SG10201606882XA - Wafer-level fabrication of optical devices, in particular of modules for computational cameras - Google Patents

Wafer-level fabrication of optical devices, in particular of modules for computational cameras

Info

Publication number
SG10201606882XA
SG10201606882XA SG10201606882XA SG10201606882XA SG10201606882XA SG 10201606882X A SG10201606882X A SG 10201606882XA SG 10201606882X A SG10201606882X A SG 10201606882XA SG 10201606882X A SG10201606882X A SG 10201606882XA SG 10201606882X A SG10201606882X A SG 10201606882XA
Authority
SG
Singapore
Prior art keywords
wafer
modules
optical devices
level fabrication
computational cameras
Prior art date
Application number
SG10201606882XA
Other languages
English (en)
Inventor
Hartmut Rudmann
Matthias Maluck
Alexander Bietsch
Peter Roentgen
Stephan Heimgartner
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of SG10201606882XA publication Critical patent/SG10201606882XA/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49748—Repairing by shaping, e.g., bending, extruding, turning, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Lens Barrels (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Optical Couplings Of Light Guides (AREA)
SG10201606882XA 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices, in particular of modules for computational cameras SG10201606882XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161527355P 2011-08-25 2011-08-25

Publications (1)

Publication Number Publication Date
SG10201606882XA true SG10201606882XA (en) 2016-10-28

Family

ID=46969906

Family Applications (4)

Application Number Title Priority Date Filing Date
SG10201606882XA SG10201606882XA (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices, in particular of modules for computational cameras
SG10201606884TA SG10201606884TA (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices with front focal length correction
SG2014008726A SG2014008726A (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices with front focal length correction
SG2014008718A SG2014008718A (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices. in particular of modules for computational cameras

Family Applications After (3)

Application Number Title Priority Date Filing Date
SG10201606884TA SG10201606884TA (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices with front focal length correction
SG2014008726A SG2014008726A (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices with front focal length correction
SG2014008718A SG2014008718A (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices. in particular of modules for computational cameras

Country Status (8)

Country Link
US (2) US20140307081A1 (https=)
EP (2) EP2748853B1 (https=)
JP (2) JP6282225B2 (https=)
KR (2) KR102056501B1 (https=)
CN (2) CN103890949B (https=)
SG (4) SG10201606882XA (https=)
TW (3) TWI620310B (https=)
WO (2) WO2013026174A2 (https=)

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WO2015119571A1 (en) * 2014-02-07 2015-08-13 Heptagon Micro Optics Pte. Ltd. Stacks of arrays of beam shaping elements including stacking, self-alignment and/or self-centering features
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WO2015191001A1 (en) 2014-06-10 2015-12-17 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules including hybrid arrangements of beam shaping elements, and imaging devices incorporating the same
US9711552B2 (en) * 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
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WO2016060615A1 (en) 2014-10-14 2016-04-21 Heptagon Micro Optics Pte. Ltd. Optical element stack assemblies
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
KR102329129B1 (ko) 2015-05-12 2021-11-19 삼성전자주식회사 샘플값 보상을 위한 영상 부호화 방법과 그 장치, 및 샘플값 보상을 위한 영상 복호화 방법과 그 장치
WO2016191142A2 (en) 2015-05-27 2016-12-01 Verily Life Sciences Llc Nanophotonic hyperspectral/lightfield superpixel imager
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EP3374815B1 (en) 2015-11-12 2022-09-28 Heptagon Micro Optics Pte. Ltd. Optical element stack assemblies
KR20170073910A (ko) 2015-12-21 2017-06-29 에스케이하이닉스 주식회사 라이트 필드 이미징 장치 및 그 제조방법
DE102016200285A1 (de) 2016-01-13 2017-07-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtung, Abbildungssystem und Verfahren zum Erfassen eines Objektbereichs
CN108941932A (zh) * 2017-05-23 2018-12-07 东莞东阳光科研发有限公司 人工晶体制备方法
US10677964B2 (en) * 2017-10-23 2020-06-09 Omnivision Technologies, Inc. Lens wafer assembly and associated method for manufacturing a stepped spacer wafer
CN113366359B (zh) 2019-03-12 2022-11-15 奥林巴斯株式会社 内窥镜用摄像装置及内窥镜
WO2021153629A1 (ja) * 2020-01-30 2021-08-05 古河電気工業株式会社 光モジュールおよび光学装置
US11664399B2 (en) * 2021-02-01 2023-05-30 Visera Technologies Company Limited Solid-state image sensor

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Also Published As

Publication number Publication date
KR102056501B1 (ko) 2019-12-16
JP6282225B2 (ja) 2018-02-21
US20140307081A1 (en) 2014-10-16
KR20140068984A (ko) 2014-06-09
EP2748854B1 (en) 2021-06-02
SG2014008718A (en) 2014-04-28
JP2014524597A (ja) 2014-09-22
US10444477B2 (en) 2019-10-15
SG2014008726A (en) 2014-04-28
KR20140054280A (ko) 2014-05-08
SG10201606884TA (en) 2016-10-28
WO2013026174A2 (en) 2013-02-28
CN103890948B (zh) 2017-12-01
CN103890949A (zh) 2014-06-25
EP2748854A1 (en) 2014-07-02
JP2014526067A (ja) 2014-10-02
EP2748853A2 (en) 2014-07-02
WO2013026175A1 (en) 2013-02-28
EP2748853B1 (en) 2023-10-11
TW201724487A (zh) 2017-07-01
JP6223975B2 (ja) 2017-11-01
CN103890948A (zh) 2014-06-25
WO2013026174A3 (en) 2013-04-11
CN103890949B (zh) 2017-10-03
TW201327790A (zh) 2013-07-01
TWI567956B (zh) 2017-01-21
TWI582969B (zh) 2017-05-11
US20140299587A1 (en) 2014-10-09
TWI620310B (zh) 2018-04-01
KR101966480B1 (ko) 2019-04-05
TW201316497A (zh) 2013-04-16

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