WO2012022213A1 - 一种改进的发光二极管晶片座的照明装置 - Google Patents

一种改进的发光二极管晶片座的照明装置 Download PDF

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Publication number
WO2012022213A1
WO2012022213A1 PCT/CN2011/077439 CN2011077439W WO2012022213A1 WO 2012022213 A1 WO2012022213 A1 WO 2012022213A1 CN 2011077439 W CN2011077439 W CN 2011077439W WO 2012022213 A1 WO2012022213 A1 WO 2012022213A1
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WO
WIPO (PCT)
Prior art keywords
crystal
electrode
hole
plastic sheet
diode wafer
Prior art date
Application number
PCT/CN2011/077439
Other languages
English (en)
French (fr)
Inventor
林明亮
Original Assignee
Lin Mingliang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lin Mingliang filed Critical Lin Mingliang
Priority to KR2020117000041U priority Critical patent/KR20120003558U/ko
Publication of WO2012022213A1 publication Critical patent/WO2012022213A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
    • F21V7/26—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material the material comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/041—Optical design with conical or pyramidal surface
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the utility model relates to the technical field of electronic components, in particular to an improved lighting device for a light-emitting diode wafer holder.
  • the present application is based on a Chinese utility model patent application with the application number of 201020298146.6 on August 18, 2010, the content of which is hereby incorporated by reference.
  • the utility model generally comprises two wire holders with fixed polarity, the upper end of the wire holder is provided with a crystal seat, the crystal seat comprises a plurality of electrode parts, an insulator is arranged between the electrode parts, and a plurality of crystals, crystals and crystals are arranged on the electrode part.
  • the bracket, the electrode part, and the positive and negative poles of each crystal are welded and connected. Due to various reasons, the positive and negative poles of the crystal may be soldered or leaky due to various reasons, which will cause the whole
  • the connection circuit has poor contact, which affects the quality.
  • the purpose of the utility model is to provide a replacement wire welding for the defects of the prior art, which is convenient for processing and disassembly, does not damage the crystal, has a heat dissipation function, and avoids problems of light source attenuation, wire floating, wire short circuit, and service life. Long improved lighting device for LED wafer holders.
  • An improved illumination device for an LED chip holder comprising a reflector and a diode crystal holder, the diode crystal holder comprising a plurality of electrode portions, and being disposed on the electrode portion (the insulating portion between the electrode portion, the electrode portion is provided with a plurality of crystals at an upper end thereof; and a connecting member having a heat dissipating and conducting function is fixed between the respective crystals, and the diode crystal holder is connected with three non-polar crystals
  • the bracket is provided with a plastic sheet in the reflector, the plastic sheet is provided with a venting hole, and the inner wall of the plastic sheet is provided with a phosphor.
  • the connecting member is a straight piece, and two ends of the straight piece are provided with connecting holes, and the crystal is provided with a connecting post, and the connecting hole is connected with the connecting post of the crystal.
  • the connecting hole is a U-shaped hole, a V-shaped hole or a circular hole.
  • the connecting member is an electrical conductor of a copper sheet or an aluminum sheet.
  • the lower end of the diode crystal holder is provided with a heat dissipating device.
  • the electrode portion is a ring structure or a columnar structure arranged in layers, and the ring structure or the columnar structure is circular, oblate or polygonal.
  • the utility model comprises a reflector and a diode crystal holder, the diode crystal holder comprises a plurality of electrode portions, and an insulating portion disposed between the electrode portion and the electrode portion, wherein the upper end of the electrode portion is provided There are a plurality of crystals; each of the crystals A connecting member having a heat dissipating and conducting function is fixedly disposed, the diode crystal holder is connected with three non-polar brackets, and the reflector is provided with a plastic sheet, and the plastic sheet is provided with a venting hole, and the plastic sheet is provided with an inner wall Phosphor powder;
  • the utility model has the principle that the connecting member is arranged between the respective crystals through the principle of the mechanical structure, so that the positive electrode and the negative electrode of each crystal are sequentially connected, so that the utility model can replace the traditional wire welding, facilitate processing and disassembly, and will not damage the crystal.
  • the connecting member further has a heat dissipating function, so that the electrode portion, the respective crystals and the connecting member itself are effectively dissipated, and the reflective cover is provided with a plastic sheet, and the plastic sheet is provided with a phosphor powder, and the plastic sheet is provided with a breathable material. Hole, so it can avoid deterioration of phosphor and tannin, no problem of light source attenuation, wire floating, wire short circuit, prolong the service life of the whole diode crystal seat, each crystal and the connector itself.
  • the three crystal non-polar brackets connected to the diode crystal holder the non-polar bracket, that is, there is no positive and negative polarity, in use, any two of the brackets can be connected, and the two in the connection are automatically
  • the positive and negative electrodes are selected in the root bracket.
  • Embodiment 1 is a schematic structural view of Embodiment 1 of the present invention.
  • FIG. 2 is a schematic view showing the connection of a crystal and a connecting member in the first embodiment of the present invention
  • FIG. 3 is a schematic structural view of the second embodiment of the present invention.
  • Embodiment 1 as shown in FIG. 1 and FIG. 2, an improved illumination device for an LED chip holder, comprising a reflector 1 and a diode crystal holder 2, the diode crystal holder 2 comprising a plurality of electrode portions 3,
  • the plurality of electrode portions 3 have an annular structure, and the annular structure may have a circular shape, an oblate or polygonal columnar structure, and an insulating portion 4 disposed between the electrode portion 3 and the electrode portion 3,
  • a plurality of crystals 5 are provided at the upper end of the electrode portion 3; the crystal 5 may be provided on one electrode portion 3 or may be provided on the plurality of electrode portions 3 at the same time.
  • connection member 6 having a heat dissipation and a conductive function is fixedly disposed, and the diode crystal holder 2 is connected with three non-polarity brackets 7, wherein the connection member 6 connects the positive poles of the respective crystals 5 or
  • the negative electrode is connected to form a circuit instead of the welding form, which is convenient for processing and disassembly, and does not damage the electrode portion 3.
  • the non-polar bracket 7 has no positive and negative polarity, and can be connected to any of them when used. The two brackets 7 automatically select the positive and negative poles in the two brackets 7 to be connected.
  • the reflector 1 is provided with a plastic sheet 11 .
  • the inner surface of the plastic sheet 11 is provided with phosphor powder.
  • the plastic sheet 11 is provided with a venting hole.
  • the vent hole has a distance from the crystal 5 and can be effective for the crystal 5 and the plastic sheet 11 . Heat dissipation helps to protect the crystal 5 and avoid deterioration of the phosphor and tannin, and less light decay, ensuring the life of the light source.
  • the middle portion of the connecting member 6 is a straight piece 61.
  • the two ends of the straight piece 61 are provided with connecting holes 62.
  • the crystal 5 is provided with a connecting post, and the connecting hole 62 is connected with the connecting post of the crystal 5.
  • the connecting holes 62 at the two ends of the straight piece 61 are connected to the positive electrode or the negative electrode of the crystal 5; the straight piece 61 and the connecting hole 62 constitute a mechanical structure connecting member 6, the mechanical structure
  • the connecting member 6 can easily connect the positive electrode or the negative electrode of each crystal 5 firmly, and can effectively dissipate heat to the entire electrode portion 3, the respective crystals 5 and the connecting member 6 itself, and extend the entire electrode portion 3, the respective crystals 5 and the connecting member 6 Its own service life.
  • the electrical conductor is preferably a copper sheet, or may be an aluminum sheet or other electrode portion 3 such as a conductive sponge or a conductive rubber, as long as it facilitates the conduction of the crystals 5, facilitates disassembly and processing, and mechanical structure.
  • the electrical conductor is preferably a copper sheet, or may be an aluminum sheet or other electrode portion 3 such as a conductive sponge or a conductive rubber, as long as it facilitates the conduction of the crystals 5, facilitates disassembly and processing, and mechanical structure.
  • the realization of the principle can be.
  • the connecting holes 62 provided at the two ends of the straight piece 61 are all circular holes, and may be U-shaped holes or V-shaped holes, and the connecting ends of the straight piece 61 are provided.
  • the hole 62 may also have a circular hole at one end, a U-shaped hole at the other end, a circular hole at one end, a V-shaped hole at the other end or a U-shaped hole at one end, and a V-shaped hole at the other end, as long as The positive electrode or the negative electrode of each crystal 5 is firmly connected, and is convenient for disassembly and processing.
  • the lower end of the diode crystal holder 2 is provided with a heat dissipating device, which mainly derives the heat of each component of the utility model, and maintains the temperature within a certain range.
  • the electrode portion 3 and the insulating portion 4 of the diode crystal holder 2 are assembled first, and then the respective crystals 5 are placed on the upper end of the electrode portion 3 of the diode crystal holder 2, and the connection is made by the mechanical structure principle of the fixing device.
  • the component 6 is connected between the positive electrode and the negative electrode of each crystal 5 to connect the respective crystals 5, thereby replacing the conventional wire bonding, facilitating processing and disassembly, without damaging the crystal 5, and the connecting member 6 has a heat dissipation function, thereby facilitating
  • the electrode portion 3, the respective crystals 5, and the connecting member 6 themselves are effectively radiated, and the service life of the electrode portion 3, the respective crystals 5, and the connecting member 6 itself is extended.
  • a plastic sheet 11 is disposed on the crystal 5, and a phosphor is disposed on the inner wall of the plastic sheet 11.
  • the plastic sheet 11 is provided with a venting hole, and the venting hole can effectively dissipate heat from the phosphor on the inner wall of the plastic sheet 11, and the venting hole has heat dissipation.
  • the functional connector 6 cooperates to effectively dissipate heat to the crystal 5.
  • the plastic sheet 11 and the crystal 5 cover are provided with a reflector 1 to facilitate the brightness of the illumination.
  • the connector 6 of the above mechanical structure principle can also be used in advance to replace the existing technique of directly depositing the phosphor on the crystal 5 on the plastic.
  • the crystal 5 can also be arranged in the same color or a mixture of crystals 5 of different colors according to actual needs, so that the uniformity or color of the crystal 5 chromaticity on the respective electrode portions 3 of the present invention and the diode crystal holder 2 can be achieved. Diversified requirements.
  • Embodiment 2 is different from the first embodiment in that the diode crystal holder 2 is provided with a plurality of electrode portions 3, each of the electrode portions 3 being independent power sources,
  • the electrode portions 3 are columnar structures arranged in layers, and the columnar structures may be generally circular, oblate or polygonal columnar structures, and each of the electrode portions 3 is provided with a plurality of crystals 5, different electrodes 3
  • the portion can be set to a crystal 5 mixed with the same color or various colors according to actual needs. Since the plastic sheet 11 is covered on the crystal 5, the plastic sheet 11 is provided with a venting hole, and the inner surface of the plastic sheet 11 is provided with a phosphor.
  • the brightness and chromaticity of the utility model can be increased, and the crystal 5 and the plastic sheet 11 can be effectively dissipated, which is beneficial to protect the crystal 5 and avoid deterioration of the phosphor and the tantalum, reduce light decay, and ensure the life of the light source.
  • the utility model has the principle that the connecting member is arranged between the respective crystals through the principle of the mechanical structure, so that the positive electrode and the negative electrode of each crystal are sequentially connected, so that the utility model can replace the traditional wire welding, facilitate processing and disassembly, and will not damage the crystal, the connection
  • the device also has a heat dissipating function, so that the electrode portion, the respective crystals and the connecting member itself are effectively dissipated, and the reflector is provided with a plastic sheet, and the plastic sheet is provided with a phosphor powder, and since the plastic sheet is provided with a vent hole, It can avoid the deterioration of phosphor and tannin, and it will not cause the problem of light source attenuation, wire floating, and wire short circuit, and prolong the service life of the whole diode crystal holder, each crystal and the connector itself.
  • the three crystal non-polar brackets connected to the diode crystal holder the non-polar bracket, that is, there is no positive and negative polarity, in use, any two of the brackets can be connected, and the two in the connection are automatically
  • the positive and negative electrodes are selected in the root bracket.
  • the utility model can be mass-produced and has a good market prospect.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Description

说 明 书 一种改进的发光二极管晶片座的照明装置 技术领域：
本实用新型涉及电子元器件技术领域， 特别涉及一种改进的发 光二极管晶片座的照明装置。 本申请是基于申请日 2010年 8月 18 日的、 申请号为 201020298146.6的中国实用新型专利申请， 上述专 利申请的内容作为参考引入本文。
背景技术：
目前， 发光二极管用于各类照明设备， 多以导线支架的连接 为主要装配方式。 其一般包括两个具有固定极性的导线支架， 导 线支架上端设有晶体座， 晶体座包括多个电极部， 电极部之间设 有绝缘体， 在电极部上设有多个晶体， 晶体和晶体间通过导线将 支架、 电极部、 各晶体的正、 负两极进行焊接连接， 由于导线焊 接过程中会因多种原因使晶体的正、负两极出现虚焊、漏焊的情况， 这样会使整个连接电路出现接触不良的现象， 故而影响品质； 再说， 当晶体的正、 负两极焊接好后， 若发现连接错误， 又需要将焊接好 的晶体、 导线的电子元器件焊接处熔焊后重新焊接， 不但会损坏晶 体， 还给加工和拆装带来不便， 另外， 由于晶体承载的温度很高， 当电子元器件长时间使用后， 会因为累积过多的热源使荧光粉和矽 胶变质， 进而发生发光二极管光源衰退或导线浮离， 导线短路等 问题， 影响光源寿命。 实用新型内容：
本实用新型的目的在于针对现有技术的不足提供一种代替导线 焊接， 方便加工和拆装， 不会损坏晶体， 具有散热功能， 避免发生 光源衰减、 导线浮离、 导线短路的问题， 使用寿命长的改进的发光 二极管晶片座的照明装置。
为实现上述目的， 本实用新型采用以下技术方案： 一种改进的 发光二极管晶片座的照明装置， 它包括反光罩和二极管晶体座， 所 述二极管晶体座包括多个电极部， 以及设置于电极部 （与电极部之 间的绝缘部， 所述电极部上端设有多个晶体； 所述各个晶体之间固 定设有具有散热和导电功能的连接件， 所述二极管晶体座连接有三 根无极性的支架， 所述反光罩内设有塑胶片， 该塑胶片开设有透气 孔， 塑胶片内壁设有荧光粉。
所述连接件为直片， 所述直片的两端设有连接孔， 所述晶体设 有连接柱， 所述连接孔与晶体的连接柱连接。
所述连接孔为 U形孔、 V形孔或圆形孔。
所述连接件为铜片或铝片的导电体。
所述二极管晶体座下端设有散热装置。
所述电极部为环状结构或分层设置的柱状结构， 所述环状结构 或柱状结构呈圆形、 扁圆形或多边形。
本实用新型有益效果为： 本实用新型它包括反光罩和二极管晶 体座， 所述二极管晶体座包括多个电极部， 以及设置于电极部与电 极部之间的绝缘部， 所述电极部上端设有多个晶体； 所述各个晶体 之间固定设有具有散热和导电功能的连接件， 所述二极管晶体座连 接有三根无极性的支架， 所述反光罩内设有塑胶片， 该塑胶片开设 有透气孔， 塑胶片内壁设有荧光粉； 本实用新型将连接件通过机械 结构的原理设于各个晶体间， 使各个晶体的正极和负极依次连 接， 可使本实用新型代替传统导线焊接， 方便加工和拆卸， 不会 损坏晶体， 所述连接件还具有散热功能， 故利于电极部、 各个晶 体以及连接件本身进行有效散热， 而所述反光罩内设有塑胶片， 该塑胶片内壁设有荧光粉， 由于塑胶片设有透气孔， 所以可以避免 荧光粉和矽胶变质， 不会发生光源衰减、 导线浮离、 导线短路的问 题， 延长二极管晶体座整体、 各个晶体以及连接件本身的使用寿 命。 另外， 所述二极管晶体座连接的三根无极性的支架， 所述无极 性的支架， 即没有正负极性， 在使用时， 可以任一的连接其中的两 根支架， 自动的在连接的两根支架中选定正负极。
附图说明：
图 1是本实用新型实施例一的结构示意图；
图 2是本实用新型实施例一中晶体与连接件的连接示意图； 图 3是本实用新型实施二的结构示意图。
附图标记： 1 __反光罩 2.
Figure imgf000005_0001
4- -绝缘部
-晶体 6 __连接件
7- -支架 11——塑胶片
61- _直片 62 __连接孔 具体实施方式：
下面结合附图对本实用新型作进一步的说明：
实施例一， 见图 1、 图 2所示， 一种改进的发光二极管晶片座的 照明装置， 它包括反光罩 1和二极管晶体座 2， 所述二极管晶体座 2 包括多个电极部 3，该多个电极部 3为环状结构，所述环状结构可以 整体呈圆形， 扁圆形或者是多边形的柱状结构,以及设置于电极部 3 与电极部 3之间的绝缘部 4， 所述电极部 3上端设有多个晶体 5; 该 晶体 5可以设置在一个电极部 3上， 也可以同时设于多个电极部 3 上。 所述各个晶体 5之间固定设有具有散热和导电功能的连接件 6 连接， 所述二极管晶体座 2连接有三根无极性的支架 7， 其中， 所述 连接件 6将各个晶体 5的正极或负极连接形成一个回路， 代替了焊 接的形式， 方便加工和拆装， 不会损坏电极部 3， 所述无极性的支架 7， 即没有正负极性， 在使用时， 可以任一的连接其中的两根支架 7， 自动的在连接的两根支架 7中选定正负极。
所述反光罩 1内设有塑胶片 11，所述塑胶片 11内壁设有荧光粉， 塑胶片 11开设有透气孔， 该透气孔与晶体 5有一段距离， 可对晶体 5和塑胶片 11有效散热， 有利于保护晶体 5和避免荧光粉和矽胶变 质， 加少光衰， 保证光源寿命。
本实施例中，所述连接件 6中部为直片 61，直片 61的两端设有 连接孔 62，所述晶体 5设有连接柱，所述连接孔 62与晶体 5的连接 柱连接。所述直片 61两端的连接孔 62与晶体 5的正极或负极连接; 所述直片 61和连接孔 62组成一机械结构的连接件 6，该机械结构的 连接件 6可方便将各晶体 5的正极或负极牢固连接， 同时可以对电 极部 3整体、 各个晶体 5以及连接件 6本身进行有效的散热， 延长 电极部 3整体、 各个晶体 5以及连接件 6本身的使用寿命。
本实施例中， 所述导电体优选为铜片， 也可以为铝片或者如导 电海绵或导电橡胶的其它电极部 3，只要有利于各晶体 5的导通，方 便拆装和加工以及机械结构原理的实现即可。
本实施例中， 所述直片 61两端设有的连接孔 62均为圆形孔， 除此之外也可为 U形孔或 V形孔， 所述直片 61两端设有的连接孔 62也可以是一端为圆形孔，另一端为 U形孔，还可以一端为圆形孔， 另一端为 V形孔或者一端为 U形孔， 另一端为 V形孔， 其实只要能 将各晶体 5的正极或负极牢固连接通， 方便拆装和加工即可。
本实施例中， 所述二极管晶体座 2下端设有散热装置， 该散热 装置主要是将本实用新型各个部件的热量导出， 是其保持在一定范 围内的温度。
本实用新型制作时，先将二极管晶体座 2的电极部 3和绝缘部 4 装配好， 之后将各个晶体 5放置于二极管晶体座 2的电极部 3的上 端， 通过固定装置的机械结构原理将连接件 6连接于各个晶体 5的 正极和负极之间， 使各个晶体 5 连通， 以此代替传统导线焊接， 方便加工和拆卸， 不会损坏晶体 5， 另外所述连接件 6具有散热 功能， 故利于电极部 3、 各个晶体 5以及连接件 6本身进行有效 散热，延长电极部 3、各个晶体 5以及连接件 6本身的使用寿命。 之后在电极部 3下端装设与电极部 3连接的三根无极性的支架 7， 在晶体 5上罩设塑胶片 11， 塑胶片 11内壁设有荧光粉， 所述塑 胶片 11设有透气孔，该透气孔可对塑胶片 11内壁的荧光粉有效 散热，该透气孔与具有散热功能的连接件 6配合使用对晶体 5有 效的散热。 最后， 塑胶片 11和晶体 5外罩设一反光罩 1， 有利 于照明的光亮度。
另外， 以上机械结构原理的连接件 6还可预先将荧光粉制作 在塑胶上取代现有将荧光粉直接点胶在晶体 5上之技术。 晶体 5 也可根据实际需要设置成同一颜色或各种不同颜色的晶体 5混合设 置， 如此便可达到本实用新型与二极管晶体座 2 的各个电极部 3 上的晶体 5色度均匀一致性或色度多样化的要求。
实施例二， 见图 3所示， 与实施例一的不同之处在于， 所述二 极管晶体座 2设有多个电极部 3，所述每个电极部 3均为独立的电源， 所述多个电极部 3为分层设置的柱状结构， 所述柱状结构可以整体 呈圆形， 扁圆形或者是多边形的柱状结构,所述每个电极部 3设有多 个晶体 5，不同的电极 3部可根据实际需要设置成同一颜色或各种不 同颜色的晶体 5混合设置， 由于在晶体 5上罩设有塑胶片 11， 该塑 胶片 11设有透气孔， 塑胶片 11 内壁设有荧光粉， 所以这样既可增 加本实用新型的亮度和色度， 又对晶体 5和塑胶片 11有效散热， 有 利于保护晶体 5和避免荧光粉和矽胶变质， 减少光衰， 保证光源寿 命。
以上所述仅是本实用新型的较佳实施方式， 故凡依本实用新型 专利申请范围所述的构造、 特征及结构所做的等效变化或修饰， 均 包括于本实用新型专利申请范围内。
工业应用性
本实用新型将连接件通过机械结构的原理设于各个晶体间， 使各个晶体的正极和负极依次连接，可使本实用新型代替传统导 线焊接， 方便加工和拆卸， 不会损坏晶体， 所述连接件还具有散 热功能，故利于电极部、各个晶体以及连接件本身进行有效散热， 而所述反光罩内设有塑胶片， 该塑胶片内壁设有荧光粉， 由于塑胶 片设有透气孔， 所以可以避免荧光粉和矽胶变质， 不会发生光源衰 减、 导线浮离、 导线短路的问题， 延长二极管晶体座整体、 各个晶 体以及连接件本身的使用寿命。 另外， 所述二极管晶体座连接的 三根无极性的支架， 所述无极性的支架， 即没有正负极性， 在使用 时， 可以任一的连接其中的两根支架， 自动的在连接的两根支架中 选定正负极。 本实用新型可以批量生产， 具有良好的市场前景。

Claims

权 利 要 求 书
1、一种改进的发光二极管晶片座的照明装置，它包括反光罩（1) 和二极管晶体座（2)，所述二极管晶体座（2)包括多个电极部（3)， 以及设置于电极部 （3) 与电极部 （3) 之间的绝缘部 （4) ， 所述电 极部（3)上端设有多个晶体（5) ； 其特征在于： 所述各个晶体（5) 之间固定设有具有散热和导电功能的连接件（6) ， 所述二极管晶体 座 （2)连接有三根无极性的支架 （7) ， 所述反光罩 （1) 内设有塑 胶片 （11) ， 该塑胶片 （11) 开设有透气孔， 塑胶片 （11) 内壁设 有荧光粉。
2、根据权利要求 1所述的一种改进的发光二极管晶片座的照明 装置， 其特征在于： 所述连接件（6)为直片 （61) ， 所述直片 （61) 的两端设有连接孔 （62) ， 所述晶体 （5) 设有连接柱， 所述连接孔
(62) 与晶体 （5) 的连接柱连接。
3、根据权利要求 2所述的一种改进的发光二极管晶片座的照明 装置， 其特征在于： 所述连接孔（62)为 U形孔、 V形孔或圆形孔。
4、根据权利要求 3所述的一种改进的发光二极管晶片座的照明 装置， 其特征在于： 所述连接件 （6) 为铜片或铝片的导电体。
5、根据权利要求 1所述的一种改进的发光二极管晶片座的照明 装置， 其特征在于： 所述二极管晶体座 （2) 下端设有散热装置。
6、根据权利要求 1所述的一种改进的发光二极管晶片座的照明 装置， 其特征在于： 所述电极部 （3)为环状结构或分层设置的柱状
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