WO2013076751A1 - Échangeur thermique de type à plaques et dispositif de cycle de réfrigération utilisant celui-ci - Google Patents

Échangeur thermique de type à plaques et dispositif de cycle de réfrigération utilisant celui-ci Download PDF

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Publication number
WO2013076751A1
WO2013076751A1 PCT/JP2011/006460 JP2011006460W WO2013076751A1 WO 2013076751 A1 WO2013076751 A1 WO 2013076751A1 JP 2011006460 W JP2011006460 W JP 2011006460W WO 2013076751 A1 WO2013076751 A1 WO 2013076751A1
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WIPO (PCT)
Prior art keywords
plate
heat transfer
heat exchanger
refrigerant
heat
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Application number
PCT/JP2011/006460
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English (en)
Japanese (ja)
Inventor
伊東　大輔
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三菱電機株式会社
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Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2011/006460 priority Critical patent/WO2013076751A1/fr
Priority to GB1406880.3A priority patent/GB2510738A/en
Priority to US14/358,319 priority patent/US20140290921A1/en
Publication of WO2013076751A1 publication Critical patent/WO2013076751A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
    • F28F3/046—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element the deformations being linear, e.g. corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
    • F28D9/0043—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the plates having openings therein for circulation of at least one heat-exchange medium from one conduit to another
    • F28D9/005—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the plates having openings therein for circulation of at least one heat-exchange medium from one conduit to another the plates having openings therein for both heat-exchange media

Definitions

  • the present invention relates to a plate heat exchanger and a refrigeration cycle apparatus using the plate heat exchanger.
  • the plate heat exchanger heat transfer plates having a plurality of rows of corrugated irregularities are laminated, and a line connecting the apexes of the corrugated peaks (or the bottom points of the valleys) of the heat transfer plates is adjacent.
  • intersect with respect to a heat exchanger plate is proposed.
  • such a plate type heat exchanger has a wave height h corresponding to the interval between the apex of the corrugated peak of the heat transfer plate and the apex of the valley of the valley of the heat transfer plate adjacent to the heat transfer plate, for example, 1 It is set to about 6 mm to 2.2 mm.
  • the refrigerant when the refrigerant flow rate increases, the refrigerant easily gets over the waveform formed on the heat transfer plate, and may flow in the long axis direction of the heat transfer plate. That is, it is difficult for the refrigerant to spread in the short axis direction (width direction) of the heat transfer plate, and the flow velocity in the short axis direction may become non-uniform. Thereby, the flow of the refrigerant on the width side of the heat transfer plate is retained, and there is a possibility that the effective heat transfer area is reduced and dust clogging occurs.
  • the wave angle ⁇ which is the angle formed by the line connecting the peaks of the corrugated peaks and the longitudinal direction of the heat transfer plate, is set to a small value (for example, 45 degrees) so that the refrigerant can easily spread in the short axis direction of the heat transfer plate.
  • a plate-type heat exchanger designed to do this has been proposed (see, for example, Patent Document 2).
  • the wave pitch ⁇ which is the distance between the peaks and peaks (or valleys and valleys) of the heat transfer plate, is set small (for example, 4 mm or less) to increase the refrigerant flow rate.
  • JP 2001-56192 A for example, paragraph [0017] and FIG. 2 of the specification
  • JP 2011-516815 A for example, paragraphs [0025] to [0028] of the specification
  • Patent Document 1 The technique described in Patent Document 1 is to reduce the wave height h, thereby reducing the refrigerant flow path cross section and increasing the refrigerant flow velocity.
  • the refrigerant flow rate increases, the refrigerant is easily stirred at the intersection of adjacent heat transfer plates, and the pressure loss increases.
  • the subject that the power consumption of the compressor which supplies a refrigerant
  • the refrigerant hardly spreads in the short axis direction (width direction) of the heat transfer plate, and the refrigerant flow in the short axis direction may become non-uniform. Thereby, the flow of the refrigerant on the width side of the heat transfer plate is retained, and there is a possibility that the effective heat transfer area is reduced and dust clogging occurs.
  • the present invention has been made to solve at least one of the above-described problems, and provides heat transfer efficiency, reduction of pressure loss, blockage of a refrigerant flow path, cost increase suppression, and weight reduction.
  • An object of the present invention is to provide a plate-type heat exchanger designed to be designed.
  • the plate heat exchanger according to the present invention includes an inflow port through which a fluid flows in, an outflow port through which the fluid flowing in from the inflow port flows out, and a substantially V-shaped unevenness arranged in a plurality from the inflow port toward the outflow port.
  • a plate in which a plurality of heat transfer plates on which waves are formed are alternately turned upside down and stacked, and a flow path connecting the inlet and the outlet is formed in the space formed by the uneven waves of adjacent heat transfer plates
  • Type heat exchanger wherein the thickness t of the heat transfer plate is 0.2 mm or less, the uneven pitch ⁇ is 4 to 7 mm, the distance h between the apexes of the unevenness is 1.0 to 1.2 mm,
  • the area expansion rate ⁇ is 1.05 to 1. 15.
  • the plate thickness t is 0.2 mm or less
  • the uneven pitch ⁇ is 4 mm to 7 mm
  • the distance h between the apexes of the uneven corresponding to the stacking direction is 1. 0mm to 1.2mm
  • the area expansion ratio ⁇ is in the range of 1.05 to 1.15, so heat transfer efficiency, pressure loss reduction, refrigerant flow path blockage, cost increase suppression and weight reduction Can be achieved.
  • FIG. 2 is a schematic view of a heat transfer plate of the plate heat exchanger illustrated in FIG. 1. It is explanatory drawing of the various dimensions of the heat-transfer plate of the plate type heat exchanger shown in FIG. It is explanatory drawing of the relationship between wave pitch (LAMBDA) of the plate type heat exchanger shown in FIG. 1, and area expansion rate (PHI). It is a graph which shows the weight reduction amount of a plate type heat exchanger when changing the wave height h and wave angle (theta) as a parameter when the heat exchange amount of a plate type heat exchanger is 15 kW.
  • LAMBDA wave pitch
  • PHI area expansion rate
  • FIG. 1 is an explanatory diagram of a plate heat exchanger 100 according to the first embodiment.
  • Fig.1 (a) is a side view in the state in which the plate type heat exchanger 100 was assembled.
  • FIG. 1B is a front view of the side plate 1.
  • FIG. 1C is a front view of the heat transfer plate 2.
  • FIG. 1D is a front view of the heat transfer plate 3.
  • FIG. 1E is a front view of the side plate 4.
  • FIG. 1 (f) is a diagram illustrating a state in which the heat transfer plate 2 and the heat transfer plate 3 are overlapped.
  • FIG. 1 (f) is a diagram illustrating a state in which the heat transfer plate 2 and the heat transfer plate 3 are overlapped.
  • FIG. 2 is a schematic view of the heat transfer plate 20 of the plate heat exchanger 100 illustrated in FIG.
  • the solid line arrow represents the flow of the first refrigerant and the dotted line arrow represents the flow of the second refrigerant.
  • the relationship of the size of each component may be different from the actual one.
  • FIG.1 and FIG.2 the structure of the plate-type heat exchanger 100 is demonstrated.
  • the plate heat exchanger 100 heats, for example, a heat source side refrigerant (first refrigerant) conveyed from an outdoor unit on the heat source side and a heat medium (second refrigerant) conveyed from an indoor unit on the usage side. It is to be exchanged. That is, the plate heat exchanger 100 is a heat exchanger of a heat medium such as refrigerant versus refrigerant or refrigerant versus water or brine.
  • the plate heat exchanger 100 is formed with a first refrigerant channel X through which the first refrigerant flows and a second refrigerant channel Y through which the second refrigerant flows so that the first refrigerant and the second refrigerant are not mixed.
  • the plate heat exchanger 100 includes a heat transfer plate 20 and side plates 1 and 4 that reinforce the plate heat exchanger 100.
  • the heat transfer plate 20 forms the first refrigerant flow paths X and Y for the first refrigerant and the second refrigerant.
  • the heat transfer plate 20 is composed of two types of plates, that is, heat transfer plates 2 and 3 having a rectangular planar shape.
  • the heat transfer plate 2 is obtained by inverting the heat transfer plate 3 upside down.
  • the heat transfer plate 20 has a substantially V-shaped wave on the surface thereof, and the heat transfer plate 2 formed in a plurality of rows in the “vertical direction” and the lower direction of the heat transfer plate 2 are reversed.
  • the arranged heat transfer plates 3 are alternately arranged oppositely (stacked).
  • the heat transfer plate 3 having the reverse direction of the heat transfer plate 2 is arranged behind the heat transfer plate 2, and the heat transfer plate 2 is arranged behind the heat transfer plate 3.
  • the “vertical direction” indicates not only the direction perpendicular to the surface on which the plate heat exchanger 100 is installed, but also the general vertical direction.
  • the shape of the heat transfer plate 20 in plan view is described as being rectangular, the shape is not limited thereto, and may be, for example, a square.
  • the top and bottom of the heat transfer plate 20 correspond to the top and bottom of the paper surface of FIG. That is, the top of the heat transfer plate 20 corresponds to the side where the first opening 11 and the fourth opening 14 described later are present, and the bottom of the heat transfer plate 20 is the second opening 13 and the third opening 12. Corresponds to the side.
  • the heat transfer plate 2 is provided in parallel to the heat transfer plate 3 and the side plates 1 and 4, and is a plate-like member disposed to face the adjacent heat transfer plate 3.
  • the heat transfer plate 2 is formed with a plurality of rows of waves of unevenness 9 having a substantially inverted V shape when viewed in plan.
  • corrugation 9 is formed symmetrically about the centerline parallel to the longitudinal direction (up-down direction of the paper surface of FIG.1 and FIG.2) of the heat-transfer plate 2.
  • the unevenness 9 is formed so that a line connecting the apexes of the unevenness 9 forms a predetermined angle with respect to the center line.
  • the heat transfer plate 3 also has an angle other than the angle formed by the line connecting the tops (or bottom points) of the irregularities 10 of the heat transfer plate 3 and the longitudinal direction of the heat transfer plate 3 (the vertical direction of the paper surface in FIGS. 1 and 2). Is the same as the configuration of the heat transfer plate 2. That is, the heat transfer plate 3 is a plate-like member that is provided in parallel to the heat transfer plate 2 and the side plates 1 and 4 and is disposed to face the adjacent heat transfer plate 2. As shown in FIG. 1D, the heat transfer plate 3 is formed with a plurality of rows of waves of substantially V-shaped irregularities 10 when viewed in plan.
  • a line connecting the apexes (bottom points) of the unevenness 10 is formed symmetrically with respect to a center line parallel to the longitudinal direction of the heat transfer plate 3.
  • the unevenness 10 is formed so that a line connecting the apexes of the unevenness 10 forms a predetermined angle with respect to the center line.
  • the unevenness 9 formed on the heat transfer plate 2 and the unevenness 10 formed on the heat transfer plate 3 increase the area where the heat (or cold) of the first refrigerant and the second refrigerant is released, and increase the heat exchange efficiency. It is formed for such reasons.
  • a line connecting the vertices of the unevenness 9 of the heat transfer plate 2 and It is provided so that the line which connected the vertex of the unevenness
  • the cross-section of the unevennesses 9 and 10 formed on the heat transfer plates 2 and 3 may be, for example, a saw shape or a wave shape (curved surface).
  • the heat transfer plate 2 and the heat transfer plate 3 include a first opening 11 through which the first refrigerant flowing into the plate heat exchanger 100 flows, and the plate.
  • a second opening 13 through which the first refrigerant flowing out of the heat exchanger 100 flows is formed.
  • the heat transfer plate 2 and the heat transfer plate 3 also have a third opening 12 through which the second refrigerant flowing into the plate heat exchanger 100 flows, and a second refrigerant flowing out from the plate heat exchanger 100.
  • Four openings 14 are formed.
  • the first opening 11 formed in the heat transfer plate 2 corresponds to the inlet of the first refrigerant flowing into the first refrigerant flow path X formed between the heat transfer plates 2 and 3, and
  • the second opening 13 formed in the heat plate 2 corresponds to the outlet of the first refrigerant flowing into the first refrigerant channel X.
  • the second refrigerant passes through the third opening 12 and the fourth opening 14 formed in the heat transfer plate 2 without flowing into the first refrigerant flow path X.
  • the third opening 12 formed in the heat transfer plate 3 corresponds to the inlet of the second refrigerant flowing into the second refrigerant flow path Y formed between the heat transfer plates 3 and 2, and
  • the fourth opening 14 formed in the heat plate 3 corresponds to the outlet of the second refrigerant that has flowed into the second refrigerant flow path Y.
  • the first refrigerant passes through the first opening 11 and the second opening 13 formed in the heat transfer plate 2 without flowing into the second refrigerant flow path Y.
  • the first openings 11 of the heat transfer plates 2 and 3 communicate with each other. The same applies to the second opening 13, the third opening 12, and the fourth opening 14.
  • the heat transfer plate 2 and the heat transfer plate 3 form a first refrigerant flow path X through which the first refrigerant flows by the rear surface of the heat transfer plate 2 and the front surface of the heat transfer plate 3,
  • a second refrigerant flow path Y through which the second refrigerant flows is formed by the rear surface of the heat transfer plate 3 and the front surface of the heat transfer plate 2.
  • “front” corresponds to “right of paper” in FIG. 2
  • “rear” corresponds to “left of paper”.
  • the side plates 1 and 4 reinforce the plate heat exchanger 100.
  • the side plate 1 is provided in parallel to the heat transfer plate 20 and the side plate 4, and is disposed opposite to the foremost heat transfer plate 2 as shown in FIG. .
  • the side plate 4 is provided in parallel to the heat transfer plate 20 and the side plate 1, and is disposed opposite to the rearmost heat transfer plate 3 as shown in FIG. It is.
  • the side plate 1 includes a first refrigerant inflow pipe 5 for allowing the first refrigerant to flow into the plate heat exchanger 100 and a first refrigerant outflow pipe 7 for allowing the first refrigerant to flow out of the plate heat exchanger 100. Is provided.
  • the side plate 1 has a second refrigerant inflow pipe 6 for allowing the second refrigerant to flow into the plate heat exchanger 100, and a second refrigerant outflow for causing the second refrigerant to flow out of the plate heat exchanger 100.
  • a tube 8 is provided.
  • FIG. 3 is an explanatory diagram of various dimensions of the heat transfer plate 20 of the plate heat exchanger 100 shown in FIG.
  • FIG. 3A is a plan view of the heat transfer plate 20 using the heat transfer plate 2 as an example.
  • FIG.3 (b) is sectional drawing in the surface orthogonal to the line
  • FIG. 4 is an explanatory diagram of the relationship between the area expansion ratio ⁇ and the wave pitch ⁇ of the plate heat exchanger 100 shown in FIG. In FIG. 4, the plate thickness t is 0.2 mm, and the wave height h is 1.4 mm.
  • the wave angle ⁇ , wave pitch ⁇ , wave height h, wavelength s, area enlargement ratio ⁇ , and plate thickness are specified in the wave shape specification of the irregularities 9, 10 formed on the heat transfer plate 20.
  • the variable t is adopted.
  • the wave angle ⁇ corresponds to the wave spreading angle with respect to the wave arrangement direction of the substantially V-shaped irregularities 9 and 10. That is, as shown in FIG. 3, the wave angle ⁇ is an angle formed by a line connecting the vertices (or bottom points) of the unevenness of the heat transfer plate 20 with respect to the longitudinal direction of the heat transfer plate 20. As shown in FIG. 3B, the wave pitch ⁇ corresponds to the length between adjacent vertices. As shown in FIG. 3B, the wave height h corresponds to the length between the bottom and top of the unevenness.
  • the wavelength s corresponds to the length of the heat transfer plate 20 between adjacent vertices, as shown in FIG.
  • This wavelength s is expressed by the following (Formula 1).
  • equation is a curvature radius corresponding to the distance of the perpendicular direction from the curvature center O shown to FIG. ⁇ represents a range in which the distance from the center of curvature O to the waves of the unevennesses 9 and 10 is the same radius of curvature R1.
  • the plate thickness t corresponds to the thickness of the heat transfer plate 20.
  • the area enlargement ratio ⁇ is obtained by dividing the wavelength s at a predetermined wave height h by the wave pitch ⁇ . Further, the area enlargement ratio ⁇ can also be represented by the wave height h and the wave pitch ⁇ because the wavelength s is represented by the above (Formula 1).
  • the area expansion rate ⁇ is small, the elongation of the plate material is small, and when the area expansion rate ⁇ is large, the elongation of the plate material is large.
  • FIG. 4 shows the value of the area enlargement ratio ⁇ when the plate thickness t is 0.2 mm and the wave height h is 1.4 mm.
  • FIG. 5 is a graph showing the weight reduction amount of the plate heat exchanger 100 when the wave height h and the wave angle ⁇ are changed as parameters when the heat exchange amount of the plate heat exchanger 100 is 15 kW. is there.
  • the plate thickness t is 0.2 mm.
  • the wave height h is preferably 1.0 to 1.2 mm.
  • the area enlargement ratio ⁇ is small and the elongation of the plate material is small. Therefore, by adjusting the wave angle ⁇ , the weight reduction ratio can be set to 20% or more or a value close thereto. This is because it can.
  • the wave angle ⁇ may be set within a range of 40 degrees to 50 degrees. This is because, in the range of the wave angle ⁇ , it is possible to prevent the refrigerant flow in the minor axis direction of the heat transfer plate 20 from becoming uneven while securing the weight reduction rate. Further, in the range of the wave angle ⁇ , the flow of the refrigerant on the width side of the heat transfer plate 20 stays, and the reduction of the effective heat transfer area and the occurrence of clogging of dust are suppressed, and the pressure loss is reduced. Because it can. Furthermore, if the wave height h is 1.0 to 1.2 mm, it is possible to suppress the occurrence of cracks in the heat transfer plate 20 and uneven thickness t because the elongation of the plate material is small. it can.
  • the wave height h is larger than 1.2 mm, compared with the case where the wave height h is 1.0 to 1.2 mm, the area enlargement ratio ⁇ is increased and the elongation of the plate material is increased. There is a possibility that a crack in the heat transfer plate 20 or an uneven thickness t may occur.
  • the wave height h is less than 1.0 mm, as compared with the case where the wave height h is 1.0 to 1.2 mm, the area expansion rate ⁇ is reduced and the elongation of the plate material is reduced.
  • the refrigerant flow path is small, so the pressure loss is large. That is, when the wave height h is less than 1.0 mm, in order to set the heat exchange amount to 15 kW, it is necessary to increase the number of stacked heat transfer plates 20 in order to reduce the pressure loss. The weight of the heat exchanger 100 cannot be reduced.
  • FIG. 6 is a graph showing the weight reduction amount of the plate heat exchanger 100 when the area expansion ratio ⁇ and the wave angle ⁇ are changed as parameters.
  • the plate thickness t is 0.2 mm.
  • the continuous line of FIG. 6 is a result in the plate type heat exchange whose heat exchange amount is 15 kW, and a dotted line is a result in the plate type heat exchanger whose heat exchange amount is 9 kW.
  • the area expansion rate ⁇ is preferably 1.05 to 1.15 in any heat exchange amount. This is because, in the case of the area enlargement ratio ⁇ , the weight reduction ratio can be set to 20% or more or a value close thereto by adjusting the wave angle ⁇ .
  • the wave angle ⁇ may be set within a range of 40 degrees to 50 degrees. This is because, in the range of the wave angle ⁇ , it is possible to prevent the refrigerant flow in the minor axis direction of the heat transfer plate 20 from becoming uneven while securing the weight reduction rate. Further, in the range of the wave angle ⁇ , the flow of the refrigerant on the width side of the heat transfer plate 20 stays, and the reduction of the effective heat transfer area and the occurrence of clogging of dust are suppressed, and the pressure loss is reduced. Because it can.
  • the plate heat exchanger is independent of the heat exchange amount of the plate heat exchanger 100.
  • the following wave height h, area enlargement ratio ⁇ , and wave angle ⁇ may be set. That is, the wave height h is set to 1.0 to 1.2 mm, the wave angle ⁇ is set to a range of 40 degrees to 50 degrees, and the area enlargement ratio ⁇ is set to 1.05 to 1.15. . Thereby, the optimal weight reduction effect in the case of reducing the thickness t to 0.2 mm or less can be obtained.
  • the case where the plate thickness t is 0.2 mm has been described as an example.
  • the wave pitch ⁇ and the wave height h are set as described above.
  • the range (value) the weight reduction rate is increased, the refrigerant flow in the minor axis direction of the heat transfer plate 20 is prevented from becoming non-uniform, and the heat transfer plate 20 is cracked or the thickness t is decreased. Bias suppression can be realized.
  • the wave angle ⁇ is set to 40 to 50 degrees
  • the wave height h is set to 1.0 to 1.2 mm, so that the heat exchange of the plate heat exchanger 100 is performed. It has been explained that an optimum weight reduction effect can be obtained by reducing the plate thickness t regardless of the amount.
  • the wave pitch ⁇ is preferably 4 mm or more, and will be described below with reference to FIG.
  • FIG. 7 is a diagram for explaining the distance between junction points of adjacent heat transfer plates 2 and 3 for each wave angle ⁇ .
  • the wave angle ⁇ is 65 degrees
  • the wave angle ⁇ is 45 degrees.
  • the junction point corresponds to the position of the point where the line connecting the vertices of the unevenness of the heat transfer plate 2 and the line connecting the vertices of the unevenness of the heat transfer plate 3 intersect.
  • the dotted line illustrated in FIG. 7A and FIG. 7B represents a line connecting the vertices of the unevenness formed in the adjacent heat transfer plates 2 and 3.
  • L1 is the distance between point a and point b when the wave angle ⁇ is 65 degrees
  • L2 is the distance between point a and point b when the wave angle ⁇ is 45 degrees.
  • the wave angle ⁇ when the wave angle ⁇ is reduced from 65 degrees to 45 degrees, the refrigerant flows in the short axis direction of the heat transfer plates 2 and 3 in a non-uniform manner. It is possible to prevent the refrigerant flow on the width side of the heat transfer plates 2 and 3 from staying, and to reduce the effective heat transfer area and clogging of dust.
  • the wave angle ⁇ when the wave angle ⁇ is reduced from 65 degrees to 45 degrees, the distance L1> the distance L2. That is, the distance between the junction points closest to each other in the minor axis direction is reduced.
  • the wave pitch ⁇ is preferably set to 4 to 7 mm.
  • the radius of the minimum fillet is about 1.5 mm, and about 50% or more is secured as the refrigerant flow path, so that blocking of the refrigerant flow path is suppressed.
  • the wave pitch ⁇ is excessively widened, the number of junctions between the adjacent heat transfer plate 2 and the heat transfer plate 3 decreases, resulting in a decrease in heat transfer efficiency.
  • the wave pitch ⁇ is set to 4 to 7 mm, it is possible to suppress a decrease in heat transfer efficiency.
  • the thickness t of the heat transfer plate 20 is set to 0.2 mm or less
  • the wave height h is set to 1.0 to 1.2
  • the wave angle ⁇ Is set to 40 to 50 degrees
  • the wave pitch ⁇ is set to 4 to 7 mm, thereby reducing heat transfer efficiency, reducing pressure loss, equalizing the refrigerant flow in the short axis direction, and blocking the refrigerant flow path.
  • cost increase can be suppressed and weight can be reduced.
  • the heat transfer plate 20 has a wave height h set to 1.0 to 1.2 mm, a wave angle ⁇ set to 40 degrees to 50 degrees, and an area enlargement ratio ⁇ of 1.05 to 1. 15 (see FIGS. 5 and 6).
  • the area enlargement ratio ⁇ is decreased, and the elongation of the plate material is small.
  • the refrigerant flows in the short axis direction of the heat transfer plate 20 in a non-uniform manner.
  • the occurrence of cracks in the heat plate 20, uneven thickness t, and the like, and the refrigerant flow path being made thinner, increase the flow rate of the refrigerant and improve the heat transfer efficiency. can do.
  • the wave angle ⁇ is set to 40 degrees to 50 degrees, and the wave pitch ⁇ is set to 4 to 7 mm (see FIG. 7).
  • the wave pitch ⁇ is set to 4 to 7 mm (see FIG. 7).
  • the heat transfer plate 20 of the plate heat exchanger 100 has a wave height h set to 1.0 mm to 1.2 mm and a wave pitch ⁇ set to 4 to 7 mm. 05 to 1.15 can be satisfied. Thereby, since the diameter of the refrigerant flow path is reduced, the flow rate of the refrigerant is increased, and the heat transfer efficiency can be improved. Further, it is possible to reduce the elongation of the plate material when forming the heat transfer plate 20 from the plate material, and it is possible to suppress the occurrence of cracks in the heat transfer plate 20, unevenness of the plate thickness t, and the like. That is, the strength of the plate heat exchanger 100 is not easily impaired (high strength). Thereby, the plate material can be thinned, and the material cost and weight can be reduced. And since the setting load at the time of press work can be set small by the part which can be thinned, processing cost can be reduced.
  • the thickness t, wave height h, wave angle ⁇ , and wave pitch ⁇ of the heat transfer plate 20 deviate from the ranges described in the first embodiment, there are the following adverse effects.
  • the plate thickness t is out of the range, the weight of the plate heat exchanger 100 is increased in the first place. Further, when the wave height h and the wave angle ⁇ are out of the range, the increase in the weight of the plate heat exchanger 100, the occurrence of cracks in the heat transfer plate 20 and the deviation of the plate thickness t, or the increase in pressure loss. If the number of stacked heat transfer plates 20 is increased, the weight of the plate heat exchanger 100 is increased. Further, when the wave pitch ⁇ is out of the range, the heat transfer efficiency is lowered due to the blockage of the refrigerant flow path or the reduction of the junction points between the adjacent heat transfer plates 2 and 3.
  • the plate heat exchanger 100 realizes suppression of pressure loss and high strength. Therefore, the plate heat exchanger 100 can suppress pressure loss even when supplied with, for example, a CO 2 refrigerant, a hydrocarbon refrigerant, a low-density flammable low GWP refrigerant, etc. The deformation of the heat transfer plate 20 and the like can be suppressed.
  • the plate-type heat exchanger 100 can reduce the elongation rate of the plate material as described above, the elongation rate is 30% or more of stainless steel (elongation rate 40%), copper (elongation rate 40%), Even if the heat transfer plate 20 is constituted by not only industrial aluminum (elongation rate 30%) but also metals such as titanium (elongation rate 14%) and corrosion-resistant aluminum (elongation rate 16%) as small as 20% or less.
  • the heat transfer plate 20 may be made of synthetic resin or the like.
  • the heat transfer plate 2 is the heat transfer plate 3 upside down and has the same configuration
  • the heat transfer plate 2 is not limited thereto. That is, the heat transfer plate 2 and the heat transfer plate 3 have a thickness t of 0.2 mm or less, a wave height h in the range of 1.0 to 1.2 mm, a wave angle ⁇ in the range of 40 degrees to 50 degrees, and a wave pitch. It is sufficient that ⁇ is set in the range of 4 to 7 mm and the area enlargement ratio ⁇ is set in the range of 1.05 to 1.15.
  • FIG. 8 is an explanatory diagram of a refrigeration cycle apparatus (air conditioner) according to Embodiment 2 of the present invention.
  • the refrigeration cycle apparatus according to the second embodiment is, for example, an air conditioner, a power generator, a food heat sterilization apparatus or the like equipped with a plate heat exchanger.
  • the refrigeration cycle apparatus is the air conditioner 200 as an example.
  • the air-conditioning apparatus 200 uses the heat of the indoor unit 102 as the cooling heat of the heat source side refrigerant that flows through the one outdoor unit 101, the one indoor unit 102, and the outdoor unit 101 that are heat source units. It has a heat medium converter 103 for transmitting to the medium.
  • the outdoor unit 101 and the heat medium relay unit 103 are connected by a refrigerant pipe 120 that conducts the heat source side refrigerant (first refrigerant) to constitute a refrigerant circulation circuit A.
  • the heat medium converter 103 and the indoor unit 102 are connected by a heat medium pipe 121 that conducts the heat medium (second refrigerant), and constitutes a heat medium circuit B.
  • the outdoor unit 101 is mounted with at least a heat source side heat exchanger 110, a compressor 118, and an expansion device 111.
  • the indoor unit 102 is equipped with at least a use side heat exchanger 112.
  • At least the plate heat exchanger 100 and the pump 119 according to the first embodiment are mounted on the heat medium relay unit 103.
  • the plate heat exchanger 100 is mounted on the heat medium converter 103 will be described, at least one of the outdoor unit 101, the indoor unit 102, and the heat exchanger of the heat medium converter 103 is used. It is sufficient that the plate heat exchanger 100 is employed.
  • the air conditioning apparatus 200 that performs the cooling operation is described as an example of the refrigeration cycle apparatus.
  • the refrigerant circulation circuit A may be provided with a four-way valve or the like to enable the heating operation. Needless to say.
  • the heat source side heat exchanger 110 functions as a condenser and performs heat exchange between the heat source side refrigerant flowing through the refrigerant pipe 120 and the outdoor air.
  • One of the heat source side heat exchangers 110 is connected to the plate heat exchanger 100 and the other is connected to the discharge side of the compressor 118.
  • the compressor 118 compresses the heat source side refrigerant and conveys it to the refrigerant circuit A.
  • the compressor 118 has a discharge side connected to the heat source side heat exchanger 110 and a suction side connected to the plate heat exchanger 100.
  • the expansion device 111 expands the heat source side refrigerant flowing through the refrigerant pipe 120 by reducing the pressure.
  • One of the expansion devices 111 is connected to the heat source side heat exchanger 110, and the other is connected to the plate heat exchanger 100.
  • the throttling device 111 may be composed of, for example, a capillary tube or a solenoid valve.
  • the usage-side heat exchanger 112 performs heat exchange between the heat medium flowing through the heat medium pipe 121 and the air in the air-conditioning target space.
  • One of the use side heat exchangers 112 is connected to the plate heat exchanger 100 and the other is connected to the suction side of the pump 119.
  • the plate heat exchanger 100 exchanges heat between the heat source side refrigerant and the heat medium.
  • the plate heat exchanger 100 is connected to the suction side of the compressor 118 and the expansion device 111 via the refrigerant pipe 120. Further, the plate heat exchanger 100 is connected to the use side heat exchanger 112 and the pump 119 via the heat medium pipe 121. That is, the plate heat exchanger 100 is cascade-connected to the refrigerant circuit A and the heat medium circuit B.
  • the pump 119 conveys the heat medium to the heat medium circulation circuit B.
  • the pump 119 has a suction side connected to the use side heat exchanger 112 and a discharge side connected to the plate heat exchanger 100.
  • the flow of the heat source side refrigerant in the refrigerant circuit A will be described.
  • the low-temperature / low-pressure heat source side refrigerant is compressed by the compressor 118 and discharged as a high-temperature / high-pressure gas refrigerant.
  • the high-temperature and high-pressure gas refrigerant discharged from the compressor 118 flows into the heat source side heat exchanger 110. And it becomes a high-pressure liquid refrigerant while radiating heat to the outdoor air by the heat source side heat exchanger 110.
  • the high-pressure liquid refrigerant that has flowed out of the heat source side heat exchanger 110 is expanded by the expansion device 111 and becomes a low-temperature, low-pressure two-phase refrigerant.
  • This low-temperature, low-pressure two-phase refrigerant flows into the plate heat exchanger 100 that functions as an evaporator.
  • the low-temperature / low-pressure two-phase refrigerant absorbs heat from the heat medium circulating in the heat medium circuit B, and becomes a low-temperature / low-pressure gas refrigerant while cooling the heat medium.
  • the gas refrigerant that has flowed out of the plate heat exchanger 100 is sucked into the compressor 118 again.
  • the heat medium pressurized and discharged by the pump 119 flows into the plate heat exchanger 100, and the cold heat of the heat source side refrigerant of the plate heat exchanger 100 is transmitted to the heat medium.
  • this heat medium flows out of the plate heat exchanger 100, it flows into the use side heat exchanger 112.
  • the heat medium absorbs heat from the indoor air by the use side heat exchanger 112, thereby cooling the air-conditioning target space.
  • the heat medium flowing out from the use side heat exchanger 112 is sucked into the pump 119 again.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

La présente invention a trait à un échangeur thermique de type à plaques dont l'épaisseur de plaque t des plaques de transfert de chaleur (2, 3) est inférieure ou égale à 0,2 mm, le pas Λ des concavités et des convexités (9, 10) va de 4 à 7 mm, la distance h entre les sommets des concavités et des convexités (9, 10) va de 1,0 à 1,2 mm, et le coefficient d'agrandissement de surface Φ, défini comme étant la valeur lorsque la longueur d'onde s correspondant à la longueur des plaques de transfert de chaleur (2, 3) entre les sommets des ondes des concavités et des convexités (9, 10) des plaques de transfert de chaleur (2, 3) est divisée par le pas Λ des concavités et des convexités (9, 10), va de 1,05 à 1,15.
PCT/JP2011/006460 2011-11-21 2011-11-21 Échangeur thermique de type à plaques et dispositif de cycle de réfrigération utilisant celui-ci WO2013076751A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2011/006460 WO2013076751A1 (fr) 2011-11-21 2011-11-21 Échangeur thermique de type à plaques et dispositif de cycle de réfrigération utilisant celui-ci
GB1406880.3A GB2510738A (en) 2011-11-21 2011-11-21 Plate-type heat exchanger and refrigeration cycle device using same
US14/358,319 US20140290921A1 (en) 2011-11-21 2011-11-21 Plate-type heat exchanger and refrigeration cycle apparatus using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/006460 WO2013076751A1 (fr) 2011-11-21 2011-11-21 Échangeur thermique de type à plaques et dispositif de cycle de réfrigération utilisant celui-ci

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WO2013076751A1 true WO2013076751A1 (fr) 2013-05-30

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US (1) US20140290921A1 (fr)
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US10767933B2 (en) 2016-02-24 2020-09-08 Alfa Laval Corporate Ab Heat exchanger plate for a plate heat exchanger, and a plate heat exchanger
CN111788449A (zh) * 2018-01-29 2020-10-16 法雷奥热系统公司 用于热交换器的板的扰动装置

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WO2017098668A1 (fr) * 2015-12-11 2017-06-15 三菱電機株式会社 Échangeur de chaleur à plaques et dispositif à cycle frigorifique
US10578367B2 (en) * 2016-11-28 2020-03-03 Carrier Corporation Plate heat exchanger with alternating symmetrical and asymmetrical plates
DE102016015535A1 (de) * 2016-12-19 2018-06-21 Ziehl-Abegg Se Kühlvorrichtung eines Elektromotors sowie Elektromotor mit Kühlvorrichtung
KR102440596B1 (ko) * 2017-11-28 2022-09-05 현대자동차 주식회사 차량용 열교환기
KR20210026216A (ko) * 2019-08-29 2021-03-10 엘지전자 주식회사 판형 열교환기

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JP2011517764A (ja) * 2008-04-04 2011-06-16 アルファ ラヴァル コーポレイト アクチボラゲット プレート熱交換器
JP2010078286A (ja) * 2008-09-29 2010-04-08 Mitsubishi Electric Corp プレート式熱交換器、及びこれを搭載した空気調和機
JP2011226676A (ja) * 2010-04-16 2011-11-10 Mitsubishi Electric Corp 温水熱源機

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10767933B2 (en) 2016-02-24 2020-09-08 Alfa Laval Corporate Ab Heat exchanger plate for a plate heat exchanger, and a plate heat exchanger
CN111788449A (zh) * 2018-01-29 2020-10-16 法雷奥热系统公司 用于热交换器的板的扰动装置

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US20140290921A1 (en) 2014-10-02
GB201406880D0 (en) 2014-05-28

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