WO2013060519A1 - Strömungsleithaube zur strömungsführung von luft - Google Patents
Strömungsleithaube zur strömungsführung von luft Download PDFInfo
- Publication number
- WO2013060519A1 WO2013060519A1 PCT/EP2012/067415 EP2012067415W WO2013060519A1 WO 2013060519 A1 WO2013060519 A1 WO 2013060519A1 EP 2012067415 W EP2012067415 W EP 2012067415W WO 2013060519 A1 WO2013060519 A1 WO 2013060519A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- flow
- flow guide
- guiding element
- guiding
- guide
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
Definitions
- the invention relates to a flow guide for the flow ⁇ management of air in a computer or in another electronic device.
- Such devices contain stromverbrau ⁇ Chen electronic components that generate heat and therefore must be cooled. Excessively high operating temperatures, for example, jeopardize the reliability of microprocessors or memory chips and reduce their service life.
- the cooling is effected by means of a blower or fan and heat-dissipating structures such beispielswei ⁇ se fins airconducting cowl or compact heat conductive metal structures in close proximity to individual chips.
- a shroud is a shaped part, the cavities ⁇ Lich restricts air flow and thereby controls targeted, be it for the exhaust air from the components to be cooled off or for the supply air towards the components to be cooled.
- Strömungsleithaube instead of a one-piece molding as Ver ⁇ bund made of several parts made of different materials.
- a first sheet material is used as in ⁇ game as sheet metal, which (as by punching, bending and / or bending) purports after forming a rough, approximate flow profile or flow edge.
- This first flow guide is preferably punched, ge ⁇ buckled or bent so that it is made up of each flat surface preparation ⁇ chen with straight edges or edges.
- At such a first molded part are further molded parts of the second material, the ⁇ NEN, for fine adjustment of the flow path, particularly easily attachable.
- Figure 1 shows an embodiment of a flow guide cap and Figure 2 shows a computer with a flow guide cap inside.
- Figure 1 shows a perspective view of awhosbei ⁇ game a flow guide cap 10 for the flow of air in a computer or other electronic device.
- the flow guide cap 10 is composed of several individual parts.
- a first flow guiding element 1, which defines a main flow channel 7, is formed from a flat first material 11, for example made of sheet metal, cardboard or a plastic.
- the main flow channel 7 leads from left to right across the perspective view of the flow guide cap 10;
- the main flow channel 7 is limited at least in one direction (approximately downwards) by the first flow- guiding element 1.
- the main flow channel 7 can be delimited, for example, by further elements in the interior of the computer; However, this is not without ⁇ dingt required.
- the first flow guide 1 is kinked along several preferably straight edges 4, punched or bent in any other way, whereby a plurality of planar, ie planar sections 3 is formed.
- the first flow-guiding element 1 can be brought into the desired shape in a simple manner and can then be further processed particularly easily.
- a foam appears before ⁇ geous because it made with little material consumption and easily molded, such as cut or sawn who can ⁇ .
- the particular embodiment of Figure 1, which the first flow guide 1 is limited solely or überwie ⁇ quietly by planar surfaces or surface properties, has to be in communication with the second flow guide 2 has the particular advantage that the latter can be formed geometrically particularly simple and particularly easily connected to the first flow guide 1 can; in the simplest case by whole-area adhesive bonding of one or more flat surfaces 6 of the respective second flow guide 2 with a plane part section 3 of the first flow guide 1.
- first flow guide 1 By glued, for example, on the inner side of the first flow guide ⁇ In 1 second flow guide 2; 2a, 2b, for example , can narrow a main flow channel 7, constrict locally or into a plurality of partial flow channels 8; 8a, 8b split. It can also be glued or otherwise connected to each other several second flow guide elements.
- the first flow guide 1 from the flächi ⁇ gene material before a main flow channel 7 before, which is further formed by the second flow guide 2.
- both the first flow guide 1 and the second flow guide 2 serve; 2a, 2b to the active Strö ⁇ mung guidance of air or other gaseous medium.
- all second Strömungsleit ⁇ elements 2 are on the same side of the sheet material 11, from which the first flow guide 1 is formed; the surface 5 of the first flow guide element provided with the second flow guide elements 2 is the inside thereof, which surrounds or partially surrounds the flow passage.
- the flow guide or Strömungsleithaube 10 described here is suitable, for example, or to provide an air flow Zvi ⁇ rule a fan and a plurality of cooling air to be cooled units of a computer.
- AI ternativ can be derived with such a flow guide cap 10 from the air from ⁇ one or more units.
- air with the help of a ventilator are sucked from the Bauein ⁇ units, the first leithaube by the flow flows before it reaches the components or the fan.
- FIG. 2 shows schematically a cross-section of a computer 20 or other electronic device 15, which is equipped with a flow guide cap 10 according to the present application.
- a flow guide cap 10 In the cross-sectional view of two to be cooled units 14 of the computer and a fan 13 are indicated.
- a Strömungsleithaube 10 In the computer 20 a Strömungsleithaube 10 is installed, which restricts a main flow channel 7 and amplifies it in the region close to be cooled Bauajie 14, as it is recognizable ⁇ based on the flow pattern indicated by arrows.
- the flow guide cap 10 comprises a first flow guide element 1 made of a first material 11, such as a sheet metal, and at least one second flow guide element 2 made of a second material 12, for example a plastic foam.
- the second flow guide 2 is ⁇ example, with the (downwardly facing, but arranged at the top) top side of the central portion of the first flow directing ⁇ elements 1 connected.
- the height and the course of the soracen ⁇ de of the first flow guide 1 define within the plane of the drawing and perpendicular to the plane of the volume that is available for the main flow channel 7.
- the second flow guide is, for example, cuboid-shaped or otherwise limited by flat surfaces and constricts the flow channel 7 even further.
- the flow guide cap described here is much easier to manufacture and cheaper than a one-piece, molded Spritzguß ⁇ part made of plastic, and despite the simplest basic shapes can optimize flow, such as oblique Begren ⁇ tion surfaces of the first and / or second molded part or curved surfaces in particular of the second Moldings from the bulk material.
- the flow profile can be further optimized by refining the shape of the first and second flow guide elements and by adding additional flow guide elements 2 made of the second material 12.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/353,905 US9298229B2 (en) | 2011-10-28 | 2012-09-06 | Flow-guiding hood for guiding a flow of air |
EP12769969.2A EP2772125B1 (de) | 2011-10-28 | 2012-09-06 | Strömungsleithaube zur strömungsführung von luft |
JP2014537535A JP6243339B2 (ja) | 2011-10-28 | 2012-09-06 | 空気の流れを案内する流通案内フード |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011117223A DE102011117223B3 (de) | 2011-10-28 | 2011-10-28 | Luftleithaube zur Strömungsführung von Luft in einem elektronischen Gerät und elektronisches Gerät mit einer solchen Luftleithaube |
DE102011117223.1 | 2011-10-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013060519A1 true WO2013060519A1 (de) | 2013-05-02 |
Family
ID=47008494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2012/067415 WO2013060519A1 (de) | 2011-10-28 | 2012-09-06 | Strömungsleithaube zur strömungsführung von luft |
Country Status (5)
Country | Link |
---|---|
US (1) | US9298229B2 (de) |
EP (1) | EP2772125B1 (de) |
JP (1) | JP6243339B2 (de) |
DE (1) | DE102011117223B3 (de) |
WO (1) | WO2013060519A1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105684565A (zh) * | 2014-09-16 | 2016-06-15 | 深圳市大疆创新科技有限公司 | 散热装置及采用该散热装置的uav |
CN113115571A (zh) * | 2021-04-09 | 2021-07-13 | 绍兴市柯桥皓质华琚纺织品设计股份有限公司 | 一种纺织电气控制器散热机构 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9788461B2 (en) * | 2014-07-30 | 2017-10-10 | Ciena Corporation | Airflow divider for balancing airflow in a modular chassis system |
US11102910B2 (en) * | 2017-08-01 | 2021-08-24 | Dell Products L.P. | Flexible service air baffle |
CN109960380B (zh) * | 2017-12-22 | 2022-10-04 | 富联精密电子(天津)有限公司 | 导风罩、采用该导风罩的机箱及电子装置 |
US10555441B2 (en) * | 2018-01-26 | 2020-02-04 | Super Micro Computer Inc. | Winds shroud and server using the same |
JP6721192B2 (ja) * | 2018-11-09 | 2020-07-08 | Necプラットフォームズ株式会社 | 電子機器、電子機器のメンテナンス方法 |
US11340571B2 (en) * | 2020-02-11 | 2022-05-24 | Dell Products L.P. | System with retrofit enhancement of an ultra dense thermally challenged server |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6330154B1 (en) * | 1999-02-02 | 2001-12-11 | 3Com Corporation | Cooling equipment |
US20040095724A1 (en) * | 2002-11-14 | 2004-05-20 | Cheng-Chung Hsu | Heat dissipation device for server |
US20050113016A1 (en) * | 2003-11-20 | 2005-05-26 | First International Computer, Inc. | Airflow guide structure and manufacture thereof |
US20110014861A1 (en) * | 2009-07-20 | 2011-01-20 | Hon Hai Precision Industry Co., Ltd. | Air duct assembly and heat dissipating assembly |
US20110085303A1 (en) * | 2009-10-09 | 2011-04-14 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Airflow guiding cover |
Family Cites Families (22)
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JP3690658B2 (ja) * | 2001-07-13 | 2005-08-31 | インターナショナル・ビジネス・マシーンズ・コーポレーション | ヒートシンク、冷却部材、半導体基板冷却装置、コンピュータ、および放熱方法 |
US6975509B2 (en) * | 2002-05-16 | 2005-12-13 | Sun Microsystems, Inc. | Computing apparatus with cooling fan |
US6721180B2 (en) * | 2002-07-31 | 2004-04-13 | Infineon Technologies Ag | Cooling hood for circuit board |
US7441593B2 (en) * | 2005-04-15 | 2008-10-28 | Chaun-Choung Technology Corp. | Protective cover for heat-conductive material of heat sink |
TW200714181A (en) * | 2005-09-05 | 2007-04-01 | Accton Technology Corp | Electronic product having airflow-guiding structure and method for fabricating the airflow-guiding structure thereof |
US7342786B2 (en) * | 2005-10-25 | 2008-03-11 | Hewlett-Packard Development Company, L.P. | Air duct with airtight seal |
DE102005063024B4 (de) * | 2005-12-30 | 2007-10-25 | Fujitsu Siemens Computers Gmbh | Luftleithaube |
US7310228B2 (en) * | 2006-04-10 | 2007-12-18 | Super Micro Computer, Inc. | Air shroud for dissipating heat from an electronic component |
US7408773B2 (en) * | 2006-11-27 | 2008-08-05 | Dell Products L.P. | Reinforced air shroud |
JP2008251067A (ja) | 2007-03-29 | 2008-10-16 | Hitachi Ltd | ディスクアレイ装置 |
CN201097302Y (zh) * | 2007-08-03 | 2008-08-06 | 鸿富锦精密工业(深圳)有限公司 | 机箱导风装置 |
TW200912621A (en) * | 2007-08-07 | 2009-03-16 | Cooligy Inc | Method and apparatus for providing a supplemental cooling to server racks |
US7589973B2 (en) * | 2007-09-05 | 2009-09-15 | Sun Microsystems, Inc. | Air duct flow optimization device |
US7808780B2 (en) * | 2008-02-28 | 2010-10-05 | International Business Machines Corporation | Variable flow computer cooling system for a data center and method of operation |
CN201278345Y (zh) * | 2008-07-23 | 2009-07-22 | 鸿富锦精密工业(深圳)有限公司 | 导风装置 |
US7817417B2 (en) * | 2008-10-17 | 2010-10-19 | Hewlett-Packard Development Company, L.P. | Flexible airflow baffle for an electronic system |
CN201336015Y (zh) * | 2008-10-27 | 2009-10-28 | 鸿富锦精密工业(深圳)有限公司 | 导风装置 |
CN201319174Y (zh) * | 2008-11-26 | 2009-09-30 | 鸿富锦精密工业(深圳)有限公司 | 导风装置 |
CN201348761Y (zh) * | 2008-12-31 | 2009-11-18 | 鸿富锦精密工业(深圳)有限公司 | 导风装置 |
US8279601B2 (en) * | 2010-01-28 | 2012-10-02 | Juniper Networks, Inc. | Air flow ducts for cooling electronic devices within a data processing unit |
TW201200838A (en) * | 2010-06-23 | 2012-01-01 | Hon Hai Prec Ind Co Ltd | An air intake for cooling memories and an electronic device using the same |
JP2012048050A (ja) * | 2010-08-27 | 2012-03-08 | Sanyo Electric Co Ltd | 投写型映像表示装置 |
-
2011
- 2011-10-28 DE DE102011117223A patent/DE102011117223B3/de not_active Expired - Fee Related
-
2012
- 2012-09-06 JP JP2014537535A patent/JP6243339B2/ja not_active Expired - Fee Related
- 2012-09-06 US US14/353,905 patent/US9298229B2/en not_active Expired - Fee Related
- 2012-09-06 WO PCT/EP2012/067415 patent/WO2013060519A1/de active Application Filing
- 2012-09-06 EP EP12769969.2A patent/EP2772125B1/de not_active Not-in-force
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6330154B1 (en) * | 1999-02-02 | 2001-12-11 | 3Com Corporation | Cooling equipment |
US20040095724A1 (en) * | 2002-11-14 | 2004-05-20 | Cheng-Chung Hsu | Heat dissipation device for server |
US20050113016A1 (en) * | 2003-11-20 | 2005-05-26 | First International Computer, Inc. | Airflow guide structure and manufacture thereof |
US20110014861A1 (en) * | 2009-07-20 | 2011-01-20 | Hon Hai Precision Industry Co., Ltd. | Air duct assembly and heat dissipating assembly |
US20110085303A1 (en) * | 2009-10-09 | 2011-04-14 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Airflow guiding cover |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105684565A (zh) * | 2014-09-16 | 2016-06-15 | 深圳市大疆创新科技有限公司 | 散热装置及采用该散热装置的uav |
US10178812B2 (en) | 2014-09-16 | 2019-01-08 | SZ DJI Technology Co., Ltd. | Heat dissipation device and UAV using the same |
US10681849B2 (en) | 2014-09-16 | 2020-06-09 | SZ DJI Technology Co., Ltd. | Heat dissipation device and UAV using the same |
CN113115571A (zh) * | 2021-04-09 | 2021-07-13 | 绍兴市柯桥皓质华琚纺织品设计股份有限公司 | 一种纺织电气控制器散热机构 |
Also Published As
Publication number | Publication date |
---|---|
US20140293532A1 (en) | 2014-10-02 |
EP2772125A1 (de) | 2014-09-03 |
US9298229B2 (en) | 2016-03-29 |
EP2772125B1 (de) | 2017-11-08 |
JP6243339B2 (ja) | 2017-12-06 |
JP2014531136A (ja) | 2014-11-20 |
DE102011117223B3 (de) | 2013-04-25 |
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