WO2012138139A3 - 인쇄 조성물 및 이를 이용한 인쇄 방법 - Google Patents

인쇄 조성물 및 이를 이용한 인쇄 방법 Download PDF

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Publication number
WO2012138139A3
WO2012138139A3 PCT/KR2012/002563 KR2012002563W WO2012138139A3 WO 2012138139 A3 WO2012138139 A3 WO 2012138139A3 KR 2012002563 W KR2012002563 W KR 2012002563W WO 2012138139 A3 WO2012138139 A3 WO 2012138139A3
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WO
WIPO (PCT)
Prior art keywords
printing
boiling point
solvent
same
composition
Prior art date
Application number
PCT/KR2012/002563
Other languages
English (en)
French (fr)
Other versions
WO2012138139A2 (ko
Inventor
손용구
황지영
구범모
황인석
이승헌
전상기
성지현
김주연
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to JP2014503597A priority Critical patent/JP5756563B2/ja
Priority to US14/007,543 priority patent/US20140007786A1/en
Priority to CN201280017343.8A priority patent/CN103562326B/zh
Publication of WO2012138139A2 publication Critical patent/WO2012138139A2/ko
Publication of WO2012138139A3 publication Critical patent/WO2012138139A3/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09D161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/10—Intaglio printing ; Gravure printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask

Abstract

본 출원은 실리콘계 블랭킷을 이용하는 인쇄 방법에 사용되기 위한 조성물로서, 1) 바인더 수지, 2) 끓는 점이 100℃ 이하의 저비점 용매, 및 3) 끓는 점이 180℃ 이상의 고비점 용매를 포함하고, 상기 고비점 용매가 상기 바인더 수지와의 용해도 파라미터 차이가 3 (cal.cm)1/2 이하이고, 상기 실리콘계 블랭킷과의 용해도 파라미터의 차이가 4 (cal.cm)1/2 이상이며, 상기 실리콘계 블랭킷에 대한 스웰링 파라미터가 2 이하인 것을 특징으로 하는 인쇄 조성물 및 이를 이용한 인쇄 방법에 관한 것이다.
PCT/KR2012/002563 2011-04-05 2012-04-05 인쇄 조성물 및 이를 이용한 인쇄 방법 WO2012138139A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014503597A JP5756563B2 (ja) 2011-04-05 2012-04-05 印刷組成物及びこれを利用した印刷方法
US14/007,543 US20140007786A1 (en) 2011-04-05 2012-04-05 Composition for printing and printing method using the same
CN201280017343.8A CN103562326B (zh) 2011-04-05 2012-04-05 用于印刷的组合物及使用该组合物的印刷方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20110031365 2011-04-05
KR10-2011-0031365 2011-04-05

Publications (2)

Publication Number Publication Date
WO2012138139A2 WO2012138139A2 (ko) 2012-10-11
WO2012138139A3 true WO2012138139A3 (ko) 2013-01-10

Family

ID=46969685

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/002563 WO2012138139A2 (ko) 2011-04-05 2012-04-05 인쇄 조성물 및 이를 이용한 인쇄 방법

Country Status (6)

Country Link
US (1) US20140007786A1 (ko)
JP (1) JP5756563B2 (ko)
KR (1) KR101356896B1 (ko)
CN (1) CN103562326B (ko)
TW (1) TWI462977B (ko)
WO (1) WO2012138139A2 (ko)

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TWI556987B (zh) * 2013-08-01 2016-11-11 Ｌｇ化學股份有限公司 平板印刷用毯及使用彼所製造之微細圖案
KR101649036B1 (ko) * 2013-08-21 2016-08-17 주식회사 엘지화학 오프셋 인쇄 조성물, 이를 이용한 인쇄방법 및 오프셋 인쇄 조성물을 이용하여 형성된 패턴
CN106029795B (zh) * 2014-03-06 2019-04-19 株式会社Lg化学 胶版印刷组合物、使用该胶版印刷组合物的印刷方法和包括该胶版印刷组合物的图案
KR101789862B1 (ko) 2014-10-07 2017-10-25 주식회사 엘지화학 인쇄용 잉크 조성물 및 이를 이용한 인쇄 방법
KR101657076B1 (ko) * 2015-06-25 2016-09-20 주식회사 네패스 미세 패턴의 형성 방법
US10338231B2 (en) * 2015-11-30 2019-07-02 Trimble Inc. Hardware front-end for a GNSS receiver
KR101707372B1 (ko) * 2016-04-22 2017-02-15 주식회사 엘지화학 리버스 오프셋 인쇄 조성물 및 이를 이용한 인쇄 방법
KR102640436B1 (ko) * 2021-08-02 2024-02-27 재단법인대구경북과학기술원 리버스 오프셋 인쇄용 잉크 조성물 및 이의 이용한 리버스 오프셋 인쇄 방법

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JP2006037057A (ja) * 2004-07-30 2006-02-09 Hitachi Chem Co Ltd 印刷インキ組成物、凸版反転オフセット法、レジストパターンの形成法、電子部品の製造法及び電子部品
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Also Published As

Publication number Publication date
KR101356896B1 (ko) 2014-02-06
TW201305285A (zh) 2013-02-01
CN103562326A (zh) 2014-02-05
JP5756563B2 (ja) 2015-07-29
TWI462977B (zh) 2014-12-01
CN103562326B (zh) 2016-01-20
WO2012138139A2 (ko) 2012-10-11
KR20120113682A (ko) 2012-10-15
US20140007786A1 (en) 2014-01-09
JP2014516372A (ja) 2014-07-10

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