WO2012144360A1 - Transformateur haute fréquence, composants haute fréquence et appareil de terminal de communication - Google Patents

Transformateur haute fréquence, composants haute fréquence et appareil de terminal de communication Download PDF

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Publication number
WO2012144360A1
WO2012144360A1 PCT/JP2012/059622 JP2012059622W WO2012144360A1 WO 2012144360 A1 WO2012144360 A1 WO 2012144360A1 JP 2012059622 W JP2012059622 W JP 2012059622W WO 2012144360 A1 WO2012144360 A1 WO 2012144360A1
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side coil
coil element
primary side
secondary side
coil
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PCT/JP2012/059622
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English (en)
Japanese (ja)
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加藤登
家木勉
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株式会社村田製作所
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Publication of WO2012144360A1 publication Critical patent/WO2012144360A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F19/00—Fixed transformers or mutual inductances of the signal type
    • H01F19/04—Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/42—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns

Definitions

  • the present invention relates to a high-frequency transformer in which coil elements are coupled with a high degree of coupling, a high-frequency component including the same, and a communication terminal device.
  • a high-frequency transformer is used in a circuit for wireless communication to perform impedance conversion, impedance matching, balanced-unbalanced conversion, and the like.
  • a small communication terminal device such as a portable terminal device requires a high-frequency transformer that is small, thin, and low loss.
  • Patent Document 1 As a small-sized high-frequency transformer, for example, as disclosed in Patent Document 1 and Patent Document 2, one constituted by a multilayer substrate is used.
  • Patent Document 3 discloses an example of a balun (balun trance).
  • an object of the present invention is to provide a high-frequency transformer, a high-frequency component and a communication terminal device including the high-frequency transformer that can obtain stronger coupling even when the high-frequency transformer is reduced in size and thickness.
  • the high-frequency transformer of the present invention is A plurality of primary side coil elements connected to each other and a plurality of secondary side coil elements connected to each other;
  • the primary side coil element includes one or a plurality of coil winding axes parallel to each other;
  • the secondary side coil element includes one or a plurality of coil winding axes parallel to each other; All or part of the coil winding axis of the primary side coil element and the coil winding axis of the secondary side coil element are a common coil winding axis,
  • the primary side coil element and the secondary side coil element are arranged so as to have two or more boundaries between the primary side coil element and the secondary side coil element on the common coil winding axis, Magnetic flux generated by the primary coil element along the common coil winding axis due to mutual induction between the primary coil element and the secondary coil element and the secondary along the common coil winding axis
  • the winding direction and connection direction of the primary side coil element and the secondary side coil element are determined so that directions of magnetic fluxes generated by
  • the high frequency component of the present invention includes a high frequency transformer,
  • the high-frequency transformer is A plurality of primary side coil elements connected to each other and a plurality of secondary side coil elements connected to each other;
  • the primary coil element includes one or more coil winding axes, and the secondary coil element includes one or more coil winding axes; All or part of the coil winding axis of the primary side coil element and the coil winding axis of the secondary side coil element are coincident,
  • the primary side coil element and the secondary side coil element are arranged so as to have two or more boundaries between the primary side coil element and the secondary side coil element on the coil winding axis, Due to mutual induction between the primary side coil element and the secondary side coil element, the directions of the magnetic flux generated by the primary side coil element along the coil winding axis and the magnetic flux generated by the secondary side coil element are opposite to each other.
  • the winding direction and connection direction of the primary side coil element and the secondary side coil element are determined.
  • the communication terminal device of the present invention includes a high frequency transformer,
  • the high-frequency transformer is A plurality of primary side coil elements connected to each other and a plurality of secondary side coil elements connected to each other;
  • the primary coil element includes one or more coil winding axes, and the secondary coil element includes one or more coil winding axes; All or part of the coil winding axis of the primary side coil element and the coil winding axis of the secondary side coil element are coincident,
  • the primary side coil element and the secondary side coil element are arranged so as to have two or more boundaries between the primary side coil element and the secondary side coil element on the coil winding axis, Due to mutual induction between the primary side coil element and the secondary side coil element, the directions of the magnetic flux generated by the primary side coil element along the coil winding axis and the magnetic flux generated by the secondary side coil element are opposite to each other.
  • the winding direction and connection direction of the primary side coil element and the secondary side coil element are determined.
  • a coil having a low loss and a high inductance is provided even if it is reduced in size and thickness
  • a high-frequency transformer having a small size and a low loss and a high-frequency component and a communication terminal device including the same are obtained. Further, by arranging and connecting a plurality of coil elements so as to form a closed magnetic circuit with adjacent coil elements, the magnetic flux density of the coil can be further increased, a high-frequency transformer having a high degree of coupling, a high-frequency component including the same, and A communication terminal device is obtained.
  • FIG. 1A is a circuit diagram of the high-frequency transformer 101 of the first embodiment.
  • FIG. 1B is a diagram illustrating directions of currents i1 and i2 flowing from the terminal P1 to the terminal P2 and from the terminal P3 to the terminal P4, respectively.
  • FIG. 2 is a diagram illustrating a first example of a layer configuration in which the high-frequency transformer of FIG. 1 is configured by conductor wiring in a multilayer substrate.
  • FIG. 3 is a diagram illustrating a second example of a layer configuration in which the high-frequency transformer of FIG. 1 is configured by conductor wiring in a multilayer substrate.
  • FIG. 4 is a diagram illustrating a third example of a layer configuration in which the high-frequency transformer of FIG. 1 is configured by conductor wiring in a multilayer substrate.
  • FIGS. 5A, 5B, 5C, and 5D are circuit diagrams of the high-frequency transformers 102A, 102B, 102C, and 102D of the second embodiment.
  • FIG. 6 is a diagram showing a layer configuration in which the high-frequency transformer of FIG. 5A is configured by conductor wiring in the multilayer substrate.
  • FIGS. 7A and 7B are circuit diagrams of the high-frequency transformers 103A and 103B according to the third embodiment.
  • FIG. 8 is a diagram showing a layer configuration in which the high-frequency transformer of FIG. 7A is configured by conductor wiring in the multilayer substrate.
  • FIG. 9 is a diagram showing a layer configuration in which the high-frequency transformer of FIG. 7B is configured by conductor wiring in the multilayer substrate.
  • FIGS. 10A and 10B are circuit diagrams of the high-frequency transformers 104A and 104B according to the fourth embodiment.
  • FIGS. 11A, 11B, and 11C are circuit diagrams of the high-frequency transformers 105A, 105B, and 105C according to the fifth embodiment.
  • 12A, 12B, and 12C are circuit diagrams of the high-frequency transformers 106A, 106B, and 106C according to the sixth embodiment.
  • FIG. 13 is a diagram illustrating a layer configuration in which the high-frequency transformer of FIG. 12A is configured by conductor wiring in the multilayer substrate.
  • FIG. 14 is a diagram showing a layer configuration in which the high-frequency transformer of FIG. 12B is configured by conductor wiring in the multilayer substrate.
  • FIG. 13 is a diagram illustrating a layer configuration in which the high-frequency transformer of FIG. 12A is configured by conductor wiring in the multilayer substrate.
  • FIG. 14 is a diagram showing a layer configuration in which the high-frequency transformer of FIG
  • FIG. 15 is a circuit diagram of the high-frequency transformer 107 of the seventh embodiment.
  • FIGS. 16A, 16B, and 16C are circuit diagrams of the high-frequency transformers 108A, 108B, and 108C of the eighth embodiment.
  • FIGS. 17A and 17B are circuit diagrams of the high-frequency transformers 109A and 109B according to the ninth embodiment.
  • FIG. 18 is a configuration diagram of the high-frequency component and the communication terminal device of the tenth embodiment.
  • FIG. 19 is a configuration diagram of the high-frequency component and the communication terminal device of the eleventh embodiment.
  • FIG. 1A is a circuit diagram of the high-frequency transformer 101 of the first embodiment.
  • the high-frequency transformer 101 includes four coil elements L11, L12, L21, and L22. I have.
  • the high-frequency transformer 101 includes primary-side terminals P1 and P2 and secondary-side terminals P3 and P4. Two coil elements L11 and L12 are connected in parallel between the input terminals P1 and P2.
  • the two coil elements L11 and L12 are arranged at positions symmetrical with respect to the center of a common coil winding axis (hereinafter simply referred to as “winding axis”) AX.
  • the coil elements L11 and L12 are wound spirally with the winding directions being opposite to each other.
  • a first end on the center side in the direction of the winding axis AX of the two coil elements L11 and L12 is connected to the terminal P1.
  • the terminal P2 is connected to the second ends on both ends in the direction of the winding axis AX.
  • the winding axis of the two coil elements L21 and L22 is a winding axis AX that is common to the winding axis of the primary coil elements L11 and L12.
  • the secondary coil elements L21 and L22 are arranged at positions separated from both sides of the primary coil elements L11 and L12 and symmetrically with respect to the center of the winding axis AX.
  • the coil elements L21 and L22 are wound spirally with the winding directions being opposite to each other.
  • the primary side so that the boundary between the primary side coil element L11 and the secondary side coil element L21 and the boundary between the primary side coil element L12 and the secondary side coil element L22 are generated on the common coil winding axis AX.
  • Coil elements L11 and L12 and secondary coil elements L21 and L22 are arranged.
  • the “boundary” is an area sandwiched between coil elements adjacent to each other on the coil winding axis. And the coil element and coil element which adjoin at this boundary mutually interact.
  • a first end on the center side (primary coil elements L11, L12 side) is connected to the terminal P3 in the direction of the winding axis AX of the coil elements L21, L22.
  • the terminal P4 is connected to the second ends on both ends in the direction of the winding axis AX.
  • the directions of the magnetic flux generated by the primary side coil elements L11, L12 and the magnetic flux generated by the secondary side coil elements L21, L22 are mutually different.
  • the winding direction and connection direction of the primary side coil elements L11 and L12 and the secondary side coil elements L21 and L22 are determined so as to be reversed.
  • FIG. 1B is a diagram showing the directions of currents i1 and i2 flowing from the terminal P1 to the terminal P2 and from the terminal P3 to the terminal P4 by arrows.
  • the direction of this current represents the phase (polarity) of the high-frequency current.
  • the magnetic flux generated in the secondary coil elements L21 and L22 is upward at the moment when the magnetic flux generated in the primary coil elements L11 and L12 is downward in FIG. 1B, and the magnetic field is changed by the high-frequency current.
  • the direction of the magnetic flux generated in the primary side coil elements L11, L12 and the secondary side coil elements L21, L22 is reversed.
  • the magnetic flux acts to repel (retreat) each other, so that the magnetic flux density around each coil element increases. That is, an effect as if the magnetic flux was confined in the magnetic material can be brought about. In particular, when affected by opposite magnetic fluxes at both ends of the coil, the effect of confining the magnetic flux of each coil is enhanced, and the magnetic flux density can be increased.
  • each coil element since the current flowing through each coil element is symmetrical with respect to the center of the winding axis AX, parasitic capacitance and parasitic inductance are attached to the terminals P1 to P4 in a well-balanced manner, and the influence of these parasitic components. Is effectively canceled out, and the phase difference of the current flowing through the symmetrical portions can be reduced.
  • the above-described effects obtained by arranging the coil element at a symmetrical position with respect to the center of the common winding axis and flowing the current in a symmetrical relationship also apply to the embodiments described below.
  • FIG. 2 is a configuration diagram when the high-frequency transformer of FIG. 1 is configured as a chip component.
  • the chip component is configured by forming a conductor wiring in the laminated substrate.
  • FIG. 2 is an exploded perspective view of the laminated substrate.
  • This laminated substrate is a laminated body of a dielectric or magnetic base material layer including a predetermined conductor pattern.
  • the conductor pattern 21c is formed on the uppermost substrate layer 51a
  • the conductor pattern 21b is formed on the second substrate layer 51b
  • the conductor pattern 21a is formed on the third substrate layer 51c. Is formed.
  • the conductor pattern 11 is formed on the fourth base layer 51d, and the conductor patterns 112 and 13 are formed on the fifth base layer 51e.
  • the conductor pattern 12 is formed on the sixth base layer 51f, the conductor pattern 22a is formed on the seventh base layer 51g, and the conductor pattern 22b is formed on the eighth base layer 51h.
  • a conductor pattern 22c is formed on the base material layer 51i of the eye.
  • Terminal electrodes 61, 62, 63, 64 are formed on the back surface of the tenth substrate layer 51j.
  • a plain base material layer (not shown) is laminated on the upper part of the uppermost base material layer 51a.
  • the terminal electrodes 61, 62, 63 and 64 correspond to the terminals P1, P2, P3 and P4 shown in FIG.
  • the conductor patterns 11 and 112 correspond to the coil element L11, and the conductor patterns 112 and 12 correspond to the coil element L12. That is, the conductor pattern 112 also serves as part of the coil elements L11 and L12.
  • Conductor patterns 21a, 21b, and 21c correspond to coil element L21, and conductor patterns 22a, 22b, and 22c correspond to coil element L22.
  • a ground conductor 65 is formed on the base material layer 51j. Since the ground conductor 65 is disposed between the coil element having the plurality of conductor patterns and the circuit at the mounting destination, the plurality of conductor patterns are shielded from the circuit at the mounting destination by the ground conductor 65. . However, this ground conductor is not essential. If the shielding of the coil element is unnecessary in the state of the chip component, the ground conductor is unnecessary.
  • the line extending in the vertical direction in FIG. 2 is an interlayer connection conductor (via conductor), which connects the conductor pattern and the conductor pattern, and connects the conductor pattern and the terminal electrode.
  • Each conductive pattern can be formed using a conductive material such as silver or copper as a main component.
  • a glass ceramic material, an epoxy resin material or the like can be used if it is a dielectric, and a ferrite ceramic material or a resin material containing ferrite is used if it is a magnetic material. it can.
  • a dielectric material when forming a high-coupling transformer for the UHF band, and when forming a high-coupling transformer for the HF band, a magnetic material is preferably used. It is preferable to use it.
  • each conductor pattern is arranged so that their coil winding axes coincide (the coil winding axes are the same straight line, and the coil elements L11, L12 , L21 and L22 are arranged in a coaxial relationship. That is, each conductor pattern is formed on the base material layer so that the coil winding axis is perpendicular to the main surface of the laminate.
  • FIG. 3 is a diagram showing a second example of a layer configuration in which the high-frequency transformer of FIG. 1 is configured by conductor wiring in a multilayer substrate.
  • the line width of the conductor patterns 11, 12, 13, and 112 constituting the primary coil elements L11 and L12.
  • the line widths of the conductor patterns 11, 12, 13, 112 are made larger than the line widths of the conductor patterns 21a, 21b, 21c, 22a, 22b, 22c of the secondary coil elements L21, L22.
  • the primary coil elements L11 and L12 and the secondary coil elements L21 and L22 are not affected even if there is some deviation in the plane direction of the conductor pattern (displacement position of the conductor pattern and misalignment of the base material layer). It is possible to suppress a change in the degree of coupling. That is, the conductor patterns 11, 12, 112 and the conductor patterns 21a, 21b, 21c overlap with each other when viewed in the common coil winding axis direction, and the conductor patterns 11, 12, 112, and the conductor patterns 22a, 22b, 22c Overlap.
  • the primary side coil elements L11, L12 due to the conductor patterns 11, 12, 112 and the secondary side due to the conductor patterns 21a, 21b, 21c, 22a, 22b, 22c.
  • a change in the degree of coupling with the coil elements L21 and L22 can be kept small.
  • FIG. 4 is a diagram showing a third example of a layer configuration in which the high-frequency transformer of FIG. 1 is configured by conductor wiring in a multilayer substrate.
  • the difference from the example shown in FIG. 2 is the line width of the conductor patterns 11, 12, 21b, and 22b.
  • conductor patterns with a large line width and thin conductor patterns are alternately arranged in the stacking direction.
  • the conductor patterns 11, 12, 112 and the conductor patterns 21a, 21b, 21c overlap with each other when viewed in the common coil winding axis direction, and the conductor patterns 11, 12, 112, and the conductor patterns 22a, 22b, 22c overlaps.
  • FIGS. 5A, 5B, 5C, and 5D are circuit diagrams of the high-frequency transformers 102A, 102B, 102C, and 102D of the second embodiment.
  • These high-frequency transformers 102A, 102B, 102C, and 102D each include eight coil elements L111, L112, L121, L122, L211, L212, L221, and L222.
  • Each of the high-frequency transformers 102A, 102B, 102C, and 102D includes primary-side terminals P1 and P2, and secondary-side terminals P3 and P4.
  • a series circuit of the coil elements L111 and L112 and a series circuit of the coil elements L121 and L122 are connected in parallel between the input terminals P1 and P2.
  • a series circuit of coil elements L211 and L212 and a series circuit of coil elements L221 and L222 are connected in parallel.
  • the coil elements L111 and L121 are spirally wound in the winding directions opposite to each other along the winding axis AX1.
  • the coil elements L211 and L221 are wound spirally along the winding axis AX1 in opposite winding directions.
  • the coil elements L112 and L122 are spirally wound in the opposite winding directions along the winding axis AX2.
  • the coil elements L212 and L222 are wound in a spiral along the winding axis AX2 in mutually opposite winding directions.
  • FIG. 5 (a) the arrangement of coils on the winding axis AX1, the winding direction, and the connection to the terminals P1, P3 are the same as in FIG. 1 (a).
  • the winding direction of the coil on the winding axis AX2 is the same as the coil on the adjacent winding axis AX1. After being connected at the upper ends or the lower ends of adjacent coils, the remaining ends are connected to terminals P2 and P4, respectively.
  • the direction of the current and the direction of the magnetic flux on the winding axes AX1 and AX2 are the same as those in the first embodiment, and are set so that the directions of the primary and secondary magnetic fluxes are always reversed.
  • the direction of the coil element is determined so that the direction of the magnetic flux is reversed between adjacent coil elements connected in series. For this reason, in addition to the confinement effect at the boundary between the primary side and the secondary side described in the first embodiment, in FIG. 5A, an effect of turning around and strengthening the magnetic flux across adjacent coil elements is also added. . As a result, a coil with a higher confinement effect and less loss can be formed, and the amount of coupling between the primary side and the secondary side can be increased.
  • 5 (b) and 5 (c) show whether the center side of the coil element array along the winding axes AX1 and AX2 is connected to the terminal or the outside side is connected to the terminal.
  • the direction was changed in a different direction. Accordingly, the winding direction of each coil is also changed. In either case, since the direction of the magnetic field generated in each coil is the same, the effect is the same.
  • FIG. 5D shows that the coil winding direction between the terminals P3 and P4 is reversed with respect to FIG. 5A.
  • the direction of the magnetic field is the same as in FIG. 5A by making the direction of the current flowing through the terminals P3-P4 opposite, that is, by making the phase of the current 180 degrees different from the terminals P1-P2.
  • the same effects as in FIG. 5A can be obtained for reducing the coil loss and improving the coupling degree of the transformer.
  • Fig.5 (a)-FIG.5 (d) the example which arrange
  • FIG. 5D for the type in which the winding direction of the coil between the terminals P3 and P4 is reversed, the center of the coil element array along the winding axes AX1 and AX2 is used as the terminal.
  • FIG. 6 is a diagram showing a layer configuration in which the high-frequency transformer of FIG. 5A is configured by conductor wiring in the multilayer substrate.
  • This laminated substrate is a laminated body of a dielectric or magnetic base material layer including a predetermined conductor pattern.
  • conductor patterns 211c and 212c are formed on the uppermost substrate layer 51a, and conductor patterns 211b and 212b are formed on the second substrate layer 51b.
  • Conductor patterns 211a and 212a are formed on the substrate.
  • Conductor patterns 111 and 112 are formed on the fourth base layer 51d, and conductor patterns 1121 and 1122 are formed on the fifth base layer 51e.
  • Conductor patterns 121 and 122 are formed on the sixth substrate layer 51f, conductor patterns 221a and 222a are formed on the seventh substrate layer 51g, and conductor patterns 221b and 222b are formed on the eighth substrate layer 51h. Are formed, and conductor patterns 221c and 222c are formed on the ninth base layer 51i. Terminal electrodes 61, 62, 63, 64 are formed on the back surface of the tenth substrate layer 51j. A plain base material layer (not shown) is laminated on the upper part of the uppermost base material layer 51a.
  • a ground conductor 65 is formed on the base material layer 51j.
  • the ground conductor 65 shields the coil element having the plurality of conductor patterns from the circuit of the mounting destination. However, the ground conductor 65 is not essential. If the shielding of the coil element is unnecessary in the state of the chip component, the ground conductor is unnecessary.
  • the terminal electrodes 61, 62, 63 and 64 correspond to the terminals P1, P2, P3 and P4 shown in FIG.
  • the conductor patterns 1121 and 111 correspond to the coil element L111
  • the conductor patterns 1121 and 121 correspond to the coil element L121.
  • the conductor pattern 1121 also serves as part of the coil elements L111 and L121.
  • the conductor patterns 1122 and 112 correspond to the coil element L112, and the conductor patterns 1122 and 122 correspond to the coil element L122.
  • the conductor pattern 1121 also serves as part of the coil elements L111 and L121.
  • the conductor pattern 1122 also serves as part of the coil elements L112 and L122.
  • the conductor patterns 211a, 211b, and 211c correspond to the coil element L211 and the conductor patterns 212a, 212b, and 212c correspond to the coil element L212.
  • the conductor patterns 221a, 221b, and 221c correspond to the coil element L221, and the conductor patterns 222a, 222b, and 222c correspond to the coil element L222.
  • the line extending in the vertical direction in FIG. 6 is an interlayer connection conductor (via conductor), which connects the conductor pattern and the conductor pattern, and connects the conductor pattern and the terminal electrode.
  • the closed magnetic circuit is formed by the adjacent series coils, so that the inductance value is large even if it is thin.
  • a low-loss coil can be obtained. Therefore, it is possible to realize a transformer that is smaller and thinner than conventional ones, has a small loss, and has a large coupling amount between primary and secondary.
  • FIGS. 7A and 7B are circuit diagrams of the high-frequency transformers 103A and 103B according to the third embodiment.
  • the configuration of the transformer in the center of FIG. 7A is the same as that shown in FIG.
  • the configuration of the transformer in the center of FIG. 7B is the same as that shown in FIG.
  • vertical ground electrodes G1 and G2 are provided on the extended line of the winding shaft and grounded.
  • the parasitic capacitance between the secondary coil elements L211, L212, L221, and L222 and the ground increases.
  • the value of the parasitic capacitance can be set.
  • the impedance conversion ratio can have the frequency characteristic.
  • FIG. 8 is a diagram showing a layer configuration in which the high-frequency transformer of FIG. 7A is configured by conductor wiring in the multilayer substrate.
  • FIG. 9 is a diagram showing a layer configuration in which the high-frequency transformer of FIG. 7B is configured by conductor wiring in the multilayer substrate.
  • a ground electrode 66 is formed on the base material layer 51m, and a ground electrode 67 is formed on the base material layer 51n.
  • the other configuration is the same as the example shown in FIG.
  • each coil element shown in FIG. 7 (b) is constituted by each conductor pattern in the base material layers 51a to 51h.
  • a ground electrode 66 is formed on the base material layer 51m, and a ground electrode 67 is formed on the base material layer 51n.
  • the other configuration is the same as the example shown in FIG.
  • both of the ground electrodes 66 and 67 may be disposed on the inner layer of the laminate, or both may be disposed on the outer surface.
  • the impedance conversion ratio can be changed according to the frequency, and the optimum impedance matching is achieved over a wide band. be able to.
  • An example of a circuit connected to the front stage and the rear stage of the high-frequency transformer will be described in another later embodiment.
  • 10A and 10B are circuit diagrams of the high-frequency transformers 104A and 104B according to the fourth embodiment. This is an example in which the number of coils arranged on the same winding axis is increased.
  • These high-frequency transformers 104A and 104B include primary side coil elements L111, L112, L121, L122, L131, and L132 and secondary side coil elements L211, L212, L221, L222, L231, and L232.
  • 10 (a) and 10 (b) differ in the number of coils on the primary side and the secondary side. In either case, the direction of the magnetic flux is reversed between the primary side coil element and the secondary side coil element sharing the winding axis. In any case, a closed magnetic circuit is formed by coil elements connected in series on adjacent winding axes. These configurations are the same as those shown in the second embodiment.
  • FIGS. 11A, 11B, and 11C are circuit diagrams of the high-frequency transformers 105A, 105B, and 105C according to the fifth embodiment. These are examples of a high-frequency transformer having three winding axes AX1, AX2, and AX3 that are parallel to each other. In either case, the direction of the primary-secondary magnetic flux and the direction of the magnetic flux between adjacent coils are the same as those shown in the second embodiment.
  • the coil elements L111, L112, L113, L121, L122, and L123 constitute a primary coil element
  • the coil elements L211, L212, L213, L221, L222, and L223 constitute a secondary coil.
  • the element is configured.
  • vertical ground electrodes G1, G2 are provided and grounded on the extended lines of the three winding axes AX1, AX2, AX3.
  • 12A, 12B, and 12C are circuit diagrams of the high-frequency transformers 106A, 106B, and 106C according to the sixth embodiment.
  • the intermediate point between the secondary coil elements L211 and L212 and the intermediate point between the secondary coil elements L221 and L222 are grounded.
  • the intermediate points of the secondary coil elements L211 and L212 and the intermediate points of the secondary coil elements L221 and L222 are respectively connected to the ground electrodes G1 and G2 sandwiching the coil conductor in the winding axis direction. ing.
  • intermediate points of the primary side coil elements L111 and L112 and intermediate points of the primary side coil elements L121 and L122 are respectively connected to the ground electrodes G1 and G2 sandwiching the coil conductor in the winding axis direction. Yes.
  • FIG. 13 is a diagram showing a layer configuration in which the high-frequency transformer of FIG. 12A is configured by conductor wiring in the multilayer substrate.
  • FIG. 14 is a diagram showing a layer configuration in which the high-frequency transformer of FIG. 12B is configured by conductor wiring in the multilayer substrate.
  • a ground conductor 68 is formed on the base material layer 51k, and a ground electrode 65 is formed on the base material layer 51j.
  • the ground conductor 68 is electrically connected to the ground electrode 65 through a via conductor.
  • the centers of the conductor patterns 211c and 212c are connected to the ground conductor 68 through via conductors.
  • the centers of the conductor patterns 221c and 222c are connected to the ground electrode 65 through via conductors.
  • the other configuration is the same as the example shown in FIG.
  • a ground electrode 66 is formed on the base material layer 51m, and a ground electrode 67 is formed on the base material layer 51n, and the ground electrodes 65, 66, and 67 are electrically connected via via conductors.
  • the centers of the conductor patterns 211c and 212c are connected to the ground electrode 66 through via conductors.
  • the centers of the conductor patterns 221c and 222c are connected to the ground electrode 67 through via conductors.
  • the other configuration is the same as the example shown in FIG.
  • FIG. 15 is a circuit diagram of the high-frequency transformer 107 of the seventh embodiment.
  • the number of winding shafts is different between the primary side and the secondary side.
  • the coil elements L111 and L121 are disposed on the winding axis AX1
  • the coil elements L112 and L122 are disposed on the winding axis AX2.
  • the coil elements L211 and L221 are disposed on the winding axis AX1, and among the secondary coil elements, the coil elements L212 and L222 are disposed on the winding axis AX2, and the secondary coil Of the elements, coil elements L213 and L223 are arranged on a winding axis AX3.
  • such a structure can be adopted when the number of coil turns is greatly different between the primary side and the secondary side.
  • the number of winding axes of the coil elements arranged inside the laminated body may be larger than the number of winding axes of the coil elements arranged outside the laminated body.
  • leakage of magnetic flux from the inner coil elements is more suppressed when there are more winding axes of the coil elements arranged outside the laminated body than the number of winding axes of the coil elements arranged inside the laminated body. It is effective in that it is.
  • FIGS. 16A, 16B, and 16C are circuit diagrams of the high-frequency transformers 108A, 108B, and 108C of the eighth embodiment. None of these high-frequency transformers 108A, 108B, and 108C have a structure in which the central coil element forms a closed magnetic circuit in pairs with adjacent winding shafts.
  • the coil elements L11 and L12 are formed in an intermediate layer with a laminated structure.
  • coil elements L111, L121, L112, and L122 are formed in an intermediate layer with a laminated structure. Such a structure can also be adopted when the number of turns of the coil elements formed in these intermediate layers is relatively small.
  • FIGS. 17A and 17B are circuit diagrams of the high-frequency transformers 109A and 109B according to the ninth embodiment. These high-frequency transformers have a plurality of coil elements arranged three-dimensionally.
  • FIG. 17A there are four winding axes AX11, AX12, AX21, and AX22 that are parallel to each other, and the surface that includes the winding axes AX11 and AX12 and the surface that includes the winding axes AX21 and AX22 are parallel.
  • the plane including the winding axes AX11 and AX21 and the plane including the winding axes AX12 and AX22 are parallel.
  • the plane including the winding axes AX11 and AX12 and the plane including the winding axes AX11 and AX21 are orthogonal to each other.
  • One set of transformers is constituted by coil elements arranged along the winding axes AX11, AX12, and another set of transformers is constituted by coil elements arranged along the winding axes AX21, AX22.
  • Two sets of transformers are connected in parallel to terminals P1-P2 and to terminals P3-P4, respectively.
  • FIG. 17B there are nine winding axes AX11, AX12, AX13, AX21, AX22, AX23, AX31, AX32, AX33 parallel to each other, and a surface including the winding axes AX11, AX12, AX13.
  • a plane including the winding axes AX21, AX22, and AX23 and a plane including the winding axes AX31, AX32, and AX33 are parallel to each other.
  • the plane including the winding axes AX11, AX21, and AX31, the plane including the winding axes AX12, AX22, and AX32, and the plane including the winding axes AX13, AX23, and AX33 are parallel to each other. Further, in this example, the plane including the winding axes AX11, AX12, and AX13 and the plane including the winding axes AX11, AX21, and AX31 are orthogonal to each other.
  • One set of transformers is constituted by coil elements arranged along winding axes AX11, AX12, AX13, and another set of transformers is constituted by coil elements arranged along winding axes AX21, AX22, AX23.
  • the coil elements configured and arranged along the winding axes AX31, AX32, and AX33 constitute another set of transformers, and these three sets of transformers are connected to the terminals P1-P2 and to the terminals P3-P4. They are connected in parallel. In this way, the coil elements may be stacked in layers.
  • FIG. 17 shows an example in which a certain surface including the adjacent winding axis and another surface including the adjacent winding axis are orthogonal to each other, but the intersection angle between this surface and the surface is an angle other than 90 degrees. There may be. For example, it may be 30 degrees or 120 degrees. In that case, a plurality of coil elements are arranged in a honeycomb shape.
  • FIG. 18 is a configuration diagram of the high-frequency component and the communication terminal device of the tenth embodiment.
  • the communication terminal apparatus shown in FIG. 18 includes a high frequency circuit 201, a matching circuit 202, a high frequency component 203, a matching circuit 204, and an antenna 205.
  • the high-frequency component 203 is provided as an impedance conversion circuit that performs impedance matching between the impedance of the transmission line on the high-frequency circuit 201 side and the impedance of the antenna 205.
  • the basic configuration of the high-frequency component 203 is the same as that of the high-frequency transformer 103B shown in FIG.
  • a terminal P1 of this high frequency transformer is used as an input / output terminal on the high frequency circuit 201 side, and a terminal P3 is used as a ground terminal. Terminals P2 and P4 are connected and used as an input / output terminal on the antenna 205 side.
  • the high-frequency component 203 can intentionally change the frequency characteristics of the primary side coil element and the secondary side coil element, so that the impedance conversion ratio depends on the frequency. Can be changed.
  • the impedance conversion ratio of the high-frequency component 203 has a frequency characteristic in accordance with the frequency characteristic of the impedance of the antenna, so that optimum impedance matching can be achieved over a wide band. it can.
  • FIG. 19 is a configuration diagram of the high-frequency component and the communication terminal device of the eleventh embodiment.
  • the communication terminal device shown in FIG. 19 includes a high frequency circuit 201, a high frequency component 206, a filter 207, and an antenna 205.
  • the high-frequency component 206 is provided as a balanced-unbalanced conversion circuit that converts a balanced signal on the high-frequency circuit 201 side and an unbalanced signal on the antenna 205 side.
  • the basic configuration of the high-frequency component 206 is the same as that of the high-frequency transformer 106A shown in FIG.
  • a terminal P1 of this high frequency transformer is used as an input / output terminal on the antenna 205 side, and a terminal P2 is used as a ground terminal. Terminals P3 and P4 are used as input / output terminals for balanced signals on the high-frequency circuit 201 side.
  • the high-frequency component 206 that performs the balance-unbalance conversion is formed of the laminated substrate as shown in FIG.
  • the number of turns of the coil shown in the configuration diagram of the laminated body is naturally an example, and the number of turns of each coil element is not limited to that shown in these drawings.
  • Terminals 11, 12, 13 ... Conductor patterns 21a, 21b, 21c, 22a, 22b , 22c ... Conductor patterns 51a to 51k ... Base material layer 51m, 51n ... Base material layer 61 62, 63, 64 ... terminal electrodes 65, 66, 67 ... ground electrode 68 ... ground conductor 101 ... high frequency transformers 102A, 102B, 102C, 102D ... high frequency transformers 103A, 103B ... high frequency transformers 104A, 104B ... high frequency transformers 105A, 105B, 105C ... high frequency transformers 106A, 106B, 106C ... high frequency transformer 107 ...
  • high frequency transformers 108A, 108B, 108C ... high frequency transformers 109A, 109B ... high frequency transformers 111, 112 ... conductor patterns 121, 122 ... conductor patterns 201 ... high frequency circuits 202, 204 ... Matching circuits 203, 206 ... high frequency components 205 ... antenna 207 ... filters 211a, 211b, 211c ... conductor patterns 212a, 212b, 212c ... conductor patterns 221a, 221b 221c ... conductor patterns 222a, 222b, 222c ... conductor patterns 1121, 1122 ... conductor pattern

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

Selon l'invention, l'axe de spire de bobine d'éléments de bobine de côté primaire (L11, L12) et celui d'éléments de bobine de côté secondaire (L21, L22) sont un axe de spire de bobine commun (AX). Les éléments de bobine de côté primaire et les éléments de bobine de côté secondaire sont agencés de telle sorte qu'il existe deux limites ou davantage entre les éléments de bobine de côté primaire (L11, L12) et les éléments de bobine de côté secondaire (L21, L22) sur l'axe de spire de bobine commun (AX). Les directions de spire et les directions de connexion des éléments de bobine de côté primaire (L11, L12) et des éléments de bobine de côté secondaire (L21, L22) sont fixées de telle sorte que les inductions mutuelles entre les éléments de bobine de côté primaire (L11, L12) et les éléments de bobine de côté secondaire (L21, L22) amènent les directions des flux magnétiques générés par les éléments de bobine de côté primaire (L11, L12) à être opposées aux directions des flux magnétiques générés par les éléments de bobine de côté secondaire (L21, L22).
PCT/JP2012/059622 2011-04-20 2012-04-09 Transformateur haute fréquence, composants haute fréquence et appareil de terminal de communication WO2012144360A1 (fr)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014188739A1 (fr) * 2013-05-23 2014-11-27 株式会社村田製作所 Transformateur à haute fréquence, composant haute fréquence et dispositif terminal de communication
WO2015083525A1 (fr) * 2013-12-06 2015-06-11 株式会社村田製作所 Élément inducteur et dispositif électronique
JP2016139826A (ja) * 2013-02-19 2016-08-04 株式会社村田製作所 インダクタブリッジおよび電子機器
CN107871584A (zh) * 2016-09-26 2018-04-03 株式会社村田制作所 电子部件

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01151211A (ja) * 1987-12-08 1989-06-14 Tdk Corp 積層応用部品の構造
JPH04142714A (ja) * 1990-10-03 1992-05-15 Murata Mfg Co Ltd ソリッドトランスとその製造方法
JPH04206905A (ja) * 1990-11-30 1992-07-28 Murata Mfg Co Ltd 積層型トランス
JP2001176726A (ja) * 1999-10-07 2001-06-29 Toko Inc バラントランス
JP2005129968A (ja) * 1993-06-10 2005-05-19 Yokogawa Electric Corp プリントコイル
JP2008167403A (ja) * 2006-12-08 2008-07-17 Taiyo Yuden Co Ltd 積層型バラン及び混成集積回路モジュール並びに積層基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01151211A (ja) * 1987-12-08 1989-06-14 Tdk Corp 積層応用部品の構造
JPH04142714A (ja) * 1990-10-03 1992-05-15 Murata Mfg Co Ltd ソリッドトランスとその製造方法
JPH04206905A (ja) * 1990-11-30 1992-07-28 Murata Mfg Co Ltd 積層型トランス
JP2005129968A (ja) * 1993-06-10 2005-05-19 Yokogawa Electric Corp プリントコイル
JP2001176726A (ja) * 1999-10-07 2001-06-29 Toko Inc バラントランス
JP2008167403A (ja) * 2006-12-08 2008-07-17 Taiyo Yuden Co Ltd 積層型バラン及び混成集積回路モジュール並びに積層基板

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016139826A (ja) * 2013-02-19 2016-08-04 株式会社村田製作所 インダクタブリッジおよび電子機器
WO2014188739A1 (fr) * 2013-05-23 2014-11-27 株式会社村田製作所 Transformateur à haute fréquence, composant haute fréquence et dispositif terminal de communication
JP5700176B1 (ja) * 2013-05-23 2015-04-15 株式会社村田製作所 高周波トランス、高周波部品および通信端末装置
JP2015122535A (ja) * 2013-05-23 2015-07-02 株式会社村田製作所 高周波トランス、高周波部品および通信端末装置
WO2015083525A1 (fr) * 2013-12-06 2015-06-11 株式会社村田製作所 Élément inducteur et dispositif électronique
US9324491B2 (en) 2013-12-06 2016-04-26 Murata Manufacturing Co., Ltd. Inductor device and electronic apparatus
CN107871584A (zh) * 2016-09-26 2018-04-03 株式会社村田制作所 电子部件
JP2018056195A (ja) * 2016-09-26 2018-04-05 株式会社村田製作所 電子部品
US10622135B2 (en) 2016-09-26 2020-04-14 Murata Manufacturing Co., Ltd. Electronic component
CN107871584B (zh) * 2016-09-26 2020-05-05 株式会社村田制作所 电子部件

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