WO2013026174A2 - Wafer-level fabrication of optical devices. in particular of modules for computational cameras - Google Patents

Wafer-level fabrication of optical devices. in particular of modules for computational cameras Download PDF

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Publication number
WO2013026174A2
WO2013026174A2 PCT/CH2012/000200 CH2012000200W WO2013026174A2 WO 2013026174 A2 WO2013026174 A2 WO 2013026174A2 CH 2012000200 W CH2012000200 W CH 2012000200W WO 2013026174 A2 WO2013026174 A2 WO 2013026174A2
Authority
WO
WIPO (PCT)
Prior art keywords
spacer
wafer
light channels
light
optical components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CH2012/000200
Other languages
English (en)
French (fr)
Other versions
WO2013026174A3 (en
Inventor
Hartmut Rudmann
Matthias Maluck
Alexander Bietsch
Peter Roentgen
Stephan Heimgartner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Sensors Singapore Pte Ltd
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Priority to EP12768695.4A priority Critical patent/EP2748853B1/en
Priority to JP2014526351A priority patent/JP6223975B2/ja
Priority to CN201280052516.XA priority patent/CN103890949B/zh
Priority to KR1020147007074A priority patent/KR101966480B1/ko
Priority to SG2014008718A priority patent/SG2014008718A/en
Priority to US14/239,334 priority patent/US20140307081A1/en
Publication of WO2013026174A2 publication Critical patent/WO2013026174A2/en
Publication of WO2013026174A3 publication Critical patent/WO2013026174A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49748—Repairing by shaping, e.g., bending, extruding, turning, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes

Definitions

  • Active optical component A light sensing or a light emitting component.
  • a photodiode an image sensor, an LED, an OLED, a laser chip.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Lens Barrels (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Optical Couplings Of Light Guides (AREA)
PCT/CH2012/000200 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices. in particular of modules for computational cameras Ceased WO2013026174A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP12768695.4A EP2748853B1 (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices. in particular of modules for computational cameras
JP2014526351A JP6223975B2 (ja) 2011-08-25 2012-08-24 光学装置の、特にコンピュテーショナルカメラ用モジュールのウェハレベルの製作
CN201280052516.XA CN103890949B (zh) 2011-08-25 2012-08-24 光学器件、特别是用于计算式摄像机的模块的晶片级制造
KR1020147007074A KR101966480B1 (ko) 2011-08-25 2012-08-24 광학 장치, 특히 계산 카메라를 위한 모듈의 웨이퍼-레벨 제조
SG2014008718A SG2014008718A (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices. in particular of modules for computational cameras
US14/239,334 US20140307081A1 (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices, in particular of modules for computational cameras

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161527355P 2011-08-25 2011-08-25
US61/527,355 2011-08-25

Publications (2)

Publication Number Publication Date
WO2013026174A2 true WO2013026174A2 (en) 2013-02-28
WO2013026174A3 WO2013026174A3 (en) 2013-04-11

Family

ID=46969906

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/CH2012/000200 Ceased WO2013026174A2 (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices. in particular of modules for computational cameras
PCT/CH2012/000201 Ceased WO2013026175A1 (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices with front focal length correction

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/CH2012/000201 Ceased WO2013026175A1 (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices with front focal length correction

Country Status (8)

Country Link
US (2) US20140307081A1 (https=)
EP (2) EP2748853B1 (https=)
JP (2) JP6282225B2 (https=)
KR (2) KR102056501B1 (https=)
CN (2) CN103890949B (https=)
SG (4) SG10201606882XA (https=)
TW (3) TWI620310B (https=)
WO (2) WO2013026174A2 (https=)

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US9507143B2 (en) 2014-09-19 2016-11-29 Intel Corporation Compact illumination system
WO2017023211A1 (en) * 2015-08-06 2017-02-09 Heptagon Micro Optics Pte. Ltd. Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
US9595553B2 (en) 2012-11-02 2017-03-14 Heptagon Micro Optics Pte. Ltd. Optical modules including focal length adjustment and fabrication of the optical modules
CN107736021A (zh) * 2015-05-12 2018-02-23 三星电子株式会社 用于样点值补偿的图像编码方法和装置以及用于样点值补偿的图像解码方法和装置
US20190259741A1 (en) * 2015-04-20 2019-08-22 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same

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WO2015119571A1 (en) * 2014-02-07 2015-08-13 Heptagon Micro Optics Pte. Ltd. Stacks of arrays of beam shaping elements including stacking, self-alignment and/or self-centering features
SG11201606706WA (en) 2014-02-18 2016-09-29 Heptagon Micro Optics Pte Ltd Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
WO2015191001A1 (en) 2014-06-10 2015-12-17 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules including hybrid arrangements of beam shaping elements, and imaging devices incorporating the same
US9711552B2 (en) * 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
WO2016060615A1 (en) 2014-10-14 2016-04-21 Heptagon Micro Optics Pte. Ltd. Optical element stack assemblies
WO2016191142A2 (en) 2015-05-27 2016-12-01 Verily Life Sciences Llc Nanophotonic hyperspectral/lightfield superpixel imager
JP6619174B2 (ja) * 2015-07-31 2019-12-11 ソニーセミコンダクタソリューションズ株式会社 製造装置および方法
DE102015215833A1 (de) 2015-08-19 2017-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtung mit Optiksubstrat
EP3374815B1 (en) 2015-11-12 2022-09-28 Heptagon Micro Optics Pte. Ltd. Optical element stack assemblies
KR20170073910A (ko) 2015-12-21 2017-06-29 에스케이하이닉스 주식회사 라이트 필드 이미징 장치 및 그 제조방법
DE102016200285A1 (de) 2016-01-13 2017-07-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtung, Abbildungssystem und Verfahren zum Erfassen eines Objektbereichs
CN108941932A (zh) * 2017-05-23 2018-12-07 东莞东阳光科研发有限公司 人工晶体制备方法
US10677964B2 (en) * 2017-10-23 2020-06-09 Omnivision Technologies, Inc. Lens wafer assembly and associated method for manufacturing a stepped spacer wafer
CN113366359B (zh) 2019-03-12 2022-11-15 奥林巴斯株式会社 内窥镜用摄像装置及内窥镜
WO2021153629A1 (ja) * 2020-01-30 2021-08-05 古河電気工業株式会社 光モジュールおよび光学装置
US11664399B2 (en) * 2021-02-01 2023-05-30 Visera Technologies Company Limited Solid-state image sensor

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US9748297B2 (en) 2012-11-02 2017-08-29 Heptagon Micro Optics Pte. Ltd. Optical modules including focal length adjustment and fabrication of the optical modules
US10373996B2 (en) 2012-11-02 2019-08-06 ams Sensors Singapore Pte. Ltd Optical modules including focal length adjustment and fabrication of the optical modules
US9507143B2 (en) 2014-09-19 2016-11-29 Intel Corporation Compact illumination system
US20190259741A1 (en) * 2015-04-20 2019-08-22 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
US11257799B2 (en) * 2015-04-20 2022-02-22 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
CN107736021A (zh) * 2015-05-12 2018-02-23 三星电子株式会社 用于样点值补偿的图像编码方法和装置以及用于样点值补偿的图像解码方法和装置
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Also Published As

Publication number Publication date
KR102056501B1 (ko) 2019-12-16
JP6282225B2 (ja) 2018-02-21
US20140307081A1 (en) 2014-10-16
KR20140068984A (ko) 2014-06-09
EP2748854B1 (en) 2021-06-02
SG2014008718A (en) 2014-04-28
JP2014524597A (ja) 2014-09-22
US10444477B2 (en) 2019-10-15
SG2014008726A (en) 2014-04-28
KR20140054280A (ko) 2014-05-08
SG10201606884TA (en) 2016-10-28
SG10201606882XA (en) 2016-10-28
CN103890948B (zh) 2017-12-01
CN103890949A (zh) 2014-06-25
EP2748854A1 (en) 2014-07-02
JP2014526067A (ja) 2014-10-02
EP2748853A2 (en) 2014-07-02
WO2013026175A1 (en) 2013-02-28
EP2748853B1 (en) 2023-10-11
TW201724487A (zh) 2017-07-01
JP6223975B2 (ja) 2017-11-01
CN103890948A (zh) 2014-06-25
WO2013026174A3 (en) 2013-04-11
CN103890949B (zh) 2017-10-03
TW201327790A (zh) 2013-07-01
TWI567956B (zh) 2017-01-21
TWI582969B (zh) 2017-05-11
US20140299587A1 (en) 2014-10-09
TWI620310B (zh) 2018-04-01
KR101966480B1 (ko) 2019-04-05
TW201316497A (zh) 2013-04-16

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