WO2012176996A3 - 반도체 제조에 사용되는 분사부재 및 그것을 갖는 기판 처리 장치 - Google Patents

반도체 제조에 사용되는 분사부재 및 그것을 갖는 기판 처리 장치 Download PDF

Info

Publication number
WO2012176996A3
WO2012176996A3 PCT/KR2012/004267 KR2012004267W WO2012176996A3 WO 2012176996 A3 WO2012176996 A3 WO 2012176996A3 KR 2012004267 W KR2012004267 W KR 2012004267W WO 2012176996 A3 WO2012176996 A3 WO 2012176996A3
Authority
WO
WIPO (PCT)
Prior art keywords
support member
substrates
injection member
treatment apparatus
substrate treatment
Prior art date
Application number
PCT/KR2012/004267
Other languages
English (en)
French (fr)
Other versions
WO2012176996A2 (ko
Inventor
박용성
이성광
김동렬
방홍주
김민석
Original Assignee
국제엘렉트릭코리아 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 국제엘렉트릭코리아 주식회사 filed Critical 국제엘렉트릭코리아 주식회사
Priority to CN201280031035.0A priority Critical patent/CN103635992B/zh
Priority to JP2014516893A priority patent/JP5818288B2/ja
Priority to US14/126,656 priority patent/US20140224177A1/en
Publication of WO2012176996A2 publication Critical patent/WO2012176996A2/ko
Publication of WO2012176996A3 publication Critical patent/WO2012176996A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32633—Baffles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

본 발명은 기판 처리 장치에 관한 것으로, 복수의 기판이 수용되어 플라즈마 처리 공정이 수행되는 공정 챔버; 공정 챔버에 설치되고 동일 평면상에 복수의 기판이 놓여지는 지지부재; 및 지지부재와 대향되게 설치되고, 적어도 하나 이상의 반응가스 및 퍼지가스를 지지부재에 놓여진 복수의 기판들 각각에 대응하는 위치에서 독립적으로 분사할 수 있도록 독립된 복수개의 배플들을 갖는 분사부재; 및 분사부재의 배플들이 지지부재에 놓여진 복수의 기판들 각각에 순차적으로 선회하도록 지지부재 또는 상기 분사부재를 회전시키는 구동부를 포함하되; 분사부재는 복수개의 배플들 중 반응가스를 분사하는 적어도 하나의 배플에 설치되어 기판으로 분사되는 반응가스를 플라즈마화하는 플라즈마 발생기를 포함한다.
PCT/KR2012/004267 2011-06-24 2012-05-30 반도체 제조에 사용되는 분사부재 및 그것을 갖는 기판 처리 장치 WO2012176996A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201280031035.0A CN103635992B (zh) 2011-06-24 2012-05-30 用于半导体制造的喷射构件及具有该喷射构件的基板处理装置
JP2014516893A JP5818288B2 (ja) 2011-06-24 2012-05-30 半導体製造に使用される噴射部材及びそれを有する基板処理装置
US14/126,656 US20140224177A1 (en) 2011-06-24 2012-05-30 Injection member in fabrication of semiconductor device and substrate processing apparatus having the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0061897 2011-06-24
KR1020110061897A KR101243742B1 (ko) 2011-06-24 2011-06-24 반도체 제조에 사용되는 분사부재 및 그것을 갖는 기판 처리 장치

Publications (2)

Publication Number Publication Date
WO2012176996A2 WO2012176996A2 (ko) 2012-12-27
WO2012176996A3 true WO2012176996A3 (ko) 2013-04-04

Family

ID=47423047

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/004267 WO2012176996A2 (ko) 2011-06-24 2012-05-30 반도체 제조에 사용되는 분사부재 및 그것을 갖는 기판 처리 장치

Country Status (6)

Country Link
US (1) US20140224177A1 (ko)
JP (1) JP5818288B2 (ko)
KR (1) KR101243742B1 (ko)
CN (1) CN103635992B (ko)
TW (1) TWI535886B (ko)
WO (1) WO2012176996A2 (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9175391B2 (en) * 2011-05-26 2015-11-03 Intermolecular, Inc. Apparatus and method for combinatorial gas distribution through a multi-zoned showerhead
KR20130136245A (ko) * 2012-06-04 2013-12-12 삼성전자주식회사 인젝터 및 이를 포함하는 물질층 증착 챔버
KR101560623B1 (ko) * 2014-01-03 2015-10-15 주식회사 유진테크 기판처리장치 및 기판처리방법
JP6242288B2 (ja) * 2014-05-15 2017-12-06 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
US10249511B2 (en) * 2014-06-27 2019-04-02 Lam Research Corporation Ceramic showerhead including central gas injector for tunable convective-diffusive gas flow in semiconductor substrate processing apparatus
JP6258184B2 (ja) * 2014-11-13 2018-01-10 東京エレクトロン株式会社 基板処理装置
KR101667945B1 (ko) * 2014-11-20 2016-10-21 국제엘렉트릭코리아 주식회사 기판 처리 장치
TWI676709B (zh) 2015-01-22 2019-11-11 美商應用材料股份有限公司 使用空間上分開的佈植器腔室進行的對薄膜的原子層沈積
JP6339029B2 (ja) * 2015-01-29 2018-06-06 東京エレクトロン株式会社 成膜装置
US10954597B2 (en) * 2015-03-17 2021-03-23 Asm Ip Holding B.V. Atomic layer deposition apparatus
US10121655B2 (en) * 2015-11-20 2018-11-06 Applied Materials, Inc. Lateral plasma/radical source
CN106034371A (zh) * 2016-06-17 2016-10-19 西安交通大学 等离子体射流阵列协同机械旋转运动的材料处理装置
KR102009348B1 (ko) 2017-09-20 2019-08-09 주식회사 유진테크 배치식 플라즈마 기판처리장치
DE102018114208A1 (de) * 2018-06-14 2019-12-19 Aixtron Se Abdeckplatte zur Abdeckung der zur Prozesskammer weisenden Seite eines Suszeptors einer Vorrichtung zum Abscheiden von SiC-Schichten
JP6575641B1 (ja) * 2018-06-28 2019-09-18 株式会社明電舎 シャワーヘッドおよび処理装置
KR102606837B1 (ko) * 2021-11-02 2023-11-29 피에스케이 주식회사 상부 전극 유닛, 그리고 이를 포함하는 기판 처리 장치
KR102622277B1 (ko) * 2022-05-19 2024-01-08 세메스 주식회사 기체 분사유닛 및 기판처리장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040102600A (ko) * 2003-05-28 2004-12-08 삼성전자주식회사 반도체 소자 제조를 위한 증착 장치
KR100558922B1 (ko) * 2004-12-16 2006-03-10 (주)퓨전에이드 박막 증착장치 및 방법
KR20070093820A (ko) * 2006-03-15 2007-09-19 에이에스엠 저펜 가부시기가이샤 회전 서셉터를 지닌 반도체가공장치
KR20100020920A (ko) * 2008-08-13 2010-02-23 시너스 테크놀리지, 인코포레이티드 기상 증착 반응기 및 이를 이용한 박막 형성 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100920324B1 (ko) * 2007-08-24 2009-10-07 주식회사 케이씨텍 박막 증착장치
WO2010019007A2 (en) * 2008-08-13 2010-02-18 Synos Technology, Inc. Vapor deposition reactor for forming thin film
KR101108879B1 (ko) * 2009-08-31 2012-01-30 주식회사 원익아이피에스 가스분사장치 및 이를 이용한 기판처리장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040102600A (ko) * 2003-05-28 2004-12-08 삼성전자주식회사 반도체 소자 제조를 위한 증착 장치
KR100558922B1 (ko) * 2004-12-16 2006-03-10 (주)퓨전에이드 박막 증착장치 및 방법
KR20070093820A (ko) * 2006-03-15 2007-09-19 에이에스엠 저펜 가부시기가이샤 회전 서셉터를 지닌 반도체가공장치
KR20100020920A (ko) * 2008-08-13 2010-02-23 시너스 테크놀리지, 인코포레이티드 기상 증착 반응기 및 이를 이용한 박막 형성 방법

Also Published As

Publication number Publication date
TW201307609A (zh) 2013-02-16
KR101243742B1 (ko) 2013-03-13
JP2014520212A (ja) 2014-08-21
US20140224177A1 (en) 2014-08-14
CN103635992A (zh) 2014-03-12
KR20130006886A (ko) 2013-01-18
CN103635992B (zh) 2016-05-25
WO2012176996A2 (ko) 2012-12-27
JP5818288B2 (ja) 2015-11-18
TWI535886B (zh) 2016-06-01

Similar Documents

Publication Publication Date Title
WO2012176996A3 (ko) 반도체 제조에 사용되는 분사부재 및 그것을 갖는 기판 처리 장치
WO2011025214A3 (ko) 가스분사장치 및 이를 이용한 기판처리장치
WO2012096529A3 (ko) 반도체 제조에 사용되는 분사부재 및 그것을 갖는 플라즈마 처리 장치
WO2012036499A3 (ko) 박막 증착 장치
WO2012148801A3 (en) Semiconductor substrate processing system
GB201121034D0 (en) Apparatus and method for depositing a layer onto a substrate
WO2012118955A3 (en) Apparatus and process for atomic layer deposition
WO2012099681A3 (en) Semiconductor processing system and methods using capacitively coupled plasma
WO2012030382A3 (en) Showerhead electrode
WO2011159615A3 (en) Method and apparatus for inducing turbulent flow of a processing chamber cleaning gas
WO2010114274A3 (en) Apparatus for depositing film and method for depositing film and system for depositing film
WO2013016191A3 (en) Methods and apparatus for the deposition of materials on a substrate
WO2013012549A3 (en) Multi-chamber cvd processing system
WO2012118952A3 (en) Apparatus and process for atomic layer deposition
TW200942637A (en) Dual zone gas injection nozzle
TW200644123A (en) Methods of removing resist from substrates in resist stripping chambers
WO2012040317A3 (en) Plasma-activated deposition of conformal films
WO2009104918A3 (en) Apparatus and method for processing substrate
JP2011222960A5 (ko)
WO2011027987A3 (ko) 가스분사장치 및 이를 이용한 기판처리장치
WO2009008519A1 (ja) ガス処理装置、ガス処理システム及びガス処理方法、並びにそれを用いた排気ガス処理システム及び内燃機関
WO2012118887A3 (en) Apparatus and process for atomic layer deposition
WO2011109266A3 (en) Method and apparatus for single step selective nitridation
TW200802549A (en) Vertical plasma processing apparatus for semiconductor process
WO2012030703A3 (en) Apparatus and method for heat treating a glass substrate

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12803284

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 2014516893

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 14126656

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 12803284

Country of ref document: EP

Kind code of ref document: A2