WO2013081159A1 - Récipient de logement de substrat - Google Patents

Récipient de logement de substrat Download PDF

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Publication number
WO2013081159A1
WO2013081159A1 PCT/JP2012/081225 JP2012081225W WO2013081159A1 WO 2013081159 A1 WO2013081159 A1 WO 2013081159A1 JP 2012081225 W JP2012081225 W JP 2012081225W WO 2013081159 A1 WO2013081159 A1 WO 2013081159A1
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WO
WIPO (PCT)
Prior art keywords
substrate
bonded
container body
thin film
substrate support
Prior art date
Application number
PCT/JP2012/081225
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English (en)
Japanese (ja)
Inventor
吉平 杉田
藤原　馨
Original Assignee
東京エレクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京エレクトロン株式会社 filed Critical 東京エレクトロン株式会社
Publication of WO2013081159A1 publication Critical patent/WO2013081159A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions

Definitions

  • the present invention relates to a substrate storage container used for transporting a substrate such as a silicon substrate, and more particularly to a substrate storage container for storing a bonded substrate in which a thin film substrate is bonded to a support substrate. .
  • thin film processed wafers (hereinafter referred to as “thin film wafers”) have been applied.
  • thin film wafers are fragile, especially at the end (bevel portion). Is very fragile, and there is a problem that cracks and chips are likely to occur during various treatments or conveyance. Therefore, in order to reinforce the thin film wafer, a bonded substrate is formed by bonding the thin film wafer and a glass substrate or another wafer as a reinforcing substrate.
  • a coin stack method When transporting such a bonded substrate, for example, a coin stack method is used in which both surfaces of the bonded substrate are sandwiched and transported by a flexible material.
  • a coin stack method particles may adhere to the surface of the thin film wafer due to the transfer from the material sandwiching the surface of the bonded substrate, and the bonded substrate easily rolls, so There is a problem of being easily scratched.
  • FIG. 7 is a perspective view showing a conventional substrate storage container.
  • a substrate storage container 60 is mainly composed of a container main body 61 for storing a substrate and a lid 63 provided in an opening 62 of the container main body 61 so as to be openable and closable.
  • a plurality of substrate support pieces 64 are arranged symmetrically and in parallel on two opposing inner wall surfaces of the container body 61. The substrate support piece 64 supports the bonded substrate carried into the container main body 61 on its upper surface.
  • a substrate support portion 65 that supports the bonded substrate carried into the container body 61 is provided on the inner surface of the lid 63 and the inner wall surface of the container body 61 facing the inner surface.
  • FIG. 8 is a diagram showing a substrate support state in the substrate storage container of FIG.
  • the bonded substrate 70 is provided on the four substrate support portions 65 provided on the inner surface of the lid body 63 of the container body 61 and the inner wall surface of the container body 61 facing the inner surface of the lid body 63. Further, it is supported and fixed by four substrate support portions 66.
  • the substrate support portions 65 and 66 basically have the same shape having an opening having a V-shaped cross section.
  • FIG. 9 is a schematic diagram showing a contact state between the substrate 70 and the substrate support portion 65 in the substrate storage container 60 of FIG.
  • two adjacent substrate support portions 65 are arranged on the same support member 67, and the support member 67 is made of a thin plate-like plastic member having elasticity, for example. Functions as a member. That is, after the bonded substrate 70 is carried into the container body 61 and placed on the substrate support piece 64, the lid 63 is closed to thereby close the inner wall surface of the lid body 63 and the container body 61 facing the inner wall surface. By attaching the V-shaped opening of the substrate supporting portions 65 and 66 provided on the inner wall surface to the outer peripheral end surface of the bonded substrate 70 or by supporting it in a loose-fitting manner, it is possible to attach to the substrate storage container 60. The accommodation of the laminated substrate 70 is completed.
  • the conventional substrate storage container 60 supports the outer peripheral end surface of the bonded substrate 70 with the substrate support portion 65 provided on the plastic support member 67 functioning as a spring member, the substrate support portion 65 is provided. There is a problem that the opening surface having the V-shaped cross section and the bevel portion of the thin film wafer of the bonded substrate 70 contact or collide with each other, and the bevel portion is cracked or chipped.
  • FIG. 10 is a cross-sectional view showing a contact or collision state between the bonded substrate 70 and the substrate support 65 in the substrate storage container 60 of FIG.
  • the bevel portion of the thin film wafer 72 and the V-shaped opening surface of the substrate support portion 65 of the bonded substrate 70 in which the support substrate 71 and the thin film wafer 72 are bonded together are in contact with each other. It is easily damaged due to contact with the support portion 65.
  • An object of the present invention is to provide a substrate storage container capable of preventing damage to a thin film wafer on a bonded substrate and avoiding particle contamination.
  • a container main body that houses a bonded substrate obtained by bonding a thin film substrate to a support substrate, and the opening of the container main body can be opened and closed.
  • a substrate support member that is provided on each of the wall surfaces and is brought into contact with the outer peripheral end surfaces of the plurality of bonded substrates that are carried into the container body and placed on the substrate support piece, and supports the bonded substrates;
  • a substrate storage container is provided, wherein the substrate support member is made of an elastic member that crosses the main surfaces of the plurality of bonded substrates.
  • the thin-film substrate preferably has a thickness of 150 ⁇ m or less.
  • the thin-film substrate preferably has a thickness of 20 ⁇ m to 100 ⁇ m.
  • the thin film substrate is preferably a silicon substrate
  • the support substrate is preferably one of a silicon substrate and a glass substrate that are thicker than the thin film substrate.
  • At least one substrate support member is provided on the inner side surface of the lid body, and the substrate support member is provided on the inner wall surface of the container body facing the inner side surface of the lid body. It is preferable that at least two are provided at intervals.
  • the predetermined interval is formed by two straight lines respectively connecting the two substrate support members and the center of the main surface of the bonded substrate carried into the container body and placed on the substrate support piece. It is preferable that the angle is 30 ° to 120 °.
  • the elastic member is preferably a columnar member made of either silicon rubber or urethane rubber.
  • the present invention since the outer peripheral end face of the bonded substrate is supported and fixed by the substrate support member made of an elastic member, it is possible to avoid unnecessary stress from acting on the thin film substrate in the bonded substrate. Damage to the substrate can be prevented. Further, since no particles are generated from the substrate support member, particle contamination of the thin film substrate can be avoided.
  • FIG. 1 is a perspective view of a substrate storage container according to an embodiment of the present invention.
  • a substrate storage container 10 is a rectangular container having a rectangular space for storing a substrate therein, and a container main body 11 for storing a bonded substrate (see FIG. 2) described later, and the container main body 11.
  • the opening 12 is mainly composed of a lid 13 provided so that the opening 12 can be opened and closed.
  • the container body 11 and the lid body 13 are made of, for example, a synthetic resin made of polycarbonate, polypropylene, polyethylene terephthalate, polyether ether ketone, or the like.
  • the lid body 13 is provided, for example, along the outer peripheral portion of the inner surface of the lid body 13, and has a frame body (not shown) that fits with the opening 12 of the container body 11. 11 is fitted into the opening 12 of the container 11 to seal the container body 11. This prevents entry of contaminants such as particles from the outside into the container body 11.
  • the lid 13 is engaged with the container body 11 by an engaging member that locks the container body 11 and the lid body 13 such as an engagement fitting (not shown) with the opening of the container body 11 closed. In this case, it can be fixed.
  • a plurality of, for example, 25 substrate support pieces 15 are arranged symmetrically and in parallel on the two inner wall surfaces 14 of the container body 11 facing each other, and each substrate support piece 15 is accommodated in the container body 11.
  • the laminated substrates 15 to be mounted are supported one by one while being placed on the upper surface.
  • the substrate support piece 15 does not fix the bonded substrate, but simply supports it in a state of being placed on the upper surface thereof. Therefore, the space between the adjacent substrate support pieces 15 is the thickness of the bonded substrate plus a space dimension necessary for loading and unloading the bonded substrate.
  • the substrate support piece 15 is made of a synthetic resin such as polycarbonate, polypropylene, polyethylene terephthalate, polyetheretherketone, or the like, similar to the container body 11 and the lid body 13.
  • One or more, for example, two substrate support members 16 are disposed on the inner side surface of the lid 13 with a gap therebetween. Similarly, for example, two substrate support members 16 are arranged at an interval on the inner wall surface of the container main body 11 facing the inner surface of the lid 13 (see FIG. 3 described later).
  • the substrate support member 16 is a rod-shaped member made of an elastic body such as silicon rubber, urethane rubber, perfluoroelastomer (fluororesin-based rubber), and is preferably a columnar member. It may be a member.
  • the substrate support member 16 is fixed to a predetermined position of the container main body 11 and the lid body 13 with an adhesive or using screws or the like.
  • the substrate support member 16 is carried into the container main body 11, contacts the outer peripheral end surfaces of the plurality of bonded substrates placed on the substrate support piece 15, and the main surface of each bonded substrate, for example, the upper portion of the thin film wafer Crosses with a plane.
  • the crossing angle between the substrate support member 16 and the main surface of the bonded substrate is, for example, a right angle.
  • the crossing angle is not limited to a right angle, and the rod-like substrate support member 16 is inclined in the container main body 11 or the lid 13 so as to cross the main surface of the bonded substrate 5 at an acute angle or an obtuse angle. It may be.
  • the distance between the two substrate support members 16 provided on the inner surface of the lid body 13 and the two substrate support members 16 provided on the inner wall surface of the container body 11 facing the inner surface of the lid body 13 is two substrates.
  • the angle formed by two straight lines connecting the support member 16 and the center of the main surface of each bonded substrate carried into the container body 11 and placed on the substrate support piece 15 is an interval of 30 ° to 120 °. It is preferable. As a result, the bonded substrate can be pressed and supported evenly by the four substrate support members that are in contact with the outer peripheral end face, and can be stably fixed.
  • the number of substrate support members 16 provided on the inner surface of the lid 13 is not limited to two, and there may be at least one. Further, the number of substrate support members 16 provided on the inner wall surface of the container main body 11 facing the inner side surface of the lid 13 is not limited to two, and if there are at least two, the number is three or more. May be.
  • FIG. 2 is a cross-sectional view of a bonded substrate housed in the substrate housing container 10 of FIG.
  • a bonded substrate 5 is mainly composed of a support substrate 3 and a thin film wafer 1 as a thin film substrate bonded to the upper plane of the support substrate 3 using an adhesive layer 2.
  • the thickness of the thin film wafer 1 is 150 ⁇ m or less, for example, 20 ⁇ m to 100 ⁇ m.
  • Such a thin film wafer is formed with a large number of through-holes such as via holes (Through Silicon Via), and is then laminated by a three-dimensional mounting method to constitute a semiconductor device.
  • the thin film wafer 1 is easily damaged by various processing apparatuses such as a plasma processing apparatus or at the time of handling such as transporting. Therefore, the thin film wafer 1 is bonded to a support substrate 3 thicker than the thin film wafer 1 and bonded substrate. 5 is used by being peeled off from the support substrate 3 at the time of lamination.
  • the support substrate 3 is any one of a silicon substrate, a glass substrate, a compound semiconductor, and the thickness thereof is, for example, 500 to 800 ⁇ m.
  • the adhesive for example, an epoxy-based adhesive, an emulsion-based adhesive such as vinyl acetate, ethylene vinyl acetate, and acrylic is preferably used.
  • the thickness of the adhesive layer is, for example, about 20 to 30 ⁇ m.
  • the thin film wafer 1 has a disk shape with a diameter of 299 mm, for example, and the support substrate 3 has a disk shape with a diameter of 300 mm, for example. Therefore, the distance between the outer peripheral end face of the thin film wafer 1 and the outer peripheral end face of the support substrate 3 is about 400 to 500 ⁇ m. Although the possibility of avoiding damage to the thin film wafer 1 increases by increasing the distance between the outer peripheral end face of the thin film wafer 1 and the outer peripheral end face of the support substrate 3, from the viewpoint of productivity of the thin film wafer 1, At present, increasing the interval is not adopted.
  • the bonded substrate 5 is stored in the substrate storage container 10 of FIG. 1 when transported between various processing apparatuses or during storage.
  • the bonded substrate 5 before or after processing is carried into the container body 11 by the transfer arm and the lid 13 is closed.
  • the two substrate support members 16 provided on the inner side surface of the lid body 13 and the two substrate support members 16 provided on the inner wall surface of the container body 11 facing the inner side surface of the lid body 13 are bonded to each other.
  • the bonded substrate 5 is fixed at a predetermined position in the container main body 11 by contacting the outer peripheral end surface of 5.
  • FIG. 3 is a schematic diagram showing a state in which the bonded substrate 5 is stored in the substrate storage container 10 of FIG.
  • the bonded substrate 5 is carried into the container main body 11 of the substrate storage container 10 from the direction of arrow A, and the two substrate support members 16 provided on the inner surface of the lid 13 and the inner surface of the lid 13. Are uniformly supported and fixed by two substrate support members 16 provided on the inner wall surface of the container main body 11 facing each other.
  • FIG. 4 is a diagram showing a substrate support state in the substrate storage container 10 of FIG.
  • the bonded substrate 5 carried into the container body 11 is placed on the substrate support piece 15 with its lower surface in contact with the upper surface of the substrate support piece 15, and comes into contact with the outer peripheral end surface. It is supported and fixed by the substrate support member 16.
  • FIG. 5 is a diagram showing a contact state between the substrate and the substrate support member 16 in FIG.
  • the bonded substrate 5 stored in the substrate storage container 10 is transported to another substrate processing apparatus for each substrate storage container 10 or stored for a predetermined period.
  • the outer peripheral end face of the bonded substrate 5 is supported and fixed by the substrate support member 16 made of an elastic member, unnecessary stress is prevented from acting on the thin film wafer 1 in the bonded substrate 5. Thus, damage to the thin film wafer 1 can be prevented.
  • the container body 11 can be sealed, it is possible to prevent the entry of contaminants from the outside, and the substrate support member 16 is free from the occurrence of particles and the like, such as silicon rubber and urethane rubber Therefore, it is possible to prevent adhesion of particles to the bonded substrate 5, particularly to the thin film wafer 1.
  • the same surface as that of the substrate support member 16 is formed on the surface of the substrate support piece 15 arranged in parallel with the inner wall surface of the container main body 11 of the substrate storage container 10 on the surface facing the thin film wafer 1 of the bonded substrate 5. It is preferable to provide an elastic film 17 described later made of a material. As a result, it is possible to prevent the thin film wafer 1 from being scratched when the bonded substrate 5 is carried into and out of the container body 11.
  • an elastic member 18 described later made of the same material as that of the substrate support member 16.
  • FIG. 6 is a diagram showing a main part of a modification of the present embodiment, and is a cross-sectional view taken along line BB in FIG.
  • the substrate support member 16 is provided on the surface of the substrate support piece 15 facing the thin film wafer 1 of the bonded substrate 5 and the inner wall surface of the container body 11 and sandwiched between the adjacent substrate support pieces 15.
  • An elastic film 17 and an elastic member 18 made of the same material are disposed. Thereby, damage to the thin film wafer 1 of the bonded substrate 5 can be prevented more reliably.
  • the lid 13 of the substrate storage container 10 of FIG. 1 in which the 25-stage substrate support pieces 15 are arranged on the inner wall surface of the container body 11 is opened, and 25 bonded substrates 5 of FIG. After being placed on top, the lid 13 was closed and the substrate support member 16 made of silicon rubber was brought into contact with and fixed to the outer peripheral end face of each bonded substrate 5.
  • the substrate container 10 containing the 25 bonded substrates 5 is left to stand for 10 days, and the change in the number of particles on the thin film wafer 1 of the bonded substrate 5 due to the application of silicon rubber as the substrate support member 16.
  • the number of particles stayed only a few in 10 days, and the particle contamination of the thin film wafer 1 due to the application of silicon rubber as the substrate support member 16 was within a range where there was no practical problem.
  • the vertical centerline of the container main body 11 is 70 degrees.
  • the container body 11 was swung about 100 times so that it could swing left and right at ⁇ 110 °, and after that, an impact was applied to the container body 11 by repeatedly striking the upper outer surface of the container body 11 about 100 times.
  • the thin film wafer 1 of the accommodated bonded substrate 5 was not damaged such as cracking or chipping.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

L'invention concerne un récipient de logement de substrat capable d'empêcher l'endommagement d'une tranche à film mince d'un substrat soudé et d'en éviter la contamination par des particules. Un récipient (10) de logement de substrat comporte : un corps (11) de récipient qui renferme un substrat soudé (5) formé en soudant une tranche (1) à film mince à un substrat porteur (3) ; un couvercle (13) qui est disposé dans une ouverture (12) du corps de récipient pour pouvoir ouvrir et fermer l'ouverture (12) et obture le corps (11) de récipient ; une pluralité de pièces (15) de soutien de substrat qui sont disposées sur une surface de paroi intérieure du corps (11) de récipient ; et des organes (16) de soutien de substrat qui sont placés sur une surface intérieure du couvercle (13) et une surface de paroi intérieure faisant face à ladite surface intérieure du corps (11) de récipient, respectivement, et qui soutiennent les surfaces d'extrémités périphériques extérieures d'une pluralité de substrats soudés (5) amenés dans le corps (11) de récipient et montés sur les pièces (15) de soutien de substrat tout en étant en contact avec celles-ci, chacun des organes de soutien de substrat étant constitué d'un organe élastique qui croise les surfaces principales des substrats soudés.
PCT/JP2012/081225 2011-12-01 2012-11-27 Récipient de logement de substrat WO2013081159A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-263661 2011-12-01
JP2011263661A JP2013118211A (ja) 2011-12-01 2011-12-01 基板収納容器

Publications (1)

Publication Number Publication Date
WO2013081159A1 true WO2013081159A1 (fr) 2013-06-06

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TW (1) TW201340236A (fr)
WO (1) WO2013081159A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6326330B2 (ja) * 2014-09-05 2018-05-16 株式会社Ｓｃｒｅｅｎホールディングス 基板収納容器、ロードポート装置および基板処理装置
JP6375577B2 (ja) * 2015-03-30 2018-08-22 信越ポリマー株式会社 基板収納容器
CN109075112A (zh) * 2016-02-05 2018-12-21 恩特格里斯公司 用于衬底容器的缓冲保持器
KR102325657B1 (ko) * 2017-08-09 2021-11-12 미라이얼 가부시키가이샤 기판 수납 용기

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58175627U (ja) * 1982-05-17 1983-11-24 信越ポリマ−株式会社 ウエハ−収納容器
JP2005289436A (ja) * 2004-03-31 2005-10-20 Kyokuhei Glass Kako Kk ガラス基板搬送用ボックス
WO2011142288A1 (fr) * 2010-05-14 2011-11-17 住友電気工業株式会社 Dispositif semi-conducteur, substrat lié, et ses procédés de fabrication

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58175627U (ja) * 1982-05-17 1983-11-24 信越ポリマ−株式会社 ウエハ−収納容器
JP2005289436A (ja) * 2004-03-31 2005-10-20 Kyokuhei Glass Kako Kk ガラス基板搬送用ボックス
WO2011142288A1 (fr) * 2010-05-14 2011-11-17 住友電気工業株式会社 Dispositif semi-conducteur, substrat lié, et ses procédés de fabrication

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JP2013118211A (ja) 2013-06-13
TW201340236A (zh) 2013-10-01

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