WO2012169033A1 - 有機エレクトロルミネッセンスパネル及びその製造方法 - Google Patents
有機エレクトロルミネッセンスパネル及びその製造方法 Download PDFInfo
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- WO2012169033A1 WO2012169033A1 PCT/JP2011/063217 JP2011063217W WO2012169033A1 WO 2012169033 A1 WO2012169033 A1 WO 2012169033A1 JP 2011063217 W JP2011063217 W JP 2011063217W WO 2012169033 A1 WO2012169033 A1 WO 2012169033A1
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000005401 electroluminescence Methods 0.000 title claims abstract description 14
- 239000010410 layer Substances 0.000 claims abstract description 100
- 239000007788 liquid Substances 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 35
- 239000012044 organic layer Substances 0.000 claims abstract description 35
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- 239000011248 coating agent Substances 0.000 abstract description 55
- 238000002347 injection Methods 0.000 description 24
- 239000007924 injection Substances 0.000 description 24
- 230000005525 hole transport Effects 0.000 description 19
- 229910052782 aluminium Inorganic materials 0.000 description 16
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- 230000000903 blocking effect Effects 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
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- 239000011521 glass Substances 0.000 description 4
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- VFUDMQLBKNMONU-UHFFFAOYSA-N 9-[4-(4-carbazol-9-ylphenyl)phenyl]carbazole Chemical compound C12=CC=CC=C2C2=CC=CC=C2N1C1=CC=C(C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=C1 VFUDMQLBKNMONU-UHFFFAOYSA-N 0.000 description 2
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- LDQKTTFIGYWRIM-UHFFFAOYSA-N 1-(4-hexylphenyl)isoquinoline iridium(3+) Chemical compound [Ir+3].CCCCCCc1ccc(cc1)-c1nccc2ccccc12.CCCCCCc1ccc(cc1)-c1nccc2ccccc12.CCCCCCc1ccc(cc1)-c1nccc2ccccc12 LDQKTTFIGYWRIM-UHFFFAOYSA-N 0.000 description 1
- NDVYWNHMMNCMMN-UHFFFAOYSA-N C(=O)(O)C1=NC=CC=C1[Ir] Chemical compound C(=O)(O)C1=NC=CC=C1[Ir] NDVYWNHMMNCMMN-UHFFFAOYSA-N 0.000 description 1
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- UFVXQDWNSAGPHN-UHFFFAOYSA-K bis[(2-methylquinolin-8-yl)oxy]-(4-phenylphenoxy)alumane Chemical compound [Al+3].C1=CC=C([O-])C2=NC(C)=CC=C21.C1=CC=C([O-])C2=NC(C)=CC=C21.C1=CC([O-])=CC=C1C1=CC=CC=C1 UFVXQDWNSAGPHN-UHFFFAOYSA-K 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/813—Anodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80515—Anodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/10—Transparent electrodes, e.g. using graphene
- H10K2102/101—Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO]
- H10K2102/103—Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO] comprising indium oxides, e.g. ITO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/321—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3]
- H10K85/324—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3] comprising aluminium, e.g. Alq3
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/341—Transition metal complexes, e.g. Ru(II)polypyridine complexes
- H10K85/342—Transition metal complexes, e.g. Ru(II)polypyridine complexes comprising iridium
Definitions
- the present invention relates to an organic electroluminescence panel (hereinafter referred to as an organic EL panel) in which a plurality of organic electroluminescence elements (hereinafter referred to as organic EL elements) are distributed in, for example, a matrix shape or a stripe shape, and a method for manufacturing the same.
- organic EL panel organic electroluminescence panel
- organic EL elements organic electroluminescence elements
- Each of the organic EL elements includes a plurality of organic layers (organic material layers) made of an organic compound having a charge transport property between an anode and a cathode, and includes at least one light emitting layer in the organic layer. .
- a light emitting layer or an organic layer for each organic EL element is applied on a substrate using an ink jet method in which a liquid containing an organic material is ejected through a nozzle in a micro flow form.
- a process of forming a bank (an organic insulating film or the like) for separating each organic EL element is known.
- Patent Document 1 discloses a bank structure in which one or more of a charge transport material, a charge injection material, an optical filter material, and a light-emitting material are formed in each well around the periphery of at least one well. ing.
- This bank structure forms a periphery of at least one electrode and does not extend to the periphery of adjacent electrodes.
- Patent Document 2 discloses a bank structure that prevents liquid mixing by providing an intervening groove between banks of adjacent EL elements.
- a bank is arranged so as to surround the electrode on the light extraction side of the organic EL element, and liquid repellent treatment is performed on the bank, or liquid repellent properties are provided.
- a bank is formed so that the liquid applied beyond the light emitting area does not spread.
- fluorine is added to the bank surface.
- a vacuum plasma apparatus or an atmospheric pressure plasma apparatus to decompose fluorine-containing gas with plasma to add fluorine to the bank surface.
- a method of painting with a lyophilic bank is conceivable.
- the coating liquid is applied on the bank, so that the coating liquid is mixed in adjacent cells. Therefore, it is difficult to perform separate coating using a lyophilic bank under a wet coating method.
- FIG. 1 shows a manufacturing process of an organic EL panel by a conventional ink jet method.
- a substrate 1 such as glass is prepared, and an anode 2 such as ITO and an auxiliary electrode BU are formed thereon (FIG. 1A).
- an insulating bank BK is formed so as to surround the anode 2 by a photolithography process (FIG. 1B).
- the coating liquid Lq which is a material solution constituting the organic layer, is applied (FIG. 1C).
- the organic layer LY is formed into a film by subsequent drying (FIG. 1 (d)).
- the bank BK is necessary, for example, when the sub pitch Sp of the organic EL element is 500 ⁇ m and the width BKW of the bank BK is 100 ⁇ m, the opening width OW is 400 ⁇ m.
- the aperture ratio (OW / Sp) is 80%, for example.
- the present invention has been made in view of such circumstances, and it is an example of the problem to provide an organic EL panel having a large aperture ratio and a manufacturing method thereof while forming an organic layer by a coating process. It is done.
- the present inventor found that the movement of the coating liquid is restricted by the shape of the electrode, and by using the specific shape electrode for the organic EL element, the bank between the elements was removed.
- the present invention has been completed.
- the method for manufacturing an organic electroluminescence panel includes a first step of distributing a plurality of first electrodes juxtaposed on a substrate, and a plurality of organic layers including a light emitting layer on the top surface of each of the first electrodes. It includes a second step of forming a laminated body and a third step of forming an organic electroluminescence element by forming a second electrode on each of the laminated bodies.
- the first electrode uses a conductor having a corner portion forming a ridge line surrounding the top surface
- the second step uses at least a luminescent organic material-containing liquid through a nozzle. And supplying to the organic layer on the top surface in the form of a micro flow obtained by injection.
- An organic electroluminescence panel includes a plurality of organic layers including a plurality of first electrodes formed side by side on a substrate, and a light emitting layer formed on the top surface of each of the first electrodes. It is an organic electroluminescent element containing the laminated body which consists of, and the 2nd electrode formed on each of the said laminated body.
- the organic electroluminescence element is a conductor having a corner portion where the first electrode forms a ridge line surrounding the top surface, and the light emitting layer has at least a light emitting organic material-containing liquid ejected through a nozzle. It is characterized in that it is formed by being supplied to the organic layer on the top surface and dried according to the obtained micro flow form.
- FIG. 2 shows an intermediate generation structure of an organic EL panel obtained by the steps of a method for manufacturing an organic EL panel as a first example.
- a substrate 1 such as glass is prepared, and a conductive film such as aluminum and a conductive film such as ITO are sequentially formed by a sputtering process.
- a photolithography process is performed in a predetermined pattern such as a stripe shape or a rectangular island shape, and a plurality of stacked conductors of the first electrode 11 and the auxiliary first electrode (anode) 11a are juxtaposed on the substrate 1.
- corner portions TPE are formed on the periphery of the auxiliary first electrode 11a. That is, a corner portion TPE that forms a ridge line surrounding the top surface of the auxiliary first electrode 11a is formed.
- the corner portion TPE has an inner angle of 45 ° to 165 °, for example, 90 °.
- the hole injection layer 3 is formed by applying the entire surface of the auxiliary first electrode 11a and the substrate 1 with a coating solution for hole injection layer by a wet coating method such as spin coating or slit coating, and drying.
- a hole transport layer coating solution is applied on the entire surface and dried to form a hole transport layer 4 (FIG. 2B).
- the hole transport layer 4 is formed with a ridge line TPE2 surrounding the top surface of the hole transport layer 4 which is similar to the corner TPE around the auxiliary first electrode 11a.
- the hole injection layer 3 and the hole transport layer 4 which are organic layers of a non-light emitting organic material extending over the distribution range of the first electrode 11 are formed. May be omitted, or only one layer may be formed.
- the light emitting layer coating liquid Lq that is, the light emitting organic material is contained on the top surface of the hole transport layer 4 surrounded by the ridge line TPE2 by an ink jet method in which a liquid is ejected through a nozzle and supplied in a micro flow form. A liquid is applied (FIG. 2 (c)).
- the nozzle NZ is moved relative to the substrate 1 along the arrangement of the first electrodes 11.
- the nozzle NZ injects the light emitting layer coating liquid and supplies it to the top surface of the hole transport layer 4 in the form of a micro flow that is a micro droplet.
- the coating liquid Lq is maintained in a contact angle, for example, in a hemispherical bulging form by its surface tension.
- the light emitting layer 5 is formed by drying the light emitting layer coating solution (FIG. 2D).
- a hole blocking layer material is formed on the light emitting layer 5 by a vacuum evaporation method to form a hole blocking layer 6, and an electron transport layer material is formed thereon by a vacuum evaporation method. Then, an electron transport layer 7 is formed, and an electron injection layer material is formed thereon by a vacuum vapor deposition method to form an electron injection layer 8 (FIG. 2E).
- a cathode 9 which is a second electrode such as aluminum is formed on the electron injection layer 8 by vacuum deposition (FIG. 2F). Thereafter, an organic EL panel is obtained through a sealing process (not shown).
- a sealing step solid sealing may be performed after forming a barrier film or the like using plasma CDV or the like, or hollow sealing using a glass can or the like may be used.
- the manufacturing process of the organic EL element can be simplified, and the opening width OW can be largely secured for the sub-pitch Sp of each organic EL element. Sp) can be improved.
- FIG. 3 shows an organic EL panel obtained by forming a hole injection layer, a hole transport layer, and a light emitting layer by an ink jet method as a second embodiment.
- an aluminum film for the first electrode is formed on the substrate 1 by sputtering.
- an ITO film is formed on the aluminum film for the anode (auxiliary first electrode) by a sputtering method.
- the aluminum film and the ITO film are patterned by a photolithography method, and the first electrode 11 and the anode 11a having the same shape and having corners on the periphery are formed.
- the corner portion forms a ridge line surrounding the top surface.
- the hole injection layer 3, the hole transport layer 4, and the light emitting layer 5 are applied by the inkjet method in the same pattern as the first electrode and dried to form each layer in order.
- a ridge line surrounding the top surface caused by the corner TPE around the periphery of the anode (auxiliary first electrode) is formed, so that patterning by the ink jet method is possible.
- the hole blocking layer 6 is applied on the entire surface by an arbitrary application method.
- the electron transport layer 7 and the electron injection layer 8 are formed by vapor deposition.
- the cathode 9 which is the second electrode of aluminum is deposited by resistance heating. Thereafter, an organic EL panel of the second embodiment is obtained through a sealing process.
- all the layers of the pattern may be applied on the electrode, or only an arbitrary layer may be applied, and other than that on the electrode and on the electrode
- the structure which covers also may be sufficient.
- the cathode 9 as the second electrode of the first example was replaced by aluminum, and silver (Ag) was deposited by resistance heating to form an organic film having the same configuration as that of the first example.
- An EL panel was formed.
- Ag (translucent electrode) for the cathode (second electrode)
- an organic EL panel having a top emission structure can be manufactured. Since the top emission structure does not extract light from the substrate side, it is possible to select a thickness and shape that can easily produce a pinning effect on the first electrode. If the Ag film thickness of the second electrode is 75 nm or less, the transmittance of the second electrode is 80% or more.
- silver (Ag) is used instead of aluminum for the first electrode, a bottom emission type organic EL panel having a transmittance of 80% or more can be manufactured.
- FIG. 4 shows an example in which a light emitting layer is formed by the same ink jet method as in the first example except that the configuration of the first electrode 11 and the anode 11a is changed to Ag of the second electrode as the fourth example. . Since the light emitting layer forming step and subsequent steps are the same as those in the first embodiment, description thereof will be omitted.
- an aluminum film for the first electrode is formed on the substrate 1 by sputtering.
- the aluminum film is patterned by a photolithography method, and the first electrode 11 having corners on the periphery is formed.
- an ITO film for the anode is formed on the first electrode 11 by sputtering.
- the ITO film is patterned by photolithography, and the anode 11a is formed with a smaller area than the first electrode 11 so that the corners of the periphery of the first electrode 11 are exposed.
- the patterning of the first electrode is performed in a pattern that is slightly larger than the anode.
- the first electrode 11 and the anode 11a of the conductor are not limited to be formed in two layers, and a plurality of the corners TPE on the periphery are exposed. It may be formed as a multilayer stack so that the area of the top surface of one of the conductive films is larger than that of the other conductive films.
- the hole injection layer 3 is formed by coating the entire surface of the first electrode 11, the auxiliary first electrode 11 a and the substrate 1 with a coating liquid for hole injection layer and drying it.
- a hole transport layer coating solution is applied on the entire surface and dried to form a hole transport layer 4 (FIG. 4B).
- a ridge line TPE ⁇ b> 2 due to the corner TPE around the periphery of the first electrode 11 is formed.
- the light emitting layer coating solution is applied to the top surface of the hole transport layer 4 surrounded by the ridge line TPE2 by the inkjet method in the same pattern as the first electrode 11 (FIG. 4).
- C aluminum having good processability is used as the first electrode 11 having a pattern with a large area of the underlayer, and ITO having poor processability is used as the auxiliary first electrode 11a having a pattern having a small area on the upper layer. Even if the coating liquid Lq is not stopped at the upper layer edge, the coating liquid Lq can be stopped at the corner TPE edge of the aluminum base layer.
- the subsequent steps are the same as in the first embodiment.
- each coating liquid Lq constitutes an organic layer such as a hole injection layer, a hole transport layer, a light emitting layer, a hole block layer, an electron transport layer, and an electron injection layer.
- organic material-containing liquids including organic materials to be prepared and prepared in advance as inks.
- a conductive material having a work function larger than that of the cathode 9 is selected for the anode 11a.
- the materials and film thicknesses are selected so as to be transparent or translucent.
- the order of stacking the organic layers is from the cathode opposite to the order of the above examples, from the electron injection layer, the electron transport layer, the hole blocking layer, the light emitting layer, the hole transport layer, the hole injection layer, and the anode. Good.
- a sample substrate is prepared in which a first electrode 11 of an ITO conductive film having a corner TPE is formed on a glass substrate 1. Therefore, the coating liquid Lq is applied to the top surface (flat surface) of the first electrode 11 on the substrate 1 by, for example, a wet film forming ink jet method.
- the coating liquid Lq is a coating liquid for various organic layers containing an organic material constituting the organic layer such as a hole injection layer, a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer.
- an organic material constituting the organic layer such as a hole injection layer, a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer.
- FIG. 5A is a schematic partial cross-sectional view of a sample substrate in an equilibrium state in which a droplet of the coating liquid has landed and attached to the first electrode 11.
- FIG. 5B is a schematic partial cross-sectional view of the sample substrate in a state in which a film of the coating liquid in which a plurality of droplets of the coating liquid has landed and aggregated adheres to the entire surface of the first electrode 11.
- the droplet of the coating liquid Lq maintains a bulging shape or the like due to its surface tension.
- ⁇ S the solid (first electrode) surface tension
- ⁇ SL the solid-liquid interfacial tension (first electrode coating liquid interfacial tension)
- ⁇ L the liquid (coating liquid) surface tension
- ⁇ the contact angle.
- the first electrode When the contact angle is 0 ⁇ ⁇ ⁇ 90 °, the first electrode is in a lyophilic state with respect to the coating solution. When the contact angle is 90 ° ⁇ ⁇ 180 °, the first electrode has a liquid repellency with respect to the coating solution. Considering the adhesion of the coating liquid to the first electrode and the movement of the coating liquid droplets, the characteristics of the coating liquid are set so that the contact angle is 0 ⁇ ⁇ ⁇ 90 °, and the coating liquid is prepared.
- the coating liquid Lq is applied to the first electrode 11 in such a total amount that the film of the coating liquid Lq does not pass through the corner portion TPE of the first electrode 11.
- This embodiment uses this pinning phenomenon. In other words, since it is the contact angle ⁇ of the coating liquid Lq on the top surface of the first electrode 11, if the taper angle ⁇ of the corner portion TPE is used, the coating liquid Lq is first applied until the contact angle at the corner portion TPE becomes ⁇ + ⁇ .
- the contact angle of the coating liquid Lq can take any value from ⁇ to ⁇ + ⁇ at the corner portion TPE.
- the inventor conducted an experiment to investigate a suitable range of the taper angle ⁇ of the corner portion TPE where the pinning effect can be obtained.
- a plurality of sample substrates 1 provided with a first electrode 11 having a constant area are manufactured by changing the taper angle ⁇ to 2 °, 15 ° and 20 °, and a corner portion TPE (0 ⁇ m).
- the liquid droplets of the coating liquid were applied to the landing positions in the range of up to 100 ⁇ m by the inkjet method. Then, the occurrence probability that the coating liquid stays without proceeding beyond the corner TPE when the droplet landing distance is changed (pinning effect) is measured, and the pinning occurrence probability and the landing distance from the edge are measured. I investigated the relationship.
- FIG. 6 is a graph showing the experimental results of the pinning occurrence probability. As is apparent from FIG. 6, it can be seen that there is a significant difference in the pinning effect depending on the taper angle that the effect of pinning is difficult to obtain when the taper angle is small, and that the effect is easily obtained when the taper angle is large. From FIG. 6, it was verified that in the case of a sample substrate having taper angles of 15 ° and 20 °, if the landing distance from the edge of the droplet exceeds 60 ⁇ m, the pinning occurrence probability is dramatically improved. Therefore, in this embodiment, the taper angle ⁇ of the corner is set to 15 ° or more as an effective range of the pinning effect.
- the film thickness of the first electrode is in the range of 1000 nm or less. It was appropriate. When the film thickness of the first electrode is reduced, if the film thickness is less than 50 nm, the area of the tapered surface from the corner is small and it is difficult to obtain a clear corner shape, and the first resistance is ensured in order to secure low resistance wiring.
- the film thickness of the electrode was suitably in the range of 50 nm or more.
- the present inventor fabricated a plurality of substrates having first electrodes whose peripheral side walls have a so-called reverse taper shape, and investigated the upper limit of the taper angle ⁇ of the corner.
- the first electrode When the first electrode is made into a reverse taper shape using anisotropic etching or a multilayer electrode structure, the number of sample substrates in which the taper edge portion is broken when the substrate is physically contacted in the cleaning process or the like. For example, in the case where the taper angle exceeds 135 ° as in the SEM photograph of the cross section of the sample substrate having the first electrode of the two-layer electrode structure (lower Al, upper ITO) shown in FIG. Since the manufacturing yield is lowered, it is preferable to employ a first electrode having a corner taper angle ⁇ of 135 ° or less.
- the inventor decided to provide the first electrode on the substrate of the organic EL panel with a taper angle of 15 ° to 135 °, that is, to provide a corner portion having an internal angle of 45 ° to 165 °.
- the present inventor forms a first electrode 11 having a corner portion TPE on the substrate 1 as shown in FIG. 8, and the base organic layer 12 is first applied in advance by a wet coating method such as a slit coating method.
- a sample substrate formed on the entire surface of the electrode 11 and the substrate 1 was produced.
- the material of the base organic layer is a charge transporting organic compound constituting the organic layer such as a hole injection layer, a hole transport layer, a hole block layer, an electron transport layer, and an electron injection layer.
- the method for manufacturing the organic EL panel includes a step of forming each of the laminates and at least one organic layer (underlying organic layer 12) of the charge transporting organic compound extending between them. Can be.
- the inventor produced a sample substrate in which a first electrode 11 having a corner TPE was formed on a substrate 1 and an auxiliary first electrode 11a was formed thereon as shown in FIG.
- a first electrode 11 having a corner TPE was formed on a substrate 1 and an auxiliary first electrode 11a was formed thereon as shown in FIG.
- the pinning effect of the coating liquid Lq was also maintained on the corner portion TPE of the first electrode 11 of the underlayer shown in FIG.
- the first electrode can have a multilayer structure in which two or more layers are laminated, for example, aluminum having good workability is used as the first electrode 11 of the underlayer, and ITO having poor workability is used as an auxiliary layer for the upper layer.
- the coating liquid Lq can be stopped at the corner TPE edge of the aluminum underlayer.
- the first step includes a step of stacking a plurality of conductive films as the first electrode, and the conductive having the corner portion of the plurality of conductive films.
- the area of the top surface of the film is preferably larger than that of the other conductive film.
- the present inventor measured the surface roughness Ra (arithmetic average roughness) of the first electrode on the plurality of substrates with a surface roughness measuring machine (JISB0601). Therefore, it was observed that the pinning effect does not work when the surface roughness of the first electrode of ITO exceeds Ra 50 nm. Further, in the case of other metal first electrodes, Ra is 30 nm or less, preferably when Ra is 10 nm or less, the pinning effect is generally exhibited. Therefore, it is possible to employ the first electrode having a corner surface roughness Ra of 30 nm or less. preferable.
- An organic EL panel having a light emission pattern of 100 mm ⁇ 100 mm was produced.
- Each of the organic EL elements had a line length of 100 mm and a line width of 450 ⁇ m, and each element of the elements was arranged in parallel with 200 lines and a sub-pitch of 500 ⁇ m (the lines and spaces were 450 ⁇ m and 50 ⁇ m).
- the RGB light emitting layer was coated with a sub-pitch of 500 ⁇ m, and the organic EL elements arrayed alternately in the order of RGB were formed with the other organic layers and electrodes in common.
- the sub-pitch Sp of each organic EL element was 500 ⁇ m
- the opening width OW was 450 ⁇ m
- the aperture ratio (OW / Sp) was 90%, which was brighter than the conventional one.
- Table 1 shows the manufacturing structure of the organic EL panel.
- PEDOT PSS: Poly (3,4-ethylenedioxythiophene) poly (styrenesulfonate)
- BAlq Bis (2-methyl-8-quinolinolato) (p-phenylphenolato) aluminum
- HexIr (phq) 3 Tris [2- (4-n-hexylphenyl) quinoline)] iridium (III)
- CBP 4,4'-Bis (9H-carbazol-9-yl) biphenyl
- Ir (ppy) 3 Tris (2-phenylpyridine) iridium (III)
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Abstract
Description
PEDOT:PSS : Poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate)
BAlq : Bis(2-methyl-8-quinolinolato)(p-phenylphenolato) aluminum ,
HexIr(phq)3 : Tris[2-(4-n-hexylphenyl)quinoline)] iridium(III)
CBP : 4,4’-Bis(9H-carbazol-9-yl)biphenyl
Ir(ppy)3 : Tris (2-phenylpyridine) iridium(III)
FIr(p ic) : Bis(2,4-difluorophenylpyridinato) (2-carboxypyridyl)iridium (III)
3 正孔注入層
4 正孔輸送層
5 発光層
6 正孔ブロック層
7 電子輸送層
8 電子注入層
9 陰極(第二電極)
11 第一電極
11a 補助第一電極(陽極)
Claims (7)
- 有機エレクトロルミネッセンスパネルの製造方法であって、
基板上に複数の第1電極を並置して分布せしめる第1ステップと、
前記第1電極の各々の頂面上に発光層を含む複数の有機層が積層された積層体を形成する第2ステップと、
前記積層体の各々の上に第2電極を形成して有機エレクトロルミネッセンス素子を形成する第3ステップとを含み、
前記第1ステップにおいて、前記第1電極を、前記頂面を囲む稜線を形成する角部を有する導電体とし、
前記第2ステップは、少なくとも発光性有機材料含有液体をノズルを介して射出して得られる微小フロー形態によって前記頂面の有機層へ供給するステップを含むことを特徴とする有機エレクトロルミネッセンスパネルの製造方法。 - 前記角部の内角は、45°乃至165°の角度であることを特徴とする請求項1に記載の有機エレクトロルミネッセンスパネルの製造方法。
- 前記第2ステップは、前記第1電極の分布範囲に亘って拡がる少なくとも1層の非発光性有機材料の有機層を形成するステップを含むことを特徴とする請求項1又は2に記載の有機エレクトロルミネッセンスパネルの製造方法。
- 前記第1ステップは、複数の導電膜を積層して前記第1電極を形成するステップを含み、前記複数の導電膜のうちの1つの導電膜の頂面の面積が他の導電膜よりも大きいことを特徴とする請求項1乃至3のいずれか1に記載の有機エレクトロルミネッセンスパネルの製造方法。
- 前記角部の表面粗さRaが30nm以下であることを特徴とする請求項1乃至4のいずれか1に記載の有機エレクトロルミネッセンスパネルの製造方法。
- 前記第2ステップにおける、前記ノズルを前記第1電極の配列に沿って前記基板に対して相対的に移動させるステップを含むことを特徴とする請求項1乃至5のいずれか1に記載の有機エレクトロルミネッセンスパネルの製造方法。
- 基板上に並置され分布形成された複数の第1電極と、
前記第1電極の各々の頂面上に積層されて形成された発光層を含む複数の有機層からなる積層体と、
前記積層体の各々の上に形成された第2電極と、を含む有機エレクトロルミネッセンス素子であって、
前記第1電極が、前記頂面を囲む稜線を形成する角部を有する導電体であり、
前記発光層は、少なくとも発光性有機材料含有液体がノズルを介して射出して得られる微小フロー形態によって前記頂面の有機層へ供給され乾燥されて、形成されていることを特徴とする有機エレクトロルミネッセンスパネル。
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US14/124,663 US9029848B2 (en) | 2011-06-09 | 2011-06-09 | Organic electroluminescent panel and method for producing the same |
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WO2022189908A1 (ja) * | 2021-03-11 | 2022-09-15 | 株式会社半導体エネルギー研究所 | 表示装置 |
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