WO2012140964A1 - Flexible multilayer substrate with built-in electronic components - Google Patents

Flexible multilayer substrate with built-in electronic components Download PDF

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Publication number
WO2012140964A1
WO2012140964A1 PCT/JP2012/054932 JP2012054932W WO2012140964A1 WO 2012140964 A1 WO2012140964 A1 WO 2012140964A1 JP 2012054932 W JP2012054932 W JP 2012054932W WO 2012140964 A1 WO2012140964 A1 WO 2012140964A1
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Prior art keywords
multilayer substrate
flexible multilayer
electronic component
built
flexible
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PCT/JP2012/054932
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French (fr)
Japanese (ja)
Inventor
喜人 大坪
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株式会社村田製作所
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Publication of WO2012140964A1 publication Critical patent/WO2012140964A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding

Definitions

  • the present invention relates to an electronic component built-in flexible multilayer substrate, and more particularly to an electronic component built-in flexible multilayer substrate excellent in a function of radiating heat generated from the built-in electronic component.
  • a flexible multilayer substrate is flexible and can be greatly deformed, and a limited space in the case of the device can be effectively used. Since it is possible to realize a complicated electronic circuit, it is widely used.
  • This flexible multilayer substrate is formed by laminating a plurality of resin films made of polyimide or the like, in which conductive vias are formed at predetermined positions and wiring conductors made of copper foil or the like are formed on the surface, and heated and pressurized, It is formed by integrating.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2004-158545 discloses a metal having high thermal conductivity such as Al, Cu, and Mo on the main surface of a flexible multilayer substrate directly above a built-in electronic component (semiconductor element).
  • An electronic component built-in flexible multi-layer substrate provided with a heat sink composed of the above is disclosed.
  • a via conductor (however, not electrically connected between the two) may be provided as a heat radiating path.
  • the conventional flexible multilayer board with built-in electronic components described above has a problem that the heat sink prevents the height reduction and the size reduction.
  • the heat sink even if the heat sink itself has a large heat absorption effect, there is a problem that if it is used continuously, heat will be trapped in the heat sink, and the built-in electronic components will break and become inoperable or malfunction. .
  • the present invention has been made to solve the problems of the above-described conventional flexible multilayer board with built-in electronic components.
  • the flexible multilayer substrate with built-in electronic components of the present invention includes a plurality of laminated resin films, via conductors formed at predetermined positions of the resin film, and wiring conductors formed between predetermined layers of the resin film.
  • An electronic component is embedded in a flexible multilayer substrate having the structure, and at least a part of the surface of the embedded electronic component is exposed from the flexible multilayer substrate.
  • At least a part of the upper surface of the built-in electronic component may be exposed from the flexible multilayer substrate.
  • the side surface of the built-in electronic component may be exposed from the flexible multilayer substrate.
  • the terminal electrodes of the built-in electronic component may be exposed from the flexible multilayer substrate.
  • the heat generated from the built-in electronic component can be efficiently dissipated to the outside.
  • At least one electronic component may be built in one main surface side of the flexible multilayer substrate, and at least one other electronic component may be built in the other main surface side of the flexible multilayer substrate.
  • heat generated from the built-in electronic component can be efficiently dissipated from both main surfaces of the flexible multilayer substrate.
  • the electronic component built in one main surface side of the flexible multilayer substrate and the electronic component built in the other main surface side of the flexible multilayer substrate are When seen through, at least a part of them may overlap.
  • the strength of the rigid region of the flexible multilayer substrate in which the electronic component is incorporated can be improved.
  • the electronic component built-in flexible multilayer substrate of the present invention having the above-described configuration efficiently dissipates heat generated from the embedded electronic component to the outside from the surface of the electronic component exposed from the flexible multilayer substrate. Can do. In addition, since a separate heat sink is not provided, a reduction in height and a reduction in size are not hindered.
  • FIG. 1 is a cross-sectional view showing an electronic component built-in flexible multilayer substrate 100 according to a first embodiment of the present invention.
  • FIGS. 2A to 2F are cross-sectional views showing respective steps applied in an example of a method for manufacturing the electronic component built-in flexible multilayer substrate 100.
  • 3G and 3H are continued from FIG.
  • It is sectional drawing which shows the electronic component built-in flexible multilayer substrate 200 concerning 2nd Embodiment of this invention.
  • It is sectional drawing which shows the electronic component built-in flexible multilayer substrate 300 concerning 3rd Embodiment of this invention.
  • FIG. 1 shows a flexible multilayer substrate 100 with a built-in electronic component according to a first embodiment of the present invention.
  • the electronic component 2 is embedded in the flexible multilayer substrate 1.
  • the flexible multilayer substrate 1 includes a plurality of laminated resin films 3.
  • a resin film 3 for example, a thermoplastic resin such as polyimide or polyester is used.
  • the thickness of the resin film 3 is, for example, about 10 ⁇ m to 100 ⁇ m.
  • via conductors 4 are formed at predetermined positions so as to penetrate between both main surfaces of the resin film 3.
  • the via conductor 4 is formed by filling the through hole with a conductive paste whose main component is a metal such as Cu, Ag, or Sn.
  • a wiring conductor 5 having a desired shape is formed on one main surface of the resin film 3.
  • a copper foil is used for the wiring conductor 5.
  • the thickness of the wiring conductor 5 is, for example, about 5 ⁇ m to 50 ⁇ m.
  • the wiring conductor 5 may be attached to the resin film 3 with an adhesive, or may be attached by heating and pressing without an adhesive.
  • the flexible multilayer substrate 1 includes a rigid region R having a large number of layers of the resin film 3 to be laminated and a low flexibility and a flexible region F having a small number of layers of the resin film 3 to be laminated and a large flexibility. .
  • the flexible multilayer substrate 1 is housed in a compact manner, for example, in the case of the device by mainly deforming the flexible region F.
  • the electronic component 2 is built in the rigid region R of the flexible multilayer substrate 1.
  • the four electronic components 2 are seen through in the laminating direction of the resin film 3 on the one main surface side and the other main surface side of the flexible multilayer substrate 1 two by two in the rigid region R. Built-in to overlap.
  • the rigid region R of the flexible multilayer substrate 1 has improved strength because the two electronic components 2 are built in the stacking direction.
  • the heat generated in the electronic component 2 is from both main surface sides of the flexible multilayer substrate 1. Efficiently dissipates.
  • the electronic component 2 includes a pair of terminal electrodes 2a at both ends.
  • the terminal electrode 2a is connected to the via conductor 4 by a bonding material (not shown) such as a conductive paste or solder.
  • a conductive paste filled in the via conductor 4 may be used as the conductive paste of the bonding material.
  • the terminal electrode 2 a of the electronic component 2 may be connected to the wiring conductor 5 instead of being connected to the via conductor 4.
  • the type of electronic component 2 does not matter.
  • a capacitor is shown as the electronic component 2, but other types of electronic components such as a semiconductor, a resistor, and a coil may be used instead of the capacitor. Alternatively, a plurality of types of electronic components may be incorporated.
  • the entire upper surface and a part of the side surface are exposed from the flexible multilayer substrate 1.
  • the upper surface of the electronic component 2 means a surface opposite to the mounting surface.
  • the side surface of the electronic component 2 refers to the remaining four surfaces obtained by removing the mounting surface and the upper surface from the six surfaces.
  • a part of the terminal electrode 2 a of the electronic component 2 is exposed from the flexible multilayer substrate 1. Since the terminal electrode 2a of the electronic component 2 that easily absorbs heat and easily accumulates heat is exposed, the heat generated from the built-in electronic component 2 is efficiently dissipated to the outside.
  • the electronic component built-in flexible multilayer substrate 100 according to the first embodiment of the present invention having the above-described structure can be manufactured by, for example, each process shown in FIGS. 2 (A) to 3 (H).
  • a resin film 3 is prepared, and a metal foil 15 made of copper foil or the like is attached to the entire surface of one main surface of the resin film 3 as required, as shown in FIG.
  • the metal foil 15 may be attached with an adhesive, or may be attached by heating and pressing without an adhesive. Note that this step is omitted for the resin film 3 that does not require the metal foil 15.
  • through holes 14 for forming the conductive vias 4 are formed in the resin film 3 as necessary.
  • the through hole 14 can be formed by irradiating laser such as YAG laser or excimer laser. Note that this step is omitted for the resin film 3 that does not require the conductive via 4.
  • an etching resist 16 having a desired shape is formed on the metal foil 15 attached to the resin film 3 by, for example, screen printing.
  • the metal foil 15 in the portion where the etching resist 16 is not formed is etched with an etching solution to form the wiring conductor 5 having a desired shape on the resin film 3. To do.
  • the conductive holes 4 are formed by filling the through holes 14 formed in the resin film 3 with a conductive paste.
  • a plurality of resin films 3 are laminated, heated and pressurized, and integrated to form a flexible multilayer substrate 1.
  • the plurality of resin films 3 are formed with wiring conductors 5 formed on the main surface, those not formed, those with via conductors 4 penetrating between both main surfaces, or formed. Those not present are selected as necessary, and are laminated in the desired order.
  • the terminal electrode 2a of the electronic component 2 is connected to the via conductor 4 with a bonding material made of conductive paste or solder, and the electronic component 2 is built in the flexible multilayer substrate 1.
  • the electronic component built-in flexible multilayer substrate 100 according to the first embodiment is completed.
  • the electronic component 2 may be embedded in the flexible multilayer substrate 1 when the plurality of resin films 3 are stacked and integrated to form the flexible multilayer substrate 1 at the same time.
  • the material, shape, thickness, number of layers and the like of the resin film 3 are arbitrary and are not limited to the above-described contents.
  • a thermosetting resin can be used instead of the thermoplastic resin.
  • the shape and formation position of the conductive via 4 and the wiring conductor 5 and the type and number of the built-in electronic component 2 are arbitrary, and are not limited to the above-described contents.
  • the configuration of the electronic circuit constituted by the electronic component 2, the conductive via 4, and the wiring conductor 5 is also arbitrary, and is not limited to the above-described content.
  • the wiring conductor is formed by etching a metal foil.
  • the wiring conductor may be formed by printing with a solder resist or photolithography on the main surface of the outermost layer of the flexible multilayer substrate with built-in electronic components. .
  • FIG. 4 shows an electronic component built-in flexible multilayer substrate 200 according to the second embodiment of the present invention.
  • the resin film 13 is further laminated on the upper surface of the electronic component 12.
  • the electronic component built-in flexible multilayer substrate 200 if a wiring conductor (not shown) is formed on the surface of the resin film 13, another electronic component can be mounted thereon. That is, according to the electronic component built-in flexible multilayer substrate 200 according to the present embodiment, it is possible to mount electronic components at a higher density.
  • FIG. 5 shows an electronic component built-in flexible multilayer substrate 300 according to a third embodiment of the present invention.
  • heat generated from the electronic component 22 can be efficiently dissipated from both main surfaces of the flexible multilayer substrate 1. Moreover, since the side surface of the electronic component 22 is covered with the resin films 3 and 23, the electronic component 22 is securely held in the flexible multilayer substrate 1.
  • FIG. 6 shows an electronic component built-in flexible multilayer substrate 400 according to a fourth embodiment of the present invention.
  • another resin film 33 is formed on the resin film 23 on one main surface (the upper main surface in FIG. 6) of the rigid region R of the flexible multilayer substrate 1. Laminated. Another resin film is not laminated on the resin film 23 on the other main surface (lower main surface in FIG. 6) of the rigid region R of the flexible multilayer substrate 1, and the upper surface of the electronic component 22 extends from the resin film 23. It was exposed.
  • the flexible multilayer substrate 400 with built-in electronic components has a wiring conductor (not shown) on one main surface (the upper main surface in FIG. 6) of the rigid region R of the flexible multilayer substrate 1.
  • another electronic component can be mounted. From the other main surface (the lower main surface in FIG. 6) of the rigid region R of the flexible multilayer substrate 1, the upper surface of the electronic component 22 is By exposing, the heat generated from the electronic component 22 was efficiently dissipated. That is, in the present embodiment, both high-density mounting of electronic components and heat dissipation from the electronic components are achieved.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A flexible multilayer substrate with built-in electronic components having an excellent capacity for dissipating heat generated by the built-in electronic components is provided. This flexible multilayer substrate with built-in electronic components (100) has electronic components (2) that are built into a flexible multilayer substrate (1), which is provided with a plurality of laminated resin films (3), via conductors (4) formed in prescribed locations in the resin films (3), and wiring conductors (5) formed between prescribed layers of the resin films (3), wherein the built-in electronic components (2) are each configured in such a manner that at least part of the surface thereof is exposed from the flexible multilayer substrate (1).

Description

電子部品内蔵フレキシブル多層基板Flexible multilayer board with built-in electronic components
　本発明は、電子部品内蔵フレキシブル多層基板に関し、更に詳しくは、内蔵された電子部品から発生する熱の放散機能に優れた電子部品内蔵フレキシブル多層基板に関する。 The present invention relates to an electronic component built-in flexible multilayer substrate, and more particularly to an electronic component built-in flexible multilayer substrate excellent in a function of radiating heat generated from the built-in electronic component.
　電子機器、電気機器などにおいて、フレキシブル多層基板が、可撓性があり、大きく変形させることができ、機器のケース内の限られた空間を有効に活用することが可能であるため、また、多層化されていて、複雑な電子回路を実現することが可能であるため、広く利用されている。このフレキシブル多層基板は、例えば、所定の位置に導電ビアが形成され、表面に銅箔などからなる配線導体が形成された、ポリイミドなどからなる複数の樹脂フィルムを積層し、加熱及び加圧して、一体化することにより形成される。 In an electronic device, an electric device, etc., a flexible multilayer substrate is flexible and can be greatly deformed, and a limited space in the case of the device can be effectively used. Since it is possible to realize a complicated electronic circuit, it is widely used. This flexible multilayer substrate is formed by laminating a plurality of resin films made of polyimide or the like, in which conductive vias are formed at predetermined positions and wiring conductors made of copper foil or the like are formed on the surface, and heated and pressurized, It is formed by integrating.
　近時、このフレキシブル多層基板に電子部品を内蔵させた、電子部品内蔵フレキシブル多層基板が開発され、利用されている。フレキシブル多層基板に電子部品を内蔵させることにより、より多くの電子部品を実装することができ、構成される電子回路の高機能化が可能になる。あるいは、同じ機能の電子回路を、平面的により小さなフレキシブル多層基板で実現することが可能になる。 Recently, a flexible multilayer board with built-in electronic components, in which electronic components are built into this flexible multilayer board, has been developed and used. By incorporating electronic components in the flexible multilayer substrate, a larger number of electronic components can be mounted, and the functionality of the configured electronic circuit can be improved. Alternatively, an electronic circuit having the same function can be realized with a flexible multilayer substrate that is smaller in plan.
　しかしながら、フレキシブル多層基板に電子部品を内蔵させると、内蔵された電子部品から発生する熱を放散させることが重要な課題になる。適切に熱を放散させないと、内蔵された電子部品が壊れて作動しなくなったり、誤作動したり、あるいは樹脂フィルムが溶融してフレキシブル多層基板が壊れるといった問題があるからである。 However, when an electronic component is built in the flexible multilayer substrate, it is an important issue to dissipate heat generated from the built-in electronic component. This is because if the heat is not properly dissipated, the built-in electronic component breaks and does not operate, malfunctions, or the resin film melts to break the flexible multilayer substrate.
　例えば、特許文献１（特開２００４‐１５８５４５号公報）には、内蔵された電子部品（半導体素子）の直上のフレキシブル多層基板の主面に、Ａｌ、Ｃｕ，Ｍｏなどの熱伝導率の高い金属などからなる放熱板を設けた電子部品内蔵フレキシブル多層基板が開示されている。電子部品と放熱板の間には、放熱経路としてのビア導体（ただし両者間は電気的には導通していない）を設けるようにしても良いとされている。 For example, Patent Document 1 (Japanese Patent Application Laid-Open No. 2004-158545) discloses a metal having high thermal conductivity such as Al, Cu, and Mo on the main surface of a flexible multilayer substrate directly above a built-in electronic component (semiconductor element). An electronic component built-in flexible multi-layer substrate provided with a heat sink composed of the above is disclosed. Between the electronic component and the heat radiating plate, a via conductor (however, not electrically connected between the two) may be provided as a heat radiating path.
特開２００４‐１５８５４５号公報JP 2004-158545 A
　しかしながら、上述した従来の電子部品内蔵フレキシブル多層基板には、放熱板により、低背化が妨げられる、小型化が妨げられるという問題があった。また、放熱板自体の吸熱効果が大きくても、連続使用すると放熱板に熱がこもり、その熱により、内蔵された電子部品が壊れて作動しなくなったり、誤作動したりするという問題があった。 However, the conventional flexible multilayer board with built-in electronic components described above has a problem that the heat sink prevents the height reduction and the size reduction. In addition, even if the heat sink itself has a large heat absorption effect, there is a problem that if it is used continuously, heat will be trapped in the heat sink, and the built-in electronic components will break and become inoperable or malfunction. .
　本発明は、上述した従来の電子部品内蔵フレキシブル多層基板が有する問題を解決するためになされたものである。その手段として、本発明の電子部品内蔵フレキシブル多層基板は、積層された複数の樹脂フィルムと、樹脂フィルムの所定の位置に形成されたビア導体と、樹脂フィルムの所定の層間に形成された配線導体を備えたフレキシブル多層基板に、電子部品を内蔵させ、内蔵された電子部品は、表面の少なくとも一部が、フレキシブル多層基板から露出するようにした。 The present invention has been made to solve the problems of the above-described conventional flexible multilayer board with built-in electronic components. As its means, the flexible multilayer substrate with built-in electronic components of the present invention includes a plurality of laminated resin films, via conductors formed at predetermined positions of the resin film, and wiring conductors formed between predetermined layers of the resin film. An electronic component is embedded in a flexible multilayer substrate having the structure, and at least a part of the surface of the embedded electronic component is exposed from the flexible multilayer substrate.
　例えば、内蔵された電子部品の上面の少なくとも一部が、フレキシブル多層基板から露出するようにすれば良い。 For example, at least a part of the upper surface of the built-in electronic component may be exposed from the flexible multilayer substrate.
　あるいは、内蔵された電子部品の側面の少なくとも一部が、フレキシブル多層基板から露出するようにすれば良い。 Alternatively, at least a part of the side surface of the built-in electronic component may be exposed from the flexible multilayer substrate.
　あるいは、内蔵された電子部品の端子電極の少なくとも一部が、フレキシブル多層基板から露出するようにすれば良い。この場合には、吸熱しやすく、熱のこもりやすい端子電極が露出されるため、内蔵された電子部品から発生した熱を、効率良く、外部に放散することができる。 Alternatively, at least a part of the terminal electrodes of the built-in electronic component may be exposed from the flexible multilayer substrate. In this case, since the terminal electrode that easily absorbs heat and easily accumulates heat is exposed, the heat generated from the built-in electronic component can be efficiently dissipated to the outside.
　また、少なくとも１個の電子部品をフレキシブル多層基板の一方の主面側に内蔵させ、他の少なくとも１個の電子部品をフレキシブル多層基板の他方の主面側に内蔵させるようにしても良い。この場合には、内蔵された電子部品から発生した熱を、フレキシブル多層基板の両主面から、効率良く放散させることができる。 Further, at least one electronic component may be built in one main surface side of the flexible multilayer substrate, and at least one other electronic component may be built in the other main surface side of the flexible multilayer substrate. In this case, heat generated from the built-in electronic component can be efficiently dissipated from both main surfaces of the flexible multilayer substrate.
　また、この場合において、フレキシブル多層基板の一方の主面側に内蔵された電子部品と、フレキシブル多層基板の他方の主面側に内蔵された電子部品が、フレキシブル多層基板を樹脂フィルムの積層方向に透視した場合に、少なくとも一部が重なるようにしても良い。この場合には、電子部品が内蔵された、フレキシブル多層基板のリジッド領域の強度を向上させることができる。 In this case, the electronic component built in one main surface side of the flexible multilayer substrate and the electronic component built in the other main surface side of the flexible multilayer substrate are When seen through, at least a part of them may overlap. In this case, the strength of the rigid region of the flexible multilayer substrate in which the electronic component is incorporated can be improved.
　上述した構成からなる本発明の電子部品内蔵フレキシブル多層基板は、内蔵された電子部品から発生した熱を、フレキシブル多層基板から露出している当該電子部品の表面から、効率良く、外部に放散させることができる。また、別途、放熱板を設けたものではないため、低背化が妨げられることや、小型化が妨げられることがない。 The electronic component built-in flexible multilayer substrate of the present invention having the above-described configuration efficiently dissipates heat generated from the embedded electronic component to the outside from the surface of the electronic component exposed from the flexible multilayer substrate. Can do. In addition, since a separate heat sink is not provided, a reduction in height and a reduction in size are not hindered.
本発明の第１実施形態にかかる電子部品内蔵フレキシブル多層基板１００を示す断面図である。1 is a cross-sectional view showing an electronic component built-in flexible multilayer substrate 100 according to a first embodiment of the present invention. 図２（Ａ）～（Ｆ）は、電子部品内蔵フレキシブル多層基板１００の製造方法の一例において適用される各工程を示す断面図である。FIGS. 2A to 2F are cross-sectional views showing respective steps applied in an example of a method for manufacturing the electronic component built-in flexible multilayer substrate 100. 図３（Ｇ）、（Ｈ）は、図２の続きである。3G and 3H are continued from FIG. 本発明の第２実施形態にかかる電子部品内蔵フレキシブル多層基板２００を示す断面図である。It is sectional drawing which shows the electronic component built-in flexible multilayer substrate 200 concerning 2nd Embodiment of this invention. 本発明の第３実施形態にかかる電子部品内蔵フレキシブル多層基板３００を示す断面図である。It is sectional drawing which shows the electronic component built-in flexible multilayer substrate 300 concerning 3rd Embodiment of this invention. 本発明の第４実施形態にかかる電子部品内蔵フレキシブル多層基板４００を示す断面図である。It is sectional drawing which shows the electronic component built-in flexible multilayer substrate 400 concerning 4th Embodiment of this invention.
　以下、図面とともに、本発明を実施するための形態について説明する。 Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
　［第１実施形態］
　図１に、本発明の第１実施形態にかかる電子部品内蔵フレキシブル多層基板１００を示す。 [First Embodiment]
FIG. 1 shows a flexible multilayer substrate 100 with a built-in electronic component according to a first embodiment of the present invention.
　電子部品内蔵フレキシブル多層基板１００は、フレキシブル多層基板１に、電子部品２が内蔵されている。 In the electronic component built-in flexible multilayer substrate 100, the electronic component 2 is embedded in the flexible multilayer substrate 1.
　フレキシブル多層基板１は、積層された複数の樹脂フィルム３を備える。樹脂フィルム３には、例えば、ポリイミドやポリエステルなどの熱可塑性樹脂が使用される。樹脂フィルム３の厚みは、例えば、１０μｍ～１００μｍ程度にされる。 The flexible multilayer substrate 1 includes a plurality of laminated resin films 3. For the resin film 3, for example, a thermoplastic resin such as polyimide or polyester is used. The thickness of the resin film 3 is, for example, about 10 μm to 100 μm.
　樹脂フィルム３には、所定の位置に、樹脂フィルム３の両主面間を貫通して、ビア導体４が形成されている。ビア導体４は、貫通孔に、例えば、Ｃｕ、Ａｇ、Ｓｎなどの金属を主成分とする導電性ペーストを充填することにより形成されている。 In the resin film 3, via conductors 4 are formed at predetermined positions so as to penetrate between both main surfaces of the resin film 3. The via conductor 4 is formed by filling the through hole with a conductive paste whose main component is a metal such as Cu, Ag, or Sn.
　樹脂フィルム３の一方の主面には、所望の形状からなる配線導体５が形成されている。配線導体５には、例えば、銅箔が用いられる。配線導体５の厚みは、例えば、５μｍ～５０μｍ程度にされる。配線導体５は、樹脂フィルム３に、接着剤により貼着されても良いし、接着材なしで加熱及び加圧されて、貼着されても良い。 A wiring conductor 5 having a desired shape is formed on one main surface of the resin film 3. For the wiring conductor 5, for example, a copper foil is used. The thickness of the wiring conductor 5 is, for example, about 5 μm to 50 μm. The wiring conductor 5 may be attached to the resin film 3 with an adhesive, or may be attached by heating and pressing without an adhesive.
　フレキシブル多層基板１は、積層される樹脂フィルム３の層数が多く、可撓性が小さいリジット領域Ｒと、積層される樹脂フィルム３の層数が少なく、可撓性が大きいフレキシブル領域Ｆを備える。フレキシブル多層基板１は、主にフレキシブル領域Ｆを変形させることにより、機器のケース内などに、コンパクトに収容される。 The flexible multilayer substrate 1 includes a rigid region R having a large number of layers of the resin film 3 to be laminated and a low flexibility and a flexible region F having a small number of layers of the resin film 3 to be laminated and a large flexibility. . The flexible multilayer substrate 1 is housed in a compact manner, for example, in the case of the device by mainly deforming the flexible region F.
　電子部品２は、フレキシブル多層基板１のリジット領域Ｒに内蔵されている。本実施形態においては、４個の電子部品２が、リジッド領域Ｒにおいて、２個ずつ、フレキシブル多層基板１の一方主面側と他方主面側で、樹脂フィルム３の積層方向に透視した場合に、重なるように内蔵されている。フレキシブル多層基板１のリジッド領域Ｒは、２個の電子部品２が積層方向に重ねて内蔵されているため、強度が向上している。また、電子部品２が、フレキシブル多層基板１の一方主面側と他方主面側に分けて内蔵されているため、電子部品２で発生した熱は、フレキシブル多層基板１の両主面側から、効率良く放散される。 The electronic component 2 is built in the rigid region R of the flexible multilayer substrate 1. In this embodiment, when the four electronic components 2 are seen through in the laminating direction of the resin film 3 on the one main surface side and the other main surface side of the flexible multilayer substrate 1 two by two in the rigid region R. Built-in to overlap. The rigid region R of the flexible multilayer substrate 1 has improved strength because the two electronic components 2 are built in the stacking direction. In addition, since the electronic component 2 is built in one main surface side and the other main surface side of the flexible multilayer substrate 1, the heat generated in the electronic component 2 is from both main surface sides of the flexible multilayer substrate 1. Efficiently dissipates.
　電子部品２は、両端に１対の端子電極２ａを備えている。そして、端子電極２ａが、導電性ペースト、はんだなどの接合材（図示せず）により、ビア導体４に接続されている。なお、この接合材の導電ペーストには、ビア導体４内に充填された導電ペーストを用いても良い。また、電子部品２の端子電極２ａは、ビア導体４に接続するのではなく、配線導体５に接続するようにしても良い。 The electronic component 2 includes a pair of terminal electrodes 2a at both ends. The terminal electrode 2a is connected to the via conductor 4 by a bonding material (not shown) such as a conductive paste or solder. Note that a conductive paste filled in the via conductor 4 may be used as the conductive paste of the bonding material. Further, the terminal electrode 2 a of the electronic component 2 may be connected to the wiring conductor 5 instead of being connected to the via conductor 4.
　電子部品２の種類は問わない。図１においては、電子部品２としてコンデンサを示しているが、コンデンサに代えて、半導体、抵抗、コイルなど、他の種類の電子部品であっても良い。あるいは、複数の種類の電子部品が内蔵されていても良い。 The type of electronic component 2 does not matter. In FIG. 1, a capacitor is shown as the electronic component 2, but other types of electronic components such as a semiconductor, a resistor, and a coil may be used instead of the capacitor. Alternatively, a plurality of types of electronic components may be incorporated.
　本実施形態においては、電子部品２の表面のうち、上面の全部と、側面の一部がフレキシブル多層基板１から露出している。なお、電子部品２の上面とは、実装面と反対側の面をいう。また、電子部品２の側面とは、６個の面から実装面と上面を除いた、残りの４個の面をいう。なお、本実施形態においては、電子部品２の端子電極２ａの一部が、フレキシブル多層基板１から露出している。吸熱しやすく、熱がこもりやすい電子部品２の端子電極２ａが露出されるため、内蔵された電子部品２から発生した熱は、効率良く、外部に放散される。 In the present embodiment, of the surface of the electronic component 2, the entire upper surface and a part of the side surface are exposed from the flexible multilayer substrate 1. In addition, the upper surface of the electronic component 2 means a surface opposite to the mounting surface. The side surface of the electronic component 2 refers to the remaining four surfaces obtained by removing the mounting surface and the upper surface from the six surfaces. In the present embodiment, a part of the terminal electrode 2 a of the electronic component 2 is exposed from the flexible multilayer substrate 1. Since the terminal electrode 2a of the electronic component 2 that easily absorbs heat and easily accumulates heat is exposed, the heat generated from the built-in electronic component 2 is efficiently dissipated to the outside.
　上述した構造からなる、本発明の第１実施形態にかかる電子部品内蔵フレキシブル多層基板１００は、例えば、図２（Ａ）～図３（Ｈ）に示す、各工程により製造することができる。 The electronic component built-in flexible multilayer substrate 100 according to the first embodiment of the present invention having the above-described structure can be manufactured by, for example, each process shown in FIGS. 2 (A) to 3 (H).
　まず、樹脂フィルム３を用意し、図２（Ａ）に示すように、必要に応じて、樹脂フィルム３の一方の主面の全面に、銅箔などからなる金属箔１５を貼着する。金属箔１５は、接着剤で貼着させても良いし、接着剤なしで、加熱及び加圧して貼着させても良い。なお、金属箔１５が不要な樹脂フィルム３に対しては、この工程は省略される。 First, a resin film 3 is prepared, and a metal foil 15 made of copper foil or the like is attached to the entire surface of one main surface of the resin film 3 as required, as shown in FIG. The metal foil 15 may be attached with an adhesive, or may be attached by heating and pressing without an adhesive. Note that this step is omitted for the resin film 3 that does not require the metal foil 15.
　次に、図２（Ｂ）に示すように、必要に応じて、樹脂フィルム３に、導電ビア４を形成するための貫通孔１４を形成する。貫通孔１４は、ＹＡＧレーザやエキシマレーザなどのレーザを照射することにより形成することができる。なお、導電ビア４が不要な樹脂フィルム３に対しては、この工程は省略される。 Next, as shown in FIG. 2B, through holes 14 for forming the conductive vias 4 are formed in the resin film 3 as necessary. The through hole 14 can be formed by irradiating laser such as YAG laser or excimer laser. Note that this step is omitted for the resin film 3 that does not require the conductive via 4.
　次に、図２（Ｃ）に示すように、樹脂フィルム３に貼着された金属箔１５上に、例えばスクリーン印刷により、所望の形状からなるエッチングレジスト１６を形成する。 Next, as shown in FIG. 2C, an etching resist 16 having a desired shape is formed on the metal foil 15 attached to the resin film 3 by, for example, screen printing.
　次に、図２（Ｄ）に示すように、エッチング液により、エッチングレジスト１６が形成されていない部分の金属箔１５をエッチングし、樹脂フィルム３上に、所望の形状からなる配線導体５を形成する。 Next, as shown in FIG. 2D, the metal foil 15 in the portion where the etching resist 16 is not formed is etched with an etching solution to form the wiring conductor 5 having a desired shape on the resin film 3. To do.
　次に、図２（Ｅ）に示すように、不要となったエッチングレジスト１６を除去する。 Next, as shown in FIG. 2E, the etching resist 16 that is no longer needed is removed.
　次に、図２（Ｆ）に示すように、樹脂フィルム３に形成された貫通孔１４に、導電性ペーストを充填し、導電ビア４を形成する。 Next, as shown in FIG. 2 (F), the conductive holes 4 are formed by filling the through holes 14 formed in the resin film 3 with a conductive paste.
　次に、図３（Ｇ）に示すように、複数の樹脂フィルム３を積層し、加熱及び加圧し、一体化して、フレキシブル多層基板１を形成する。なお、複数の樹脂フィルム３には、主面に配線導体５が形成されたものや、形成されていないもの、両主面間を貫通してビア導体４が形成されたものや、形成されていないものを、必要に応じて選択し、所望の順番に積層する。 Next, as shown in FIG. 3G, a plurality of resin films 3 are laminated, heated and pressurized, and integrated to form a flexible multilayer substrate 1. It should be noted that the plurality of resin films 3 are formed with wiring conductors 5 formed on the main surface, those not formed, those with via conductors 4 penetrating between both main surfaces, or formed. Those not present are selected as necessary, and are laminated in the desired order.
　次に、図３（Ｈ）に示すように、導電性ペーストやはんだからなる接合材により、電子部品２の端子電極２ａをビア導体４に接続し、電子部品２をフレキシブル多層基板１に内蔵させて、第１実施形態にかかる電子部品内蔵フレキシブル多層基板１００は完成する。なお、電子部品２のフレキシブル多層基板１への内蔵は、複数の樹脂フィルム３を積層し、一体化して、フレキシブル多層基板１を形成する際に、同時に行うようにしても良い。 Next, as shown in FIG. 3 (H), the terminal electrode 2a of the electronic component 2 is connected to the via conductor 4 with a bonding material made of conductive paste or solder, and the electronic component 2 is built in the flexible multilayer substrate 1. Thus, the electronic component built-in flexible multilayer substrate 100 according to the first embodiment is completed. The electronic component 2 may be embedded in the flexible multilayer substrate 1 when the plurality of resin films 3 are stacked and integrated to form the flexible multilayer substrate 1 at the same time.
　以上、本発明の第１実施形態にかかる電子部品内蔵フレキシブル多層基板１００の構成、及びその製造方法の一例について説明した。しかしながら、本発明が上述した内容に限定されることはなく、発明の趣旨に沿って、種々の変更をなすことができる。 The configuration of the electronic component built-in flexible multilayer substrate 100 according to the first embodiment of the present invention and an example of the manufacturing method thereof have been described above. However, the present invention is not limited to the contents described above, and various modifications can be made in accordance with the spirit of the invention.
　例えば、樹脂フィルム３の材質、形状、厚み、層数などは任意であり、上述した内容には限定されない。例えば、樹脂フィルム３の材質として、熱可塑性樹脂に代えて、熱硬化性樹脂を使用することもできる。 For example, the material, shape, thickness, number of layers and the like of the resin film 3 are arbitrary and are not limited to the above-described contents. For example, as the material of the resin film 3, a thermosetting resin can be used instead of the thermoplastic resin.
　また、導電ビア４や配線導体５の形状、形成位置や、内蔵される電子部品２の種類や個数なども任意であり、上述した内容には限定されない。 Further, the shape and formation position of the conductive via 4 and the wiring conductor 5 and the type and number of the built-in electronic component 2 are arbitrary, and are not limited to the above-described contents.
　従って、電子部品２、導電ビア４、配線導体５により構成される電子回路の構成も任意であり、上述した内容には限定されない。 Therefore, the configuration of the electronic circuit constituted by the electronic component 2, the conductive via 4, and the wiring conductor 5 is also arbitrary, and is not limited to the above-described content.
　また、配線導体は、金属箔をエッチングして形成しているが、電子部品内蔵フレキシブル多層基板の最外層の主面には、ソルダレジストでの印刷もしくはフォトリソ加工により配線導体を形成してもよい。 The wiring conductor is formed by etching a metal foil. However, the wiring conductor may be formed by printing with a solder resist or photolithography on the main surface of the outermost layer of the flexible multilayer substrate with built-in electronic components. .
　［第２実施形態］
　図４に、本発明の第２実施形態にかかる電子部品内蔵フレキシブル多層基板２００を示す。 [Second Embodiment]
FIG. 4 shows an electronic component built-in flexible multilayer substrate 200 according to the second embodiment of the present invention.
　電子部品内蔵フレキシブル多層基板２００においては、電子部品１２の側面の一部（端子電極１２ａの一部）のみがフレキシブル多層基板１から露出しており、電子部品１２の上面は、フレキシブル多層基板１から露出していない。すなわち、電子部品１２の上面には、更に樹脂フィルム１３が積層されている。 In the electronic component built-in flexible multilayer substrate 200, only a part of the side surface of the electronic component 12 (a part of the terminal electrode 12a) is exposed from the flexible multilayer substrate 1, and the upper surface of the electronic component 12 is exposed from the flexible multilayer substrate 1. Not exposed. That is, the resin film 13 is further laminated on the upper surface of the electronic component 12.
　電子部品内蔵フレキシブル多層基板２００の他の構成は、図１に示した、第１実施形態にかかる電子部品内蔵フレキシブル多層基板１００と同じである。 Other configurations of the electronic component built-in flexible multilayer substrate 200 are the same as those of the electronic component built-in flexible multilayer substrate 100 according to the first embodiment shown in FIG.
　本実施形態にかかる電子部品内蔵フレキシブル多層基板２００においては、樹脂フィルム１３の表面に配線導体（図示せず）を形成すれば、そこに更に別の電子部品を実装することができる。すなわち、本実施形態にかかる電子部品内蔵フレキシブル多層基板２００によれば、電子部品の更なる高密度実装化が可能になる。 In the electronic component built-in flexible multilayer substrate 200 according to the present embodiment, if a wiring conductor (not shown) is formed on the surface of the resin film 13, another electronic component can be mounted thereon. That is, according to the electronic component built-in flexible multilayer substrate 200 according to the present embodiment, it is possible to mount electronic components at a higher density.
　［第３実施形態］
　図５に、本発明の第３実施形態にかかる電子部品内蔵フレキシブル多層基板３００を示す。 [Third Embodiment]
FIG. 5 shows an electronic component built-in flexible multilayer substrate 300 according to a third embodiment of the present invention.
　電子部品内蔵フレキシブル多層基板３００においては、電子部品２２の上面のみがフレキシブル多層基板１から露出している。すなわち、フレキシブル多層基板１のリジッド領域Ｒの、両主面の最上層に積層された樹脂フィルム２３から、電子部品２２の上面のみが露出している。 In the electronic component built-in flexible multilayer substrate 300, only the upper surface of the electronic component 22 is exposed from the flexible multilayer substrate 1. That is, only the upper surface of the electronic component 22 is exposed from the resin film 23 laminated on the uppermost layer of both main surfaces of the rigid region R of the flexible multilayer substrate 1.
　電子部品内蔵フレキシブル多層基板３００の他の構成は、図１に示した、第１実施形態にかかる電子部品内蔵フレキシブル多層基板１００と同じである。 Other configurations of the electronic component built-in flexible multilayer substrate 300 are the same as those of the electronic component built-in flexible multilayer substrate 100 according to the first embodiment shown in FIG.
　本実施形態にかかる電子部品内蔵フレキシブル多層基板３００においては、電子部品２２から発生する熱を、フレキシブル多層基板１の両主面から効率良く発散させることができる。しかも、電子部品２２の側面は樹脂フィルム３及び２３により覆われるため、電子部品２２はフレキシブル多層基板１内に確実に保持される。 In the electronic component built-in flexible multilayer substrate 300 according to this embodiment, heat generated from the electronic component 22 can be efficiently dissipated from both main surfaces of the flexible multilayer substrate 1. Moreover, since the side surface of the electronic component 22 is covered with the resin films 3 and 23, the electronic component 22 is securely held in the flexible multilayer substrate 1.
　［第４実施形態］
　図６に、本発明の第４実施形態にかかる電子部品内蔵フレキシブル多層基板４００を示す。 [Fourth Embodiment]
FIG. 6 shows an electronic component built-in flexible multilayer substrate 400 according to a fourth embodiment of the present invention.
　電子部品内蔵フレキシブル多層基板４００では、図５に示した第３実施形態にかかる電子部品内蔵フレキシブル多層基板３００に、一部分、変更を加えた。 In the electronic component built-in flexible multilayer substrate 400, a part of the electronic component embedded flexible multilayer substrate 300 according to the third embodiment shown in FIG.
　すなわち、電子部品内蔵フレキシブル多層基板４００においては、フレキシブル多層基板１のリジッド領域Ｒの、一方の主面（図６における上側の主面）の樹脂フィルム２３の上に、更に別の樹脂フィルム３３を積層した。フレキシブル多層基板１のリジッド領域Ｒの、他方の主面（図６における下側の主面）の樹脂フィルム２３には、別の樹脂フィルムは積層せず、樹脂フィルム２３から電子部品２２の上面が露出した状態にした。 That is, in the electronic component built-in flexible multilayer substrate 400, another resin film 33 is formed on the resin film 23 on one main surface (the upper main surface in FIG. 6) of the rigid region R of the flexible multilayer substrate 1. Laminated. Another resin film is not laminated on the resin film 23 on the other main surface (lower main surface in FIG. 6) of the rigid region R of the flexible multilayer substrate 1, and the upper surface of the electronic component 22 extends from the resin film 23. It was exposed.
　すなわち、第４実施形態にかかる電子部品内蔵フレキシブル多層基板４００は、フレキシブル多層基板１のリジッド領域Ｒの、一方の主面（図６における上側の主面）には、配線導体（図示せず）を設けた上で、更に別の電子部品を実装できるようにし、フレキシブル多層基板１のリジッド領域Ｒの、他方の主面（図６における下側の主面）からは、電子部品２２の上面を露出させて、この電子部品２２から発生する熱を効率良く放散させるようにした。すなわち、本実施形態においては、電子部品の高密度実装と、電子部品からの熱の放散の両立を図った。 In other words, the flexible multilayer substrate 400 with built-in electronic components according to the fourth embodiment has a wiring conductor (not shown) on one main surface (the upper main surface in FIG. 6) of the rigid region R of the flexible multilayer substrate 1. In addition, another electronic component can be mounted. From the other main surface (the lower main surface in FIG. 6) of the rigid region R of the flexible multilayer substrate 1, the upper surface of the electronic component 22 is By exposing, the heat generated from the electronic component 22 was efficiently dissipated. That is, in the present embodiment, both high-density mounting of electronic components and heat dissipation from the electronic components are achieved.
１：フレキシブル多層基板
Ｒ：フレキシブル多層基板１のリジッド領域
Ｆ：フレキシブル多層基板１のフレキシブル領域
２、１２、２２：電子部品（コンデンサ）
２ａ、１２ａ、２２ａ：端子電極
３、１３、２３、３３：樹脂フィルム
４：ビア導体
５：配線導体
１４：孔（ビア導体用）
１５：金属箔（銅箔）
１６：エッチングレジスト 1: Flexible multilayer substrate R: Rigid region F of flexible multilayer substrate 1: Flexible regions 2, 12, 22 of flexible multilayer substrate 1: Electronic component (capacitor)
2a, 12a, 22a: terminal electrodes 3, 13, 23, 33: resin film 4: via conductor 5: wiring conductor 14: hole (for via conductor)
15: Metal foil (copper foil)
16: Etching resist

Claims (6)

  1. 　積層された複数の樹脂フィルムと、前記樹脂フィルムの所定の位置に形成されたビア導体と、前記樹脂フィルムの所定の層間に形成された配線導体を備えたフレキシブル多層基板に、電子部品が内蔵された、電子部品内蔵フレキシブル多層基板であって、
    　前記電子部品は、表面の少なくとも一部が、前記フレキシブル多層基板から露出している電子部品内蔵フレキシブル多層基板。     An electronic component is incorporated in a flexible multilayer substrate including a plurality of laminated resin films, via conductors formed at predetermined positions of the resin film, and wiring conductors formed between predetermined layers of the resin film. In addition, a flexible multi-layer substrate with built-in electronic components,
    The electronic component-embedded flexible multilayer substrate in which at least a part of a surface is exposed from the flexible multilayer substrate.
  2. 　前記電子部品の上面の少なくとも一部が、前記フレキシブル多層基板から露出している、請求項１に記載された電子部品内蔵フレキシブル多層基板。 The flexible multilayer substrate with built-in electronic components according to claim 1, wherein at least a part of an upper surface of the electronic component is exposed from the flexible multilayer substrate.
  3. 　前記電子部品の側面の少なくとも一部が、前記フレキシブル多層基板から露出している、請求項１又は２に記載された電子部品内蔵フレキシブル多層基板。 The electronic component built-in flexible multilayer substrate according to claim 1, wherein at least a part of a side surface of the electronic component is exposed from the flexible multilayer substrate.
  4. 　前記電子部品の端子電極の少なくとも一部が、前記フレキシブル多層基板から露出している、請求項１ないし３のいずれか１項に記載された電子部品内蔵フレキシブル多層基板。 The flexible multilayer substrate with built-in electronic components according to any one of claims 1 to 3, wherein at least a part of the terminal electrodes of the electronic component is exposed from the flexible multilayer substrate.
  5. 　前記電子部品は少なくとも２個からなり、少なくとも１個の電子部品は、前記フレキシブル多層基板の一方の主面側に、少なくとも上面の一部を前記フレキシブル多層基板の一方の主面から露出させて、又は、上面を前記フレキシブル多層基板の一方の主面の近傍に配置させて内蔵され、他の少なくとも１個の電子部品は、前記フレキシブル多層基板の他方の主面側に、少なくとも上面の一部を前記フレキシブル多層基板の他方の主面から露出させて、又は、上面を前記フレキシブル多層基板の他方の主面の近傍に配置させて内蔵されている、請求項１ないし４のいずれか１項に記載された電子部品内蔵フレキシブル多層基板。 The electronic component is composed of at least two, and at least one electronic component is exposed on one main surface side of the flexible multilayer substrate, at least a part of the upper surface is exposed from one main surface of the flexible multilayer substrate, Alternatively, the upper surface is disposed in the vicinity of one main surface of the flexible multilayer substrate and is incorporated, and at least one other electronic component has at least a part of the upper surface on the other main surface side of the flexible multilayer substrate. 5. The device according to claim 1, wherein the flexible multilayer substrate is built in such that it is exposed from the other main surface of the flexible multilayer substrate or an upper surface is disposed in the vicinity of the other main surface of the flexible multilayer substrate. Flexible multilayer board with built-in electronic components.
  6. 　前記フレキシブル多層基板の一方の主面側に内蔵された前記電子部品と、前記フレキシブル多層基板の他方の主面側に内蔵された前記電子部品は、前記フレキシブル多層基板を前記樹脂フィルムの積層方向に透視した場合に、少なくとも一部が重なっている、請求項５に記載された電子部品内蔵フレキシブル多層基板。 The electronic component built in one main surface side of the flexible multilayer substrate and the electronic component built in the other main surface side of the flexible multilayer substrate are arranged such that the flexible multilayer substrate is placed in the laminating direction of the resin film. The flexible multilayer board with a built-in electronic component according to claim 5, wherein at least a part thereof overlaps when seen through.
PCT/JP2012/054932 2011-04-14 2012-02-28 Flexible multilayer substrate with built-in electronic components WO2012140964A1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014103141A (en) * 2012-11-16 2014-06-05 Murata Mfg Co Ltd Resin multilayer substrate
CN103879308A (en) * 2012-12-20 2014-06-25 安萨尔多信号和交通系统有限公司 Self-insulated modular power supply line
WO2015166588A1 (en) * 2014-05-02 2015-11-05 株式会社メイコー Rigid-flex substrate with embedded component

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JPH01175296A (en) * 1987-12-28 1989-07-11 Toshiba Corp Multilayer printed circuit board device
JP2006073984A (en) * 2004-09-01 2006-03-16 Samsung Electro Mech Co Ltd Resistor built-in printed circuit board and its manufacturing method
JP2007273654A (en) * 2006-03-31 2007-10-18 Sumitomo Bakelite Co Ltd Flexible circuit board, method for manufacturing the same, and electronic component

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JPS61210696A (en) * 1984-11-14 1986-09-18 インタ−ナシヨナル・スタンダ−ド・エレクトリツク・コ−ポレイシヨン Manufacture of substrate and substrate for supporting electronic component
JPH01175296A (en) * 1987-12-28 1989-07-11 Toshiba Corp Multilayer printed circuit board device
JP2006073984A (en) * 2004-09-01 2006-03-16 Samsung Electro Mech Co Ltd Resistor built-in printed circuit board and its manufacturing method
JP2007273654A (en) * 2006-03-31 2007-10-18 Sumitomo Bakelite Co Ltd Flexible circuit board, method for manufacturing the same, and electronic component

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014103141A (en) * 2012-11-16 2014-06-05 Murata Mfg Co Ltd Resin multilayer substrate
CN103879308A (en) * 2012-12-20 2014-06-25 安萨尔多信号和交通系统有限公司 Self-insulated modular power supply line
CN103879308B (en) * 2012-12-20 2017-04-26 安萨尔多信号和交通系统有限公司 Self-insulated modular power supply line
WO2015166588A1 (en) * 2014-05-02 2015-11-05 株式会社メイコー Rigid-flex substrate with embedded component

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