WO2013020290A1 - Dispositif et procédé de brasage tendre à la vague de pièces à souder avec remise en circulation de brasure - Google Patents

Dispositif et procédé de brasage tendre à la vague de pièces à souder avec remise en circulation de brasure Download PDF

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Publication number
WO2013020290A1
WO2013020290A1 PCT/CN2011/078252 CN2011078252W WO2013020290A1 WO 2013020290 A1 WO2013020290 A1 WO 2013020290A1 CN 2011078252 W CN2011078252 W CN 2011078252W WO 2013020290 A1 WO2013020290 A1 WO 2013020290A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
collection
reservoir
workpieces
recirculation
Prior art date
Application number
PCT/CN2011/078252
Other languages
English (en)
Inventor
Edward Feng
Original Assignee
Linde Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linde Aktiengesellschaft filed Critical Linde Aktiengesellschaft
Priority to PCT/CN2011/078252 priority Critical patent/WO2013020290A1/fr
Publication of WO2013020290A1 publication Critical patent/WO2013020290A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains

Definitions

  • the present invention relates to a method and to a device for wave soldering.
  • Wave soldering is, together with reflow soldering, one of the most frequently used connection methods in the production of electronic components.
  • a workpiece for example a circuit board and components to be soldered on the board, is passed across a pumped wave or waterfall of liquid solder by a conveyor.
  • the solder wave is generated via a solder nozzle comprising one or more solder outlet openings from which liquid solder emerges.
  • the solder flows along the top of the solder nozzle and wets the bottom of the workpiece and the pin or lead of the component with solder. At specific locations, wettable by solder and corresponding to solder joints, the solder provides the desired connections.
  • a critical parameter in wave soldering is oxygen present in the system. Oxygen causes oxidation of the solder and of the corresponding surfaces of the workpiece whereby the quality of the resulting solder joints and/or the reliability of the soldering process may be impaired. By exposure to oxygen, dross is formed which is to be disposed of or regenerated, thus generating additional costs. A major focus in the development of wave soldering processes is therefore the reduction of harmful oxygen effects.
  • An inventive device for wave soldering of workpieces comprises a solder reservoir for liquid solder and at least one solder nozzle.
  • the at least one solder nozzle comprises at least one solder outlet opening arranged above a solder level of the solder in the solder reservoir.
  • At least one solder collection and recirculation device is provided to collect the solder emerging from the at least one solder outlet opening and not adhering to the workpieces, and for stepwise recirculating or guiding the collected solder back into the solder reservoir.
  • the solder collection and recirculation device is thus adapted to collect the solder above the solder level and to guide the collected solder back into the solder reservoir while reducing harmful oxgen influences.
  • solder nozzles in wave soldering devices comprise nozzle outlet openings located at a considerable height above the solder level. The solder exiting the nozzle, as mentioned, is contacting a workpiece to be soldered, for example a circuit board.
  • the surface or upper side of the solder nozzle must therefore be positioned close to the workpiece, and the distance to the solder level can not be arbitrarily reduced due to mandatory constructive requirements and, in some cases, heat sensitivity of the workpieces.
  • the cascading effect of the solder wave flow in conventional devices effects an intensive mixing of the solder with air or oxygen, particularly if large drop heights are present. Thus dross formation and oxidation is increased. Via the inventively suggested solder collection and recirculation device, the effective drop height, in contrast, is significantly reduced.
  • a solder collection and recirculation device advantageously comprises an open solder collection tray adapted to catch the solder and, fluidly connected to the open solder collection tray, a solder conduct ending at or below the solder level.
  • the solder does thus not fall over the entire drop height into the solder reservoir but is caught above the solder level in the open solder collection tray of the solder collection and recirculation device. This results in a stepwise solder recirculation. Turbulences in the solder are reduced because the inventive solder collection and recirculation device ensures a very gentle, low-turbulence solder guidance.
  • solder can be isolated in much of its flow path of ambient oxygen in the proposed solder collection and recirculatioh device which can comprise a closed solder duct.
  • the solder collection and recirculation device thus provides a beneficial effect as, on the one hand, it reduces turbulences and, on the other hand, it reduces the contact areas between solder flow and the ambient atmosphere.
  • An advantageous device comprises a solder collection and recirculation device provided for collecting solder emerging from several solder nozzles.
  • wave soldering devices may be constructed significantly easier.
  • a solder nozzle may be surrounded by an annular solder collection tray.
  • the advantages of the invention can especially be realized if, additionally to the solder collection and recirculation device, at least one protective gas device is provided.
  • an appropriate protective gas device for example via corresponding shielding gas nozzles, protective gas can be supplied specifically to areas of the solder which is collected in an appropriate solder collection and recirculation device. Especially in such critical areas, oxidation can be reduced significantly. As not the overall device, however, is to be supplied with protective gas, protective gas consumption is significantly reduced as compared to conventional devices.
  • the solder collection and recirculation device can be benificial in particular in wave soldering devices which comprise at least one solder pump.
  • a solder pump can be tuned in its capacity to the solder stream provided by the solder collection and recirculation device.
  • Devices of the invention advantageously comprise at least one heating device which is provided for continuous liquefaction of the solder.
  • a heater can be arranged in close proximity to the solder collection and recirculation device to ensure a targeted reheating of the solder flowing back into a defined area. An overheating of the overall solder batch can thus be reduced.
  • Figure 1 shows an apparatus for wave soldering according to the prior art.
  • Figure 2 shows an apparatus for wave soldering according to a particularly preferred embodiment of the invention.
  • Figure 1 shows an apparatus 10 for wave soldering of workpieces 2.
  • the device comprises a solder reservoir 3 in which liquid solder 4 (shaded) is contained.
  • the solder 4 in the solder reservoir, is contained up to a certain height, variable to some extent, and a solder level 4' is formed.
  • a solder nozzle 5 is provided which has at least one solder outlet opening 5'. The solder outlet opening 5' is located above the solder level 4'.
  • the workpiece 2 is moved via a conveyor, not shown, in processing direction 2' obliquely upward, illustrated by a dashed arrow, across the solder nozzle 5 or the solder outlet opening 5' and gets in contact with solder 4 emerging from solder nozzle 5.
  • Workpiece 2 is wetted in specific areas (solder joints) by the solder 4. Solder not adhering to the workpiece 2 flows back into the solder reservoir 3 via solder streams 4".
  • the flow of the solder 4 is illustrated by solid arrows.
  • the solder 4 in the solder reservoir 3 is kept liquid by means of a heating device 9 and is pumped by means of a soldering pump 8 through solder nozzle 5.
  • Figure 2 shows a device according to a particularly preferred embodiment of the invention.
  • the device is generally designated with 1 and comprises the elements of device 100 previously explained in relation to figure 1 .
  • a solder collection and recirculation device 6 for the solder 4 is provided, which comprises, in the exemplary illustration of figure 2, a solder collection tray 6' and a solder duct 6".
  • the solder collection tray 6' is arranged above the solder level 4' and thereby ensures a greatly reduced drop height of the solder 4.
  • a solder guiding means 7 can be provided, for example in the form of accordingly bent metal sheets, and ensures a particularly gentle transfer of the solder 4 into the tray 6' of the collection and recirculation device 6.
  • the collection and recirculation device 6 may surround the solder nozzle 5 in an annular manner.
  • at least one protective gas device may be provided by which specific areas of the tray 6' or solder 4 collected therein can be supplied with an inert protective gas.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La présente invention concerne un dispositif (1) pour le brasage tendre à la vague de pièces à souder (2), comprenant un réservoir de brasure (3) destiné à contenir de la brasure à l'état liquide (4) et au moins une buse de brasure (5) dotée d'au moins une ouverture de sortie de brasure (5') située au-dessus d'un niveau de brasure (4') de la brasure (4) qui se trouve dans le réservoir de brasure (3). L'invention prévoit au moins un dispositif de collecte et de remise en circulation de brasure (6) conçu pour collecter la brasure (4) sortant d'au moins une ouverture de sortie de brasure (5') et n'adhérant pas aux pièces à souder (2) et destiné à remettre en circulation la brasure (4) à l'intérieur du réservoir de brasure (3) et ledit au moins un dispositif de collecte et de remise en circulation (6) est agencé au-dessus du niveau de brasure (4'). L'invention concerne également un procédé correspondant de brasage tendre à la vague de pièces à souder (2).
PCT/CN2011/078252 2011-08-11 2011-08-11 Dispositif et procédé de brasage tendre à la vague de pièces à souder avec remise en circulation de brasure WO2013020290A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/078252 WO2013020290A1 (fr) 2011-08-11 2011-08-11 Dispositif et procédé de brasage tendre à la vague de pièces à souder avec remise en circulation de brasure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/078252 WO2013020290A1 (fr) 2011-08-11 2011-08-11 Dispositif et procédé de brasage tendre à la vague de pièces à souder avec remise en circulation de brasure

Publications (1)

Publication Number Publication Date
WO2013020290A1 true WO2013020290A1 (fr) 2013-02-14

Family

ID=47667872

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2011/078252 WO2013020290A1 (fr) 2011-08-11 2011-08-11 Dispositif et procédé de brasage tendre à la vague de pièces à souder avec remise en circulation de brasure

Country Status (1)

Country Link
WO (1) WO2013020290A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4802617A (en) * 1988-02-19 1989-02-07 Electrovert Limited Restriction of dross formation in a soldering apparatus
CN2274540Y (zh) * 1996-08-19 1998-02-18 张国琦 液态金属软钎接的单/双波峰异步感应式电泵
US20020047039A1 (en) * 2000-10-23 2002-04-25 Shohei Mawatari Automatic wave soldering apparatus and method
CN1479568A (zh) * 2002-06-11 2004-03-03 千住金属工业株式会社 波动焊接设备
CN101563181A (zh) * 2007-01-18 2009-10-21 林德股份公司 选择性焊接的装置和方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4802617A (en) * 1988-02-19 1989-02-07 Electrovert Limited Restriction of dross formation in a soldering apparatus
CN2274540Y (zh) * 1996-08-19 1998-02-18 张国琦 液态金属软钎接的单/双波峰异步感应式电泵
US20020047039A1 (en) * 2000-10-23 2002-04-25 Shohei Mawatari Automatic wave soldering apparatus and method
CN1479568A (zh) * 2002-06-11 2004-03-03 千住金属工业株式会社 波动焊接设备
CN101563181A (zh) * 2007-01-18 2009-10-21 林德股份公司 选择性焊接的装置和方法

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