WO2013051197A1 - Dispositif d'application de résine et procédé d'application de résine - Google Patents

Dispositif d'application de résine et procédé d'application de résine Download PDF

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Publication number
WO2013051197A1
WO2013051197A1 PCT/JP2012/005759 JP2012005759W WO2013051197A1 WO 2013051197 A1 WO2013051197 A1 WO 2013051197A1 JP 2012005759 W JP2012005759 W JP 2012005759W WO 2013051197 A1 WO2013051197 A1 WO 2013051197A1
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WO
WIPO (PCT)
Prior art keywords
resin
application
coating
light emission
light
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Application number
PCT/JP2012/005759
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English (en)
Japanese (ja)
Inventor
野々村　勝
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パナソニック株式会社
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Publication of WO2013051197A1 publication Critical patent/WO2013051197A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Definitions

  • the present invention relates to a resin coating apparatus and a resin coating method used in an LED package manufacturing system for manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor.
  • LEDs light emitting diodes having excellent characteristics of low power consumption and long life have been widely used as light sources for various lighting devices. Since the basic light emitted from the LED element is currently limited to three colors of red, green, and blue, in order to obtain white light suitable for general lighting applications, the above three basic lights are added.
  • a method of obtaining white light by color mixing, a method of obtaining pseudo white light by combining a blue LED and a phosphor emitting yellow fluorescence having a complementary color relationship with blue are used.
  • the latter method has been widely used, and an illumination device using an LED package in which a blue LED and a YAG phosphor are combined has been used for a backlight of a liquid crystal panel (for example, a patent). Reference 1).
  • YAG phosphor particles are placed in a mounting portion in which YAG phosphor particles are dispersed in the mounting portion.
  • An LED package is configured by injecting dispersed silicone resin, epoxy resin, or the like to form a resin packaging portion. And, for the purpose of uniforming the height of the resin packaging part in the mounting part after the resin injection, a residual resin storage part for discharging and storing the surplus resin injected more than a specified amount from the mounting part is formed.
  • An example is given. As a result, even when the discharge amount from the dispenser varies at the time of resin injection, a resin packaging portion having a certain resin amount and a specified height is formed on the LED element.
  • the LED element has undergone a manufacturing process in which a plurality of elements are formed on the wafer at the same time, and due to various error factors in this manufacturing process, such as non-uniform composition during film formation on the wafer, the wafer state Inevitably, variations in emission wavelength occur in the LED elements divided into individual pieces. And in the above-mentioned example, since the height of the resin wrapping part covering the LED element is set uniformly, the variation in the emission wavelength in the individual LED element is directly reflected in the variation in the emission characteristic of the LED package as a product. As a result, the number of defective products deviating from the acceptable quality range has been inevitably increased.
  • the present invention provides an LED package manufacturing system that makes the light emission characteristics of the LED package uniform even when the light emission wavelengths of the individual LED elements vary, thereby improving the production yield and various color tone adjustments of the light emission colors. It is an object of the present invention to provide a resin coating apparatus and a resin coating method that can perform the above-described process.
  • the resin coating apparatus of the present invention is used in an LED package manufacturing system for manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor, and covers the LED element mounted on the substrate.
  • a resin coating apparatus that coats the resin, wherein the resin coating unit has a plurality of coating nozzles that discharge the resin in a variable amount to apply the resin to any position to be coated, and controls the resin coating unit
  • the application control unit for executing the measurement application process for applying the resin to the translucent member for light emission characteristic measurement and the production application process for applying to the LED element for actual production, and the phosphor is excited.
  • a production execution processing unit for executing a production coating process for coating the LED element with a resin having an appropriate resin coating amount, and the coating control unit has different types of fluorescence depending on the plurality of coating nozzles.
  • the plurality of resins including the body are sequentially trial-applied to the same translucent member for light emission characteristic measurement, and the light emission characteristic measurement unit targets the plurality of resins that have been trial-applied.
  • the application amount derivation processing unit derives the appropriate resin application amount for each of the plurality of resins, and the production execution processing unit determines the appropriate resin for the plurality of derived resins.
  • the plurality of resins are sequentially applied to the same LED element by the plurality of application nozzles.
  • the resin coating method of the present invention is used in an LED package manufacturing system for manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor, and covers the LED element mounted on the substrate.
  • a resin application method for applying the resin wherein the resin is applied to a translucent member as a light emission characteristic test by a resin application part having a plurality of application nozzles that discharge the resin in a variable amount.
  • Light is emitted from an application step, a translucent member placement step of placing the translucent member on which the resin has been trial-applied on the translucent member placement portion, and a light source portion that emits excitation light that excites the phosphor.
  • the excitation light is applied to the resin coated on the translucent member to measure the emission characteristics of the light emitted by the resin, and to the emission characteristic measurement process.
  • An application amount derivation process for deriving an appropriate resin application amount of the resin to be applied to the LED element for actual production based on a measurement result and a predetermined light emission characteristic; and the derived appropriate resin application A production execution step of executing a production coating process for coating the LED element with a resin having an appropriate resin coating amount by commanding an amount to a coating control unit that controls the resin coating unit, and applying the measurement
  • a plurality of the resins containing different kinds of phosphors are sequentially trial-applied to the same light-transmitting member by the plurality of application nozzles, and the plurality of the test-applied resins in the light emission characteristic measurement step
  • the emission characteristics are measured for the application amount, and the appropriate resin application amount is derived for each of the plurality of resins in the application amount derivation processing step.
  • step by commanding the appropriate resin coating
  • a plurality of resins containing different types of phosphors are sequentially trial-coated on the same light-transmitting member.
  • the appropriate resin application amount is derived for each of the plurality of resins on the basis of the measurement results obtained by measuring the light emission characteristics of the plurality of trial-applied resins, and the application control is performed on the appropriate resin application amount for the plurality of derived resins.
  • Explanatory drawing of chromaticity adjustment of the LED package manufactured by the LED package manufacturing system of one embodiment of this invention (A)-(c) is explanatory drawing of a structure and function of the component mounting apparatus in the LED package manufacturing system of one embodiment of this invention
  • (A), (b) is explanatory drawing of a structure and function of the resin coating apparatus in the LED package manufacturing system of one embodiment of this invention
  • (A), (b) is explanatory drawing of the light emission characteristic test
  • the block diagram which shows the structure of the control system of the LED package manufacturing system of one embodiment of this invention Flowchart of LED package manufacturing by LED package manufacturing system of one embodiment of the present invention Flow chart of threshold data creation processing for non-defective product determination in LED package manufacturing system of one embodiment of the present invention (A)-(c) is explanatory drawing of the threshold value data for the quality determination in the LED package manufacturing system of one embodiment of this invention Chromaticity diagram for explaining threshold data for non-defective product determination in the LED package manufacturing system of one embodiment of the present invention
  • coating operation process in the LED package manufacturing process by the LED package manufacturing system of one embodiment of this invention (A)-(d) is explanatory drawing of the resin application
  • the LED package manufacturing system 1 has a function of manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor.
  • the component mounting apparatus M1, the curing apparatus M2, the wire bonding apparatus M3, the resin coating apparatus M4, the curing apparatus M5, and the piece cutting apparatus M6 are connected by the LAN system 2. These devices are connected and controlled by the management computer 3 in an integrated manner.
  • the component mounting apparatus M1 is mounted by bonding the LED element 5 to the substrate 4 (see FIGS. 2A and 2B) serving as the base of the LED package with a resin adhesive.
  • the curing device M2 cures the resin adhesive used for bonding at the time of mounting by heating the substrate 4 after the LED element 5 is mounted.
  • the wire bonding apparatus M3 connects the electrode of the substrate 4 and the electrode of the LED element 5 with a bonding wire.
  • the resin coating device M4 applies a resin containing a phosphor to each LED element 5 on the substrate 4 after wire bonding.
  • the curing device M5 cures the resin applied so as to cover the LED elements 5 by heating the substrate 4 after the resin application.
  • the piece cutting device M6 cuts the substrate 4 after the resin is cured into each individual LED element 5 and divides it into individual LED packages. Thereby, the LED package divided
  • FIG. 1 shows an example in which a production line is configured by arranging each of the component mounting device M1 to the piece cutting device M6 in series.
  • the LED package manufacturing system 1 does not necessarily have such a line configuration.
  • each process work may be sequentially executed by each of the distributed devices.
  • a plasma processing apparatus that performs plasma treatment for electrode cleaning prior to wire bonding before and after the wire bonding apparatus M3, and a surface modification for improving resin adhesion before resin application after wire bonding. You may make it interpose the plasma processing apparatus which performs the plasma processing for the purpose of quality.
  • the substrate 4 is a multiple-type substrate in which a plurality of individual substrates 4a serving as a base of one LED package 50 in a finished product are formed.
  • Each individual substrate 4a includes Each LED mounting portion 4b on which the LED element 5 is mounted is formed.
  • the LED element 5 is mounted in the LED mounting portion 4b for each individual substrate 4a, and then the resin 8 is applied to cover the LED element 5 in the LED mounting portion 4b. Is cut for each individual substrate 4a to complete the LED package 50 shown in FIG.
  • the LED package 50 has a function of irradiating white light used as a light source of various illumination devices, and includes a first phosphor that emits yellow fluorescence that is complementary to the blue LED element 5 and blue.
  • a first phosphor that emits yellow fluorescence that is complementary to the blue LED element 5 and blue.
  • pseudo white light is obtained.
  • a predetermined amount of the second resin 8B including a second phosphor that emits red or green fluorescence is added. Try to mix.
  • warm-colored or cold-colored white light can be generated according to the application and preference of illumination.
  • the individual substrate 4a is provided with a cavity-shaped reflecting portion 4c having, for example, a circular or elliptical annular bank that forms the LED mounting portion 4b.
  • the N-type part electrode 6a and the P-type part electrode 6b of the LED element 5 mounted inside the reflection part 4c are connected to the wiring layers 4e and 4d formed on the upper surface of the individual substrate 4a by bonding wires 7, respectively.
  • the first resin 8A and the second resin 8B cover the LED element 5 in this state and are sequentially applied to the inner side of the reflecting portion 4c with a predetermined thickness.
  • the first phosphor included in the first resin 8A emits light. Red or green and blue light emitted from yellow and the second phosphor contained in the second resin 8B are mixed and irradiated as white light.
  • resin 8 when “resin 8” is simply described, it means the generic name of the first resin 8A and the second resin 8B or a mixture thereof.
  • the LED element 5 is configured by stacking an N-type semiconductor 5b and a P-type semiconductor 5c on a sapphire substrate 5a, and further covering the surface of the P-type semiconductor 5c with a transparent electrode 5d.
  • An N-type part electrode 6a and a P-type part electrode 6b for external connection are formed on the N-type semiconductor 5b and the P-type semiconductor 5c, respectively.
  • the LED elements 5 are taken out from the LED wafer 10 that is stuck and held on the holding sheet 10a in a state where a plurality of LED elements 5 are formed in a lump and then divided into pieces.
  • the LED element 5 is divided into individual pieces from the wafer state due to various error factors in the manufacturing process, for example, non-uniform composition during film formation on the wafer. It is inevitable that variations occur in the case. If such an LED element 5 is mounted on the substrate 4 as it is, the emission characteristics of the LED package 50 as a product will vary.
  • the light emission characteristics of a plurality of LED elements 5 manufactured in the same manufacturing process are measured in advance, Element characteristic information corresponding to data indicating the light emission characteristics of the LED elements 5 is created, and an appropriate amount of the resin 8 corresponding to the light emission characteristics of each LED element 5 is applied in the application of the resin 8. .
  • resin application information to be described later is prepared in advance.
  • the LED elements 5 taken out from the LED wafer 10 are individually identified by element IDs (in this case, the individual LED elements 5 with the serial number (i) in the LED wafer 10). Are given sequentially to the light emission characteristic measuring device 11.
  • element ID if it is the information which can specify the LED element 5 separately, you may make it use the matrix coordinate which shows the arrangement
  • the LED element 5 can be supplied in the state of the LED wafer 10 in the component mounting apparatus M1 described later.
  • the light emission characteristic measuring device 11 power is actually supplied to each LED element 5 through a probe to actually emit light, and the light is spectrally analyzed to measure predetermined items such as a light emission wavelength and light emission intensity.
  • a standard distribution of emission wavelengths is prepared as reference data in advance, and the wavelength range corresponding to the standard range in the distribution is further divided into a plurality of wavelength ranges.
  • the plurality of target LED elements 5 are ranked according to the emission wavelength.
  • Bin codes [1], [2], [3], [4], [5] are assigned in order from the low wavelength side corresponding to each of the ranks set by dividing the wavelength range into five. ] Is given.
  • element characteristic information 12 having a data structure in which the Bin code 12b is associated with the element ID 12a is created.
  • the element characteristic information 12 is information obtained by individually measuring the light emission characteristics including the light emission wavelengths of the plurality of LED elements 5 in advance.
  • the element characteristic information 12 is prepared in advance by an LED element manufacturer or the like and is used for the LED package manufacturing system 1. Is transmitted.
  • the element characteristic information 12 may be transmitted in a form recorded on a single storage medium, or may be transmitted to the management computer 3 via the LAN system 2. In any case, the transmitted element characteristic information 12 is stored in the management computer 3 and provided to the component mounting apparatus M1 as necessary.
  • the plurality of LED elements 5 for which the light emission characteristic measurement is completed in this way are sorted for each characteristic rank as shown in FIG. 3D, and are distributed into five types according to each characteristic rank. Attached individually to 13a. Thereby, the three types of LED sheets 13A, 13B in which the LED elements 5 corresponding to the Bin codes [1], [2], [3], [4], and [5] are adhered and held on the adhesive sheet 13a, respectively. 13C, 13D, and 13E are created, and when these LED elements 5 are mounted on the individual substrate 4a of the substrate 4, the LED elements 5 are already classified into LED sheets 13A, 13B, 13C, and 13D. , 13E in the form of the component mounting apparatus M1.
  • the LED elements 5 corresponding to any of the Bin codes [1], [2], [3], [4], and [5] are held in the LED sheets 13A, 13B, 13C, 13D, and 13E, respectively.
  • the element characteristic information 12 is provided from the management computer 3 in a form indicating whether or not it has been.
  • the LED element 5 emits light.
  • Additive mixing of blue light with yellow light that is emitted when the first phosphor is excited by the blue light and red light or green light that is emitted when the second phosphor is excited is performed.
  • the amount of the particles of the first phosphor and the second phosphor in the concave LED mounting portion 4b on which the LED element 5 is mounted is important for ensuring the normal light emission characteristics of the LED package 50 of the product. Become an element.
  • the appropriate amount of the phosphor particles in the resin 8 applied to cover the LED element 5 differs depending on the Bin codes [1], [2], [3], [4], and [5]. It will be a thing.
  • the resin application information 14 prepared in the present embodiment as shown in FIG. 4, the first resin 8A and the first resin in which the particles of the first phosphor and the second phosphor are contained in the silicone resin and the epoxy resin, respectively.
  • the appropriate resin application amount for each Bin classification of the two resins 8B is defined in advance in units of nl (nanoliter) according to the Bin code classification 17. That is, when the LED resin 5 is covered and the first resin 8A and the second resin 8B are accurately applied by the appropriate resin application amount indicated by the resin application information 14, the amount of phosphor particles in the resin covering the LED element 5 Becomes an appropriate supply amount of the phosphor particles, thereby ensuring a regular emission wavelength required for the finished product after the resin 8 is thermally cured.
  • the resin application information 14 is configured in the form of a plurality of data tables corresponding to different appropriate resin application amounts.
  • the ratio of the first phosphor that is the main component that emits white light in the component ratio of the phosphor in the resin 8 is larger than the ratio of the second phosphor, the second fluorescence as a minor component.
  • a data table in which the amount of body particles is fixed to a specific value is created for each of a plurality of specific values.
  • the particle amount of the second phosphor is defined by the concentration (%) of the second phosphor and the resin application amount of the second resin 8B containing the second phosphor.
  • the specific value of the second phosphor particle amount is fixed in a plurality of ways of Q1, Q2, and Q3, and the appropriate resin application when the second phosphor particle amount is Q1, Q2, and Q3, respectively.
  • the quantities 15 (1), 15 (2) and 15 (3) are defined.
  • the appropriate resin application amount 15 (1) corresponds to the phosphor concentration column 16 (1).
  • the phosphor in the first resin 8A corresponds to one specific value Q1 of the particle amount of the second phosphor.
  • the first phosphor concentration indicating the concentration of particles is set to a plurality of levels (here, D11 (5%), D12 (10%), D13 (15%)), and the appropriate resin coating amount of the first resin 8A Also, different numerical values are used according to the respective first phosphor concentrations.
  • the appropriate resin application amounts VA0, VB0, Bin codes [1], [2], [3], [4], and [5], respectively.
  • the first resin 8A of VC0, VD0, VE0 (appropriate resin application amount 15 (11)) is applied.
  • the appropriate resin application amounts VF0, VG0, VH0 for the Bin codes [1], [2], [3], [4], and [5], respectively.
  • VJ0, VK0 appropriate resin application amount 15 (12) of the first resin 8A is applied.
  • the first resin 8A of VN0, VP0, VR0 (appropriate resin application amount 15 (13)) is applied.
  • the appropriate resin application amount is set for each of the plurality of different first phosphor concentrations as described above in order to ensure quality by applying a resin having an optimum phosphor concentration according to the degree of variation in the emission wavelength. It is because it is more preferable.
  • the color tone of the illumination light emitted from the LED package 50 can be adjusted by changing the particle amount of the second phosphor in the resin 8. That is, in the chromaticity diagram of FIG. 5, the broken line L1 indicates the color tone when only the phosphor that emits yellow excitation light is used, and the corresponding chromaticity range of the white portion at the center is the standard white light range. Used as
  • the amount of the second phosphor particles corresponding to the desired color tone is estimated. Then, the second phosphor particle amounts Q1, Q2, and Q3 that are closest to the estimated value are selected, and a data table corresponding to the selected second phosphor particle amount is used. For example, if the second phosphor particle amount Q1 is selected, the first phosphor concentration column 16 (1) and the appropriate resin coating amount 15 (1) are used.
  • the component mounting apparatus M1 includes a board transfer mechanism 21 that transfers the work target board 4 supplied from the upstream side in the board transfer direction (arrow a).
  • the substrate transport mechanism 21 is provided with an adhesive application part A shown in section AA in FIG. 6B and a component mounting part B shown in section BB in FIG. 6C. It is installed.
  • the adhesive application unit A is disposed on the side of the substrate transport mechanism 21 and supplies the resin adhesive 23 in the form of a coating film having a predetermined film thickness, and the substrate transport mechanism 21 and the adhesive supply unit 22.
  • the component mounting part B is disposed on the side of the board transport mechanism 21 and has the parts supply mechanism 25 and the board transport mechanism 21 that hold the LED sheets 13A, 13B, 13C, 13D, and 13E shown in FIG.
  • a component mounting mechanism 26 that is movable in the horizontal direction (arrow c) above the supply mechanism 25 is provided.
  • the substrate 4 carried into the substrate transport mechanism 21 is positioned by the adhesive application portion A, and is bonded to the LED mounting portion 4b formed on each individual substrate 4a.
  • the agent 23 is applied. That is, first, the adhesive transfer mechanism 24 is moved above the adhesive supply unit 22 so that the transfer pin 24a is brought into contact with the coating film of the resin adhesive 23 formed on the transfer surface 22a, and the resin adhesive 23 is adhered. Next, the adhesive transfer mechanism 24 is moved above the substrate 4 and the transfer pin 24a is lowered to the LED mounting portion 4b (arrow d), whereby the resin adhesive 23 attached to the transfer pin 24a is moved into the LED mounting portion 4b. It is supplied by transfer to the element mounting position.
  • the substrate 4 after application of the adhesive is conveyed to the downstream side, positioned at the component mounting part B as shown in FIG. 6 (c), and the LED elements are targeted for each LED mounting part 4b after the adhesive is supplied.
  • 5 is implemented. That is, first, the component mounting mechanism 26 is moved above the component supply mechanism 25, and the mounting nozzle 26a is lowered with respect to any of the LED sheets 13A, 13B, 13C, 13D, and 13E held by the component supply mechanism 25, and mounted. The LED element 5 is held and taken out by the nozzle 26a.
  • the component mounting mechanism 26 is moved above the LED mounting portion 4b of the substrate 4 to lower the mounting nozzle 26a (arrow e), whereby the LED element 5 held by the mounting nozzle 26a is bonded to the adhesive in the LED mounting portion 4b. It is mounted at the element mounting position where is applied.
  • any one of the LED sheets 13A, 13B, 13C, 13D, and 13E can be used in an individual mounting operation by the component mounting program 26, that is, the component mounting mechanism 26.
  • the order in which the LED elements 5 are taken out and mounted on the plurality of individual boards 4a of the board 4 is set in advance, and the component mounting work is executed according to this element mounting program.
  • mounting position information 71a (see FIG. 12) indicating which of the plurality of individual boards 4a of the board 4 is mounted from the work execution history is extracted. Record.
  • the mounting position information 71a and the LED element 5 mounted on each individual substrate 4a correspond to any characteristic rank (Bin code [1], [2], [3], [4], [5]).
  • Data associated with the element characteristic information 12 indicating whether or not to be created is created as map data 18 shown in FIG. 7 by the map creation processing unit 74 (see FIG. 12).
  • the individual positions of the plurality of individual substrates 4a of the substrate 4 are specified by combinations of matrix coordinates 19X and 19Y indicating the positions in the X direction and the Y direction, respectively. Then, by making the Bin code to which the LED element 5 mounted at the position belongs correspond to the individual cell of the matrix constituted by the matrix coordinates 19X and 19Y, the LED element 5 mounted by the component mounting apparatus M1 on the substrate 4 Map data 18 in which the mounting position information 71a indicating the position and the element characteristic information 12 about the LED element 5 are associated is created.
  • the component mounting apparatus M1 displays the map data 18 in which the mounting position information indicating the position of the LED element 5 mounted by the apparatus on the board 4 and the element characteristic information 12 on the LED element 5 are associated with the board 4
  • a map creation processing unit 74 is provided as map data creation means to be created every time.
  • the created map data 18 is transmitted as feedforward data to the resin coating apparatus M4 described below via the LAN system 2.
  • the resin coating device M4 has a function of coating the resin 8 so as to cover the plurality of LED elements 5 mounted on the substrate 4 by the component mounting device M1.
  • the resin coating apparatus M4 transfers the work target substrate 4 supplied from the upstream side to the substrate transport mechanism 31 that transports the substrate 4 in the substrate transport direction (arrow f). ) Is provided with a resin coating portion C shown in the CC cross section.
  • the resin application part C is provided with a resin discharge head 32 having a configuration including a plurality (two in this case) of dispensers 33A and 33B for discharging the resin 8 from the application nozzle 33a mounted at the lower end.
  • the dispensers 33A and 33B can be raised and lowered individually.
  • the resin discharge head 32 is driven by the nozzle moving mechanism 34, and the nozzle moving mechanism 34 is controlled by the application control unit 36, whereby the horizontal direction (arrow g shown in FIG. 8A). ) Move and lift operations.
  • the syringes attached to the dispensers 33A and 33B of the resin discharge head 32 contain the first resin 8A and the second resin 8B, respectively, and by applying air pressure into the dispensers 33A and 33B by the resin discharge mechanism 35.
  • the first resin 8A and the second resin 8B in the dispensers 33A and 33B are discharged through the application nozzle 33a and applied to the LED mounting portion 4b formed on the substrate 4.
  • the resin application part C is configured to include a plurality of application nozzles 33a that apply the first resin 8A and the second resin 8B in variable application amounts and apply them to any application target position.
  • various liquid discharge methods such as a plunger method using a mechanical cylinder and a screw pump method can be adopted for the resin discharge mechanism 35.
  • a test hitting / measurement unit 40 is disposed on the side of the substrate transport mechanism 31 so as to be located within the movement range of the resin discharge head 32.
  • the trial placement / measurement unit 40 Prior to the actual production application operation in which the first resin 8A and the second resin 8B are applied to the LED mounting portion 4b of the substrate 4, the trial placement / measurement unit 40 has the application amounts of the first resin 8A and the second resin 8B. It has a function of determining whether or not it is appropriate by measuring the light emission characteristics of the test-applied resin 8.
  • the light emission characteristics when the light emitted from the measurement light source section 45 is applied to the light transmitting member 43 on which the first resin 8A and the second resin 8B have been trial-applied by the resin application section C are measured using the spectroscope 42 and the light emission characteristics measurement. Measurement is performed by a light emission characteristic measuring unit provided with the processing unit 39, and the measurement result is compared with a preset threshold value, so that the preset resin application amount defined by the resin application information 14 shown in FIG. Judge the suitability.
  • the light emission characteristics are measured after the trial application of the first resin 8A and the second resin 8B of different fluorescent colors, but the first resin 8A and the second resin 8B are You may make it determine the suitability of the resin application quantity by measuring the light emission characteristic individually as each object.
  • the composition and properties of the first resin 8A and the second resin 8B containing the phosphor particles are not necessarily stable, and even if the appropriate resin application amount is set in advance in the resin application information 14, It is inevitable that the concentration of the phosphor and the resin viscosity fluctuate. For this reason, even if the first resin 8A and the second resin 8B are discharged with the discharge parameters corresponding to the preset appropriate resin application amount, the resin application amount itself may vary from the preset appropriate value, or even the resin application Even if the amount is appropriate, the supply amount of the phosphor particles to be originally supplied varies depending on the concentration change.
  • a test coating for inspecting whether or not an appropriate supply amount of phosphor particles is supplied at a predetermined interval is executed by the resin coating apparatus M4.
  • the resin coating unit C provided in the resin coating apparatus M4 shown in the present embodiment includes a measurement coating process for applying the resin 8 to the light-transmitting member 43 for the above-described light emission characteristic measurement, and a substrate for actual production. 4 has a function of executing a production coating process to be applied to the LED element 5 mounted in the state 4. Both the coating process for measurement and the coating process for production are executed when the coating control unit 36 controls the resin coating unit C.
  • the translucent member 43 is wound and supplied on the supply reel 47 and fed along the upper surface of the trial hitting stage 40a, and then irradiated with the translucent member mounting portion 41. It is wound around a collection reel 48 driven by a take-up motor 49 via a portion 46.
  • a mechanism for rotating the translucent member 43 various methods such as a method of feeding the translucent member 43 into the collection box by a feeding mechanism are adopted in addition to a method of winding the translucent member 43 to collect it. be able to.
  • the irradiation unit 46 has a function of irradiating the translucent member 43 with measurement light emitted from the light source unit 45, and the measurement light emitted from the light source unit 45 is contained in a light shielding box 46a having a simple dark box function.
  • a light focusing tool 46b guided by a fiber cable is provided.
  • the light source unit 45 has a function of emitting excitation light that excites the phosphor contained in the resin 8.
  • the light source unit 45 is disposed above the translucent member mounting unit 41 and transmits measurement light.
  • the light member 43 is irradiated from above via the light focusing tool 46b.
  • the translucent member 43 a flat sheet-like member made of transparent resin is used as a tape material having a predetermined width, or an embossed portion corresponding to the concave shape of the LED package 50 is provided on the lower surface of the same tape material. Embossed type is used.
  • the resin 8 is trial-applied to the translucent member 43 by the resin ejection head 32. This trial application is performed by discharging a predetermined amount of resin 8 to the translucent member 43 by the application nozzle 33a with respect to the translucent member 43 whose lower surface is supported by the trial hitting stage 40a.
  • the resin 8 applied in the test hitting stage 40a is a test application for empirically determining whether or not the phosphor supply amount is appropriate for the target LED element 5.
  • the resin 8 is continuously applied to the plurality of points on the translucent member 43 by the same trial application operation by the resin discharge head 32. Therefore, when the resin 8 is continuously applied to the plurality of points on the translucent member 43 by the same trial application operation by the resin discharge head 32, the correlation between the measured light emission characteristic value and the application amount is known. Based on the data, the application amount is varied in stages and applied.
  • FIG. 9C shows the structure of the translucent member mounting portion 41 and the integrating sphere 44.
  • the translucent member mounting portion 41 has a structure in which an upper guide member 41 c having a function of guiding both end surfaces of the translucent member 43 is mounted on the upper surface of the lower support member 41 b that supports the lower surface of the translucent member 43. Yes.
  • the translucent member placement section 41 guides the translucent member 43 during conveyance in the test hitting / measurement unit 40, and places the translucent member 43 on which the resin 8 has been trial-applied in the measurement coating process to hold the position. It has a function to do.
  • the integrating sphere 44 has a function of collecting the transmitted light that has been irradiated from the light focusing tool 46 b (arrow h) and transmitted through the resin 8 and led to the spectroscope 42. That is, the integrating sphere 44 has a spherical spherical reflecting surface 44 c inside, and transmitted light (arrow i) incident from the opening 44 a located immediately below the light transmitting opening 41 a is the top of the integrating sphere 44.
  • the white light emitted by the LED package used for the light source unit 45 is applied to the resin 8 that has been trial-applied to the translucent member 43.
  • the blue light component contained in the white light excites the phosphor in the resin 8 to emit yellow light, red light or green light.
  • White light obtained by adding and mixing yellow light and blue light is irradiated upward from the resin 8 and is received by the spectroscope 42 via the integrating sphere 44 described above.
  • the received white light is analyzed by the light emission characteristic measurement processing unit 39 to measure the light emission characteristic, as shown in FIG. 8B.
  • the light emission characteristics such as the color tone rank of white light and the luminous flux are inspected, and a deviation from the prescribed light emission characteristics is detected as the inspection result.
  • the integrating sphere 44, the spectroscope 42, and the light emission characteristic measurement processing unit 39 emit excitation light emitted from the light source unit 45 to the resin 8 applied to the light transmitting member 43 (here, blue light extracted by the white LED). Is emitted from above, the light emitted from the resin 8 is received from below the translucent member 43, and a light emission characteristic measuring unit for measuring the light emission characteristic of the light emitted from the resin 8 is configured.
  • the light emission characteristic measuring unit is configured by disposing the integrating sphere 44 below the translucent member 43, and configured to receive light emitted from the resin 8 through the opening 44a of the integrating sphere 44. Has been.
  • the following effects can be obtained by configuring the light emission characteristic measuring unit as described above. That is, in the application shape of the resin 8 that is trial-applied to the light transmissive member 43 shown in FIG. 9B, the lower surface side is always in contact with the upper surface of the light transmissive member 43 or the bottom surface of the embossed portion 43a.
  • the lower surface of 8 is always at a reference height defined by the translucent member 43. Therefore, the height difference between the lower surface of the resin 8 and the opening 44a of the integrating sphere 44 is always kept constant.
  • the upper surface of the resin 8 does not necessarily realize the same liquid surface shape and height due to disturbances such as application conditions by the application nozzle 33a, and the gap between the upper surface of the resin 8 and the light focusing tool 46b. The interval of will vary.
  • the irradiation light irradiated on the resin 8 is the light focusing tool 46b. Therefore, the degree of focusing is high, and the influence of the variation in the distance between the upper surface of the resin 8 and the light focusing tool 46b on the light transmission can be ignored.
  • the transmitted light that has passed through the resin 8 is excitation light in which the phosphor is excited inside the resin 8, so that the degree of scattering is high, and the distance between the lower surface of the resin 8 and the opening 44 a varies. Has an influence on the degree of light being taken in by the integrating sphere 44.
  • the light emitted from the resin 8 is transmitted by irradiating the resin 8 with the excitation light emitted from the light source unit 45 as described above. Since the configuration in which light is received by the integrating sphere 44 from below the optical member 43 is employed, it is possible to determine stable light emission characteristics. Further, by using the integrating sphere 44, it is not necessary to separately provide a dark room structure in the light receiving portion, so that the apparatus can be made compact and the equipment cost can be reduced.
  • the measurement result of the light emission characteristic measurement processing unit 39 is sent to the application amount derivation processing unit 38, and the application amount derivation processing unit 38 defines in advance the measurement result of the light emission characteristic measurement processing unit 39.
  • a deviation from the emitted light emission characteristic is obtained, and a process for deriving an appropriate resin application amount of the resin 8 to be applied to the LED element 5 for actual production is performed based on the deviation.
  • the new appropriate discharge amount derived by the application amount derivation processing unit 38 is sent to the production execution processing unit 37, and the production execution processing unit 37 commands the newly derived appropriate resin application amount to the application control unit 36.
  • the application control unit 36 controls the nozzle moving mechanism 34 and the resin discharge mechanism 35 to perform a production application process for applying an appropriate resin application amount of the resin 8 to the LED elements 5 mounted on the substrate 4. 32.
  • a resin 8 having an appropriate resin coating amount specified in the resin coating information 14 is actually applied, and light emission characteristics are measured while the resin 8 is uncured. Then, based on the obtained measurement results, a non-defective range of emission characteristic measurement values when the emission characteristics are measured for the resin 8 applied in the production coating is set, and the non-defective range is determined for the quality determination in the production coating. It is used as a threshold value (see threshold value data 81a shown in FIG. 12).
  • a white LED is used as the light source unit 45 for measuring the light emission characteristics, and is prescribed in advance as a basis for setting a threshold value for quality determination in production coating.
  • the regular emission characteristics required for the finished product in which the resin 8 applied to the LED element 5 is cured are biased by the difference in emission characteristics due to the resin 8 being in an uncured state. Emission characteristics are used. Thereby, control of the resin application amount in the resin application process to the LED element 5 can be performed based on the normal light emission characteristics of the finished product.
  • the LED package 50 that emits white light is used as the light source unit 45.
  • the light emission characteristic measurement of the resin 8 applied by trial can be performed by the light having the same characteristic as the excitation light emitted in the finished LED package 50, and a more reliable test result can be obtained.
  • a light source device that can stably emit blue light having a constant wavelength for example, a blue LED that emits blue light or a blue laser light source
  • a light source unit for inspection for example, a blue LED that emits blue light or a blue laser light source
  • blue light having a predetermined wavelength may be extracted using a band-pass filter.
  • a test hit / measure unit 140 having the configuration shown in FIGS. 10A, 10B, 11A, and 11B may be used. . That is, as shown in FIGS. 10 (a), 10 (b), 11 (a), and 11 (b), the test hitting / measuring unit 140 has a cover portion 140b disposed above an elongated horizontal base portion 140a. It has an external structure. The cover part 140b is provided with an opening part 140c, and the opening part 140c can be freely opened and closed by a sliding slide window 140d for application (arrow l).
  • a trial hitting stage 145a for supporting the translucent member 43 from the lower surface side, a translucent member mounting portion 141 on which the translucent member 43 is placed, and a translucent member mounting portion 141.
  • a spectroscope 42 is provided above.
  • the translucent member mounting unit 141 includes a light source device that emits excitation light that excites the phosphor. Exciting light is irradiated from the lower surface side of the light source device to the translucent member 43 on which is applied by trial.
  • the translucent member 43 is wound and supplied on the supply reel 47 in the same manner as in the example shown in FIGS. 9A to 9C, and is sent along the upper surface of the test strike stage 145a (arrow m). Then, the light is wound around a collection reel 48 driven by a winding motor 49 via a space between the translucent member mounting portion 141 and the spectroscope 42.
  • FIG. 11B the translucent member 43 on which the resin 8 has been trial-applied is moved by the trial hitting stage 145a so that the resin 8 is positioned above the translucent member mounting portion 141, and the cover portion 140b is further moved.
  • a state in which a darkroom for measuring light emission characteristics is formed between the base 140a and the base 140a is shown.
  • An LED package 50 that emits white light is used as the light source device for the translucent member mounting portion 141.
  • the wiring layers 4e and 4d connected to the LED element 5 are connected to the power supply device 142.
  • the power supply device 142 When the power supply device 142 is turned on, the LED element 5 is supplied with power for light emission.
  • the LED package 50 emits white light.
  • the yellow light emitted from the phosphor in the resin 8 is excited by the blue light contained in the white light.
  • White light in which light and blue light are added and mixed is irradiated upward from the resin 8.
  • a spectroscope 42 is disposed above the trial hitting / measurement unit 140, and the white light emitted from the resin 8 is received by the spectroscope 42, and the received white light is analyzed by the light emission characteristic measurement processing unit 39. The emission characteristics are measured.
  • the light emission characteristic measurement processing unit 39 measures the light emission characteristic of the light emitted by the resin 8 by irradiating the resin 8 applied to the light transmitting member 43 with the excitation light emitted from the LED element 5 as the light source part. . Then, the measurement result of the light emission characteristic measurement processing unit 39 is sent to the coating amount derivation processing unit 38, and the same processing as the example shown in FIGS. 8A and 8B is executed.
  • the configuration of the control system of the LED package manufacturing system 1 will be described with reference to FIG.
  • the component mounting device M1 and the resin coating device M4 the element characteristic information 12, the resin coating information 14, the map data 18, and the above-mentioned
  • the components related to the transmission / reception and update processing of the threshold data 81a are shown.
  • the management computer 3 includes a system control unit 60, a storage unit 61, and a communication unit 62.
  • the system control unit 60 controls the LED package manufacturing work by the LED package manufacturing system 1 in an integrated manner.
  • the storage unit 61 stores element characteristic information 12, resin application information 14, and map data 18 and threshold data 81a as necessary. ing.
  • the communication unit 62 is connected to other devices via the LAN system 2 and exchanges control signals and data.
  • the element characteristic information 12 and the resin application information 14 are transmitted from the outside via the LAN system 2 and the communication unit 62 or via a single storage medium such as a CD ROM, USB memory storage, SD card, and stored in the storage unit 61. Is done.
  • the component mounting apparatus M1 includes a mounting control unit 70, a storage unit 71, a communication unit 72, a mechanism driving unit 73, and a map creation processing unit 74.
  • the mounting control unit 70 controls each unit described below based on various programs and data stored in the storage unit 71 in order to execute a component mounting operation by the component mounting apparatus M1.
  • the storage unit 71 stores mounting position information 71 a and element characteristic information 12 in addition to programs and data necessary for control processing by the mounting control unit 70.
  • the mounting position information 71 a is created from execution history data of mounting operation control by the mounting control unit 70.
  • the element characteristic information 12 is transmitted from the management computer 3 via the LAN system 2.
  • the communication unit 72 is connected to other devices via the LAN system 2 and exchanges control signals and data.
  • the mechanism driving unit 73 is controlled by the mounting control unit 70 to drive the component supply mechanism 25 and the component mounting mechanism 26.
  • the map creation processing unit 74 includes mounting position information 71a indicating the position of the LED element 5 on the substrate 4 stored in the storage unit 71 and mounted by the component mounting apparatus M1, and an element for the LED element 5 A process of creating the map data 18 associated with the characteristic information 12 for each substrate 4 is performed. That is, the map data creating means is provided in the component mounting apparatus M1, and the map data 18 is transmitted from the component mounting apparatus M1 to the resin coating apparatus M4. The map data 18 may be transmitted from the component mounting apparatus M1 to the resin coating apparatus M4 via the management computer 3. In this case, the map data 18 is also stored in the storage unit 61 of the management computer 3 as shown in FIG.
  • the resin coating apparatus M4 includes a coating control unit 36, a storage unit 81, a communication unit 82, a production execution processing unit 37, a coating amount derivation processing unit 38, and a light emission characteristic measurement processing unit 39.
  • the application control unit 36 controls the nozzle moving mechanism 34, the resin discharge mechanism 35, and the test hitting / measurement unit 40 constituting the resin application unit C, so that the resin 8 is applied to the translucent member 43 for light emission characteristic measurement.
  • the measurement coating process to be performed and the production coating process to be applied to the LED element 5 for actual production are performed.
  • the application control unit 36 uses the application nozzles 33a of the dispensers 33A and 33B in the measurement application process, and the first and second resins 8A and 8B including the first and second phosphors of different types. Are sequentially applied to the same translucent member 43 for light emission characteristic measurement.
  • the storage unit 81 stores programs and data necessary for control processing by the application control unit 36, as well as resin application information 14, map data 18, threshold data 81a, and actual production application amount 81b.
  • the resin application information 14 is transmitted from the management computer 3 via the LAN system 2, and the map data 18 is similarly transmitted from the component mounting apparatus M1 via the LAN system 2.
  • the communication unit 82 is connected to other devices via the LAN system 2 and exchanges control signals and data.
  • the light emission characteristic measurement processing unit 39 irradiates the excitation light emitted from the light source unit 45 to the plurality of resins 8 (first resin 8A and second resin 8B) applied on the translucent member 43 by trial.
  • a process for measuring light emission characteristics of a resin is performed.
  • the application amount derivation processing unit 38 obtains a deviation between the measurement result of the light emission characteristic measurement processing unit 39 and a predetermined light emission characteristic, and based on this deviation, the first resin to be applied to the LED element 5 for actual production.
  • a calculation process for deriving the appropriate resin application amount of 8A and the second resin 8B is performed.
  • the production execution processing unit 37 instructs the application control unit 36 to specify the appropriate resin application amounts for the first resin 8A and the second resin 8B derived by the application amount derivation processing unit 38, whereby each of the dispensers 33A and 33B.
  • the application nozzle 33a With the application nozzle 33a, a production application process for applying the first resin 8A and the second resin 8B in appropriate amounts to the same LED element 5 in sequence is executed.
  • a processing function other than the function for executing the work operation unique to each apparatus for example, the function of the map creation processing unit 74 provided in the component mounting apparatus M1, and the resin coating apparatus M4 are provided.
  • the function of the applied amount derivation processing unit 38 is not necessarily attached to the apparatus.
  • the functions of the map creation processing unit 74 and the coating amount derivation processing unit 38 are covered by the arithmetic processing function of the system control unit 60 of the management computer 3 and necessary signal exchange is performed via the LAN system 2. It may be configured.
  • both the component mounting apparatus M1 and the resin coating apparatus M4 are connected to the LAN system 2. Then, the management computer 3 and the LAN system 2 in which the element characteristic information 12 is stored in the storage unit 61 uses the information obtained by separately measuring the emission characteristics including the emission wavelengths of the plurality of LED elements 5 in advance as the element characteristic information. 12 is element characteristic information providing means provided to the component mounting apparatus M1.
  • the element characteristic information providing means for providing the element characteristic information 12 to the component mounting apparatus M1 and the resin information providing means for providing the resin coating information 14 to the resin coating apparatus M4 are the storage unit 61 of the management computer 3 which is an external storage means.
  • the element characteristic information and the resin application information read out are transmitted to the component mounting apparatus M1 and the resin application apparatus M4 via the LAN system 2, respectively.
  • element characteristic information 12 and resin application information 14 are acquired (ST1). That is, the first resin 8A and the second resin 8A for obtaining the LED package 50 having the element characteristic information 12 obtained by individually measuring the emission characteristics including the emission wavelengths of the plurality of LED elements 5 in advance and the prescribed emission characteristics.
  • the resin application information 14 that associates the appropriate resin application amount of the resin 8B with the element characteristic information 12 is acquired from the external device via the LAN system 2 or via a storage medium.
  • the second phosphor particle amount corresponding to the color tone required for the LED package 50 to be manufactured is first selected, and a data table corresponding to the selected second phosphor particle amount is acquired.
  • the board 4 to be mounted is carried into the component mounting apparatus M1 (ST2).
  • the resin adhesive 23 is supplied to the element mounting position in the LED mounting portion 4b by raising and lowering the transfer pin 24a of the adhesive transfer mechanism 24 (arrow n).
  • the LED element 5 held by the mounting nozzle 26a of the component mounting mechanism 26 is lowered (arrow o) and mounted in the LED mounting portion 4b of the substrate 4 via the resin adhesive 23 ( ST3).
  • the map creation processing unit 74 creates map data 18 that associates the mounting position information 71a with the element characteristic information 12 of each LED element 5 for the board 4 from the execution data of the component mounting work (ST4). ).
  • the map data 18 is transmitted from the component mounting apparatus M1 to the resin coating apparatus M4, and the resin coating information 14 is transmitted from the management computer 3 to the resin coating apparatus M4 (ST5). Thereby, it will be in the state which can perform the resin coating operation
  • the substrate 4 after component mounting is sent to the curing device M2, where it is heated, whereby as shown in FIG. 19 (c), the resin adhesive 23 is thermoset to become a resin adhesive 23 *.
  • the LED element 5 is fixed to the individual substrate 4a.
  • the substrate 4 after resin curing is sent to the wire bonding apparatus M3, and as shown in FIG. 19D, the wiring layers 4e and 4d of the individual substrate 4a are respectively connected to the N-type portion electrodes 6a and P of the LED element 5.
  • the mold part electrode 6 b is connected to the bonding wire 7.
  • threshold data creation processing for non-defective product determination is executed (ST6). This process is executed in order to set a pass / fail judgment threshold value in production coating (see threshold value data 81a shown in FIG. 12). Bin codes [1], [2], [3 ], [4], and [5] are repeatedly executed for each of the production coatings. Details of the threshold data creation processing will be described with reference to FIGS. 14, 15A to 15C, and FIG. In FIG. 14, first, the first resin 8A containing the first phosphor at a genuine concentration specified in the data table corresponding to the second phosphor particle amount selected in the resin application information 14, the selected second phosphor particle amount. A second resin 8B containing a concentration capable of supplying is prepared (ST11).
  • the resin discharge head 32 is moved to the test hitting stage 40a of the test hitting / measurement unit 40, and the first resin 8A
  • the second resin 8B is sequentially applied to the translucent member 43 at the specified application amount (appropriate resin application amount) shown in the resin application information 14 (ST12).
  • the prescribed coating amount of the second resin 8B is calculated from the selected second phosphor particle amount and the phosphor concentration of the prepared second resin 8B.
  • the resin 8 applied to the translucent member 43 is moved onto the translucent member mounting portion 41, the LED element 5 is caused to emit light, and the light emission characteristics in an uncured state of the resin 8 are measured by the light emission characteristic measuring section having the above-described configuration. Measure (ST13). Then, based on the light emission characteristic measurement value 39a which is the measurement result of the light emission characteristic measured by the light emission characteristic measurement unit, a non-defective product determination range of the measurement value for determining the light emission characteristic to be non-defective is set (ST14). The non-defective product determination range is stored as threshold data 81a in the storage unit 81, transferred to the management computer 3, and stored in the storage unit 61 (ST15).
  • FIG. 14 shows threshold data created in this way, that is, measured light emission characteristic values obtained in the uncured state of the resin after applying the first resin 8A and the second resin 8B containing a genuine amount of phosphor.
  • the non-defective product determination range (threshold value) of the measured value for determining that the light emission characteristic is non-defective is shown.
  • 15A, 15B, and 15C, the phosphor concentration in the first resin 8A is 5%, respectively.
  • the threshold values corresponding to the Bin codes [1], [2], [3], [4], and [5] in the case of 10% and 15% are shown.
  • the Bin code 12b corresponds to the application amount indicated by the appropriate resin application amount 15 (11).
  • threshold data 81a (1) is set based on the respective emission characteristic measurement values 39a (1).
  • the measurement result of measuring the light emission characteristics of the resin 8 coated with the first resin 8A with the appropriate resin coating amount VA0 corresponding to the Bin code [1] is the chromaticity coordinate ZA0 on the chromaticity table shown in FIG. It is represented by (X A0 , Y A0 ). With this chromaticity coordinate ZA0 as the center, a predetermined range (for example, ⁇ 10%) for the X coordinate and Y coordinate on the chromaticity table is set as a non-defective product determination range (threshold value).
  • a non-defective product determination range (threshold value) is set based on the light emission characteristic measurement results (chromaticity table shown in FIG. 16). (See chromaticity coordinates ZB0 to ZE0 above).
  • the predetermined range set as the threshold is appropriately set according to the accuracy level of the light emission characteristics required for the LED package 50 as a product.
  • FIGS. 15B and 15C show the measured emission characteristics and the non-defective product determination range (threshold value) when the phosphor concentration of the first resin 8A is 10% and 15%, respectively.
  • the appropriate resin application amount 15 (2) and the appropriate resin application amount 15 (3) indicate the appropriate resin application amounts when the phosphor concentrations are 10% and 15%, respectively.
  • the emission characteristic measurement value 39a (2) and the emission characteristic measurement value 39a (3) are emission specific measurement values when the phosphor concentrations are 10% and 15%, respectively, and threshold data 81a ( 2)
  • the threshold value data 81a (3) indicates a non-defective product determination range (threshold value) in each case.
  • the threshold data created in this way is selectively used according to the Bin code 12b to which the target LED element 5 belongs in the production coating operation.
  • the threshold value data creation process shown in (ST6) is executed as an off-line operation by a single inspection device provided separately from the LED package manufacturing system 1, and is previously stored in the management computer 3 as threshold value data 81a. It is also possible to transmit the received data to the resin coating apparatus M4 via the LAN system 2.
  • the substrate 4 after wire bonding is conveyed to the resin coating device M4 (ST7), and as shown in FIG. 20A, the coating nozzle of the dispenser 33A is placed inside the LED mounting portion 4b surrounded by the reflecting portion 4c.
  • First resin 8A is discharged from 33a, and then, as shown in FIG. 20B, second resin 8B is discharged from application nozzle 33a of dispenser 33B to LED mounting portion 4b to which first resin 8A has been applied.
  • the threshold data 81a, and the resin application information 14 a work of applying a prescribed amount of the first resin 8A and the second resin 8B over the LED element 5 is performed (ST8). Details of this resin coating operation processing will be described with reference to FIGS.
  • the resin container is exchanged as necessary (ST21). That is, the syringe attached to the dispensers 33A and 33B of the resin discharge head 32 is replaced with one containing the first resin 8A and the second resin 8B having a phosphor concentration selected according to the characteristics of the LED element 5.
  • the first resin 8A and the second resin 8B are trial-applied to the translucent member 43 for measurement of light emission characteristics by the resin application part C (measurement application process) (ST22). That is, in the measurement application step, the test hitting / measurement unit 40 applies a plurality of resins containing different types of phosphors to the same translucent member 43 drawn to the test hitting stage 40a by the plurality of application nozzles 33a. Test-apply sequentially.
  • the first resin 8A with the appropriate resin application amount (VA0 to VE0) for each Bin code 12b specified in FIG. 4 and the second resin 8B with the above-mentioned specified amount are applied.
  • the resin is discharged from the application nozzles 33a of the dispensers 33A and 33B to the translucent member 43.
  • the actual resin application amount to be applied is not necessarily the above-mentioned appropriate resin application amount and the above-mentioned prescribed amount due to changes in the properties of the first resin 8A and the second resin 8B over time, and is shown in FIG. As described above, the actual resin application amount of the first resin 8A is VA1 to VE1, which is somewhat different from VA0 to VE0.
  • the translucent member 43 on which the first resin 8A and the second resin 8B are applied by trial is sent and placed on the translucent member mounting portion 41 ( Translucent member placement step).
  • the excitation light which excites a fluorescent substance is light-emitted from the light source part 45 arrange
  • the excitation light is irradiated from above on the resin 8 made of the first resin 8A and the second resin 8B that have been trial-applied to the translucent member 43, whereby the light emitted from the resin 8 is integrated from below the translucent member 43.
  • Light is received by the spectroscope 42 via the sphere 44, and the light emission characteristic measurement processing unit 39 measures the light emission characteristic (light emission characteristic measurement step) (ST23).
  • a light emission characteristic measurement value represented by the chromaticity coordinate Z (see FIG. 16) is obtained.
  • This measurement result is not necessarily based on the above-described error in the coating amount and the change in the concentration of the phosphor particles in the resin 8, and so on, and the standard color at the time of proper resin coating shown in FIG.
  • the degree coordinates ZA0 to ZE0 do not match.
  • the deviation ( ⁇ X A) indicating the difference in the X and Y coordinates between the obtained chromaticity coordinates ZA1 to ZE1 and the standard chromaticity coordinates ZA0 to ZE0 at the time of proper resin application shown in FIG. , ⁇ Y A ) to ( ⁇ X E , ⁇ Y E ) are determined to determine whether correction is necessary to obtain desired light emission characteristics.
  • the measurement result is within the threshold value (ST24), and as shown in FIG. 18C, the deviation obtained in (ST23) is compared with the threshold value.
  • the deviations ( ⁇ X A , ⁇ Y A ) to ( ⁇ X E , ⁇ Y E ) are within ⁇ 10% of ZA0 to ZE0.
  • the application amount is corrected (ST25). That is, the deviation between the measurement result in the light emission characteristic measurement step and the predetermined light emission characteristic is obtained, and as shown in FIG. 18 (d), the actual production to be applied to the LED element 5 based on the obtained deviation.
  • the process of deriving the new appropriate resin application amount (VA2 to VE2) is executed by the application amount deriving processing unit 38 (application amount deriving process step).
  • the corrected appropriate resin coating amount (VA2 to VE2) is an updated value obtained by adding a correction amount corresponding to each deviation to the preset appropriate resin coating amount VA0 to VE0.
  • the relationship between the deviation and the correction amount is recorded in the resin application information 14 as known accompanying data in advance.
  • the processes of (ST22), (ST23), (ST24), and (ST25) are repeatedly executed, and the measurement result is defined in advance in (ST24).
  • the proper resin coating amount for actual production is determined.
  • the appropriate resin coating amount is determined by repeatedly executing the measurement coating step, the translucent member placement step, the excitation light emission step, the light emission characteristic measurement step, and the coating amount derivation step. I try to derive.
  • the determined proper resin application amount is stored in the storage unit 81 as the actual production application amount 81b.
  • the second resin 8B is fixed to a specified value defined by the resin application information 14 in the application amount derivation, and an updated value obtained by adding a correction amount for only the first resin 8A is shown. .
  • the application similar to the application amount derivation process performed for the first resin 8A is also applied to the second resin 8B. Execute quantity derivation process. That is, in the coating amount derivation processing step, processing for deriving the appropriate resin coating amount is performed for each of the plurality of resins 8 (first resin 8A and second resin 8B).
  • the production coating is executed (ST31). That is, the appropriate resin application amount for the plurality of resins 8 (the first resin 8A and the second resin 8B) derived by the application amount derivation processing unit 38 and stored as the actual production application amount 81b is stored in the resin discharge mechanism 35.
  • the production execution processing unit 37 commands the application control unit 36 to control, so that the appropriate resin application amount of the first resin 8A and the second resin 8B are sequentially applied to the same LED element 5 mounted on the substrate 4.
  • the coating process is executed (production execution process).
  • the number of coatings by the dispensers 33A and 33B is counted, and it is monitored whether the number of coatings has passed a predetermined number of times (ST32). That is, until the predetermined number of times is reached, it is determined that there is little change in the properties of the first resin 8A and the second resin 8B and the phosphor concentration, and the production coating is executed while maintaining the same actual production coating amount 81b. Repeat (ST31). If the predetermined number of times has been confirmed in (ST32), it is determined that the properties of the first resin 8A and the second resin 8B and the phosphor concentration may have changed, and the process returns to (ST22). Thereafter, the measurement of the same light emission characteristic and the coating amount correction process based on the measurement result are repeatedly executed.
  • the substrate 4 is sent to the curing device M5, and the resin 8 is cured by heating by the curing device M5 (ST9).
  • the resin 8 applied so as to cover the LED element 5 is thermally cured to become a resin 8 *, which is fixed in the LED mounting portion 4b.
  • the substrate 4 after the resin curing is sent to the individual piece cutting device M6, where the substrate 4 is cut into individual piece substrates 4a, and as shown in FIG. (ST10). Thereby, the LED package 50 is completed.
  • the resin coating apparatus M4 shown in the above embodiment ejects the first resin 8A and the second resin 8B each including different types of the first phosphor and the second phosphor in variable amounts.
  • the resin application part C having a plurality of application nozzles 33a to be applied to arbitrary application target positions and the resin application part C the first resin 8A and the second resin 8B are used for measuring the light emission characteristics.
  • An application control unit 36 for executing a measurement application process for trial application to the member 43 and a production application process for application to the LED element 5 for actual production, a light source unit 45 for emitting excitation light for exciting the phosphor, and measurement
  • the translucent member mounting portion 41 on which the translucent member 43 on which the first resin 8A and the second resin 8B are trial-coated is placed, and the excitation light emitted from the light source unit 45 is transmitted through the translucent member 43.
  • the application amount deriving processing unit 38 for deriving the appropriate resin application amount for actual production to be applied to the LED element 5 and the derived appropriate resin application amount are instructed to the application control unit 36.
  • the production execution processing unit 37 is configured to execute a production application process for applying the appropriate resin application amount of resin to the LED element 5.
  • the first resin 8A and the second resin 8B each containing different types of phosphors are made the same transparent.
  • Test application is sequentially performed on the optical member 43, the light emission characteristics are measured for the first resin 8 ⁇ / b> A and the second resin 8 ⁇ / b> B that have been test applied, and the light emission characteristics are measured and applied to the LED element 5 for actual production.
  • the first resin 8A is provided by the plurality of application nozzles 33a.
  • the second resin 8B can be sequentially applied to the same LED element 5.
  • first resin 8A and second resin 8B containing different types of phosphors are sequentially applied by two dispensers 33A and 33B.
  • the resin coating apparatus and the resin coating method of the present invention make the light emission characteristics of the LED package uniform and improve the production yield even when the light emission wavelength of the individual LED elements varies. It has the effect that various color tones of emitted colors can be adjusted, and can be used in the field of manufacturing an LED package in which an LED element is covered with a resin containing a phosphor.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Cette invention concerne un procédé d'application de résine comprenant les étapes consistant à : appliquer séquentiellement un revêtement d'essai de deux types de résine (8) comprenant des types de phosphore différents ; déduire une quantité de résine à appliquer pour chacun des deux types de résine (8) sur la base des résultats d'une mesure des caractéristiques d'émission lumineuse de la résine (8) appliquée en revêtement d'essai ; transmettre la quantité appropriée de résine à appliquer à une unité de commande d'application (36) ; et appliquer séquentiellement les deux types de résine (8) au moyen d'une pluralité de dispositifs de distribution (33A, 33B) sur le même élément de DEL pour une section de montage de DEL (4b).
PCT/JP2012/005759 2011-10-06 2012-09-11 Dispositif d'application de résine et procédé d'application de résine WO2013051197A1 (fr)

Applications Claiming Priority (2)

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JP2011221627A JP5768217B2 (ja) 2011-10-06 2011-10-06 樹脂塗布装置および樹脂塗布方法
JP2011-221627 2011-10-06

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Citations (8)

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Publication number Priority date Publication date Assignee Title
JP2003260403A (ja) * 2002-03-12 2003-09-16 Tatsumo Kk 蛍光体ペースト吐出状態検査装置及び検査方法
JP2006093108A (ja) * 2004-08-06 2006-04-06 Nordson Corp 光学ディスプレイのための蛍光体を噴射するシステム
WO2006121197A1 (fr) * 2005-05-12 2006-11-16 Matsushita Electric Industrial Co., Ltd. Dispositif de fabrication d’une couche fluorescente et procédé de fabrication d’une couche fluorescente au moyen du dispositif
JP2007289081A (ja) * 2006-04-26 2007-11-08 Fujitsu Ltd 物質導入装置及び物質導入方法
JP2007311663A (ja) * 2006-05-19 2007-11-29 Sharp Corp 発光装置の製造方法、発光装置、および発光装置の製造装置
JP2008145300A (ja) * 2006-12-11 2008-06-26 Sharp Corp 蛍光体層厚み判定方法および発光装置の製造方法
JP2010177620A (ja) * 2009-02-02 2010-08-12 Showa Denko Kk 発光装置の製造方法
JP2011096936A (ja) * 2009-10-30 2011-05-12 Alpha- Design Kk 半導体発光ディバイス製造装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5869769B2 (ja) * 2011-03-07 2016-02-24 コニカミノルタ株式会社 蛍光体層の形成方法および発光装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003260403A (ja) * 2002-03-12 2003-09-16 Tatsumo Kk 蛍光体ペースト吐出状態検査装置及び検査方法
JP2006093108A (ja) * 2004-08-06 2006-04-06 Nordson Corp 光学ディスプレイのための蛍光体を噴射するシステム
WO2006121197A1 (fr) * 2005-05-12 2006-11-16 Matsushita Electric Industrial Co., Ltd. Dispositif de fabrication d’une couche fluorescente et procédé de fabrication d’une couche fluorescente au moyen du dispositif
JP2007289081A (ja) * 2006-04-26 2007-11-08 Fujitsu Ltd 物質導入装置及び物質導入方法
JP2007311663A (ja) * 2006-05-19 2007-11-29 Sharp Corp 発光装置の製造方法、発光装置、および発光装置の製造装置
JP2008145300A (ja) * 2006-12-11 2008-06-26 Sharp Corp 蛍光体層厚み判定方法および発光装置の製造方法
JP2010177620A (ja) * 2009-02-02 2010-08-12 Showa Denko Kk 発光装置の製造方法
JP2011096936A (ja) * 2009-10-30 2011-05-12 Alpha- Design Kk 半導体発光ディバイス製造装置

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