WO2013014818A1

WO2013014818A1 - Lamp and lighting fixture

Info

Publication number: WO2013014818A1
Application number: PCT/JP2012/000511
Authority: WO
Inventors: 康一中村; 高橋　健治; 喜彦金山; 英明桐生
Original assignee: パナソニック株式会社
Priority date: 2011-07-28
Filing date: 2012-01-27
Publication date: 2013-01-31
Also published as: CN203927459U; JP5140782B1; JPWO2013014818A1

Abstract

A lamp (1) comprises: a LED module (10); a lighting unit (30) that powers the LED module (10); an enclosure (40) that has a first housing part (44) that houses positions other than a capacitor (30b1) of the lighting unit (30), and a second housing part (45) that houses the capacitor (30b1) and is formed with engaging concave parts (P1 to P6) on an outer wall; and a base (60) that has engaging convex parts (61a) on an inner wall and that is fixed to the second housing part (45) by engaging the engaging convex parts (61a) to the engaging concave parts (P1 to P6) in a state of being fitted over the second housing part (45). A peripheral wall of the second housing part (45) has a thickness distribution, and the engaging concave parts (P1 to P6) are formed in the positions on the peripheral wall of the second housing part (45), excluding the thinnest positions.

Description

Lamps and lighting equipment

The present invention relates to a lamp using a light emitting element such as an LED (light emitting diode) as a light source and a lighting apparatus using the same.

Conventionally, a lamp has been proposed that includes a housing in which a lighting unit for lighting an LED is housed, and a base attached so as to cover one end side of the housing (see Patent Document 1).

In this type of lamp, a lamp provided with a case made of a synthetic resin in which a portion to which a mouthpiece is attached is formed in a cylindrical shape, and a mouthpiece formed in a cylindrical shape with a bottom corresponding to the portion is there.

In assembling the lamp, the cap is attached to the housing by caulking a plurality of places in the circumferential direction of the end of the cap in a state where the cap is covered on one end side of the housing. When the end of the mouthpiece is crimped, an engagement convex portion is formed on the peripheral wall of the mouth ring, and an engagement recess is formed on a portion of the peripheral wall of the housing corresponding to the engagement convex portion. Then, the base is attached to the housing in a form in which the engagement convex portion is engaged with the engagement concave portion.

JP, 2010-129275, A

By the way, the electronic component etc. which comprise a part of lighting unit may be accommodated in the site | part corresponded to the inner side of the nozzle | cap | die in a housing | casing. In this case, the inner diameter dimension of the portion (hereinafter referred to as the storage portion) is determined by the maximum dimension in the radial direction of the electronic component or the like stored in the storage portion. On the other hand, the size of the base of the lamp is determined by the standard, and the external dimension of the storage section is defined to a predetermined size by the standard. Then, as the maximum dimension of the electronic component and the like stored in the storage portion increases, the thickness of the peripheral wall of the storage portion decreases accordingly.

As a result, when attaching the base to the housing, the force applied when caulking the end of the base must also be weakened. This is because if the caulking force is increased too much, the peripheral wall of the storage portion may be broken.

However, when the user attaches the lamp to the luminaire or assembles the lamp, a force may be applied to the base in a direction of separating from the housing. On the other hand, the depth of the engagement concave portion and the protrusion amount of the engagement convex portion are increased to increase the attachment strength between the mouthpiece and the housing, and the mouthpiece is prevented from being separated from the storage portion. It is valid. Then, in order to increase the depth of the engagement recess and the protrusion amount of the engagement protrusion, it is necessary to increase the thickness of the portion forming the engagement recess in the peripheral wall of the storage portion.

After all, it is required that the thickness of the portion where the engagement concave portion is formed in the peripheral wall is thickened in the storage portion while securing an internal space to some extent.

An object of the present invention is to provide a lamp and a lighting fixture which can easily secure a space for housing a lighting unit and can increase the attachment strength between a base and a housing.

A lamp according to the present invention stores a light source having a semiconductor light emitting element, a lighting unit for lighting the light source, a first storage portion for storing a first portion of the lighting unit, and a second portion other than the first portion of the lighting unit And a housing having a second storage portion in which an outer wall is formed with an engagement recess, and an inner wall having an engagement convex portion, the engagement convex portion being engaged with the second storage portion. And a base attached to the second storage portion by engaging with the mating recess, the peripheral wall of the second storage portion has a thickness distribution, and the engagement concave portion is the most thickness of the peripheral wall of the second storage portion Is formed in the area except for the thin area.

According to this configuration, the peripheral wall of the second storage portion has a thickness distribution, and the engagement concave portion is formed at a portion other than the thinnest portion in the peripheral wall of the second storage portion, whereby the engagement concave portion is formed. Since the depth can be increased, the attachment strength between the base and the second housing can be increased. In addition, since the thickness of a portion other than the portion where the engagement recess is formed in the peripheral wall of the second storage portion can be reduced, the internal space of the second storage portion can be increased by that amount. It becomes easy to secure the space which accommodates the unit.

In the lamp according to the present invention, the thickness distribution may be based on the shape of a second portion disposed inside the second storage portion.

According to this configuration, it is possible to reduce the volume of the gap generated between the inner wall of the second storage portion and the second portion, so that the space between the inner wall of the second storage portion and the second portion is a cavity. Also, since the heat dissipation can be improved, it is not necessary to interpose a thermally conductive member between the inner wall of the second housing and the second portion. As a result, the cost can be reduced by reducing the number of parts.

Further, in the lamp according to the present invention, the engagement concave portion and the engagement convex portion are formed by caulking a part of the mouthpiece in a state in which the mouthpiece is externally fitted to the second storage portion. It may be

According to this configuration, since the engagement recess and the engagement protrusion can be formed relatively easily, the assemblability can be improved, and as a result, the assembly cost can be reduced.

In the lamp according to the present invention, the second storage portion may be filled with a heat conductive resin.

According to this configuration, since the heat is conducted from a part of the lighting unit to the die via the heat conductive resin, the heat dissipation can be improved.

In the lamp according to the present invention, the lighting unit may include a mounting substrate on which a plurality of electronic components are mounted, and the second storage unit may store at least one electronic component.

According to this configuration, since the distance between the electronic component and the inner wall of the second housing can be reduced, the heat dissipation of the electronic component can be improved.

In the lamp according to the present invention, the lighting unit includes a heat pipe for dissipating heat generated by the mounting substrate, and the second storage portion stores a part of the heat pipe. It may be.

In addition, the present invention may be a luminaire including the above-described lamp and an instrument body having a socket to which the base of the lamp is attached.

According to this configuration, a part of the heat generated in the lighting unit can be transmitted to the lighting apparatus through the base and the socket, so that the heat dissipation of the entire lighting apparatus can be improved.

1 is a perspective view of a lamp according to Embodiment 1. FIG. Sectional drawing of the lamp | ramp which concerns on Embodiment 1. FIG. The state which removed the nozzle | cap | die of the lamp | ramp which concerns on Embodiment 1 is shown, (a) is the perspective view seen from diagonally downward, (b) is a top view. The perspective view of the lighting fixtures which concern on Embodiment 2. FIG. Sectional drawing of the lamp | ramp which concerns on a modification. The state which removed the nozzle | cap | die of the lamp | ramp which concerns on a modification is shown, (a) is the perspective view seen from diagonally downward, (b) is a top view. Sectional drawing of the lamp | ramp which concerns on a modification. Sectional drawing of the lamp | ramp which concerns on a modification. The state which removed the nozzle | cap | die of the lamp | ramp which concerns on a modification is shown, (a) is the perspective view seen from diagonally downward, (b) is a top view. The state which removed the nozzle | cap | die of the lamp | ramp which concerns on a modification is shown, (a) is the perspective view seen from diagonally downward, (b) is a top view. The state which removed the nozzle | cap | die of the lamp | ramp which concerns on a modification is shown, (a) is the perspective view seen from diagonally downward, (b) is a top view.

Embodiment 1
Hereinafter, the configuration of the lamp 1 according to Embodiment 1 will be described with reference to FIGS. 1 and 2.

As shown in FIGS. 1 and 2, the lamp 1 is an LED lamp that is an alternative to an incandescent lamp, and includes a light emitting module 10 as a light source, a base 20 on which the light emitting module 10 is mounted, and a light emitting module 10 A lighting unit 30 for lighting the light, a first housing 40 accommodating the lighting unit 30, a second housing 50 attached so as to cover a part of the first housing 40, the lighting unit 30, and The base 60 electrically connected, and the glove 80 attached to the upper side of the second housing 50 are provided. Further, from the lighting unit 30, a feed line 70 for supplying power to the light emitting module 10 is derived. In the lamp 1, an envelope is formed of the globe 80, the first housing 40, the second housing 50, and the base 60, and the light emitting module 10 and the base 20 are accommodated in the envelope. Ru.

The light emitting module 10 includes a mounting substrate 11 having a substantially circular shape in plan view, and a plurality of (36 in FIG. 1) light emitting units 12 disposed on the mounting substrate 11.

The light emitting unit 12 includes a semiconductor light emitting element (not shown) formed of an LED mounted on the mounting substrate 11 and a sealing body 12 a provided on the mounting substrate 11 so as to cover the semiconductor light emitting elements. Ru. Here, the LED is a blue LED that emits blue light, and the sealing body 12 a is formed of a translucent material in which phosphor particles for converting the wavelength of blue light into yellow light are mixed. Then, a part of the blue light emitted from the LED is wavelength-converted to yellow light by the sealing body 12 a, and white light generated by mixing of unconverted blue light and converted yellow light is emitted from the light emitting module 10 It is emitted. The light emitting unit 12 may be, for example, a combination of a semiconductor light emitting element emitting ultraviolet light and phosphor particles of each color that emits light in three primary colors (red, green, and blue). Furthermore, the wavelength conversion material used for the sealing body 12a includes a substance such as a semiconductor, a metal complex, an organic dye, or a pigment that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light. You may use a material. In the present embodiment, the semiconductor light emitting element is an LED, but the semiconductor light emitting element may be, for example, an LD (laser diode) or an EL element (electric luminescence element).

Moreover, while 32 light-emitting parts 12 are arrange | positioned in a substantially annular shape at equal intervals along the circumferential direction of the mounting board 11, four are arrange | positioned at equal intervals along the outer periphery of the below-mentioned through-hole 11a. There is. In the present embodiment, the term "annular" includes not only substantially annular but also polygonal annular rings such as triangles, quadrilaterals, and pentagons. Therefore, the semiconductor light emitting device 12 may be mounted in, for example, an elliptical or polygonal ring shape.

The mounting substrate 11 is provided with a power receiving terminal 11 b for receiving the power supplied from the lighting unit 30 on the side on which the light emitting unit 12 is mounted. The mounting board 11 has a circular through-hole 11a in a plan view circular shape for penetrating the feeding board 70 which penetrates in the thickness direction of the mounting board 11 and is led out from the lighting unit 30 at substantially the center portion. .

The base 20 is formed in a substantially disc shape, and the light emitting module 10 is mounted on the upper surface. Here, the light emitting module 10 is fixed to the base 20 by three screws 13. In the base 20, a through hole 20a having a circular shape in a plan view and penetrating through the thickness direction of the base 20 and inserting the feed wire 70 is formed in a substantially central portion thereof. The inner diameter of the through hole 20 a is formed to be large enough to allow the connector 71 to be inserted therethrough. This makes it possible to improve the ease of assembly of the lamp. Further, the outer peripheral edge of the lower side end of the base 20 has a tapered shape in accordance with the shape of the inner peripheral surface 53 of the second housing 50. Since the tapered surface 24 is in surface contact with the inner peripheral surface 53 of the second housing 50, the heat transmitted from the light emitting module 10 to the base 20 is more easily conducted to the second housing 50. That is, the heat generated in the light emitting module 10 is conducted to the base 60 mainly through the base 20 and the second housing 50 and further through the small diameter portion 45 of the first housing 40, and from the base 60 to the lighting fixture Heat is dissipated to the side (not shown). The base 20 is integrally formed of a metal material. As the metal material, for example, Al, Ag, Au, Ni, Rh, Pd, an alloy of two or more of them, an alloy of Cu and Ag, or the like can be considered. Since these metal materials have good thermal conductivity, the heat generated by the light emitting module 10 can be efficiently conducted to the second housing 50. The base 20 may be formed of a resin material having good thermal conductivity. Further, the base 20 may be assembled by screwing, bonding, engagement, or the like, instead of being molded as a pair, but molded as a separate part. The base 20 is not limited to the disk shape, and may be an oval or polygonal ring.

The lighting unit 30 is for lighting a semiconductor light emitting element, and includes a circuit board 30a and various electronic components 30b mounted on the circuit board 30a. The electronic component 30b includes a capacitor 30b1 which is a heat-generating component. In FIG. 2, only some electronic components are denoted by reference numerals. The lighting unit 30 is accommodated in the first housing 40, and is fixed to the first housing 40 by, for example, screwing, bonding, and engagement.

By the way, the lighting unit 30 is disposed such that the heat-sensitive electronic component (for example, the capacitor 30b1) is located on the lower side far from the light emitting module 10 and the heat-resistant electronic component is located on the upper side near the light emitting module 10 ing. In this way, there is an advantage that the electronic component which is weak to the heat such as the capacitor 30b1 is hardly thermally destroyed by the heat generated in the light emitting module 10.

The lighting unit 30 and the base 60 are electrically connected by the

electric wires

31 and 32. The electrical wiring 31 is connected to the shell portion 61 of the base 60 through a gap S1 generated between the inner wall of the first housing 40 and the capacitor 30b1. Further, the electrical wiring 32 is connected to the eyelet portion 63 of the base 60 through a gap S2 generated between the inner wall of the first housing 40 and the capacitor 30b1. Further, the lighting unit 30 and the light emitting module 10 are electrically connected by a feed line 70. A connector 71 is provided at the tip of the feed line 70 and is connected to a power receiving terminal 11 b disposed on the circuit board 11 of the light emitting module 10.

The first housing 40 has a substantially cylindrical shape with both sides open, and includes a large diameter first storage portion 44, a small diameter second storage portion 45, and a lid 47. Most of the lighting unit 30 is housed in the first housing portion 44 located in the upper portion of the first housing 40. On the other hand, the base 60 is externally fitted in the second housing portion 45 located at the lower part of the first housing 40, and the lower opening 43 of the first housing 40 is closed. Further, the upper opening 46 of the first storage portion 44 is closed by a substantially disc-like lid 47. A substantially central portion of the lid 47 is provided with a through hole 47 a which penetrates in the thickness direction of the lid 47 and into which the feed line 70 led from the lighting unit 30 is inserted. Here, the through holes 11 a provided in the mounting substrate 11, the through holes 20 a provided in the base 20, and the through holes 47 a provided in the lid 47 overlap with each other in the optical axis direction of the lamp 1. The first housing 40 is formed of an insulating material made of a resin material.

By the way, the peripheral wall of the second housing portion 45 has a thickness distribution, and the thickness distribution is based on the shape of the capacitor 30 b 1 disposed inside the second housing portion 45. That is, the peripheral wall of the second housing portion 45 is formed such that the inner wall thereof is along the outer wall of the capacitor 30b1 in plan view. Specifically, the thickness (for example, W1, W2) of the peripheral wall positioned at both ends in the direction intersecting the arranging direction is smaller than the thickness W0 of the peripheral wall positioned at both ends in the arranging direction of the two capacitors 30b1. It is thicker. Here, as shown in FIGS. 3A and 3B, the engaging recesses P1 to P6 for attaching the base 60 to the second housing portion 45 have the largest thickness in the peripheral wall of the second housing portion 45. It is formed at a site other than the thin site. The engagement recesses P1 to P6 correspond to portions where the engagement recesses P1 to P6 are formed in the upper end portion of the mouthpiece 60 in a state where the mouthpiece 60 is externally fitted to the second housing 45 as described later. By caulking the portion, the engagement convex portion 60 a formed on the upper end portion of the mouthpiece 60 is formed by being embedded in the outer peripheral surface of the second storage portion 45. Therefore, when thickness W1 and W2 of the part where engagement concave part P1-P6 is formed when the engagement convex part 60a formed in the upper end of mouthpiece 60 is made to squeeze in the peripheral face of the 2nd seat 45 In addition, the stress applied to the portions where the engagement recesses P1 to P6 are formed has a thickness that does not cause breakage.

In addition, when the user attaches the lamp 1 to the lighting fixture or assembles the lamp 1, a force may be applied to the base 60 in the direction of separating from the second storage 45 in the assembly process of the lamp 1. At this time, if the depth of the engagement concave portion and the amount of protrusion of the engagement convex portion are small and the attachment strength between the mouthpiece 60 and the second storage portion 45 is not sufficient, the mouthpiece may be detached from the second storage portion There is. Therefore, in the present embodiment, when the user attaches the lamp 1 to the lighting fixture or at the time of assembly, a range of force that can be applied to the base 60 in a direction of separating from the second storage portion 45 (hereinafter referred to as an applied force range In this application range, the thickness W1 and W2 of the portions where the engagement recesses P1 to P6 are formed in the peripheral wall are determined so that the mouthpiece 60 is not separated from the second storage portion 45. .

As shown in FIG. 3B, the thickness in the radial direction of the second storage portion 45 is W1 = 3 mm at the portions where the engaging recesses P1 and P4 are formed, and the engaging recesses P2, P3, P5 and P6 are formed. W2 = 4 mm at the site where the Further, the thickness W0 of the peripheral wall positioned on both ends in the direction in which the two capacitors 30b1 are arranged is 2 mm. Thereby, the strength of the portion where the engagement concave portions P1 to P6 are formed can be enhanced, and hence the strength of the joint portion between the second housing portion 45 and the base 60 can be enhanced. Therefore, the durability of the lamp 1 can be improved. It can be enhanced.

In the present embodiment, an example in which the engagement concave portions P1 to P6 are provided at six places in the second storage portion 45 has been described, but the present invention is not limited to this. By additionally providing one engagement recess at a position adjacent to each of the joint recesses P1 to P6, the engagement recess may be provided at twelve positions in the second storage portion 45. According to this configuration, the attachment strength between the base 60 and the second storage unit 45 can be enhanced.

The second housing 50 has a substantially cylindrical shape whose both ends are open and whose diameter is reduced from the upper side to the lower side. The second housing 50 is made of, for example, a metal material, and as the metal material, for example, Al, Ag, Au, Ni, Rh, Pd, an alloy of two or more of them, an alloy of Cu and Ag, etc. Is considered. Since these metal materials have good thermal conductivity, the heat transmitted to the second housing 50 can be efficiently transmitted to the base 60 side. The material of the second housing 50 is not limited to a metal material, and may be, for example, a resin material having a high thermal conductivity.

The base 60 is a member for receiving power from the light fixture socket when the lamp 1 is attached to the light fixture and turned on. The type of the base 60 is not particularly limited, and examples thereof include an Edison type E26 base and an E17 base. The base 60 has a shell portion 61 which has a substantially cylindrical shape and whose outer peripheral surface is an external thread, and an eyelet portion 63 attached to the shell portion 61 via the insulating portion 62. An insulating member 64 is interposed between the shell 61 and the second housing 50.

The glove 80 is configured to close the upper opening of the second housing 50 in a state of covering the upper side of the light emitting module 10 by press-fitting the opening end thereof into the upper end of the second housing 50. Is mounted above the second housing 50. The shape of the globe 80 is not limited to the shape imitating the bulb of the A-type light bulb, and may be any shape. The glove 80 may be fixed to the second housing 50 by an adhesive or the like. Further, the globe 80 is formed of glass, a resin material or the like, and the inner surface 82 thereof is subjected to a diffusion treatment for diffusing the light emitted from the light emitting module 10, for example, a diffusion treatment with silica or a white pigment ing. The light incident on the inner surface 82 of the globe 80 is transmitted through the globe 80 and taken out of the globe 80.

A method of assembling the lamp 1 according to the present embodiment will be described.

First, the lighting unit 30 is disposed in the first housing 40. At this time, the capacitor 30 b 1 that constitutes a part of the lighting unit 30 is disposed inside the second storage unit 45. In addition, the first storage portion in the second storage portion 45 is passed through the

electric wires

31 and 32 drawn from the lighting unit 30 through the gaps S1 and S2 formed between the inner wall of the second storage portion 45 and the capacitor 30b1. Lead out to the opposite side to the 44 side.

Next, the tips of the

electric wires

31 and 32 are connected to the shell 61 and the eyelet 63 of the base 60 by soldering or the like, and the base 60 is attached to the second housing 45 of the first housing 40. Let it fit.

Subsequently, the upper end portion of the mouthpiece 60 is crimped to form the engagement convex portion 60 a at the upper end portion of the mouth ring 60, and the engagement convex portion 60 a is embedded in the outer peripheral surface of the second storage portion 45. Thus, the engagement recesses P1 to P6 are formed. Here, six portions corresponding to the portions where the engagement concave portions P1 to P6 of the second storage portion 45 are formed at the upper end portion of the mouthpiece 60 are caulked (see FIG. 3B). Thus, the base 60 is attached to the second housing portion 45 in such a manner that each of the six engagement convex portions 61a is engaged with each of the six engagement concave portions P1 to P6 formed in the second housing portion 45. It will be

Thereafter, the first housing is in a state in which the first storage portion 44 is directed upward relative to the second storage portion 45, and a silicone resin is formed in the space formed between the inner wall of the second storage portion 45 and the capacitor 30b1. inject. Then, the silicone resin is filled in the gap between the inner wall of the second housing 45 and the capacitor 30 b 1 and the inside of the base 60. In this process, a force is applied to the base 60 in the direction of separating downward from the second storage portion 45. At this time, gravity corresponding to the weight of the base 60 itself and the weight of the silicone resin charged in the inside of the base 60 is applied to the base 60. Therefore, in the present embodiment, in a state where the cap 60 is temporarily fixed to the second housing portion 45, the gravity corresponding to at least the weight of the cap 60 itself and the weight of the silicone resin charged in the cap 60 is the cap 60. The base 60 is prevented from being detached from the second storage unit 45 even if it is added. Then, the silicone resin is dried and solidified.

Next, the lid 47 is attached so as to cover the upper opening 46 of the first storage portion 44. At this time, in a state where the connector 71 is passed through the through hole 47 a of the lid 47 and the lid 47 is attached to the first housing portion 44, the connector 71 and a part of the feeder 70 are first through the through hole 47 a. It will be in the state where it was pulled out to the exterior of case 40.

Subsequently, after the second housing 50 is placed on the outside of the first housing 40, the base 20 is fitted from the upper side of the second housing 50.

Thereafter, the lower end portion of the glove 80 is fitted into the gap formed between the upper end portion of the second housing 50 and the peripheral portion of the base 20, thereby attaching the glove 80 to the second housing 50.

As described above, in the present embodiment, the peripheral wall of the second storage portion 45 has a thickness distribution, and the engagement recesses P1 to P6 are portions other than the thinnest portion in the peripheral wall of the second storage portion 45. Is formed. As a result, the depths of the engagement concave portions P1 to P6 can be made deep, so that the attachment strength between the base 60 and the second storage portion 45 can be increased. In addition, since the thickness of the portion of the peripheral wall of the second storage portion 45 other than the portions where the engagement concave portions P1 to P6 are formed can be reduced, the internal space of the second storage portion 45 is widened accordingly. Therefore, a space for housing the lighting unit 30 can be easily secured.

Next, the heat radiation path of the lamp 1 will be described.

When the base 60 is attached to the socket of the lighting apparatus and energization is performed, the lighting unit 30 operates to supply power to the light emitting module 10, and the plurality of light emitting units 12 of the light emitting module 10 emit light. The light emitted from the light emitting unit 12 passes through the globe 80 and is irradiated to the outside.

Here, the heat generated in the light emitting portion 12 is mainly transmitted to the base 20 from almost the entire surface of the back surface of the light emitting module 10, conducted to the second housing 50 in contact with the peripheral portion of the base 20, and dissipated to the outside Be done. Also, part of the heat conducted to the second housing 50 is transmitted to the base 60 via the first housing 40 in contact with the second housing 50, and is dissipated from the base 60 to the lighting fixture via the socket .

The heat generated by the lighting unit 30 is conducted to the first housing 40 to which the lighting unit 30 is attached, and is dissipated from the base 60 through the socket to the lighting apparatus.

Here, the heat generated by the capacitor 30b that constitutes a part of the lighting unit 30 is conducted to the peripheral wall of the second housing portion 45 of the first housing 40 via the silicone resin, and illumination is performed from the base 60 via the socket. Heat is dissipated to the appliance. As described above, in the lamp 1 according to the present embodiment, the heat generated by the lighting unit 30 is not only dissipated to the outside through the first housing 40 and the second housing 50 but also from the base 60 to the socket The heat dissipation of the lighting unit 30 can be further improved because the heat is also dissipated from the entire lighting apparatus.
Second Embodiment
FIG. 4 is a perspective view of the lighting fixture 100 according to the present embodiment.

This lighting fixture 100 shows a garden light equipped with a lamp 1. The lighting fixture 100 comprises a fixture body 101 and a base 102 for mounting the fixture body 101 on a wall C.

A socket (not shown) is provided in the instrument body 101, and a base 60 of the lamp 1 is attached to the socket. In addition, installation of the lighting fixture 100 is performed by fixing the base 102 to the wall C, Moreover, the direction of the tool main body 100 can be changed with respect to the base 102, and the irradiation direction of light may be changed arbitrarily. it can.
<Modification>
(1) In the first embodiment described above, an example was described in which the gap between the inner wall of the second housing portion 45 of the first housing 40 and the capacitor 30b1 was filled with the silicone resin which is a heat conductive resin. It is not limited to this. For example, the gap between the inner wall of the second housing 45 and the capacitor 30b1 may be hollow.

In this modification, since the volume of the gap between the inner wall of the second housing portion 45 and the capacitor 30b1 is small, sufficient heat dissipation characteristics can be obtained without filling with a heat conductive resin such as silicone resin. Therefore, the cost can be reduced by reducing the number of members.

(2) In the above-mentioned Embodiment 1, although the example which capacitor 30b1 which comprises a part of lighting unit 30 is accommodated in the 2nd accommodating part 45 was demonstrated, it is not limited to this. For example, as shown in FIG. 5, the lighting unit 30 includes two heat pipes 30c capable of transmitting heat generated by the electronic component 30 including the circuit board 30a and the capacitor 30b1. A part may be stored in the second storage unit 45. In the present modification, when the occupancy rate of the heat pipe 30c in the second storage portion 45 is smaller than when the capacitor 30b1 is stored in the second storage portion 45, the thickness of the peripheral wall of the second storage portion 45 is reduced. It can be thicker than in the case of Form 1 (see FIGS. 6 (a) and (b)). In this case, as shown in FIG. 6B, even if the caulking site is increased to six or more places (10 places in the example of FIG. 6B), the engagement recesses P11 to P20 in the first housing 40 It is possible to suppress the destruction of the first housing 40 caused by the stress applied to the portion forming the.

Further, by increasing the number of portions in which the engaging concave portions P11 to P20 are formed in the peripheral wall of the second housing portion 45, the bonding strength between the base 60 and the first housing 40 can be enhanced.

In the present modification, the heat generated by the lighting unit 30 is conducted to the base 70 through the heat pipe 30c.

In addition, this modification is not limited to the lamp | ramp 2 of the structure shown in FIG. For example, it may be a bulb-type lamp 3 provided with a beam splitter 90 as shown in FIG.

(3) As a modification of the first embodiment described above, for example, an electronic component (for example, capacitor 30 b 1) and a cap 60 of which the calorific value is larger than that of other electronic components among the electronic components constituting the lighting unit 30. A heat transfer member 30d in the form of a string may be provided between the two, and the heat generated by the electronic component having a large amount of heat generation may be directly conducted to the base 60 and dissipated. For example, as shown in FIG. 8, one end of a string-like heat conduction member 30 d is fixed to a portion connected to the capacitor 30 b 1 and protruding to the lower side of the circuit board 30 a, and an adhesive whose other end is a heat conductive resin It fixes to the insulation part 72 of the nozzle | cap | die 60 via this, and the structure which makes the heat | fever which generate | occur | produces with the large electronic component of heat generation be conducted to the nozzle | cap | die 60 via 30 d of heat conduction members.

In this case, since the heat conduction member 30d is in the form of a string, the occupancy rate of the heat conduction member 30d in the second accommodation portion 45 accommodates the heat pipe 30c described in (2) above in the second accommodation portion 45. Since the size can be further reduced as compared with the case, the thickness of the peripheral wall of the second storage portion 45 can be further increased as compared with the modification described in the above (2).

(4) In the first embodiment described above, the capacitor 30b1 constituting a part of the lighting unit 30 is housed in the second housing portion 45, and the peripheral wall of the second housing portion 45 has a thickness distribution based on the shape of the capacitor 30b1. Although the example which it has is demonstrated, for example, as shown in FIG. 9, the site | part in which the engagement recessed part P21, P22, P23 in the surrounding wall of the 2nd accommodating part 45 was formed is not limited to this. It may be formed to be thicker than the portion. In this modification, as shown in FIG. 9, the thickness W4 of the portion where the engagement concave portions P21, P22 and P23 are formed is 3 mm.

According to the present modification, it is only necessary to thicken the thickness of the portion forming the engagement concave portions P21, P22, P23 among the peripheral walls of the second housing portion 45, so that the material cost of the first housing 40 can be reduced. Can be

(5) In the first embodiment described above, the capacitor 30b1 constituting a part of the lighting unit 30 is housed in the second housing portion 45, and the peripheral wall of the second housing portion 45 has a thickness distribution based on the shape of the capacitor 30b1. Although the example which it has was demonstrated, if the number of objects of capacitor | condenser 30b1 differs, you may change the surrounding wall of the 2nd accommodating part 45 according to it.

For example, as shown in FIG. 10, a capacitor 30b1 constituting a part of the lighting unit 30
In the case where there is only one, the thickness of the peripheral wall may be made thicker than that of the first embodiment in accordance with the outer peripheral shape of the capacitor 30b1. In this case, for example, the engagement recesses P61, P62,..., P612 may be formed at 12 locations in the peripheral wall of the second storage portion 45.

Further, as shown in FIG. 11, in the case where there are three capacitors 30b1 that configure a part of the lighting unit 30, the thickness distribution of the peripheral wall of the second housing portion 45 is based on the shape enveloping the three capacitors 30b1. Should be set. In this case, the engagement recess may be provided in each of the three portions of the peripheral wall of the second storage portion 45 which are thicker than the other portions. For example, as shown in FIG. 11, if the engagement concave portions P71, P72,..., P712 are formed in total 12 places at three places in each of three relatively thick portions in the peripheral wall of the second storage part 45 Good.

The present invention can be widely used in lighting in general.

1, 2, 3, 4, 5, 6, 7 Lamps 10 Light emitting modules 11 Mounting boards 20 Bases 30 Lighting units 30a Circuit boards 30b Electronic parts 30b1

Capacitors

31, 32 Electrical wiring 40 First housing 44 First housing 45 Second storage section P1, P2, P3, P4, P5, P6 Engaging recess 50 Second case 60 Base 61 Shell 61a Engaging projection 62 Insulating 63 Eyelet 70 Feeding wire 71 Connector 80 Glove

Claims

A light source having a semiconductor light emitting element;
A lighting unit for lighting the light source;
A housing having a first housing portion for housing the first portion of the lighting unit, and a second housing portion for housing the second portion other than the first portion of the lighting unit and having an engaging recess formed on the outer wall ,
An inner wall having an engagement convex portion, and in a state of being externally fitted to the second storage portion, the cap being attached to the second storage portion by joining the engagement convex portion to the engagement concave portion; Equipped with
The peripheral wall of the second storage portion has a thickness distribution, and the engagement concave portion is formed in a portion excluding the thinnest portion in the peripheral wall of the second storage portion.
The lamp according to claim 1, wherein the thickness distribution is based on a shape of the second portion disposed inside the second storage portion.
The said engagement recessed part and the said engagement convex part are formed by crimping a part of said nozzle | cap | die in the state which externally fitted the said nozzle | cap | die to the said 2nd accommodating part. Lamp.
The lamp according to claim 3, wherein the second storage portion is filled with a heat conductive resin.
The lighting unit includes a mounting substrate on which a plurality of electronic components are mounted,
The lamp according to claim 4, wherein the second portion houses at least one electronic component.
The lighting unit includes a heat pipe for radiating heat generated by the mounting substrate,
The lamp according to claim 1, wherein the second portion is a part of the heat pipe.
A lamp according to claim 1;
And a fixture body having a socket to which the base of the lamp is attached.