WO2013024907A1 - Procédé de fabrication d'un film de résine fluorescent et film de résine fluorescent fabriqué par ce procédé - Google Patents

Procédé de fabrication d'un film de résine fluorescent et film de résine fluorescent fabriqué par ce procédé Download PDF

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Publication number
WO2013024907A1
WO2013024907A1 PCT/KR2011/005927 KR2011005927W WO2013024907A1 WO 2013024907 A1 WO2013024907 A1 WO 2013024907A1 KR 2011005927 W KR2011005927 W KR 2011005927W WO 2013024907 A1 WO2013024907 A1 WO 2013024907A1
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WO
WIPO (PCT)
Prior art keywords
phosphor
resin film
semi
resin
film
Prior art date
Application number
PCT/KR2011/005927
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English (en)
Korean (ko)
Inventor
이승재
박나나
박경선
김보경
손종락
곽창훈
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to US14/127,878 priority Critical patent/US20140141283A1/en
Priority to CN201180072254.9A priority patent/CN103687900A/zh
Priority to PCT/KR2011/005927 priority patent/WO2013024907A1/fr
Publication of WO2013024907A1 publication Critical patent/WO2013024907A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/06—Coating with compositions not containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Definitions

  • the present invention relates to a method for producing a phosphor resin film and a phosphor resin film prepared thereby, which improves the precipitation of phosphors over time and can uniformly apply the phosphor to the surface of the phosphor, and thereby It relates to a manufactured phosphor resin film.
  • LED Light emitting diode
  • a common method of manufacturing a LED package is to connect an LED device to a premold plastic using a leadframe, wire bond the leadframe to the surface of the LED device and a premold plastic package.
  • the space of the package) is filled with a polymer paste such as silicon in which the phosphor is dispersed and cured.
  • a blue LED and a fluorescent material are configured to emit white light
  • some light is emitted while the light emitted from the blue LED passes through a fluorescent material such as CaYAG.
  • a fluorescent material such as CaYAG.
  • red and yellow-green which are longer wavelengths than originally absorbed, are emitted, and the original wavelength of blue light and Together they create white light.
  • the use of a dispersing agent is not required, and since the precipitation of a fluorescent substance does not generate
  • one aspect of the present invention is to provide a method for producing a phosphor resin film which enables uniform distribution of phosphors over a large area.
  • another aspect of the present invention is to provide a phosphor resin film produced by such a method is uniformly distributed phosphor.
  • another aspect of the present invention is to provide a method of manufacturing a light emitting device having improved optical characteristics by using a phosphor resin film in which phosphors are uniformly distributed.
  • the present invention provides a phosphor resin film including a polymer resin and a latent curing agent and having the phosphor uniformly interposed on one surface of the semi-cured resin film and the semi-cured resin film.
  • it may further comprise the step of applying a release film on the surface provided with the phosphor powder of the semi-cured resin film.
  • the providing of the phosphor powder may be a step of spraying the phosphor powder on the surface of the semi-cured resin film using an inkjet method.
  • the phosphor powder may be a yellow phosphor.
  • the phosphor powder may be two or more kinds of phosphors having different emission wavelengths.
  • the phosphor powder may include at least a red phosphor and a green phosphor.
  • the polymer resin may be a thermoplastic resin, a thermosetting resin or a mixed resin thereof.
  • the latent curing agent may be a dicyandiamide or imidazole-based curing agent.
  • the solvent may be at least one selected from toluene and methyl ethyl ketone.
  • it may further comprise the step of applying a release film on the surface interposed phosphor powder of the semi-cured resin film.
  • the applying of the phosphor resin film to the light emitting device may include applying the surface of the phosphor resin film not interposed with the phosphor powder to contact the light emitting device.
  • applying the phosphor resin film to a light emitting device may be performed at the wafer level.
  • applying the phosphor resin film to the light emitting device may be performed at a package level.
  • the method for producing a phosphor resin film of the present invention enables uniform distribution of phosphors over a large area by producing a phosphor particle and subsequently providing phosphor particles, and has excellent LED fluorescence properties and various LED chips and Transfer or lamination to the package structure is possible. According to the method of the present invention, it is possible to improve the precipitation of the phosphor powder, the non-uniform optical properties thereby, the amount control problem caused during paste dispensing, and the like.
  • Figure 1 schematically shows a manufacturing process of the phosphor resin film according to an embodiment of the present invention.
  • Figure 2 schematically shows a cross section of the phosphor resin film according to an embodiment of the present invention.
  • FIG. 3 illustrates a process of transferring the phosphor resin film of FIG. 1 by applying pressure to a pre-molded package.
  • FIG. 4 illustrates a package in which a phosphor resin film according to an embodiment of the present invention is laminated on a flip chip LED.
  • the present invention is to prepare a film comprising a phosphor used in the LED package, the step of preparing a polymer slurry by mixing a polymer resin and a latent curing agent in the remaining solvent, applying the polymer slurry to have a film shape, the Drying the applied polymer slurry to form a semi-cured resin film, and providing a phosphor powder on the semi-cured resin film relates to a method for producing a phosphor resin film.
  • FIG. 1 is a process diagram schematically showing a method for producing a phosphor resin film of the present invention.
  • the polymer slurry After mixing a polymer resin and a latent curing agent in a solvent to prepare a polymer slurry, the polymer slurry is applied to have a film shape (a), and the applied polymer slurry is dried to form a semi-cured resin film (b).
  • it may further comprise the step (d) of applying a release film on the surface provided with the phosphor powder of the semi-cured resin film.
  • a polymer slurry is prepared by mixing a polymer resin except a phosphor and a latent curing agent in a solvent.
  • the polymer resin that can be used in the present invention should be able to be applied to produce a semi-cured resin film by drying in the form of a film by the following manufacturing process, it is preferable to have flexibility before curing for ease of handling.
  • such a polymer resin may use a thermoplastic resin or a thermosetting resin, and preferably a mixed resin mixed with these may be used.
  • the polymer resin may use a mixed resin in which 30 to 70 parts by weight of the thermoplastic resin and 30 to 70 parts by weight of the thermosetting resin are mixed with each other.
  • the polymer resin may be included 40 to 80% by weight based on the total polymer slurry.
  • the thermoplastic resin may serve to provide coating property and flexibility of the phosphor resin film to be applied, and in the present invention, the thermosetting resin serves to impart adhesion and mechanical properties after curing the phosphor resin film. can do.
  • any one or more selected from polyester, polypropylene oxide, polyacrylate, polyvinylidene fluoride, and phenoxy resin may be used as an example of the thermoplastic resin, and in the present invention, an epoxy may be used as an example of the thermosetting resin.
  • an epoxy may be used as an example of the thermosetting resin.
  • At least one selected from polyimide, acrylate, silicone, and polyester resin can be used.
  • curing agent used for hardening of resin in this invention is a latent hardening
  • the latent thermosetting agent does not advance the curing of the polymer resin at room temperature without raising the curing to proceed.
  • a severe viscosity change may occur during the application of the polymer slurry, which may adversely affect the uniformity of the thickness, thereby increasing the tolerance.
  • Dicyandiamide (DICY) or imidazol-based latent curing agent may be used as an example of the latent thermosetting agent, and the latent curing agent is 1 to 10 wt% based on the polymer slurry. May be included.
  • the polymer slurry is prepared by mixing the polymer resin and the latent curing agent by adding it to the remainder of the solvent, and the solvent which can be used at this time is toluene or methyl ethyl ketone (MEK). May be used, and more preferably, a mixed solvent in which these are mixed may be used.
  • MEK methyl ethyl ketone
  • the polymer slurry After preparing a polymer slurry in which a polymer resin and a latent curing agent are mixed in a solvent as described above, the polymer slurry is applied to have a film shape.
  • the polymer slurry can be applied onto a release film from which the polymer slurry can be applied and dried to obtain a semi-cured polymer resin film, or can be applied onto a suitable support material known in the art, for example polyester or polyimide. It may be applied on the release film, but is not particularly limited thereto.
  • the applied polymer slurry is dried to form a semi-cured resin film.
  • the polymer slurry may be applied in the form of a film and dried until it is semi-cured at 100 to 150 ° C. to obtain a semi-cured resin film.
  • a phosphor is provided on the resin film.
  • the provision of the phosphor may be preferably performed by an inkjet method, but is not limited thereto, and any technique known in the art that may uniformly provide or spread the phosphor may be used.
  • Phosphor that can be used in the present invention can be carried out by variously selected according to the color and optical characteristics of the LED.
  • the phosphor in the present invention any one or more selected from phosphors capable of emitting white light, red phosphors, green phosphors and yellow phosphors may be used.
  • the phosphor powder may be used together with two or more kinds of phosphors having different emission wavelengths, wherein the phosphor powder may include at least a red phosphor and a green phosphor.
  • the phosphor may use any phosphor known in the art, and is not particularly limited.
  • the diameter of the general phosphor powder is 10 to 15 ⁇ m, but the phosphor powder added in the present invention is preferably added as a powder having a smaller diameter in order to exhibit even dispersibility in the semi-cured phosphor resin film.
  • the phosphor powder When the phosphor powder is provided on the semi-cured resin film, the phosphor powder may be provided to form one or more layers in the resin film on one surface of the resin film.
  • the distance between the phosphor particles can be adjusted according to the application range.
  • the release film 50 may be attached to the surface provided with the phosphor powder of the resin film. Furthermore, pressing step by a roller or the like may be performed after the release film is attached.
  • the releasing film and pressing step may use any method known in the art, and are not particularly limited.
  • the present invention does not require the use of an additional dispersant, and after the semi-prepared resin film is prepared, the phosphor is provided in a uniform thickness, thereby preventing the precipitation of the phosphor over time even during film production, and further, the phosphor is filmed. It can be applied to the surface thinly and uniformly.
  • a phosphor resin film comprising a polymer resin and a latent curing agent and a phosphor resin film uniformly interposed on one surface of the semi-cured resin film and the semi-cured resin film.
  • the term 'one side of the resin film' is used to refer to a direction of one side of both surfaces as a concept including a thickness in the resin film, that is, the phosphor powder is only on one side of the phosphor resin film. It is understood that the present invention is not limited to being present as a layer, and may exist in one layer to a plurality of layers from the one surface and may exist over a certain depth to thickness of the phosphor resin film.
  • the phosphor may be present in a plurality of layers of one to four layers in the resin film, and preferably, from one side of the resin film to an area up to about 50% of the thickness of the resin film. The spacing between the phosphor particles can be adjusted as needed.
  • 2 illustrates an exemplary phosphor resin film of the present invention in which the phosphor powder 10 is uniformly interposed on one surface of the cured resin film 20.
  • Another aspect of the present invention is to provide a phosphor resin film containing phosphor powder on one surface of a resin film obtained by semi-curing a mixture of a polymer resin and a latent curing agent in a B-stage state; It provides a light emitting device manufacturing method comprising the step of applying to and curing the semi-cured phosphor resin film.
  • the step of preparing the phosphor resin film containing the phosphor powder on one surface of the resin film obtained by semi-curing the mixture of the polymer resin and the latent curing agent in the B stage state is as described above.
  • the surface of the phosphor resin film it is preferable to apply the surface of the phosphor resin film not interposed with the phosphor powder to contact the light emitting device.
  • FIG. 3 is a schematic diagram showing a process of applying the phosphor resin film of the present invention to a flip chip LED chip of a light emitting device, and more specifically, the phosphor resin film of the present invention pre-molded LED package It is a schematic diagram which shows the process of applying pressure to a transfer.
  • the LED package 40 mostly uses a plastic premolded package, and in this case, fine holes are formed in the package to facilitate the transfer of the phosphor resin film.
  • the flip chip LED 30 and the phosphor resin film are turned upside down so that the surface of the phosphor resin film is not interposed with the LED chip 30 (a).
  • the phosphor resin film may be uniformly coated and laminated on the entire surface of the flip chip LED structure by applying pressure at the top and applying vacuum at the flip chip side to form a phosphor resin film (b and c).
  • it may optionally include the step of applying a release film on the surface interposed with the phosphor powder of the semi-cured resin film (not shown).
  • the leadframe strip of the package 40 is turned upside down and pressed by applying pressure to the phosphor resin film. At this time, through the minute hole designed in the package inside the package. By applying a vacuum, the phosphor resin film is completely filled without bubbles in the space inside the package.
  • the LED package manufacturing process is terminated by curing the phosphor resin film through heat or ultraviolet (UV) curing.
  • the phosphor resin film of the present invention is produced in a B-stage state by pressing an outer frame edge of the LED pre-mold package by a method such as punching the phosphor resin film. It is possible to transfer a certain amount of phosphor resin film by pressing and then harden it, and also to laminate it as shown in FIG. 4.
  • the applying of the phosphor resin film to the light emitting device may be performed at any of wafer level or package level.
  • the phosphor resin film of the present invention improves the deposition of phosphor powder which may occur in the film manufacturing process and the non-uniform optical characteristics thereby resulting in uniform phosphor distribution and excellent fluorescence characteristics over a large area, and the optical characteristics are uniform. Do.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'un film de résine fluorescent et sur un film de résine fluorescent fabriqué par ce procédé. Plus particulièrement, la présente invention concerne le procédé de fabrication du film de résine fluorescent, qui comprend les étapes consistant à : mélanger une résine de polymère et un agent de durcissement latent avec un solvant pour préparer une bouillie de polymère ; à étaler la bouillie de polymère en une forme de film ; à sécher la bouillie de polymère appliquée pour former un film de résine semi-durcie ; et à placer une poudre fluorescente sur le film de résine semi-durcie. La présente invention concerne également le film de résine semi-durcie, qui comprend la résine de polymère et l'agent de durcissement latent, et le film de résine fluorescent dans lequel une surface du film de résine semi-durcie est uniformément revêtue par la poudre fluorescente.
PCT/KR2011/005927 2011-08-12 2011-08-12 Procédé de fabrication d'un film de résine fluorescent et film de résine fluorescent fabriqué par ce procédé WO2013024907A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US14/127,878 US20140141283A1 (en) 2011-08-12 2011-08-12 Method for manufacturing a fluorescent resin film and fluorescent resin film manufactured thereby
CN201180072254.9A CN103687900A (zh) 2011-08-12 2011-08-12 荧光树脂膜的制造方法以及由此制造的荧光树脂膜
PCT/KR2011/005927 WO2013024907A1 (fr) 2011-08-12 2011-08-12 Procédé de fabrication d'un film de résine fluorescent et film de résine fluorescent fabriqué par ce procédé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2011/005927 WO2013024907A1 (fr) 2011-08-12 2011-08-12 Procédé de fabrication d'un film de résine fluorescent et film de résine fluorescent fabriqué par ce procédé

Publications (1)

Publication Number Publication Date
WO2013024907A1 true WO2013024907A1 (fr) 2013-02-21

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US (1) US20140141283A1 (fr)
CN (1) CN103687900A (fr)
WO (1) WO2013024907A1 (fr)

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US10655792B2 (en) * 2014-09-28 2020-05-19 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
CN103311400A (zh) * 2012-03-15 2013-09-18 展晶科技(深圳)有限公司 发光二极管封装结构的制造方法
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11073248B2 (en) * 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US12007077B2 (en) 2014-09-28 2024-06-11 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament

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JPH11228949A (ja) * 1998-02-09 1999-08-24 Hitachi Chem Co Ltd 蛍光体の回収法、回収蛍光体、これを用いた感光性樹脂組成物及び感光性エレメント
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US20140141283A1 (en) 2014-05-22
CN103687900A (zh) 2014-03-26

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