WO2013051375A1

WO2013051375A1 - Dicing device, and method for manufacturing semiconductor device

Info

Publication number: WO2013051375A1
Application number: PCT/JP2012/073110
Authority: WO
Inventors: 慶成丸嶋
Original assignee: シャープ株式会社
Priority date: 2011-10-05
Filing date: 2012-09-10
Publication date: 2013-04-11
Also published as: TW201324657A

Abstract

The placement surface (10a) of a stage (10) is supported so as to have a tilt angle (θ) from a reference horizontal surface (A) orthogonal to the vertical direction in a process of dicing while pouring cleaning water. This is performed in order to reduce the cost involved in manufacturing a semiconductor device. The tilt angle (θ) is set so as to be no smaller than the angle at which the pooling of the cleaning water blown onto a semiconductor wafer placed on the stage (10) begins to be disrupted.

Description

Dicing apparatus and semiconductor device manufacturing method

The present invention relates to a dicing apparatus used for manufacturing a semiconductor device.

In the manufacturing process of a semiconductor device, dicing is usually performed to cut out an element from a semiconductor wafer.

FIG. 13 shows a bird's-eye view of a dicing apparatus for realizing the conventional dicing method.

In the dicing apparatus shown in FIG. 13, first, a semiconductor wafer is affixed on a dicing tape affixed to a frame for conveying the apparatus. Next, after the frame on which the semiconductor wafer is attached is placed on the stage of the dicing apparatus with the semiconductor wafer attachment side facing upward, the semiconductor wafer is cut along a predetermined dicing line by a dicing blade. At this time, a dicing operation is performed while ejecting a cleaning liquid (hereinafter referred to as cleaning water) from the nozzle in order to remove cutting waste and cool the dicing blade and the semiconductor wafer.

As shown in FIG. 14, a general dicing apparatus is provided with a stage on the bottom surface side of a dicing apparatus working area, on which a frame for transporting a semiconductor wafer is placed. A dicing blade is provided on the top surface side of the dicing apparatus working area facing the surface.

Normally, as shown in FIG. 15, the axial direction of the central axis (blade central axis) of the dicing blade is set parallel to the frame mounting surface of the stage, and further, with respect to a reference horizontal plane perpendicular to the vertical direction. Are also set in parallel. For this reason, the cleaning water ejected from the nozzle during dicing tends to accumulate on the semiconductor wafer.

Therefore, in the conventional dicing apparatus, when the dicing operation is performed while injecting the cleaning water, as shown in FIG. 16, in the frame to which the semiconductor wafer is attached, the dicing tape and the wafer ends A and B There is a possibility that the cleaning water enters between the semiconductor wafer and the adhesive of the dicing tape and the cleaning water react to weaken the adhesive force of the adhesive and cause the semiconductor wafer to be released from the dicing tape.

Therefore, Patent Document 1 discloses a method of manufacturing a semiconductor device that prevents a semiconductor wafer from being separated from a dicing tape by forming a hydrophobic film on the dicing tape application surface side of the semiconductor wafer. .

Japanese Patent Publication “Japanese Patent Laid-Open No. 10-270387 (published on Oct. 9, 1998)”

However, as disclosed in Patent Document 1, when a hydrophobic film is formed on the dicing tape application surface side of the semiconductor wafer, a process for forming the hydrophobic film on the semiconductor wafer, and the formed hydrophobic property Since it is necessary to newly add a process for removing the film, there is a problem that labor and cost in manufacturing the semiconductor device increase.

In addition, if a hydrophobic film forming process or a removing process is newly added, extra stress is applied to the semiconductor wafer during processing.

Therefore, it is conceivable to use a silicon oxide film that can be used as a semiconductor device as it is without removing the formed hydrophobic film as the hydrophobic film. Thinning becomes difficult.

Also, as a hydrophobic film, using a film of photoresist, resin, rubber material, when formed on the dicing tape application surface side of the semiconductor wafer, because the rigidity of the film is low, the semiconductor wafer blurs during dicing, There is a high possibility that processing problems such as cracks and chipping will occur.

Therefore, according to the conventional dicing apparatus, it is difficult to improve the yield of the semiconductor device, and the number of manufacturing steps increases, so that the cost for manufacturing the semiconductor device increases.

The present invention has been made in view of the above problems, and its purpose is to add a dicing tape adhesive and a semiconductor wafer without adding new steps (hydrophobic film forming step and removing step). An object of the present invention is to provide a dicing apparatus capable of reducing the cost for manufacturing a semiconductor device by preventing the semiconductor wafer from being separated from the dicing tape due to the intrusion of cleaning water between the two.

In order to solve the above-described problems, the dicing apparatus of the present invention has a stage on which a semiconductor wafer is fixedly mounted by an adhesive force of a dicing tape adhesive, and a central axis of rotation parallel to the semiconductor wafer mounting surface of the stage. A dicing apparatus having a dicing blade and a cleaning liquid supply mechanism for spraying a cleaning liquid onto a dicing portion when the semiconductor wafer is diced with the dicing blade, and at least during dicing, the semiconductor wafer mounting surface of the stage is vertical. It is supported so as to have an inclination angle from a reference horizontal plane orthogonal to the direction, and the inclination angle is set to an angle at which the retention state of the cleaning liquid sprayed on the semiconductor wafer placed on the stage starts to break down. It is characterized by having.

In order to solve the above-described problems, the semiconductor device manufacturing method of the present invention performs dicing while wiping the cleaning liquid on the semiconductor wafer fixedly mounted on the stage by the adhesive force of the adhesive of the dicing tape. A method for manufacturing an apparatus, wherein a semiconductor wafer placement surface of the stage is supported so as to have an inclination angle from a reference horizontal plane perpendicular to the vertical direction, and the inclination angle is on a semiconductor wafer placed on the stage. The dicing is performed in a state where the staying state of the cleaning liquid sprayed on the surface is set to be equal to or larger than an angle at which the cleaning liquid starts to collapse.

According to the above configuration, at least during dicing, the semiconductor wafer placement surface of the stage is supported so as to have an inclination angle from a reference horizontal plane perpendicular to the vertical direction, and the inclination angle is a semiconductor placed on the stage. Since the cleaning liquid sprayed on the wafer is set at an angle greater than the angle at which it starts to break down, the cleaning liquid sprayed on the semiconductor wafer during dicing will immediately flow down from the semiconductor wafer. It is possible to suppress the cleaning liquid from staying on the semiconductor wafer.

Thereby, the cleaning liquid staying during dicing can prevent the cleaning liquid from entering the dicing part and the end of the semiconductor wafer, so that the cleaning liquid does not enter between the semiconductor wafer and the adhesive of the dicing tape.

As a result, since the adhesive of the dicing tape does not react with the cleaning liquid, the adhesive force of the adhesive does not decrease, so that the semiconductor wafer can be prevented from being peeled off from the dicing tape and cut out from the semiconductor wafer. Further, the jumping out of the semiconductor chip (the jumping out of the semiconductor chip due to peeling off from the dicing tape) can be suppressed.

Accordingly, since the semiconductor chip can be appropriately cut out from the semiconductor wafer without applying extra stress to the semiconductor wafer during dicing, the yield of the semiconductor device is improved, and as a result, the cost of the semiconductor device is reduced. There is an effect that can be.

The present invention is a dicing apparatus that performs dicing while wiping a cleaning liquid on a semiconductor wafer placed on a stage, wherein the semiconductor wafer placement surface of the stage is inclined from a reference horizontal plane perpendicular to the vertical direction. The dicing is performed in a state where the inclination angle is set to be equal to or larger than an angle at which the staying state of the cleaning liquid sprayed on the semiconductor wafer placed on the stage starts to collapse. By doing so, the semiconductor chip can be appropriately cut out from the semiconductor wafer without applying extra stress to the semiconductor wafer during dicing, so that the yield of the semiconductor device is improved, and as a result, the cost of the semiconductor device is reduced. There is an effect that it can be lowered.

It is a schematic block diagram of the dicing apparatus which concerns on Embodiment 1 of this invention. It is a schematic sectional drawing which shows the state which affixed the semiconductor wafer on the flame | frame for apparatus conveyance. It is a bird's-eye view of the dicing apparatus shown in FIG. It is an enlarged view of the semiconductor wafer cutting part by the dicing apparatus shown in FIG. It is a schematic block diagram of the dicing apparatus which concerns on Embodiment 2 of this invention. It is a bird's-eye view of the dicing apparatus shown in FIG. It is an enlarged view of the semiconductor wafer cutting part by the dicing apparatus shown in FIG. It is a schematic block diagram of the dicing apparatus which concerns on Embodiment 3 of this invention. It is a bird's-eye view of the dicing apparatus shown in FIG. It is an enlarged view of the semiconductor wafer cutting part by the dicing apparatus shown in FIG. It is a schematic block diagram of the dicing apparatus which concerns on Embodiment 4 of this invention. It is a schematic block diagram of the cooling mechanism applied to the dicing apparatus of this invention. It is a bird's-eye view of the conventional dicing apparatus. It is a schematic block diagram of the dicing apparatus shown in FIG. It is an enlarged view of the semiconductor wafer cutting part by the dicing apparatus shown in FIG. It is a figure for demonstrating the mechanism in which a washing | cleaning liquid penetrate | invades between a semiconductor wafer and a dicing tape.

[Embodiment 1]
An embodiment of the present invention will be described as follows.

(Outline explanation of dicing equipment)
FIG. 1 is a diagram showing a schematic configuration of a dicing apparatus 1 according to the present embodiment.

As shown in FIG. 1, the dicing apparatus 1 rotates a stage 10 on which a workpiece (semiconductor wafer 16 to be described later) is placed via a frame 13 and a workpiece placed on the stage 10 by rotation. A dicing blade 11 to be cut, a nozzle (cleaning liquid supply mechanism) 12 for injecting a cleaning liquid (hereinafter referred to as cleaning water) to a dicing portion of the workpiece by the dicing blade 11, and a workpiece for placing and conveying the workpiece A dicing blade holding portion (drive mechanism) 14 that supports the frame 13 and the dicing blade 11 and transmits a driving force to the dicing blade 11 is arranged in the working area 100.

The working area 100 is a work area for performing dicing work by the dicing apparatus 1. A structural body such as a housing for supporting each component constituting the dicing apparatus 1 is formed along the working area 100.

The stage 10 is provided on the bottom surface side 1b of the dicing apparatus working area in the working area 100, and the placement surface 10a on which the frame 13 is placed is inclined at an inclination angle θ from a horizontal plane (reference horizontal plane A) perpendicular to the vertical direction. Designed to be Here, since the stage 10 should just incline the mounting surface 10a at the time of the dicing of the workpiece by the dicing blade 11, the mounting surface 10a is parallel to the bottom surface side 1b of the dicing apparatus working area except during the dicing. That is, the inclination angle θ may be 0 ° so as to be parallel to the reference horizontal plane A. Details of the inclination angle θ will be described later.

The dicing blade 11 is supported by a dicing blade holding portion 14 fixed to the top surface 1a of the dicing apparatus working area in the working area 100.

The dicing blade holding part 14 supports the dicing blade 11 by a support bar 14a fixed to the top surface 1a of the dicing machine working area. The support bar 14 a is provided with a driving source for transmitting a rotational driving force to the dicing blade 11. For example, a motor may be used as a drive source, and this motor may be connected to the blade center shaft 11a of the dicing blade 11 so that the dicing blade 11 is rotationally driven.

Further, the support bar 14a of the dicing blade holding part 14 is formed so as to be extendable and contracted so that the dicing blade 11 is brought into contact with a workpiece to be cut during dicing.

Here, the axial direction of the blade center axis 11a, which is the rotation center of the dicing blade 11, is inclined at an inclination angle θ with respect to the reference horizontal plane so that it is parallel to the mounting surface 10a of the stage 10 during dicing. ing. Thereby, at the time of dicing, the dicing blade 11 comes into contact with the workpiece placed on the stage 10 perpendicularly.

The nozzle 12 is provided for injecting (spraying) cleaning water (pure water) onto a cut portion (dicing portion) where the dicing blade 11 and the workpiece are in contact with each other during dicing. Thereby, the dicing blade 11 is cooled and the cutting waste is removed.

Here, the nozzle 12 has a structure in which a cleaning water injection port is provided above the cutting portion, and the cleaning water is injected from above to the cutting portion. However, depending on the inclination of the mounting surface of the workpiece, that is, the inclination angle θ, the structure may be provided below the cutting portion and injecting the washing water from below to above the cutting portion.

As shown in FIG. 2, the frame 13 is provided with a dicing tape 15 on the entire surface, and a semiconductor wafer 16 as a workpiece is attached on the dicing tape 15. The semiconductor wafer 16 is adhered to the frame 13 by the adhesive force of the adhesive of the dicing tape 15, and as a result, is fixed to the frame 13.

Thereby, the semiconductor wafer 16 is fixedly placed on the placement surface 10 a of the stage 10 via the frame 13. In this state, the semiconductor wafer 16 is diced by the dicing blade 11.

(Dicing)
FIG. 3 is a bird's-eye view of the dicing apparatus 1 shown in FIG.

As shown in FIG. 3, a plurality of chips are formed by a dicing blade 11 while cleaning water is ejected by a nozzle 12 from a semiconductor wafer 16 fixedly mounted by a dicing tape 15 of a frame 13 placed on a stage 10. Cut out.

FIG. 4 is an enlarged view of a cut portion of the semiconductor wafer 16.

As shown in FIG. 4, during dicing, the mounting surface 10 a of the semiconductor wafer 16 of the stage 10 is inclined from the reference horizontal plane A by the inclination angle θ. Here, since the dicing blade 11 needs to be perpendicular to the semiconductor wafer 16, the axial direction of the blade center axis 11 a of the dicing blade 11 is parallel to the mounting surface 10 a of the stage 10. That is, the dicing blade 11 is also inclined by the inclination angle θ with respect to the reference normal plane B, similarly to the mounting surface 10 a of the stage 10.

(Inclination angle θ)
Although cleaning water is sprayed onto the semiconductor wafer 16 during dicing, as shown in FIG. 2, the semiconductor wafer 16 to be cut is fixed to the frame 13 by the adhesive force of the adhesive by the dicing tape 15. There is a possibility that the cleaning water enters between the semiconductor wafer 16 and the adhesive of the dicing tape 15 and the cleaning water and the adhesive react to weaken the adhesive strength of the adhesive.

The intrusion of the cleaning water into the adhesive bonding portion is caused by the excessive retention of cleaning water on the surface of the semiconductor wafer 16 during dicing. If the semiconductor wafer 16 can be inclined and flowed by its own weight, the above problem does not occur. The means for tilting the semiconductor wafer 16 is realized by tilting the mounting surface 10a of the stage 10 described above. That is, by appropriately setting the above-described inclination angle θ, it is possible to prevent the cleaning water from staying on the semiconductor wafer 16 and prevent the cleaning water from entering the adhesive bonding portion, and the adhesive strength of the adhesive can be reduced. It becomes possible to suppress weakening.

Here, in the dicing apparatus 1 shown in FIG. 1, Table 1 shows the results of examining the relationship between the inclination angle θ and the flow of cleaning water.

Table 1 shows a case in which, in the dicing apparatus 1 shown in FIG. 1, pure water as cleaning water ejected from the nozzles 12 during dicing is injected to the cut portion of the semiconductor wafer 16 at 100 ml / min. Shows the results obtained.

Therefore, if the inclination angle θ is less than 10 °, the cleaning water stays on the semiconductor wafer 16 and is not preferable. If the inclination angle θ is 10 °, the staying state of the cleaning water on the semiconductor wafer 16 collapses and the cleaning water stays on the semiconductor wafer 16. It flows little by little.

Even when the inclination angle θ is 15 °, the stagnation is slow, but the cleaning water slowly flows down. Preferably, when the inclination angle θ is 20 ° or more, the cleaning water for the semiconductor wafer 16 is almost equal. It runs down completely.

From the above, it can be seen that if the inclination angle θ is 10 ° or more, the staying state of the cleaning water on the semiconductor wafer 16 collapses and the cleaning water flows out. That is, if the inclination angle θ is 10 ° or more, it becomes possible to prevent the cleaning water from entering the adhesive bonding portion and to suppress the adhesive force of the adhesive from weakening.

In addition, it can be seen that if the inclination angle θ is 20 ° or more, the cleaning water for the semiconductor wafer 16 will flow almost completely, which is more effective.

As described above, the larger the inclination angle θ, the higher the effect of preventing the cleaning water from entering the adhesive bonding portion. However, if the inclination angle θ exceeds 90 °, the stage 10 in the dicing apparatus 1 is increased. The arrangement positions of the dicing blade 11 and the nozzle 12 need to be significantly changed. The case where the inclination angle θ is 90 ° will be described in detail in a second embodiment described later. When the inclination angle θ is 180 °, the structure of the dicing apparatus 1 needs to be further changed. The case where the inclination angle θ is 180 ° will be described in detail in Embodiments 3 and 4 described later.

(Effect of inclination angle θ due to viscosity of washing water)
When pure water is used as the cleaning liquid, the inclination angle θ has almost no influence of the viscosity of the cleaning water. That is, since the dicing apparatus 1 is usually installed in a clean room that is temperature and humidity controlled, the temperature change is slight, and it is unlikely that the viscosity of the wash water will change greatly. It seems difficult to affect the corners. Even if the viscosity of the cleaning water is strictly increased due to a temperature change, it is considered that it is within an error range and hardly affects the inclination angle θ.

(Effect of cleaning water injection amount (= injection speed) with inclination angle θ)
It is considered that there is almost no influence on the inclination angle θ due to the injection amount of the washing water, like the above viscosity. Table 2 shows the relationship between the washing water injection amount and the minimum inclination angle.

In Table 2, No. 1 indicates that the minimum inclination angle is 10 ° when the injection amount is 100 ml / min. The test condition of 2 indicates that the minimum inclination angle is 8 ° when the injection amount is 300 ml / min. Here, the minimum inclination angle is the minimum inclination angle θ at which the cleaning water does not stay on the surface of the semiconductor wafer 16.

Supplementing the information in Table 2, when the injection amount of cleaning water is 300 ml / min or more and the inclination angle θ is 8 °, compared to when the injection amount of cleaning water is 100 ml / min and the inclination angle θ is 10 °. The extent of the cleaning water spreading to the entire surface of the semiconductor wafer 16 increases, but there is no great difference in the way the cleaning water flows in the direction of gravity.

When the injection amount of cleaning water is 300 ml or more per minute, if the inclination angle θ is at least 8 ° or more, the cleaning water does not stay on the surface of the semiconductor wafer 16 and naturally flows in the direction of gravity due to its own weight, If the injection amount of cleaning water is 100 ml per minute, if the inclination angle θ is at least 10 ° or more, the cleaning water does not stay on the surface of the semiconductor wafer 16 and flows naturally in the direction of gravity due to the weight of the cleaning water. It can be seen that even when the injection amount of the cleaning water is changed, the inclination angle θ for allowing the cleaning water to flow down naturally in the direction of gravity due to its own weight hardly changes.

Therefore, there is almost no influence on the inclination angle θ due to the injection amount of the washing water as in the case of the viscosity of the washing water described above.

It should be noted that the injection amount of washing water is 100 ml / min. Since the test condition No. 1 is the lowest level of injection amount that cannot normally be performed, it is appropriate that the lower limit value of the inclination angle θ is 10 °.

However, when the cleaning liquid is pure water, it can be said that the lower limit value of the inclination angle θ is 10 °. However, in the case of a cleaning liquid other than pure water, the lower limit value of the inclination angle θ is limited to 10 °. For example, the inclination angle at which the retention state of the cleaning liquid on the semiconductor wafer starts to collapse may be set as the lower limit value of the inclination angle θ.

(Effects of Embodiment 1)
According to the dicing apparatus 1 having the above-described configuration, the staying state of the cleaning water on the semiconductor wafer 16 collapses due to the inclination angle θ of the mounting surface 10a of the stage 10 during dicing performed while injecting the cleaning water from the nozzle 12. Therefore, the cleaning water does not stay on the semiconductor wafer 16.

Thereby, since it is possible to prevent the cleaning water from entering between the semiconductor wafer 16 and the adhesive of the dicing tape 15 from the dicing part and the end of the semiconductor wafer 16, the adhesive and the cleaning water of the dicing tape 15 can be prevented. Can be removed from the dicing tape 15 due to a decrease in the adhesive strength of the adhesive, and the semiconductor chip cut out from the semiconductor wafer 16 can be ejected (by peeling from the dicing tape 15). Jumping out of the semiconductor chip can be suppressed.

Accordingly, dicing can be performed effectively without giving stress to the semiconductor wafer 16 and without taking the trouble of processing, so that the yield of semiconductor chips cut out from the semiconductor wafer 16 can be increased, There is an effect that the cost for manufacturing the semiconductor device can be reduced.

[Embodiment 2]
Another embodiment of the present invention will be described as follows.

(Outline explanation of dicing equipment)
FIG. 5 is a diagram showing a schematic configuration of the dicing apparatus 2 according to the present embodiment.

As shown in FIG. 5, the dicing apparatus 2 rotates a stage 20 on which a workpiece (semiconductor wafer 26 described later) is placed via a frame 23 and a workpiece placed on the stage 20 by rotation. A dicing blade 21 to be cut, a nozzle (cleaning liquid supply mechanism) 22 for injecting a cleaning liquid (hereinafter referred to as cleaning water) to a dicing portion of the workpiece by the dicing blade 21, and a workpiece for placing and conveying the workpiece A dicing blade holding portion (drive mechanism) 24 that supports the frame 23 and the dicing blade 21 and transmits a driving force to the dicing blade 21 is arranged in the working area 200.

The working area 200 is a work area for performing dicing work by the dicing apparatus 2. A structural body such as a housing for supporting each component constituting the dicing apparatus 2 is formed along the working area 200.

The stage 20 is provided on the left side 2b of the dicing apparatus working area in the working area 200, and the placement surface 20a on which the frame 23 is placed is inclined with respect to a horizontal plane (reference horizontal plane A) perpendicular to the vertical direction. The angle θ is designed to be 90 °.

The dicing blade 21 is supported by a dicing blade holding part 24 fixed to the right side 2a of the dicing apparatus working area in the working area 200.

The dicing blade holding part 24 supports the dicing blade 21 by a support bar 24a fixed to the right side 2a of the dicing machine working area. The support bar 24 a is provided with a driving source for transmitting a rotational driving force to the dicing blade 21. For example, a motor may be used as a drive source, and this motor may be connected to the blade center shaft 21a of the dicing blade 21 so that the dicing blade 21 is rotationally driven.

Further, the support bar 24a of the dicing blade holding part 24 is formed to be extendable and contracted so that the dicing blade 21 is brought into contact with the workpiece to be cut during dicing.

Here, the tilt angle θ = 90 ° with respect to the reference horizontal plane so that the axial direction of the blade center axis 21a, which is the center of rotation of the dicing blade 21, is parallel to the placement surface 20a of the stage 20 during dicing. It is inclined at. Thereby, at the time of dicing, the dicing blade 21 comes into contact with the workpiece placed on the stage 20 perpendicularly.

The nozzle 22 is provided to inject cleaning water (pure water) to a cut portion (dicing portion) where the dicing blade 21 and the workpiece are in contact with each other during dicing. Thereby, the dicing blade 21 is cooled and the cutting waste is removed.

Here, the nozzle 22 has a structure in which a cleaning water injection port is provided above the cutting portion, and the cleaning water is injected from above to below the cutting portion.

As in the first embodiment, the frame 23 is provided with a dicing tape 25 on the entire surface, and a semiconductor wafer 26 as a workpiece is attached on the dicing tape 25. The semiconductor wafer 26 is adhered to the frame 23 by the adhesive force of the adhesive of the dicing tape 25, and as a result, is fixed to the frame 23.

Thereby, the semiconductor wafer 26 is fixedly mounted on the mounting surface 20 a of the stage 20 through the frame 23. In this state, the semiconductor wafer 26 is diced by the dicing blade 21.

(Dicing)
6 is a bird's-eye view of the dicing apparatus 2 shown in FIG.

As shown in FIG. 6, a plurality of chips are cut out by a dicing blade 21 while cleaning water is ejected by a nozzle 22 from a semiconductor wafer 26 bonded by a dicing tape 25 of a frame 23 placed on a stage 20. .

FIG. 7 is an enlarged view of a cut portion of the semiconductor wafer 26.

As shown in FIG. 7, during dicing, the mounting surface 20 a of the semiconductor wafer 26 of the stage 20 is inclined with respect to the reference horizontal plane A by an inclination angle θ = 90 °. That is, the mounting surface 20 a of the semiconductor wafer 26 of the stage 20 is parallel to the reference normal plane B. Here, since the dicing blade 21 needs to hit the semiconductor wafer 26 perpendicularly, the axial direction of the blade center axis 21 a of the dicing blade 21 is parallel to the mounting surface 20 a of the stage 20. That is, the dicing blade 21 is also inclined by the inclination angle θ = 90 ° with respect to the reference horizontal plane, similarly to the mounting surface 20a of the stage 20. That is, the dicing blade 21 is also parallel to the reference normal plane B.

(Effects of Embodiment 2)
Also in the dicing apparatus 2 according to the present embodiment, the same effects as those obtained by the dicing apparatus 1 according to the first embodiment can be obtained.

Furthermore, in the dicing apparatus 2 according to the present embodiment, since the inclination angle θ of the mounting surface 20a of the stage 20 is set to 90 ° during dicing while injecting the cleaning water from the nozzle 22, the cleaning water The gravity drop direction matches the gravity direction, and the retention due to the surface tension on the semiconductor wafer 26 is small, so that the cleaning water flows most efficiently.

Thereby, since it is possible to prevent the cleaning water from entering between the semiconductor wafer 26 and the adhesive of the dicing tape 25 from the dicing part and the end of the semiconductor wafer 26, the adhesive of the dicing tape 25 and the cleaning water. , And the adhesive strength of the adhesive is reduced, so that peeling of the semiconductor wafer 26 from the dicing tape 25 can be surely eliminated, and the semiconductor chip cut out from the semiconductor wafer 26 is released (peeled from the dicing tape 25). The jumping of the semiconductor chip due to this can be suppressed.

Therefore, dicing can be performed effectively without giving stress to the semiconductor wafer 26 and without taking the trouble of processing, so that the yield of semiconductor chips cut out from the semiconductor wafer 26 can be increased, There is an effect that the cost for manufacturing the semiconductor device can be reduced.

In the present embodiment, the case where the inclination angle θ is 90 ° has been described. However, in the dicing apparatus 2 shown in FIG. 5, the stage 20 is located on the left side 2b of the dicing apparatus working area parallel to the reference normal plane B. Even if the inclination angle θ of the mounting surface 20a of the stage 20 deviates from 90 ° and becomes 80 ° or 100 °, the cleaning water is not as much as when the inclination angle θ is 90 °. The gravity drop direction and the gravity direction substantially coincide with each other, and the retention due to the surface tension on the semiconductor wafer 26 is small, so that the cleaning water efficiently flows down.

However, if the inclination angle θ is larger than 90 ° and considerably larger than the above 100 °, the correspondence with the dicing apparatus 2 (corresponding to the inclination of the mounting surface 20a of the stage 20) is not sufficient, which will be described later. As disclosed in the third embodiment, the stage needs to be provided on the ceiling surface side.

[Embodiment 3]
Another embodiment of the present invention will be described as follows.

(Outline explanation of dicing equipment)
FIG. 8 is a diagram showing a schematic configuration of the dicing apparatus 3 according to the present embodiment.

As shown in FIG. 8, the dicing apparatus 3 rotates a stage 30 on which a workpiece (semiconductor wafer 36 described later) is placed via a frame 33, and a workpiece placed on the stage 30 by rotation. A dicing blade 31 to be cut, a nozzle (cleaning liquid supply mechanism) 32 for injecting a cleaning liquid (hereinafter referred to as cleaning water) to a dicing portion of the workpiece by the dicing blade 31, and a workpiece to be placed and conveyed A dicing blade holding portion (drive mechanism) 34 that supports the frame 33 and the dicing blade 31 and transmits a driving force to the dicing blade 31 is arranged in the working area 300.

The working area 300 is a work area for performing dicing work by the dicing apparatus 3. A structural body such as a housing for supporting each component constituting the dicing apparatus 3 is formed along the working area 300.

Here, the dicing apparatus 3 having the above-described configuration has an upside down structure with respect to the dicing apparatus 1 shown in FIG. 1 of the first embodiment. That is, the stage 30 is provided on the top surface side 3a of the dicing apparatus working area in the working area 300, and the mounting surface 30a on which the frame 33 is mounted is parallel to a horizontal plane (reference horizontal plane A) perpendicular to the vertical direction. That is, it is designed so that the inclination angle θ = 180 °.

The dicing blade 31 is supported by a dicing blade holding portion 34 fixed to the bottom surface side 3b of the dicing apparatus working area in the working area 300.

The dicing blade holding part 34 supports the dicing blade 31 by a support bar 34a fixed to the bottom surface side 3b of the dicing apparatus working area. The support bar 34 a is provided with a driving source for transmitting a rotational driving force to the dicing blade 31. For example, a motor may be used as a drive source, and this motor may be connected to the blade center shaft 31a of the dicing blade 31 so that the dicing blade 31 is rotationally driven.

Further, the support bar 34a of the dicing blade holding part 34 is formed so as to be extendable and contracted so that the dicing blade 31 is brought into contact with the workpiece to be cut during dicing.

Here, the axial direction of the blade center axis 31a which is the rotation center of the dicing blade 31 is parallel to the reference horizontal plane A so as to be parallel to the mounting surface 30a of the stage 30 during dicing. Thereby, at the time of dicing, the dicing blade 31 comes into contact with the workpiece placed on the stage 30 perpendicularly.

The nozzle 32 is provided to inject cleaning water (pure water) to a cut portion (dicing portion) where the dicing blade 31 and the workpiece are in contact with each other during dicing. Thereby, the dicing blade 31 is cooled and the cutting waste is removed.

Here, the nozzle 32 has a structure in which a cleaning water injection port is provided below the cutting portion, and the cleaning water is injected from below to above the cutting portion.

As in the first embodiment, the frame 33 is provided with a dicing tape 35 on the entire surface, and a semiconductor wafer 36 as a workpiece is attached on the dicing tape 35. The semiconductor wafer 36 is adhered to the frame 33 by the adhesive of the dicing tape 35, and as a result, is fixed to the frame 33.

Thereby, the semiconductor wafer 36 is fixedly placed on the placement surface 30 a of the stage 30 through the frame 33. In this state, the semiconductor wafer 36 is diced by the dicing blade 31.

(Dicing)
FIG. 9 is a bird's-eye view of the dicing apparatus 3 shown in FIG.

As shown in FIG. 9, a plurality of chips are cut out by a dicing blade 31 while cleaning water is ejected by a nozzle 32 from a semiconductor wafer 36 bonded by a dicing tape 35 of a frame 33 placed on a stage 30. .

FIG. 10 is an enlarged view of a cut portion of the semiconductor wafer 36.

As shown in FIG. 10, during the dicing, the mounting surface 30a of the semiconductor wafer 36 of the stage 30 is parallel to the reference horizontal plane A and is directed downward. Here, since the dicing blade 31 needs to hit the semiconductor wafer 36 vertically from below, the axial direction of the blade center axis 31a of the dicing blade 31 is parallel to the mounting surface 30a of the stage 30. Yes.

As shown in FIG. 10, since the dicing blade 31 is applied to the semiconductor wafer 36 from below and the cleaning water is ejected from the nozzle 32 from below to above, the cleaning water that has hit the semiconductor wafer 36 is obtained. Falls immediately due to its own weight and gravity.

(Effects of Embodiment 3)
Also in the dicing apparatus 3 according to the present embodiment, the same effects as those obtained by the dicing apparatus 2 according to the second embodiment are obtained.

Furthermore, in the dicing apparatus 3 according to the present embodiment, since the inclination angle θ of the mounting surface 30a of the stage 30 is set to 180 ° during dicing while injecting the cleaning water from the nozzle 32, the cleaning water The direction in which the gravity falls and the direction of gravity coincide with each other, and the washing water flows down efficiently.

This prevents the cleaning water from entering between the semiconductor wafer 36 and the adhesive of the dicing tape 35 from the dicing part and end of the semiconductor wafer 36, so the adhesive of the dicing tape 35 and the cleaning water , And the adhesive force of the adhesive decreases, and the peeling of the semiconductor wafer 36 from the dicing tape 35 can be surely eliminated, and the semiconductor chips cut out from the semiconductor wafer 36 jump out (peel off from the dicing tape 35). The jumping of the semiconductor chip due to this can be suppressed.

Therefore, dicing can be performed effectively without giving stress to the semiconductor wafer 36 and without taking time and effort during processing, so that the yield of semiconductor chips cut out from the semiconductor wafer 36 can be increased, The semiconductor chip can be provided at a low cost.

Further, the dicing apparatus 3 according to the present embodiment is a dicing apparatus that has conventionally existed, that is, a dicing apparatus in which a dicing blade is provided on the top surface side of the dicing apparatus working area and a stage is provided on the bottom surface side of the dicing apparatus working area. This can be realized simply by reversing the arrangement positions of the dicing blade and the stage.

[Embodiment 4]
Another embodiment of the present invention will be described as follows.

(Outline explanation of dicing equipment)
FIG. 11 is a diagram showing a schematic configuration of the dicing apparatus 4 according to the present embodiment.

The dicing device 4 basically has the same configuration as the dicing device 3 according to the third embodiment. That is, as shown in FIG. 11, the dicing apparatus 4 includes a stage 40, a dicing blade 41 that cuts the workpiece placed on the stage 40 by rotation, and a dicing portion of the workpiece by the dicing blade 41. A nozzle (cleaning liquid supply mechanism) 42 for injecting a cleaning liquid (hereinafter referred to as cleaning water), a frame 43 for placing and conveying a workpiece, and a dicing blade 41 are supported, and a driving force is applied to the dicing blade 41. A dicing blade holding part (drive mechanism) 44 for transmitting is arranged in the working area 400.

The working area 400 is a work area for performing dicing work by the dicing apparatus 4. A structural body such as a housing for supporting each component constituting the dicing apparatus 4 is formed along the working area 400.

Here, the dicing apparatus 4 having the above-described configuration has substantially the same structure as the dicing apparatus 3 shown in FIG. 8 of the third embodiment. That is, the stage 40 is provided on the top surface 4a side of the dicing apparatus working area in the working area 400, and the placement surface 40a on which the frame 43 is placed is parallel to a horizontal plane (reference horizontal plane A) perpendicular to the vertical direction. That is, it is designed so that the inclination angle θ = 180 °.

However, unlike the third embodiment, the arrangement position of the dicing blade 41 is supported by the dicing blade holding portion 44 fixed to the side surface 4b of the dicing apparatus working area in the working area 400.

The dicing blade holding portion 44 supports the dicing blade 41 by a support bar 44a fixed to the side surface 4b of the dicing apparatus working area. The support bar 44 a is provided with a driving source for transmitting a rotational driving force to the dicing blade 41. For example, a motor may be used as a drive source, and this motor may be connected to the blade center shaft 41a of the dicing blade 41 so that the dicing blade 41 is rotationally driven.

Moreover, the dicing blade holding part 44 is provided so as to be movable to the dicing apparatus working area top side 4a side together with the support bar 44a. Thereby, the dicing blade 41 comes into contact with the workpiece to be cut during dicing.

The nozzle 42 is provided to inject cleaning water (pure water) to a cut portion (dicing portion) where the dicing blade 41 and the workpiece are in contact with each other during dicing. Thereby, the dicing blade 41 is cooled and the cutting waste is removed.

As in the third embodiment, the frame 43 is provided with a dicing tape 45 on the entire surface, and a semiconductor wafer as a workpiece is attached on the dicing tape 45. The semiconductor wafer is adhered to the frame 43 by the adhesive of the dicing tape 45, and as a result, is fixed to the frame 43.

Thereby, the semiconductor wafer is fixedly mounted on the mounting surface 40 a of the stage 40 through the frame 43. In this state, the semiconductor wafer is diced by the dicing blade 41.

(Effects of Embodiment 4)
According to the dicing apparatus 4 according to the present embodiment, substantially the same effect as that obtained by the dicing apparatus 3 according to the third embodiment can be obtained.

Moreover, since the dicing blade holding portion 44 is provided on the side surface 4b of the dicing apparatus working area in the stage 40, it does not exist at the position where the wash water injected toward the placement surface 40a of the stage 40 falls under its own weight. Become. For this reason, unnecessary cleaning water is not applied to the dicing blade holding unit 44, so that deterioration or failure of the mechanism of the dicing blade holding unit 44 due to the application of cleaning water to the dicing blade holding unit 44 can be reduced. There is an effect.

In the dicing device 4 having the above-described configuration, the dicing blade holding portion 44 that is a drive mechanism for driving the dicing blade 41 is fixed to the dicing device working area side surface 4b via the support bar 44a. In other words, the dicing blade holding part 44 is provided at a position that is off the projection surface of the semiconductor wafer placed on the placement surface 40 a of the stage 40.

Since the projection surface of the semiconductor wafer placed on the stage is also a surface showing the range in which the cleaning water falls during dicing, the dicing blade is a drive mechanism that drives the dicing blade at a position off the projection surface. By providing the holding portion 44, no washing water is applied to the drive mechanism, so that there is an effect that the deterioration due to the washing water being applied to the drive mechanism can be eliminated and failure can be reduced.

In the fourth embodiment, the example in which the support bar 44a of the dicing blade holding unit 44 is fixed to the side surface side 4b of the dicing apparatus has been described. However, the present invention is not limited to this example, and the diverging blade holding unit 44 is off the projection plane. As long as the dicing blade holding portion 44 is disposed at a position, the attachment position may be anywhere.

(Cooling mechanism)
The main purpose of the cleaning water is to eliminate clogging of the blade blades due to cutting waste and the like rather than cooling. Further, in each embodiment, even when the cleaning water is immediately dropped from the semiconductor wafer, since the cleaning water is continuously injected, there is a particular problem in cooling the semiconductor wafer and the dicing blade. Does not occur.

For example, in order to further enhance the cooling effect of the semiconductor wafer and the dicing blade, a cooling mechanism as shown in FIG. 12 may be provided in the dicing apparatus.

In the cooling mechanism shown in FIG. 12, in order to cool the stage surface portion that fixes and holds the semiconductor wafer attached to the dicing tape on the frame, a high thermal conductive dicing tape is used as the dicing tape. Auxiliary cooling is performed from the back side through a dicing tape, and further, a cooling water pipe is provided in the stage to cool the semiconductor wafer from the further back side of the dicing tape.

(Summary of effects according to each embodiment)
As described above, in the dicing apparatus disclosed in each embodiment of the present invention, the stage for fixing and mounting the semiconductor wafer by the adhesive force of the adhesive of the dicing tape, and the rotation of the semiconductor wafer on the center axis of the stage are described above. A dicing apparatus having a dicing blade parallel to the mounting surface and a cleaning liquid supply mechanism for spraying a cleaning liquid (hereinafter referred to as cleaning water) to a dicing portion when dicing a semiconductor wafer with the dicing blade, at least during dicing The semiconductor wafer placement surface of the stage is supported so as to have an inclination angle from a reference horizontal plane orthogonal to the vertical direction, and the inclination angle is applied to the cleaning water sprayed onto the semiconductor wafer placed on the stage. It is set to be more than the angle at which the staying state starts to collapse.

And in the manufacturing method of the semiconductor device using the said dicing apparatus, the manufacturing method of the semiconductor device which dices while spraying washing water with respect to the semiconductor wafer fixedly mounted by the adhesive force of the adhesive of a dicing tape on a stage The semiconductor wafer placement surface of the stage is supported so as to have an inclination angle from a reference horizontal plane perpendicular to the vertical direction, and the inclination angle is sprayed onto the semiconductor wafer placed on the stage. The dicing is performed in a state where the cleaning water staying state is set to be equal to or larger than the angle at which the state of starting the collapse of the washing water starts.

According to the above configuration, at least during dicing, the semiconductor wafer placement surface of the stage is supported so as to have an inclination angle from a reference horizontal plane perpendicular to the vertical direction, and the inclination angle is a semiconductor placed on the stage. Since the cleaning water sprayed on the wafer is set at an angle greater than the angle at which it starts to collapse, the cleaning water sprayed on the semiconductor wafer during dicing will immediately flow down from the semiconductor wafer. It is possible to suppress the retention of cleaning water on the semiconductor wafer during dicing.

As a result, the cleaning water staying in the dicing can prevent the cleaning water from entering the dicing portion and the end of the semiconductor wafer, so that the cleaning water is applied to the adhesive bonding portion between the semiconductor wafer and the dicing tape. Do not enter.

As a result, since the adhesive of the dicing tape and the washing water do not react with each other, the adhesive strength of the adhesive does not decrease, so that the semiconductor wafer can be prevented from being peeled off from the dicing tape and cut out from the semiconductor wafer. It is possible to suppress the protruding semiconductor chip (the semiconductor chip protruding due to peeling off from the dicing tape).

Up to this point, the inclination angle θ is 10 ° or more, preferably 20 ° or more, and the embodiment in the case of 90 ° and the embodiment in the case of 180 ° have been described. May be set to any angle between 10 ° and 350 °. If the inclination angle θ is set within this range, it is possible to prevent the cleaning water from staying on the semiconductor wafer during dicing.

However, it is necessary to change the structure of the dicing machine itself according to each angle. For example, when the inclination angles are 90 ° and 180 °, it is necessary to change the arrangement of the stage and the dicing blade as described above.

Also, depending on the above inclination angle, it is necessary to change the direction of spraying the cleaning water.

That is, when the inclination angle θ set at the time of dicing is 10 ° to 90 °, 270 ° to 350 °, the cleaning water is sprayed from the upper side to the lower side with respect to the dicing portion, and the inclination angle set at the time of dicing is set. When θ is 90 ° to 270 °, it is preferable to spray cleaning water from below to above the dicing site.

According to the above configuration, since the spraying direction of the cleaning water sprayed onto the semiconductor wafer is changed according to the inclination angle, the cleaning water can be stably sprayed onto the semiconductor wafer.

For example, when the tilt angle θ set at the time of dicing is 10 ° to 90 °, 270 ° to 350 °, the stage mounting surface is upward except in the case of 90 ° and 270 °. By spraying the cleaning water on the dicing part from the top to the bottom, the cleaning water can be efficiently sprayed.

Further, when the tilt angle θ set at the time of dicing is 90 ° to 270 °, the stage mounting surface faces downward except in the case of 90 ° and 270 °, so that it is below the dicing portion. By spraying the cleaning water upward from the top, the cleaning water can be efficiently sprayed.

As described above, according to the dicing apparatus of the present invention, since stress is not applied to the semiconductor wafer during dicing, the semiconductor wafer for solar cells (solar cell) which is weak against stress and thinned. ) Can be appropriately diced.

Furthermore, according to the dicing apparatus of the present invention, since the cleaning water is difficult to enter between the semiconductor wafer and the dicing tape during dicing, the adhesive pressure sensitive adhesive generated by the reaction between the dicing tape adhesive and the cleaning water. It is possible to prevent a decrease in power. For this reason, it is possible to perform dicing with the semiconductor wafer lightly attached to the dicing tape by using (1) a dicing tape whose adhesive has a weak adhesive strength and (2) a general sponge roller. .

In this way, if the semiconductor wafer is lightly affixed to the dicing tape, it is not necessary to apply excessive stress to the semiconductor wafer after the dicing so that the semiconductor wafer is peeled off from the dicing tape. Can be easily peeled off.

Therefore, when peeling from the dicing tape, it is not necessary to apply stress to the semiconductor wafer more than necessary. Therefore, the semiconductor wafer can be suitably used for a thinned semiconductor wafer that may be broken by the stress when peeling from the dicing tape.

In particular, a semiconductor wafer for a solar cell (hereinafter referred to as a solar cell) is an example that represents a thin film semiconductor wafer. When dicing a solar cell, the electrode surface side of the solar cell is attached to a dicing tape. Since the adhesive of the dicing tape enters into the recesses and exerts a strong anchor effect, it is necessary to make the adhesive force of the adhesive of the dicing tape as weak as possible. On the contrary, even when the light receiving surface side of the solar cell is affixed to the dicing tape, it goes without saying that it is necessary to make the adhesive force of the adhesive of the dicing tape as weak as possible in view of the thin film semiconductor wafer. The adhesive strength of this adhesive may be an adhesive strength that does not peel the solar cell from the dicing tape during dicing.

Thus, in the case of solar cells, in order to perform dicing in a state where the adhesive strength of the adhesive of the dicing tape is weakened as much as possible, the cleaning water is likely to enter between the solar cell and the adhesive of the dicing tape, It is necessary to eliminate as much as possible the decrease in the adhesive strength of the adhesive due to the reaction between the entering cleaning water and the adhesive of the dicing tape.

For these reasons, the dicing apparatus of the present invention can be suitably used for dicing any semiconductor wafer from a general semiconductor wafer to a semiconductor wafer that is vulnerable to stress such as a solar cell. It can be suitably used for dicing.

Further, it is preferable that the inclination angle set at the time of dicing is 10 ° to 350 °.

If the tilt angle is in the range of 10 ° to 350 °, the cleaning solution sprayed on the semiconductor wafer will immediately flow down, and the cleaning solution that remains during dicing will cause the cleaning solution remaining on the dicing sites and ends of the semiconductor wafer. Since the intrusion can be prevented, the adhesive of the dicing tape and the cleaning liquid react to reduce the adhesive strength of the adhesive, so that the semiconductor wafer can be surely removed from the dicing tape and cut out from the semiconductor wafer. It is possible to suppress the protruding semiconductor chip (the semiconductor chip protruding due to peeling off from the dicing tape). Therefore, there is an effect that various problems caused by the penetration of the cleaning liquid do not occur.

In order to make the cleaning liquid flow more easily from the semiconductor wafer, the inclination angle is preferably 20 ° or more and 340 ° or less.

The tilt angle set during dicing is preferably 90 °.

When the tilt angle is 90 °, the direction of gravity drop of the cleaning liquid matches the direction of gravity, and the cleaning liquid stays on the semiconductor wafer less due to surface tension, so that the cleaning liquid flows most efficiently.

As a result, it is possible to reliably prevent the cleaning liquid from entering between the semiconductor wafer and the adhesive of the dicing tape from the dicing part and end of the semiconductor wafer, so that the adhesive of the dicing tape and the cleaning liquid react. As a result, the peeling of the semiconductor wafer from the dicing tape due to the decrease in the adhesive strength of the adhesive can be surely eliminated, and the semiconductor chip cut out from the semiconductor wafer (the semiconductor chip jumping out from the dicing tape) can be removed. Can be suppressed.

The tilt angle set during dicing is preferably 180 °.

That the inclination angle is 180 ° is the structure of the dicing apparatus in which the dicing surface of the semiconductor wafer is directed downward and the dicing blade is directed upward. This shows a structure in which members arranged on the upper surface and the lower surface of a normal dicing apparatus are exchanged.

Therefore, a mechanism for tilting the semiconductor wafer mounting surface of the stage is unnecessary, and in the existing dicing apparatus, it is only necessary to reverse the arrangement of the stage and the dicing blade, so the dicing apparatus can be provided easily and inexpensively. can do.

The drive mechanism for driving the dicing blade is provided at a position off the projection surface of the semiconductor wafer placed on the stage.

Since the projection surface of the semiconductor wafer placed on the stage is also a surface showing a range in which the cleaning liquid falls during dicing, by providing a drive mechanism for driving the dicing blade at a position off the projection surface, Since no cleaning liquid is applied to the drive mechanism, the deterioration due to the cleaning liquid being applied to the drive mechanism is eliminated, and the failure can be reduced.

The cleaning liquid supply mechanism sprays the cleaning liquid from the upper side to the lower side when the tilt angle set during dicing is 10 ° to 90 °, 270 ° to 350 °, and is set during dicing. When the inclination angle is 90 ° to 270 °, it is preferable to spray the cleaning liquid from below to above the dicing site.

According to the above configuration, since the spraying direction of the cleaning liquid sprayed on the semiconductor wafer is changed according to the inclination angle, the cleaning liquid can be sprayed stably on the semiconductor wafer.

For example, when the tilt angle set at the time of dicing is 10 ° to 90 °, 270 ° to 350 °, the stage mounting surface is upward except in the case of 90 ° and 270 °. By spraying the cleaning liquid on the part from the top to the bottom, the cleaning liquid can be efficiently sprayed.

Further, when the tilt angle set at the time of dicing is 90 ° to 270 °, except for the cases of 90 ° and 270 °, the stage mounting surface is directed downward. By spraying the cleaning liquid upward, the cleaning liquid can be efficiently sprayed.

The semiconductor wafer is preferably a semiconductor wafer for solar cells.

According to the dicing apparatus having the above configuration, since stress is not applied to the semiconductor wafer during dicing, the semiconductor wafer for solar cells that is weak against stress and thinned can be appropriately diced. it can.

The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

The present invention can be applied to the semiconductor-related field, and in particular, it can be applied to the solar cell (solar cell) field in which a significant demand increase is expected in the future.

DESCRIPTION OF SYMBOLS 1 Dicing apparatus 1a Dicing apparatus working area top side 1b Dicing apparatus working area bottom side 2 Dicing apparatus 2a Dicing apparatus working area right side 2b Dicing apparatus working area left side 3 Dicing apparatus 3a Dicing apparatus working area top side 3b Dicing Device working area bottom surface side 4 Dicing device 4a Dicing device working area top surface side 4b Dicing device working area side surface side 10 Stage 10a Mounting surface 11 Dicing blade 11a Blade central axis 12 Nozzle (cleaning liquid supply mechanism)
13 Frame 14 Dicing blade holder (drive mechanism)
14a Support bar 15 Dicing tape 16 Semiconductor wafer 20 Stage 20a Mounting surface 21 Dicing blade 21a Blade center shaft 22 Nozzle (cleaning liquid supply mechanism)
23 Frame 24 Dicing blade holder (drive mechanism)
24a Support bar 25 Dicing tape 26 Semiconductor wafer 30 Stage 30a Mounting surface 31 Dicing blade 31a Blade center shaft 32 Nozzle (cleaning liquid supply mechanism)
33 Frame 34 Dicing blade holder (drive mechanism)
34a Support bar 35 Dicing tape 36 Semiconductor wafer 40 Stage 40a Mounting surface 41 Dicing blade 41a Blade center shaft 42 Nozzle (cleaning liquid supply mechanism)
43 Frame 44 Dicing blade holder (drive mechanism)
44a Support bar 45 Dicing tape 100 Working area 200 Working area 300 Working area 400 Working area A Reference horizontal plane B Reference normal plane θ Inclination angle

Claims

A stage on which a semiconductor wafer is fixedly mounted by an adhesive force of a dicing tape adhesive;
A dicing blade whose central axis of rotation is parallel to the semiconductor wafer mounting surface of the stage;
A dicing apparatus having a cleaning liquid supply mechanism for spraying a cleaning liquid on a dicing site when dicing a semiconductor wafer with the dicing blade,
At least during dicing, the semiconductor wafer placement surface of the stage is supported so as to have an inclination angle from a reference horizontal plane perpendicular to the vertical direction, and the inclination angle is sprayed onto the semiconductor wafer placed on the stage. A dicing apparatus characterized in that the dicing apparatus is set at an angle greater than or equal to an angle at which the staying state of the cleaning liquid starts to collapse.
2. The dicing apparatus according to claim 1, wherein the inclination angle set at the time of dicing is 10 ° to 350 °.
3. The dicing apparatus according to claim 2, wherein the inclination angle set at the time of dicing is 90 °.
3. The dicing apparatus according to claim 2, wherein the inclination angle set at the time of dicing is 180 °.
The dicing apparatus according to claim 4, wherein the driving mechanism for driving the dicing blade is provided at a position deviated from a projection surface of the semiconductor wafer placed on the stage.
The cleaning liquid supply mechanism is
When the inclination angle set at the time of dicing is 10 ° to 90 °, 270 ° to 350 °, the cleaning liquid is sprayed from the upper side to the lower side with respect to the dicing part,
3. The dicing apparatus according to claim 2, wherein when the inclination angle set during dicing is 90 ° to 270 °, the cleaning liquid is sprayed from below to above the dicing portion.
The dicing apparatus according to any one of claims 1 to 6, wherein the semiconductor wafer is a semiconductor wafer for a solar cell.
A method of manufacturing a semiconductor device that performs dicing while wiping a cleaning liquid on a semiconductor wafer fixedly mounted by an adhesive force of an adhesive of a dicing tape on a stage,
The semiconductor wafer placement surface of the stage is supported so as to have an inclination angle from a reference horizontal plane perpendicular to the vertical direction, and the inclination angle is a staying state of the cleaning liquid sprayed on the semiconductor wafer placed on the stage The method of manufacturing a semiconductor device, wherein the dicing is performed in a state where the angle is set to be equal to or greater than an angle at which collapse starts.