TWI312581B - Chip-on-glass package of image sensor - Google Patents

Description

1312581 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to an image sensor package capable of replacing a ball τ t ^ 八 格 Array (BgA) or a planar grid array (LGA), T show Technology, especially related to a kind of shirt image sensing|§ glass flip-chip package structure [prior technology] In the early image sensor package, the batch was made by s... ^

Connecting the wafer to the substrate, as disclosed in the National Patent No. 122 1 329, the image sensing chip is attached to the substrate (small-sized printed circuit board), and the wire is formed by wire bonding. ^ Α 4 Electrically connect the image sensing wafer to bond a light-transmissive glass over the wafer, so that the wafer and the wire are placed in a straight, rolled space. In addition, a lattice array of solder balls or metal pads are disposed under the substrate to form a BGA or LGA package. When the conventional-de-like sensor package structure & surface is bonded to an external printed circuit board, the fresh ball or metal pad is soldered to the connection pad of the external printed circuit board, and the electrical connection and mechanical bonding are achieved at the same time. . However, the solder ball or the bonding metal pad /, 〃 '^ 膏 cream has a considerable horizontal error change during reflow soldering' plus the wafer and the substrate are fixed in the direction of the image, so In addition, the 9 line is too large to enter - the product is displayed, the original is artificial, and the system is broken. The angle and the universal direction of the image sensing cannot be adjusted, so that the image sensor cannot be correctly sensed. The image in the correct position. The overall appearance of the connected image sensor package structure is too large to be installed in portable electronic products. For example, National Patent No. 12428 139

The 1312581 glass flip-chip package structure includes a fan-out type flexible circuit board external portion with a reinforcing plate coupled to the other surface of the contact finger for re-insertion to the external electronic component to achieve a modular design. The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. According to the present invention, a glass flip chip package structure of an image sensor mainly comprises a glass substrate, a bump image sensing chip and a fan-out flexible circuit board. A surface of the glass substrate is formed with a first wiring layer. The image sensing chip is flip-chip bonded to the glass substrate. One active surface of the image sensing chip has a sensing region and a plurality of bumps electrically connected to the first circuit layer. The sensing zone is oriented toward the glass substrate. The flexible circuit board has an inner bonding portion, a bendable portion and an outer connecting portion and is formed with a second circuit layer, wherein the second circuit layer has a plurality of contact fingers at the outer connecting portion, and the inner connecting portion is Attached to the glass substrate to electrically connect the first circuit layer and the second circuit layer, and the width and rigidity of the bendable portion are smaller than the width and rigidity of the external portion, so that the image sensing chip The sensing area is relatively movable to the contact fingers. The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures. In the above-mentioned glass sensor package structure of the image sensor, the external portion is combined with a reinforcing plate with respect to the other surface of the contact fingers. The glass flip-chip package structure of the image sensor, wherein the complement 7 1312581 strong plate has a rectangular shape, and one of the reinforcing plates has a longer side than the width of the bendable portion, and one of the reinforcing plates has a shorter side Greater than the length of the contact fingers. In the above-mentioned glass sensor package structure of the image sensor, the width of the bendable portion is substantially the same as the width of the inner patch portion. In the above-mentioned glass sensor package structure of the image sensor, the glass substrate has a closed retaining ring, and the bumps are deformable.

The glass flip chip package structure of the image sensor described above, wherein the closed stop ring is formed by the first circuit layer. The glass flip-chip package structure of the image sensor, wherein the first circuit layer comprises a plurality of connection pads and a plurality of external pads, wherein the connection pads are located corresponding to the bumps, and the external pads are Arranged toward one side of the glass substrate. The glass flip-chip package structure of the image sensor, wherein the second circuit layer has a plurality of internal fingers located in the inner bonding portion, and the distance between the inner connecting fingers is smaller than the distance between the contact fingers, Bonded to the external pads. In the above-mentioned glass sensor package structure of the image sensor, the width and rigidity of the bendable portion are also smaller than the width and rigidity of the glass substrate, respectively. The glass flip chip package structure of the image sensor described above, wherein the image sensing chip has a rear surface that is exposed and parallel to the active surface as a reference for adjusting the sensing area. [Embodiment] 1312581

As shown in Figures 2 through 4, a glass flip chip package structure 200 of an image sensor is disclosed in one embodiment of the present invention. 2 is a schematic cross-sectional view of the glass flip chip package structure 200 of the image sensor, and FIG. 3 is a top view of the glass flip chip package structure of the image sensor. FIG. 4 is a schematic view of the top surface of the image sensor A schematic diagram of the bottom surface of the glass flip chip package structure 200 of the image sensor. The glass flip chip package structure 200 of the image sensor mainly comprises a glass substrate 210, a bump image sensing chip 220 and a fan-out flexible circuit board 23 0 ° as shown in FIGS. 2 and 5 A first circuit layer 2 1 1 is formed on the upper surface of the glass substrate 2 10 . The first circuit layer 2 1 1 includes a plurality of connection pads 2 1 2 and a plurality of external pads 2 1 3 , wherein the connection pads 2 1 2 are positioned corresponding to the plurality of bumps 224 of the image sensing wafer 220 . The external pads 2 1 3 are arranged to face one side of the glass substrate 2 1 0 . The material of the first wiring layer 2 1 1 may be gold (Au) or an alloy thereof, copper (Cu) or an alloy thereof, indium tin oxide (I TO), a conductive paste or the like. It can be formed by techniques such as sputtering, electroplating, electroless plating, pressing, printing or ink jetting. The image sensing wafer 220 is flip-chip bonded to the glass substrate 210. The image sensing wafer 220 has an active surface 2 2 1 and an opposite back surface 2 2 2 . The active surface 2 2 1 includes a sensing region 2 2 3 having an image sensing component therein. For example, the image sensing wafer 220 is a CMOS image sensing wafer or other sensor wafer. And a plurality of bumps 224 are disposed on the active surface 22 1 , and the system is located at the active, 1312581

A plurality of pads 225 at face 221 are bonded to the pads 212. After the flip chip bonding, the bumps 224 are electrically connected to the connection pads 2 1 2 of the first circuit layer 2 1 1 , and the sensing regions 2 2 3 are oriented toward the glass substrate 210 . Preferably, the glass substrate 210 may further have a sealing ring 214, such as a metal ring or a PI rubber ring; and the bumps 224 are deformable, for example, wire-forming bumps. The gap between the active surface 221 of the image sensing wafer 220 and the upper surface of the glass substrate 210 is reduced to further maximize the blocking function of the closed retaining ring 2 14 . In addition, a colloid 250, such as a non-conductive adhesive (NCP), a high-flow underfill, a non-flow underfill, a waterproof adhesive or a stamper colloid, may be formed on the upper surface of the glass substrate 210 and partially filled in The glass substrate 210 is interposed between the image sensing wafer 220 to cover the bumps 224. The flexible circuit board 203 has an inner affixing portion 23 1 , a bendable portion 232 , and an outer connecting portion 233 . The bendable portion 232 is connected to the inner affixing portion 231 and the outer connecting portion 233 . The width is substantially the same as the width of the inner patch portion 231, and the width of the outer portion 233 is larger than the bendable portion 23 2 and the inner patch portion 23 1 to make the line fan-out design. The flexible circuit board 230 is formed with a second circuit layer 234, wherein the second circuit layer 234 has a plurality of contact fingers 23 6 located at the external portion 23 3 and a plurality of the inner bonding portions 2 3 1 The inner finger 2 3 5 (as shown in Fig. 4) 'the distance between the inner fingers 2 3 5 is smaller than the distance between the contact fingers 2 3 6 to be joined to the outer 塾 2 1 3 and increase The contact fingers 23 6 are spaced apart for the external surface to be connected to 10 1312581. The inner bonding portion 2 3 1 is attached to the glass substrate 2 1 , for example

The ACF conductive adhesive 260 (abbreviated as Anisotropic Conductive F i 1 m) electrically connects the internal contacts 2 3 5 and the external pads 2 1 3 to electrically connect the first circuit layer 211 and the second circuit Layer 234. Moreover, the width and rigidity of the bendable portion 232 are smaller than the width and rigidity of the outer portion 233, so that the sensing region 2 2 3 of the image sensing wafer 220 is relatively movable to the contact fingers 2 36. In this embodiment, the width and rigidity of the bendable portion 232 are also smaller than the width and rigidity of the glass substrate 210. Therefore, after the external portion 233 is electrically connected to the socket of an external portable electronic device, such as a mobile phone, a micro camera, a digital camera, a pda or a notebook computer, the glass substrate 21 and the image sense The wafer 220 is still movable (as shown in FIG. 2) to move and adjust the horizontal position and the sensing angle of the sensing region 223, and then mechanically fix the glass substrate 21 or the image sensing wafer 220°.弟z和3图所-~, I 1文ΰ|; Ζό ό ΪΤ These * contact fingers 236 are another 矣 and Sun Zhuang people I force surface system combined with a reinforcing plate 2 4 0 to enhance the external part 233 J丨王 will serve the external department 2 3 3 with a heavy weight, and the characteristics. In this embodiment, the reinforcing plate has a rectangular shape: the longer side of the reinforcing plate 24 is larger than the bendable 232, and the reinforcing plate 24 is larger than the fingers 236. The length of the second. As shown in Fig. 2, preferably, you have a 0-shirt image sensing chip 2 2 0

1312581 The back surface 222 is not covered by the encapsulant 250 and is exposed and parallel to the active surface 221 as a reference for adjusting the sensing area 223, so that the sensing angle of the sensing area 223 can be grasped. It can be used as a mechanically fixed adhesive surface with a horizontal surface. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. Any simple modifications, equivalent changes and modifications made without departing from the technical scope of the present invention are still within the technical scope of the present invention. [Simple description of the drawing] Fig. 1 is a schematic cross-sectional view of a glass flip chip package structure of a conventional image sensor. Figure 2 is a cross-sectional view showing a glass flip chip package structure of an image sensor in accordance with an embodiment of the present invention. Figure 3: In accordance with an embodiment of the present invention, the top surface of the glass flip chip package structure of the image sensor is not intended. Fig. 4 is a bottom plan view showing a glass flip chip package structure of the image sensor according to an embodiment of the invention. Figure 5 is a schematic illustration of the surface of a glass substrate of a glass flip chip package structure of the image sensor in accordance with an embodiment of the present invention. [Main component symbol description] Glass flip-chip package structure of 100 image sensor 12 1312581

110 Glass substrate 111 Line 120 Image sensing wafer 121 Active surface 122 Back surface 123 Sensing area 124 Bump 125 Sealant 130 Insulation protection layer 140 Via 150 External pad 200 Image sensor glass: Flip chip package structure 210 Glass substrate 211 First circuit layer 212 Connection pad 213 External pad 214 Sealing ring 220 Bumping image sensing i. Crystal 221 Active surface 222 Back 223 Sensing area 224 Bump 225 Pad 230 Fan-out flexible circuit board 23 1 Inner bonding portion 232 bendable portion 233 External portion 234 Second circuit layer 235 Inscribed finger 236 Contact finger 240 Reinforcing plate 250 Sealing body 260 ACF conductive adhesive

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Claims (1)

1312581 '10. Application of Lifan® ··1, a glass flip-chip package structure of an image sensor, comprising: - a glass substrate whose surface is formed with a first circuit layer; - a bumped image sensing wafer The flip-chip is bonded to the glass substrate, and the active surface of the image sensing wafer has a sensing region and a plurality of bumps electrically connected to the first wiring layer, the sensing a façade facing the glass substrate; and a fan-out type flexible circuit board having an inner affixed portion, a bendable portion, and an circumscribed portion and formed with a second circuit layer, wherein the second circuit layer has a plurality of a contact finger located at the external portion, the inner bonding portion is attached to the glass substrate to electrically connect the first circuit layer and the second circuit layer, and the width and rigidity of the flexible portion are smaller than the external portion The width and rigidity are such that the sensing region of the image sensing wafer is relatively movable to the contact fingers. 2. The glass-on-chip package structure of the image sensor of claim i, wherein the affixing portion incorporates a reinforcing plate with respect to the other surface of the contact fingers. 3. The glass flip chip package structure of the image sensor according to claim 2, wherein the reinforcing plate has a rectangular shape, and one of the reinforcing plates has a longer side than a width of the bendable portion, and the reinforcing plate is thicker than the bendable portion. One of the shorter sides of the plate is larger than the length of the contact fingers. 4. The glass flip-chip mounting structure of the image sensor of claim i wherein the width of the bendable portion is the same as the width of the inner patch portion 0 14 1312581, as claimed in the patent application. The glass flip-chip package structure of the image sensor of the item wherein the glass substrate has a closed retaining ring and the bumps are deformable. 6. The glass flip chip package structure of the image sensor according to the patent application scope of item [i] wherein the first circuit layer comprises a plurality of connection pads and a plurality of external ports, wherein the connection lines are formed. The bumps are arranged toward one side of the glass substrate. 7. The glass flip chip package structure of the image sensor of claim 6, wherein the second circuit layer has a plurality of internal fingers located in the inner tape portion, and the distance between the inner fingers It is smaller than the distance between the contact fingers to be bonded to the external pads. 8. The glass flip-chip mounting structure of the image sensor of claim 1, wherein the width and rigidity of the bendable portion are also smaller than the width and rigidity of the glass substrate, respectively. 9. The glass flip chip package structure of the image sensor of claim 1, wherein the image sensing chip has a rear surface that is exposed and parallel to the active surface to adjust the sensing area. Reference standard. 15