WO2013047247A1 - Module solaire et procédé de fabrication de module solaire - Google Patents
Module solaire et procédé de fabrication de module solaire Download PDFInfo
- Publication number
- WO2013047247A1 WO2013047247A1 PCT/JP2012/073697 JP2012073697W WO2013047247A1 WO 2013047247 A1 WO2013047247 A1 WO 2013047247A1 JP 2012073697 W JP2012073697 W JP 2012073697W WO 2013047247 A1 WO2013047247 A1 WO 2013047247A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- type electrode
- current collector
- electrode current
- solar cell
- connection
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 238000000034 method Methods 0.000 title claims description 17
- 239000004020 conductor Substances 0.000 claims abstract description 107
- 239000012790 adhesive layer Substances 0.000 claims abstract description 15
- 239000002245 particle Substances 0.000 claims description 35
- 238000010030 laminating Methods 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000010248 power generation Methods 0.000 abstract description 13
- 210000004027 cell Anatomy 0.000 description 112
- 239000002313 adhesive film Substances 0.000 description 60
- 229920005989 resin Polymers 0.000 description 30
- 239000011347 resin Substances 0.000 description 30
- 239000003822 epoxy resin Substances 0.000 description 15
- 229920000647 polyepoxide Polymers 0.000 description 15
- 239000011230 binding agent Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 11
- 238000001723 curing Methods 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000006059 cover glass Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000012945 sealing adhesive Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- -1 Polypropylene Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 description 1
- 210000001520 comb Anatomy 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- RZXDTJIXPSCHCI-UHFFFAOYSA-N hexa-1,5-diene-2,5-diol Chemical compound OC(=C)CCC(O)=C RZXDTJIXPSCHCI-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- RXFVKZHOXNKNEU-UHFFFAOYSA-N s-(aminodisulfanyl)thiohydroxylamine Chemical compound NSSSN RXFVKZHOXNKNEU-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a solar cell module using a back surface-coupled solar cell, and more particularly to a solar cell module in which solar cells are coupled using a conductive adhesive and a connecting conductor and a method for manufacturing the solar cell module.
- the back contact type solar cell module in which both a p-type electrode and an n-type electrode are provided on the back surface of a solar cell.
- both the p-type electrode and the n-type electrode are provided on the back surface of the solar cell.
- the back contact solar cell module does not need to be provided with electrodes and tab wires on the surface of the solar cell serving as the light receiving surface, and the light receiving efficiency is improved and the appearance is also improved.
- the back contact solar cell module is different from the type in which electrodes are provided on the front and back surfaces of the solar cell, and the tab wire can be routed between the surface of one solar cell and the back surface of another solar cell. In addition, the manufacturing process becomes easy.
- FIG. 9 shows a connection configuration of solar cells in a conventional back contact solar cell module.
- solar cell 100 p-type electrode 101 and n-type electrode 102 are alternately arranged on the back surface of the cell, and a p-type electrode current collector is continuous with one end of p-type electrode 101 along one side edge.
- a portion 103 is formed, and an n-type electrode current collecting portion 104 that is continuous with each end of the n-type electrode 102 is formed along the other side edge portion.
- the p-type electrode current collector 103 and the n-type electrode current collector 104 are provided with several connection points 106 to the tab wire 105 at positions facing each other.
- Each solar battery cell 100 is arranged such that the p-type electrode current collector 103 and the n-type electrode current collector 104 are adjacent to each other, and the connection points 106 are soldered to each other with thin tab wires 105. ing.
- the soldering process is performed at a high temperature of about 260 ° C., there is a concern that the solar battery cell 100 may be warped.
- the cross-sectional area of the tab wire is increased, the rigidity of the tab wire itself increases, and the internal generated at the connection point 106 between the tab wire 105 and the p-type electrode current collector 103 and the n-type electrode current collector 104 due to thermal expansion.
- connection reliability between the p-type electrode current collector 103 and the n-type electrode current collector 104 and the tab wire 105 may be reduced due to the stress. Furthermore, since the flux is used in soldering, there is a concern that the sealing resin of the solar battery cell 100 may be peeled off or the adhesiveness may be deteriorated due to the residue of the flux.
- the present invention provides a solar cell module and a solar cell module for improving power generation efficiency while improving connection reliability between the p-type electrode current collector and the n-type electrode current collector and the connecting conductor. It aims to provide a method.
- a solar cell module includes a p-type electrode in which p-type electrodes and n-type electrodes are alternately arranged on one surface of the cell and connected to one end of the p-type electrode.
- a plurality of photovoltaic cells provided with a current collector along one side edge and an n-type electrode current collector connected with one end of the n-type electrode along the other edge; One side is connected to the p-type electrode current collector of one solar cell over the longitudinal direction, and the other side of the width direction is the other solar cell adjacent to the one solar cell along the longitudinal direction.
- connection conductor connected to the n-type electrode current collector and electrically connecting the p-type electrode current collector of the one solar cell and the n-type electrode current collector of the other solar cell;
- the p-type electrode current collector and the n-type electrode current collector are connected to the connecting conductor in the longitudinal direction. Those having an adhesive layer for surface connection.
- the manufacturing method of the solar cell module according to the present invention includes a plurality of solar cells in which p-type electrodes and n-type electrodes are alternately arranged on one side of a cell at one side edge of one solar cell.
- a p-type electrode current collector connected to one end of the p-type electrode and an n-type electrode current collector connected to one end of the n-type electrode provided along the other side edge of the other solar cell.
- connection conductor is arranged in the longitudinal direction and the p-type electrode current collector and the n-type current collector are arranged in the longitudinal direction. A step of surface connection to the current collecting part.
- the p-type electrode current collector and the n-type electrode current collector and the connection conductor are surface-connected along the side edge of the solar battery cell via the adhesive layer, thereby connecting It is possible to secure a large connection area between the conductor for use with the p-type electrode current collector and the n-type electrode current collector, thereby preventing increase in conduction resistance with the conductor for connection and maintaining connection reliability. .
- connection width of the p-type electrode current collector and the n-type electrode current collector can be reduced, Accordingly, by forming a p-type electrode and an n-type electrode, an effective area can be secured and power generation efficiency can be improved.
- FIG. 1 is an exploded perspective view showing a solar cell module.
- 2A and 2B are diagrams showing a solar battery cell, where FIG. 2A is a perspective view showing a light receiving surface side, and FIG. 2B is a bottom view showing a back surface.
- FIG. 3 is a cross-sectional view showing the configuration of the laminate.
- FIG. 4 is a cross-sectional view showing the configuration of the conductive adhesive film.
- FIG. 5 is a view showing a manufacturing process of the solar cell module, and is a bottom view showing a state in which solar cells are arranged in a predetermined arrangement.
- FIG. 6 is a view showing a manufacturing process of the solar cell module, and is a bottom view showing a string in which solar cells are connected by connection conductors.
- FIG. 1 is an exploded perspective view showing a solar cell module.
- 2A and 2B are diagrams showing a solar battery cell, where FIG. 2A is a perspective view showing a light receiving surface side, and FIG. 2B
- FIG. 7 is a cross-sectional view showing a laminate in which conductive particles are exposed from the surface of the conductive adhesive film.
- FIG. 8 is a bottom view showing the configuration of another solar cell module.
- FIG. 9 is a bottom view showing an example of a conventional back contact solar cell module.
- the solar cell module 1 to which the present invention is applied will be described by taking, as an example, a crystalline silicon solar cell module using a single crystal silicon photoelectric conversion device or a polycrystalline photoelectric conversion device as a photoelectric conversion device.
- the solar cell module 1 has strings 4 in which a plurality of solar cells 2 are connected in series by connecting conductors 3 serving as interconnectors, and a matrix 5 in which a plurality of strings 4 are arranged Prepare. And the solar cell module 1 is laminated together with the front cover 7 provided on the light receiving surface side and the back sheet 8 provided on the back surface side, with the matrix 5 sandwiched between the sealing adhesive sheets 6. Finally, a metal frame 9 such as aluminum is attached to the periphery.
- sealing adhesive for example, a translucent sealing material such as ethylene vinyl alcohol resin (EVA) is used.
- EVA ethylene vinyl alcohol resin
- surface cover 7 for example, a light-transmitting material such as glass or light-transmitting plastic is used.
- back sheet 8 a laminated body in which glass or aluminum foil is sandwiched between resin films is used.
- Each solar battery cell 2 of the solar battery module has a photoelectric conversion element 10 made of a silicon substrate. As shown in FIG. 2A, the photoelectric conversion element 10 has no electrode formed on the surface 10a serving as the light receiving surface, and as shown in FIG. 2B, the back surface 10b opposite to the light receiving surface. In addition, a p-type electrode 11 and an n-type electrode 12 having different polarities are formed.
- linear p-type electrodes 11 and n-type electrodes 12 are alternately arranged on the back surface 10 b of the photoelectric conversion element 10, and a plurality of p-type electrodes 11 are formed along one side edge 2 a.
- a p-type electrode current collector 13 connected to each one end of the n-type electrode is provided, and an n-type electrode current collector 14 connected to each one end of the plurality of n-type electrodes 12 is provided along the other side edge 2b.
- the p-type electrode current collector 13 and the n-type electrode current collector 14 are provided along the opposite one side edge 2a and the other side edge 2b of the solar battery cell 2 and have a predetermined width.
- the p-type electrode 11 and the p-type electrode current collector 13 are respectively formed in a comb shape, and each is alternately between the combs. I'm stuck in.
- a conductive paste such as an Ag paste is formed in a predetermined pattern on the back surface 10 b of the photoelectric conversion element 10. It is formed by coating and baking.
- the p-type electrode current collector 13 and the n-type electrode current collector part 14 of the adjacent solar battery cell 2 are electrically connected to each other by a connecting conductor 3 to be described later.
- the strings 4 connected to are configured.
- the connection conductor 3 is connected to the p-type electrode current collector 13 and the n-type electrode current collector 14 by a conductive adhesive film 17 described later.
- connection width W is a width orthogonal to the longitudinal direction of the p-type electrode current collector 13 along the one side edge 2 a of the solar battery cell 2. This is a region where one side in the width direction is connected.
- the connection area with the connection conductor 3 and the effective area contributing to power generation are defined according to the connection width W of the p-type electrode current collector 13 and the n-type electrode current collector 14. .
- the solar battery cell 2 can secure a large area of the p-type electrode 11 and the n-type electrode 12 by narrowing the connection width W of the p-type electrode current collector 13 and the n-type electrode current collector 14.
- the power generation efficiency can be improved, but the connection area with the connection conductor 3 is reduced, and the increase in conduction resistance and connection reliability are impaired.
- the solar cell 2 is advantageous in terms of conduction resistance and connection reliability with the connection conductor 3 if a large connection width W between the p-type electrode current collector 13 and the n-type electrode current collector 14 is secured.
- the effective area contributing to power generation decreases.
- the solar battery cell 2 is formed by connecting the p-type electrode current collector 13 and the n-type electrode current collector 14 and the connection conductor 3 via the conductive adhesive film 17, thereby connecting the connection conductor 3 and
- the effective resistance is ensured and the power generation efficiency is improved while increasing the connection resistance and improving the connection reliability.
- Such a connection width W for achieving harmony between connection reliability and power generation efficiency is approximately 1 to 5 mm.
- the connecting conductor 3 is formed wider than the tab wire used in the conventional solar cell module.
- the connection conductor 3 is formed by using, for example, a ribbon-like copper foil having a thickness of 50 to 300 ⁇ m, and performing gold plating, silver plating, tin plating, solder plating or the like as necessary. Further, the connecting conductor 3 is used with a length substantially equal to that of the one side edge 2a and the other side edge 2b of the solar cell 2, and one side in the width direction of the pair of solar cells 2 adjacent to each other.
- the p-type electrode current collector 13 or the n-type electrode current collector 14 formed on one side is connected to the n-type electrode current collector 14 or p formed on the other solar cell 2 on the other side in the width direction.
- the connecting portion of the mold electrode current collector 13 is used.
- connection conductor 3 constitutes a laminate 15 by previously laminating a conductive adhesive film 17 constituting an adhesive layer on one surface.
- the connection conductor 3 is provided on the p-type electrode current collector 13 provided on one solar cell 2 and the other solar cell 2 on the surface of the laminate 15 on which the conductive adhesive film 17 is provided.
- a pair of solar cells 2 adjacent to each other are connected in series by being disposed across the n-type electrode current collector 14 formed.
- the conductive adhesive film 17 constituting the adhesive layer is one in which conductive particles 19 are contained in a thermosetting binder resin 18 at a high density and formed into a film shape.
- the conductive adhesive film 17 preferably has a minimum melt viscosity of 100 to 100,000 Pa ⁇ s from the viewpoint of indentability. If the minimum melt viscosity of the conductive adhesive film 17 is too low, the resin flows in the process of low pressure bonding to main curing, and connection failure or protrusion to the cell light receiving surface is likely to occur, which causes a decrease in the light receiving rate. Moreover, even if the minimum melt viscosity is too high, defects are likely to occur when the film is adhered, and the connection reliability may be adversely affected.
- the minimum melt viscosity can be measured while a sample is loaded in a predetermined amount of rotational viscometer and raised at a predetermined temperature increase rate.
- the conductive particles 19 contained in the binder resin 18 are not particularly limited.
- metal particles such as nickel, gold, silver, and copper, those obtained by applying gold plating to the resin particles, and gold plating on the resin particles. Examples thereof include those in which the outermost layer of the applied particles is provided with an insulating coating.
- shape of the conductive particles 19 a spherical shape or a flat shape can be preferably used.
- the average particle diameter of the conductive particles 19 can be used in the range of 1 to 50 ⁇ m, and the range of 10 to 30 ⁇ m can be preferably used.
- the conductive adhesive film 17 preferably has a viscosity of about 10 to 10000 kPa ⁇ s, more preferably 10 to 5000 kPa ⁇ s at around room temperature.
- the conductive adhesive film 17 has a viscosity in the range of 10 to 10000 kPa ⁇ s, when the conductive adhesive film 17 is provided on one surface of the connection conductor 3 and wound around the reel 21, blocking due to so-called protrusion is prevented. And a predetermined tack force can be maintained.
- composition of the binder resin layer of the conductive adhesive film 17 is not particularly limited as long as it does not impair the above-described characteristics, but more preferably a film-forming resin, a liquid epoxy resin, a latent curing agent, a silane cup Contains a ring agent.
- the film-forming resin corresponds to a high molecular weight resin having an average molecular weight of 10,000 or more, and preferably has an average molecular weight of about 10,000 to 80,000 from the viewpoint of film formation.
- various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin can be used.
- a phenoxy resin is preferably used from the viewpoint of the film formation state, connection reliability, and the like. .
- the liquid epoxy resin is not particularly limited as long as it has fluidity at room temperature, and all commercially available epoxy resins can be used.
- Specific examples of such epoxy resins include naphthalene type epoxy resins, biphenyl type epoxy resins, phenol novolac type epoxy resins, bisphenol type epoxy resins, stilbene type epoxy resins, triphenolmethane type epoxy resins, phenol aralkyl type epoxy resins.
- Resins, naphthol type epoxy resins, dicyclopentadiene type epoxy resins, triphenylmethane type epoxy resins, and the like can be used. These may be used alone or in combination of two or more. Moreover, you may use it combining suitably with other organic resins, such as an acrylic resin.
- the latent curing agent various curing agents such as a heat curing type and a UV curing type can be used.
- the latent curing agent does not normally react but is activated by some trigger and starts the reaction.
- the trigger includes heat, light, pressurization, etc., and can be selected and used depending on the application.
- a thermosetting latent curing agent is preferably used, and is fully cured by being heated and pressed by the p-type electrode current collector 13 and the n-type electrode current collector 14.
- a latent curing agent made of imidazoles, amines, sulfonium salts, onium salts, or the like can be used.
- silane coupling agent epoxy, amino, mercapto sulfide, ureido, etc. can be used.
- an epoxy-type silane coupling agent is used preferably. Thereby, the adhesiveness in the interface of an organic material and an inorganic material can be improved.
- an inorganic filler as another additive composition.
- an inorganic filler silica, talc, titanium oxide, calcium carbonate, magnesium oxide and the like can be used, and the kind of the inorganic filler is not particularly limited.
- the conductive adhesive film 17 has the tape-like laminate 15 formed by laminating the binder resin 18 on the connecting conductor 3. Further, the conductive adhesive film 17 may have a configuration in which a release sheet is provided on the surface opposite to the surface on which the connection conductor 3 of the binder resin 18 is laminated.
- a peeling sheet PET (Poly * Ethylene * Terephthalate), OPP (Oriented * Polypropylene), PMP (Poly-4-methlpentene-1), PTFE (Polytetrafluoroethylene) etc. can be used.
- This tape-like conductive adhesive film 17 is wound around a reel 21.
- the laminated body 15 is preliminarily laminated and integrated with the connecting conductor 3 and the conductive adhesive film 17, in actual use, the laminated body 15 is pulled out from the reel 21, and the one side edge 2 a and the other of the solar battery cell 2. After being cut to a predetermined length substantially the same as the side edge 2b, the release sheet is peeled off, and the binder resin 18 of the conductive adhesive film 17 is placed on the p-type electrode current collector 13 and the n-type electrode current collector 14 The connection conductor 3 and the electrode current collectors 13 and 14 can be connected to each other by sticking to the electrode collector.
- connection conductor 3 is applied in advance to one surface which becomes an adhesive surface to the solar battery cell 2, and the solar cell is interposed via the conductive adhesive paste. You may affix on each electrode current collection part 13 and 14 of the cell 2.
- the laminated body 15 is not limited to the reel shape formed in a long shape, but may be a strip shape corresponding to each of the electrode current collectors 13 and 14.
- the conductive adhesive film 17 and the conductive adhesive paste may be provided on each of the electrode current collectors 13 and 14 and the connecting conductor 3 may be disposed thereafter without forming the laminate 15 in advance.
- An adhesive layer composed of laminated laminated films is defined as an “adhesive layer”.
- the conductive adhesive film 17 When the conductive adhesive film 17 is provided as a reel product, the conductive adhesive film 17 has a viscosity in the range of 10 to 10,000 kPa ⁇ s to prevent the conductive adhesive film 17 from being deformed. The dimensions can be maintained. Similarly, when two or more conductive adhesive films 17 are stacked in a strip shape, deformation can be prevented and a predetermined dimension can be maintained.
- the conductive adhesive film 17 is prepared by dissolving the conductive particles 19, the film-forming resin, the liquid epoxy resin, the latent curing agent, and the silane coupling agent in a solvent.
- a solvent toluene, ethyl acetate or the like, or a mixed solvent thereof can be used.
- a conductive adhesive film 17 is obtained by applying a resin-generating solution obtained by dissolution onto a release sheet and volatilizing the solvent.
- the conductive adhesive film 17 is formed by laminating a layer of the binder resin 18 on one surface of the connecting conductor 3 by roll laminating or the like.
- the release sheet and the connection conductor 3 are formed to have a width corresponding to the connection width W of the p-type electrode current collector 13 and the n-type electrode current collector 14.
- the laminated body 15 has one widthwise connection width of the p-type electrode current collector 13 according to the connection width W of the p-type electrode current collector 13 and the n-type electrode current collector 14 of the connection conductor 3.
- the width in the width direction is equal to the connection width W of the n-type electrode current collector 14.
- a plurality of solar cells 2 are adjacent to a p-type electrode current collector 13 of one solar cell 2 and an n-type electrode current collector 14 of the other solar cell 2. Arrange as follows.
- the laminate 15 is cut into a predetermined length according to the lengths of the p-type electrode current collector 13 and the n-type electrode current collector 14, and as shown in FIG. In FIG. 2, straddling the adjacent p-type electrode current collector 13 and n-type electrode current collector 14, and along one side edge 2 a of one solar cell 2 and the other side edge 2 b of the other solar cell 2. And temporarily paste.
- the laminated body 15 arranges the surface on which the conductive adhesive film 17 is laminated on the p-type electrode current collector 13 and the n-type electrode current collector 14, so that the connection conductor 3 is conductively bonded.
- the film 17 is disposed on the p-type electrode current collector 13 and the n-type electrode current collector 14 via the film 17.
- the laminated body 15 has one side temporarily attached to the p-type electrode current collector 13 so as not to touch the n-type electrode 12, and the other side temporarily attached to the n-type electrode current collector 14. This side is prevented from touching the p-type electrode 11.
- Temporary pasting of the laminate 15 is performed at a predetermined temperature (for example, 70 to 80 ° C.) and pressure at which the conductive adhesive film 17 exhibits fluidity but does not cause main curing by a heating bonder from above the connecting conductor 3. (E.g., 0.5 MPa) and heat pressing for a predetermined time (e.g., 0.5 seconds).
- a solar battery string 4 in which a plurality of solar battery cells 2 are connected by the connection conductor 3 is formed.
- a matrix 5 in which a plurality of strings 4 are arranged has a surface cover 7 provided on the light receiving surface side, in which sheets 6 of a light-transmitting sealing adhesive such as EVA for sealing the solar cells 2 are laminated on the front and back surfaces. And it laminates collectively with the back sheet 8 provided in the back surface side.
- the laminated body 15 is heated and pressed at a predetermined temperature and pressure for a predetermined time from above the connecting conductor 3 by a laminator, so that the connecting conductor 3, the p-type electrode current collector 13 and the n-type are obtained.
- the binder resin 18 flows out from between the electrode current collectors 14 and the conductive particles 19 are sandwiched. In this state, the binder resin 18 is cured.
- the connecting conductor 3, the p-type electrode current collector 13 and the n-type electrode current collector 14 are conductively connected via the conductive adhesive film 17, and the adjacent solar cells 2 are connected in series.
- a metal frame 9 such as aluminum is attached to the periphery, and the solar cell module 1 is completed.
- connection conductor 3 is connected to the side edge portion of the solar cell 2 via the conductive adhesive film 17.
- the connection area between the connection conductor 3 and the p-type electrode current collector 13 and the n-type electrode current collector 14 can be secured large. It is possible to prevent increase in conduction resistance with the conductor 3 and maintain connection reliability.
- the connecting conductor 3 is connected to the p-type electrode current collector 13 and the n-type electrode current collector 14 in a surface connection, the stress applied between the connections is dispersed and repeatedly exposed to a temperature cycle environment. In addition, connection stability can be obtained.
- the adhesive layer made of the conductive adhesive film 17 has a lower elastic modulus than that of the solder, the stress between the solar battery cell 2 and the connection conductor 3 can be relaxed.
- the solar cell module 1 has a connection width W between the p-type electrode current collector 13 and the n-type electrode current collector 14 in order to ensure the connection area of the connection conductor 3 along the side edge of the solar cell 2. Therefore, the p-type electrode 11 and the n-type electrode 12 are formed correspondingly to ensure an effective area and improve the power generation efficiency.
- the connecting conductor 3 has a total length L (electrode length) of 90 along the side edge of the solar cell 2 in the p-type electrode current collector 13 and the n-type electrode current collector 14 shown in FIG. It is preferable that the surface connection is performed over%. Thereby, the connection reliability of the connection conductor 3 can be ensured and the power generation efficiency can be improved.
- the conductive particles 19 may be exposed from the surface of the laminated body 15 opposite to the surface laminated on the connection conductor 3 of the conductive adhesive film 17.
- the laminated body 15 has the conductive particles 19 in contact with the p-type electrode current collector 13 and the n-type electrode current collector 14, and the connection conductor 3 and Conductivity between the p-type electrode current collector 13 and the n-type electrode current collector 14 can be ensured.
- the conductive adhesive film 17 from which the conductive particles 19 are exposed from the surface is obtained by, for example, dispersing an aggregate of Ni particles in a resin generation solution, applying the solution on a release sheet, and volatilizing the solvent.
- a method of exposing the surface a method of applying a resin generating solution on a release sheet, spreading Ni particles on the surface, and then exposing the surface by volatilizing the solvent, after spreading the Ni particles on the surface, and using a laminator
- a method of embedding Ni particles in the surface can be used.
- the solar cell module 1 heats and presses the conductive adhesive film 17 by a batch laminating process using a laminator, and after the laminated body 15 is disposed on each of the electrode current collectors 13 and 14, a predetermined temperature (for example, the binder resin 18 may be finally cured and connected by heating and pressing at a pressure (for example, about 0.5 to 3 MPa) and a time (for example, about 15 seconds).
- a pressure for example, about 0.5 to 3 MPa
- a time for example, about 15 seconds.
- the solar cell module 1 is formed by sealing with the EVA sheet 6 and attaching the metal frame 9.
- the bonding step can be omitted, and the process can be simplified.
- the solar cell module 1 may be provided with the conductive adhesive film 17 and the connection conductor 3 separately on the p-type electrode current collector 13 and the n-type electrode current collector 14 without using the laminate 15. Good.
- the conductive adhesive film 17 is temporarily attached to the electrode current collectors 13 and 14, or A conductive adhesive paste is applied.
- the connecting conductor 3 is placed on the conductive adhesive film 17 or the conductive adhesive paste, and is heated and pressed from above the connecting conductor 3 at a predetermined temperature, pressure, and time at which the binder resin 18 is fully cured by a heating bonder. .
- connection conductor 3 is connected to each end of the p-type electrode 11 provided in one solar cell 2 and the n-type electrode 12 provided in another solar cell 2. Therefore, the p-type electrode current collector 13 and the n-type electrode current collector 14 may not be provided.
- the photoelectric conversion element 10 on the back surface 10b of the photoelectric conversion element 10, line-shaped p-type electrodes 11 and n-type electrodes 12 extending between both side edges are alternately arranged in the width direction.
- the p-type electrode current collector 13 and the n-type electrode current collector 14 are not formed on the one side edge 2a and the other side edge 2b.
- the photoelectric conversion element 10 is formed such that one end 11a of the p-type electrode 11 extends to the one side edge 2a side than the n-type electrode 12, and one end 12a of the n-type electrode 12 extends to the other side edge 2b side. It is formed extending from the p-type electrode 11.
- the connecting conductor 3 has one side edge along the one side edge 2 a and the other side edge 2 b of the adjacent solar cells 2 through the conductive adhesive film 17. It is connected to one end 11a extended to the part 2a side and one end 12a extended to the other side edge part 2b side.
- the connection conductor 3 can serve as both the current collector of the p-type electrode 11 and the current collector of the n-type electrode 12. Therefore, the solar cell 2 can reduce materials, such as Ag paste, by omitting the current collectors 13 and 14.
- the connecting conductor 3 is connected so that the side connected to the one end 11a of the p-type electrode 11 is not in contact with the n-type electrode 12 provided on the side edge 2a side. 12 is connected so as not to contact the p-type electrode 11 provided on the other side edge 2b side.
- model member a 5-inch wafer made of silicon was used, and electrodes were formed over the entire surface (hereinafter referred to as “model member”). The electrode was formed by screen-printing Ag paste and firing.
- the connecting conductor consisting of The connecting conductor is connected by a conductive adhesive film or soldering.
- the conductive adhesive film used for connecting the connection conductors was mainly composed of an epoxy resin, and Ni particles were blended in a highly filled state as conductive particles. Moreover, the conductive adhesive film prepared what was exposed from the film surface by producing the aggregate of Ni particle
- Example 1 a laminated body (DT100 series: manufactured by Sony Chemical & Information Device Co., Ltd.) in which a wide connecting conductor and a conductive adhesive film having a thickness of 15 ⁇ m were laminated on both electrodes of a pair of model members, Connections were made along one side edge and the other side edge.
- conductive particles are exposed on the surface of the conductive adhesive film.
- Example 1 after arrange
- the connection width W of the connection conductor to both electrodes of the pair of model members of Example 1 is 1 mm.
- Example 2 the configuration was the same as Example 1 except that the connection width W of the connection conductor to each electrode was 2 mm.
- Example 3 has the same configuration as Example 1 except that the connection width W of the connection conductor to each electrode was 3 mm.
- Example 4 has the same configuration as Example 1 except that the connection width W of the connection conductor to each electrode was 5 mm.
- Example 5 a conductive adhesive film (SP100 series: manufactured by Sony Chemical & Information Device Co., Ltd.) having a thickness of 15 ⁇ m was temporarily attached to both electrodes of a pair of model members, and then connected to both conductive adhesive films.
- the conductive adhesive film was heat-cured by arranging the conductor and performing main pressure bonding at a predetermined temperature, pressure, and time at which the binder was thermally cured, and the connection conductor was surface-connected. Thereafter, EVA sheets were laminated on the front and back surfaces of the model member, and laminated and sealed with a laminator together with a cover glass provided on the non-electrode surface side and a back sheet provided on the electrode formation surface side.
- Ni particles are not exposed on the surface.
- the connection width W of the connection conductor to both electrodes of the pair of model members of Example 5 is 2 mm.
- Comparative Example 1 a tab wire obtained by applying a solder plating (Sn / Ag / Cu, 20 ⁇ m) to a thin wire-like Cu foil wire (5 mm ⁇ 20 mm, 250 ⁇ m thickness) was used as in the prior art. Using this tab line, the longitudinal direction was passed between both electrodes of a pair of model members, and both ends were connected by heating (see FIG. 9). Thereafter, EVA sheets were laminated on both surfaces of the model member, and laminated with a laminator together with a cover glass provided on the non-electrode surface side and a back sheet provided on the electrode formation surface side.
- Comparative Example 2 had the same configuration as Example 1 except that the connection width W of the connection conductor to both electrodes of the pair of model members was 10 mm.
- Comparative Example 3 as the adhesive, a wide connecting conductor and an insulating adhesive film having a thickness of 15 ⁇ m containing no conductive particles (composition obtained by removing conductive particles from the conductive adhesive film of Example 1) and was laminated to both electrodes of a pair of model members along one side edge and the other side edge. And in the comparative example 3, after arrange
- Comparative Example 4 had the same configuration as that of Example 5 except that the conductive adhesive film and the connecting conductor were connected to each electrode by laminating together with a laminator.
- connection resistance when a current 1A was passed by the four-terminal method using a digital multimeter ( m ⁇ ) was measured at the initial stage of production of the laminate and after the TC test (90 ° C. ⁇ 40 ° C., 400 cycles) to determine the connection reliability of the connection conductor and the tab wire.
- connection reliability test the increase in connection resistance after the TC test from the beginning was evaluated as ⁇ when less than 10 m ⁇ , ⁇ when 10 to 15 m ⁇ , and x when exceeding 15 m ⁇ . Further, the loss rate of the effective area was evaluated as ⁇ when less than 6%, ⁇ when 6 to 10%, and ⁇ when more than 10%. The measurement results are shown in Table 1.
- connection conductor is surface-connected to each electrode of the pair of model members, and the connection width W is 1 to 5 mm.
- the increase in connection resistance was less than 10 m ⁇ , and the loss rate of the effective area was as good as 8% at maximum.
- Comparative Example 1 since the tab wire is connected by solder connection, the initial stress between each electrode and the tab wire is caused by internal stress generated at the connection point between the tab wire and each electrode of the pair of model members. It can be seen that the connection resistance is high and is further increased by the TC test and lacks connection reliability. Moreover, some cracks were also confirmed in the electrode.
- connection conductor was surface-connected to each electrode of the pair of model members, and the connection width W was as large as 10 mm, so the connection reliability was good. Since the connection width W with the connection conductor is 10 mm, the loss rate of the effective area in the 5-inch cell has increased to 16%.
- 1 solar cell module 2 solar cell, 2a one side edge, 2b other side edge, 3 connecting conductor, 4 strings, 5 matrix, 6 sheet, 7 surface cover, 8 back sheet, 9 metal frame, 10 photoelectric Conversion element, 11 p-type electrode, 11a one end, 12 n-type electrode, 12a one end, 13 p-type electrode current collector, 14 n-type electrode current collector, 15 laminate, 17 conductive adhesive film, 18 binder resin, 19 Conductive particles, 21 reels
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
Abstract
Cette invention améliore le rendement de production d'énergie tout en maintenant la fiabilité de connexion entre un collecteur d'électrode du type p/collecteur d'électrode du type n et un conducteur de connexion. Cette invention comprend : une pluralité de cellules solaires (2) dans lesquelles des électrodes du type p (11) et des électrodes du type n (12) sont alternativement agencées en parallèle sur une surface de chaque cellule, un collecteur d'électrode du type p (13) connecté à une extrémité des électrodes du type p (11) qui sont placées le long d'un bord latéral (2a) de chaque cellule, et un collecteur d'électrode du type n (14) connecté à une extrémité des électrodes du type n (12) qui sont placées le long de l'autre bord latéral (2b) de chaque cellule ; des conducteurs de connexion (3), dont un côté longitudinal est connecté au collecteur d'électrode du type p (13) d'une cellule solaire (2) et dont l'autre côté longitudinal est connecté au collecteur d'électrode du type n (14) d'une autre cellule solaire (2) ; et des couches adhésives (17) pour établir une connexion de surface entre les conducteurs de connexion (3) et les collecteurs d'électrode du type p (13) ainsi qu'entre les conducteurs de connexion (3) et les collecteurs d'électrode du type n (14) dans la direction longitudinale.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-209902 | 2011-09-26 | ||
JP2011209902A JP5892584B2 (ja) | 2011-09-26 | 2011-09-26 | 太陽電池モジュール、太陽電池モジュールの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013047247A1 true WO2013047247A1 (fr) | 2013-04-04 |
Family
ID=47995280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/073697 WO2013047247A1 (fr) | 2011-09-26 | 2012-09-14 | Module solaire et procédé de fabrication de module solaire |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5892584B2 (fr) |
TW (1) | TW201320374A (fr) |
WO (1) | WO2013047247A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104282788A (zh) * | 2014-09-28 | 2015-01-14 | 苏州中来光伏新材股份有限公司 | 无主栅、高效率背接触太阳能电池模块、组件及制备工艺 |
CN104810423A (zh) * | 2015-04-24 | 2015-07-29 | 苏州中来光伏新材股份有限公司 | 新型无主栅高效率背接触太阳能电池和组件及制备工艺 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9490376B2 (en) | 2011-09-29 | 2016-11-08 | Lg Electronics Inc. | Solar cell module |
JPWO2014119252A1 (ja) * | 2013-02-01 | 2017-01-26 | パナソニックIpマネジメント株式会社 | 太陽電池モジュールの製造方法及び太陽電池モジュールの製造装置 |
KR102124520B1 (ko) | 2013-10-29 | 2020-06-18 | 엘지전자 주식회사 | 태양 전지 모듈 및 그 제조 방법 |
KR102319721B1 (ko) | 2013-10-29 | 2021-11-01 | 엘지전자 주식회사 | 태양 전지 및 태양 전지 모듈 |
CN106098831B (zh) * | 2016-08-02 | 2018-02-02 | 泰州中来光电科技有限公司 | 一种背接触太阳能电池串及其制备方法和组件、系统 |
CN106816486B (zh) * | 2017-04-01 | 2018-12-25 | 泰州中来光电科技有限公司 | 一种n型ibc太阳能电池拼片连接的电池串及其制备方法、组件和系统 |
WO2024142868A1 (fr) * | 2022-12-27 | 2024-07-04 | 株式会社カネカ | Module de cellules photovoltaïques |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005191479A (ja) * | 2003-12-26 | 2005-07-14 | Sekisui Jushi Co Ltd | 太陽電池モジュール |
JP2007214533A (ja) * | 2006-01-16 | 2007-08-23 | Hitachi Chem Co Ltd | 導電性接着フィルム及び太陽電池モジュール |
WO2008139994A1 (fr) * | 2007-05-09 | 2008-11-20 | Hitachi Chemical Company, Ltd. | Élément de liaison conducteur, structure de liaison et module de cellule solaire |
JP2009176782A (ja) * | 2008-01-21 | 2009-08-06 | Sanyo Electric Co Ltd | 太陽電池モジュール |
JP2009212396A (ja) * | 2008-03-05 | 2009-09-17 | Sanyo Electric Co Ltd | 太陽電池モジュール及びその製造方法 |
JP2010041012A (ja) * | 2008-08-08 | 2010-02-18 | Sanyo Electric Co Ltd | 太陽電池モジュール |
JP2010182877A (ja) * | 2009-02-05 | 2010-08-19 | Sharp Corp | 太陽電池セル、配線シート、配線シート付き太陽電池セルおよび太陽電池モジュール |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63287077A (ja) * | 1987-05-20 | 1988-11-24 | Hitachi Ltd | 光電変換デバイス |
JP2005011869A (ja) * | 2003-06-17 | 2005-01-13 | Sekisui Jushi Co Ltd | 太陽電池モジュールおよびその製造方法 |
JP2006324590A (ja) * | 2005-05-20 | 2006-11-30 | Sharp Corp | 裏面電極型太陽電池とその製造方法 |
JP5383792B2 (ja) * | 2009-03-30 | 2014-01-08 | 三洋電機株式会社 | 太陽電池 |
-
2011
- 2011-09-26 JP JP2011209902A patent/JP5892584B2/ja active Active
-
2012
- 2012-09-14 WO PCT/JP2012/073697 patent/WO2013047247A1/fr active Application Filing
- 2012-09-20 TW TW101134445A patent/TW201320374A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005191479A (ja) * | 2003-12-26 | 2005-07-14 | Sekisui Jushi Co Ltd | 太陽電池モジュール |
JP2007214533A (ja) * | 2006-01-16 | 2007-08-23 | Hitachi Chem Co Ltd | 導電性接着フィルム及び太陽電池モジュール |
WO2008139994A1 (fr) * | 2007-05-09 | 2008-11-20 | Hitachi Chemical Company, Ltd. | Élément de liaison conducteur, structure de liaison et module de cellule solaire |
JP2009176782A (ja) * | 2008-01-21 | 2009-08-06 | Sanyo Electric Co Ltd | 太陽電池モジュール |
JP2009212396A (ja) * | 2008-03-05 | 2009-09-17 | Sanyo Electric Co Ltd | 太陽電池モジュール及びその製造方法 |
JP2010041012A (ja) * | 2008-08-08 | 2010-02-18 | Sanyo Electric Co Ltd | 太陽電池モジュール |
JP2010182877A (ja) * | 2009-02-05 | 2010-08-19 | Sharp Corp | 太陽電池セル、配線シート、配線シート付き太陽電池セルおよび太陽電池モジュール |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104282788A (zh) * | 2014-09-28 | 2015-01-14 | 苏州中来光伏新材股份有限公司 | 无主栅、高效率背接触太阳能电池模块、组件及制备工艺 |
CN104810423A (zh) * | 2015-04-24 | 2015-07-29 | 苏州中来光伏新材股份有限公司 | 新型无主栅高效率背接触太阳能电池和组件及制备工艺 |
Also Published As
Publication number | Publication date |
---|---|
TW201320374A (zh) | 2013-05-16 |
JP2013073971A (ja) | 2013-04-22 |
JP5892584B2 (ja) | 2016-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5892584B2 (ja) | 太陽電池モジュール、太陽電池モジュールの製造方法 | |
JP5415396B2 (ja) | 太陽電池モジュールの製造方法及び太陽電池モジュール | |
JP5356347B2 (ja) | 太陽電池モジュール及び太陽電池モジュールの製造方法 | |
JP5676944B2 (ja) | 太陽電池モジュール、太陽電池モジュールの製造方法 | |
WO2012128366A1 (fr) | Module de cellules solaires, procédé de fabrication de module de cellules solaires et corps enroulé en bobine comportant un fil de connexion entouré autour | |
KR101435312B1 (ko) | 태양 전지 모듈, 태양 전지 모듈의 제조 방법 | |
JP5480120B2 (ja) | 太陽電池モジュール、太陽電池モジュールの製造方法、太陽電池セル及びタブ線の接続方法 | |
WO2013035667A1 (fr) | Procédé de fabrication de module solaire, module solaire et procédé de connexion de fil plat | |
JP5798772B2 (ja) | 太陽電池モジュール、太陽電池モジュールの製造方法、タブ線 | |
JP2012124375A (ja) | 太陽電池モジュール及び太陽電池モジュールの製造方法 | |
JP5828582B2 (ja) | 太陽電池モジュール、太陽電池モジュールの製造方法、導電性接着剤 | |
JP6021138B2 (ja) | 太陽電池モジュール、太陽電池モジュールの製造方法、及び薄膜太陽電池用タブ線 | |
JP5745349B2 (ja) | 太陽電池モジュールの製造方法 | |
JP5759220B2 (ja) | 太陽電池モジュール、太陽電池モジュールの製造方法 | |
JP6039905B2 (ja) | 導電性接着剤、太陽電池モジュール及び太陽電池モジュールの製造方法 | |
WO2012099257A1 (fr) | Module de cellules solaires et procédé de fabrication d'un module de cellules solaires | |
JP2016021577A (ja) | 太陽電池モジュール、太陽電池モジュールの製造方法、導電性接着剤 | |
JP2016001765A (ja) | 太陽電池モジュール及び太陽電池モジュールの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12835853 Country of ref document: EP Kind code of ref document: A1 |
|
DPE2 | Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101) | ||
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12835853 Country of ref document: EP Kind code of ref document: A1 |