JP6870184B2 - Printed circuit board and manufacturing method of printed circuit board - Google Patents

Description

The present invention relates to a printed circuit board and a method for manufacturing a printed circuit board.

The performance of electronic devices mounted on printed circuit boards is increasing, and the heat generated from the electronic devices is increasing more and more. If the heat generated from the electronic element is not efficiently dissipated, the performance of the electronic element will deteriorate.

On the other hand, the thickness of the printed circuit board is becoming thinner and thinner due to the thinning of the printed circuit board, and if the heat transferred from the electronic element to the printed circuit board is not efficiently removed, the printed circuit board will be deformed. It will be.

Therefore, research is being conducted on a printed circuit board that can efficiently remove heat generated from an electronic device and prevent deformation due to heat transferred from the device.

Korean Publication No. 10-2005-0025859

According to an embodiment of the present invention, there is provided a printed circuit board capable of efficiently removing heat generated from an electronic device.

Further, according to the embodiment of the present invention, there is provided a printed circuit board in which the deformation rate due to heat transferred from the electronic element is minimized.

It is a figure which shows the printed circuit board which concerns on 1st Example of this invention. It is a figure which shows the printed circuit board which concerns on 2nd Example of this invention. It is a figure which shows the printed circuit board which concerns on 3rd Example of this invention. It is a figure which shows one step for explaining the manufacturing method of the printed circuit board which concerns on 1st Example of this invention. It is a figure which shows the next process of the process of FIG. It is a figure which shows the next process of the process of FIG. It is a figure which shows the next process of the process of FIG. It is a figure which shows the next process of the process of FIG. It is a figure which shows the next process of the process of FIG. It is a figure which shows a part in the manufacturing process for demonstrating the manufacturing method of the printed circuit board which concerns on 2nd Embodiment of this invention. It is a figure which shows a part in the manufacturing process for demonstrating the manufacturing method of the printed circuit board which concerns on 2nd Embodiment of this invention. It is a figure which shows a part in the manufacturing process for demonstrating the manufacturing method of the printed circuit board which concerns on 3rd Example of this invention. It is a figure which shows a part in the manufacturing process for demonstrating the manufacturing method of the printed circuit board which concerns on 3rd Example of this invention.

The terms used in the present application are used solely for the purpose of explaining a specific embodiment and do not limit the present invention. A singular expression includes multiple expressions unless explicitly mentioned in the sentence. In the present application, terms such as "including" or "having" specify the existence of features, numbers, steps, actions, components, parts, or a combination thereof described in the specification. It must be understood that it does not preclude the existence or addability of one or more other features or numbers, steps, actions, components, components or combinations thereof. Further, in the entire specification, "above" means that it is located above or below the target portion, and does not necessarily mean that it is located above or above the gravity direction.

Further, "coupling" does not mean only the case where physical direct contact is made between each component in the contact relationship between the components, and other components are interposed between the components. , And other components are used as a comprehensive concept even when the components are in contact with each other.

The size and thickness of each configuration shown in the figure are arbitrarily shown for convenience of explanation, and the present invention is not necessarily limited to the one shown in the figure.

Hereinafter, an embodiment of a printed circuit board and a printed circuit board according to the present invention will be described in detail with reference to the accompanying drawings, and in the description with reference to the attached drawings, the same or corresponding components will be designated by the same drawing number. It will be added and duplicate explanations for this will be omitted.

<Printed circuit board>
1st Example FIG. 1 is a diagram showing a printed circuit board according to the first embodiment of the present invention.

Referring to FIG. 1, the printed circuit board 1000 according to the first embodiment of the present invention includes a core 100, an insulating portion 200, and a via 300.

The core 100 can be formed in the central portion of the printed circuit board 1000 according to the present embodiment. The core 100 includes a reinforcing portion 110, a via connecting portion 120, and a cutting portion 130 that separates the reinforcing portion 110 and the via connecting portion 120.

The reinforcing portion 110 can impart rigidity to the printed circuit board 1000 according to the present embodiment and prevent the printed circuit board 1000 according to the present embodiment from warping. Therefore, the reinforcing portion 110 may use a material different from that of the via connecting portion 120, and may include a first metal having a rigidity of a certain level or more and a coefficient of thermal expansion of a certain level or less.

The first metal may be Invar, but is not limited thereto. That is, as the first metal, a metal other than Invar can be used as long as it satisfies the rigidity and the coefficient of thermal expansion required for the printed circuit board 1000 according to the present embodiment.

In this embodiment, the reinforcing portion 110 is formed of a rigid reinforcing layer 111 formed of a first metal having excellent rigidity and a heat radiating layer formed of a second metal having excellent thermal conductivity and laminated on the rigid reinforcing layer 111. Includes 113 and. Here, the second metal may be copper (Cu), but is not limited thereto. That is, as the second metal, a metal other than copper (Cu) can be used as long as it satisfies the thermal conductivity required for the printed circuit board 1000 according to the present embodiment.

In this embodiment, the rigidity reinforcing layer 111 and the heat radiating layer 113 can be alternately laminated. Specifically, the reinforcing portion 110 may have a structure in which the second metal / first metal / second metal are sequentially laminated in this order from the lower part. In this case, since the reinforcing portion 110 contains a second metal that is advantageous for heat dissipation on both sides, the printed circuit board 1000 according to the present embodiment quickly dissipates heat transferred from electronic components in the horizontal direction of the board. Can be done.

On the other hand, for higher strength reinforcement, the reinforcing portion 110 may have a structure in which the first metal / second metal / first metal are sequentially laminated from the lower part.

The via connecting portion 120 is a portion connected to the via 300 penetrating the insulating portion 200, and in the printed circuit board 1000 according to the present embodiment, the heat transferred is more than a certain level in order to efficiently release the heat. It can be made of a metal having conductivity. Further, in this embodiment, the via 300 can be connected to the upper portion and the lower portion of the via connecting portion 120, respectively. As a result, the heat transferred through the one-side via 300 can be rapidly released to the other-side via via the via connection portion 120 having high thermal conductivity. That is, the printed circuit board 1000 according to the present embodiment can quickly dissipate the heat transferred from the electronic components in the direction of passing through the substrate. Here, the metal constituting the via connection portion 120 may be copper (Cu), but is not limited thereto. That is, if the thermal conductivity required for the printed circuit board 1000 according to this embodiment is satisfied, a metal other than copper (Cu) can be used.

On the other hand, the via connection portion 120 may further include Invar to reinforce the rigidity of the substrate. Here, the via connection portion 120 can be formed in a multilayer structure in which Invar and copper (Cu) are alternately laminated.

The cutting portion 130 separates the reinforcing portion 110 and the via connecting portion 120. That is, the cutting portion 130 physically separates the reinforcing portion 110 having the property of electrical conduction and the via connecting portion 120 by penetrating the core 100. An insulating portion 200, which will be described later, is formed in the cut portion 130, and the insulating portion 200 is formed in the cut portion 130 to electrically separate (insulate) the reinforcing portion 110 and the via connecting portion 120.

On the other hand, FIG. 1 shows three reinforcing portions 110 and two via connecting portions 120, and a via connecting portion 120 is formed between adjacent reinforcing portions 110, but this is only an example. .. That is, the number of the reinforcing portion 110 and the via connecting portion 120 included in the core 100, and the arrangement structure of the reinforcing portion 110 and the via connecting portion 120 can be changed arbitrarily or as necessary. For example, a plurality of reinforcing portions 110 can be arranged so as to surround the via connecting portion 120. As a result, the heat transferred to the via connecting portion 120 via the via 300 can be quickly dissipated through the adjacent via connecting portion 120.

The insulating portion 200 is also formed in the cutting portion 130 so as to cover the core 100 and insulate the reinforcing portion 110 and the via connecting portion 120. The insulating portion 200 can be formed by using an ordinary insulating resin. That is, the insulating portion 200 may be an insulating resin (prepreg) impregnated with a reinforcing material or an insulating resin (build-up film) containing an inorganic filler. Further, the insulating portion 200 can include a thermosetting resin or a photosensitive resin.

The via 300 is formed through the insulating portion 200 so as to connect to the core 100. As shown in FIG. 1, the via 300 can be connected to the via connection portion 120 of the core 100. The via 300 can be formed of copper (Cu) having excellent thermal conductivity, but is not limited thereto. When the substance constituting the via 300 and the second metal are the same, the binding force between the core 100 and the via 300 can be increased.

The via 300 is connected to the core 100, and the heat transferred to the printed circuit board 1000 according to this embodiment can be dissipated to the upper part or the lower part. As an example, when an electronic component is mounted on the upper portion of the printed circuit board 1000 according to the present embodiment, the heat generated from the electronic component can be dissipated to the lower portion via the via 300 and the via connection portion 120.

The size of the lower part of the via 300 may be formed smaller than the upper part of the via connection portion 120. In this case, due to the tolerance generated between the steps, the via 300 formed in the insulating portion 200 can be connected to the via connecting portion 120 even if the position of the via 300 deviates from the initially target position of the insulating portion 200.

On the other hand, FIG. 1 shows that the via 300 is connected only to the via connection portion 120, but this is only an example. That is, the via 300 can be connected not only to the via connecting portion 120 but also to the reinforcing portion 110. In this case, since the heat generated in the electronic component is also transmitted through the reinforcing portion 110, the heat dissipation function of the printed circuit board 1000 according to the present embodiment can be improved.

Further, although not shown in FIG. 1, one or more build-up layers can be formed on at least one of the upper portion and the lower portion of the insulating portion 200.

Second Example FIG. 2 is a diagram showing a printed circuit board according to a second embodiment of the present invention.

Referring to FIG. 2, the printed circuit board 2000 according to the second embodiment of the present invention includes the core 100, the insulating portion 200, and the via 300, similarly to the printed circuit board 1000 according to the first embodiment of the present invention. However, the reinforcing portions 110 are different from each other.

The reinforcing portion 110 applied to the printed circuit board 2000 according to the present embodiment is formed of a rigid reinforcing layer 111 made of a first metal and a rigid reinforcing layer 111 formed of a second metal to cover the rigid reinforcing layer 111. Includes a heat dissipation layer 115 that surrounds the. Unlike the first embodiment, in this embodiment, the heat radiating layer 115 also covers the side surface of the rigid reinforcing layer 111. In this case, since the proportion of the second metal having a relatively excellent thermal conductivity in the reinforcing portion 110 increases, the heat dissipation performance of the printed circuit board 2000 according to the present embodiment can be improved.

Third Example FIG. 3 is a diagram showing a printed circuit board according to a third embodiment of the present invention.

Referring to FIG. 3, the printed circuit board 3000 according to the third embodiment of the present invention includes the same configuration as the printed circuit board 1000 according to the first embodiment of the present invention, and further includes an electronic element 400.

The electronic element 400 is embedded in the insulating portion 200. That is, the electronic element 400 can be embedded in the insulating portion 200 together with the reinforcing portion 110 and the via connecting portion 120. The electronic element 400 may be an active element such as an IC chip or a passive element such as a capacitor. Roughness may be formed on the outer surface of the electronic element 400 embedded in the insulating portion 200 in order to improve the coupling force with the insulating portion 200.

The electronic element 400 can be electrically and / or thermally connected to a circuit pattern formed outside the insulating material via a via 300 formed on the insulating material and a connection terminal of the electronic element 400.

On the other hand, although there is one electronic element 400 in FIG. 3, this is merely an example, and a plurality of electronic elements 400 can be embedded in the insulating portion 200. In this case, the plurality of electronic elements 400 may be the same type of electronic elements 400, or may be different types of electronic elements 400 from each other.

In the printed circuit board 3000 according to this embodiment, since the electronic element 400 is embedded in the insulating portion 200, the thickness of the package can be reduced.

<Manufacturing method of printed circuit board>
1st Example FIG. 4 to 9 is a diagram showing sequentially the manufacturing process in order to explain the manufacturing method of the printed circuit board according to the first embodiment of the present invention.

Referring to FIGS. 4 to 6, the method of manufacturing the printed circuit board 1000 according to the present embodiment includes a reinforcing portion 110, a via connecting portion 120, and a cutting portion 130 that separates the reinforcing portion 110 and the via connecting portion 120. Includes steps to form the core 100.

The steps of forming the core 100 include a step of embedding a plurality of embedded members 10 made of the first metal in a metal plate 20 made of a second metal to form a core metal plate 30, and a core on one surface of a carrier member 40. A step of adhering the metal plate 30 and a step of removing a part of the core metal plate 30 to form the cut portion 130 can be included.

First, referring to FIG. 4, the core metal plate 30 is formed. The core metal plate 30 of this embodiment is formed by embedding a plurality of embedded members 10 made of a first metal having excellent rigidity in a metal plate 20 made of a second metal having excellent thermal conductivity. To. After a plurality of embedded members 10 are arranged apart from each other by using an intermediate member (not shown), a second metal can be formed along the surface of the embedded member 10 including between adjacent embedded members 10. The metal plate 20 can be formed by plating, but is not limited to this. That is, the metal plate 20 can also be formed by using a metal paste containing a second metal.

Next, as shown in FIG. 5, the core metal plate 30 is attached to one surface of the carrier member 40. The dotted line shown in FIG. 5 indicates the region where the cut portion 130 shown in FIG. 6 is formed.

After that, as shown in FIG. 6, a cut portion 130 is formed on the core metal plate 30. When the cut portion 130 is formed on the core metal plate 30, the reinforcing portion 110 and the via connecting portion 120 of the printed circuit board 1000 according to the first embodiment of the present invention are formed.

The cut portion 130 can be formed by selectively etching the core metal plate 30. In this case, an etching resist pattern is formed on the core metal plate 30, and the region of the core metal plate 30 exposed from the open portion of the etching resist pattern can be etched.

The cut portion 130 is formed on the core metal plate 30 so that the side surface of the embedded member 10 is exposed. Therefore, the reinforcing portion 110 of the printed circuit board 1000 according to the first embodiment of the present invention is formed of a rigid reinforcing layer 111 made of a first metal and a second metal, and is formed on the upper surface and the lower surface of the rigid reinforcing layer 111. It has a structure including a heat radiating layer 113 to be laminated, respectively.

Referring to FIGS. 7 and 8, the method of manufacturing the printed circuit board 1000 according to this embodiment includes a step of forming an insulating portion 200 that fills the cut portion 130.

First, as shown in FIG. 7, the first insulating layer 210 is formed on one surface of the carrier member 40, and then the carrier member 40 is removed from the first insulating layer 210.

The first insulating layer 210 can be formed by using a normal interlayer insulating material in a semi-cured (B-stage) state. That is, the first insulating layer 210 can be formed by using an insulating material (prepreg) impregnated with glass fibers or an insulating material (build-up film or the like) containing a filler. Further, the first insulating layer 210 can also be formed of a thermosetting resin or a photosensitive resin.

The first insulating layer 210 can be formed by laminating the above-mentioned insulating material on one surface of the carrier member 40 and then heating and pressurizing the first insulating layer 210, but the first insulating layer 210 is not limited to this. That is, the first insulating layer 210 can also be formed by applying a liquid insulating material on one surface of the carrier member 40 and then curing the liquid insulating material.

After the first insulating layer 210 is formed, the carrier member 40 can be removed from the first insulating layer 210.

Next, as shown in FIG. 8, the second insulating layer 230 is formed on one surface of the first insulating layer 210 from which the carrier member 40 has been removed. The second insulating layer 230 can be formed by using a normal interlayer insulating material in a semi-cured (B-stage) state. That is, the second insulating layer 230 can be formed by using an insulating material (prepreg) impregnated with glass fibers or an insulating material (build-up film or the like) containing a filler. The second insulating layer 230 can also be formed of a thermosetting resin or a photosensitive resin.

On the other hand, the first insulating layer 210 and the second insulating layer 230 may be formed of the same type of insulating material or different types of insulating materials. As an example of the former, the first insulating layer 210 and the second insulating layer 230 can all be formed of a build-up film. As an example of the latter, the first insulating layer 210 can be formed of a build-up film and the second insulating layer 230 can be formed of a prepreg. Further, the first insulating layer 210 can be formed of a thermosetting resin, and the second insulating layer 230 can be formed of a photosensitive resin.

Referring to FIG. 9, the method of manufacturing the printed circuit board 1000 according to this embodiment includes a step of forming a via 300 in the insulating portion 200.

The via 300 can be formed by forming a via hole in the insulating portion 200 and then filling the via hole with a conductive substance. As an example, a via hole can be formed in the insulating portion 200 by using a laser drill, and the via hole can be plated with a conductive substance to form the via 300. However, the method of forming the via hole is not limited to the above example. That is, when the insulating portion 200 is made of a photosensitive resin, via holes can also be formed by photolithography. Further, the method of filling the via hole with the conductive substance is not limited to the above example. That is, the via 300 can be formed by filling the via hole with the conductive paste.

Although not shown in FIG. 9, a circuit pattern can be formed on at least one of the upper surface and the lower surface of the insulating portion 200 at the same time when the via hole is filled with the conductive substance.

2nd Example FIGS. 10 to 11 are diagrams showing a part of a manufacturing process for explaining a method of manufacturing a printed circuit board according to a second embodiment of the present invention.

Referring to FIGS. 5 and 10, the method for manufacturing the printed circuit board 2000 according to the present embodiment selectively removes the core metal as compared with the method for manufacturing the printed circuit board 1000 according to the first embodiment of the present invention. The area and area of the plate 30 are different.

That is, in the method for manufacturing a printed circuit board according to the first embodiment of the present invention, the core metal plate 30 is selectively removed so that the side surface of the embedded member 10 is exposed, but the printed circuit board according to the present embodiment is removed. In the manufacturing method of, the core metal plate 30 is selectively removed so that the side surface of the embedded member 10 is not exposed.

With reference to FIG. 11, since the second metal having a relatively excellent thermal conductivity is manufactured in a form of covering the first metal constituting the embedded member 10, the heat dissipation performance can be improved. That is, the reinforcing portion 110 applied to this embodiment has a structure in which the heat radiating layer 115 formed of the second metal covers the rigid reinforcing layer 111 formed of the first metal.

Third Example FIGS. 12 to 13 are diagrams showing a part of a manufacturing process for explaining a manufacturing method of a printed circuit board according to a third embodiment of the present invention.

With reference to FIGS. 5 and 12, the method for manufacturing the printed circuit board 3000 according to the present embodiment selectively removes the core metal as compared with the method for manufacturing the printed circuit board 1000 according to the first embodiment of the present invention. The area and area of the plate 30 are different.

That is, in the method for manufacturing a printed circuit board according to the present embodiment, the cavity 140 in which the electronic element 400 is mounted is formed in the core metal plate 30. The cavity 140 can be formed by using any one of the methods for forming the cut portion 130 described above.

Referring to FIG. 13, the electronic element 400 can be attached to one surface of the carrier member 40 together with the reinforcing portion 110 and the via connecting portion 120.

Since the electronic element 400 is embedded in the insulating portion in the subsequent process, the printed circuit board 3000 manufactured in this embodiment can be made thinner.

An embodiment of the present invention has been described above, but if the person has ordinary knowledge in the technical field, addition or modification of components is made within a range that does not deviate from the idea of the present invention described in the claims. Alternatively, the present invention can be modified and changed in various ways by deletion or the like, and it can be said that this is also included in the scope of the present invention.

10 Embedded member 20 Metal plate 30 Core Metal plate 40 Carrier member 100 Core 110 Reinforcement part 111 Rigid reinforcement layer 113, 115 Heat dissipation layer 120 Via connection part 130 Cutting part 140 Cavity 200 Insulation part 210 First insulation layer 230 Second insulation layer 300 Via 400 Electronic element 1000, 2000, 3000 Printed circuit board

Claims (11)

A core comprising a via connection and a material different from the via connection and having a reinforcing portion disposed apart from the via connection.
An insulating portion that insulates the via connection portion and the reinforcing portion and covers the core,
Including vias formed through the insulating portion so as to connect to the via connecting portion.
The reinforcing portion includes a rigid reinforcing layer formed of Invar and a heat radiating layer formed of copper (Cu).
The via connection portion has a multi-layer structure, and is a printed circuit board in which Invar and copper (Cu) are alternately laminated. The printed circuit board according to claim 1 , wherein the rigid reinforcing layer and the heat radiating layer are alternately laminated. The printed circuit board according to claim 2 , wherein the heat radiating layer is formed so as to surround the rigid reinforcing layer in order to cover the rigid reinforcing layer. The printed circuit board according to any one of claims 1 to 3 , further comprising an electronic element embedded in the insulating portion. The printed circuit board according to any one of claims 1 to 4, further comprising a via connected to the reinforcing portion. The printed circuit board according to any one of claims 1 to 5 , wherein the reinforcing portion is a plurality, and is arranged so as to surround the via connecting portion. A step of forming a core including a via connection portion, a reinforcing portion containing a material different from the via connection portion, and a cutting portion for separating the via connection portion and the reinforcing portion.
A step of forming an insulating portion that is filled in the cut portion and covers the core,
A step of forming a via that penetrates the insulating portion and connects to the via connecting portion.
A method of manufacturing a printed circuit board including. The step of forming the core is
A step of embedding a plurality of embedded members formed of the first metal in a metal plate formed of the second metal to form a core metal plate, and a step of forming the core metal plate.
The step of adhering the core metal plate to one surface of the carrier member,
The method for manufacturing a printed circuit board according to claim 7 , further comprising a step of removing a part of the core metal plate to form the cut portion. The method for manufacturing a printed circuit board according to claim 8 , wherein the first metal is Invar, and the second metal is copper (Cu). The method for manufacturing a printed circuit board according to claim 8 or 9 , further comprising a step of forming a cavity in the core metal plate so that an electronic component is mounted on the core metal plate. The step of forming the insulating portion is
Steps to attach the core to one side of the carrier member,
A step of laminating a first insulating layer on the carrier member so that the cut portion is filled.
A step of removing the carrier member from the first insulating layer,
The method for manufacturing a printed circuit board according to any one of claims 7 to 10 , further comprising a step of forming a second insulating layer on one surface of the first insulating layer from which the carrier member has been removed.

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