WO2013069865A1 - Dispositif de conversion de signal acoustique/électrique hybride qui est de type inverse - Google Patents

Dispositif de conversion de signal acoustique/électrique hybride qui est de type inverse Download PDF

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Publication number
WO2013069865A1
WO2013069865A1 PCT/KR2012/004981 KR2012004981W WO2013069865A1 WO 2013069865 A1 WO2013069865 A1 WO 2013069865A1 KR 2012004981 W KR2012004981 W KR 2012004981W WO 2013069865 A1 WO2013069865 A1 WO 2013069865A1
Authority
WO
WIPO (PCT)
Prior art keywords
acoustic
sound inlet
sound
electric converting
circuit board
Prior art date
Application number
PCT/KR2012/004981
Other languages
English (en)
Inventor
Gap Ryul Jung
Original Assignee
Pilkor Cst. Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pilkor Cst. Co., Ltd. filed Critical Pilkor Cst. Co., Ltd.
Publication of WO2013069865A1 publication Critical patent/WO2013069865A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R23/00—Transducers other than those covered by groups H04R9/00 - H04R21/00
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Definitions

  • producers may easily avoid the damage of the product caused by corresponding process circumstances (for example, introduction of internal air pressure, introduction of cream solder dissolution gas or the like) while performing ⁇ the process of surface-mounting the product to the circuit board included in an electronic device (an information communication device, an acoustic device, or the like) under a severe condition of high temperature and high pressure>.
  • Fig. 5 is an exploded perspective view exemplarily showing the reverse-type hybrid acoustic/electric converting device according to the present disclosure which is surface-mounted to a circuit board of an electronic device.
  • the corresponding FET is preferably a junction field effect transistor (J-FET), and in this case, the load register 195 connects to a drain terminal of the J-FET (for reference, an MOS FET or the like cannot be adopted as the acoustic/electric converting device for an electronic device (a mobile device) due to its noise characteristic).
  • J-FET junction field effect transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

La présente invention concerne un dispositif de conversion acoustique/électrique hybride de type inverse, et une structure de produit totale d'un conditionnement de conversion acoustique/électrique de type inverse général est amélioré en une capsule acoustique monolithique apte à former une structure de fixation autoportante indépendante (à savoir, une structure de fixation autoportante indépendante de cintrage du boîtier) d'un mécanisme de détection du son excellente (une plaque de vibration, une plaque de fixation, la plaque diélectrique ou similaire) simplement par une simple opération de couplage d'une structure de bloc partielle (par exemple, un bloc de métal de conduction/compression et un bloc de base d'isolation/compression) sans une quelconque procédure complexe séparée et apte à réaliser la fonction de l'élément de conversion acoustique/électrique à la place et une structure supportant la capsule acoustique monolithique et comprenant une entrée de son, un motif d'étanchéité acoustique, une puce de circuit ou similaire.
PCT/KR2012/004981 2011-11-07 2012-06-25 Dispositif de conversion de signal acoustique/électrique hybride qui est de type inverse WO2013069865A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0115245 2011-11-07
KR1020110115245A KR20130050089A (ko) 2011-11-07 2011-11-07 리버스 타입 하이브리드 음/전 변환장치

Publications (1)

Publication Number Publication Date
WO2013069865A1 true WO2013069865A1 (fr) 2013-05-16

Family

ID=48290205

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/004981 WO2013069865A1 (fr) 2011-11-07 2012-06-25 Dispositif de conversion de signal acoustique/électrique hybride qui est de type inverse

Country Status (2)

Country Link
KR (1) KR20130050089A (fr)
WO (1) WO2013069865A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110087167A (zh) * 2019-04-26 2019-08-02 维沃移动通信有限公司 终端设备

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101424617B1 (ko) * 2013-06-27 2014-08-01 주식회사 아이. 피. 에스시스템 마이크로 스피커 및 그 조립방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100464700B1 (ko) * 2002-09-27 2005-01-05 부전전자부품 주식회사 지향성 콘덴서 마이크로폰
KR20050078324A (ko) * 2004-01-29 2005-08-05 주식회사 비에스이 위상지연필터 및 이를 이용한 단일 지향성 콘덴서마이크로폰
US20070104339A1 (en) * 2005-11-04 2007-05-10 Hosiden Corporation Electret condenser microphone
KR100753913B1 (ko) * 2006-04-11 2007-09-05 주식회사 씨에스티 마이크로폰 조립체

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100464700B1 (ko) * 2002-09-27 2005-01-05 부전전자부품 주식회사 지향성 콘덴서 마이크로폰
KR20050078324A (ko) * 2004-01-29 2005-08-05 주식회사 비에스이 위상지연필터 및 이를 이용한 단일 지향성 콘덴서마이크로폰
US20070104339A1 (en) * 2005-11-04 2007-05-10 Hosiden Corporation Electret condenser microphone
KR100753913B1 (ko) * 2006-04-11 2007-09-05 주식회사 씨에스티 마이크로폰 조립체

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110087167A (zh) * 2019-04-26 2019-08-02 维沃移动通信有限公司 终端设备
US12028665B2 (en) 2019-04-26 2024-07-02 Vivo Mobile Communication Co., Ltd. Terminal device

Also Published As

Publication number Publication date
KR20130050089A (ko) 2013-05-15

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