200807732 九、發明說明： 【發明所屬之技術領域】 本發明係有關於能取代球格陣列（bga)或平面栅格 陣列（LGA)之影像感測器封裝技術，特別係有關於一種 影像感測器之玻璃覆晶封裝構$。 【先前技術】 在早期的影像感測器封裝構造中是利用打線技術 電性連接晶片與基板’例如本國專利證號第122 1 3 29 號所揭露者’影像感測晶片係黏貼於一基板（小尺寸印 刷電路板）上，打線形成之導線電性連接影像感測晶片 與基板，一框形物設置於基板上，以能結合一透光玻 璃於晶片上方，使晶片與導線置於一氣密空間内。另， 在基板之下方設置有格狀陣列之銲球或金屬墊，以成 為BGA或LGA封裝型態。當習知影像感測器封裝構 造表面接合至一外部印刷電路板，銲球或金屬墊是焊 接至外部印刷電路板之連接墊，同時達到電性連接與 機械結合。然而銲球或接合金屬塾之錫膏於回銲時有 相當大的水平誤差變化，加上晶片與基板均被固定無 法移動，無法調整影像感測的角度與方向，使得影像 感測器無法正確感測到正確位置的影像。此外，打線 連接之影像感測器封裝構造整體外觀過大，無法進一 步更加微小化以裝設於可攜式電子產品。 如本國專利證號第12 4 2 8 1 9號所揭示者，原申請人 提出另一種已知的影像感測器封裝構造，其係為玻璃 5 200807732 覆晶（ChiP_0n-Glass)封裝型態，以達到微小化。如第 圖所示 種^知景》像感測器之玻璃覆晶封裝構造 1 〇 〇係包含一玻璃基板1 1 〇、一影像感測晶片工2 〇及一 絕緣保護層1 3 0 °該玻璃基板1丨〇之上表面係形成有 複數個線路1 1卜該影像感測晶片12〇係覆晶接合於該 玻璃基板1 1 0，該影像感測晶片丨2 〇係具有一包含有 感測區123之主動面121及一背面ι22，該影像感測 晶片1 2 0之主動面1 2 1係形成有複數個凸塊丨2 4，而 該些凸塊1 2 4係連接至該些線路1 1 1。另以一密封膠 U5包覆該些凸塊124與氣閉密封該感測區ι23。該絕 緣保護層1 3 0係為封膠材料，其係形成於該玻璃基板 上並覆蓋至該影像感測晶片1 2 0之背面1 2 2。複數個 導通孔1 4 0貫穿該絕緣保護層1 3 0並電性導通至該些 線路1 U。並且將複數個外接墊1 5 〇設置於該絕緣保護 層13 0上並連接該些導通孔140。因此，此一影像感 測器之玻璃覆晶封裝構造1〇〇可為晶片卡型態，可接 觸式插接至一槽座。但在插接之後，仍無法調整影像 感測晶片1 2 0之該感測^ 1 2 3之水平位置與感測角度。 【發明内容】 本發明之主要目的係在於提供一種影像感測器之 玻璃覆晶封裒構造，解決習知影像感測封裝構造在對 外電性連接之後，無法調整晶片感測區位置與角度之 問題。 本發明之次一目的係在於提供一種影像感測器之 6 200807732 玻璃覆晶封裝構造，其包含之扇出型軟性電路板之外 接部相對於其接觸指之另一表面係結合有一補強板， 以供重覆插接至外部電子元件達到模組化設計。 本發明的目的及解決其技術問題是採用以下技術 方案來實現的。依據本發明，一種影像感測器之玻璃 覆晶封裝構造主要包含一玻璃基板、一凸塊化影像感 測晶片以及一扇出型軟性電路板。該玻璃基板之表面 係形成有一第一線路層。該影像感測晶片係覆晶接合 於該玻璃基板，該影像感測晶片之一主動面係具有一 感測區與複數個凸塊，該些凸塊係電性連接至該第一 線路層，該感測區係朝向該玻璃基板。該軟性電路板 係具有一内貼部、一可彎曲部以及一外接部並形成有 一第二線路層，其中該第二線路層係具有複數個位於 該外接部之接觸指，該内貼部係貼附於該玻璃基板， 以電性連接第一線路層與該第二線路層，並且該可彎 曲部之寬度與剛性係均小於該外接部之寬度與剛性， \ 以使該影像感測晶片之該感測區相對可動於該些接觸 指。 本發明的目的及解決其技術問題還可採用以下技 術措施進一步實現。 前述的影像感測器之玻璃覆晶封裝構造，其中該外 接部相對於該些接觸指之另一表面係結合有一補強 板。 前述的影像感測器之玻璃覆晶封裝構造，其中該補 7 200807732 強板概呈矩形，該補強板之一較長邊係大於該可彎曲 部之寬度，該補強板之一較短邊係大於該些接觸指之 長度。 前述的影像感測器之玻璃覆晶封裝構造，其中該可 彎曲部之寬度大致相同於該内貼部之寬度。 前述的影像感測器之玻璃覆晶封裝構造，其中該玻 璃基板係具有一密閉擋環，且該些凸塊係為可變形。 前述的影像感測器之玻璃覆晶封裝構造，其中該密 閉擋環係由該第一線路層所構成。 前述的影像感測器之玻璃覆晶封裝構造，其中該第 一線路層係包含有複數個連接墊與複數個外接墊，該 些連接墊係位置對應於該些凸塊，該些外接墊係排列 朝向該玻璃基板之其中一側邊。 前述的影像感測器之玻璃覆晶封裝構造，其中該第 二線路層係具有複數個位於該内貼部之内接指，該些 内接指之間距係小於該些接觸指之間距，以接合至該 些外接塾。 前述的影像感測器之玻璃覆晶封裝構造，其中該可 彎曲部之寬度與剛性係亦分別小於該玻璃基板之寬度 與剛性。 前述的影像感測器之玻璃覆晶封裝構造，其中該影 像感測晶片係具有一顯露且平行於該主動面之背面， 以作為調整該感測區之參考基準。 【實施方式】 8 200807732 如第2至4圖所示，在本發明之一具體實施例中揭 示一種影像感測器之玻璃覆晶封裝構造200。第2圖 係為該影像感測器之玻璃覆晶封裝構造200之截面示 意圖，第3圖係為該影像感測器之玻璃覆晶封裝構造 2 0 0之頂面不意圖’第4圖係為該影像感測器之玻璃 覆晶封裝構造200之底面示意圖。該影像感測器之玻 璃覆晶封裝構造200係主要包含一玻璃基板210、一 凸塊化影像感測晶片 220以及一扇出型軟性電路板 230 ° 如第2及5圖所示，該玻璃基板210之上表面係形 成有一第一線路層2 1 1。該第一線路層2 1 1係包含有複 數個連接墊2 1 2與複數個外接墊2 1 3，該些連接塾2 1 2 係位置對應於該影像感測晶片 220之複數個凸塊 224，該些外接墊2 1 3係排列朝向該玻璃基板2 1 0之其 中一側邊。該第一線路層 21 1之材質係可為金（Au)或 其合金、銅（Cu)或其合金、氧化錫銦（I TO)或導電膠等 等。並可利用濺鐘、電鍍、無電鍍、壓合、印刷或喷 墨等技術形成之。 該影像感測晶片 220係覆晶接合於該玻璃基板 2 10，該影像感測晶片220係具有一主動面221及一相 對之背面222。該主動面221係包含一感測區223，其 内設有影像感測元件，例如該影像感測晶片220係為 一 CMOS影像感測晶片或其它感測器晶片。並於該主 動面221上設置有複數個凸塊224，其係位於該主動 9 200807732 面221處之複數個銲墊225上，以接合至該些連接墊 2 1 2。在覆晶接合之後’該些凸塊2 2 4係電性連接至該 第一線路層211之該些連接墊212，該感測區223係 朝向該玻璃基板210。較佳地，該破璃基板21〇可另 具有一遂閉擔環2 14 ’例如金屬環或p〗膠環；且該些 凸塊224係為可變形，例如打線形成之結線凸塊⑻以 bump)。藉以縮小該影像感測晶片22〇之該主動面221 與该玻璃基板2 1 0之上表面之間的間隙，進而使該密 閉擔環2 1 4發揮最大擋膠功能。另，—封膠體2 5 〇 , 例如非導電膠（NCP)、高流動底部填充膠、非流動底部 填充膠、防水膠或壓模膠體，可形成於該玻璃基板2 i 〇 之上表面並局部填充在該玻璃基板21〇與該影像感測 晶片2 2 0之間，以包覆該些凸塊2 2 4。 該軟性電路板230係具有一内貼部231、一可彎曲 部232以及一外接部23 3，該可彎曲部232係連接該 内貼部23 1與該外接部23 3，該可彎曲部232之寬声 大致相同於該内貼部231之寬度，又該外接部2” 2 寬度大於該可彎曲部232與該内貼部231，以使線路 為扇出設計。該軟性電路板23〇並形成有一第二線路 層234,纟中該第二線路《234係具有複數個位於該 外接部233之接觸指236與複數個位於該内貼部 之内接指235(如第4圖所示），該些内接指23 5之間距 係小於該些接觸# 236 &冑足巨，以接合至該#外接塾 213並使增加該些接觸指236之間距以供對外表面接 10 200807732 合。該内貼部23 1係貼附於該玻璃基板2 1 0，例如使 用 ACF 導電膠 260(ACF 為 Anisotropic Conductive Film之簡稱）電性該些内接指235與該些外接墊213， 以電性連接第一線路層2 1 1與該第二線路層23 4。並 且該可彎曲部2 3 2之寬度與剛性係均小於該外接部 233之寬度與剛性，以使該影像感測晶片220之該感 測區223相對可動於該些接觸指236。在本實施例中， 該可彎曲部232之寬度與剛性係亦分別小於該玻璃基 板2 1 0之寬度與剛性。 因此，利用該外接部233電性連接至一外部可攜式 電子裝置之槽座之後，例如行動電話、微型攝影裝置、 數位相機、PDA或筆記型電腦等，該玻璃基板21〇與 該影像感測曰曰片 2 2 0仍為可移動調整（如第2圖所 示），以移動調整該感測區223之水平位置與感測角 度’再機械固定該玻璃基板2 1 0或該影像感測晶片 220 〇 如第2及3圖所示，較佳地，該外接部2 3 3相對於 該些接觸指236之另一表面係結合有一補強板24〇， 以增強該外接部233之剛性，使得該外接部23 3具有 可重覆插接之特性。在本實施例中，該補強板24〇概 呈矩形，該補強板240之一較長邊係大於該可彎曲部 232之寬度，該補強板24〇之一較短邊係大於該些接 觸指236之長度。 再如第2圖所示，較佳地，該影像感測晶片22〇之 11 僅是本發明的較佳實施例而已，並 限制’雖然本發明已以較 非用以限定本發明，任何 本發明之技術範圍内，所 變化與修飾，均仍屬於本 200807732 該背面222係不被該封豚體 — 修體250覆盍而為顯露狀 行於該主動面22 1，以作兔细杜 a 馬調整遠感測區223之 基準’故可有利於掌握該感 / U /則區2 23之感測角度 平面且可作為機械固定之黏著面。 以上所述 本發明作任何形式上的 施例揭露如上，然而並 本項技術者，在不脫離 任何簡單修改、等效性 的技術範圍内。 【圖式簡單說明】 第1圖：習知影像感測器 成 裔之玻璃覆晶封裝構造之 示意圖。 第2圖：依據本發明之-具體實施例，一種影像 ^ 器之玻璃覆晶封裴構造之截面示意圖。 第3圖：依據本發明之—罝. 具體實施例，該影像感 之玻璃覆晶封裝構造之頂面示意圖。 第4圖：依據本發明之—具體實施例，該影像感 之玻璃覆晶封裝構造之底面示意圖。 第5圖：依據本發明之一具體實施例，該影像感 之玻璃覆晶封裝構造之玻璃基板之表面 圖。 【主要元件符號說明】 1 0 0影像感測器之玻璃覆晶封裝構造 且平 參考 與水 非對 佳實 熟悉 作的 發明 截面 感測 測器 測器 測器 示意 12 200807732 110 玻璃基板 111線路 120 影像感測晶片 121 主動面 122背面 123 感測區 124 凸塊 125密封膠 130 絕緣保護層 140導通孔 150 外接墊 200 影像感測器之玻璃覆晶封裝構造 210 玻璃基板 2 11第一線路層 212 連接墊 213 外接墊 214密閉擋環 220 凸塊化影像感測晶片 221 主動面 222背面 223 感測區 224 凸塊 225銲墊 230 扇出型軟性電路板 231 内貼部 232可彎曲部 233 外接部 234 第二線路層 235内接指 236 接觸指 240 補強板 2 5 0封膠體 260 ACF 導 電膠 13200807732 IX. Description of the Invention: [Technical Field] The present invention relates to image sensor packaging technology capable of replacing a ball grid array (bga) or a planar grid array (LGA), in particular, an image sensing method The glass flip chip package is $. [Prior Art] In the early image sensor package structure, the wafer and the substrate were electrically connected by a wire bonding technique. For example, the image sensing chip attached to a substrate is adhered to a substrate (for example, National Patent No. 122 1 3 29) On the small-sized printed circuit board, the wire formed by the wire is electrically connected to the image sensing chip and the substrate, and a frame is disposed on the substrate to bond a transparent glass over the wafer to place the wafer and the wire in an airtight manner. Within the space. In addition, a grid of solder balls or metal pads are disposed under the substrate to form a BGA or LGA package. When the conventional image sensor package construction surface is bonded to an external printed circuit board, the solder balls or metal pads are soldered to the connection pads of the external printed circuit board while achieving electrical and mechanical bonding. However, solder balls or solder pastes have a large horizontal error change during reflow, and the wafer and the substrate are fixed and cannot be moved, and the angle and direction of image sensing cannot be adjusted, so that the image sensor cannot be correct. The image in the correct position is sensed. In addition, the overall appearance of the image sensor package structure of the wire connection is too large to be further miniaturized for installation in portable electronic products. As disclosed in the National Patent No. 12 4 2 8 1 9 , the original applicant proposes another known image sensor package structure, which is a glass 5 200807732 chip-on-chip (ChiP_0n-Glass) package type. To achieve miniaturization. As shown in the figure, the glass flip-chip package structure of the sensor is a glass substrate 1 1 , an image sensing wafer 2 〇 and an insulating protective layer 1 30 ° A plurality of lines 1 are formed on the upper surface of the glass substrate 1 . The image sensing wafer 12 is flip-chip bonded to the glass substrate 1 10 , and the image sensing wafer 2 has a sense of inclusion. An active surface 121 of the measuring area 123 and a front surface ι22, the active surface 1 2 1 of the image sensing wafer 120 is formed with a plurality of bumps 丨 24, and the bumps 1 2 4 are connected to the Line 1 1 1. The bumps 124 are covered with a sealant U5 to seal the sensing region ι23 with a gas seal. The insulating protective layer 130 is a sealing material formed on the glass substrate and covering the back surface 122 of the image sensing wafer 120. A plurality of via holes 140 are penetrated through the insulating protective layer 130 and electrically connected to the lines 1 U. And a plurality of external pads 15 5 are disposed on the insulating protection layer 130 and connected to the via holes 140. Therefore, the glass flip-chip package structure of the image sensor can be a wafer card type and can be plugged into a socket. However, after the plugging, the horizontal position and the sensing angle of the sensing ^1 2 3 of the image sensing wafer 1 2 0 cannot be adjusted. SUMMARY OF THE INVENTION The main object of the present invention is to provide a glass-on-film sealing structure of an image sensor, which can solve the problem that the position and angle of the sensing region of the wafer cannot be adjusted after the external electrical connection is obtained by the conventional image sensing package structure. problem. A second object of the present invention is to provide an image sensor of the 2008 200807732 glass flip chip package structure, which comprises a fan-out type flexible circuit board external joint with a reinforcing plate coupled to the other surface of the contact finger thereof. Modular design for re-insertion to external electronic components. The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. According to the present invention, a glass flip chip package structure of an image sensor mainly comprises a glass substrate, a bump image sensing chip and a fan-out flexible circuit board. A surface of the glass substrate is formed with a first wiring layer. The image sensing chip is flip-chip bonded to the glass substrate, and an active surface of the image sensing chip has a sensing region and a plurality of bumps, and the bumps are electrically connected to the first circuit layer. The sensing zone is oriented toward the glass substrate. The flexible circuit board has an inner bonding portion, a bendable portion and an outer connecting portion and is formed with a second circuit layer, wherein the second circuit layer has a plurality of contact fingers at the outer connecting portion, and the inner connecting portion is Attached to the glass substrate to electrically connect the first circuit layer and the second circuit layer, and the width and rigidity of the bendable portion are smaller than the width and rigidity of the external portion, so that the image sensing chip The sensing area is relatively movable to the contact fingers. The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures. In the above-mentioned glass sensor package structure of the image sensor, the external portion is combined with a reinforcing plate with respect to the other surface of the contact fingers. The glass flip-chip package structure of the image sensor, wherein the supplement 7 200807732 strong plate has a rectangular shape, and one of the reinforcing plates has a longer side than the width of the bendable portion, and one of the reinforcing plates has a shorter side Greater than the length of the contact fingers. In the above-mentioned glass sensor package structure of the image sensor, the width of the bendable portion is substantially the same as the width of the inner patch portion. In the above-mentioned glass sensor package structure of the image sensor, the glass substrate has a closed retaining ring, and the bumps are deformable. The glass flip chip package structure of the image sensor described above, wherein the closed stop ring is formed by the first circuit layer. The glass flip-chip package structure of the image sensor, wherein the first circuit layer comprises a plurality of connection pads and a plurality of external pads, wherein the connection pads are located corresponding to the bumps, and the external pads are Arranged toward one side of the glass substrate. The glass flip-chip package structure of the image sensor, wherein the second circuit layer has a plurality of internal fingers located in the inner bonding portion, and the distance between the inner connecting fingers is smaller than the distance between the contact fingers, Bonded to the external ports. In the above-mentioned glass sensor package structure of the image sensor, the width and rigidity of the bendable portion are also smaller than the width and rigidity of the glass substrate, respectively. The glass flip chip package structure of the image sensor described above, wherein the image sensing chip has a rear surface that is exposed and parallel to the active surface as a reference for adjusting the sensing area. [Embodiment] 8 200807732 As shown in Figs. 2 to 4, a glass flip chip package structure 200 of an image sensor is disclosed in an embodiment of the present invention. 2 is a schematic cross-sectional view of the glass flip chip package structure 200 of the image sensor, and FIG. 3 is a top view of the glass flip chip package structure of the image sensor. It is a schematic diagram of the bottom surface of the glass flip chip package structure 200 of the image sensor. The glass flip chip package structure 200 of the image sensor mainly comprises a glass substrate 210, a bump image sensing chip 220 and a fan-out flexible circuit board 230 ° as shown in Figures 2 and 5, the glass A first circuit layer 2 1 1 is formed on the upper surface of the substrate 210. The first circuit layer 2 1 1 includes a plurality of connection pads 2 1 2 and a plurality of external pads 2 1 3 , and the connection ports 2 1 2 are corresponding to the plurality of bumps 224 of the image sensing wafer 220 . The external pads 2 1 3 are arranged to face one side of the glass substrate 2 1 0 . The material of the first wiring layer 21 1 may be gold (Au) or an alloy thereof, copper (Cu) or an alloy thereof, indium tin oxide (I TO), a conductive paste or the like. It can be formed by techniques such as splashing, electroplating, electroless plating, pressing, printing or ink jetting. The image sensing wafer 220 is flip-chip bonded to the glass substrate 210. The image sensing wafer 220 has an active surface 221 and a opposite back surface 222. The active surface 221 includes a sensing region 223 having an image sensing component therein. For example, the image sensing wafer 220 is a CMOS image sensing wafer or other sensor wafer. A plurality of bumps 224 are disposed on the active surface 221, and are disposed on the plurality of pads 225 at the surface 221 of the active 9 200807732 to be bonded to the connection pads 2 1 2 . After the flip chip bonding, the bumps 2 24 are electrically connected to the connection pads 212 of the first circuit layer 211 , and the sensing region 223 faces the glass substrate 210 . Preferably, the glass substrate 21 另 may further have a closing ring 2 14 ′ such as a metal ring or a p-shaped rubber ring; and the protrusions 224 are deformable, for example, the wire forming bumps (8) formed by wire bonding Bump). The gap between the active surface 221 of the image sensing wafer 22 and the upper surface of the glass substrate 210 is reduced to further maximize the blocking function of the sealing ring 2 . In addition, the sealant 2 5 〇, such as non-conductive glue (NCP), high-flow underfill, non-flow underfill, waterproof glue or compression mold colloid, can be formed on the surface of the glass substrate 2 i 并 and local The glass substrate 21 is filled between the glass substrate 21 and the image sensing wafer 220 to cover the bumps 2 24 . The flexible circuit board 230 has an inner mounting portion 231, a bendable portion 232, and an outer connecting portion 23, and the bendable portion 232 connects the inner patch portion 23 1 and the outer joint portion 23 3 . The bendable portion 232 The wide sound is substantially the same as the width of the inner patch portion 231, and the outer portion 2" 2 is wider than the bendable portion 232 and the inner patch portion 231, so that the circuit is fan-out design. The flexible circuit board 23 is folded. Forming a second circuit layer 234, wherein the second line "234" has a plurality of contact fingers 236 located at the external portion 233 and a plurality of internal fingers 235 located at the inner portion (as shown in FIG. 4) The distance between the inner fingers 23 5 is smaller than the contact # 236 & 胄 巨 to join the # 外 塾 213 and increase the distance between the contact fingers 236 for external surface connection 10 200807732. The inner bonding portion 23 1 is attached to the glass substrate 2 1 0 , for example, using an ACF conductive adhesive 260 (ACF is an abbreviation for Anisotropic Conductive Film) to electrically connect the internal fingers 235 and the external pads 213 to be electrically Connecting the first circuit layer 2 1 1 and the second circuit layer 23 4 and the width of the bendable portion 2 3 2 Both the rigid portion and the rigid portion are smaller than the width and rigidity of the outer portion 233, so that the sensing region 223 of the image sensing wafer 220 is relatively movable to the contact fingers 236. In the embodiment, the width of the bendable portion 232 The rigidity and the rigidity are also smaller than the width and rigidity of the glass substrate 210. Therefore, after the external portion 233 is electrically connected to the socket of an external portable electronic device, such as a mobile phone, a miniature camera, and a digital camera. , the PDA or the notebook computer, etc., the glass substrate 21 〇 and the image sensing cymbal 205 are still movable (as shown in FIG. 2 ) to move and adjust the horizontal position of the sensing area 223 Sensing angle 're-fixing the glass substrate 210 or the image sensing wafer 220 as shown in FIGS. 2 and 3, preferably, the external portion 233 is opposite to the other of the contact fingers 236 The surface is combined with a reinforcing plate 24A to enhance the rigidity of the external portion 233, so that the external portion 23 3 has a re-interchangeable characteristic. In the embodiment, the reinforcing plate 24 is substantially rectangular, and the reinforcing plate is rigid. One of the longer sides of the plate 240 is larger than the bendable The width of the portion 232, the shorter side of the reinforcing plate 24 is larger than the length of the contact fingers 236. As shown in Fig. 2, preferably, the image sensing wafer 22 is only the present invention. The preferred embodiment of the present invention is not limited to the scope of the present invention, and variations and modifications are still within the scope of the present invention. The body - the repair body 250 is covered and exposed to the active surface 22 1 for the purpose of adjusting the distance sensing area 223 of the rabbit fine Du a horse, so that it is advantageous to grasp the feeling / U / then area 2 23 The angle plane is sensed and can be used as a mechanically fixed adhesive surface. The above-described embodiments of the present invention are disclosed above in any form, and the present invention is not limited to the technical scope of any simple modification or equivalence. [Simple description of the figure] Fig. 1: Schematic diagram of a conventional glass sensor package structure of a known image sensor. Figure 2 is a cross-sectional view showing a glass-on-chip sealing structure of an imager in accordance with an embodiment of the present invention. Fig. 3 is a top plan view of the glass-on-film package structure of the image sensing according to the present invention. Figure 4 is a schematic illustration of the underside of the image-sensing glass flip-chip package structure in accordance with an embodiment of the present invention. Figure 5 is a surface view of a glass substrate of the image-sensing glass flip-chip package structure in accordance with an embodiment of the present invention. [Main component symbol description] The invention is based on the glass flip-chip package structure of the image sensor and the flat reference and the water non-pair are familiar with the invention. The cross-section sensor is measured by the detector 12 200807732 110 The glass substrate 111 line 120 Image sensing wafer 121 active surface 122 back surface 123 sensing region 124 bump 125 sealant 130 insulating protective layer 140 via 150 external pad 200 image sensor glass flip chip package structure 210 glass substrate 2 11 first circuit layer 212 Connection pad 213 external pad 214 sealing ring 220 bumping image sensing wafer 221 active surface 222 back 223 sensing area 224 bump 225 pad 230 fan-out flexible circuit board 231 inner part 232 bendable part 233 external part 234 second circuit layer 235 internal finger 236 contact finger 240 reinforcing plate 2 5 0 sealing body 260 ACF conductive adhesive 13