT-LCD用液晶取向膜的涂布工艺示意图。
图 2为现有的 TFT-LCD用液晶取向膜的缺陷示意图。
图 3为本发明的取向膜修复系统元件方块示意图。
图 4为采用图 3的取向膜修复系统示意图。
图 5为本发明的电荷耦合元件检测在 TFT/CF基板上的一取向膜的一缺陷位置的示意 图。
图 6为本发明的取向膜缺陷去除装置除在 TFT/CF基板上缺陷的效果示意图。
图 7为本发明的取向膜修复剂涂布装置将取向膜修复剂涂布在针孔的状态示意图。 图 8为本发明的取向膜修复剂涂布在针孔的效果示意图。 具体实施方式
以下结合附图所示的最佳实施例作进一步详述。
参见图 3以及图 4， 本发明提出一种取向膜修复系统， 包括： 一检查装置 310、 一驱 动电路 320、 一取向膜缺陷去除装置 330及一取向膜修复剂涂布装置 340。 检查装置 310 包括一电荷耦合元件 （CCD) 311 及一缺陷位置检测电路 312， 电荷耦合元件 （CCD) 311 检测在 TFT/CF基板上的一取向膜的一缺陷位置， 缺陷位置检测电路 312则记录对应该缺 陷位置的一位置坐标信号。驱动电路 320控制取向膜缺陷去除装置 330及取向膜修复剂涂 布装置 350的移动，其作用为接收缺陷位置检测电路 312检测到的位置坐标信号，将取向 膜缺陷去除装置 330及取向膜修复剂涂布装置 340移动至缺陷位置上方，以去除在 TFT/CF 基板 110上的缺陷位置上的取向膜 120和微粒 130。其中， TFT/CF基板 110是借由输送装 置 350输送。
参见图 5检查装置 310检测在 TFT/CF基板 110上由取向膜 120包覆微粒 130所行程 的微粒暗点 500，缺陷位置检测电路 312则纪录对应微粒暗点 500位置的一位置坐标信号。 参见图 6， 承接图 5， 取向膜缺陷去除装置 330较佳为等离子体 （AP Plasma)装置， 根据检查装置 310提供的微粒暗点 500的位置坐标信号， 驱动电路 320将等离子体 （AP Plasma)装置移动到微粒暗点 500的上方，去除微粒暗点 500位置上的取向膜 120和微粒 130， 形成针孔 （Pin hole ) 600； 或者对取向膜 120上的针孔 （Pin hole ) 600缺陷进行 改性， 改善针孔 （Pin hole ) 600缺陷产生区域 TFT/CF基板 110表面的贴合性。 参见图 7，取向膜修复剂涂布装置 340较佳为喷印装置（Inkjet )。根据检查装置 310 提供的微粒暗点 500 的位置坐标信号， 驱动电路将喷印装置 （Inkjet ) 移动到微粒暗点 500的上方， 将取向膜修复剂 341涂布在针孔 （Pin hole ) 600上， 对针孔 （Pin hole ) 600进行修复。 取向膜修复剂 341由取向膜溶解在溶剂中形成。 在喷印装置 （Inkjet )将 取向膜修复剂 341涂布在针孔 （Pin hole ) 600上时， 应考虑针孔 （Pin hole ) 600的面 积、 取向膜修复剂 341 的固含量以及目标取向膜厚度为 lOOnm, 从而计算出喷印装置 ( Inkjet ) 的最佳滴下量。
参见图 8， 取向膜修复剂 341涂布在针孔 600位置上， 与原先的取向膜 120相结合。 在本发明中， 上述取向膜缺陷去除装置更是对取向膜上的针孔缺陷进行改性， 改善 针孔缺陷产生区域基板表面的贴合性。
与现有技术相比， 本发明在取向膜完成涂布、预烘烤、本硬化等一些列制程成膜后， 在检查工序中检查在取向膜上是否有微粒暗点（Particle mura)或形成有针孔（Pin hole ) 缺陷， 并且对微粒暗点 （Particle mura) 或针孔 （Pin hole ) 缺陷的位置进行检测。 然 后在修复系统中， 用等离子体 （AP Plasma) 装置去除微粒暗点 （Particle mura) 位置上 的取向膜和微粒 （Particle ), 形成针孔 （Pin hole)。 或者用等离子体 （AP Plasma) 装 置对取向膜上的针孔 （Pin hole ) 缺陷进行改性， 改善针孔 （Pin hole ) 缺陷产生区域基 板表面的贴合性。最后， 通过喷印装置（Inkjet )使取向膜修复剂涂布在针孔（Pin hole ) 上， 对针孔 （Pin hole ) 进行修复。 可有效的达到降低制造成本之目的。 以上， 仅为本发明的较佳实施例， 意在进一步说明本发明， 而非对其进行限定。 凡根 据上述文字和附图所公开的内容进行的简单的替换， 都在本专利的权利保护范围之歹 ϋ。

Claims

1、 一种取向膜修复系统， 包括：
一检查装置， 包括一电荷耦合元件及一缺陷位置检测电路， 该电荷耦合元件检测在
TFT/CF基板上的一取向膜的一缺陷位置， 该缺陷位置检测电路则记录对应该缺陷位置的 一位置坐标信号；
一取向膜缺陷去除装置，根据该位置坐标信号， 去除在 TFT/CF基板上的该缺陷位置 上的缺陷， 以形成一针孔； 以及
一取向膜修复剂涂布装置， 根据该位置坐标信号， 将一取向膜修复剂涂布在该针孔 上， 对该针孔进行修复。
2、 如权利要求 1所述的取向膜修复系统， 其中， 该缺陷为包覆有微粒的该取向膜。
3、如权利要求 1所述的取向膜修复系统， 其中， 该针孔是指去除该缺陷后于该取向 膜上所形成的缺口。
4、如权利要求 1所述的取向膜修复系统， 其中， 该取向膜缺陷去除装置为一等离子 体 (AP Plasma) 装置。
5、如权利要求 1所述的取向膜修复系统， 其中， 该取向膜修复剂涂布装置为一喷印 装置 ( Inkjet ) o
6、如权利要求 5所述的取向膜修复系统， 其中， 该喷印装置将该取向膜修复剂涂布 在该针孔上时， 是依据该针孔的面积、 该取向膜修复剂的固含量以及目标膜厚为 100nm， 从而计算出该喷印装置的滴下量。
7、如权利要求 1所述的取向膜修复系统， 其中， 该取向膜修复系统还包括一驱动电 路。
8、如权利要求 7所述的取向膜修复系统， 其中， 该驱动电路控制该取向膜缺陷去除 装置的移动，其作用为接收该缺陷位置检测电路检测到的该位置坐标信号，将该取向膜缺 陷去除装置移动至该缺陷位置上方， 以去除在 TFT/CF基板上的该缺陷位置上的取向膜和 微粒。
9、如权利要求 7所述的取向膜修复系统， 其中， 所述的驱动电路控制该取向膜修复 剂涂布装置的移动，其作用为接收该缺陷位置检测电路检测到的该位置坐标信号，将该取 向膜修复剂涂布装置移动至该缺陷位置上方， 以将该取向膜修复剂涂布在该针孔上，对该 针孔进行修复。
10.如权利要求 1所述的取向膜修复系统，其中，该取向膜缺陷去除装置还可对该取向 膜上的该针孔缺陷进行改性， 改善该针孔缺陷产生区域基板表面的贴合性。
PCT/CN2011/085218 2011-12-05 2011-12-31 取向膜修复系统 Ceased WO2013082846A1 (zh)

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103524046A (zh) * 2013-09-29 2014-01-22 南京中电熊猫液晶显示科技有限公司 一种配向膜在线修补设备及其在线修复方法
CN107703680A (zh) * 2016-08-08 2018-02-16 帆宣系统科技股份有限公司 可节省修补成本的配向膜修补方法
CN107870458B (zh) * 2016-09-22 2020-04-03 帆宣系统科技股份有限公司 配向膜修补装置
CN106733549B (zh) * 2017-01-12 2020-06-09 京东方科技集团股份有限公司 一种膜层修复方法及系统
CN107577089A (zh) * 2017-09-18 2018-01-12 惠科股份有限公司 一种显示面板的制程及制程装置
CN109976007A (zh) * 2019-04-16 2019-07-05 合肥工业大学 一种取向膜修复装置及其修复方法
CN110687703B (zh) * 2019-10-16 2022-05-31 深圳市华星光电半导体显示技术有限公司 液晶配向膜的修补装置及修补液晶配向膜的方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070040183A (ko) * 2005-10-11 2007-04-16 삼성전자주식회사 액정표시장치의 보수장치 및 보수방법
CN101004878A (zh) * 2006-01-17 2007-07-25 彩富电子股份有限公司 平面显示器面板坏点检测仪及其检测方法
CN101416099A (zh) * 2006-05-16 2009-04-22 夏普株式会社 显示面板的制造方法、显示面板的制造装置和显示面板
TW200919038A (en) * 2007-10-24 2009-05-01 Chunghwa Picture Tubes Ltd Method for repairing alignment film
CN101556407A (zh) * 2008-04-09 2009-10-14 中华映管股份有限公司 配向膜修补方法
WO2010140443A1 (ja) * 2009-06-04 2010-12-09 シャープ株式会社 液晶パネルの製造方法、液晶パネルおよび修復装置
CN102103291A (zh) * 2010-12-17 2011-06-22 深圳市华星光电技术有限公司 配向膜修补设备及其修补方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070040183A (ko) * 2005-10-11 2007-04-16 삼성전자주식회사 액정표시장치의 보수장치 및 보수방법
CN101004878A (zh) * 2006-01-17 2007-07-25 彩富电子股份有限公司 平面显示器面板坏点检测仪及其检测方法
CN101416099A (zh) * 2006-05-16 2009-04-22 夏普株式会社 显示面板的制造方法、显示面板的制造装置和显示面板
TW200919038A (en) * 2007-10-24 2009-05-01 Chunghwa Picture Tubes Ltd Method for repairing alignment film
CN101556407A (zh) * 2008-04-09 2009-10-14 中华映管股份有限公司 配向膜修补方法
WO2010140443A1 (ja) * 2009-06-04 2010-12-09 シャープ株式会社 液晶パネルの製造方法、液晶パネルおよび修復装置
CN102103291A (zh) * 2010-12-17 2011-06-22 深圳市华星光电技术有限公司 配向膜修补设备及其修补方法

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