WO2013008462A1 - 電流センサ用基板及び電流センサ - Google Patents
電流センサ用基板及び電流センサ Download PDFInfo
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- WO2013008462A1 WO2013008462A1 PCT/JP2012/004488 JP2012004488W WO2013008462A1 WO 2013008462 A1 WO2013008462 A1 WO 2013008462A1 JP 2012004488 W JP2012004488 W JP 2012004488W WO 2013008462 A1 WO2013008462 A1 WO 2013008462A1
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/146—Measuring arrangements for current not covered by other subgroups of G01R15/14, e.g. using current dividers, shunts, or measuring a voltage drop
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
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Definitions
- the present invention relates to a current sensor substrate and a current sensor, and more particularly to a current sensor substrate and a current sensor provided with a primary conductor having a U-shaped current path.
- a method of detecting a magnetic flux generated around the measurement current flowing is known.
- a method of arranging a magnetoelectric conversion element in the vicinity of a primary conductor through which a measurement current flows is known.
- FIG. 1 shows an example of a conventional current sensor.
- a U-shaped current conductor portion 204a is formed in the conductive clip 204, and the Hall element 208 is disposed inside the U-shape. Since the magnetic flux density is high near the center of the U-shaped inner side, the measurement sensitivity is improved.
- the current sensor shown in FIG. 1 requires manufacturing labor, such as requiring the conductive clip 204 to be separately provided and coupled to the lead terminals 202a to 202d, resulting in an increase in cost.
- the present invention has been made in view of such problems, and a first object thereof is to reduce manufacturing costs in a current sensor including a primary conductor having a U-shaped current path.
- a second object is to provide a substrate for the current sensor.
- a first aspect of the present invention includes a primary conductor having a U-shaped current path, a support portion for supporting a magnetoelectric conversion element, and a lead terminal connected to the support portion.
- the lead terminal may be connected to the support portion through a step.
- the support portion has a notch portion, and the current path is disposed in the notch portion in plan view. Good.
- the primary conductor may have a stepped portion connected to the current path.
- the fifth aspect of the present invention may further include a magnetic material arranged so as to overlap the U-shaped current path in plan view in any of the first to fourth aspects.
- the sixth aspect of the present invention may further include a magnetic material arranged so as to sandwich the U-shaped current path in any one of the first to fifth aspects.
- the current sensor substrate according to any one of the first to fourth aspects, and the current of the current sensor substrate disposed on the support portion of the current sensor substrate. It is good also as a current sensor provided with the IC chip which has the magnetoelectric conversion element which detects the magnetic flux which arises from the current which flows through a course.
- the magnetoelectric conversion element may be arranged inside the U-shape of the U-shaped current path in plan view.
- the current sensor substrate according to the fifth or sixth aspect and a current flowing through the current path of the current sensor substrate disposed on the support portion of the current sensor substrate are generated.
- the magnetic material is formed on the surface of the IC chip opposite to the surface on which the U-shaped current path is disposed. It may be formed so as to cover a part or the whole.
- the magnetic material may be formed on the support portion apart from the primary conductor.
- the magnetic material may be composed of a magnetic plating or a magnetic chip.
- the IC chip may protrude from the support portion in a side view.
- the IC chip overlaps the current path in a plan view, and the magnetoelectric conversion element has the U-shaped current path in the plan view. It may be arranged inside the character shape.
- the IC chip may be disposed with a predetermined distance from the U-shaped current path in a side view.
- the primary conductor may not support the IC chip.
- the support portion of the current sensor substrate has a notch, and the U-shaped current path of the current sensor substrate is Further, it may be disposed in the cutout portion in plan view and overlap with the IC chip.
- the magnetoelectric conversion element may be a Hall element.
- the IC chip is arranged at a position outside the U-shape of the current path and close to the current path. You may make it further provide a magnetoelectric conversion element.
- the magnetoelectric conversion element may be a Hall IC or a magnetoresistive IC including a signal processing circuit.
- the twenty-first aspect may further include an insulating member formed between a primary conductor of the current sensor substrate and the IC chip.
- the insulating member may be an insulating tape.
- a U-shaped current conductor includes a primary conductor having a U-shaped current path, a support portion for supporting a magnetoelectric conversion element, and a signal terminal side member having a lead terminal connected to the support portion.
- FIG. 3 is a side view of the current sensor of FIG. 2.
- FIG. 3 is a sectional view taken along line IIIB-IIIB in FIG. 2.
- FIG. 5 is a diagram for explaining a method of manufacturing the current sensor according to the first embodiment.
- FIG. 5 is a diagram for explaining a method of manufacturing the current sensor according to the first embodiment.
- FIG. 5 is a diagram for explaining a method of manufacturing the current sensor according to the first embodiment.
- FIG. 5 is a diagram for explaining a method of manufacturing the current sensor according to the first embodiment.
- FIG. 5 is a diagram for explaining a method of manufacturing the current sensor according to the first embodiment.
- FIG. 5 is a diagram for explaining a method of manufacturing the current sensor according to the first embodiment.
- FIG. 5 is a diagram for explaining a method of manufacturing the current sensor according to the first embodiment. It is a figure which shows the deformation
- FIG. 2 shows a current sensor according to the first embodiment.
- the current sensor 200 includes a primary conductor 210 having a U-shaped current path 210A, a support portion 220A for supporting a magnetoelectric conversion element 230A such as a Hall element, and a signal terminal side member 220 having lead terminals 220B_1 and 220B_2 (hereinafter referred to as a “terminal”). , Simply abbreviated as “member 220”), and an IC chip 230 having a magnetoelectric conversion element 230A that is disposed on the support 220A and detects a magnetic flux generated from a current flowing through the current path 210A.
- the primary conductor 210, the member 220, and the IC chip 230 are molded with a resin 240 to form the current sensor 200.
- a portion excluding the IC chip 230 and the resin 240 is a current sensor substrate.
- the lead terminal 220B_1 represents a lead terminal connected to the support part 220A
- the lead terminal 220B_2 represents a lead terminal not connected to the support part 220A.
- each lead terminal is simply referred to as the lead terminal 220B.
- the current path 210A is arranged close to the support portion 220A so as not to overlap the support portion 220A in plan view. Further, as can be seen from the side view of FIG. 3A and the cross-sectional view of FIG. 3B, in a side view, the flat portion of the surface on the side of placing the IC chip 230 of the support portion 220A, and the surface of the current path 210A near the IC chip 230 The support portion 220A and the current path 210A are arranged so that the height of the flat portion is different.
- the support portion 220A and the lead terminal 220B_1 are integrally formed of a metal material, not a separate member. That is, the support portion 220A and the lead terminal 220B_1 are physically integrated, and are physically and electrically connected.
- the magnetoelectric conversion element 230A is arranged inside the U-shaped of the current path 210A in plan view. Further, the IC chip 230 protrudes from the support portion 220A in a side view and overlaps with the current path 210A in a plan view.
- the member 220 has a stepped portion 220C between the support portion 220A and the lead terminal 220B.
- a step 220C having a thickness of about 20 to 100 ⁇ m can be provided by forming the member 220, whereby a clearance is obtained between the current path 210A and the IC chip 230.
- the clearance ensures a high withstand voltage between the primary conductor 210 and the IC chip 230, and enables the high withstand voltage to be maintained inside the package.
- the conductive path 210A of the primary conductor 210 and the IC chip 230 come into contact with each other, and even if an insulating sheet is pasted on the back surface of the IC chip 230 in advance, the dielectric strength is low and the dielectric breakdown is likely to occur. End up.
- an insulating sheet may be pasted on the primary conductor 210 in advance, the process becomes complicated, and the feasibility is low in a situation where manufacturing cost is required to be suppressed.
- FIGS. 4A to 4C and FIGS. 5A to 5C a method of manufacturing the current sensor 200 according to the first embodiment will be described.
- a lead frame on which a desired pattern is formed is produced from a single metal plate.
- FIG. 4A shows a portion corresponding to one current sensor.
- the step 220C is provided in the member 220 by forming by pressing or the like (FIG. 4B).
- the IC chip 230 is die-bonded to the support portion 220B
- the lead terminal 220A and the IC chip 230 are wire-bonded (FIG. 4C).
- FIG. 5A is a plan view
- FIG. 5B is a front view
- FIG. 5C is a right side view.
- the current sensor 200 has a smaller number of parts than the conventional one, and the manufacturing cost is reduced. In addition, a high withstand voltage between the primary conductor 210 and the IC chip 230 is achieved. Can be guaranteed.
- FIG. 6A shows a modification of the current sensor 200 according to the first embodiment.
- the current sensor 600 is the same as the current sensor 200 except for the IC chip 630.
- the first magnetoelectric conversion element 630A is arranged inside the U-shape of the current path 210A in plan view
- the second magnetoelectric conversion element 630B is It is designed to be disposed outside the U-shape of the current path 210A and in a position close to the current path 210A.
- FIG. 7 shows a cross-sectional view along the line VII-VII in FIG. 6A.
- the magnetic flux density at the position of the first magnetoelectric conversion element 630A generated by the current flowing through the primary conductor 210 is B1s
- FIG. 6B shows an example in which three magnetoelectric conversion elements are used as another modification of the current sensor 200 according to the first embodiment.
- the current sensor 700 is the same as the current sensor 200 except for the IC chip 730.
- the first magnetoelectric conversion element 730A is disposed inside the U shape of the current path 210A in plan view, and the second magnetoelectric conversion element 730B and the second magnetoelectric conversion element 730B
- the third magnetoelectric conversion element 730C is designed to be disposed outside the U-shaped ends of the current path 210A and in a position close to the current path 210A.
- a current path having a C-shape, a V-shape, or a similar shape may be used for the current path 210A as one form of the U-shaped current path.
- FIG. 8 shows a current sensor according to the second embodiment.
- the current sensor 800 is different from the current sensor 200 of the first embodiment in that, instead of the IC chip 230 protruding from the support part 220A in a side view, the support part 820A of the member 220 has a notch part 820A ′, The current path 210A is arranged at the notch 820A ′ in plan view. Therefore, although the IC chip 230 does not protrude, the IC chip 230 and the current path 210A overlap in plan view.
- 9A shows a side view and FIG. 9B shows a cross-sectional view.
- the processing of the stamping mold of the lead frame is slightly complicated.
- a degree of freedom is provided in the arrangement of the magnetoelectric conversion elements in the IC chip, and the magnetoelectric conversion elements can be arranged inside the IC chip. Therefore, it is possible to reduce the influence on the offset due to the stress. Further, since the bonding area between the support portion and the IC chip increases, the IC chip can be supported more stably.
- the IC chip 230 may be an IC chip 630 having two magnetoelectric conversion elements or an IC chip 730 having three magnetoelectric conversion elements.
- FIG. 10 shows a current sensor according to the third embodiment.
- the current sensor 1000 is different from the current sensor 200 of the first embodiment in that the primary conductor 210 has a step portion 210C adjacent to the current path 210A, not the member 220.
- the IC chip 230 protrudes from the support portion 220A in a side view and overlaps with the current path 210A in a plan view.
- FIG. 11A shows a side view and FIG. 11B shows a cross-sectional view.
- the IC chip 230 may be an IC chip 630 having two magnetoelectric conversion elements or an IC chip 730 having three magnetoelectric conversion elements.
- FIG. 12 shows a configuration example of the current sensor according to the fourth embodiment.
- this current sensor 500A similar to that shown in FIG. 2, for example, a primary conductor 210 having a U-shaped current path 210A and a conductor terminal 210B and a magnetoelectric conversion element 230A are supported.
- a member 220 having a support portion 520A and a lead terminal 220B and an IC chip 230 having a magnetoelectric conversion element 230A are provided.
- Primary conductor 210, member 220, and IC chip 230 are molded with resin 240A.
- a magnetic material chip 540 made of a magnetic material is formed on the IC chip 230.
- the support portion 520A is further configured to support a magnetic material chip 550 made of a magnetic material such as ferrite.
- the support portion 520A includes, for example, two step portions 521A and 521B. The shape of the step portions 521A and 521B will be described with reference to FIG.
- the magnetic material chips 540 and 550 are arranged so that the magnetic flux generated by the current flowing through the current path 210A of the primary conductor 210 is converged on the magnetic sensing part of the magnetoelectric conversion element 230A.
- the current sensor 500A becomes a current sensor substrate by removing the IC chip 230 and the resin 240A from the above-described components of the current sensor 500A.
- FIG. 13 is a side view of the current sensor 500A of FIG.
- the step portion 521A of the support portion 520A is formed so that the center portion of the support portion 520A protrudes upward, and the tip portion of the support portion 520A is located below the primary conductor 210. It is formed to protrude.
- tip 550 is formed in the lower part of this support part 520A.
- the magnetic material chip 550 is formed on the support portion 520 ⁇ / b> A apart from the primary conductor 210.
- the current sensor 500A With the configuration of the current sensor 500A, when a current flows through the current path of the primary conductor 210, the magnetic material chips 540 and 550 are formed. Therefore, the magnetic flux generated by the current is easily converged on the magnetic sensing part of the magnetoelectric transducer 230A. Become. Therefore, the current detection sensitivity of the current sensor 500A is improved.
- the formation of the magnetic material chips 540 and 550 suppresses the intrusion of an external magnetic field into the current sensor 500A.
- the present embodiment is a current sensor in which only one magnetic chip 540 is formed to improve the current detection sensitivity and to suppress the intrusion of an external magnetic field.
- FIG. 14 shows a configuration example of the current sensor according to the fifth embodiment.
- the current sensor 500B of the present embodiment includes a primary conductor 210 having a U-shaped current path 210A, a support portion 520B and a lead terminal 220B for supporting the magnetoelectric conversion element 230A, for example.
- the IC chip 230 having the magnetoelectric conversion element 230A.
- a magnetic material chip 540 made of a magnetic material is formed on the IC chip 230.
- Primary conductor 210, member 220, and IC chip 230 are molded with resin 240A.
- the support portion 520B of the present embodiment has, for example, only one step portion 521A.
- the current sensor 500B becomes a current sensor substrate by removing the IC chip 230 and the resin 240A from the above-described components of the current sensor 500B.
- FIG. 15 is a side view of the current sensor 500B of FIG. Similarly to the one shown in FIG. 13, in the current sensor 500B, the step portion 521A of the support portion 520B is formed so that the central portion of the support portion 520B protrudes upward. Similarly to the one shown in FIG. 13, the magnetic material chip 540 has an IC chip so that the magnetic flux generated by the current flowing through the current path 210A of the primary conductor 210 is converged on the magnetic sensitive part of the magnetoelectric conversion element 230A. 230.
- the current sensor 500B With the configuration of the current sensor 500B, when a current flows through the current path of the primary conductor 210, the magnetic material chip 540 is formed, so that the magnetic flux generated by the current is easily converged on the magnetic sensing part of the magnetoelectric conversion element 230A. Therefore, the current detection sensitivity of the current sensor 500B is improved.
- the formation of the magnetic material chip 540 suppresses the intrusion of an external magnetic field from the upper surface of the package to the current sensor 500B.
- the present embodiment is a current sensor in which only one magnetic chip 550 is formed to improve the current detection sensitivity and to suppress the intrusion of an external magnetic field.
- FIG. 16 shows a configuration example of a current sensor according to the sixth embodiment.
- the current sensor 500C of this embodiment includes a primary conductor 210 having, for example, a U-shaped current path 210A, a support portion 520A and a lead terminal 220B for supporting the magnetoelectric conversion element 230A.
- the IC chip 230 having the magnetoelectric conversion element 230A.
- a magnetic material chip 540 made of a magnetic material is formed below the support portion 520A.
- Primary conductor 210, member 220, and IC chip 230 are molded with resin 240A.
- the current sensor 500C becomes a current sensor substrate by removing the IC chip 230 and the resin 240A from the above-described components of the current sensor 500C.
- FIG. 17 is a side view of the current sensor 500C of FIG.
- the step portion 521A of the support portion 520A is formed so that the center portion of the support portion 520A protrudes upward
- the step portion 521B is formed of the support portion 520A.
- the tip portion is formed so as to protrude below the primary conductor 210.
- the magnetic material chip 550 has a support portion so that the magnetic flux generated by the current flowing through the current path 210A of the primary conductor 210 is converged on the magnetic sensitive portion of the magnetoelectric conversion element 230A. It is arranged at the bottom of 520A.
- the magnetic resistance is lowered because the magnetic material chip 550 is formed, and the magnetic flux generated by the primary conductor current is increased. Therefore, the current detection sensitivity of the current sensor 500C is improved.
- the formation of the magnetic material chip 550 suppresses the intrusion of an external magnetic field from the back surface of the package with respect to the current sensor 500C.
- the primary conductor 210 having the U-shaped current path 210A has been described as an example.
- the function of the current sensor can be realized as an example of another shape of the current path 210A.
- other shapes may be used.
- the case where the IC chip 230 having one magnetoelectric conversion element is applied has been described.
- the IC chip for example, two or more magnetoelectric conversion elements are provided. May be.
- the magnetic chips 540 and 550 made of a magnetic material are applied has been described.
- the magnetic material for example, a magnetic plating formed on the IC surface or the like But you can.
- the insulating member is an insulating tape made of a sheet material having an excellent pressure resistance, and it is preferable that one surface of the insulating tape is coated with an adhesive.
- Each of the support portions 520A and 520B of the current sensors 500A, 500B, and 500C of each embodiment has a stepped portion, but the shape of the stepped portion may be changed as long as the height of the support portion can be changed. is there. Further, the number of the stepped portions may be three or more as long as the function of the current sensor can be realized.
- the magnetoelectric conversion element of each embodiment may be a Hall IC or a magnetoresistive IC including a signal processing circuit.
Abstract
Description
図2に、第1の実施形態に係る電流センサを示す。電流センサ200は、U字形の電流経路210Aを有する一次導体210と、ホール素子等の磁電変換素子230Aを支持するための支持部220A、及びリード端子220B_1,220B_2を有する信号端子側部材220(以下、単に「部材220」と略記する。)と、支持部220Aに配置された、電流経路210Aを流れる電流から生じる磁束を検出する磁電変換素子230Aを有するICチップ230とを備える。一次導体210、部材220、及びICチップ230を樹脂240でモールドして、電流センサ200が形成される。ICチップ230及び樹脂240を除いた部分が電流センサ用基板である。
Vo1=k1×(B1s+B1n)+Vu1
Vo2=k2×(-B2s+B2n)+Vu2
となる。但し、k1、k2は各々の感度係数、Vu1、Vu2は各々のオフセット値である。
Vo=Vo1-Vo2=k×(B1s+B2s)
となり、外来磁場によるノイズが消えるとともに、U字形内側の第1の磁電変換素子630Aのみの場合よりも大きな信号が得られるので、感度向上につながる。
Vo=Vo1-(Vo2+Vo3)/2=k×(B1s+(B2s+B3s)/2)
となり、2つの場合と同様に外来磁場によるノイズが消え感度も向上するとともに、1次導体210とICチップ730の位置関係が3つの磁電変換素子の配置方向にズレが生じた場合でも、出力Voの変動レベルを極力抑えることができるようになる。
図8に、第2の実施形態に係る電流センサを示す。電流センサ800が第1の実施形態の電流センサ200と異なるのは、ICチップ230が側面視において支持部220Aから突出する代わりに、部材220の支持部820Aが、切欠部820A’を有し、電流経路210Aが、平面視において切欠部820A’に配置されている点である。したがって、ICチップ230は突出しないものの、平面視において、ICチップ230と電流経路210Aは重複する。図9Aに側面図、図9Bに断面図を示す。第1の実施形態と比較して側面視において高さの異なる電流経路210Aが、平面視において切欠部820A’に配置されているためにリードフレームのスタンピング金型の加工が若干複雑になるが、ICチップ内の磁電変換素子の配置に自由度が生まれ、ICチップのより内側に配置できるようになるため、応力起因によるオフセットへの影響を低減することができる。また支持部とICチップとの接着面積が増えるためICチップをより安定に支持することが可能となる。
図10に、第3の実施形態に係る電流センサを示す。電流センサ1000が第1の実施形態の電流センサ200と異なるのは、部材220ではなく、一次導体210が段差部210Cを電流経路210Aに隣接する位置に有する点である。ICチップ230は、側面視において支持部220Aから突出しており、平面視において電流経路210Aと重複する。図11Aに側面図、図11Bに断面図を示す。
次に、電流センサの一実施形態として、電流検出感度を向上させつつ、外部磁場の侵入の抑制をも可能とするようにした電流センサについて図12および図13を参照して説明する。本実施形態の電流センサは、全体の構成は図2に示した第1の実施形態のものとほぼ同様であるが、磁性材料を有する構成が第1の実施形態のものと異なる。
次に、第5の実施形態について図14および図15を参照して説明する。
次に、第6の実施形態について図16および図17を参照して説明する。
上述した各実施形態にかかる電流センサは例示に過ぎず、以下に示すような変更を行うことが可能である。
210 一次導体
210A 電流経路
210B 一次導体端子
210C 段差部
220 信号端子側部材
220A 支持部
220B,220B_1,220B_2 リード端子
220C 段差部
230 ICチップ
230A 磁電変換素子
500A,500B,500C 電流センサ
520A,520B 段差部
630 ICチップ
630A 第1の磁電変換素子
630B 第2の磁電変換素子
800 電流センサ
820A 支持部
820A’ 切欠部
1000 電流センサ
Claims (22)
- U字形の電流経路を有する一次導体と、
磁電変換素子を支持するための支持部と、
前記支持部と接続するリード端子と、
を備え、
前記U字形の電流経路は、平面視において前記支持部と重複せず、且つ、
側面視において前記支持部と高さが異なるように形成されていることを特徴とする電流センサ用基板。 - 前記リード端子は、前記支持部と段差を介して接続していることを特徴とする請求項1に記載の電流センサ用基板。
- 前記支持部は、切欠部を有し、
前記U字形の電流経路は、平面視において前記切欠部に配置されていることを特徴とする請求項1又は2に記載の電流センサ用基板。 - 前記一次導体は、前記U字形の電流経路に接続する段差部を有することを特徴とする請求項1から3のいずれかに記載の電流センサ用基板。
- 平面視において前記U字形の電流経路と重なるように配置される磁性体材料を更に有することを特徴とする請求項1から4のいずれかに記載の電流センサ用基板。
- 前記U字形の電流経路を挟むように配置される磁性体材料を更に有することを特徴とする請求項5に記載の電流センサ用基板。
- 請求項1から4のいずれかに記載の電流センサ用基板と、
前記電流センサ用基板の前記支持部に配置された、前記電流センサ用基板の前記U字形の電流経路を流れる電流から生じる磁束を検出する磁電変換素子を有するICチップと
を備える電流センサ。 - 前記磁電変換素子は、平面視において前記U字形の電流経路の前記U字形の内側に配置されていることを特徴とする請求項7に記載の電流センサ。
- 請求項5又は6に記載の電流センサ用基板と、
前記電流センサ用基板の前記支持部に配置された、前記電流センサ用基板の前記電流経路
を流れる電流から生じる磁束を検出する磁電変換素子を有するICチップと
を備え、
前記磁電変換素子は、平面視において前記U字形の電流経路の前記U字形の内側に配置されていることを特徴とする電流センサ。 - 前記磁性材料は前記ICチップの前記U字形の電流経路が配置されている側の面とは反対の面側に、前記磁電変換素子の一部もしくは全体を覆うように形成されていることを特徴とする請求項9に記載の電流センサ。
- 前記磁性材料は、前記一次導体から離れて前記支持部上に形成されていることを特徴とする請求項9又は10に記載の電流センサ。
- 前記磁性材料は、磁性体メッキまたは磁性体チップで構成されていることを特徴とする請求項9から11のいずれかに記載の電流センサ。
- 前記ICチップは、側面視において前記支持部から突出していることを特徴とする請求項7から12のいずれかに記載の電流センサ。
- 前記ICチップは、平面視において前記電流経路と重複しており、前記磁電変換素子は、平面視において前記U字形の電流経路の前記U字形の内側に配置されていることを特徴とする請求項13に記載の電流センサ。
- 前記ICチップは、側面視において前記U字形の電流経路と所定の間隔をもって配置されていることを特徴とする請求項13又は14に記載の電流センサ。
- 前記一次導体は前記ICチップを支持していないことを特徴とする請求項13から15のいずれかに記載の電流センサ。
- 前記電流センサ用基板の前記支持部は、切欠部を有し、
前記電流センサ用基板の前記U字形の電流経路は、平面視において前記切欠部に配置されており、かつ、前記ICチップと重複することを特徴とする請求項7から12のいずれかに記載の電流センサ。 - 前記磁電変換素子は、ホール素子であることを特徴とする請求項7から17のいずれかに記載の電流センサ。
- 前記ICチップは、前記電流経路のU字形の外側であって前記電流経路に近接する位置に配置された第2の磁電変換素子をさらに備えることを特徴とする請求項7から18のいずれかに記載の電流センサ。
- 前記磁電変換素子は、信号処理回路を含むホールICまたは磁気抵抗ICであることを特徴とする請求項7から19のいずれかに記載の電流センサ。
- 前記電流センサ用基板の一次導体と前記ICチップとの間に形成される絶縁部材をさらに有することを特徴とする請求項7から20のいずれかに記載の電流センサ。
- 前記絶縁部材は、絶縁テープであることを特徴とする請求項21に記載の電流センサ。
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JP2013523832A JP5695195B2 (ja) | 2011-07-13 | 2012-07-11 | 電流センサ用基板及び電流センサ |
CN201280034639.0A CN103649762B (zh) | 2011-07-13 | 2012-07-11 | 电流传感器用基板以及电流传感器 |
KR1020147000480A KR101503224B1 (ko) | 2011-07-13 | 2012-07-11 | 전류 센서용 기판 및 전류 센서 |
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JP7329118B1 (ja) * | 2022-10-24 | 2023-08-17 | 旭化成エレクトロニクス株式会社 | 電流センサ |
US11867728B1 (en) | 2022-10-24 | 2024-01-09 | Asahi Kasei Microdevices Corporation | Current sensor |
Also Published As
Publication number | Publication date |
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US20140167736A1 (en) | 2014-06-19 |
JPWO2013008462A1 (ja) | 2015-02-23 |
KR101503224B1 (ko) | 2015-03-16 |
CN103649762A (zh) | 2014-03-19 |
TWI480554B (zh) | 2015-04-11 |
KR20140019470A (ko) | 2014-02-14 |
JP5695195B2 (ja) | 2015-04-01 |
US9448256B2 (en) | 2016-09-20 |
EP2733496B1 (en) | 2016-09-07 |
EP2733496A4 (en) | 2014-12-24 |
EP2733496A1 (en) | 2014-05-21 |
CN103649762B (zh) | 2015-09-16 |
TW201314216A (zh) | 2013-04-01 |
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