WO2012136011A1 - 发光二极管封装构造 - Google Patents

发光二极管封装构造 Download PDF

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Publication number
WO2012136011A1
WO2012136011A1 PCT/CN2011/073299 CN2011073299W WO2012136011A1 WO 2012136011 A1 WO2012136011 A1 WO 2012136011A1 CN 2011073299 W CN2011073299 W CN 2011073299W WO 2012136011 A1 WO2012136011 A1 WO 2012136011A1
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WO
WIPO (PCT)
Prior art keywords
light
package structure
housing
led package
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2011/073299
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English (en)
French (fr)
Inventor
张光耀
郑巍巍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US13/130,120 priority Critical patent/US8426873B2/en
Publication of WO2012136011A1 publication Critical patent/WO2012136011A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Definitions

  • the present invention relates to a light emitting diode package structure, and more particularly to a light emitting diode package structure having a light transmissive package portion having an uneven surface.
  • Liquid crystal display Display LCD
  • LCD Liquid crystal display Display
  • FPD Fluorescence-to-CIE 1931
  • the liquid crystal material of the liquid crystal display cannot be self-illuminated, and the light source must be externally provided. Therefore, a backlight module is required in the liquid crystal display to provide a desired light source.
  • the backlight module can be divided into a side-in type backlight module and a direct-lit backlight module.
  • a backlight module mainly uses a cold cathode fluorescent lamp (CCFL), a hot cathode fluorescent lamp (HCFL), and a semiconductor light emitting element as a light source, and a semiconductor light emitting element mainly emits light by using a light emitting diode (LED), which is compared with a cathode.
  • CCFL cold cathode fluorescent lamp
  • HCFL hot cathode fluorescent lamp
  • LED light emitting diode
  • Fluorescent tubes are more energy efficient, longer lasting, and more compact, which has a tendency to gradually replace cathode fluorescent tubes.
  • the light-emitting diodes are mostly packaged in the form of chips to form an LED package structure, and then bonded to the fixing plate of the backlight module.
  • the type of LED package structure is classified according to the characteristics of the color of the light, the material of the grain, the brightness of the light, the size and the like.
  • a single die generally constitutes a point source
  • a plurality of die assemblies generally constitute a surface source and a line source for information, status indication, and display.
  • the illuminating display is also formed by combining a plurality of crystal grains by a series or parallel connection of the dies with a suitable optical structure to constitute a illuminating section and a illuminating point of the illuminating display.
  • the surface-adhesive package type LED (SMD-LED) is attached to the surface of the circuit board and is suitable for surface-to-surface (SMT) processing, because reflow soldering can be performed to solve brightness, viewing angle, flatness, reliability, consistency, etc. problem.
  • SMT surface-to-surface
  • the carbon steel material pin of the in-line LED is removed, so that the reflective layer needs to be filled with less epoxy resin, and the surface of the packaged LED can be sealed. Reduce the weight of the product by half, and ultimately make the application more perfect. Therefore, the surface-adhesive package type LED has gradually replaced the lead-type LED, and the application design is more flexible, especially in the LED display market, which has a certain share and has an accelerated development trend.
  • FIG. 1 is a cross-sectional view showing a conventional light emitting diode package structure.
  • a conventional LED package structure 90 includes a housing 91 , a first electrode sheet 92 , a second electrode sheet 93 , an LED chip 94 , and a light transmissive package portion 95 .
  • the upper surface of the housing 91 is provided with a recess 911; a portion of the first electrode piece 92 is disposed at the bottom of the recess 911, and another portion extends outside the housing 91 for electrical use with the outside. connection.
  • a portion of the second electrode sheet 93 is disposed at the bottom of the recess 911, and another portion extends outside the housing 91 for electrical connection with the outside.
  • the LED chip 94 has a first electrode (not shown) and a second electrode (not shown).
  • the LED chip 94 is disposed in the recess 911, and the first electrode is electrically connected to the first electrode.
  • the second electrode is electrically connected to the second electrode sheet 93 through a first lead 96; the transparent encapsulating portion 95 encloses the recess 911, and encapsulates each of the recesses 911
  • the light of the light-emitting diode chip 94 can be emitted upward through the light-transmissive encapsulation portion 95.
  • the housing 91 is designed to be ideal for the surface of the light transmissive package 95 to be horizontal.
  • the transparent encapsulating portion 95 is actually The surface is in a state of being depressed at the center portion thereof. Since the refractive index of the light-transmissive encapsulating portion 95 is greater than the refractive index of the air, when the light passes from the inside to the outside through the interface between the surface of the light-transmitting encapsulating portion 95 and the air, a part of the light is totally reflected. Even if these totally reflected light rays are reflected from the wall surface of the recessed portion 911 and then emitted from the light-transmitting package portion 95, the light is attenuated and the light-emitting rate of the light is affected.
  • FIG. 2 is a cross-sectional view showing another conventional LED package structure.
  • the LED package structure 90' of FIG. 2 is substantially the same as the LED package structure 90 of FIG. 1, except that the light-transmissive package portion 95' of the LED package structure 90' of FIG. 2 has a
  • the design of the convex lens avoids the above-mentioned light attenuation due to the effect of total reflection, and can more efficiently emit light at a large viewing angle. However, this will increase the manufacturing cost of the light-transmitting package portion 95'.
  • subsequent SMT or other manufacturing processes of the LED package construction 90' are disadvantageous.
  • the invention provides a light emitting diode package structure to solve the problem of light efficiency of the foregoing light emitting diode package structure.
  • a main object of the present invention is to provide an LED package structure in which a plurality of protrusions are provided in a recess of a housing or on an edge of the housing to make the surface of the light-transmissive package portion have irregularities.
  • the shape increases the diffusion angle of the light and improves the light extraction efficiency of the light.
  • Another object of the present invention is to provide an LED package structure that further changes and controls the viewing angle of the light emitted by the LED package structure by different arrangements of the plurality of protrusions, so as to be suitable for different use requirements.
  • Another object of the present invention is to provide an LED package construction that facilitates pick-and-place by suction of the tip by the arrangement of the projections or bosses, making the manufacturing process suitable for general surface-attachment techniques.
  • an LED package construction comprising:
  • a housing having a recess and a plurality of protrusions
  • a light-transmissive encapsulation portion encapsulating a recess of the housing and covering the light-emitting diode chip in the recess, the light-transmissive package portion having an uneven surface.
  • the plurality of protrusions are located on a bottom surface of the recess, and the protrusion is higher than an edge of the housing.
  • the light-transmitting package portion encapsulates the protruding portion.
  • the plurality of protrusions are in the shape of a cone, arranged in a circular array or mirror-symmetrically with respect to the LED chip.
  • the plurality of protrusions have a plate shape and are arranged in mirror symmetry with respect to the LED chip.
  • the housing further includes at least one boss, the height of the boss being greater than the height of the plurality of protrusions.
  • the surface of the projection has a reflective layer.
  • an LED package structure comprising:
  • a housing having a recess and a plurality of protrusions, the peripheral edge of the housing extending upward to form the plurality of protrusions;
  • a light-transmissive encapsulation portion encapsulating a recess of the housing and covering the light-emitting diode chip in the recess, the light-transmissive package portion having an uneven surface.
  • the plurality of protrusions are located on opposite sides of the recess and are arranged in a multi-step shape that is lower on the highest side of the center.
  • the plurality of protrusions are radially arranged.
  • an LED package structure comprising:
  • a housing having a recess and a plurality of protrusions, the plurality of protrusions being located on a bottom surface of the recess, and the protrusion being higher than an edge of the housing;
  • An LED chip disposed in the recess of the housing
  • a light-transmissive encapsulating portion enclosing a concave portion and a protruding portion of the casing, and covering the light-emitting diode chip in the concave portion, the light-transmitting packaging portion having an uneven surface;
  • At least one boss having a height greater than a height of the plurality of protrusions.
  • the invention provides an LED package structure, which comprises a casing, an LED chip and a light-transmissive package.
  • the housing has a recessed portion and a plurality of protruding portions, and the LED chip is disposed on the recessed portion and covers the transparent encapsulating portion in the recessed portion, and the plurality of protruding portions are disposed at the In the recess or on the edge of the housing.
  • the plurality of protrusions are formed such that the surface of the light-transmissive package portion has an uneven shape, thereby increasing the diffusion angle of the light and improving the light-emitting efficiency of the light.
  • the invention provides an LED package structure, which comprises a casing, an LED chip and a light-transmissive package.
  • the housing has a recessed portion and a plurality of protruding portions, and the LED chip is disposed on the recessed portion and covers the transparent encapsulating portion in the recessed portion, and the plurality of protruding portions are disposed at the In the recess or on the edge of the housing.
  • the plurality of protrusions are formed such that the surface of the light-transmissive package portion has an uneven shape, thereby increasing the diffusion angle of the light and improving the light-emitting efficiency of the light.
  • Figure 1 A cross-sectional view of a prior art LED package construction.
  • Figure 2 A cross-sectional view of another prior art LED package construction.
  • 3A is a perspective view of a housing and an LED chip of a first embodiment of the LED package construction of the present invention.
  • Figure 3B is a cross-sectional view showing a first embodiment of the light emitting diode package construction of the present invention.
  • FIG. 4 is a perspective view of a housing and an LED chip of a second embodiment of the LED package construction of the present invention.
  • FIG. 5 is a perspective view of a housing and an LED chip of a third embodiment of the LED package construction of the present invention.
  • FIG. 6A is a perspective view of a housing and an LED chip of a fourth embodiment of the LED package construction of the present invention.
  • Figure 6B is a cross-sectional view showing a fourth embodiment of the light emitting diode package construction of the present invention.
  • FIG. 7 is a perspective view of a casing and an LED chip of a fifth embodiment of the LED package construction of the present invention.
  • FIG. 8 is a perspective view of a housing and an LED chip of a sixth embodiment of the LED package construction of the present invention.
  • FIG. 3A is a perspective view of a housing and an LED chip of a first embodiment of an LED package structure according to the present invention
  • FIG. 3B is a cross-sectional view of the first embodiment of the LED package structure of the present invention.
  • the LED package structure 10 includes a housing 11 , a first electrode sheet 12 , a second electrode sheet 13 , an LED chip 14 , and a light-transmissive package portion 15 .
  • the housing 11 has a recess 111, and the recess 111 is a recessed structure, and its shape can be adjusted correspondingly according to product requirements.
  • the housing 11 further includes a plurality of protrusions 16 disposed on a bottom surface of the recess 111 of the housing 11, and the protrusions 16 are circumferentially arranged.
  • the plurality of protrusions 16 are in the shape of a cone and are higher than the edge of the casing 11.
  • the surface of the protrusion 16 has a reflective layer (not shown).
  • a portion of the first electrode sheet 12 is disposed in the housing 11 and another portion thereof extends outside the housing 11 for electrical connection with the outside.
  • a portion of the second electrode sheet 13 is disposed in the housing 11 and another portion thereof extends outside the housing 11 for electrical connection with the outside.
  • the LED chip 14 has a first electrode (not shown) and a second electrode (not shown).
  • the LED chip 14 is disposed in the recess 111, and the LED chip 14 is located in the protrusion. The center of the circumference formed by the portion 16 is.
  • the first electrode of the LED chip 14 is electrically connected to the first electrode sheet 12
  • the second electrode is electrically connected to the second electrode sheet 13 via a lead 18 .
  • the light-transmissive encapsulating portion 15 encloses the concave portion 111 and covers the light-emitting diode chip 14 , the partial first electrode sheet 12 , the partial second electrode sheet 13 , and the protruding portion 16 in the concave portion 111 .
  • the light-transmissive encapsulation portion 15 at the projection portion 16 may have a protrusion formed on the surface thereof. That is, the plurality of protrusions 16 change the surface shape of the light-transmitting package portion 15.
  • the housing 11 of the LED package structure 10 further includes at least one boss 17 , the boss 17 may be disposed at an edge of the housing 11 , and the height of the boss 17 Greater than the height of the plurality of protrusions 16. Therefore, the boss 17 of the LED package structure 10 of the first embodiment of the present invention facilitates other manufacturing processes such as subsequent SMT of the LED package structure 10.
  • the path of the light emitted by the light-emitting diode chip 14 when exiting through the light-transmitting package portion 15 also changes, as can be seen in FIG. 3B.
  • the surface of the light-transmissive encapsulating portion 15 is uneven, so that the probability of total reflection of light is reduced, thereby increasing the diffusion angle of the light.
  • the light that is incident on the convex portion 16 is reflected by the reflective layer on the surface of the convex portion 16, and is then emitted from the surface of the light-transmitting package 15, thereby improving the light-emitting rate of the light emitted from the light-emitting diode chip 14.
  • FIG. 4 is a perspective view of a housing and a light emitting diode chip according to a second embodiment of the LED package structure of the present invention.
  • the LED package structure 20 of the present embodiment is similar to the LED package structure 10 of the first embodiment, and therefore the same component name is used, but the difference is that the plurality of protrusions 26 in this embodiment are different.
  • the light-emitting diode chips 24 are arranged in mirror symmetry with respect to the light-emitting diode chip 24, and the surface of the protruding portion 26 has a reflective layer (not shown).
  • the light-emitting diode package structure 20 has a smaller viewing angle in a direction along which the plurality of protrusions 26 are arranged, and a larger viewing angle in a direction perpendicular to the arrangement direction.
  • the LED package construction 20 can be adapted to different usage requirements, such as a light source for a side-lit backlight module.
  • FIG. 5 is a perspective view of a housing and an LED chip according to a third embodiment of the LED package structure of the present invention.
  • the LED package structure 30 of the present embodiment and the LED package structure 20 of the second embodiment of the present invention are therefore used with the same component names, but the difference between the two is that the housing 31 of the present embodiment has two
  • the protrusion 36 is mirror-symmetrically disposed with respect to the LED chip 34.
  • the protrusion 36 has a plate shape, and the surface of the protrusion 36 has a reflective layer (not shown).
  • FIG. 6A is a perspective view of a casing and an LED chip of a fourth embodiment of the LED package structure of the present invention
  • FIG. 6B is a fourth embodiment of the LED package structure of the present invention. Cutaway view.
  • the LED package structure 40 includes a housing 41 , a first electrode tab 42 , a second electrode tab 43 , an LED chip 44 , and a light transmissive package portion 45 .
  • the upper surface of the housing 41 is provided with a recess 411.
  • the recess 411 is a recessed structure, and its shape can be adjusted correspondingly according to product requirements.
  • the peripheral edge of the housing 41 further extends upwardly with a plurality of protrusions 46 disposed on a circumference of the housing 41 , and the protrusions 46 are located on opposite sides of the recess 411 .
  • a portion of the first electrode sheet 42 is disposed at a bottom of the recess 411, and another portion thereof extends outside the housing 41 for electrical connection with the outside; a portion of the second electrode sheet 43 is provided At the bottom of the recess 411, another portion thereof extends outside the housing 41 for electrical connection with the outside.
  • the LED chip 44 has a first electrode (not shown) and a second electrode (not shown). The LED chip 44 is disposed in the recess 411, and the first electrode is electrically connected to the first electrode. On the electrode sheet 42, the second electrode is electrically connected to the second electrode sheet 43 via a lead wire 48.
  • the light-transmissive encapsulating portion 45 encapsulates the recessed portion 41 and covers the light-emitting diode chip 44, a portion of the first electrode sheet 42 and a portion of the second electrode sheet 43 in the recess portion 411. As shown in FIG. 6B, due to the effect of the surface tension, after the light-transmissive package portion 45 is packaged, the light-transmissive package portion 45 has a protrusion formed on the surface thereof with the protrusion portion 46. That is, the surface shape of the light-transmitting package portion 45 is changed by the plurality of protrusions 46.
  • the height of the plurality of protrusions 46 of the LED package structure 40 may be higher than the height of the light-transmissive package portion 45. Therefore, the LED package structure of the fourth embodiment of the present invention The plurality of projections 46 of 40 simultaneously facilitate other manufacturing processes such as subsequent SMT of the LED package construction 40.
  • the LED package construction 40 can produce the same technical effects as the first embodiment of the LED package construction of the present invention.
  • the surface shape of the light-transmitting package portion 45 of the LED package structure 40 is changed by the plurality of protrusions 46, and therefore, the path of the light when exiting through the light-transmissive package portion 45 It will change as well.
  • FIG. 6B it can be seen that the surface of the light-transmissive encapsulating portion 45 is uneven and produces an effect close to the convex lens, so that most of the light is emitted from the surface of the light-transmitting package 45, thereby increasing the diffusion angle of the light. Increased light output.
  • the LED package construction 40 is adapted to different usage requirements, such as a light source for a side-lit backlight module.
  • FIG. 7 is a perspective view showing a casing and an LED chip of a fifth embodiment of the LED package structure of the present invention.
  • the LED package structure 50 of the present embodiment is similar to the LED package structure 40 of the fourth embodiment of the present invention, and therefore the same name is used, but the difference is that in the embodiment, the plurality of protrusions 56 is further arranged in a multi-stepped arrangement with a low central side. Therefore, the height difference of the plurality of protrusions 56 can be designed in an asymptotic manner and with a large number of level changes.
  • the LED package structure 50 has a larger viewing angle in a direction along the plurality of protrusions 56, a smaller viewing angle in a direction perpendicular to the arrangement direction, and is suitable for different use requirements. .
  • FIG. 8 is a perspective view showing a casing and an LED chip of a sixth embodiment of the LED package structure of the present invention.
  • the LED package structure 60 of the present embodiment is similar to the LED package structure 40 of the fourth embodiment of the present invention, and thus the same component name is used, but the difference is that the plurality of protrusions of the sixth embodiment of the present invention
  • the outlets 66 are arranged in a circular array with respect to the light emitting diode chips 64.
  • the plurality of protrusions 66 extend toward the edge to be radially arranged.
  • the light emitting diode package structure 60 of the present embodiment changes the surface of the light transmissive encapsulating portion 65 by gradual or periodic arrangement, thereby improving the light-transmissive encapsulation portion 65 due to material hardening shrinkage and the surface tension of the concave portion edge.
  • the action produces a state in which the central portion is recessed.
  • the plane in which the plurality of protrusions 66 are radially arranged extends to facilitate other manufacturing processes such as subsequent SMT of the LED package structure 60.
  • the housing of the LED package structure of the present invention is provided with a plurality of protrusions for encapsulating the housing and the transparent package portion of the LED chip.
  • the surface has an uneven shape, which reduces the probability of total reflection of light emitted by the LED chip after passing through the transparent package portion, thereby improving the light extraction rate.

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Description

发光二极管封装构造 技术领域
本发明涉及一种发光二极管封装构造，特别是涉及一种具有凹凸不平表面的透光封装部的发光二极管封装构造。
 背景技术
液晶显示器(liquid crystal display，LCD)是利用液晶材料的特性来显示图像的一种平板显示装置(flat panel display，FPD)，其相较于其他显示装置而言更具轻薄、低驱动电压及低功耗等优点，已经成为整个消费市场上的主流产品。然而，液晶显示器的液晶材料无法自主发光，必须借助外在提供光源，因此液晶显示器中需另设背光模块以提供所需的光源。
一般而言，背光模块可分为侧入式背光模块和直下式背光模块两种形式。已知背光模块主要是以冷阴极荧光灯管（CCFL）、热阴极荧光灯管（HCFL）及半导体发光元件作为光源，而半导体发光元件主要又是利用发光二极管（LED）进行发光，其相较于阴极荧光灯管更为省电节能、使用寿命更长，且体积更为轻巧，因而有逐渐取代阴极荧光灯管的趋势。
现今，发光二极管多以芯片的形式进行半导体封装，以作成发光二极管封装构造，再与背光模块的固定板接合。而发光二极管产品封装构造的类型，有根据发光颜色、晶粒材料、发光亮度、尺寸大小等情况特征来分类的。单个晶粒一般构成点光源，多个晶粒组装一般可构成面光源和线光源，作信息、状态指示及显示用。发光显示器也是用多个晶粒，通过晶粒的串联或并联连接与合适的光学结构组合而成的，构成发光显示器的发光段和发光点。其中，表面粘着封装型的LED(SMD-LED)是贴于电路板表面，适合表面接着技术(SMT)加工，因为可进行回流焊，可以解决亮度、视角、平整度、可靠性、一致性等问题。并且，其采用了更轻的PCB板和反射层材料，改进后去掉了直插LED较重的碳钢材料引脚，使反射层需要填充的环氧树脂更少，表面粘着封装型的LED可将产品重量减轻一半，最终使应用更加完美。因此，表面粘着封装型的LED已逐渐替代了引脚式LED，应用设计更灵活，特别是在LED显示市场中占有一定的份额，有加速发展趋势。
请参照图1，图1揭示一种现有发光二极管封装构造的剖视图。如图1所示，一种现有发光二极管封装构造90包含：一壳体91、一第一电极片92、一第二电极片93、一发光二极管芯片94及一透光封装部95。所述壳体91的上表面设有一凹部911；所述第一电极片92的一部分设于所述凹部911的底部，另一部分延伸至所述壳体91外，以使用于与外部的电性连接。所述第二电极片93的一部分设于所述凹部911的底部，另一部分延伸至所述壳体91外，以使用于与外部的电性连接。所述发光二极管芯片94具有第一电极(图未示)及第二电极(图未示)，该发光二极管芯片94设于所述凹部911之内，其第一电极电性连接于所述第一电极片92上，其第二电极通过一第一引线96电性连接于所述第二电极片93；所述透光封装部95封装所述凹部911，并且封装所述凹部911内的各元件，所述发光二极管芯片94的光线能通过所述透光封装部95向上方发射。
在现有的所述发光二极管封装构造90中，所述壳体91在设计上预期理想的所述透光封装部95的表面是呈水平的。然而，由于所述透光封装部95的材质硬化后的收缩，加上所述壳体91的凹部911边缘对透光封装部95的表面张力的作用，实际上所述透光封装部95的表面在其中心部是呈现凹陷的状态。由于所述透光封装部95的折射率大于空气的折射率，在光线由内向外经过所述透光封装部95表面与空气的交界面时，会有部分的光线发生全反射的现象。即使这些发生全反射的光线，经过所述凹部911壁面的反射后，再从所述透光封装部95射出，这样都会使光线发生衰减，影响了光线的出光率。
请参照图2，图2揭示另一种现有发光二极管封装构造的剖视图。如图2所示，图2的发光二极管封装构造90’与图1的发光二极管封装构造90大致相同，不同之处在于：图2的发光二极管封装构造90’的透光封装部95’具有一凸透镜的设计，这样避免了上述光线因为全反射的作用而发生衰减的情况，并可更有效率地以大视角将光线射出。然而，这将提高所述透光封装部95’的制作成本。并且，由于所述透光封装部95’凸出所述壳体91’，不利于所述发光二极管封装构造90’的后续SMT或其他制造工艺。
故，有必要提供一种发光二极管封装构造，以解决现有技术所存在的问题。
 技术问题
本发明提供一种发光二极管封装构造，以解决前述发光二极管封装构造出光效率的问题。
 技术解决方案
本发明的主要目的是提供一种发光二极管封装构造，其通过将多个凸出部设于壳体的凹部内或在所述壳体的边缘上，以使透光封装部的表面具有凹凸不平的形状，增加了光线的扩散角度及提高光线的出光效率。
本发明的另一目的是提供一种发光二极管封装构造，其通过多个凸出部不同的排列的方式，进一步改变及控制发光二极管封装构造发射光线的视角，使适用于不同的使用需求。
本发明的另一目的是提供一种发光二极管封装构造，其通过凸出部或凸台的设置，使有利于以吸头吸附的方式来取放，使适用于一般表面接着技术的制造工艺。
为达上述目的，本发明提供一种发光二极管封装构造，其包含：
一壳体，所述壳体具有一凹部及多个凸出部；
一发光二极管芯片，设于所述壳体的凹部之内；及
一透光封装部，封装所述壳体的凹部，并包覆所述凹部内的所述发光二极管芯片，所述透光封装部具有凹凸不平的表面。
在本发明的一实施例中，所述多个凸出部位于所述凹部的底面上，且该凸出部高于所述壳体的边缘。
在本发明的一实施例中，所述透光封装部封装所述凸出部。
在本发明的一实施例中，所述多个凸出部呈锥体状，相对于所述发光二极管芯片呈圆形阵列排列或镜面对称排列。
在本发明的一实施例中，所述多个凸出部呈板状，相对于所述发光二极管芯片呈镜面对称排列。
在本发明的一实施例中，所述壳体另包含至少一凸台，所述凸台的高度大于所述多个凸出部的高度。
在本发明的一实施例中，所述凸出部的表面具有一反射层。
为达上述目的，本发明另提供一种发光二极管封装构造，其包含：
一壳体，所述壳体具有一凹部及多个凸出部，所述壳体的周缘向上延伸形成所述多个凸出部；
一发光二极管芯片，设于所述壳体的凹部之内；及
一透光封装部，封装所述壳体的凹部，并包覆所述凹部内的所述发光二极管芯片，所述透光封装部具有凹凸不平的表面。
在本发明的一实施例中，所述多个凸出部位于所述凹部的相对两侧并且呈中央最高两侧低的多阶梯状排列。
在本发明的一实施例中，所述多个凸出部呈放射状排列。
为达上述目的，本发明另提供一种发光二极管封装构造，其包含：
一壳体，所述壳体具有一凹部及多个凸出部，所述多个凸出部位于所述凹部的底面上，且该凸出部高于所述壳体的边缘；
一发光二极管芯片，设于所述壳体的凹部之内；
一透光封装部，封装所述壳体的凹部及凸出部，并包覆所述凹部内的所述发光二极管芯片，所述透光封装部具有凹凸不平的表面；及
至少一凸台，所述凸台的高度大于所述多个凸出部的高度。
本发明提供一种发光二极管封装构造，其包含一壳体、一发光二极管芯片及一透光封装部。所述壳体具有一凹部及多个凸出部，所述发光二极管芯片设于所述凹部，并包覆所述凹部内的所述透光封装部，所述多个凸出部设于所述凹部内或在所述壳体的边缘上。本发明通所述多个凸出部以使所述透光封装部的表面形成凹凸不平的形状，从而增加了光线的扩散角度及提高光线的出光效率。
 有益效果
本发明提供一种发光二极管封装构造，其包含一壳体、一发光二极管芯片及一透光封装部。所述壳体具有一凹部及多个凸出部，所述发光二极管芯片设于所述凹部，并包覆所述凹部内的所述透光封装部，所述多个凸出部设于所述凹部内或在所述壳体的边缘上。本发明通所述多个凸出部以使所述透光封装部的表面形成凹凸不平的形状，从而增加了光线的扩散角度及提高光线的出光效率。
 附图说明
图1：一种现有发光二极管封装构造的剖视图。
图2：另一种现有发光二极管封装构造的剖视图。
图3A：本发明发光二极管封装构造的第一实施例的壳体与发光二极管芯片的立体示意图。
图3B：本发明发光二极管封装构造的第一实施例的剖视图。
图4：本发明发光二极管封装构造的第二实施例的壳体与发光二极管芯片的立体示意图。
图5：本发明发光二极管封装构造的第三实施例的壳体与发光二极管芯片立体示意图。
图6A：本发明发光二极管封装构造的第四实施例的壳体与发光二极管芯片的立体示意图。
图6B：本发明发光二极管封装构造的第四实施例的剖视图。
图7：本发明发光二极管封装构造的第五实施例的壳体与发光二极管芯片的立体示意图。
图8：本发明发光二极管封装构造的第六实施例的壳体与发光二极管芯片的立体示意图。
 本发明的最佳实施方式
为让本发明上述目的、特征及优点更明显易懂，下文特举本发明较佳实施例，并配合附图，作详细说明。其中，为了能更清楚的表示发光二极管封装构造的主要部分，本发明附图中的立体示意图都是以简化的方式来表示其主要特征。
请同时参照图3A及图3B，图3A为本发明发光二极管封装构造的第一实施例的壳体与发光二极管芯片的立体示意图；图3B为本发明发光二极管封装构造的第一实施例的剖视图。所述发光二极管封装构造10包含：一壳体11、一第一电极片12、一第二电极片13、一发光二极管芯片14及一透光封装部15。
所述壳体11具有一凹部111，所述凹部111是一凹陷构造，其形状可依产品需求而对应调整。所述壳体11还包含多个凸出部16，所述多个凸出部16设于所述壳体11的凹部111的底面上，所述凸出部16呈圆周排列。优选的，所述多个凸出部16是呈锥体状，且高于所述壳体11的边缘，所述凸出部16的表面具有一反射层（图未示）。
所述第一电极片12的一部分设于所述壳体11内，其另一部分延伸至所述壳体11外，以用于与外部的电性连接。所述第二电极片13的一部分设于所述壳体11内，其另一部分延伸至所述壳体11外，以用于与外部的电性连接。所述发光二极管芯片14具有第一电极（图未示）及第二电极（图未示），该发光二极管芯片14设于所述凹部111之内，且该发光二极管芯片14位于所述凸出部16形成的圆周的圆心处。所述发光二极管芯片14第一电极电性连接于所述第一电极片12上，其第二电极通过一引线18电性连接于所述第二电极片13。
所述透光封装部15封装所述凹部111，并包覆所述凹部111内的发光二极管芯片14、部分第一电极片12、部分第二电极片13及凸出部16。如图3B所示，由于表面张力的作用，在封装所述透光封装部15之后，所述透光封装部15在所述凸出部16处，其表面会形成突起。也就是说，所述多个凸出部16改变所述透光封装部15的表面形状。
另外，优选的，所述发光二极管封装构造10的所述壳体11另包含至少一凸台17，所述凸台17可设于所述壳体11的边缘，并且所述凸台17的高度大于所述多个凸出部16的高度。因此，本发明第一实施例的所述发光二极管封装构造10的所述凸台17有利于该发光二极管封装构造10的后续SMT等其他制造工艺。
进一步来说，随着所述透光封装部15表面形状的改变，发光二极管芯片14发出的光线经由所述透光封装部15出射时的路径也会随之改变，在图3B中可以看到，所述透光封装部15的表面凹凸不平，因此，减少了光线产生全反射的几率，因而增加了光线的扩散角度。此外，照射到凸出部16的光线由凸出部16表面的反射层反射后，自透光封装体15的表面射出，从而提高了发光二极管芯片14发出光线的出光率。
请参照图4所示，图4为本发明发光二极管封装构造的第二实施例的壳体与发光二极管芯片立体示意图。本实施例的发光二极管封装构造20与第一实施例的发光二极管封装构造10相似，因此沿用相同的元件名称，但二者的不同之处在于：本实施例中所述多个凸出部26相对于所述发光二极管芯片24呈镜面对称排列，且所述凸出部26的表面具有一反射层（图未示）。使所述发光二极管封装构造20在沿着所述多个凸出部26排列的方向上的视角较小，在与排列方向垂直的方向上的视角较大。从而，所述发光二极管封装构造20可适合于不同的使用需求，例如做为侧入光式背光模块的光源。
请参照图5所示，图5为本发明发光二极管封装构造的第三实施例的壳体与发光二极管芯片立体示意图。本实施例的发光二极管封装构造30与本发明第二实施例的发光二极管封装构造20，因此沿用相同的元件名称，但二者的不同之处在于：本实施例的所述壳体31具有两个相对于发光二极管芯片34呈镜面对称设置的凸出部36，该凸出部36呈板状，且所述凸出部36的表面具有一反射层（图未示）。
请同时参照图6A及图6B所示，图6A为本发明发光二极管封装构造的第四实施例的壳体与发光二极管芯片立体示意图；图6B为本发明发光二极管封装构造的第四实施例的剖视图。在本实施例中，所述发光二极管封装构造40包含：一壳体41、一第一电极片42、一第二电极片43、一发光二极管芯片44及一透光封装部45。所述壳体41的上表面设有一凹部411，所述凹部411是一凹陷构造，其形状可依产品需求而对应调整。所述壳体41的周缘还向上延伸有多个凸出部46，所述多个凸出部46设于所述壳体41的周缘上，该凸出部46位于凹部411的相对两侧。
所述第一电极片42的一部分设于所述凹部411的底部，其另一部分延伸至所述壳体41外，以用于与外部的电性连接；所述第二电极片43的一部分设于所述凹部411的底部，其另一部分延伸至所述壳体41外，以用于与外部的电性连接。所述发光二极管芯片44具有第一电极（图未示）及第二电极（图未示），该发光二极管芯片44设于所述凹部411内，其第一电极电性连接于所述第一电极片42上，其第二电极通过一引线48电性连接于所述第二电极片43。
所述透光封装部45封装所述凹部41，并包覆所述凹部411内的所述发光二极管芯片44、部分第一电极片42及部分第二电极片43。如图6B所示，由于表面张力的作用，在封装所述透光封装部45之后，所述透光封装部45在有所述凸出部46的地方，其表面会形成突起。也就是说，通过所述多个凸出部46改变所述透光封装部45的表面形状。
另外，优选的，所述发光二极管封装构造40的多个凸出部46的高度会高于所述透光封装部45的高度，因此，本发明的第四实施例的所述发光二极管封装构造40的多个凸出部46同时有利于该发光二极管封装构造40的后续SMT等其他制造工艺。
进一步来说，在本实施例中，发光二极管封装构造40可产生相同于本发明发光二极管封装构造的第一实施例的技术效果。在本实施例中，发光二极管封装构造40的透光封装部45的表面形状，由于所述多个凸出部46而发生改变，因此，光线在通过所述透光封装部45出射时的路径也会随之改变。在图6B中，可以看到，所述透光封装部45表面凹凸不平，并产生接近凸透镜的效果，因此大部分的光线由透光封装体45的表面射出，因而增加了光线的扩散角度，提高了出光率。
再者，由于所述发光二极管封装构造40在沿着所述多个凸出部46排列的方向上的视角较大，在与排列方向垂直的方向上的视角较小。从而，使所述发光二极管封装构造40适合于不同的使用需求，例如做为侧入光式背光模块的光源。
请参照图7所示，图7揭示本发明发光二极管封装构造的第五实施例的壳体与发光二极管芯片的立体示意图。本实施例的发光二极管封装构造50与本发明第四实施例的发光二极管封装构造40相似，因此沿用相同的名称，但其不同之处在于：在本实施例中，所述多个凸出部56更进一步呈中央最高两侧低的多阶梯状排列。因此，可以渐近的方式及较多的层次变化来设计所述多个凸出部56的高度落差。同样的，所述发光二极管封装构造50在沿着所述多个凸出部56排列的方向上的视角较大，在与排列方向垂直的方向上的视角较小，可适合于不同的使用需求。
请参照图8所示，图8揭示本发明发光二极管封装构造的第六实施例的壳体与发光二极管芯片的立体示意图。本实施例的发光二极管封装构造60与本发明第四实施例的发光二极管封装构造40相似，因此沿用相同的元件名称，但其不同之处在于：本发明第六实施例的所述多个凸出部66是相对于所述发光二极管芯片64呈圆形阵列排列。优选的，所述多个凸出部66向边缘延伸为呈放射状排列。因此，本实施例的发光二极管封装构造60通过渐变或周期排列的方式，使所述透光封装部65的表面发生变化，从而改善所述透光封装部65因为材质硬化收缩及凹部边缘表面张力的作用产生中心部凹陷的状态。另外，所述多个凸出部66放射状排列所延伸出来的平面，有利于该发光二极管封装构造60的后续SMT等其他制造工艺。
综上所述，相较于现有的发光二极管封装构造，本发明的所述发光二极管封装构造的壳体设置的多个凸出部，使封装该壳体和发光二极管芯片的透明封装部的表面形成凹凸不平的形状，减少所述发光二极管芯片发出的光线经过该透光封装部后发生全反射的几率，从而提高出光率。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反地，包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。
 本发明的实施方式
工业实用性
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Claims (14)

  1. 一种发光二极管封装构造，其特征在于：所述发光二极管封装构造包含：
    一壳体，所述壳体具有一凹部及多个凸出部；
    一发光二极管芯片，设于所述壳体的凹部之内；及
    一透光封装部，封装所述壳体的凹部，并包覆所述凹部内的所述发光二极管芯片，所述透光封装部具有凹凸不平的表面。
  2. 如权利要求1所述的发光二极管封装构造，其特征在于：所述多个凸出部位于所述凹部的底面上，且该凸出部高于所述壳体的边缘。
  3. 如权利要求2所述的发光二极管封装构造，其特征在于：所述透光封装部封装所述凸出部。
  4. 如权利要求2所述的发光二极管封装构造，其特征在于：所述多个凸出部呈锥体状，相对于所述发光二极管芯片呈圆形阵列排列或镜面对称排列。
  5. 如权利要求2所述的发光二极管封装构造，其特征在于：所述多个凸出部呈板状，相对于所述发光二极管芯片呈镜面对称排列。
  6. 如权利要求2所述的发光二极管封装构造，其特征在于：所述壳体另包含至少一凸台，所述凸台的高度大于所述多个凸出部的高度。
  7. 如权利要求2所述的发光二极管封装构造，其特征在于：所述凸出部的表面具有一反射层。
  8. 一种发光二极管封装构造，其特征在于：所述发光二极管封装构造包含：
    一壳体，所述壳体具有一凹部及多个凸出部，所述壳体的周缘向上延伸形成所述多个凸出部；
    一发光二极管芯片，设于所述壳体的凹部之内；及
    一透光封装部，封装所述壳体的凹部，并包覆所述凹部内的所述发光二极管芯片，所述透光封装部具有凹凸不平的表面。
  9. 如权利要求8所述的发光二极管封装构造，其特征在于：所述多个凸出部位于所述凹部的相对两侧并且呈中央最高两侧低的多阶梯状排列。
  10. 如权利要求8所述的发光二极管封装构造，其特征在于：所述多个凸出部呈放射状排列。
  11. 一种发光二极管封装构造，其特征在于：所述发光二极管封装构造包含：
    一壳体，所述壳体具有一凹部及多个凸出部，所述多个凸出部位于所述凹部的底面上，且该凸出部高于所述壳体的边缘；
    一发光二极管芯片，设于所述壳体的凹部之内；
    一透光封装部，封装所述壳体的凹部及凸出部，并包覆所述凹部内的所述发光二极管芯片，所述透光封装部具有凹凸不平的表面；及
    至少一凸台，所述凸台的高度大于所述多个凸出部的高度。
  12. 如权利要求11所述的发光二极管封装构造，其特征在于：所述多个凸出部呈锥体状，相对于所述发光二极管芯片呈圆形阵列排列或镜面对称排列。
  13. 如权利要求11所述的发光二极管封装构造，其特征在于：所述多个凸出部呈板状，相对于所述发光二极管芯片呈镜面对称排列。
  14. 如权利要求11所述的发光二极管封装构造，其特征在于：所述凸出部的表面具有一反射层。
PCT/CN2011/073299 2011-04-07 2011-04-26 发光二极管封装构造 Ceased WO2012136011A1 (zh)

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