WO2013042627A1 - Substrat de montage d'un composant électronique, boîtier pour composant électronique et dispositif électronique - Google Patents

Substrat de montage d'un composant électronique, boîtier pour composant électronique et dispositif électronique Download PDF

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Publication number
WO2013042627A1
WO2013042627A1 PCT/JP2012/073624 JP2012073624W WO2013042627A1 WO 2013042627 A1 WO2013042627 A1 WO 2013042627A1 JP 2012073624 W JP2012073624 W JP 2012073624W WO 2013042627 A1 WO2013042627 A1 WO 2013042627A1
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WO
WIPO (PCT)
Prior art keywords
substrate
electronic component
conductor
wiring
wiring conductor
Prior art date
Application number
PCT/JP2012/073624
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English (en)
Japanese (ja)
Inventor
真広 辻野
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京セラ株式会社
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Publication of WO2013042627A1 publication Critical patent/WO2013042627A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H01L2223/6655—Matching arrangements, e.g. arrangement of inductive and capacitive components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Definitions

  • the present invention relates to an electronic component placement board on which electronic components are placed, an electronic component storage package and an electronic apparatus including the same. Such electronic devices are used in various electronic devices.
  • an electronic component storage package (hereinafter also simply referred to as a package) for storing electronic components such as semiconductor elements, for example, a package described in JP-A-4-336702 is known.
  • a package for storing electronic components such as semiconductor elements
  • an external coplanar line is provided on the lower surface of the package substrate.
  • the external coplanar line is composed of a signal line metal thin film (wiring conductor) and a ground metal thin film (ground conductor).
  • One end of the wiring conductor is connected to the signal line via hole of the package substrate, and the other end is drawn out to the side of the package substrate.
  • One end of the ground conductor is connected to the ground via hole of the package substrate, and the other end is drawn out to the side of the package substrate.
  • Such a package is used by being attached to a mounting substrate.
  • a force may be applied to the portion of the ground conductor drawn out to the side of the substrate.
  • the wiring conductor and the ground conductor are bonded to the package substrate through, for example, a brazing material.
  • the brazing material has poor bondability, the ground conductor may peel off from the package substrate.
  • the bonding state of the ground conductor to the package substrate deteriorates in the portion of the ground conductor on the wiring conductor side, the distance between the wiring conductor may change, and the impedance matching between the ground conductor and the wiring conductor may deteriorate. is there.
  • the present invention has been made in view of the above-described problems, and has excellent bonding properties of the ground conductor to the substrate. As a result, a highly reliable electronic component mounting substrate that realizes good impedance matching is provided.
  • the electronic component placement board includes a board, a connection conductor, a wiring conductor, and a ground conductor.
  • the substrate has a placement area for placing electronic components on the top surface.
  • the connection conductor is electrically connected to the electronic component and is provided from the upper surface to the lower surface of the substrate.
  • the wiring conductor is bonded to the lower surface of the substrate, and one end is electrically connected to the connection conductor. The other end is pulled out to the side of the substrate.
  • a pair of ground conductors are disposed on the lower surface of the substrate so as to sandwich the wiring conductor therebetween, and one end thereof is joined to the substrate via a brazing material.
  • the substrate has a recess in a range from a portion where the ground conductor is joined to an outside of the joint portion of the wiring conductor. And the said brazing material is joined to the inner surface of this recessed part.
  • the board has a recess in a range from the portion where the ground conductor is joined to the outside of the joint portion of the wiring conductor.
  • a brazing material is joined to the inner surface of the recess.
  • the recess is provided within a range in which the bonding property of the ground conductor to the substrate can be improved, and the brazing material for bonding the ground conductor is bonded to the recess. For this reason, the bonding strength of the ground conductor is increased, and the positional relationship between the ground conductor and the wiring conductor is maintained. Therefore, it is possible to provide a highly reliable electronic component mounting substrate with good impedance matching.
  • FIG. 1 is an exploded perspective view showing an electronic component placement board according to an embodiment of the present invention, an electronic component storage package and an electronic device including the same. It is a perspective view which shows the electronic component storage package shown in FIG. It is an expansion perspective view which expands and shows the area
  • FIG. 3 is a plan view of the electronic component storage package shown in FIG. 2.
  • FIG. 5 is a cross-sectional view showing an AA cross section of the electronic component storage package shown in FIG. 4.
  • FIG. 5 is a cross-sectional view showing a BB cross section in the electronic component storage package shown in FIG. 4.
  • FIG. 3 is a bottom view of the electronic component storage package shown in FIG. 2. It is an enlarged bottom view which shows the area
  • an electronic component mounting substrate hereinafter also simply referred to as “mounting substrate”
  • an electronic component storage package hereinafter also simply referred to as “package”
  • an electronic device including the same according to an embodiment of the present invention
  • the apparatus will be described in detail with reference to the drawings.
  • each drawing referred to below shows only the main members necessary for explaining the present embodiment in a simplified manner for convenience of explanation. Therefore, the mounting substrate, the package, and the electronic device according to the present invention can include arbitrary constituent members that are not shown in the drawings referred to in this specification.
  • the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.
  • the electronic component placement board 1 of this embodiment includes a board 5, a connection conductor 7, a wiring conductor 9, and a ground conductor 13.
  • the substrate 5 has a placement area 5 a on the top surface for placing the electronic component 3.
  • the connection conductor 7 is provided from the upper surface to the lower surface of the substrate 5.
  • the upper end of the connection conductor 7 is electrically connected to the electronic component 3.
  • the wiring conductor 9 is bonded to the lower surface of the substrate 5.
  • One end of the wiring conductor 9 is electrically connected to the connection conductor 7, and the other end is drawn out to the side of the substrate 5.
  • One end of the ground conductor 13 is joined to both sides of the wiring conductor 9 on the lower surface of the substrate 5 via the brazing material 11.
  • the other end of the ground conductor 13 is drawn to the side of the substrate 5.
  • connection conductor 7 is a member that is electrically connected to the electronic component 3. An electric signal is input / output between the electronic component 3 and an external wiring (not shown) through the connection conductor 7 and the wiring conductor 9.
  • One end of the ground conductor 13 is joined to the lower surface of the substrate 5 via a brazing material 11 so that a pair of the conductors 9 is sandwiched therebetween.
  • the pair of ground conductors 13 disposed on both sides of the wiring conductor 9 includes a pair of first portions 13 a joined to the lower surface of the substrate 5, and the pair of first portions 13 a along the wiring conductor 9. And a second portion 13b drawn to the side of the substrate 5.
  • the first portion 13a and the second portion 13b together with the wiring conductor 9 form a coplanar line.
  • the package 100 of this embodiment includes the mounting substrate 1 and a frame 15 provided on the upper surface of the substrate 5 so as to surround the mounting region 5a of the substrate 5.
  • the electronic device 101 includes the above-described package 100, the electronic component 3 that is placed on the placement region 5 a of the package 100, and the electrodes are electrically connected to the connection conductor 7, and the frame 15. And a lid 17 for sealing the electronic component 3, which is bonded to the upper surface.
  • the mounting substrate 1 of the present embodiment is located on a portion of the lower surface of the substrate 5 that overlaps the side surface of the first portion 13 a of the ground conductor 13 that faces the wiring conductor 9 in the vertical direction.
  • a recess 19 is formed in the range Z from the side surface opposite to the side surface to the wiring conductor 9 with a width shorter than the range Z. That is, on the lower surface of the substrate 5, the recess 19 is formed in the range Z from the portion where the ground conductor 13 is joined to the outside of the wiring conductor 9.
  • the recess 19 is formed so as to include a portion overlapping the side surface of the ground conductor 13 on the wiring conductor 9 side.
  • the brazing material 11 spreads in the recess 19 to join the ground conductor 13 and the substrate 5.
  • the brazing material 11 is preferably bonded so as to form a meniscus on the side surface of the ground conductor 13.
  • FIGS. 1 to 3 are cross-sectional views in a cross section that is parallel to the direction in which the wiring conductor 9 is drawn out and is perpendicular to the upper surface or the lower surface of the substrate 5.
  • FIG. 5 is a cross-sectional view taken along the line AA across the recess 19 (the brazing material 11).
  • FIG. 6 is a cross-sectional view taken along the line BB across the wiring conductor 9. As shown in FIG.
  • the mounting substrate 1 of this embodiment has a recess 19 in the vicinity of the side surface of the substrate 5 where external force tends to concentrate on the ground conductor 13.
  • the brazing material 11 extends into the recess 19 and joins the ground conductor 13 and the substrate 5.
  • the bondability between the substrate 5 and the ground conductor 13 can be strengthened at the portion where the external force is concentrated.
  • the substrate 5 in the present embodiment has, for example, a substantially square plate shape.
  • the size of the substrate 5 is, for example, 10 mm to 100 mm on a side.
  • substrate 5 is 0.3 mm or more and 3 mm or less, for example.
  • the placement area 5a means an area that overlaps the electronic component 3 when the substrate 5 is viewed in plan.
  • the mounting region 5a is formed at the center of the upper surface of the substrate 5, but for example, even if the mounting region 5a is formed at the end of the upper surface of the substrate 5. There is no problem.
  • a region where the electronic component 3 is placed is referred to as a placement region 5a.
  • the substrate 5 of the present embodiment has one placement area 5a.
  • the substrate 5 may have a plurality of placement areas 5a, and a plurality of electronic components 3 may be placed in each placement area 5a.
  • the electronic component 3 examples include an electronic element such as a capacitor, an IC (integrated circuit) element, or an optical semiconductor element such as a light emitting element and a light receiving element. Further, a composite component in which the above elements are combined can be used as the electronic component 3.
  • the optical semiconductor element as the light emitting element, for example, an LD (Laser ⁇ ⁇ ⁇ Diode) element can be used.
  • a PD (Photodetector) element can be used as the light receiving element.
  • the electronic device 101 is used as an optical semiconductor device.
  • the substrate 5 according to this embodiment has high insulation.
  • the insulating substrate include an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, a ceramic material such as an aluminum nitride sintered body and a silicon nitride sintered body, or a glass ceramic. Materials can be used.
  • These materials are first prepared by mixing a raw material powder containing glass powder and ceramic powder, an organic solvent, and a binder.
  • a plurality of ceramic green sheets are produced by forming the mixed member into a sheet.
  • the insulating substrate 5 is produced by integrally firing the produced ceramic green sheets at a temperature of about 1600 degrees. Note that the substrate 5 is not limited to the configuration formed by one insulating member. The structure by which the some insulating member was laminated
  • the mounting substrate 1 of the present embodiment includes a mounting member 21 for mounting the electronic component 3 in the mounting area 5a.
  • the electronic component 3 may be placed directly on the upper surface of the substrate 5, the electronic component 3 is placed on the placement member 21 in the placement substrate 1 of the present embodiment.
  • the mounting member 21 it is preferable to use a member having a good insulating property like the insulating member.
  • a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body, or a glass ceramic material can be used. .
  • a metal material such as iron, copper, nickel, chromium, cobalt and tungsten, or an alloy made of these metals can be used as the substrate 5.
  • the metal substrate 5 can function as a ground electrode by being connected to a ground potential.
  • the recess 19 is formed with a width equal to or smaller than the width of the range Z.
  • a conductor layer (not shown) is formed on the inner surface of the recess 19. Specifically, a metal metallized layer is formed as a conductor layer. By forming such a conductor layer, the bondability between the highly insulating substrate 5 and the brazing material 11 can be further enhanced. Therefore, the electronic component mounting substrate 1 with higher reliability can be provided.
  • the depth of the recess 19 in the direction parallel to the upper and lower thicknesses of the substrate 5 is preferably 10 to 50% with respect to the thickness of the substrate 5.
  • the brazing material 11 can be sufficiently accumulated in the recess 19. Since the bonding area between the substrate 5 and the ground conductor 13 and the volume of the brazing material 11 are increased, the bonding force between the substrate 5 and the ground conductor 13 can be increased. Even if an external force is applied to the ground conductor 13, the stress can be relieved by the deformation of the ground conductor 13 and the brazing material 11 located in the recess 19.
  • the portion located above the recess 19 is relatively thin. However, when the above ratio is 50% or less, the sufficient substrate 5 can be provided even in the relatively thin portion. Can be ensured. As a result, it can suppress that durability of the board
  • the thickness of the recess 19 is, for example, not less than 0.1 mm and not more than 1.5 mm.
  • the width of the recess 19 in the extending direction of the wiring conductor 9 is, for example, not less than 0.1 mm and not more than 5 mm.
  • the package 100 of the present embodiment includes a frame 15 provided on the upper surface of the substrate 5 so as to surround the placement region 5a.
  • the frame 15 is made of, for example, a metal member such as iron, copper, nickel, chromium, cobalt and tungsten, or an alloy made of these metals.
  • the frame body 15 can be produced by subjecting such an ingot of a metal member to a metal processing method such as a rolling method or a punching method. Further, the frame 15 may be composed of a single member, but may be formed by joining a plurality of members.
  • the frame 15 has a cylindrical shape in which an outer periphery and an inner periphery are square when viewed in plan.
  • the outer side has a quadrangular shape with a length of 10 mm to 100 mm.
  • the thickness of the frame 15 is 0.5 mm or more and 2 mm or less, for example. Thickness means the distance between the outer periphery and the inner periphery.
  • the height of the frame 15 is 3 mm or more and 30 mm or less, for example.
  • the substrate 5 and the frame body 15 are joined by a joining member (not shown).
  • a joining member for example, a brazing material is used.
  • Exemplary brazing materials include silver brazing.
  • the frame body 15 may be integrally formed and the brazing is omitted.
  • the frame body 15 of the element storage package 100 of the present embodiment has through holes that open to the inner peripheral surface and the outer peripheral surface thereof.
  • the through hole can be formed in the frame 15 by, for example, drilling or punching.
  • a cylindrical fixing member 23 is fixed to the through hole. Specifically, one end of the fixing member 23 is inserted into the through hole, and the surface of the through hole and the fixing member 23 are joined together to fix the cylindrical fixing member 23 to the through hole.
  • the fixing member 23 is a member for fixing the optical fiber. Light is transmitted between the optical semiconductor element as the electronic component 3 and the optical fiber in the cylindrical hollow portion.
  • the cylindrical fixing member 23 may be fixed to the through hole by fixing one end of the fixing member 23 around the opening on the outer surface of the frame 15.
  • One end of the fixing member 23 may be located between the inner peripheral surface and the outer peripheral surface of the frame 15, and may protrude inward from the inner peripheral surface of the frame 15. .
  • the fixing member 23 has a strength that can fix at least the optical fiber. Specifically, metals such as stainless steel, iron, copper, nickel, chromium, cobalt and tungsten, or alloys made of these metals are used.
  • the cylindrical fixing member 23 can be produced by subjecting such an ingot of a metal member to a metal processing method such as a rolling method or a punching method.
  • the frame 15 and the fixing member 23 are formed using the same metal material. This is because the difference in thermal expansion between the frame body 15 and the fixing member 23 can be reduced, so that the stress generated between the frame body 15 and the fixing member 23 can be reduced.
  • the fixing member 23 can be fixed to the frame 15 by joining the frame 15 with a brazing material.
  • a brazing material for example, gold-tin brazing can be used.
  • the fixing member 23 may be fixed to the frame body 15 by welding.
  • a translucent member may be disposed inside the cylinder of the fixing member 23 so as to close the hole of the fixing member 23.
  • the translucent member closes the inside of the fixing member 23 and maintains the airtightness of the element storage package 100. Further, the optical signal transmitted through the internal space of the fixing member 23 is transmitted.
  • the translucent member can be formed using, for example, lead-based silicon oxide, lead-based lead oxide, boric acid, borosilicate-based amorphous glass or sapphire substrate mainly composed of silica sand. .
  • the ferrule is fixed to the other end of the fixing member 23.
  • the ferrule has a through hole that opens at one end inside the cylinder of the fixing member 23. Then, an optical fiber is inserted and fixed in this through hole. The ferrule is inserted into the fixing member 23 and fixed at a position where the optical fiber and the optical semiconductor element are optically coupled.
  • the ferrule is made of a ceramic material such as zirconia or alumina, for example.
  • the optical fiber is made of a translucent material such as quartz glass.
  • the ferrule may be fixed to the inner peripheral surface of the cylindrical fixing member 23, or may be fixed by joining the ferrule to the end surface of the other end of the fixing member 23.
  • the mounting substrate 1 includes a first wiring substrate 25 disposed in a region surrounded by a frame 15 on the upper surface of the substrate 5.
  • the first wiring base 25 includes a first insulating base 27 and a first wiring 29 that is electrically connected to the connection conductor 7 and the electronic component 3.
  • the electronic component 3 and the first wiring 29 are electrically connected via a bonding wire, for example.
  • the first insulating base 27 it is preferable to use a member having a good insulating property like the insulating member.
  • a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body, or a glass ceramic material can be used. .
  • the first wiring 29 it is preferable to use a member having good conductivity.
  • a metal material such as tungsten, molybdenum, nickel, manganese, copper, silver, and gold can be used as the first wiring 29.
  • the above metal materials may be used alone or as an alloy.
  • the mounting substrate 1 of the present embodiment includes a connection conductor 7 provided from the upper surface to the lower surface of the substrate 5.
  • the connection conductor 7 is configured by providing through holes that open to the upper surface and the lower surface of the substrate 5 and disposing a conductive member in the through holes.
  • the connecting conductor 7 is indicated by a one-dot chain line.
  • the connection conductor 7 in this embodiment is electrically connected to the electronic component 3 via the first wiring 29. Thus, the connection conductor 7 does not have to be directly joined to the electronic component 3.
  • an insulating material is arrange
  • a conductive member may be disposed in the through hole 5 whose inner surface is covered with an insulating material.
  • the wiring conductor 9 may be electrically connected to the connection conductor 7 exposed on the lower surface of the first wiring substrate 25.
  • the first wiring substrate 25 is fitted into a notch provided in the substrate 5 and fixed so that the lower surface of the first wiring substrate 25 is above the lower surface of the mounting substrate 1. . Thereby, an electrical short circuit between the substrate 5 and the connection conductor 7 is suppressed.
  • connection conductor 7 It is preferable to use a member having good conductivity for the connection conductor 7. Specifically, like the first wiring 29, a metal material such as tungsten, molybdenum, nickel, manganese, copper, silver, and gold can be used. What is necessary is just to use said metal material as single or an alloy.
  • the mounting substrate 1 of the present embodiment includes a wiring conductor 9 bonded to the lower surface of the substrate 5.
  • a member having good conductivity it is preferable to use a member having good conductivity.
  • metal members such as iron, copper, nickel, chromium, cobalt, and tungsten can be used. What is necessary is just to use said metal material as single or an alloy.
  • At least a portion of the substrate 5 where the wiring conductor 9 is joined has high insulation.
  • a brazing material 11 can be used as a bonding member for bonding the wiring conductor 9 to the substrate 5, for example.
  • An exemplary brazing material 11 is silver brazing.
  • the mounting substrate 1 of the present embodiment includes a ground conductor 13 that is partially bonded to the lower surface of the substrate 5 via a brazing material 11.
  • the ground conductor 13 has a pair of first portions 13a, a pair of second portions 13b, a third portion 13c, and a screwing portion 13d.
  • the third portion 13 c has a substantially square plate shape, and its upper surface is joined to the lower surface of the substrate 5 via the brazing material 11.
  • the ground conductors 13 are led out from the third portion 13 c toward the side of the substrate 5. That is, the pair of first portions 13a of the ground conductor 13 is continuous via the third portion 13c.
  • the third portion 13c is provided with a screwing portion 13d drawn to the outside of the substrate 5.
  • the screwing portion 13d has a screwing hole.
  • the mounting substrate 1 can be fixed to the mounting substrate 5 by screwing the mounting substrate 1 to the mounting substrate 5 through the screw holes.
  • the screwing portion 13d is preferably drawn out to the side different from the direction in which the wiring conductor 9 of the substrate 5 is drawn. Since the wiring conductor 9 and the connecting conductor 13 and the screwing portion 13d can be arranged apart from each other, a fixing member such as a screw is attached to the wiring conductor 9 when the screwing portion 13d is screwed to the mounting substrate 5. It can be made difficult to contact accidentally. Further, since the wiring conductor 9 and the ground conductor 13 and the screwing portion 13d are arranged apart from each other, the force applied to the screwing portion 13d can hardly be applied to the joint portion of the grounding conductor 13. Therefore, the possibility that the wiring conductor 9 is deformed or the ground conductor 13 is peeled off from the substrate 5 can be reduced.
  • grounding means being electrically connected to an external reference potential as a so-called ground potential.
  • the width of the first portion 13a and the width of the second portion 13b in the direction perpendicular to the direction in which the second portion 13b is drawn out are the same width.
  • the ground conductor 13 protrudes toward the wiring conductor 9 at a portion of the second portion 13 b on the wiring conductor 9 side corresponding to the width of the concave portion 19 on the wiring conductor 9 side. It is preferable to have the protrusion 13e.
  • the distance between the ground conductor 13 and the wiring conductor 9 is preferably constant.
  • the brazing material 11 is also a conductive member. Therefore, in order to achieve impedance matching of the coplanar line, by providing the protruding portion 13e protruding from the second portion 13b, the impedance between the protruding portion 13e and the wiring conductor 9 can be reduced. It is preferable to adjust so as to approach the impedance between.
  • the distance between the wiring conductor 9 and the recess 19 (in other words, the brazing material 11 extending to the recess 19) is The distance between the wiring conductor 9 and the protruding portion 13e is preferably the same. Since the impedance mismatch due to the difference in the distance between the ground conductor 13 and the brazing material 11 and the wiring conductor 9 can be further reduced, impedance matching between the ground conductor 13 and the wiring conductor 9 can be further improved.
  • the side surface of the protruding portion 13 e facing the wiring conductor 9 is parallel to the side surface of the facing wiring conductor 9. It is preferable that
  • the mounting substrate 1 includes a second wiring base 31 disposed on the upper surface of the substrate 5 and in a region surrounded by the frame body 15.
  • the second wiring base 31 has a second insulating base 33 and a second wiring 35. As indicated by a two-dot chain line in FIG. 1, the second wiring 35 is electrically connected to a terminal 37 joined to the lower surface of the substrate 5.
  • the terminal 37 is electrically connected to external wiring.
  • the second insulating substrate 33 it is preferable to use a member having good insulation like the first insulating substrate 27.
  • a member having good insulation like the first insulating substrate 27.
  • an aluminum oxide sintered body, a mullite sintered body, and a silicon carbide sintered body are used.
  • Bodies, ceramic materials such as aluminum nitride sintered bodies and silicon nitride sintered bodies, or glass ceramic materials can be used.
  • the second wiring 35 it is preferable to use a member having good conductivity. Specifically, a metal material such as tungsten, molybdenum, nickel, manganese, copper, silver, and gold can be used as the second wiring 35. What is necessary is just to use said metal material as single or an alloy.
  • the lower surface of the second wiring substrate 31 is placed on the mounting substrate 1 in order to prevent an electrical short circuit between the substrate 5 and the terminal 7.
  • the terminal 7 is electrically fixed to the second wiring 35 exposed on the lower surface of the second wiring base 31 and fitted into and fixed to a notch provided in the substrate 5 so as to be above the lower surface of the second wiring substrate 31. You may connect to the wiring part connected. Thereby, an electrical short circuit between the substrate 5 and the terminal 7 is suppressed.
  • the wiring to the electronic component 3 for example, there is a wiring that does not need to form a coplanar line like a DC power source to the electronic component 3.
  • a coplanar line may be electrically connected to the external wiring via the second wiring substrate 31.
  • the electronic device 101 of this embodiment includes a lid body 17.
  • the lid 17 is made of metal and is provided so as to seal the electronic component 3 such as an optical semiconductor element.
  • the lid body 17 is joined to the upper surface of the frame body 15. Then, the electronic component 3 is sealed in a space surrounded by the mounting substrate 1, the frame body 15, and the lid body 17.
  • the lid 17 for example, a metal member such as iron, copper, nickel, chromium, cobalt and tungsten, or an alloy made of these metals can be used.
  • the lid 17 made of metal is joined to the frame 15 by resistance welding such as seam welding or laser welding. Further, the lid 17 may be joined to the frame 15 by joining the frame 15 and the lid 17 using, for example, gold-tin solder.
  • Electronic component mounting substrate (mounting substrate) 100 Package for storing electronic components (package) DESCRIPTION OF SYMBOLS 101 ... Electronic device 3 ... Electronic component 5 ... Substrate 5a ... Mounting area 7 ... Connection conductor 9 ... Wiring conductor 11 ... Brazing material 13 ... Grounding conductor 13a First part 13b ... Second part 13c ... Third part 13d ... Screwing part 13e ... Projecting part 15 ... Frame 17 ... Lid 19 ... ⁇ Recess 21 ⁇ Placement member 23 ⁇ ⁇ ⁇ Fixing member 25 ⁇ ⁇ ⁇ First wiring substrate 27 ⁇ ⁇ ⁇ First insulating substrate 29 ⁇ ⁇ ⁇ First wiring 31 ⁇ ⁇ ⁇ Second wiring substrate 33 ... second insulating base 35 ... second wiring 37 ... terminal

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)

Abstract

Le problème à résoudre dans le cadre de cette invention est que, lorsqu'une contrainte externe est appliquée à un conducteur de mise à la terre formant une ligne coplanaire avec un fil conducteur, le conducteur à la terre peut se décoller d'un substrat, ce qui entraîne une désadaptation d'impédance dans la ligne coplanaire comprenant le conducteur de mise à la terre et le fil conducteur. La solution consiste en un substrat de montage de composant électronique (1) basé sur un mode de réalisation de la présente invention, qui est doté de conducteurs de mise à la terre (13) possédant une extrémité jointe à un substrat (5) par le biais d'un métal d'apport de brasage (11) de sorte que les conducteurs de mise à la terre (13) prennent en sandwich un fil conducteur (9) entre eux. Le substrat (5) comporte une partie en creux (19) entre la partie de jonction du conducteur de mise à la terre (13) et la partie extérieure de la partie de jonction du fil conducteur (9), et le métal d'apport de brasage (11) est joint à la surface de la partie en creux (19). Il est possible de réduire le risque que le conducteur de mise à la terre (13) soit décollé du substrat (5).
PCT/JP2012/073624 2011-09-22 2012-09-14 Substrat de montage d'un composant électronique, boîtier pour composant électronique et dispositif électronique WO2013042627A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011207004 2011-09-22
JP2011-207004 2011-09-22

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WO2013042627A1 true WO2013042627A1 (fr) 2013-03-28

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014192687A1 (fr) * 2013-05-29 2014-12-04 京セラ株式会社 Boitier pour loger des elements et structure de montage
WO2018003332A1 (fr) * 2016-06-27 2018-01-04 Ｎｇｋエレクトロデバイス株式会社 Substrat céramique haute fréquence et boîtier de logement d'élément semi-conducteur haute fréquence

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002208765A (ja) * 2001-01-11 2002-07-26 Toyo Commun Equip Co Ltd 表面実装型電子部品
JP2003152124A (ja) * 2001-11-12 2003-05-23 Kyocera Corp 高周波用パッケージ
JP2011044670A (ja) * 2009-08-24 2011-03-03 Nec Saitama Ltd 電子部品の裏面電極構造及びこれを備えた電子部品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002208765A (ja) * 2001-01-11 2002-07-26 Toyo Commun Equip Co Ltd 表面実装型電子部品
JP2003152124A (ja) * 2001-11-12 2003-05-23 Kyocera Corp 高周波用パッケージ
JP2011044670A (ja) * 2009-08-24 2011-03-03 Nec Saitama Ltd 電子部品の裏面電極構造及びこれを備えた電子部品

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014192687A1 (fr) * 2013-05-29 2014-12-04 京セラ株式会社 Boitier pour loger des elements et structure de montage
WO2018003332A1 (fr) * 2016-06-27 2018-01-04 Ｎｇｋエレクトロデバイス株式会社 Substrat céramique haute fréquence et boîtier de logement d'élément semi-conducteur haute fréquence
US10790245B2 (en) 2016-06-27 2020-09-29 NGK Electronics Devices, Inc. High-frequency ceramic board and high-frequency semiconductor element package

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