JPS6427904A - Method and apparatus for dicing - Google Patents

Abstract

PURPOSE:To reduce scattering of cutting scraps falling with washing water and to reduce adhesion of the cut scraps on a wafer, by facing a cut groove forming face of the wafer downward and carrying out dicing by rotating a rotating blade from the bottom of the wafer. CONSTITUTION:A wafer 2 is held under such a condition that the cut groove forming face is faced downward, and dicing is carried out under such a condition that a rotating blade 4 is rotated and washing water is sprayed from a nozzle 7 around the part of the wafer 2 where the cut groove should be formed. Cut scraps produced by dicing are scattered in the opposite direction to the forwarding direction of the rotating blade 4 by the flow of the washing water 8 and the centrifugal force of the rotating blade 4. The cut scraps fall down due to the dead weight but do not fall down on the wafer 2 because the wafer 2 is positioned above the rotating blade 4. Even if the cut scraps with water drops of the washing water adhere on the main surface of the wafer 2, the cut scraps fall down by the dead weight owing to vibration of dicing and so on, and remaining of the cut scraps on the main surface of the wafer 2 is thereby reduced.