WO2012142979A1 - 一种led光源的防击穿保护方法及led灯具 - Google Patents

一种led光源的防击穿保护方法及led灯具 Download PDF

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Publication number
WO2012142979A1
WO2012142979A1 PCT/CN2012/077025 CN2012077025W WO2012142979A1 WO 2012142979 A1 WO2012142979 A1 WO 2012142979A1 CN 2012077025 W CN2012077025 W CN 2012077025W WO 2012142979 A1 WO2012142979 A1 WO 2012142979A1
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Prior art keywords
light source
led light
pcb
led
cup
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PCT/CN2012/077025
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English (en)
French (fr)
Inventor
万叶华
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浙江生辉照明有限公司
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Publication of WO2012142979A1 publication Critical patent/WO2012142979A1/zh
Priority to US14/251,095 priority Critical patent/US9279577B2/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/30—Foil or other thin sheet-metal making or treating
    • Y10T29/301—Method
    • Y10T29/302—Clad or other composite foil or thin metal making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

  • the present invention relates to the field of LED technology, and in particular to An anti-breakdown protection method for an LED light source and an LED lamp manufactured by the method.
  • LED lamps are subjected to high voltage testing before leaving the factory.
  • the purpose of high voltage testing is to detect LEDs under extreme conditions.
  • the ability of the lamp housing to withstand high voltage, human touch will not lead to electric shock accidents.
  • the traditional test method is: wrapping a layer of metal foil paper outside the metal heat-dissipating lamp cup and outside the lamp cap, and then clamping the two metal foil papers with electric clips, and accessing 1500V ⁇ 4000V high voltage to detect the luminaire is qualified.
  • LEDs LED lamps
  • a loop is formed between the lamp head, the driving power source and the LED light source, and if the leakage current exceeds the tolerance of the LED light source, the LED light source is broken down and causes damage.
  • the invention overcomes the deficiencies in the prior art mentioned above, and provides an anti-breakdown protection method for an LED light source and an LED lamp manufactured by the method, the method is to connect an electrode of the LED light source to the metal heat sink lamp
  • the cup can provide a bleed path to bleed off this portion of the leakage current to protect the LED light source.
  • a method for preventing breakdown of an LED light source wherein a positive electrode or a negative electrode of the LED light source is connected to the metal heat sink cup through a conductive member to form a bypass bleed path.
  • the PCB board to which the LED light source is soldered is connected to the metal heat sink cup through a plurality of screws, and an electrode on the PCB board is connected to the screw head of one of the screws, and the threaded portion of the screw and the metal heat sink cup Connected.
  • the utility model relates to an LED lamp, comprising a lamp cap and a rubber seat, wherein a driving power source is arranged in the rubber seat, a metal heat dissipation lamp cup is arranged on the rubber seat jacket, a heat dissipation substrate is arranged on the top of the metal heat dissipation lamp cup, and a PCB board is arranged on the heat dissipation substrate.
  • the LED light source is soldered on the PCB board, and the PCB board and the heat dissipation substrate are connected by a plurality of screws, and the driving power source is connected to the electrodes of the PCB board through the wires, wherein the screw head of one screw is connected with an electrode on the PCB board, and the screw thread of the screw Partially connected to the metal heat sink cup.
  • the invention connects an electrode of the LED light source to the metal heat dissipation shell through the conductive member to form a bypass bleed path to discharge leakage current, protect the LED light source from breakdown, and not only enable the LED lamp to effectively perform high voltage
  • the test also protects the LED light source from damage.
  • the above method can also protect the LED from electrostatic ESD damage, especially when installing or taking off the lamp, to prevent the static electricity of the human body from damaging the LED light source. Thereby effectively protecting the damage caused by the LED lamp during the production process and using the installation, and avoiding unnecessary losses.
  • FIG. 1 is an exploded view of an LED lamp in an embodiment of the present invention
  • Figure 2 is a cross-sectional view of the LED lamp of the present invention.
  • Figure 3 shows the PCB board and screw connections.
  • Embodiment An anti-breakdown protection method for an LED light source of the present invention is to use an LED
  • the positive or negative electrode of the light source is connected to the metal heat sink cup through a conductive member to form a bypass bleed path, and the leakage current is discharged during the high voltage test.
  • Figure 1 shows an LED luminaire, including a lamp cap 1 , a rubber seat 2 , in a rubber seat 2
  • a driving power supply 3 inside
  • a rubber seat cover 4 is arranged on the top of the rubber seat 2
  • a metal heat dissipation lamp cup 5 is arranged on the rubber seat 2
  • a heat dissipation substrate 6 is arranged on the top of the metal heat dissipation lamp cup 5 on the heat dissipation substrate 6
  • a PCB board 7 which is composed of a copper foil circuit layer, an insulating dielectric layer and a heat conductive layer, and a plurality of LED light sources 9 are soldered on the upper copper foil circuit layer.
  • the board is integrally connected to the heat dissipating substrate 6 through four screws, and the driving power source 3 is connected to the two electrodes of the copper foil wiring layer through wires.
  • one of the screws on the copper foil circuit layer A conduction circuit 8 is printed between the contact portion of the screw head and an electrode of the copper foil circuit layer.
  • the screw head of the screw 10 can be connected to the PCB board 7
  • One of the electrodes 11 is electrically connected, and the electrode 11 can be either a positive electrode or a negative electrode, and the screw portion of the screw 10 and the metal heat sink cup 5 Electrical connection.
  • This screw can play the role of mounting and fixing, and can also discharge leakage current.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

一种LED光源的防击穿保护方法，其特征是，将LED光源（9）的一个电极（11）通过导电件连接到金属散热灯杯（5），以形成一个旁路泄放路径来泄放漏电流或静电，从而保护LED光源，防止击穿。一种LED灯具，包括灯头（1），胶座（2），在胶座（2）内设有驱动电源（3），在胶座（2）外套有金属散热灯杯（5），在金属散热灯杯（5）顶部设有散热基板（6），在散热基板（6）上设有PCB板（7），在PCB板（7）上焊接有LED光源（9），PCB板（7）与散热基板（6）通过若干个螺丝（10）相连，驱动电源（3）通过导线与PCB板的电极（11）相连，其中，一个螺丝（10）的螺丝头与PCB板（7）上的一个电极（11）相连，这个螺丝（10）的螺紋部分与金属散热灯杯（5）相连。

Description

一种LED光源的防击穿保护方法及LED灯具 技术领域
本发明涉及 LED 技术领域，特别涉及 一种LED光源的防击穿保护方法及采用这种方法制作的LED灯具。
 背景技术
LED 灯具在出厂前都要经过高压测试，高压测试的目的是检测在极端条件下， LED 灯具外壳耐高压的能力如何，人触摸会不会导致电击事故。
传统的测试方法为：在金属散热灯杯外和灯头外各自包裹好一层金属箔纸，然后用电夹子夹住两块金属箔纸，通入 1500V ～ 4000V 高压电，以检测灯具是否合格 。
但在检测中发现，有些LED灯具的LED光源(芯片)会被击穿，造成损坏，是一笔不小的损失，究其原因，是因为在高压测试中，会有少量的漏电小电流在灯头、驱动电源及LED光源间形成回路，而这部分漏电电流如果超出了LED光源的耐受极限，LED光源就会被击穿，造成损坏。
 术解决方案
本发明克服了上述现有技术中的不足，提供了一种LED光源的防击穿保护方法及采用这种方法制作的LED灯具，所述的方法是将LED光源的一个电极连接到金属散热灯杯，从而可以提供一条泄放路径将这部分漏电流泄放掉，以保护LED光源。
本发明的技术方案是这样实现的：
一种LED光源的防击穿保护方法，将LED光源的正极或负极通过导电件连接到金属散热灯杯，以形成旁路泄放路径。
作为优选，将焊接有LED光源的PCB板通过若干螺丝与金属散热灯杯连接在一起，并且将PCB板上的一个电极与其中一个螺丝的螺丝头相连，这个螺丝的螺纹部分与金属散热灯杯相连。
一种LED灯具，包括灯头，胶座，在胶座内设有驱动电源，在胶座外套有金属散热灯杯，在金属散热灯杯顶部设有散热基板，在散热基板上设有PCB板，在PCB板上焊接有LED光源，PCB板与散热基板通过若干个螺丝相连，驱动电源通过导线与PCB板的电极相连，其中一个螺丝的螺丝头与PCB板上的一个电极相连，这个螺丝的螺纹部分与金属散热灯杯相连。
 有益效果
采用了上述技术方案的本发明的原理及有益效果是：
本发明是将LED光源的一个电极通过导电件连接到金属散热外壳，以形成一个旁路泄放路径来泄放漏电流，对LED光源进行保护，防止击穿；不仅使LED灯能够有效进行高压测试，还保护LED光源不受损坏。
上述作法还可以保护LED遭受静电ESD的破坏，特别是在安装或取灯时，可以防止人体的静电对LED光源的损坏。从而有效保护了LED灯在生产过程及使用安装中造成的破坏，避免了不必要的损失。
 附图说明
图 1 为本发明实施例中LED灯具的爆炸图 ；
图 2 为本发明 LED 灯具的剖视图；
图 3 为 PCB 板与螺丝连接的示意图。
本发明的实施方式
实施例：本发明的一种LED光源的防击穿保护方法 ，是将 LED 光源的正极或负极通过导电件连接到金属散热灯杯，以形成旁路泄放路径，在高压测试时将漏电流泄放掉。
下面具体举例如下：如图 1 所示为一种 LED 灯具，包括灯头 1 ，胶座 2 ，在胶座 2 内设有驱动电源 3 ，在胶座 2 顶部设有胶座盖 4 ，在胶座 2 外套有金属散热灯杯 5 ，在金属散热灯杯 5 顶部设有散热基板 6 ，在散热基板 6 上设有 PCB 板 7 ， PCB 板 7 是由铜箔线路层、绝缘介质层与导热层组成，在上层的铜箔线路层上焊接有多个 LED 光源 9 ， PCB 板整体与散热基板 6 通过 4 个螺丝相连，驱动电源 3 通过导线与铜箔线路层的两电极相连。
如图 2 、图 3 所示，在铜箔线路层上的与其中一个螺丝 10 的螺丝头相接触的部位与铜箔线路层的一个电极之间印制一条导通电路 8 ，当螺丝 10 旋入金属散热灯杯后，这个螺丝 10 的螺丝头可以与 PCB 板 7 的一个电极 11 电连接，这个电极 11 可以是正极，也可以是负极，这个螺丝 10 的螺纹部分与金属散热灯杯 5 电连接。这个螺丝既可以起到安装固定的作用，又可以起到泄放漏电流的作用。

Claims (1)

  1. 1、 一种 LED 光源的防击穿保护方法 ，其特征是：将 LED 光源的正极或负极通过导电件连接到金属散热灯杯，以形成旁路泄放路径。
    2、 根据权利要求 1 所述的 一种LED光源的防击穿保护方法 ，其特征在于：将焊接有 LED 光源的 PCB 板通过若干螺丝与金属散热灯杯连接在一起，并且将 PCB 板上的一个电极与其中一个螺丝的螺丝头相连，这个螺丝的螺纹部分与金属散热灯杯相连。
    3、 一种 LED 灯具，包括灯头，胶座，在胶座内设有驱动电源，在胶座外套有金属散热灯杯，在金属散热灯杯顶部设有散热基板，在散热基板上设有 PCB 板，在 PCB 板上焊接有 LED 光源， PCB 板与散热基板通过若干个螺丝相连，驱动电源通过导线与 PCB 板的电极相连，其特征在于：其中一个螺丝的螺丝头与 PCB 板上的一个电极相连，这个螺丝的螺纹部分与金属散热灯杯相连。
PCT/CN2012/077025 2011-04-22 2012-06-15 一种led光源的防击穿保护方法及led灯具 WO2012142979A1 (zh)

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