WO2013027828A1 - 非接触搬送装置 - Google Patents
非接触搬送装置 Download PDFInfo
- Publication number
- WO2013027828A1 WO2013027828A1 PCT/JP2012/071446 JP2012071446W WO2013027828A1 WO 2013027828 A1 WO2013027828 A1 WO 2013027828A1 JP 2012071446 W JP2012071446 W JP 2012071446W WO 2013027828 A1 WO2013027828 A1 WO 2013027828A1
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- WIPO (PCT)
- Prior art keywords
- fluid
- plate
- cylindrical chamber
- flow forming
- swirl flow
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G25/00—Conveyors comprising a cyclically-moving, e.g. reciprocating, carrier or impeller which is disengaged from the load during the return part of its movement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Definitions
- the present invention relates to a non-contact conveyance device.
- Patent Document 1 proposes an apparatus that transports a plate-like member in a non-contact manner using Bernoulli's theorem.
- a swirling flow is generated in a cylindrical chamber opened on the lower surface of the device, and a plate-like member is sucked by the negative pressure at the central portion of the swirling flow, while the device and the plate-like member are drawn by a fluid flowing out of the circular chamber.
- the plate-like member can be conveyed in a non-contact manner.
- An object of the present invention is to suppress the rotation of the plate member that occurs when the plate member is conveyed in a non-contact manner.
- the present invention is a non-contact conveying device that conveys a plate-like member in a non-contact manner, comprising a plate-like base and a plurality of swirl flow forming bodies provided on the base, wherein the plurality of swirl flow forming bodies are A columnar main body, a cylindrical chamber formed inside the main body, one end of which is open, and a flat end surface formed on a surface of the main body on the side where the cylindrical chamber opens, A jet port provided on the inner peripheral surface of the cylindrical chamber; a fluid inlet port provided on the outer surface of the main body; and a fluid passage connecting the jet port and the fluid inlet port; A non-contact transfer device characterized in that the direction of the fluid flowing out from the cylindrical chamber along the end face is substantially parallel to a line extending from the center of gravity of the plate-like member to be transferred toward the outer periphery. I will provide a.
- the fluid passage is arranged so that the direction of the fluid flowing out from the cylindrical chamber of the swirling flow forming body along the end face is substantially parallel to a line extending from the center of gravity of the plate-like member to be conveyed toward the outer periphery. Compared with the case where it is not arranged, rotation of the plate-like member that occurs when the plate-like member is conveyed in a non-contact manner can be suppressed.
- FIG. 5 is a cross-sectional view taken along line AA in FIG. 4.
- FIG. 5 is a sectional view taken along line BB in FIG. 4.
- FIG. 5 is a figure which shows the direction of the fluid which flows out out of the rotational flow formation body. It is an enlarged view of the E section of FIG.
- FIG. 4 is a top view, a side view, and a bottom view of the non-contact transfer device 3. It is a figure explaining the centering mechanism 32 with which the non-contact conveying apparatus 3 is provided. It is a perspective view which shows the structure of the rotational flow formation body 2a which concerns on 2nd Embodiment. It is the HH sectional view taken on the line of FIG. It is the II sectional view taken on the line of FIG. It is a figure which shows the direction of the fluid which flows out out of the rotational flow formation body 2a. It is an enlarged view of the J section of FIG.
- FIG. 1 is a perspective view which shows the structure of the non-contact conveying apparatus 1 which concerns on 1st Embodiment of this invention.
- FIG. 2A is a top view of the non-contact conveyance device 1
- FIG. 2B is a side view of the non-contact conveyance device 1.
- FIG. 3 is a diagram illustrating the centering mechanism 13 provided in the non-contact transport apparatus 1.
- the non-contact conveyance device 1 is a device for holding and conveying a plate-like member W such as a semiconductor wafer or a glass substrate in a non-contact manner.
- the non-contact conveyance device 1 includes a plate-like base body 11, six columnar swirl flow forming bodies 2 fixed to the base body 11, a gripping portion 12 gripped for moving the base body 11, a plate-like shape And a centering mechanism 13 for positioning the member W.
- the base 11 includes a rectangular base portion 111 and two arm portions 112 that are bifurcated from the base portion 111.
- a cylindrical centering guide 113 is fixed to the protruding end of each arm portion 112.
- FIG. 4 is a perspective view showing the configuration of the swirl flow forming body 2.
- 5 is a cross-sectional view taken along the line AA in FIG. 4
- FIG. 6 is a cross-sectional view taken along the line BB in FIG.
- Inside the swirling flow forming body 2 a cylindrical chamber 21 having a columnar space and having one end opened is formed. A flat end surface 22 is formed on the surface where the cylindrical chamber 21 is open.
- Two jet outlets 23 are provided on the inner peripheral surface of the cylindrical chamber 21, and two fluid inlets 24 are provided on the outer peripheral surface of the swirl flow forming body 2.
- the jet port 23 and the fluid introduction port 24 are connected by a fluid passage 25.
- the two fluid passages 25 are arranged so as to be parallel to each other.
- the swirling flow forming body 2 has a surface opposite to the end surface 22 fixed to the base 111 and the arm 112. Further, the end surface 22 of each swirl flow forming body 2 has the same height from the surface of the base 111 or the arm 112.
- a fluid supply port 121 is provided on the side surface of the grip portion 12.
- a fluid passage (not shown) that connects the fluid supply port 121 and the fluid introduction port 24 of each swirl flow forming body 2 is formed inside the base body 11.
- the centering mechanism 13 is provided on the lower side of the base 11 and positions the plate-like member W held in a non-contact manner, and prevents the plate-like member W from being detached from the non-contact conveyance device 1.
- the centering mechanism 13 includes a cylinder 131 provided in the grip portion 12, a link having one end connected to the cylinder 131, and two columnar centering guides 132 fixed to the other end. Plate 133.
- a fluid for example, air
- the fluid passes through a fluid passage (not shown) in the base 11.
- the fluid inlet 24 of each swirl flow forming body 2 is sent to the fluid inlet 24 of each swirl flow forming body 2.
- the fluid sent to the fluid introduction port 24 passes through the fluid passage 25 and is discharged from the ejection port 23 into the cylindrical chamber 21.
- the fluid discharged into the cylindrical chamber 21 is rectified as a swirling flow in the cylindrical chamber 21, and then flows out from the opening of the cylindrical chamber 21.
- FIG. 7 is a diagram showing the direction of the fluid flowing out from each swirl flow forming body 2 of the non-contact transport apparatus 1. Specifically, it is a diagram showing the direction of fluid flowing out from the opening of the cylindrical chamber 21 of each swirl flow forming body 2.
- FIG. 8 is an enlarged view of a portion E in FIG. In each figure, each arrow has shown the direction of the fluid which flows out from the opening part of the cylindrical chamber 21 of the swirl flow formation body 2.
- the alternate long and short dash line indicates the fluid passage 25, and the alternate long and two short dashes line L extends in the radial direction from the center of gravity G of the plate member W and is formed in the central axis (or in the cylindrical chamber 21) of the swirling flow forming body 2.
- the fluid passage 25 is arranged so that the fluid flows out in a direction parallel to the two-dot chain line L.
- the direction of the fluid flowing out from the cylindrical chamber 21 is determined by the diameter and depth of the cylindrical chamber 21 and the flow velocity of the fluid.
- the direction of the fluid here is, for example, a combined vector of fluids.
- FIG. 9 is a diagram showing an example in which the fluid flows out in a direction not parallel to the two-dot chain line L in contrast to the above example of FIG.
- the direction of the fluid flowing out from each swirl flow forming body 2 is not parallel to the two-dot chain line L, and an angle of about 45 ° with respect to the two-dot chain line L is set. There is no.
- FIG. 10 is an enlarged view of part F in FIG.
- one arrow indicating the direction of the fluid flowing out from the cylindrical chamber 21 is a vector Va1
- this vector Va1 is decomposed into the radial direction and the tangential direction of the plate member W
- this vector Va2 is decomposed into the radial direction and the tangential direction of the plate member W
- this vector Va2 is decomposed into the radial direction and the tangential direction of the plate member W
- it is decomposed into a vector Vb2 and a vector Vc2.
- FIG. 11 is a perspective view showing a configuration of a non-contact transport device 3 according to a second embodiment of the present invention.
- 12A is a top view of the non-contact conveyance device 3
- FIG. 12B is a side view of the non-contact conveyance device 3
- FIG. 12C is a non-contact conveyance device 3.
- FIG. 13 is a diagram illustrating the centering mechanism 32 provided in the non-contact transport device 3.
- the non-contact conveyance device 3 includes a plate-like base portion 31, six columnar swirl flow forming bodies 2 a fixed to the base portion 31, and a centering mechanism 32 that performs centering of the plate-like member W. Yes.
- a fluid supply port 311 is provided on the outer surface of the base portion 31. The fluid supply port 311 is connected to a fluid introduction port 24a (see FIG. 15) of each swirl flow forming body 2a through a fluid passage (not shown) formed inside the base portion 31.
- FIG. 14 is a perspective view showing the configuration of the swirl flow forming body 2a.
- 15 is a cross-sectional view taken along line HH in FIG. 14, and
- FIG. 16 is a cross-sectional view taken along line II in FIG.
- the configuration of the swirl flow forming body 2a according to the present embodiment is substantially the same as the structure of the swirl flow forming body 2 according to the first embodiment described above. The difference is that in the swirling flow forming body 2 according to the first embodiment, the fluid introduction port 24 is provided on the outer peripheral surface of the swirling flow forming body 2 and the fluid passage 25 is provided linearly, whereas this embodiment is different.
- the fluid introduction port 24a is provided on the surface opposite to the end face 22 of the swirling flow forming body 2a, and the fluid passage 25a is bent.
- the swirling flow forming body 2 a has a surface opposite to the end surface 22 fixed to the base portion 31. Further, the end surface 22 of each swirl flow forming body 2 has the same height from the surface of the base portion 31.
- the centering mechanism 32 is provided on the outer surface of the base 31 and positions the plate-like member W held in a non-contact manner, and prevents the plate-like member W from being detached from the non-contact conveyance device 3.
- the centering mechanism 32 has six cylinders 321 whose one ends communicate with each other, a rod-like link arm 322 whose one end is connected to each cylinder 321, and the cylinder 321 of each link arm 322 are not connected. It is comprised from the rod-shaped centering guide 323 connected with the edge part of one side.
- the centering guide 323 is connected so as to extend in a direction perpendicular to the link arm 322.
- the six cylinders 321 are connected to each other at one end, so that all cylinders 321 can be pressurized and depressurized by one system of fluid.
- the pressure in the cylinder 321 is reduced by a fluid supplied from a fluid supply device (not shown)
- the six link arms 322 move toward the center, and accordingly, the centering guide 323 also moves toward the center. To do.
- the inside of the cylinder 321 is pressurized, the six link arms 322 move in the direction opposite to the center direction, and the centering guide 323 is also moved in the direction opposite to the center direction. Move towards.
- a fluid for example, air
- a fluid supply device not shown
- the fluid is not shown in the base portion 31.
- the fluid inlet 24a of each swirl flow forming body 2a is sent to the fluid inlet 24a of each swirl flow forming body 2a.
- the fluid sent to the fluid inlet 24a is discharged in the cylindrical chamber 21 from the jet outlet 23 through the fluid channel
- the fluid discharged into the cylindrical chamber 21 is rectified as a swirling flow in the cylindrical chamber 21, and then flows out from the opening of the cylindrical chamber 21.
- FIG. 17 is a diagram showing the direction of the fluid flowing out from each swirl flow forming body 2a of the non-contact transfer device 3. Specifically, it is a figure which shows the direction of the fluid which flows out from the opening part of the cylindrical chamber 21 of each turning flow formation body 2a.
- FIG. 18 is an enlarged view of a portion J in FIG. In each figure, each arrow has shown the direction of the fluid which flows out from the opening part of the cylindrical chamber 21 of the swirl
- the alternate long and short dash line indicates the fluid passage 25a
- the alternate long and two short dashes line L extends in the radial direction from the center of gravity G of the plate-like member W and is formed in the central axis (or in the cylindrical chamber 21) of the swirling flow forming body 2a.
- the fluid passage 25a is arranged so that the fluid flows out in a direction parallel to the two-dot chain line L. As a result, no force is applied to the plate-like member W in the tangential direction, and therefore rotation of the plate-like member W due to the flowing fluid is suppressed.
- the fluid passage is arranged so that the direction of the fluid flowing out from the cylindrical chamber of the swirl flow forming body is completely parallel to the line extending in the radial direction from the center of gravity of the plate-like member W. It is assumed that the relationship is not completely parallel. Even if it is not completely parallel, the relationship close to that is weakened, and the force to rotate the plate member W in the tangential direction is weakened, and the object of the present invention to suppress the rotation of the plate member W is achieved. .
- the base body 11 and the swirl flow forming body 2 of the non-contact conveyance device 1 may be molded integrally.
- the base part 31 and the swirl flow forming body 2a of the non-contact transfer device 3 may be integrally formed.
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Abstract
Description
(1)第1実施形態
図1は、本発明の第1実施形態に係る非接触搬送装置1の構成を示す斜視図である。また、図2(a)は、非接触搬送装置1の上面図であり、図2(b)は、非接触搬送装置1の側面図である。また、図3は、非接触搬送装置1が備えるセンタリング機構13について説明する図である。非接触搬送装置1は、半導体ウェーハやガラス基板等の板状部材Wを非接触で保持して搬送するための装置である。
旋回流形成体2は、その端面22と反対側の面が基部111及び腕部112に固定されている。また、各旋回流形成体2の端面22は、基部111又は腕部112の表面からの高さが同じになっている。
図11は、本発明の第2実施形態に係る非接触搬送装置3の構成を示す斜視図である。また、図12(a)は、非接触搬送装置3の上面図であり、図12(b)は、非接触搬送装置3の側面図であり、図12(c)は、非接触搬送装置3の下面図である。また、図13は、非接触搬送装置3が備えるセンタリング機構32について説明する図である。
なお、以下の説明においては、上述の第1実施形態と同じ構成要素については、同一の符号を付し、その説明を省略する。
旋回流形成体2aは、その端面22と反対側の面が基底部31に固定されている。また、各旋回流形成体2の端面22は、基底部31の表面からの高さが同じになっている。
上記の実施形態は、以下のように変形してもよい。また、以下の変形例は、互いに組み合わせてもよい。
(3-1)変形例1
上記の実施形態では、非接触搬送装置に対して6個の旋回流形成体が設置されているが、設置される旋回流形成体の個数は2以上であれば、6以外であってもよい。仮に2個の旋回流形成体が設置される場合には、それらの旋回流形成体は、例えば板状部材Wの重心を挟んで対向するように配置される。また、旋回流形成体は、円柱形状ではなく、角柱形状であってもよい。
上記の実施形態では、非接触搬送装置に対してセンタリング機構が設置されているが、このセンタリング機構を設置しない態様としてもよい。また、第1実施形態において、センタリングガイド113の設置を省略してもよい。
上記の実施形態では、旋回流形成体に対して2つの噴出口が設けられ、2本の流体通路が形成されているが、この噴出口及び流体通路の数はそれぞれ1であっても、また3以上であってもよい。
上記の実施形態では、板状部材Wが円形の形状を有するものと想定しているが、この形状は多角形状であってもよい。この場合、各旋回流形成体の流体通路は、多角形状の板状部材Wの重心からその外周に向かって延びる線と平行に円筒室21から流体が流出するように配置される。
上記の実施形態では、旋回流形成体の円筒室から流出する流体の方向が、板状部材Wの重心から半径方向に延びる線に対して完全に平行になるように流体通路を配置することを想定しているが、完全に平行な関係とならなくてもよい。完全に平行とならなくても、それに近い関係になることにより、板状部材Wをその接線方向に回転させる力が弱まり、板状部材Wの回転を抑制するという本発明の目的は達成される。
上記の実施形態において、非接触搬送装置1の基体11と旋回流形成体2とは、一体に成型されてもよい。同様に、非接触搬送装置3の基底部31と旋回流形成体2aとは、一体に成型されてもよい。
Claims (1)
- 板状部材を非接触で搬送する非接触搬送装置であって、
板状の基体と、
前記基体に設けられる複数の旋回流形成体と
を備え、
前記複数の旋回流形成体は、それぞれ、
柱状の本体と、
前記本体の内部に形成され、その一端が開口している円筒室と、
前記本体の、前記円筒室が開口する側の面に形成される平坦状の端面と、
前記円筒室の内周面に設けられる噴出口と、
前記本体の外面に設けられる流体導入口と、
前記噴出口と前記流体導入口とを連結する流体通路と
を備え、
前記流体通路は、前記円筒室から前記端面に沿って流出する流体の方向が、前記搬送される板状部材の重心から外周に向かって延びる線と略平行になるように配置されることを特徴とする非接触搬送装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12825546.0A EP2750175B1 (en) | 2011-08-24 | 2012-08-24 | Non contact conveyance device |
MYPI2013004187A MY181832A (en) | 2011-08-24 | 2012-08-24 | Non-contacting conveyance equipment |
US14/117,499 US9187256B2 (en) | 2011-08-24 | 2012-08-24 | Non-contacting conveyance equipment |
JP2013530072A JP5918771B2 (ja) | 2011-08-24 | 2012-08-24 | 非接触搬送装置 |
CN201280038140.7A CN103733323B (zh) | 2011-08-24 | 2012-08-24 | 非接触式搬送设备 |
KR1020147003338A KR20140036316A (ko) | 2011-08-24 | 2012-08-24 | 비접촉 반송 장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011182978 | 2011-08-24 | ||
JP2011-182978 | 2011-08-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013027828A1 true WO2013027828A1 (ja) | 2013-02-28 |
Family
ID=47746563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/071446 WO2013027828A1 (ja) | 2011-08-24 | 2012-08-24 | 非接触搬送装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9187256B2 (ja) |
EP (1) | EP2750175B1 (ja) |
JP (1) | JP5918771B2 (ja) |
KR (1) | KR20140036316A (ja) |
CN (1) | CN103733323B (ja) |
MY (1) | MY181832A (ja) |
TW (1) | TWI481542B (ja) |
WO (1) | WO2013027828A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015061012A (ja) * | 2013-09-20 | 2015-03-30 | 株式会社ディスコ | 切削装置 |
WO2021235428A1 (ja) * | 2020-05-21 | 2021-11-25 | 株式会社ハーモテック | 搬送装置 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014165217A (ja) * | 2013-02-21 | 2014-09-08 | Tokyo Electron Ltd | 基板搬送装置および剥離システム |
EP2843695B9 (de) * | 2013-08-28 | 2021-04-14 | Mechatronic Systemtechnik GmbH | Vorrichtung, insbesondere Endeffektor |
US9911640B2 (en) * | 2015-09-01 | 2018-03-06 | Boris Kesil | Universal gripping and suction chuck |
NL2018244B1 (en) * | 2017-01-27 | 2018-08-07 | Suss Microtec Lithography Gmbh | Endeffektor |
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Also Published As
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JPWO2013027828A1 (ja) | 2015-03-19 |
TWI481542B (zh) | 2015-04-21 |
JP5918771B2 (ja) | 2016-05-18 |
CN103733323B (zh) | 2016-08-17 |
MY181832A (en) | 2021-01-08 |
CN103733323A (zh) | 2014-04-16 |
KR20140036316A (ko) | 2014-03-25 |
US20140227045A1 (en) | 2014-08-14 |
EP2750175B1 (en) | 2020-03-25 |
US9187256B2 (en) | 2015-11-17 |
TW201318945A (zh) | 2013-05-16 |
EP2750175A1 (en) | 2014-07-02 |
EP2750175A4 (en) | 2015-03-25 |
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