WO2013069327A1 - Feuille de transfert thermique - Google Patents

Feuille de transfert thermique Download PDF

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Publication number
WO2013069327A1
WO2013069327A1 PCT/JP2012/064302 JP2012064302W WO2013069327A1 WO 2013069327 A1 WO2013069327 A1 WO 2013069327A1 JP 2012064302 W JP2012064302 W JP 2012064302W WO 2013069327 A1 WO2013069327 A1 WO 2013069327A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat conductive
filler
conductive sheet
sheet
heat
Prior art date
Application number
PCT/JP2012/064302
Other languages
English (en)
Japanese (ja)
Inventor
涼介 塩野
川口　康弘
Original Assignee
北川工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北川工業株式会社 filed Critical 北川工業株式会社
Publication of WO2013069327A1 publication Critical patent/WO2013069327A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat conductive sheet that is arranged and used so as to be in contact with a heat source in order to promote heat dissipation from a heat source such as an electronic component.
  • a heat conductive sheet obtained by mixing (filling) a heat conductive filler with an elastomer such as silicone or acrylic resin and molding the sheet into a sheet shape has been considered.
  • This type of heat conductive sheet is interposed between an electronic component that becomes a heat source, for example, and a component that becomes a heat radiating plate such as a heat sink or a housing panel (hereinafter simply referred to as a radiator) in an electric / electronic device. It is arranged to let you.
  • boron nitride is an expensive heat conductive filler, if it is used in a large amount, the manufacturing cost of the heat conductive sheet will increase. Therefore, it is desired to provide a heat conductive sheet having a low dielectric constant without using boron nitride at all or with a small amount of use.
  • boron nitride is not used or the amount of use is reduced in the low dielectric constant heat conductive sheet.
  • the present invention relates to a heat conductive sheet obtained by mixing a hollow filler having a bulk specific gravity of 0.1 to 1.0, which is a specific gravity including gas, and a heat conductive filler into a base material made of an elastomer and molding the mixture into a sheet shape. Because At least one of the heat conductive fillers contained most as the heat conductive filler is a heat conductive filler other than boron nitride.
  • the present invention is a heat treatment obtained by mixing a matrix filler made of elastomer with a hollow filler having a bulk specific gravity of 0.1 to 1.0, which is a specific gravity including gas, and a heat conductive filler, and molding the mixture into a sheet shape.
  • a conductive sheet, A heat conductive filler other than boron nitride is used as the heat conductive filler.
  • a hollow filler such as an organic balloon or a fly ash balloon is mixed with a base material made of an elastomer. Since the inside of the hollow filler is a gas, the relative dielectric constant is low, and the relative dielectric constant of the heat conductive sheet can be satisfactorily reduced even if boron nitride is not used or the amount of the boron filler is reduced. Therefore, in the present invention, at least one of the heat conductive fillers most contained as the heat conductive filler is a heat conductive filler other than boron nitride.
  • the inside of the hollow filler to be mixed is a gas
  • the relative dielectric constant is low
  • the relative dielectric constant of the heat conductive sheet can be satisfactorily reduced without using boron nitride.
  • gas has low thermal conductivity
  • the thermal conductivity of the thermal conductive sheet itself may be reduced by mixing a hollow filler having a bulk specific gravity of 0.1 to 1.0.
  • heat conductivity can be secured by mixing (using) 200 to 300 parts by weight of a heat conductive filler other than boron nitride with 100 parts by weight of the elastomer as the base material.
  • the thermal conductive sheet of the present invention can achieve both a low relative dielectric constant and a high thermal conductivity without using boron nitride.
  • the bulk specific gravity of the hollow filler is 1.0 or less, the dielectric constant can be lowered even when a heat conductive filler other than boron nitride is used.
  • the amount of air present in the heat conductive sheet can be reduced, so that the action as a heat insulating layer is suppressed and the heat conductivity of the heat conductive sheet is not lowered.
  • mixing with the elastomer, which is a base material can be easily performed. Further, since the hollow filler is homogeneously mixed in the obtained heat conductive sheet, there is no difference due to the physical properties of the sheet and the sheet becomes stable.
  • the mixing amount of the heat conductive filler with respect to 100 parts by weight of the elastomer as the base material is 200 parts by weight or more, it is possible to ensure a heat conductivity equal to or higher than that when boron nitride is used.
  • the amount is 300 parts by weight or less, mixing with the elastomer, which is a base material, becomes easy, and thus the formation of the heat conductive sheet can be completed in a short time.
  • the heat conductive filler is uniformly mixed in the obtained heat conductive sheet, there is no difference depending on the physical properties (particularly, thermal conductivity) of the sheet, and the sheet becomes stable.
  • the applicant of the present invention can reduce the relative dielectric constant of the heat conductive sheet satisfactorily by setting the amount of the hollow filler used to 5 to 80 parts by weight relative to 100 parts by weight of the elastomer, and depending on the sheet shape. We have also found that it becomes easy to mold.
  • the relative dielectric constant can be lowered even when a heat conductive filler other than boron nitride is used.
  • the amount is 80 parts by weight or less, mixing with the elastomer, which is a base material, becomes easy, so that the formation of the heat conductive sheet can be completed in a short time.
  • the hollow filler is homogeneously mixed in the obtained heat conductive sheet, there is no difference depending on the physical properties (particularly relative dielectric constant) of the sheet, and the sheet becomes stable.
  • the organic balloon when used as the hollow filler, the organic balloon has elasticity, so that the balloon is not easily broken during the material kneading, and the hardness of the heat conductive sheet is reduced and compression set is not easily generated. You can also Therefore, it has very good characteristics such as low hardness and hardly causing compression set.
  • the specific gravity is close to the specific gravity of the base material, so that it can be easily mixed with the base material.
  • the filler can be dispersed homogeneously. Therefore, the effect of the hollow filler, such as reducing the relative dielectric constant and ensuring the thermal conductivity, is easily expressed uniformly throughout the heat conductive sheet without being biased toward a part of the heat conductive sheet.
  • a fly ash balloon may be used as a hollow filler.
  • the specific gravity of the fly ash balloon is close to the specific gravity of the base material, it becomes easier to mix and the handleability as a filler is improved.
  • fly ash balloons have high strength, there is an effect that the balloons are not easily broken during material kneading.
  • fly ash balloons are hollow and spherical particles contained in a small amount in fly ash (fly ash) generated from a coal-fired power plant, and are also called “floating ash” and “cenosphere”.
  • the main components are silica and alumina.
  • Fly ash balloons are collected by mixing fly ash with water and collecting only those floating in the water.
  • the heat conductivity may be 0.8 W / (m ⁇ K) or more, and the relative dielectric constant at 100 MHz may be 4.0 or less. If the mixing amount of the heat conductive filler is adjusted so as to satisfy such characteristics, the heat conductive sheet of the present invention can transfer heat of a heat source such as an electronic component to a radiator very well, It exhibits remarkable characteristics such as being extremely difficult to cause noise.
  • the Asker C hardness may be 30 or less. If the mixing amount of the heat conductive filler or the like is adjusted so as to satisfy such characteristics, the heat conductive sheet of the present invention increases the adhesion to a heat source such as an electronic component. It exhibits significant properties that can be transmitted.
  • a heat conductive sheet was manufactured by the following manufacturing method. That is, the hollow filler and the heat conductive filler were uniformly dispersed in the liquid silicone by mixing and kneading the hollow filler and the heat conductive filler with the liquid silicone used as the base material elastomer.
  • Examples of the elastomer that is the base material include acrylic resins and the like in addition to the liquid silicone described above.
  • various methods such as extrusion, two-roll, kneader, Banbury mixer and the like can be applied as the mixing method. Of these, kneading using a mixer is desirable in terms of improving workability.
  • the liquid silicone in which the hollow filler and the heat conductive filler were mixed in this way was formed into a 0.5 mm sheet, and then vulcanized.
  • various methods such as a method of forming using a machine such as a coater, a calender roll, an extrusion, and a press can be applied.
  • a coater when molding using a coater, it is easy to produce a thin sheet (film), suitable for mass production because of good productivity, and easy to obtain sheet (film) thickness accuracy. desirable.
  • Liquid silicone base material: Two-part silicone elastomer (Toray Dow, viscosity 1000 mPa ⁇ s at 25 ° C.) -Thermal conductive filler A: Boron nitride (National Nitride Technologies, average particle size of about 6 ⁇ m) B: aluminum hydroxide (Nippon Light Metal Co., Ltd., average particle size of about 10 [mu] m) C: Magnesium hydroxide (manufactured by Kamishima Chemical Industry, average particle size of about 1 ⁇ m) D: Alumina (Nippon Light Metal, average particle size of about 12 ⁇ m) E: silicon carbide (produced by Showa Denko, the average particle size of about 8 [mu] m) Hollow filler a: Fly ash balloon (trade name “Phylite”: manufactured by Nihon Philite, particle size distribution 5 to 300 ⁇ m, bulk specific gravity 0.65 to 0.85) b:
  • Reference examples 1 to 3 were prepared using boron nitride as the heat conductive filler and fly ash balloon (trade name “Phylite”) as the hollow filler. From this, boron nitride, when mixed with 65 parts by weight of elastomer with respect to 100 parts by weight of the elastomer, deteriorated moldability due to the scale-like particle shape, and cannot be molded with 80 parts by weight. The thermal conductivity was 0.90, and the relative dielectric constant was 4.2.
  • Thermal conductivity ⁇ 0.8 W / (m ⁇ K) or more (numerical values required for general thermal conductive sheets) ⁇ : Less than 0.8 W / (m ⁇ K) Dielectric constant ⁇ : less than 4.0 (typically numerically desirable high frequency noise in suppressing) ⁇ : 4.0 or more Asker C hardness ⁇ : 30 or less ⁇ : More than 30
  • the evaluation is “ ⁇ ” when the mixing amount is 200 to 300 parts by weight, and “ ⁇ ” when the mixing amount is less than 200 parts by weight. confirmed.
  • the evaluation was “ ⁇ ” or “ ⁇ ” regardless of the type of the filler in the range of 5 to 80 parts by weight.
  • the preferred mixing amount of the hollow filler is largely related to its bulk density, and it has been confirmed that 30 parts by weight of a: fly ash balloon exhibits substantially the same effect as 8 parts by weight of b: organic balloon. It was.
  • the suitable mixing amount of the hollow filler has a positive correlation with the bulk density ratio.
  • the Asker C hardness exceeded 65 and 30, and it was found that the followability to the unevenness of the electronic component and the heat sink during mounting was poor.
  • the Asker C hardness is a good value of 30 or less, and the followability to the unevenness of the electronic component or the heat sink is excellent. It has been found that the heat of the source can be transferred very well to the heat sink.
  • this compound was mixed and kneaded by hand, in Examples 1-14 and 1-15, the hollow filler was not broken.
  • the mixing amount of the hollow filler is 5 parts by weight or less (Example 2-2)
  • the relative dielectric constant is 4.1, which is not lower than that close to 4, but exceeds 80 parts by weight (85 parts by weight: Comparative Example 2-1)
  • a heat conductive sheet could not be formed.
  • Example 3 When oxide (alumina) is used as a heat conductive filler
  • the heat conductive sheets of the examples were manufactured by specifying the composition as shown in the left column of Table 3 (Examples 3-1 to 3-10, Comparative Examples 3-1 to 3-6), and The sheet was molded in the same manner as in Example 1 to produce a heat conductive sheet under the same conditions, and the physical properties and evaluation thereof are shown in the right column of Table 3.
  • Reference Example 7 shows a heat conductive filler using only silicon carbide having a high relative dielectric constant of 9 or more and a fly ash balloon (trade name “Philite”) as a hollow filler.
  • the amount used is small (50 parts by weight (about 12% by volume)) (based on 100 parts by weight of the base material). Since it is not necessary to use boron nitride in an Example, the manufacturing cost of a heat conductive sheet can be reduced favorably. In addition, when only the hollow filler is mixed with the liquid elastomer base material, the hollow filler is lifted and it is difficult to mix. Can be manufactured easily.
  • the thermal conductive sheet of Example 4-1 does not use boron nitride or reduces the amount of usage to achieve both a low relative dielectric constant and a high thermal conductivity. It has extremely good characteristics that it is difficult to cause distortion.
  • the heat of the heat source such as an electronic component can be transmitted to the heat sink very well and stably for a long period of time, and the generation of high frequency noise is suppressed. Can do.
  • the present invention is not limited to the above embodiment, and can be implemented in various forms without departing from the gist of the present invention.
  • the elastomer in addition to liquid silicone, acrylic elastomer such as silicone gel and acrylic gel, and EPDM can also be applied.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La présente invention porte sur une feuille de transfert thermique qui est obtenue par mélange d'une charge creuse ayant une densité apparente relative de 0,1-1,0 et d'une charge conductrice de chaleur dans une matière de base qui est composée d'un élastomère et par moulage du mélange résultant en une feuille de feuille. Au moins l'une des charges conductrices de chaleur contenues dans celle-ci dans la quantité la plus grande en tant que charge conductrice de chaleur est une charge conductrice de chaleur autre que le nitrure de bore.
PCT/JP2012/064302 2011-11-11 2012-06-01 Feuille de transfert thermique WO2013069327A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-247834 2011-11-11
JP2011247834A JP2012119674A (ja) 2010-11-11 2011-11-11 熱伝導シート

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WO2013069327A1 true WO2013069327A1 (fr) 2013-05-16

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016088742A1 (fr) * 2014-12-02 2016-06-09 北川工業株式会社 Feuille thermoconductrice

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9353245B2 (en) 2014-08-18 2016-05-31 3M Innovative Properties Company Thermally conductive clay
JP2018073912A (ja) * 2016-10-26 2018-05-10 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの製造方法及び半導体装置
JP2020029524A (ja) * 2018-08-23 2020-02-27 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーン硬化物
JP7148965B2 (ja) * 2018-11-08 2022-10-06 北川工業株式会社 低誘電熱伝導材用組成物、及び低誘電熱伝導材
JP6987941B1 (ja) * 2020-09-11 2022-01-05 デクセリアルズ株式会社 熱伝導性シート及び熱伝導性シートの製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134666A (ja) * 2000-10-30 2002-05-10 Achilles Corp 放熱樹脂シート
JP2004137308A (ja) * 2002-10-15 2004-05-13 Shin Etsu Chem Co Ltd シリコーン断熱シート
JP2008283125A (ja) * 2007-05-14 2008-11-20 Naigai Technos:Kk 複合材料および複合体
WO2009110389A1 (fr) * 2008-03-07 2009-09-11 旭有機材工業株式会社 Composition de résine durcissable à la chaleur, matériau de moulage renforcé par des fibres et article moulé
JP2011127062A (ja) * 2009-12-21 2011-06-30 Toray Ind Inc 熱可塑性樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134666A (ja) * 2000-10-30 2002-05-10 Achilles Corp 放熱樹脂シート
JP2004137308A (ja) * 2002-10-15 2004-05-13 Shin Etsu Chem Co Ltd シリコーン断熱シート
JP2008283125A (ja) * 2007-05-14 2008-11-20 Naigai Technos:Kk 複合材料および複合体
WO2009110389A1 (fr) * 2008-03-07 2009-09-11 旭有機材工業株式会社 Composition de résine durcissable à la chaleur, matériau de moulage renforcé par des fibres et article moulé
JP2011127062A (ja) * 2009-12-21 2011-06-30 Toray Ind Inc 熱可塑性樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016088742A1 (fr) * 2014-12-02 2016-06-09 北川工業株式会社 Feuille thermoconductrice

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