WO2013065491A1 - Procédé pour produire un substrat en verre - Google Patents

Procédé pour produire un substrat en verre Download PDF

Info

Publication number
WO2013065491A1
WO2013065491A1 PCT/JP2012/076861 JP2012076861W WO2013065491A1 WO 2013065491 A1 WO2013065491 A1 WO 2013065491A1 JP 2012076861 W JP2012076861 W JP 2012076861W WO 2013065491 A1 WO2013065491 A1 WO 2013065491A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass substrate
polishing
water
producing
mass
Prior art date
Application number
PCT/JP2012/076861
Other languages
English (en)
Japanese (ja)
Inventor
広幸 神谷
Original Assignee
旭硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旭硝子株式会社 filed Critical 旭硝子株式会社
Priority to KR1020147011533A priority Critical patent/KR20140088535A/ko
Priority to CN201280054271.4A priority patent/CN103917332A/zh
Publication of WO2013065491A1 publication Critical patent/WO2013065491A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent

Definitions

  • the present invention relates to a method for manufacturing a glass substrate. More specifically, the present invention relates to a method for manufacturing a high-strength glass substrate suitable for a glass substrate used in a flat panel display (FPD) such as a liquid crystal display (LCD).
  • FPD flat panel display
  • LCD liquid crystal display
  • FPD Flat panel displays
  • LCD liquid crystal displays
  • the glass substrate For glass substrates for FPD, with the miniaturization of equipment and the like, weight reduction and thickness reduction are required. However, when the thickness of the glass substrate is reduced, the strength is lowered and cracking due to dropping or the like is likely to occur. For this reason, the glass substrate is required to be thin and have high strength and an excellent protective function.
  • a glass substrate for FPD forms molten glass into a plate shape by a manufacturing method called a float method, and polishes the glass substrate with, for example, a rotating and revolving polishing tool to remove minute irregularities and undulations on the surface.
  • a thin plate having a predetermined thickness (for example, 0.4 to 1.1 mm) satisfying the flatness required for the FPD glass substrate is manufactured (for example, see Patent Document 1).
  • Patent Document 1 discloses a surface polishing method in which a glass substrate surface is polished with a slurry obtained by dispersing colloidal silica aggregates in which concavo-convex colloidal silica particles are connected in water. Also in Patent Document 2, a glass substrate is polished using a polishing composition containing silica particles in which the area ratio between the projected area of the silica particles and the maximum inscribed circle area of the silica particles is within a predetermined range. The process of doing is disclosed.
  • the surface treatment of the glass substrate by the above method can remove some irregularities and waviness on the surface of the glass substrate, there is a problem that the effect of improving the strength of the glass substrate after polishing is not always sufficient. For this reason, the method of improving the intensity
  • a strengthening treatment method for a glass substrate for example, a method of increasing the strength by forming a compressive stress layer on the surface of the glass substrate is known.
  • the chemical strengthening treatment method immerses the glass substrate in a molten salt containing alkali metal ions, and replaces the alkali metal ions in the glass on the substrate surface with the alkali metal ions in the molten salt.
  • This is a method for forming a compressive stress layer, and is widely used as a technique for improving the strength of a glass substrate (for example, see Patent Document 3).
  • the chemical strengthening treatment method is particularly suitable for improving the strength of a thin glass substrate because it does not require the thickness of the glass substrate itself, but has a problem that the equipment required for the treatment becomes large and inferior in cost.
  • glass substrates for displays such as liquid crystal display devices are often used with a metal or metal oxide thin film formed on the surface, and when alkali metal is contained in the glass, alkali metal ions are thin. There is a risk of diffusing in and deteriorating film properties. For this reason, a non-alkali glass that does not substantially contain an alkali metal is used as a glass substrate for display, and there is a problem that the above-described chemical strengthening treatment method cannot be applied to such a glass substrate.
  • Japanese Unexamined Patent Publication No. 2010-250915 Japanese Unexamined Patent Publication No. 2008-13655 Japanese Unexamined Patent Publication No. 2010-202514
  • the present invention has been made to solve the above problems, and provides a glass substrate manufacturing method capable of obtaining a glass substrate having high accuracy and high strength in a glass substrate applied to a liquid crystal display device or the like. It is aimed.
  • the method for producing a glass substrate of the present invention is a dispersion medium comprising a liquid medium other than water that is substantially free of water or contains water (however, the content of water in the dispersion medium is 85% by mass or less). At least one main surface of the glass substrate body is polished with a polishing liquid in which abrasive grains are dispersed.
  • the content of water in the dispersion medium is 3 to 60% by mass.
  • the content of water in the dispersion medium is less than 3% by mass.
  • the liquid medium other than water is preferably an organic solvent.
  • the organic solvent is preferably a monovalent or polyvalent alcohol.
  • the organic solvent is preferably a hydrocarbon, an ether, an ester or a ketone.
  • the liquid medium other than water is methanol, ethanol, n-propanol, isopropyl alcohol, n-butanol, ethylene glycol, propylene glycol, n-hexane, octane, ethyl acetate, methyl ethyl ketone, It is preferably at least one selected from the group consisting of toluene and diethyl ether.
  • the abrasive grains are preferably fine particles of at least one metal oxide selected from the group consisting of silica, alumina, cerium oxide, titania, zirconia and manganese oxide.
  • the abrasive grains are particles having an average particle diameter of 5 to 500 nm.
  • the content ratio of the abrasive grains contained in the polishing liquid is preferably 0.1 to 40% by mass with respect to the total mass of the polishing liquid.
  • the polishing liquid is supplied to a polishing pad, the surface to be polished of the glass substrate body is brought into contact with the polishing pad, and the glass substrate body is covered by relative movement between the two. It is preferable to polish the polishing surface.
  • the glass substrate is preferably a glass substrate made of non-alkali glass.
  • the thickness of the glass substrate is 0.1 to 5 mm.
  • the polishing liquid is supplied to the polishing pad, the surface to be polished of the glass substrate is brought into contact with the polishing pad, and the surface to be polished of the glass substrate is polished by relative movement between the two. Can be done.
  • FIG. 1 is a diagram showing an example of a polishing apparatus that can be used in the method for producing a glass substrate of the present invention.
  • a polishing surface plate 1 is provided in a state of being rotatably supported around a vertical axis C 1, and this polishing surface plate 1 is supported by a surface plate driving motor 2. , And is driven to rotate in the direction indicated by the arrow in the figure.
  • a known polishing pad 3 is attached to the upper surface of the polishing surface plate 1.
  • a substrate holding member (carrier) 5 for holding an object to be polished such as a glass substrate on the lower surface by suction or using a holding frame or the like is provided on the axis. It is supported so as to be rotatable around the center C2 and movable in the direction of the axis C2.
  • the substrate holding member 5 is configured to be rotated in a direction indicated by an arrow by a work drive motor (not shown) or by a rotational moment received from the polishing surface plate 1.
  • a glass substrate body 4 that is an object to be polished is held on the lower surface of the substrate holding member 5, that is, the surface facing the polishing pad 3. The glass substrate body 4 is pressed against the polishing pad 3 with a predetermined load.
  • a dripping nozzle 6 and the like are provided in the vicinity of the substrate holding member 5 so that a polishing liquid 7 sent from a tank (not shown) is supplied onto the polishing surface plate 1.
  • the glass substrate body 4 held by the substrate holding member 5 is supplied while the polishing liquid 7 is supplied from the dropping nozzle 6 or the like to the surface of the polishing pad 3 while being rotated around the respective axis by the work drive motor. It is pressed against the polishing pad 3. Thereby, the surface to be polished of the glass substrate body 4, that is, the surface facing the polishing pad 3 is polished.
  • the polishing liquid 7 is a slurry in which abrasive grains are dispersed in a dispersion medium.
  • a dispersion medium composed of a liquid medium other than water that contains substantially no water or contains water below a specific limit is used as the dispersion medium.
  • the dispersion medium is a liquid medium for stably dispersing the abrasive grains and dispersing / dissolving optional components to be added as necessary.
  • the liquid medium in the present invention refers to an organic compound or water that is liquid at room temperature, and may be a mixture of one or more of them.
  • the organic compound that is a liquid medium is not limited to a low molecular compound that is usually called an organic solvent, and may be a high molecular compound that is liquid at room temperature (for example, a high molecular compound called oil).
  • the boiling point of the liquid medium is preferably 60 ° C. or higher, but is not limited thereto.
  • the dispersion medium of the polishing liquid used in the present invention is substantially composed of a liquid medium other than water that does not contain water or contains water.
  • the content of water in the dispersion medium is It is 85 mass% or less.
  • the dispersion medium which does not substantially contain water refers to a medium having a water content of less than 3% by mass. Usually, it refers to a dispersion medium when used without adding a substantial amount of water to a liquid medium other than water.
  • a liquid medium other than water is simply referred to as a liquid medium.
  • the dispersion medium in the present invention contains water
  • a uniform mixture in which the liquid medium and water are dissolved is preferable.
  • the liquid medium and water are not dissolved in each other, for example, if there is undissolved water in the dispersion medium, water tends to enter the glass substrate during polishing, and the strength of the glass substrate obtained after polishing May not be sufficiently increased.
  • the content ratio of water in the dispersion medium exceeds 85% by mass with respect to the total mass of the dispersion medium, even if the dispersion medium is a uniform dispersion medium in which water and the liquid medium are mutually dissolved, Water may easily enter the substrate, and the strength of the glass substrate obtained after polishing may not be sufficiently increased.
  • the content ratio of water in the dispersion medium is preferably 60% by mass or less, more preferably 20% by mass or less with respect to the total mass of the dispersion medium.
  • polishing liquid 7 it is more preferable to use a polishing liquid having a water content of 80% by mass or less, more preferably 50% by mass or less, based on the total mass of the polishing liquid.
  • an organic solvent having a boiling point of 40 ° C. or higher, preferably 60 ° C. or higher is preferable.
  • organic solvents hydrophilic organic solvents tend to be mixed with a relatively large amount of water to form a uniform mixture. Therefore, the hydrophilic organic solvent is suitable as a liquid medium in a dispersion medium containing water.
  • the thing which does not contain water substantially ie, the content rate of water is less than 3 mass%, can also be used as a dispersion medium which does not contain water substantially. .
  • an organic solvent having high hydrophobicity is used as a liquid medium of a dispersion medium that does not substantially contain water because it has a small amount of water uniformly mixed therein.
  • the organic solvent having a certain degree of hydrophilicity can be used as a liquid medium in a dispersion medium containing water when it contains water having a solubility amount or less and the water content is 3% by mass or more.
  • it does not contain water substantially ie, when the content rate of water is less than 3 mass%, it can be used as a liquid medium in the dispersion medium which does not contain water substantially.
  • liquid medium for example, organic solvents such as mono- or polyhydric alcohols, hydrocarbons, ethers, esters, ketones and the like are preferably used.
  • organic solvents such as mono- or polyhydric alcohols, hydrocarbons, ethers, esters, ketones and the like are preferably used.
  • a mixture of two or more compatible organic solvents can also be used.
  • low-carbon monohydric alcohols and polyhydric alcohols are hydrophilic organic solvents, and as described above, a liquid medium in a dispersion medium containing water or a dispersion containing substantially no water. Suitable as a medium.
  • a monovalent or polyhydric alcohol an alkanol having 4 or less carbon atoms, a monoalkylene glycol or dialkylene glycol having 2 to 8 carbon atoms is more preferable.
  • hydrocarbons such as aliphatic hydrocarbons, alicyclic hydrocarbons, and aromatic hydrocarbons are hydrophobic, and as described above, are suitable as a liquid medium for a dispersion medium that does not substantially contain water. ing.
  • saturated aliphatic hydrocarbons having 5 to 12 carbon atoms are more preferable.
  • the ethers are preferably alkylene glycol monoalkyl ethers or alkylene glycol dialkyl ethers having 8 or less carbon atoms, and the esters are preferably aliphatic carboxylic acid alkyl esters having 8 or less carbon atoms.
  • aromatic hydrocarbons such as toluene, dialkyl ethers such as diethyl ether, and dialkyl ketones such as methyl ethyl ketone are also preferable.
  • organic solvent examples include methanol, ethanol, n-propanol, isopropyl alcohol (hereinafter referred to as IPA), n-butanol, t-butanol, pentyl alcohol, hexyl alcohol, heptyl alcohol, octyl alcohol, decyl alcohol.
  • IPA isopropyl alcohol
  • Monohydric alcohols having 1 to 12 carbon atoms such as dodecyl alcohol, unsaturated alcohols such as allyl alcohol, crotyl alcohol and methyl vinyl alcohol, cyclic alcohols such as cyclopentanol, cyclohexanol, benzyl alcohol and phenylethyl alcohol, ethylene Dihydric alcohols such as glycol, propylene glycol, diethylene glycol and dipropylene glycol, trihydric or higher polyhydric alcohols such as glycerin and pentaerythritol, di Ethers such as til ether, dipropyl ether, dibutyl ether, ethyl vinyl ether, anisole, diphenyl ether, dioxane, tetrahydrofuran, acetal, propylene glycol monomethyl ether, propylene glycol monoethyl ether, ethyl formate, methyl formate, methyl acetate, ethyl
  • Japanese aliphatic hydrocarbons unsaturated aliphatic hydrocarbons such as hexene, heptene, octene, alicyclic hydrocarbons such as cyclopentane, cyclohexane, methylcyclohexane, cyclohexene, bicyclohexyl, decalin, benzene, toluene, xylene , Ethylbenzene, cumene, mesitylene, dodecylbenzene, naphthalene, methylnaphthalene, styrene and other aromatic hydrocarbons, methyl chloride, dichloromethane, chloroform, dichloroethane, trichloroethane, tetrachloroethylene, dichloropropane, allyl chloride, butyl chloride, chlorobenzene, bromide Halogenated hydrocarbons such as ethyl and dibromoethane, organic acids
  • methanol, ethanol, n-propanol, isopropyl alcohol, n-butanol, ethylene glycol, propylene glycol, n-hexane, octane, acetic acid are used from the viewpoint of easy dispersion of abrasive grains and excellent polishing characteristics.
  • At least one organic solvent selected from the group consisting of ethyl, methyl ethyl ketone, toluene and diethyl ether can be suitably used.
  • the liquid medium is not limited to the organic solvent as described above as long as it is a fluid having a low water content.
  • petroleum solvents such as petroleum ether, kerosene, and gasoline, natural fats and oils, low molecular weight polymers, Silicone oil or the like can also be used.
  • the abrasive grains dispersed in the dispersion medium can be appropriately selected from known abrasive grains.
  • fine particles of metal oxides such as silica, alumina, cerium oxide (ceria), zirconium oxide (zirconia), titanium oxide (titania), tin oxide, zinc oxide, manganese oxide, germanium oxide, boron nitride, nitriding
  • Fine particles of nitride such as silicon and titanium nitride
  • fine particles of carbide such as silicon carbide and boron carbide
  • fine particles of resin such as polyethylene, polypropylene, polystyrene, acrylic resin, phenol resin, polyester, and silicone resin, gold, silver, copper, etc. It is preferably at least one selected from the group consisting of metal fine particles, carbon fine particles such as graphite and diamond, and salt fine particles such as sodium carbonate, calcium carbonate, calcium sulfate, sodium chloride and potassium chloride.
  • fine particles of at least one metal oxide selected from the group consisting of silica, alumina, cerium oxide, zirconia, titania and manganese oxide can be preferably used.
  • silica those produced by a known method can be used.
  • colloidal silica obtained by hydrolyzing silicon alkoxide such as ethyl silicate and methyl silicate by a sol-gel method can be used.
  • colloidal silica obtained by ion exchange of a silicate such as sodium silicate, or fumed silica obtained by gas phase synthesis of silicon tetrachloride in a flame of oxygen and hydrogen can be used.
  • a silica particle it is also possible to use what has an uneven
  • colloidal alumina can also be preferably used.
  • cerium oxide, zirconium oxide, titanium oxide, tin oxide, and zinc oxide produced by a liquid phase method or a gas phase method can also be preferably used.
  • the use of colloidal silica is preferable because the particle size is easily controlled and a high-purity product can be obtained.
  • the average grain size of the abrasive grains is preferably in the range of 5 to 500 nm, more preferably in the range of 10 to 200 nm, from the viewpoint of polishing rate, polishing characteristics, and dispersion stability. If the average particle size of the abrasive grains is less than 5 nm, the abrasive grains tend to aggregate in the polishing liquid, and a stable polishing liquid may not be obtained. On the other hand, when the average particle size of the abrasive grains exceeds 500 nm, the damage given to the polished surface of the glass substrate is large, and a smooth and high-quality surface cannot be obtained.
  • the average particle size of the abrasive grains in the present invention refers to the average particle size measured by a dynamic light scattering type particle size distribution meter.
  • a sample diluted with an appropriate concentration range determined by the apparatus with pure water or an organic solvent so as to obtain appropriate scattering and reflected light intensity is used as a measurement sample.
  • a dynamic light scattering type particle size distribution analyzer specifically, a particle size analyzer “Microtrac UPA-ST150” (product name, manufactured by NIKKISO) is used, and the measurement sample has an appropriate concentration determined by this apparatus.
  • the abrasive grains diluted with pure water or an organic solvent were used so as to be in the range.
  • the content (concentration) of the abrasive grains in the polishing liquid can be appropriately set in consideration of the polishing rate, the uniformity of the polishing rate within the glass substrate surface, the dispersion stability, etc., but sufficient polishing characteristics are obtained. Therefore, it is preferable to set it to 0.1 mass% or more and 40 mass% or less with respect to the total mass of polishing liquid. If the content ratio of the abrasive grains is less than 0.1% by mass with respect to the total mass of the polishing liquid, the effect of improving the strength of the glass substrate by polishing cannot be sufficiently obtained. May decrease. A more preferable content ratio is 1 to 20% by mass, and a further preferable content ratio is 5 to 10% by mass.
  • the above-mentioned components are contained in the predetermined ratio, so that the abrasive grains such as colloidal silica are uniformly dispersed, and other components are uniformly dissolved.
  • each component in the polishing liquid may be unevenly distributed to some extent as long as the effect of polishing is stably obtained.
  • the abrasive grains are supplied to the polishing machine at a constant rate by devising the supply method of the polishing liquid, and the constant abrasive grains on the polishing pad.
  • the polishing effect may be sufficiently obtained even if the abrasive grains are not uniformly dispersed in the polishing liquid.
  • a stirring and mixing method usually used in the production of a polishing liquid for example, a stirring and mixing method using an ultrasonic disperser, a homogenizer, or the like can be employed.
  • the polishing liquid used in the present invention does not necessarily have to be supplied to the polishing site as a mixture of all polishing components that are configured in advance. When supplying to a polishing place, polishing components may be mixed to form a polishing liquid composition.
  • the polishing liquid is preferably produced by mixing an organic solvent or water with a dispersion liquid such as colloidal silica in which abrasive grains are uniformly dispersed, and appropriately adjusting the composition of the dispersion medium.
  • a dispersion liquid such as colloidal silica in which abrasive grains are uniformly dispersed
  • colloidal silica in which abrasive grains are uniformly dispersed
  • the polishing liquid can be produced using such commercially available water-dispersed colloidal silica and organic solvent-dispersed colloidal silica.
  • silica abrasive grains are dispersed in a dispersion medium containing a predetermined amount of water by a method such as blending an organic solvent with water-dispersed colloidal silica or blending water with organic solvent-dispersed colloidal silica.
  • a polished polishing liquid can be obtained.
  • organic solvent-dispersed colloidal silica can be used as a polishing liquid in the present invention by adjusting the content of abrasive grains as necessary.
  • the same organic solvent as the organic solvent contained in the organic solvent-dispersed colloidal silica is blended to obtain a polishing liquid having a predetermined abrasive content.
  • the polishing liquid used in the present invention is not limited to this, and an organic solvent different from the organic solvent contained in the organic solvent-dispersed colloidal silica can also be blended.
  • Organic solvent used when blending an organic solvent with water-dispersed colloidal silica to make a polishing liquid, or organic solvent contained in the organic solvent-dispersed colloidal silica when blending water with organic solvent-dispersed colloidal silica to make a polishing liquid For example, by using the above-described hydrophilic organic solvent, a dispersion medium in which water and the organic solvent are mutually dissolved can be obtained.
  • the organic solvent-dispersed colloidal silica is blended with an organic solvent of a type different from the organic solvent contained in the organic solvent-dispersed colloidal silica, the organic solvent is preferably compatible.
  • the polishing liquid used in the present invention requires a surfactant, a chelating agent, a reducing agent, a viscosity imparting agent or a viscosity modifier, an anti-aggregating agent or a dispersing agent, a rust preventive agent, etc., unless it is contrary to the spirit of the present invention. Depending on the content, it can be appropriately contained. When at least one of these optional components is used, the total amount of these optional components is preferably 10% by mass or less based on the polishing liquid.
  • the substrate holding member 5 may perform a linear motion as well as a rotational motion. Further, the polishing surface plate 1 and the polishing pad 3 may be as large as or smaller than the glass substrate body 4 that is the object to be polished. In that case, it is preferable that the entire surface of the glass substrate body 4 to be polished can be polished by relatively moving the substrate holding member 5 and the polishing surface plate 1. Further, the polishing surface plate 1 and the polishing pad 3 do not have to rotate, and may move in one direction, for example, by a belt type.
  • the polishing apparatus 10 is a polishing apparatus that polishes one surface of the glass substrate body 4 that is an object to be polished as a surface to be polished.
  • polishing pads similar to the polishing apparatus 10 are arranged on the upper and lower surfaces of the glass substrate body 4. It is also possible to polish the polished surface (both sides) of the object to be polished using the double-sided simultaneous polishing apparatus.
  • the polishing conditions by the polishing apparatus 10 are not particularly limited, but it is possible to increase the polishing pressure and improve the polishing rate by applying a load to the substrate holding member 5 and pressing it against the polishing pad 3.
  • the polishing pressure is preferably about 5 to 30 kPa, and more preferably about 5 to 15 kPa from the viewpoint of polishing rate uniformity in the polished surface, flatness, and prevention of polishing defects such as scratches.
  • the number of rotations of the polishing surface plate 1 and the substrate holding member 5 is preferably about 20 to 100 rpm, but is not limited thereto.
  • the supply amount of the polishing liquid 7 is appropriately adjusted and selected according to the material to be polished, the composition of the polishing liquid, the above polishing conditions, and the like. For example, when polishing a glass substrate having a side of 50 mm, A supply amount of about 20 to 40 cm 3 / min is preferable.
  • the polishing pad 3 may be made of a general nonwoven fabric, foamed polyurethane, porous resin, non-porous resin or the like. Further, in order to promote the supply of the polishing liquid 7 to the polishing pad 3 or to collect a certain amount of the polishing liquid 7 on the polishing pad 3, the surface of the polishing pad 3 has a lattice shape, a concentric circle shape, a spiral shape or the like. Groove processing may be performed. Further, if necessary, polishing may be performed while bringing the pad conditioner into contact with the surface of the polishing pad 3 and conditioning the surface of the polishing pad 3.
  • a substrate holding member (carrier) 22 that holds a glass substrate body 21 that is an object to be polished, a polishing surface plate 23, and a surface of the polishing surface plate 23.
  • Polishing apparatus provided with the affixed polishing pad 24, a tank 28 for storing the polishing liquid 25, and a dropping nozzle 26 for supplying the polishing liquid 25 from the tank 28 to the polishing pad 24 using the polishing liquid supply unit 27. 20 can be used.
  • the polishing apparatus 20 has a recovery unit (not shown) for recovering the polishing liquid 25 used for polishing from the polishing pad 24 and transports the recovered polishing liquid 25 to the tank 28.
  • the polishing liquid 25 returned to the tank 28 is supplied again to the polishing pad 24 through the dropping nozzle 26 using the polishing liquid supply unit 27 and is circulated.
  • the polishing apparatus 20 contacts the polishing surface of the glass substrate body 21 held by the substrate holding member (carrier) 22 with the polishing pad 24 while supplying the polishing liquid 25 from the dropping nozzle 26, as in the polishing apparatus 10 described above.
  • polishing can be performed by relatively rotating the substrate holding member (carrier) 22 and the polishing surface plate 23.
  • Examples of the glass of the glass substrate body in the present invention include quartz glass, soda lime glass, aluminosilicate glass, borosilicate glass, aluminoborosilicate glass, alkali-free glass, and crystallized glass.
  • a glass substrate made of non-alkali glass used for an FPD such as a liquid crystal display (LCD) can obtain a strength improvement effect superior to the conventional one.
  • the alkali-free glass refers to a silicate glass having an alkali metal oxide content of less than 2% by mass on the oxide basis.
  • borosilicate glass or aluminoborosilicate glass having an alkali metal oxide content of less than 0.5% by mass on the oxide basis is preferable.
  • the thickness of the glass substrate is not particularly limited, but is preferably 0.1 to 5 mm. Strengthening by polishing in the present invention can provide a strength improvement effect superior to that of a conventional glass substrate.
  • a relatively thin glass substrate includes a glass substrate having a thickness of 0.1 to 1.1 mm. In the present invention, it is preferable that the difference in thickness between the glass substrate body before polishing and the glass substrate obtained after polishing is very small, and the thickness of the glass substrate body is 0. 1 to 5 mm is preferable.
  • a polishing liquid for polishing the glass substrate body a polishing liquid with a water content of the dispersion medium set to a predetermined value or less is used to remove minute irregularities and scratches on the surface of the glass substrate body with high accuracy. be able to. Also, by using such a polishing liquid, it is possible to suppress the intrusion of moisture into the glass during polishing, and to reduce the amount of moisture in the glass substrate obtained after polishing, so the strength of the glass substrate after polishing Can be improved with high accuracy.
  • polishing liquid (1-1) Colloidal silica dispersion ⁇ organosilica> Organosilica dispersion a; EG-ST-ZL manufactured by Nissan Chemical Industries, Ltd. (Colloidal silica (average particle size 100 nm) 20% by mass, ethylene glycol and water 80% by mass, water 2% by mass or less) Organosilica dispersion b; IPA-ST-ZL manufactured by Nissan Chemical Industries, Ltd. (Colloidal silica (average particle size 120 nm) 20 mass%, isopropyl alcohol and water 80 mass%, water 1 mass% or less) Organosilica dispersion c; MEK-ST-ZL manufactured by Nissan Chemical Industries, Ltd.
  • the average particle size of the abrasive grains in the polishing liquid was measured by a dynamic light scattering method using a particle size analyzer “Microtrack UPA-ST150” (product name, manufactured by NIKKISO).
  • the measurement sample was measured by diluting with pure water or an organic solvent so as to be in an appropriate concentration range of the apparatus determined so that appropriate scattering and reflected light intensity can be obtained at the time of measurement.
  • Example 1 and Comparative Example 1 were adjusted as shown below. That is, the above-mentioned organic solvent or water as a liquid medium was mixed with each colloidal silica dispersion shown in Table 1 so as to have the ratio shown in Table 1, and then sufficiently stirred.
  • Example 1 and Comparative Example 1 A polishing liquid was obtained.
  • the mixing ratio of the colloidal silica dispersion, the liquid medium (organic solvent), and water in each polishing liquid of Example 1 and Comparative Example 1 when the total mass of each polishing liquid is 100% by mass (% by mass) ) As shown in Table 1. Pure water was used as water.
  • Example B The polishing liquids of Examples 2 to 9 and Comparative Examples 2 to 3 were prepared as shown below. That is, the above-mentioned organic solvent or water as a liquid medium was mixed with each of the colloidal silica dispersions shown in Table 1 so as to have the ratio shown in Table 1, and then sufficiently stirred, and Examples 2 to 9 and Comparative Examples Two to three polishing liquids were obtained. Mass when the mixing ratio of the colloidal silica dispersion, the liquid medium (organic solvent) and water in each of the polishing liquids of Examples 2 to 9 and Comparative Examples 2 to 3 is 100% by mass. The ratio (mass%) is shown in Table 1. Pure water was used as water.
  • Example C The polishing liquids of Examples 10 to 21 were prepared as shown below. That is, the above organic solvent as a liquid medium was mixed with each of the colloidal silica dispersions shown in Table 1 so as to have the ratio shown in Table 1, and then sufficiently stirred to obtain the polishing liquids of Examples 10 to 21. It was.
  • Table 1 shows the blending ratio of the colloidal silica dispersion and the liquid medium (organic solvent) in each polishing liquid of Examples 10 to 21 as a mass ratio (% by mass) when the total mass of each polishing liquid is 100% by mass. Shown in Pure water was used as water.
  • Table 1 shows the compositions of the polishing liquids of Examples 1 to 21 and Comparative Examples 1 to 3, the abrasive grains of each polishing liquid, the dispersion medium (total amount), and water (from organic solvents and water-dispersed colloidal silica dispersions).
  • Table 1 shows the content ratio (concentration: mass%) of the entire polishing liquid and the content ratio (mass%) of water relative to the entire dispersion medium together with the blending ratio of each colloidal silica and the like described above.
  • the polishing liquid composition (abrasive grains, dispersion medium, and water) was expressed in terms of mass% with respect to the entire polishing liquid prepared.
  • the water content (concentration: mass%) relative to the entire polishing liquid, and the water ratio in the dispersion medium are the water content in the entire polishing liquid from the amount of water contained in the colloidal silica dispersion and the organic solvent described above.
  • the ratio of water occupying the entire dispersion medium are values obtained by calculating respective maximum and minimum values.
  • Polishing machine Desktop small lapping machine NF-300 (manufactured by Nano Factor) Polishing pressure: as shown in Table 2. Platen (plate) rotation speed: shown in Table 2. Number of rotations of head (substrate holding unit): shown in Table 2. Polishing liquid supply rate: 40 ml / min Polishing pad: Suede pad H7000 (Fujibo Atago Co., Ltd.) Polishing time: as shown in Table 2.
  • the glasses of Examples 2 to 9 obtained by polishing using a polishing liquid having a water content of 85% by mass or less with respect to the total mass of the dispersion medium.
  • the strength of the glass substrate body having a strength of 690 N was increased to 763 N or more, and it was confirmed that a higher strength can be obtained as the water content is reduced.
  • the glass substrates of Comparative Examples 2 to 3 obtained by polishing with a polishing liquid containing more than 85% by mass of water with respect to the total mass of the dispersion medium only a strength of 723 N or less was obtained.
  • Comparative Example 3 where the content of water in the dispersion medium was 100%, it was confirmed that the strength was lower than that of the glass substrate body before polishing.
  • Examples 10 to 21 which were carried out by variously changing the type of organic solvent blended in the polishing liquid, a high strength of 747 N or higher was obtained in the glass substrate obtained after polishing, and the strength of the glass substrate was increased. It was recognized that the accuracy could be improved. In particular, in Examples 10 to 14 using a polishing liquid containing ethylene glycol in the dispersion medium, it was confirmed that a high strength of 810 to 840 N was obtained.
  • the present invention high-precision polishing is possible in a glass substrate main body, particularly an alkali-free glass substrate main body for FPD, and the strength of the glass substrate obtained after polishing can be increased with higher accuracy than before.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Liquid Crystal (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

La présente invention porte sur un procédé pour produire un substrat en verre dans lequel au moins une surface principale du corps principal du substrat en verre est polie avec un liquide de polissage qui est obtenu en dispersant des grains abrasifs dans un milieu de dispersion qui est composé d'un milieu liquide autre que l'eau, ledit milieu de dispersion ne contenant sensiblement pas d'eau ou contenant de l'eau (pourvu que la teneur en eau dans le milieu de dispersion soit de 85 % en masse ou moins).
PCT/JP2012/076861 2011-11-01 2012-10-17 Procédé pour produire un substrat en verre WO2013065491A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020147011533A KR20140088535A (ko) 2011-11-01 2012-10-17 유리 기판의 제조 방법
CN201280054271.4A CN103917332A (zh) 2011-11-01 2012-10-17 玻璃基板的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011240117 2011-11-01
JP2011-240117 2011-11-01

Publications (1)

Publication Number Publication Date
WO2013065491A1 true WO2013065491A1 (fr) 2013-05-10

Family

ID=48191847

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/076861 WO2013065491A1 (fr) 2011-11-01 2012-10-17 Procédé pour produire un substrat en verre

Country Status (5)

Country Link
JP (1) JPWO2013065491A1 (fr)
KR (1) KR20140088535A (fr)
CN (1) CN103917332A (fr)
TW (1) TW201319231A (fr)
WO (1) WO2013065491A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014208762A1 (fr) * 2013-06-29 2014-12-31 Hoya株式会社 Procédé de fabrication d'un substrat en verre, procédé de fabrication de disque magnétique, et composition de solution de polissage pour substrat en verre
CN104924200A (zh) * 2015-06-12 2015-09-23 衢州学院 一种用于蓝宝石晶片超精密加工的弥散强化磨盘

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105505231A (zh) * 2016-02-24 2016-04-20 湖南皓志科技股份有限公司 一种高效碳化硼研磨液及其配制方法
CN106002498B (zh) * 2016-08-01 2018-04-06 中国电子科技集团公司第四十六研究所 一种有机dast晶体的表面研磨工艺方法
CN107629701B (zh) * 2017-11-02 2021-04-13 东旭光电科技股份有限公司 抛光液及其制备方法
JP6985116B2 (ja) * 2017-11-17 2021-12-22 信越化学工業株式会社 合成石英ガラス基板用の研磨剤及び合成石英ガラス基板の研磨方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003213250A (ja) * 2001-11-16 2003-07-30 Showa Denko Kk セリウム系研磨材、セリウム系研磨材スラリー、ガラス基板の研磨方法及びガラス基板の製造方法
JP2005116563A (ja) * 2003-10-02 2005-04-28 Nippon Shokubai Co Ltd 研磨液組成物
JP2005347579A (ja) * 2004-06-03 2005-12-15 Nippon Shokubai Co Ltd 研磨剤用添加剤と研磨剤
WO2011099313A1 (fr) * 2010-02-15 2011-08-18 日立化成工業株式会社 Solution de polissage cmp et procédé de polissage

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05156239A (ja) * 1991-12-06 1993-06-22 Tokyo Daiyamondo Kogu Seisakusho:Kk 超精密加工用スラリー及び超精密加工用ペースト
CA2222305A1 (fr) * 1995-06-07 1996-12-19 Gen-Probe Incorporated Sondes a l'acide nucleique et oligonucleotides d'amplification pour especes neisseria
JPH10237426A (ja) * 1997-02-21 1998-09-08 Nippon Oil Co Ltd ラップ加工用油剤組成物
TWI281493B (en) * 2000-10-06 2007-05-21 Mitsui Mining & Smelting Co Polishing material
JP3945745B2 (ja) * 2001-03-09 2007-07-18 三井金属鉱業株式会社 セリウム系研摩材及び研摩材スラリー並びにセリウム系研摩材の製造方法
ATE495229T1 (de) * 2001-11-16 2011-01-15 Showa Denko Kk Cerbasierendes poliermittel und cerbasierende poliersuspension
JP2003277733A (ja) * 2002-03-27 2003-10-02 Yasuhiro Tani 油性研磨剤および研磨方法
JP2004331852A (ja) * 2003-05-09 2004-11-25 Tama Kagaku Kogyo Kk 分散安定性に優れた研磨剤スラリー及び基板の製造方法
JP4481898B2 (ja) * 2005-07-25 2010-06-16 ユシロ化学工業株式会社 水性砥粒分散媒組成物
WO2007069488A1 (fr) * 2005-12-16 2007-06-21 Jsr Corporation Dispersion aqueuse pour polissage mecanochimique, procede de polissage mecanochimique et kit de preparation de dispersion aqueuse pour polissage mecanochimique
JP5084670B2 (ja) * 2008-09-01 2012-11-28 日揮触媒化成株式会社 シリカゾルおよびその製造方法
JP5396047B2 (ja) * 2008-09-03 2014-01-22 三井金属鉱業株式会社 ガラス用研摩材スラリー

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003213250A (ja) * 2001-11-16 2003-07-30 Showa Denko Kk セリウム系研磨材、セリウム系研磨材スラリー、ガラス基板の研磨方法及びガラス基板の製造方法
JP2005116563A (ja) * 2003-10-02 2005-04-28 Nippon Shokubai Co Ltd 研磨液組成物
JP2005347579A (ja) * 2004-06-03 2005-12-15 Nippon Shokubai Co Ltd 研磨剤用添加剤と研磨剤
WO2011099313A1 (fr) * 2010-02-15 2011-08-18 日立化成工業株式会社 Solution de polissage cmp et procédé de polissage

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014208762A1 (fr) * 2013-06-29 2014-12-31 Hoya株式会社 Procédé de fabrication d'un substrat en verre, procédé de fabrication de disque magnétique, et composition de solution de polissage pour substrat en verre
US10068602B2 (en) 2013-06-29 2018-09-04 Hoya Corporation Method for manufacturing glass substrate, method for manufacturing magnetic disk, and polishing liquid composition for glass substrate
CN104924200A (zh) * 2015-06-12 2015-09-23 衢州学院 一种用于蓝宝石晶片超精密加工的弥散强化磨盘

Also Published As

Publication number Publication date
KR20140088535A (ko) 2014-07-10
JPWO2013065491A1 (ja) 2015-04-02
TW201319231A (zh) 2013-05-16
CN103917332A (zh) 2014-07-09

Similar Documents

Publication Publication Date Title
WO2013065491A1 (fr) Procédé pour produire un substrat en verre
JP6044630B2 (ja) 研磨剤、研磨剤セット及び基体の研磨方法
TWI554601B (zh) 研磨材料及研磨用組成物
JP5418590B2 (ja) 研磨剤、研磨剤セット及び基板の研磨方法
CN109135580B (zh) 一种玻璃用抛光液及其制备方法
KR102589079B1 (ko) 연마액, 연마액 세트 및 연마 방법
US20100022171A1 (en) Glass polishing compositions and methods
WO2013125441A1 (fr) Abrasif, ensemble abrasif, et procédé d'abrasion de substrat
WO2013125445A1 (fr) Abrasif, ensemble abrasif et procédé d'abrasion d'un substrat
US20100143600A1 (en) Coating Fluid Applicable by Hand for Sol-Gel Film Formation
WO2012005142A1 (fr) Agent de polissage et procédé de polissage
JP2013176835A (ja) 合成石英ガラス基板の製造方法
JPWO2019182061A1 (ja) 研磨液、研磨液セット及び研磨方法
JP2006205265A (ja) 研磨方法および研磨用組成物
JP2001031951A (ja) 研磨剤及び基板の研磨方法
CN108997940A (zh) 适用于蓝宝石抛光的化学机械抛光液
JP2011161570A (ja) 研磨剤および研磨方法
JP2014216369A (ja) 研磨剤および研磨方法
JP6680423B1 (ja) 研磨剤、ガラスの研磨方法、及びガラスの製造方法
WO2020066998A1 (fr) Liquide de polissage, concentré de celui-ci, procédé de production d'un article poli à l'aide d'un liquide de polissage, et procédé de polissage de substrat faisant appel à un liquide de polissage
CN111100558B (zh) 一种用于玻璃面板抛光的稀土抛光液及利用其抛光的方法
JP2001093866A (ja) 酸化物単結晶ウェーハ加工用研磨用組成物及び酸化物単結晶ウェーハの研磨方法
TWI808978B (zh) 研磨液組合物用氧化矽漿料
JP2008288240A (ja) ＳｉＣ結晶研磨方法
CN110577823A (zh) 纳米磨料、抛光液及制备方法和应用

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2013500255

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12844927

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20147011533

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12844927

Country of ref document: EP

Kind code of ref document: A1