WO2012171208A1 - 利用电路板粉合成的无醛零碳环保板材及其制造工艺 - Google Patents

利用电路板粉合成的无醛零碳环保板材及其制造工艺 Download PDF

Info

Publication number
WO2012171208A1
WO2012171208A1 PCT/CN2011/075835 CN2011075835W WO2012171208A1 WO 2012171208 A1 WO2012171208 A1 WO 2012171208A1 CN 2011075835 W CN2011075835 W CN 2011075835W WO 2012171208 A1 WO2012171208 A1 WO 2012171208A1
Authority
WO
WIPO (PCT)
Prior art keywords
parts
powder
circuit board
aldehyde
environmentally
Prior art date
Application number
PCT/CN2011/075835
Other languages
English (en)
French (fr)
Inventor
肖超锋
伍灿英
伍亮英
Original Assignee
Xiao Chaofeng
Ng Chan Ying
Ng Leong Ying
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiao Chaofeng, Ng Chan Ying, Ng Leong Ying filed Critical Xiao Chaofeng
Priority to PCT/CN2011/075835 priority Critical patent/WO2012171208A1/zh
Priority to RU2014100254/13A priority patent/RU2014100254A/ru
Priority to EP11867703.8A priority patent/EP2722142A4/en
Priority to US14/125,584 priority patent/US20140113154A1/en
Publication of WO2012171208A1 publication Critical patent/WO2012171208A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE
    • B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
    • B09B3/20—Agglomeration, binding or encapsulation of solid waste
    • B09B3/21—Agglomeration, binding or encapsulation of solid waste using organic binders or matrix
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/275—Recovery or reuse of energy or materials
    • B29C48/277—Recovery or reuse of energy or materials of materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/02—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising combinations of reinforcements, e.g. non-specified reinforcements, fibrous reinforcing inserts and fillers, e.g. particulate fillers, incorporated in matrix material, forming one or more layers and with or without non-reinforced or non-filled layers
    • B29C70/021—Combinations of fibrous reinforcement and non-fibrous material
    • B29C70/025—Combinations of fibrous reinforcement and non-fibrous material with particular filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/302—Water
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08H—DERIVATIVES OF NATURAL MACROMOLECULAR COMPOUNDS
    • C08H8/00—Macromolecular compounds derived from lignocellulosic materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L97/00—Compositions of lignin-containing materials
    • C08L97/02—Lignocellulosic material, e.g. wood, straw or bagasse
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
    • B29B17/0026—Recovery of plastics or other constituents of waste material containing plastics by agglomeration or compacting
    • B29B17/0042—Recovery of plastics or other constituents of waste material containing plastics by agglomeration or compacting for shaping parts, e.g. multilayered parts with at least one layer containing regenerated plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
    • C08L2205/16—Fibres; Fibrils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/78—Recycling of wood or furniture waste
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31909—Next to second addition polymer from unsaturated monomers
    • Y10T428/31928—Ester, halide or nitrile of addition polymer

Definitions

  • Aldehyde-free zero carbon environmental protection board synthesized by circuit board powder and manufacturing process thereof
  • the invention relates to an environmentally-friendly board, in particular to an aldehyde-free zero carbon environmental protection board which is synthesized by using a circuit board powder.
  • the invention also relates to a manufacturing process of an aldehyde-free zero carbon environmental protection sheet material synthesized by using a circuit board powder.
  • the raw materials for traditional wood products are wood, which requires deforestation, resulting in water and soil loss, various natural disasters, affecting the balanced development of the natural environment and ecology, and being environmentally friendly and unable to effectively save energy and reduce emissions.
  • the wood product sheet has a large amount of furfural release, and is easily swelled, deformed, bent, moldy, water-resistant, acid-resistant, alkali-resistant, and flammable.
  • the common artificial board production technology uses aldehyde-containing diluent as the component for producing the adhesive formula. Since the traditional adhesive urea-formaldehyde resin or phenolic resin has a relatively high water content, it will exceed 12% of the weight of the adhesive. During the process, the adhesive chemically reacts with the raw materials to produce a large amount of water vapor.
  • the raw material of the plate is mainly the circuit board powder
  • the plate embryo is subjected to the dual action of pressure and heat during the hot pressing process, the water vapor cannot be absorbed, and the bubbling phenomenon is easily caused, and the bubbling direction is released during the later stage of the plate making process.
  • the external expansion force is greater than the internal stress, which causes the plate to explode.
  • the technical problem to be solved by the present invention is to provide a recyclable profit.
  • a manufacturing process of an aldehyde-free zero-carbon environmentally-friendly sheet material synthesized by using a circuit board powder characterized in that the manufacturing process comprises the following steps: a. isocyanate Mix with the release agent in proportion and stir evenly;
  • the exhaust pressure is released, the pressure relief process is gently reduced, and the pressure relief process is at least 1 minute; the laminate of the multilayer hot press is heated by the circulating heat transfer oil, and the heat conduction of the laminate
  • the oil temperature is controlled within the range of 150 ° C ⁇ 200 ° C;
  • the circuit board powder is a powder material obtained by disassembling and scraping a waste circuit board or a circuit board scrap, or a circuit board drilling powder directly recovered; before the drying in the step c, the circuit board is The powder is used to filter and magnetically absorb the metal slag, so that the raw materials are not agglomerated.
  • the cl step is added before the step d, the high fiber auxiliary material is coarsely crushed, and then the pulverization and grinding is performed to convert the high fiber auxiliary material into the wood fiber powder of 80 mesh or more, and the temperature environment is higher than 100 ° C.
  • the water is dried and controlled, and the moisture content thereof is controlled to be 2% to 4%; then the wood fiber powder is stirred and mixed at 180 ° C to form carbon fiber powder; the circuit board powder and the carbon fiber powder are mixed and stirred in proportion;
  • the high fiber excipient is a crop straw, a wood saw powder or a bamboo saw powder.
  • the c2 step is added before the step d, and the processing aid is added in proportion and then Sub-uniform mixing;
  • the processing aid includes an antioxidant, a curing agent, and a carbon fiber.
  • the pressing material of the environmentally-friendly sheet material comprises components such as weight:
  • circuit board powder 80 ⁇ 97 circuit board powder, 3 ⁇ 12 parts isocyanate, 1 ⁇ 5 parts of release agent, 1 ⁇ 8 parts of water.
  • the technical solution adopted by the present invention is: an aldehyde-free zero-carbon environmentally-friendly sheet prepared by the above-mentioned manufacturing process, and the pressed raw material of the environmentally-friendly sheet includes a weight such as Components: 50 ⁇ 97 parts of circuit board powder, 3 ⁇ 20 parts isocyanate, 1 ⁇ 5 parts of release agent, 1 ⁇ 8 parts of water.
  • the pressing material of the environmental protection board comprises components such as 80 to 97 parts of circuit board powder, 3 to 12 parts of isocyanate, 1 to 5 parts of mold release agent, and 3 to 6 parts of water.
  • the pressing material of the environmental protection board comprises the following components: 80 ⁇ 97 parts of circuit board powder, 3 ⁇ 20 parts of anaerobic ⁇ ⁇ 1 ⁇ 5 parts of release agent, 2 ⁇ 8 parts Water, 10 ⁇ 20 parts of wood fiber powder, 5 ⁇ 12 parts of carbon fiber fiber.
  • the pressing material of the environmental protection board comprises the following components: 80 ⁇ 97 parts of circuit board powder, 3 ⁇ 20 parts of anaerobic ⁇ ⁇ 1 ⁇ 5 parts of release agent, 3 ⁇ 6 parts Water, 30 ⁇ 40 parts of wood fiber powder, 3 ⁇ 5 parts of water repellent, 3 ⁇ 5 parts of fire retardant, carbon fiber 7 ⁇ 10 parts, curing agent 1.5 ⁇ 2 parts, antioxidant 1.5 ⁇ 2 parts.
  • the release agent is paraffin
  • the circuit board powder is waste circuit board recycled powder.
  • the invention has the beneficial effects that: the isocyanate and the release agent are firstly mixed and mixed in the process of manufacturing the aldehyde-free zero-carbon environmentally-friendly sheet synthesized by the circuit board powder, and then mixed with water to fully fuse the water-soluble isocyanate with water, and the mixture is stirred and formed.
  • the ingredients of the board are controlled to control the moisture content of the ingredients in the board to prevent excessive wetting, and in the subsequent process, it cannot be uniformly mixed with the main material of the board to form a local agglomeration.
  • Moisture as a cross-linking medium (medium) enables the cross-linking of the board ingredients and the main material of the board.
  • the powder cannot be synthesized, and the powder contains moisture to avoid dust, so that the moisture cannot be omitted during the board making process.
  • the moisture content should not be too high.
  • the process of making the board must control the content of moisture in the main material of the board and the ingredients of the board, so the moisture is suitable to exist in the main ingredient and the ingredients respectively.
  • the moisture first mixed with the isocyanate can increase the degree of fusion of water and isocyanate, and effectively reduce the formation of bubbling by heat during the plate making process. Risk.
  • the pressure of the plate press during the pressure relief process is gently reduced, and the entire pressure relief process lasts for at least 1 minute, thereby avoiding sudden changes in the external pressure of the sheet.
  • the internal stress of the sheet and the thermal pressure cause the internal pressure to exceed the external pressure.
  • the pressure difference is greater than the sheet receiving range.
  • the water is heated to generate water vapor or other substances to be vaporized and the expansion is not released in time. A phenomenon occurs.
  • the pressure relief process is gentle and depressurized, which is beneficial to the effective drainage of bubbles in the plate to avoid the formation of bubbling, which effectively reduces the risk of explosion.
  • the board made of the circuit board powder and isocyanate according to the above manufacturing process is a completely aldehyde-free aldehyde-free health-friendly sheet.
  • the isocyanate can be used in this process as low as 3%, and the amount of recycled powder on the board can reach 95% or more. , greatly improve the efficiency of waste utilization, reduce the cost of the sheet, and the circuit board recycled powder itself has very good waterproof performance, so the obtained sheet also has very good waterproof performance.
  • the isocyanate can react with water to absorb water, which reduces the moisture content of the material, reduces the amount of water vapor emission, reduces the incidence of bubbles/bubble, and basically does not generate bubbling and bubbles, thereby solving the explosion together. Board problem. BEST MODE FOR CARRYING OUT THE INVENTION
  • embodiments of the present invention will be specifically described.
  • the invention relates to a manufacturing process of an aldehyde-free zero carbon environmental protection sheet material synthesized by using a circuit board powder, and the manufacturing process comprises the following steps:
  • the drying process is preferably carried out in a stirred drying machine.
  • the mixing process should be carried out using a mixing method from low speed to high speed to make the mixing more uniform.
  • the exhaust pressure is released, the pressure relief process is gently reduced, and the pressure relief process is at least 1 minute; the laminate of the multilayer hot press is heated by the circulating heat transfer oil, and the heat conduction of the laminate
  • the oil temperature is controlled within the range of 150 ° C ⁇ 200 ° C, so that the laminate maintains a high temperature, to ensure the temperature of the platen, using the flowing oil to heat the parts of the laminate to heat balance, to avoid temperature differences between the various parts of the laminate Excessive influence on sheet production and sheet quality.
  • the pressurization process is not a one-step process, but a process of gradually increasing the pressure, so that the various components interact more closely, and at the same time have the buffer time of interaction.
  • a pressure maintaining process is provided to provide a time for the raw materials to crosslink, so that the quality of the formed sheet is more stable.
  • the pressure relief process is also a gradual decompression process, avoiding the sharp decompression and forming the plate burst caused by the inconsistent internal and external pressure of the plate, avoiding the invisible burst caused by the inconsistency and the inconsistency or delamination of the local properties of the plate, further improving the quality of the plate and The consistency and stability of the sheet make the sheet durable.
  • the plate is pulled out, and then the conventional plate making process such as the flap and the air cooling treatment is performed.
  • the process of manufacturing the aldehyde-free zero-carbon environmentally-friendly sheet synthesized by the circuit board powder firstly mixes the isocyanate and the releasing agent, and then mixes with water to fully fuse the water-soluble isocyanate with water, and mixes and mixes to form a uniform plate-making ingredient, and the control system is controlled.
  • the moisture content of the board ingredients prevents excessive wetting and in the subsequent process cannot be uniformly mixed with the main material of the board to form local agglomeration.
  • Moisture as a cross-linking medium (medium) enables the cross-linking of the board ingredients and the main material of the board. Without the presence of moisture, the powder cannot be synthesized, and the powder contains moisture to avoid dust, so that the water cannot be omitted during the board making process.
  • the moisture content should not be too high.
  • the process of making the board must control the content of moisture in the main material of the board and the ingredients of the board, so the moisture is suitable to exist in the main ingredient and the ingredients respectively.
  • Moisture is first mixed with isocyanate to increase moisture and The degree of fusion of isocyanate effectively reduces the risk of bubbling due to heat during the board making process.
  • the pressure of the plate press during the pressure relief process is gently reduced, and the entire pressure relief process lasts for at least 1 minute, thereby avoiding sudden changes in the external pressure of the sheet.
  • the internal stress of the sheet and the thermal pressure cause the internal pressure to exceed the external pressure.
  • the pressure difference is greater than the sheet receiving range.
  • the water is heated to generate water vapor or other substances to be vaporized and the expansion is not released in time. A phenomenon occurs.
  • the pressure relief process is gentle and depressurized, which is beneficial to the effective drainage of bubbles in the plate to avoid the formation of bubbling, which effectively reduces the risk of explosion.
  • the board made of the circuit board powder and isocyanate according to the above manufacturing process is a completely aldehyde-free aldehyde-free health-friendly sheet.
  • the isocyanate can be used in this process as low as 3%, and the amount of recycled powder on the board can reach 95% or more. , greatly improve the efficiency of waste utilization, reduce the cost of the sheet, and the circuit board recycled powder itself has very good waterproof performance, so the obtained sheet also has very good waterproof performance.
  • the isocyanate can react with water to absorb water, which reduces the moisture content of the material, reduces the amount of water vapor emission, reduces the incidence of bubbles/bubble, and solves the problem of cracking.
  • the plate is subjected to the dual action of pressure and heat during the hot pressing process.
  • the water in the fiber begins to evaporate, and the evaporation of the water destroys the colloid layer.
  • the outward expansion force is greater than that of the fiber.
  • the internal stress between them causes a burst.
  • the isocyanate can be reacted with water to form an amine and carbon dioxide, and the amine is further reacted with an isocyanate to form a substituted urea. Since the isocyanate structure contains an unsaturated bond, it has high activity and easily reacts with some organic or inorganic groups having a reactive group to form a polyurethane elastomer. Adhesives added with MDI isocyanate can reduce the bubbling rate of the board during production and avoid bursting.
  • the waste electrical appliance recycling and dismantling center has been established in various places to dismantle used electrical appliances. After the electrical appliances are disassembled, plastics, metals and other materials are recycled, and harmful and strictly controlled substances are handed over.
  • the relevant disposal center handles the majority of the remaining boards for landfill disposal. This type of disposal is not scientific enough.
  • the electronics industry produces a large number of discarded scraps of circuit boards. Most companies directly incinerate and extract metal copper or recycle scraps to extract metals, and directly fill or remove PCB (board) powder residues. At the same time, the copper-clad board and the drilling powder produced by the electronics industry are also cleared or landfilled, which produces a large amount of discarded electronic waste.
  • Circuit board powder is a thermosetting fiber resin powder that is not easily degradable. Or landfill does not meet the requirements for energy conservation and emission reduction.
  • the remaining circuit board powder was directly synthesized according to the formulation provided by the present invention as a main component.
  • the circuit board powder is a powder material obtained by disassembling a waste circuit board or a circuit board scrap, or a circuit board drilling powder directly recovered.
  • the board powder is sifted with a vibrator to magnetize the metal slag so that the raw material does not agglomerate.
  • the step c is added before the step d, the high-fiber auxiliary material is coarsely crushed, and then the pulverization and grinding is performed to convert the high-fiber auxiliary material into the wood fiber powder of 80 mesh or more, and the water is dried at a temperature of 100 ° C or higher. Treatment, control the moisture content of 2% ⁇ 4%; then the wood fiber powder is stirred and mixed at 180 ° C to form carbon fiber powder.
  • the stirring process can be carried out by stirring and drying using a high-speed mixer, so that carbon fiber powder which is easily mixed and crosslinked with other substances to form a floor can be obtained, and the carbon fiber powder obtained by high-speed stirring is more flexible and retains its good toughness.
  • water repellent and fireproofing agent can be added for stirring to prevent high temperature burned materials.
  • the water repellent can premix the wood fiber powder to form a better waterproof and fireproof protection for the wood fiber powder. Then mix the board powder and the carbon fiber powder in proportion and mix well.
  • the high fiber excipient is a crop straw, a wood saw powder or a bamboo saw powder.
  • the recycled powder of the discarded circuit board and the wood fiber powder made of various straw or wood saw powder and bamboo saw powder are mixed, and various synthetic auxiliaries are added to mix various materials and suppress them by strong pressure.
  • the annual output of crop straw in China is hundreds of millions of tons, including corn stover, wheat straw, rice straw, bagasse and other crop straws.
  • APEC member countries have carried out technical cooperation on the utilization of crop straw integrated recycling waste resources in order to promote agro-ecological environmental protection in their own countries.
  • China has a large number of crops, such as corn stalks in the northeast and cotton in the northwest.
  • Straw, North China and East China, and southern rice stalks and wheat straw, as well as bagasse and other resources are very rich, and these surplus crop straws have not been used, they are directly landfilled or burned in the field, the incineration process produces a large number of Sulfur dioxide has a relatively large side effect on climate warming and environmental damage, and does not use ecological balance.
  • the crop straws contain relatively more lignocellulosic components, which can be recycled and recycled, and can be ground into crumb-like wood fiber powder, which is used as a raw material for the board.
  • Recyclable wood resources such as crop straw and bamboo sawdust formed by agricultural production in various parts of China have not been effectively used for landfill or incineration, which is not conducive to the implementation of environmental protection and low carbon.
  • bamboo sawdust In the wood products industry (furniture, flooring) and bamboo products industry, a large amount of wood or bamboo sawdust is produced. These sawdust, that is, wood chips, are not effectively recycled and recycled, and are basically burned or landfilled. Not only waste resources, but also pollute the environment.
  • the current wood flooring and laminate flooring are popular, but their normal service life is about 3 to 5 years. Since these flooring surfaces are pressed against the fireproof layer to play a flame retardant role, they cannot be incinerated after being discarded and can only be used as landfill. Handling, increasing the burden of environmental protection.
  • These waste reinforced flooring can be made into wood fiber powder of 80 mesh or more by grinding, and used as a plate filler.
  • waste materials can be recycled to avoid waste and avoid affecting the environment, and the weight of the sheet can be reduced to improve the toughness and strength of the sheet, which is closer to the performance of the wood, so that the sheet can be
  • the saw can be drilled, can be shaped, or can be shaped.
  • the step c2 is added before the step d, the processing aid is added in proportion and uniformly mixed again.
  • the processing aid includes an antioxidant, a curing agent, and a carbon fiber.
  • the main raw materials are uniformly mixed first, and then processing aids are added to ensure that the main raw materials are more uniformly mixed and the crosslinking effect is more closely.
  • a water repellent may be included in the processing aid, and the water repellent is one or more of paraffin wax, silicone oil, white oil, and medium palm wax. Water repellent can be added first to form a surface protection for high fiber materials. Therefore, the plate made by the process can be planned, nailed, sawn, and processed conveniently like solid wood, and can be recycled and recycled.
  • the addition of chopped carbon fiber and various composite auxiliaries can improve the internal and external stress tolerance of the plate, and at the same time improve the impact strength, static strength and static bending strength of the plate.
  • the pressed raw material of the environmentally-friendly sheet material comprises a weight such as the following components: 80 ⁇ 97 parts of the circuit Plate powder, 3 ⁇ 12 parts isocyanate, 1 ⁇ 5 parts of release agent, 1 ⁇ 8 parts of water.
  • the composition prepared according to this ratio is prepared to have a plate bursting probability close to zero, and has high internal bonding strength, strong static bending strength, high elastic modulus, holding screw force, small density deviation in the plate, and high density. .
  • the sheet metal manufacturing is carried out by the above-mentioned sheet manufacturing process, and in order to provide a recyclable non-explosive green sheet material, the raw material combination used in the present invention is: an aldehyde-free zero-carbon environmentally-friendly sheet material, and the pressed material of the environmentally-friendly sheet material includes a weight such as The following components: 50 ⁇ 97 parts of circuit board powder, 3 ⁇ 20 parts of isocyanate, 1 ⁇ 5 parts of release agent, 1 ⁇ 8 parts of water.
  • the pressed material of the environmentally-friendly sheet material comprises components such as 80 to 97 parts of circuit board powder, 3 to 12 parts of isocyanate, 1 to 5 parts of mold release agent, and 3 to 6 parts of water.
  • the pressing material of the environmentally-friendly board comprises the following components: 80 ⁇ 97 parts of circuit board powder, 3 ⁇ 20 parts of isocyanate, 1 ⁇ 5 parts of mold release agent, 2 ⁇ 8 parts of water, 10 ⁇ 20 A portion of wood fiber powder, 5 to 12 parts of carbon fiber.
  • the wood fiber powder composite board made of circuit board powder and straw, wood or bamboo saw powder inherits the high strength performance of the circuit board and has good toughness and small density of wood fiber, so that the board has the following functions:
  • the specific gravity reduces the load bearing capacity of the building; it also enhances the static strength and static bending strength of the sheet product; it also makes the sheet product easy to process and can suppress various shapes.
  • waste electronic circuit board recycled powder or / and circuit board drilling powder as the main filling material, renewable resources can be recycled and reused, which is conducive to environmental protection and energy saving.
  • the circuit board (CCL, PCB) powder is mainly composed of epoxy resin and glass fiber, the plate product made of the raw material has the effects of waterproofing, deformation proof, anti-expansion, mildew proof, anti-corrosion, acid resistance and alkali resistance, and Zero furfural standards can be achieved and recycled.
  • the addition of carbonized wood fiber mixture powder can mainly reduce the specific gravity of the plate, save transportation cost and bear the gravity of the plate, increase the internal and external stress of the plate, effectively improve the static strength and the static bending strength, and at the same time enhance the performance of the plate, and can suppress The uneven texture of various shapes makes it more antique.
  • the addition of wood fiber mixture powder can make the board more fiber bonding strength, and make the board more elastic, which provides superior performance for later use processing.
  • the pressed raw material of the environmentally-friendly sheet material comprises a weight such as the following components: 80 ⁇ 97 parts of the circuit Plate powder, 3 ⁇ 20 parts isocyanate, 1 ⁇ 5 parts mold release agent, 3 ⁇ 6 parts water, 30 ⁇ 40 parts wood fiber powder, 3 ⁇ 5 parts waterproof agent, 3 ⁇ 5 parts fire retardant, carbon fiber fiber 7 ⁇ 10 parts, 1.5 to 2 parts of curing agent, 1.5 to 2 parts of antioxidant.
  • the carbon fiber is a glass fiber.
  • the release agent is paraffin
  • the circuit board powder is a waste circuit board recycled powder
  • the waste material is recycled by using a circuit board to recover the waste material, and the waste is turned into a treasure.
  • Paraffin has the function of waterproofing agent, and can add one or more of paraffin, silicone oil, white oil and medium palm wax as water repellent. It is best to add paraffin emulsion, wood fiber for high fiber environmental protection board.
  • the composition and the powder component of the circuit board play the role of water-proof protection, preventing the plate from swelling and deforming with water, and achieving the effect of preventing mildew and anti-corrosion.
  • the fireproofing agent is one or more of ammonium chloride, potassium carbonate and carbon diammonium hydroxide, the carbon fiber is glass fiber, and the curing agent is ammonium chloride, oxalic acid, phenalkamine, polyether.
  • One or more of an amine and an arylamine, the antioxidant being one or more of an arylamine antioxidant, a phenolic antioxidant, a thioester, and a phosphite.
  • the fireproofing agent is one or more of ammonium chloride, potassium carbonate, and carbon diammonium hydroxide
  • the furfural catching agent is one or more of montmorillonite, melamine, and phenol.
  • the curing agent is one or more of ammonium chloride, oxalic acid, phenalkamine, polyether amine, and arylamine.
  • the antioxidant is an arylamine antioxidant and a phenolic antioxidant. One or more of a thioester or a phosphite.
  • one or more of ammonium chloride, potassium carbonate and carbon diammonium hydroxide are added as a fireproofing agent, and the phosphorus, nitrogen, boron, molybdenum, magnesium, aluminum, aluminum alloy composition may be added as a fire retardant for the sheet, and the fire retardant is a flame retardant. They are all distributed on the surface of fine fibers.
  • the flame retardant generates acid in the presence of high heat, forming a dehydrating agent. As the temperature increases, the flame retardant system will react violently to produce water vapor and incombustible gas, ie, flame retardant gas, and the system expands and foams to form a porous foam. Carbonized layer.
  • the carbonized layer acts as a heat barrier, blocks oxygen and prevents the escape of the degraded material, so that the entire flame retardant process is three-dimensional and omnidirectional, and the product is fireproof. Reach the Bfl level.
  • a high-efficiency smoke suppressant can be added to the fire retardant to effectively reduce the smoke concentration.
  • the added carbon fiber fiber is glass fiber, and the added carbon fiber fiber should be chopped carbon fiber fiber, and the length thereof is 3 mm to 25 mm, thereby increasing the strength of the plate and strengthening the bearing capacity of the whole plate.
  • the curing agent most preferably amine chloride as a curing agent, can accelerate the curing of the sheet during the production process, shorten the production cycle and improve the efficiency, and the sheet metal product can be processed immediately after the production of the sheet product, and can also prevent the occurrence of the sheet.
  • the produced products are easily broken.
  • an arylamine antioxidant a phenolic antioxidant, a thioester, and a phosphite are added as an antioxidant, and it is most preferable to add the phosphite as an antioxidant to the sheet. It can prevent the produced sheet products from oxidizing or aging due to the influence of climate temperature during long-term use.
  • Adding fire retardant, chopped carbon fiber, curing agent, antioxidant, stable compounding agent (stability, dispersion, activity) in the formulation mainly makes the board more compatible, the bonding strength is higher, and the sheet is stably cured without being affected by the climate. Oxidation, it can also have the natural raw wood smell, and can solve various performance requirements such as fire protection of decorative panels.
  • Embodiment 1 The pressing raw material of the aldehyde-free zero carbon environmental protection sheet of the present invention comprises components such as weight:
  • Example 2 The pressed raw material of the aldehyde-free zero carbon environmental protection sheet of the present invention comprises the following components: 97 parts of circuit board powder, 20 parts of isocyanate, 5 parts of paraffin, and 8 parts of water.
  • Example 3 The pressed raw material of the aldehyde-free zero carbon environmental protection sheet of the present invention comprises the following components: 50 parts of circuit board powder, 8 parts of isocyanate, 3 parts of paraffin, and 1 part of water.
  • Embodiment 4 The pressed raw material of the aldehyde-free zero carbon environmental protection sheet of the present invention comprises the following components: 75 parts of circuit board powder, 12 parts of isocyanate, 2 parts of paraffin, and 3 parts of water.
  • Example 5 The pressed raw material of the aldehyde-free zero carbon environmental protection sheet of the present invention comprises the following components: 50 parts of circuit board powder, 10 parts of isocyanate, 4 parts of paraffin, and 3 parts of water.
  • Embodiment 6 The pressed raw material of the aldehyde-free zero carbon environmental protection sheet of the present invention comprises the following components: 80 parts of circuit board powder, 12 parts of isocyanate, 4 parts of paraffin, and 5 parts of water.
  • Example 7 The pressed raw material of the aldehyde-free carbon-free green sheet of the present invention comprises the following components: 97 parts of circuit board powder, 12 parts of isocyanate, 5 parts of paraffin, and 6 parts of water.
  • Embodiment 8 The pressing raw material of the aldehyde-free zero carbon environmental protection sheet of the present invention comprises components such as weight: 80 parts of board powder, 3 parts isocyanate, 1 part paraffin, 3 parts water.
  • Example 9 The pressed raw material of the aldehyde-free zero carbon environmentally-friendly sheet of the present invention comprises the following components: 90 parts of circuit board powder, 8 parts of isocyanate, 3 parts of paraffin, and 4 parts of water.
  • the pressing raw material of the aldehyde-free zero carbon environmental protection sheet of the invention comprises the following components: 80 parts of circuit board powder, 12 parts of isocyanate, 4 parts of paraffin, 6 parts of water, 10 parts of wood fiber powder, 8 parts Carbon wire township thousand.
  • Embodiment 11 The pressing raw material of the aldehyde-free zero carbon environmental protection sheet of the present invention comprises the following components: 97 parts of circuit board powder, 12 parts of isocyanate, 5 parts of paraffin, 8 parts of water, 20 parts of wood fiber powder, 5 Parts of carbon fiber.
  • Embodiment 12 The pressing raw material of the aldehyde-free zero carbon environmental protection sheet of the present invention comprises the following components: 80 parts of circuit board powder, 3 parts of isocyanate, 1 part of paraffin, 2 parts of water, 20 parts of wood fiber powder, 12 Parts of carbon fiber.
  • the pressing raw material of the aldehyde-free zero carbon environmental protection sheet of the present invention comprises the following components: 90 parts of circuit board powder, 8 parts of isocyanate, 3 parts of paraffin, 4 parts of water, 15 parts of wood fiber powder, 12 Parts of carbon fiber.
  • Embodiment 14 The pressed raw material of the aldehyde-free zero carbon environmental protection sheet of the present invention comprises the following components: 80 parts of circuit board powder, 12 parts of isocyanate, 4 parts of paraffin, 5 parts of water, 10 parts of wood fiber powder, 3 A portion of ammonium chloride, 8 parts of carbon fiber, 1.5 parts of ammonium chloride, and 1.8 parts of phosphite.
  • Embodiment 15 The pressing raw material of the aldehyde-free zero carbon environmental protection sheet of the present invention comprises the following components: 97 parts of circuit board powder, 12 parts of isocyanate, 5 parts of paraffin, 6 parts of water, 20 parts of wood fiber powder, 4 A portion of ammonium chloride, 10 parts of carbon fiber, 1.5 parts of ammonium chloride, and 1.5 parts of phosphite.
  • Embodiment 16 The pressed raw material of the aldehyde-free zero carbon environmental protection sheet of the present invention comprises the following components: 80 parts of circuit board powder, 3 parts of isocyanate, 1 part of paraffin, 3 parts of water, 20 parts of wood fiber powder, 5 Parts of ammonium chloride, carbon fiber 7 parts, 1.8 parts of ammonium chloride, 1.8 parts of phosphite.
  • Embodiment 17 The pressed raw material of the aldehyde-free carbon-free green sheet of the present invention comprises the following components: 90 parts of circuit board powder, 8 parts of isocyanate, 3 parts of paraffin, 4 parts of water, 15 parts of wood fiber powder, 5 Part of ammonium chloride, 7 parts of carbon fiber, 2 parts of ammonium chloride, 2 parts of phosphite.
  • the experimental data are as follows: (According to the national high-density artificial board standard, ie LY/T1611-2003 standard)
  • the materials prepared in the respective embodiments by the manufacturing process of the present invention have the following good performance parameters.
  • the amount of furfural released was zero (standard requirement E0) 0.5mg/100g);
  • the density of the board is greater than 1.39kg/m 3 (standard requirement >0.8kg/m 3 ); in addition, the density deviation within the board is: +0.63%, -1.26% (standard requirement ⁇ 4.0%) ).
  • a combination of one or more of paraffin, silicone oil, white oil, and medium palm wax is added to replace the original paraffin or silicone oil as a water repellent, and the plate product is repeatedly tested and tested.
  • a phase difference of less than 3.5% is an acceptable alternative to each other.
  • the carbon fiber fibers are chopped glass fibers.
  • the original amine chloride is replaced by a combination of one or more of oxalic acid, phenalkamine, polyetheramine and arylamine as a curing agent, and the plate product is tested repeatedly, and the difference in performance parameters is less than 3%. , is an acceptable alternative to each other.

Abstract

一种利用电路板粉合成的无醛零碳环保板材及其制造方法，该板材的原料包括电路板粉、异氰酸酯、脱模剂、水、木质纤维粉和碳丝纤维,将这些原料混合、压制得到板材。电路板粉用量可达95%以上，所制板材无鼓泡缺陷，并具有非常好的防水性能。

Description

利用电路板粉合成的无醛零碳环保板材及其制造工艺
技术领域
本发明涉及一种环保板材， 尤其涉及一种利用电路板粉合成的无醛零碳环 保板材。 本发明还涉及一种利用电路板粉合成的无醛零碳环保板材的制造工艺。
背景技术
传统木制品板材制作的原材料为木材， 需要砍伐森林资源， 从而造成水土 流失， 发生各种自然灾害， 影响自然环境及生态的平衡发展， 不环保并且不能 有效节能减排。 这种木制品板材曱醛释放量大， 遇水容易膨胀、 变形、 弯曲、 发霉， 不耐腐蚀、 不耐酸、 不耐碱， 并且易燃。
随着世界各地城市的高速发展， 需要用到大量建筑材料， 工业与建筑使用 的装饰板材包括木质曱板、 木质多层板、 低中高密度板、 刨花板或原木板材都 没有应用再生资源循环回收技术， 因此需要大量砍伐森林资源， 造成大量的木 材资源过度砍伐浪费， 过度破坏生态环境， 使目前世界各地都处于生态平衡失 调状态， 频繁发生地震、 泥石流、 水灾、 旱灾、 雪灾、 沙尘暴等自然灾害， 使 全球气候急升变暖， 环境污染越来越严重。 过度砍伐森林资源使得生态平衡失 调， 水土流失， 木材资源减少， 从而使木制品原材料价格急升猛涨。
现时普遍的人造板生产技术都使用含醛的稀释剂作为生产胶粘配方的成 份， 由于传统胶粘剂脲醛树脂或酚醛树脂等含水率比较高， 会超过胶粘剂重量 的 12%, 此时制板热压过程中胶粘剂会与原料发生化学反应从而产生大量的水 蒸气。 当板材制作原料主要为线路板粉时， 板胚在热压过程中受到压力与热力 的双重作用， 水蒸汽无法被吸收， 容易导致鼓泡现象的发生， 在制板后期泄压 过程鼓泡向外膨胀力大于内应力导致板材爆板现象发生。
发明内容
针对现有技术不足， 本发明要解决的技术问题是提供一种可循环再生的利 用废电路板粉合成的无爆板现象的零碳高纤维环保板材及其制造工艺。
为了克服现有技术不足， 本发明釆用的技术方案是： 一种利用电路板粉合 成的无醛零碳环保板材的制造工艺， 其特征在于， 所述制造工艺包括如下步骤： a、 把异氰酸酯与脱模剂按比例混合并搅拌均匀；
b、 按比例加入水并搅拌均勾， 形成制板配料；
c、 对电路板粉进行干燥处理， 控制电路板粉的水分不超过 3%, 控制干燥 炉内的温度在 125 °C的恒温中进行搅拌干燥；
d、把干燥后的电路板粉与制板配料按比例混合搅拌均匀， 形成混合原料并 保证水分的重量百分比不超过 10 %；
e、 将混合原料均匀等速喂料进入铺装系统， 用扫平辊把原料摊平， 混合原 料进入预压机后压制为统一厚度的板坯， 由输送带送去纵横修边， 然后再输送 到多层重压机或连续钢压平压机对板材进行成型加压； 加压 1 分钟， 使板材表 面的压力达到 8Mps以上， 静置 2分钟后再进行补压， 补压压力达到 llMps以 上， 补压时间持续 3分钟后排气泄压， 泄压过程平緩均勾递减， 泄压过程至少 1 分钟； 所述多层热压机的层压板用循环导热油加热， 所述层压板的导热油温度 控制在 150°C~200 °C之内；
f、 压制完毕后， 把板材拉出， 然后进行翻板以及风冷却处理；
g、 砂光定厚， 质检， 堆板入库。
作为上述方案的改进， 所述电路板粉是将废弃电路板或电路板边角料拆解 磨成的粉状物料， 或者是直接回收的电路板钻孔粉； 在 c 步骤进行干燥前， 对 电路板粉用振动器筛选并磁吸金属杂渣， 使其原料不结团。
作为上述方案的改进，在 d步骤前增加 cl步骤，对高纤维辅料进行粗破碎， 然后再进行粉碎研磨使高纤维辅料转化成 80 目以上的木质纤维粉， 在 100 °C以 上的温度环境进行水分干燥处理， 控制其水分含量在 2 % ~ 4 %； 然后把木质纤 维粉在 180°C下进行搅拌混和形成碳质纤维粉；把电路板粉与碳质纤维粉按比例 混合搅拌均勾； 所述高纤维辅料是农作物秸秆、 木质锯粉或竹质锯粉。
作为上述方案的改进， 在 d步骤前增加 c2步骤， 按比例添加加工助剂并再 次均匀混和； 所述加工助剂包括抗氧剂、 固化剂、 碳丝纤维。
作为上述方案的改进， 所述环保板材的压制原料包括重量比如下的组分：
80 ~ 97份电路板粉， 3 ~ 12份异氰酸酯， 1 ~ 5份脱模剂， 1 ~ 8份水。
为提供可循环再生的无爆板的环保板材， 本发明釆用的技术方案是： 一种 釆用上述制造工艺制备得到的无醛零碳环保板材， 所述环保板材的压制原料包 括重量比如下的组分： 50 ~ 97份电路板粉， 3 ~ 20份异氰酸酯， 1 ~ 5份脱模剂， 1 ~ 8份水。
作为上述方案的改进， 所述环保板材的压制原料包括重量比如下的组分： 80 ~ 97份电路板粉， 3 ~ 12份异氰酸酯， 1 ~ 5份脱模剂， 3 ~ 6份水。
作为上述方案的改进， 所述环保板材的压制原料包括重量比如下的组分： 80 ~ 97份电路板粉， 3 ~ 20份异氛酸酉^ 1 ~ 5份脱模剂， 2 ~ 8份水， 10 ~ 20份 木质纤维粉， 5 ~ 12份碳丝纤维。
作为上述方案的改进， 所述环保板材的压制原料包括重量比如下的组分： 80 ~ 97份电路板粉， 3 ~ 20份异氛酸酉^ 1 ~ 5份脱模剂， 3 ~ 6份水， 30 ~ 40份 木质纤维粉， 3 ~ 5份防水剂， 3 ~ 5份防火剂， 碳丝纤维 7 ~ 10份， 固化剂 1.5 ~ 2份， 抗氧剂 1.5 ~ 2份。
作为上述方案的改进， 所述脱模剂为石蜡， 所述电路板粉是废弃线路板回 收粉。
本发明的有益效果是： 利用电路板粉合成的无醛零碳环保板材制造工艺过 程中先将异氰酸酯与脱模剂搅拌混合， 再与水混合使得水溶性异氰酸酯与水充 分融合， 混合搅拌形成均勾的制板配料， 控制制板配料中水分含量防止其过度 湿润而在后续过程无法与制板主料无法均匀混合而形成局部结团。 水分作为交 联介质 (媒质)使制板配料和制板主料能够交联，没有水分的存在则粉料无法合成 板材， 而且粉料含有水分可以避免扬尘， 从而水分在制板过程无法略去， 但为 避免搅拌不均勾则水分的含量不宜过高， 制板过程务必控制水分在制板主料和 制板配料中的含量， 因此水分适宜分别存在于主料和配料中。 水分先与异氰酸 酯混合可以提高水分与异氰酸酯的融合度， 有效降低制板过程受热形成鼓泡的 风险。
制板工艺后期， 泄压过程压板机的压力平緩均勾递减， 整个泄压过程至少 持续 1 分钟， 从而避免板材所受外部压力突变。 制板过程板材内部应力以及热 力引起内压超出外压的压差值大于板材承受范围， 同时水分受热产生水蒸汽或 其他物质气化产生膨胀未得到及时排泄， 两者同时作用则容易导致爆板现象发 生。 泄压过程平緩降压， 有利于板内气泡得到有效排泄避免形成鼓泡， 有效降 低爆板的风险。
电路板粉与异氰酸酯等原料按上述制造工艺制得的板材为完全无曱醛的无 醛健康环保板材， 异氰酸酯在此工艺中使用量可以低至 3 % , 线路板回收粉用量 可以达到 95 %以上， 大大提高废物利用的效率， 降低板材的成本， 而且线路板 回收粉本身具有非常好的防水性能， 因此制得的板材也具有非常好的防水性能。 制板过程异氰酸酯可以与水进行反应从而吸收水分， 使得材料含水率降低， 减 少了水蒸汽的散发量， 降低气泡 /鼓泡的发生率， 基本不产生鼓泡和气泡， 从而 一并解决了爆板问题。 具体实施方式 下面对本发明的实施方式进行具体描述。
本发明一种利用电路板粉合成的无醛零碳环保板材的制造工艺， 所述制造 工艺包括如下步骤：
a、 把异氰酸酯与脱模剂按比例混合并搅拌均匀；
b、 按比例加入水并搅拌均勾， 形成制板配料；
c、 对电路板粉进行干燥处理， 控制电路板粉的水分不超过 3%, 控制干燥 炉内的温度在 125 °C的恒温中进行搅拌干燥， 使物料便于均匀混合。 干燥过程最 好在搅拌式干燥机械中进行， 搅拌过程宜使用从低速到高速转换的搅拌方式， 使得混合更均匀。
d、把干燥后的电路板粉与制板配料按比例混合搅拌均匀， 形成混合原料并 保证水分的重量百分比不超过 10 %；
e、 将混合原料均匀等速喂料进入铺装系统， 用扫平辊把原料摊平， 混合原 料进入预压机后压制为统一厚度的板坯， 由输送带送去纵横修边， 然后再输送 到多层重压机或连续钢压平压机对板材进行成型加压； 加压 1 分钟， 使板材表 面的压力达到 8Mps以上， 静置 2分钟后再进行补压， 补压压力达到 llMps以 上， 补压时间持续 3分钟后排气泄压， 泄压过程平緩均勾递减， 泄压过程至少 1 分钟； 所述多层热压机的层压板用循环导热油加热， 所述层压板的导热油温度 控制在 150°C~200 °C之内， 使得层压板持续维持较高的温度， 保证压板的温度， 使用流动的油进行加热可以使层压板各部位受热平衡， 避免层压板各部位温差 过大影响板材生产以及板材质量。
其中， 加压过程不是一步到位， 而是逐步提升压力的过程， 使得各种成分 相互作用更加紧密， 同时具有相互作用的緩冲时间。 加压过程中设有保压过程， 提供原料以交联作用的时间， 使其形成的板材质量更加稳定。 卸压过程也是逐 步减压的过程， 避免急剧降压形成板材内外部压力不一致导致的板材爆裂， 避 免由此引起的隐形爆裂以及板材局部性能不一致或分层等板材瑕疵， 进一步提 高板材的质量和板材的一致性、 稳定性， 使得板材耐用。
f、 压制完毕后， 把板材拉出， 然后进行翻板以及风冷却处理等常规制板工 序。
g、 砂光定厚， 质检， 堆板入库。
利用电路板粉合成的无醛零碳环保板材制造工艺过程中先将异氰酸酯与脱 模剂搅拌混合， 再与水混合使得水溶性异氰酸酯与水充分融合， 混合搅拌形成 均匀的制板配料， 控制制板配料中水分含量防止其过度湿润而在后续过程无法 与制板主料无法均匀混合而形成局部结团。水分作为交联介质 (媒质)使制板配料 和制板主料能够交联， 没有水分的存在则粉料无法合成板材， 而且粉料含有水 分可以避免扬尘， 从而水分在制板过程无法略去， 但为避免搅拌不均勾则水分 的含量不宜过高， 制板过程务必控制水分在制板主料和制板配料中的含量， 因 此水分适宜分别存在于主料和配料中。 水分先与异氰酸酯混合可以提高水分与 异氰酸酯的融合度， 有效降低制板过程受热形成鼓泡的风险。
制板工艺后期， 泄压过程压板机的压力平緩均勾递减， 整个泄压过程至少 持续 1 分钟， 从而避免板材所受外部压力突变。 制板过程板材内部应力以及热 力引起内压超出外压的压差值大于板材承受范围， 同时水分受热产生水蒸汽或 其他物质气化产生膨胀未得到及时排泄， 两者同时作用则容易导致爆板现象发 生。 泄压过程平緩降压， 有利于板内气泡得到有效排泄避免形成鼓泡， 有效降 低爆板的风险。
电路板粉与异氰酸酯等原料按上述制造工艺制得的板材为完全无曱醛的无 醛健康环保板材， 异氰酸酯在此工艺中使用量可以低至 3 % , 线路板回收粉用量 可以达到 95 %以上， 大大提高废物利用的效率， 降低板材的成本， 而且线路板 回收粉本身具有非常好的防水性能， 因此制得的板材也具有非常好的防水性能。 制板过程异氰酸酯可以与水进行反应从而吸收水分， 使得材料含水率降低， 减 少了水蒸汽的散发量， 降低气泡 /鼓泡的发生率， 解决了爆板问题。
板材在热压过程中受到压力与热力的双重作用， 纤维中的水份开始蒸发， 水份的蒸发会破坏胶质层， 板材在压机出口进行卸压时， 其向外膨胀的力大于 纤维间的内应力导致爆板。 异氰酸酯可以与水反应生成胺和二氧化碳， 胺进一 步与异氰酸酯反应生成取代脲。 由于异氰酸酯结构中含有不饱和键， 因此具有 高活性， 容易与一些带活性基团的有机或无机物反应， 生成聚氨酯弹性体。 加 入 MDI异氰酸酯的胶粘剂在生产过程中可以降低板材鼓泡率， 避免爆板。
随着全球电子工业的发展， 废旧家电回收体制逐步建立， 各地相应的建立 废旧家电回收拆解中心拆解废旧电器， 电器拆解后把塑料、 金属等材料回收利 用， 有害的严控物质交由相关处置中心处理， 剩余的电路板大部分作填埋处理， 这样的处置方式不够科学。 电子工业产生大量的电路板废弃边角料， 大部分企 业直接成块焚烧提取金属铜或回收边角料破碎后提取金属， 把 PCB (电路板） 粉残渣直接填埋或清运。 同时清运或填埋的还有电子工业生产过程产生的覆铜 板、 钻孔粉， 这样就产生大量废弃的电子垃圾。 仅仅中国地区每年都产生 500 万吨以上废弃电路板， 电路板粉是不容易降解的热固性纤维树脂粉， 直接废弃 或填埋不符合节能减排的要求。 为再生资源循环回收利用提供了丰富的原料来 源， 利用本发明的相关技术， 把废旧电器拆解后的电路板以及工业废弃电路板 回收， 将电路板破碎后釆用静电分离技术提取金属之后， 把剩余的电路板粉直 接按本发明提供的配方作为主要成分合成板材。
更佳地， 所述电路板粉是将废弃电路板或电路板边角料拆解磨成的粉状物 料， 或者是直接回收的电路板钻孔粉。 在 C 步骤进行干燥前， 对电路板粉用振 动器筛选并磁吸金属杂渣， 使其原料不结团。
更佳地， 在 d步骤前增加 cl步骤， 对高纤维辅料进行粗破碎， 然后再进行 粉碎研磨使高纤维辅料转化成 80 目以上的木质纤维粉， 在 100°C以上的温度环 境进行水分干燥处理，控制其水分含量在 2 % ~ 4 %；然后把木质纤维粉在 180°C 下进行搅拌混和形成碳质纤维粉。 搅拌过程可以使用高速搅拌机进行搅拌干燥 从而可以得到容易混合更易于与其它物质发生交联作用形成地板的碳质纤维 粉， 高速搅拌得到的碳质纤维粉更加具有柔韧性， 保留其良好的韧性。 同时也 可以添加防水剂、 防火剂进行搅拌， 防止高温灼伤物料， 防水剂得以对木质纤 维粉进行预混， 从而对木质纤维粉形成更好的防水防火保护。 然后把电路板粉 与碳质纤维粉按比例混合搅拌均匀。
所述高纤维辅料是农作物秸秆、 木质锯粉或竹质锯粉。 将废弃的电路板的 回收粉以及由各种秸秆或木材锯粉、 竹材锯粉制作的木质纤维粉混合， 并添加 各种合成助剂， 将各种材料混合均勾并通过强大的压力压制出防水、 防火、 防 膨胀、 防变形、 防弯曲、 防霉、 防腐、 耐酸、 耐碱并且曱醛释放量为零的电路 板粉合成的无醛零碳环保板材， 实现了将各种废弃物料回收制作板材的循环再 生的目的， 避免过度砍伐森林， 有利于维持和恢复自然环境与生态平衡， 减少 自然灾害， 稳定板材价格， 达到环保低碳节能减排的效果。
我国每年农作物秸秆产量为数亿吨， 包括玉米秸秆、 小麦秸秆、 水稻秸秆、 甘蔗渣以及其它农作物秸秆。 随着全球对农业的政策支持， APEC成员国为了在 自己国家推动农业生态环境保护， 彼此开展农作物秸秆综合再生循环废物资源 利用方面的技术合作。 我国有大量的农作物， 如东北的玉米秸秆、 西北的棉花 秸秆、 华北与华东以及南方的水稻秸秆和小麦秸秆以及与甘蔗渣等资源非常丰 富， 而这些剩余农作物秸秆都没有加已利用， 都是直接在田地上填埋或者焚烧 了， 焚烧过程产生大量的二氧化硫对气候变暖、 环境破坏起到比较大的副作用， 不利用生态平衡。 然而， 农作物秸秆都含有比较多木质纤维素成分， 可以再生 循环回收利用， 可磨碎成为碎屑状成为木质纤维粉， 作为板材的配方原料。 我 国各地农业生产形成的农作物秸秆以及竹木锯粉等可再生木质资源没有得到有 效利用而填埋或焚烧， 不利于环保低碳的推行。
木业制品行业 （家具、 地板） 以及竹制品行业生产过程中产生大量的木材 或竹材锯粉， 这些锯粉即木质碎屑都没有有效的再生回收处理， 基本都是作焚 烧或填埋处理， 不但浪费资源， 而且污染环境。 目前的木地板、 强化木地板比 较流行， 但其通常的使用寿命在 3到 5年左右， 由于这些地板表面压贴了防火 层起到阻燃的作用， 废弃后无法焚烧只能作为垃圾填埋处理， 加重环境保护的 负担。 而这些废旧强化地板通过研磨处理后可制成 80目以上的木粉即木质纤维 粉， 作为板材填充料使用。
使用农作物秸秆、 木质锯粉或竹质锯粉作为高纤维辅料， 即可回收废弃资 源避免浪费避免影响环境， 又可是减轻板材的重量提高板材的韧性和强度， 更 加接近木材的性能， 使得板材可锯可钻、 可进行异形加工， 也可以进行异形压 板。
更佳地， 在 d步骤前增加 c2步骤， 按比例添加加工助剂并再次均匀混和。 所述加工助剂包括抗氧剂、 固化剂、 碳丝纤维。 先将主要原料均匀混合， 然后 再添加加工助剂， 保证主要原料之间混合更加均匀从而交联作用更加密切。 加 工助剂中可以包括防水剂， 所述防水剂为石蜡、 硅油、 白油、 中棕榈蜡中的一 种或多种。 可以先添加防水剂， 预先对高纤维物料形成外表保护。 从而使使用 该工艺制作的板材像实木木材一样可刨、 可钉、 可锯， 加工方便， 并且可再生 回收循环使用。 添加了短切碳丝纤维以及各种复合助剂相应提高了板材的内外 应力承受能力， 同时提高了板材的抗冲击强度与静止强度、 静曲强度。
更佳地， 所述环保板材的压制原料包括重量比如下的组分： 80 ~ 97份电路 板粉， 3 ~ 12份异氰酸酯， 1 ~ 5份脱模剂， 1 ~ 8份水。 按此比例调配的组分进 行制备得到的板材爆板几率接近零， 并且具有较高的内结合强度高、 静曲强度 强、 弹性模量高、 握螺钉力， 板内密度偏差小， 密度高。
通过上述板材制造工艺进行板材制造， 为了提供可循环再生的无爆板的环 保板材， 本发明釆用的原料搭配是： 一种无醛零碳环保板材， 所述环保板材的 压制原料包括重量比如下的组分： 50 ~ 97份电路板粉， 3 ~ 20份异氰酸酯， 1 ~ 5份脱模剂， 1 ~ 8份水。
更佳地， 所述环保板材的压制原料包括重量比如下的组分： 80 ~ 97份电路 板粉， 3 ~ 12份异氰酸酯， 1 ~ 5份脱模剂， 3 ~ 6份水。
更佳地， 所述环保板材的压制原料包括重量比如下的组分： 80 ~ 97份电路 板粉， 3 ~ 20份异氰酸酯， 1 ~ 5份脱模剂， 2 ~ 8份水， 10 ~ 20份木质纤维粉， 5 ~ 12份碳丝纤维。
电路板粉与秸秆、 木材或竹材锯粉制作的木质纤维粉合成板材即继承了电 路板的高强度性能又具有木质纤维的良好韧性和较小的密度， 使得板材有如下 作用： 既减轻板材的比重， 减轻建筑物的产品承重力； 又增强板材产品的静止 强度与静曲强度； 还使得板材产品容易加工， 可以压制各种形状。
利用废电子线路板再生粉料或 /和线路板钻孔粉为主要填充物料， 可以将废 弃资源再生循环使用， 有利于环保和节能减排。 由于电路板（CCL、 PCB )粉主 要是由环氧树脂与玻璃纤维组成， 用其作原料制造的板材产品具有防水、 防变 形、 防膨胀、 防霉、 防腐、 耐酸、 耐碱等效果， 而且可以达到零曱醛标准， 还 可循环再回收。
添加碳化木质纤维混合物粉主要可以减轻板材的比重， 节约运输成本以及 使用板材的承受重力， 增加板材的内外应力作用， 使静止强度和静曲强度得到 有效提高， 同时增强板材的使用性能， 可以压制各种形状的凹凸紋理， 使其更 有仿古感觉。 添加木质纤维混合物粉可以使板材更具有纤维粘合强度， 使板材 的具有更好的弹性， 为后期使用加工过程中提供优越的使用性能。
更佳地， 所述环保板材的压制原料包括重量比如下的组分： 80 ~ 97份电路 板粉， 3 ~ 20份异氰酸酯， 1 ~ 5份脱模剂， 3 ~ 6份水， 30 ~ 40份木质纤维粉， 3 ~ 5份防水剂， 3 ~ 5份防火剂， 碳丝纤维 7 ~ 10份， 固化剂 1.5 ~ 2份， 抗氧剂 1.5 ~ 2份。 其中， 所述碳丝纤维为玻璃纤维。
更佳地， 所述脱模剂为石蜡， 所述电路板粉是废弃线路板回收粉， 使用线 路板回收粉制造板材可以对废物进行回收利用， 变废为宝。
其中石蜡兼具防水剂的作用， 并且可以增加添加石蜡、 硅油、 白油、 中棕 榈蜡中的一种或多种作为防水剂， 最佳是添加石腊乳液， 对高纤维环保板材的 木质纤维成分以及电路板粉成分起到隔水保护的作用， 防止板材遇水膨胀变形， 达到防霉、 防腐的效果。 所述防火剂为氯化铵、 碳酸钾、 碳配二氢铵中的一种 或多种， 所述碳丝纤维为玻璃纤维， 所述固化剂为氯化胺、 草酸、 酚醛胺、 聚 醚胺、 芳脂胺中的一种或多种， 所述抗氧剂为芳脂胺类抗氧剂、 酚类抗氧剂、 硫酯、 亚磷酸脂中的一种或多种。
更佳地， 所述防火剂为氯化铵、 碳酸钾、 碳配二氢铵中的一种或多种， 所 述曱醛捉捕剂为蒙脱土、 三聚氰胺、 苯酚中的一种或多种， 所述固化剂为氯化 胺、 草酸、 酚醛胺、 聚醚胺、 芳脂胺中的一种或多种， 所述抗氧剂为芳脂胺类 抗氧剂、 酚类抗氧剂、 硫酯、 亚磷酸脂中的一种或多种。
其中， 添加氯化铵、 碳酸钾、 碳配二氢铵中的一种或多种作为防火剂， 也 可以添加磷氮硼钼镁辞铝组合物为板材防火剂， 使防火剂即阻燃剂均勾分布于 细小的纤维表面。 阻燃剂遇高热产生酸， 形成脱水剂， 随着温度的升高， 阻燃 剂体系将会进行剧烈反应， 产生水蒸气和不燃性气体即阻燃性气体， 同时体系 膨胀发泡形成多孔泡沫炭化层。 由于水蒸气和不然气体能够稀释板材的可燃物 浓度， 炭化层起阻热、 阻氧和阻止降解物的逸出等作用， 从而使整个阻燃过程 是立体的、 全方位的， 使产品防火性能达到 Bfl 级。 防火剂中可添加高效抑烟 剂有效降低烟雾浓度。
其中， 添加的碳丝纤维是玻璃纤维， 添加的碳丝纤维应为短切碳丝纤维， 其长度为 3毫米至 25毫米，从而可以增加板材的强度并加强整张板材的承载力。
其中， 添加氯化胺、 草酸、 酚醛胺、 聚醚胺、 芳脂胺中的一种或多种作为 固化剂， 最优选以氯化胺作为固化剂， 可以在生产过程中使板材加快固化， 缩 短生产周期， 提高效率， 板材产品生产出来后马上可以进行下一步板材加工应 用， 同时也可以防止出现刚生产出来的产品容易碰碎的现象。
其中， 添加芳脂胺类抗氧剂、 酚类抗氧剂、 硫酯、 亚磷酸脂中的一种或多 种作为抗氧剂， 最优选以亚磷酸脂作为抗氧剂添加到板材中， 可以防止生产出 来的板材产品长时间使用过程中受到气候温度影响而发生氧化或老化作用。
在配方添加防火剂、 短切碳丝纤维、 固化剂、 抗氧剂、 稳定复合助剂 （稳 定、 分散、 活性）等主要使板材更加相融， 粘合强度更高， 板材稳定固化不受 气候氧化作用， 还能具有天然原木材气味， 并且能够解决装饰板材防火等各种 性能要求。
经过反复分析及试验验证， 得到以下可以满足成型制造利用电路板粉合成 的无醛零碳环保板材的各种组分的原料搭配的实施例。
实施例一： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组分：
97份电路板粉， 3份异氰酸酯， 1份石蜡， 4份水。
实施例二： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组分： 97份电路板粉， 20份异氰酸酯， 5份石蜡， 8份水。
实施例三： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组分： 50份电路板粉， 8份异氰酸酯， 3份石蜡， 1份水。
实施例四： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组分： 75份电路板粉， 12份异氰酸酯， 2份石蜡， 3份水。
实施例五： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组分： 50份电路板粉， 10份异氰酸酯， 4份石蜡， 3份水。
实施例六： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组分： 80份电路板粉， 12份异氰酸酯， 4份石蜡， 5份水。
实施例七： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组分： 97份电路板粉， 12份异氰酸酯， 5份石蜡， 6份水。
实施例八： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组分： 80份电路板粉， 3份异氰酸酯， 1份石蜡， 3份水。
实施例九： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组分： 90份电路板粉， 8份异氰酸酯， 3份石蜡， 4份水。
实施例十： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组分： 80份电路板粉， 12份异氰酸酯， 4份石蜡， 6份水， 10份木质纤维粉， 8份碳 丝乡千维。
实施例十一： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组 分： 97份电路板粉， 12份异氰酸酯， 5份石蜡， 8份水， 20份木质纤维粉， 5 份碳丝纤维。
实施例十二： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组 分： 80份电路板粉， 3份异氰酸酯， 1份石蜡， 2份水， 20份木质纤维粉， 12 份碳丝纤维。
实施例十三： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组 分： 90份电路板粉， 8份异氰酸酯， 3份石蜡， 4份水， 15份木质纤维粉， 12 份碳丝纤维。
实施例十四： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组 分： 80份电路板粉， 12份异氰酸酯， 4份石蜡， 5份水， 10份木质纤维粉， 3 份氯化铵， 碳丝纤维 8份， 氯化胺 1.5份， 亚磷酸脂 1.8份。
实施例十五： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组 分： 97份电路板粉， 12份异氰酸酯， 5份石蜡， 6份水， 20份木质纤维粉， 4 份氯化铵， 碳丝纤维 10份， 氯化胺 1.5份， 亚磷酸脂 1.5份。
实施例十六： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组 分： 80份电路板粉， 3份异氰酸酯， 1份石蜡， 3份水， 20份木质纤维粉， 5 份氯化铵， 碳丝纤维 7份， 氯化胺 1.8份， 亚磷酸脂 1.8份。
实施例十七： 本发明的无醛零碳环保板材的压制原料包括重量比如下的组 分： 90份电路板粉， 8份异氰酸酯， 3份石蜡， 4份水， 15份木质纤维粉， 5份 氯化铵， 碳丝纤维 7份， 氯化胺 2份， 亚磷酸脂 2份。 根据上述实施例的组分所制造的板材， 经测试各项性能指标， 其实验数据 如下： （按国家高密度人造板标准即 LY/T1611-2003标准进行检测 )
其中部分性能参数检测结果如下表：
Figure imgf000014_0001
另外， 各个实施例中的配备原料通过本发明的制造工艺制备得到的板材具 有下列良好的性能参数。 其中检测到的曱醛释放量为零 （标准要求 E0 0.5mg/100g); 其次， 板材的密度大于 1.39kg/m3 (标准要求 >0.8kg/m3); 另外, 板内密度偏差范围为： +0.63%、 -1.26% (标准要求 ±4.0% )。
在上述各个实施例中， 添加石蜡、 硅油、 白油、 中棕榈蜡中的一种或多种 的组合原料取代原定的石蜡或硅油作为防水剂， 反复实验测试板材产品， 其各 项性能参数相差量小于 3.5% , 是可以接受的互相替代成分。
以碳酸钾、 碳配二氢铵中的一种或多种的组合原料取代原定的氯化铵作为 防火剂， 反复实验测试板材产品， 其各项性能参数相差量小于 5%, 是可以接受 的互相替代成分。
所述碳丝纤维为短切玻璃纤维。
以草酸、 酚醛胺、 聚醚胺、 芳脂胺中的一种或多种的组合原料取代原定的 氯化胺作为固化剂， 反复实验测试板材产品， 其各项性能参数相差量小于 3%, 是可以接受的互相替代成分。
以芳脂胺类抗氧剂、 酚类抗氧剂、 硫酯、 中的一种或多种的组合原料取代 原定的亚磷酸脂作为抗氧剂， 反复实验测试板材产品， 其各项性能参数相差量 小于 3.6%, 是可以接受的互相替代成分。
以上所揭露的仅为本发明的优选实施例而已， 当然不能以此来限定本发明 之权利范围， 因此依本发明申请专利范围所作的等同变化， 仍属本发明所涵盖 的范围。

Claims

权 利 要 求
1、 一种利用电路板粉合成的无醛零碳环保板材的制造工艺， 其特征在于， 所述制造工艺包括如下步骤：
a、 把异氰酸酯与脱模剂按比例混合并搅拌均匀；
b、 按比例加入水并搅拌均勾， 形成制板配料；
c、 对电路板粉进行干燥处理， 控制电路板粉的水分不超过 3%, 控制干燥 炉内的温度在 125 °C的恒温中进行搅拌干燥；
d、把干燥后的电路板粉与制板配料按比例混合搅拌均匀， 形成混合原料并 保证水分的重量百分比不超过 10 %；
e、 将混合原料均匀等速喂料进入铺装系统， 用扫平辊把原料摊平， 混合原 料进入预压机后压制为统一厚度的板坯， 由输送带送去纵横修边， 然后再输送 到多层重压机或连续钢压平压机对板材进行成型加压； 加压 1 分钟， 使板材表 面的压力达到 8Mps以上， 静置 2分钟后再进行补压， 补压压力达到 llMps以 上， 补压时间持续 3分钟后排气泄压， 泄压过程平緩均勾递减， 泄压过程至少 1 分钟； 所述多层热压机的层压板用循环导热油加热， 所述层压板的导热油温度 控制在 150°C~200 °C之内；
f、 压制完毕后， 把板材拉出， 然后进行翻板以及风冷却处理；
g、 砂光定厚， 质检， 堆板入库。
2、 根据权利要求 1所述的利用电路板粉合成的无醛零碳环保板材的制造工 艺， 其特征在于， 所述电路板粉是将废弃电路板或电路板边角料拆解磨成的粉 状物料， 或者是直接回收的电路板钻孔粉； 在 c 步骤进行干燥前， 对电路板粉 用振动器筛选并磁吸金属杂渣， 使其原料不结团。
3、根据权利要求 1所述的利用电路板粉合成的无醛零碳环保板材制造工艺， 其特征在于， 在 d步骤前增加 cl步骤， 对高纤维辅料进行粗破碎， 然后再进行 粉碎研磨使高纤维辅料转化成 80 目以上的木质纤维粉， 在 100 °C以上的温度环 境进行水分干燥处理，控制其水分含量在 2% ~4%；然后把木质纤维粉在 180°C 下进行搅拌混和形成碳质纤维粉； 把电路板粉与碳质纤维粉按比例混合搅拌均 匀； 所述高纤维辅料是农作物秸秆、 木质锯粉或竹质锯粉。
4、 根据权利要求 3 所述的利用电路板粉合成的无醛零碳环保板材制造工 艺， 其特征在于， 在 d步骤前增加 c2步骤， 按比例添加加工助剂并再次均匀混 和； 所述加工助剂包括固化剂、 抗氧剂、 碳丝纤维。
5、根据权利要求 1所述的利用电路板粉合成的无醛零碳环保板材制造工艺， 其特征在于， 所述环保板材的压制原料包括重量比如下的组分： 80 ~ 97份电路 板粉， 3 ~ 12份异氰酸酯， 1 ~5份脱模剂， 1 ~8份水。
6、 一种利用电路板粉合成并根据权利要求 1所述的制造工艺制备得到的无 醛零碳环保板材， 其特征在于， 所述环保板材的压制原料包括重量比如下的组 分： 50 ~ 97份电路板粉， 3 ~ 20份异氰酸酯， 1 ~5份脱模剂， 1 ~ 8份水。
7、 根据权利要求 6所述的无醛零碳环保板材， 其特征在于， 所述环保板材 的压制原料包括重量比如下的组分： 80 ~ 97份电路板粉， 3~12份异氰酸酯， 1 ~ 5份脱模剂， 3~6份水。
8、 根据权利要求 6所述的无醛零碳环保板材， 其特征在于， 所述环保板材 的压制原料包括重量比如下的组分： 80 ~ 97份电路板粉， 3~20份异氰酸酯， 1 ~ 5份脱模剂， 2~8份水， 10 ~ 20份木质纤维粉， 5 ~ 12份碳丝纤维。
9、 根据权利要求 6所述的无醛零碳环保板材， 其特征在于， 所述环保板材 的压制原料包括重量比如下的组分： 80 ~ 97份电路板粉， 3~20份异氰酸酯， 1 ~ 5份脱模剂， 3~6份水， 30 ~ 40份木质纤维粉， 3~5份防水剂， 3 ~ 5份防火 剂， 碳丝纤维 7 ~ 10份， 固化剂 1.5 ~ 2份， 抗氧剂 1.5 ~ 2份 c
10、 根据权利要求 7至 9中任意一项所述的无醛零碳环保板材， 其特征在 于， 所述脱模剂为石蜡， 所述电路板粉是废弃线路板回收粉。
PCT/CN2011/075835 2011-06-16 2011-06-16 利用电路板粉合成的无醛零碳环保板材及其制造工艺 WO2012171208A1 (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/CN2011/075835 WO2012171208A1 (zh) 2011-06-16 2011-06-16 利用电路板粉合成的无醛零碳环保板材及其制造工艺
RU2014100254/13A RU2014100254A (ru) 2011-06-16 2011-06-16 Безформальдегидная с нулевым выбросом углерода экологически безвредная плита, сделанная из порошка из монтажной платы, и способ ее производства
EP11867703.8A EP2722142A4 (en) 2011-06-16 2011-06-16 ECOLOGICAL PANEL CONSISTING OF PRINTED CIRCUIT BOARD WASTE POWDER FREE OF ALDEHYDE AND CARBON EMISSIONS AND METHOD FOR PRODUCING THE SAME
US14/125,584 US20140113154A1 (en) 2011-06-16 2011-06-16 Formaldehyde-free zero-carbon-emission environment-friendly plate made from circuit board powder and manufacturing process thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/075835 WO2012171208A1 (zh) 2011-06-16 2011-06-16 利用电路板粉合成的无醛零碳环保板材及其制造工艺

Publications (1)

Publication Number Publication Date
WO2012171208A1 true WO2012171208A1 (zh) 2012-12-20

Family

ID=47356514

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2011/075835 WO2012171208A1 (zh) 2011-06-16 2011-06-16 利用电路板粉合成的无醛零碳环保板材及其制造工艺

Country Status (4)

Country Link
US (1) US20140113154A1 (zh)
EP (1) EP2722142A4 (zh)
RU (1) RU2014100254A (zh)
WO (1) WO2012171208A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115894075A (zh) * 2022-11-25 2023-04-04 山东京韵泰博新材料科技有限公司 一种碳化制品及其制备方法和应用

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2544707C2 (ru) * 2010-12-30 2015-03-20 Фошань Веп Инвайренментал Протекшн Текнолоджи Ко., Лтд Плита, синтезированная из порошка из негодных печатных плат, и способ ее изготовления
CN104786341A (zh) * 2015-03-29 2015-07-22 桐城市诚信木塑科技材料有限公司 一种大豆蛋白胶竹地板的生产工艺
EP3526000A4 (en) * 2016-10-17 2020-08-26 Washington State University RECYCLED COMPOSITE MATERIALS AND RELATED PROCEDURES
CN106553258B (zh) * 2016-11-24 2018-09-11 益阳万维竹业有限公司 一种无甲醛防水复合板的制备工艺
CN107217546B (zh) * 2017-07-15 2018-07-27 芜湖乾凯材料科技有限公司 基于改性液体石蜡的环保纤维板及其加工方法
CN108276735A (zh) * 2017-12-28 2018-07-13 环境保护部华南环境科学研究所 一种利用废树脂粉制备的印制板钻孔用垫板及其制备方法
CN110373954B (zh) * 2019-07-22 2020-10-27 陕西科技大学 一种利用多聚糖纤维薄层压制特种导电纸防水纸及其制备方法
CN110591401A (zh) * 2019-08-14 2019-12-20 浙江海洋大学 一种柔性屏基底材料的制备方法
CN110481068A (zh) * 2019-08-20 2019-11-22 昆山新世绿环保科技有限公司 一种环保三防石墨烯纤丝板生产线

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101037527A (zh) * 2007-03-29 2007-09-19 上海交通大学 利用废弃印刷电路板中非金属材料制备酚醛模塑料的方法
CN101696315A (zh) * 2009-10-21 2010-04-21 清华大学 一种非金属粉填充酚醛树脂复合材料及其制备方法
CN101838454A (zh) * 2010-05-21 2010-09-22 上海澳金玻璃钢制品有限公司 利用回收聚氨酯泡沫废料制备的压制加强板及其工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5344484A (en) * 1992-10-08 1994-09-06 Masonite Corporation Isocyanate bonded wood composite and method of manufacturing the same
CN101591459B (zh) * 2009-07-02 2011-04-06 上海交通大学 利用废弃印刷电路板制备木塑复合材料的方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101037527A (zh) * 2007-03-29 2007-09-19 上海交通大学 利用废弃印刷电路板中非金属材料制备酚醛模塑料的方法
CN101696315A (zh) * 2009-10-21 2010-04-21 清华大学 一种非金属粉填充酚醛树脂复合材料及其制备方法
CN101838454A (zh) * 2010-05-21 2010-09-22 上海澳金玻璃钢制品有限公司 利用回收聚氨酯泡沫废料制备的压制加强板及其工艺

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
See also references of EP2722142A4 *
WANG ET AL.: "The research situation and development trends of isocyanate adhesive for artifical panels", CHINA ADHESIVES, vol. 13, no. 1, January 2004 (2004-01-01), pages 59 - 62, XP008173147 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115894075A (zh) * 2022-11-25 2023-04-04 山东京韵泰博新材料科技有限公司 一种碳化制品及其制备方法和应用
CN115894075B (zh) * 2022-11-25 2023-07-28 山东京韵泰博新材料科技有限公司 一种碳化制品及其制备方法和应用

Also Published As

Publication number Publication date
US20140113154A1 (en) 2014-04-24
EP2722142A1 (en) 2014-04-23
RU2014100254A (ru) 2015-07-27
EP2722142A4 (en) 2015-03-11

Similar Documents

Publication Publication Date Title
WO2012171208A1 (zh) 利用电路板粉合成的无醛零碳环保板材及其制造工艺
WO2012088694A1 (zh) 由废电路板粉合成的板材及其制造工艺
CN102152373B (zh) 利用废电路板粉合成的零碳木质纤维环保板材的制造工艺
He et al. Mechanical, durability and environmental aspects of magnesium oxychloride cement boards incorporating waste wood
CN104760113B (zh) 一种高强度环保板材的制作方法
CN104692741A (zh) 一种秸秆纤维素纤维/水泥基复合材料及其制备方法
CN102304280B (zh) 利用电路板粉合成的无醛零碳环保板材及其制造工艺
CN102531492A (zh) 一种水泥基木质纤维人造板及其制备方法
CN104845304B (zh) 一种利用覆铜板残渣资源化再利用的方法
KR20100112299A (ko) 제지 슬러지의 재활용 방법
CN107189473A (zh) 一种环保材料防水阻燃板材及其制备方法
CN107200541A (zh) 一种废弃秸秆复合板材及其制备方法
TWI710539B (zh) 以無機泥碴類產製隔熱磚
KR100814740B1 (ko) 차음 효과를 갖는 단열재의 제조방법
CN105754213A (zh) 一种秸秆木塑室外地板及其生产方法
CN110386829B (zh) 一种镁质凝胶材料、制备方法及用于制备玻镁平板的应用
CN102689347B (zh) 利用废电路板与植物纤维合成的环保木香板及其制造工艺
CN100392015C (zh) 一种复合纤维板及其制作方法
CN102686667B (zh) 利用废电子线路板粉制造的防水防火零碳生态板材及其制造工艺
KR102210044B1 (ko) 바닥재를 이용한 건축내장재의 제조방법 및 이로 제조된 건축내장재
JP2007119287A (ja) 木質系石膏板及びその製造方法
Gatani et al. New process for peanut husks panels: Incorporation of castor oil polyurethane adhesive and different particle sizes
Yel et al. Mechanical and Physical Properties of Cement-bonded Perticleboard Made from Tea Residues and Hardboards
RU2775386C1 (ru) Сырьевая смесь для изготовления древесно-полимерных теплоизоляционных материалов
CN109571697A (zh) 一种人造板的制备方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11867703

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 14125584

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2011867703

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2014100254

Country of ref document: RU

Kind code of ref document: A