WO2012128094A1 - Procédé pour la fixation d'un dispositif électroluminescent, et dispositif électroluminescent - Google Patents

Procédé pour la fixation d'un dispositif électroluminescent, et dispositif électroluminescent Download PDF

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Publication number
WO2012128094A1
WO2012128094A1 PCT/JP2012/056246 JP2012056246W WO2012128094A1 WO 2012128094 A1 WO2012128094 A1 WO 2012128094A1 JP 2012056246 W JP2012056246 W JP 2012056246W WO 2012128094 A1 WO2012128094 A1 WO 2012128094A1
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WIPO (PCT)
Prior art keywords
light emitting
light
emitting device
jig
positioning
Prior art date
Application number
PCT/JP2012/056246
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English (en)
Japanese (ja)
Inventor
目見田　裕一
Original Assignee
シャープ株式会社
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Filing date
Publication date
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Publication of WO2012128094A1 publication Critical patent/WO2012128094A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/027—Mountings, adjusting means, or light-tight connections, for optical elements for lenses the lens being in the form of a sphere or ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Definitions

  • the present invention relates to a light emitting device fixing method and a light emitting device, and more particularly to a light emitting device fixing method and a light emitting device that perform fixing by reflow.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2004-22245 is a prior art document that discloses a light emitting device package that increases the efficiency of light incident on a light guide plate and enables the backlight unit to be thinned.
  • the light emitting element package described in Patent Document 1 includes a main body on which the light emitting element is mounted and a pair of projecting portions projecting from the main body.
  • the pair of protrusions are positioned so as to sandwich the light exit surface, and are set at an interval at which the light guide plate can be inserted.
  • the light guide plate is inserted between the pair of projecting portions, the central portion in the thickness direction of the light guide plate and the central portion of the light emitting element's emission surface are aligned and faced, and the light guide plate is brought close to the light emitting element's emission surface By holding in the state, the positional relationship between the light guide plate and the light emitting element is set to an optimum state.
  • a plurality of light emitting devices such as a light emitting element package are arranged on a substrate.
  • the positional accuracy of the plurality of light emitting devices on the substrate is important.
  • the positional relationship between the center of the plurality of light emitting elements and the substrate cannot be optimized.
  • the present invention has been made in view of the above-described problems, and an object of the present invention is to provide a light emitting device fixing method and a light emitting device capable of accurately fixing a plurality of light emitting devices on a substrate.
  • a fixing method of a light emitting device includes a step of arranging a plurality of light emitting devices including a terminal mounted with a light emitting element and a reflector surrounding the periphery of the light emitting element at a predetermined position on a substrate on which a solder pattern is formed; A step of contacting a part of each of the plurality of light emitting devices with a positioning portion of one rod-shaped jig for maintaining the arrangement of each of the plurality of light emitting devices; And reflowing by spraying heating and hot air in a state where the tool is in contact.
  • a line connecting the center positions of the light emitting elements of the plurality of light emitting devices becomes parallel to the axis center of the jig. .
  • a notch corresponding to the shape of the positioning portion of the jig is formed at the tip of the reflector.
  • the positioning portion has an arcuate cross-sectional shape in a cross section in a direction perpendicular to the axial direction of the jig.
  • the notch has an outer surface along the positioning portion.
  • the positioning portion has a V-shaped cross-sectional shape in a cross section in a direction orthogonal to the axial direction of the jig.
  • the notch has an outer surface along the positioning portion.
  • the positioning portion has an inverted V-shaped cross section in a cross section in a direction perpendicular to the axial direction of the jig.
  • the notch has an outer surface along the positioning portion.
  • a plurality of light emitting devices are fixed to a predetermined position on the substrate on which the solder pattern is formed.
  • the light emitting device includes a light emitting element, a terminal on which the light emitting element is mounted, and a reflector surrounding the periphery of the light emitting element.
  • the reflector connects the center positions of the light emitting elements of each of the plurality of light emitting devices by contacting a part of the reflector with a positioning portion of one rod-shaped jig for maintaining the arrangement of each of the plurality of light emitting devices.
  • the ellipse has a shape that is parallel to the axis center of the jig.
  • a plurality of light emitting devices can be fixed on a substrate with high accuracy.
  • FIG. 2 is a cross-sectional view seen from the direction of arrows II-II in FIG.
  • FIG. 3 is a cross-sectional view seen from the direction of arrows III-III in FIG.
  • FIG. 6 is an enlarged partial plan view showing a VI part in FIG. 5.
  • FIG. 8 is a cross-sectional view as seen from the direction of arrows VIII-VIII in FIG. It is a figure which shows typically the state in which reflow is performed in a reflow furnace. It is a graph which shows an example of reflow conditions. It is a side view which shows the state which has arrange
  • FIG. 1 is a plan view showing a configuration of a light emitting device according to Embodiment 1 of the present invention.
  • FIG. 2 is a cross-sectional view seen from the direction of arrows II-II in FIG. 3 is a cross-sectional view as seen from the direction of arrows III-III in FIG.
  • the light emitting device 100 includes a terminal 110 including a first lead terminal 111 and a second lead terminal 112, a light emitting diode chip 120 that is a light emitting element, A resin portion 130, a first bonding wire 141, and a second bonding wire 142 are provided.
  • the first lead terminal 111 is made of a plate-like metal member having a J-shape when viewed from the side.
  • the second lead terminal 112 is made of a plate-like metal member having a J-shape when viewed from the side.
  • the first lead terminal 111 and the second lead terminal 112 are disposed so as to be spaced apart from each other so that their main surfaces are located on substantially the same plane.
  • Resin portion 130 supports terminal 110.
  • the resin portion 130 is formed by insert molding the first lead terminal 111 and the second lead terminal 112.
  • the part located on the main surface side of the terminal 110 becomes a reflector 131 surrounding the light emitting diode chip 120.
  • the reflector 131 reflects the light emitted from the light emitting diode chip 120 and emits the light toward the opening, because the surface of the opening provided in the resin part 130 has light reflectivity.
  • a notch 132 corresponding to the shape of a positioning portion of a positioning jig described later is formed.
  • the size of the resin portion 130 is, for example, 2 mm or less on the short side and 6 mm or less on the long side in plan view.
  • the thickness of the end of the reflector 131 provided with the notch 132 is, for example, not less than 0.1 mm and not more than 0.5 mm.
  • Each of the first lead terminal 111 and the second lead terminal 112 is bent so that a part of the first lead terminal 111 and the second lead terminal 112 protrudes from the side of the resin part 130 along the side and bottom surfaces of the resin part 130.
  • a part of each of the first lead terminal 111 and the second lead terminal 112 located along the bottom surface of the resin portion 130 is joined to a solder pattern of a substrate described later.
  • the main surfaces of the first lead terminal 111 and the second lead terminal 112 are in contact with the opening of the resin portion 130.
  • the shape of the terminal 110 is not limited to the above, and may be any shape as long as the light-emitting diode chip 120 can be mounted and the light-emitting device 100 can be bonded to the solder pattern of the substrate.
  • the light emitting diode chip 120 is mounted on the first lead terminal 111. Specifically, a die bonder on which the light emitting diode chip 120 is mounted on the first lead terminal 111 is used while recognizing an alignment mark provided in advance on the first lead terminal 111 and the outer shape of the light emitting diode chip 120.
  • the positional accuracy between the light emitting diode chip 120 and the first lead terminal 111 is determined by the device accuracy of the die bonder, and is, for example, a positional accuracy of about ⁇ 50 ⁇ m. Since the light emitting diode chip 120 is fixed by curing the adhesive applied between the light emitting diode chip 120 and the first lead terminal 111 at a high temperature in an oven, the position is shifted by hot air during reflow. Does not happen.
  • the light emitting diode chip 120 is connected to the first lead terminal 111 by the first bonding wire 141.
  • the light emitting diode chip 120 is connected to the second lead terminal 112 by the second bonding wire 142.
  • the light emitting diode chip 120 irradiates light to the opening side of the resin portion 130.
  • FIG. 4 is a flowchart showing a method of fixing the light emitting device according to this embodiment.
  • a step (S100) of arranging a plurality of light emitting devices 100 at predetermined positions on the substrate and a step of bringing a positioning part into contact with the reflector ( S110) and a reflow process (S120).
  • FIG. 5 is a plan view showing a state in which the light emitting device is arranged at a predetermined position on the substrate.
  • FIG. 6 is a partial plan view showing the VI part of FIG. 5 in an enlarged manner. 5 and 6, the configuration of the light emitting device 100 is simplified.
  • a plurality of light emitting devices 100 are arranged at predetermined positions on a substrate 200 on which a solder pattern is formed. Specifically, a mounter on which the light emitting device 100 is mounted on the substrate 200 is used while recognizing an alignment mark provided in advance on the substrate 200 and the outer shape of the light emitting device 100.
  • the positional accuracy of the light emitting device 100 on the substrate 200 is determined by the mounting accuracy of the mounter, and is, for example, a positional accuracy of about ⁇ 50 ⁇ m. Therefore, the center line 201 in the longitudinal direction of the substrate 200 and the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 100 substantially coincide with each other.
  • the positioning portion 310 of one rod-shaped positioning jig 300 for maintaining the arrangement of each of the plurality of light emitting devices 100 in the notch 132 that is a part of the reflector 131 of each of the plurality of light emitting devices 100.
  • an iron round bar is used as the positioning jig 300.
  • the positioning jig 300 is not limited to this, and has an appropriate weight, uniform outer dimensions, and is difficult to be thermally deformed. Any rod-shaped member may be used.
  • FIG. 7 is a front view showing a state in which the positioning part of the positioning jig is brought into contact with the notch part of the reflector.
  • FIG. 8 is a cross-sectional view as seen from the direction of arrows VIII-VIII in FIG.
  • the positioning jig 300 has a cylindrical shape. Therefore, the positioning part 310 has an arcuate cross-sectional shape in a cross section in a direction orthogonal to the axial direction of the positioning jig 300.
  • the notch 132 of the reflector 131 has an outer surface along the positioning part 310 of the positioning jig 300. Therefore, by bringing the positioning portion 310 of the positioning jig 300 into contact with the notch portion 132 of the reflector 131, the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 100 is connected to the positioning jig 300. It becomes parallel to the axis center 320.
  • the solder pattern 220 of the substrate 200 and the terminal 110 of the light emitting device 100 are in contact with each other, and the line 121 connecting the central positions of the light emitting diode chips 120 of the plurality of light emitting devices 100 and FIG.
  • the positions of the plurality of light emitting devices 100 are maintained by the positioning jig 300 in a state where the center line 201 of the substrate 200 shown is substantially coincident. In this state, reflow is performed.
  • FIG. 9 is a diagram schematically showing a state in which reflow is performed in a reflow furnace.
  • FIG. 10 is a graph showing an example of reflow conditions.
  • the vertical axis represents the temperature (° C.) of the solder pattern 220 and the horizontal axis represents the processing time (s).
  • the reflow furnace 400 has five temperature areas.
  • the process of the I section shown in FIG. 10 is performed. Specifically, a weak wind having a temperature of 150 ° C. is blown in the direction indicated by the arrow 421 in the figure, and the temperature of the solder pattern 220 is increased at a rate of 1 ° C./s to 5 ° C./s.
  • the processing of section II shown in FIG. 10 is performed. Specifically, the temperature of the solder pattern 220 is set to 180 ° C. or higher and 200 ° C. or lower and maintained for 120 seconds or less.
  • the process of section III shown in FIG. 10 is performed. Specifically, a strong wind at a temperature of 260 ° C. is sprayed in the direction indicated by the arrow 441 in the figure, and the temperature of the solder pattern 220 is increased at a rate of 1 ° C./s to 5 ° C./s.
  • the processing of the IV section shown in FIG. 10 is performed. Specifically, the temperature of the solder pattern 220 is maintained at a maximum of 260 ° C. for 10 seconds or less.
  • the process of the V section shown in FIG. 10 is performed. Specifically, a slight wind of 50 ° C. is blown in the direction indicated by the arrow 461 in the figure, and the temperature of the solder pattern 220 is lowered at a speed of 10 ° C./s to 25 ° C./s.
  • the substrate 200 is transported in the direction indicated by the arrow 411 in the drawing by the transport conveyor 410 in a state where the position of the substrate 200 and the plurality of light emitting devices 100 is maintained by the positioning jig 300, whereby the first temperature area 420. To the fifth temperature area 460, the reflow is performed.
  • the molten state of the solder pattern 220 of the substrate 200 due to the heating of the reflow furnace 400 and the sprayed state of hot air in the reflow furnace 400 are various.
  • any of the plurality of light emitting devices 100 on the substrate 200 due to the influence of the molten solder state and the hot air blowing state may vary.
  • the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 100 are constrained on the axial direction of the positioning jig 300 by the positioning jig 300. Therefore, variation in the positional relationship between the substrate 200 and the plurality of light emitting devices 100 can be suppressed.
  • the plurality of light emitting devices 100 are placed on the substrate 200 in a state where the line 121 connecting the center positions of the respective light emitting diode chips 120 of the plurality of light emitting devices 100 and the center line 201 of the substrate 200 substantially coincide with each other. Can be fixed.
  • FIG. 11 is a side view showing a state in which the light guide plate is disposed so as to face a plurality of light emitting devices fixed on the substrate by the light emitting device fixing method according to the present embodiment.
  • the notch part 132 of the reflector 131 is simplified and illustrated.
  • the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 100 and the line 501 passing through the center in the thickness direction of the light guide plate 500 are positioned in substantially the same plane.
  • a plurality of light emitting devices 100 and a light guide plate 500 are arranged.
  • the light 122 from the plurality of light emitting diode chips 120 toward the center of the light guide plate 500, the light 123 toward the upper surface of the light guide plate 500, and the light 124 toward the lower surface of the light guide plate 500 are all guided.
  • the light can enter the light plate 500.
  • the utilization efficiency of light emitted from the plurality of light emitting devices 100 can be increased.
  • a plurality of light emitting devices 100 can be fixed on the substrate 200 with high positional accuracy using a simple positioning jig 300.
  • the light-emitting device fixing method and the light-emitting device according to the second embodiment are different from those of the first embodiment only in the shape of the positioning jig and the shape of the cutout portion of the reflector.
  • FIG. 12 is a diagram showing a cross section of the light emitting device according to Embodiment 2 of the present invention.
  • FIG. 13 is a front view showing a state in which the positioning portion of the positioning jig is brought into contact with the notch portion of the reflector according to the present embodiment.
  • FIG. 14 is a cross-sectional view as seen from the direction of arrows XIV-XIV in FIG.
  • a positioning jig 700 having a pentagonal prism shape is used.
  • the positioning portion 710 of the positioning jig 700 has a V-shaped cross-sectional shape in a cross section in a direction orthogonal to the axial direction of the positioning jig 700.
  • the notch 632 formed at the tip of the reflector 631 of the resin part 630 of the light emitting device 600 has an outer surface along the positioning part 710. Therefore, by bringing the positioning part 710 of the positioning jig 700 into contact with the notch part 632 of the reflector 631, the line 121 connecting the center positions of the respective light emitting diode chips 120 of the plurality of light emitting devices 600 is connected to the positioning jig 700. It is parallel to the axis center 720.
  • the solder pattern 220 of the substrate 200 and the terminal 110 of the light emitting device 600 are in contact with each other, and the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 600 and FIG.
  • the positions of the plurality of light emitting devices 600 can be maintained by the positioning jig 700 in a state where the center line 201 of the substrate 200 shown is substantially coincident. In this state, since reflow can be performed, the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 600 and the center line 201 of the substrate 200 shown in FIG. Thus, the plurality of light emitting devices 600 can be fixed on the substrate 200.
  • the utilization efficiency of light emitted from the plurality of light emitting devices 600 can be increased.
  • a plurality of light emitting devices 600 can be fixed on the substrate 200 with high positional accuracy using a simple positioning jig 700.
  • the light-emitting device fixing method and the light-emitting device according to the third embodiment are different from those in the first embodiment only in the shape of the positioning jig and the shape of the cutout portion of the reflector.
  • FIG. 15 is a diagram showing a cross section of a light emitting device according to Embodiment 3 of the present invention.
  • FIG. 16 is a side view showing a state in which the positioning part of the positioning jig is brought into contact with the notch part of the reflector according to the present embodiment.
  • 17 is a cross-sectional view seen from the direction of the arrow XVII-XVII in FIG.
  • a positioning jig 900 having a pentagonal concave portion is used in a side view.
  • the positioning portion 910 of the positioning jig 900 has an inverted V-shaped cross section in a cross section in a direction orthogonal to the axial direction of the positioning jig 900.
  • the notch 832 formed at the tip of the reflector 831 of the resin part 830 of the light emitting device 800 has an outer surface along the positioning part 910. For this reason, by bringing the positioning portion 910 of the positioning jig 900 into contact with the notch portion 832 of the reflector 831, the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 800 is connected to the positioning jig 900. It becomes parallel to the axis center 920.
  • the solder pattern 220 of the substrate 200 and the terminal 110 of the light emitting device 800 are in contact with each other, and the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 800 and FIG.
  • the positions of the plurality of light emitting devices 800 can be maintained by the positioning jig 900 in a state where the center line 201 of the substrate 200 shown is substantially coincident. In this state, since reflow can be performed, the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 800 and the center line 201 of the substrate 200 shown in FIG. Thus, the plurality of light emitting devices 800 can be fixed on the substrate 200.
  • a plurality of light emitting devices 800 can be fixed on the substrate 200 with high positional accuracy using a simple positioning jig 900.
  • 100, 600, 800 light emitting device 110 terminal, 111 first lead terminal, 112 second lead terminal, 120 light emitting diode chip, 130, 630, 830 resin part, 131, 631, 831 reflector, 132, 632, 832 notch Part, 141 first bonding wire, 142 second bonding wire, 200 substrate, 220 solder pattern, 300, 700, 900 positioning jig, 310, 710, 910 positioning part, 400 reflow furnace, 410 transport conveyor, 420 first temperature Area, 430 second temperature area, 440 third temperature area, 450 fourth temperature area, 460 fifth temperature area, 500 light guide plate.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

Le procédé comprend une étape consistant à disposer une pluralité de dispositifs électroluminescents (100), chacun d'eux comprenant une borne (111) sur laquelle un élément électroluminescent (120) est monté et un réflecteur (131) qui entoure la périphérie de l'élément électroluminescent (120), en des endroits prévus sur une carte (200) sur laquelle est formé un motif de soudure (200) ; une étape dans laquelle une section de positionnement (310) d'un gabarit de positionnement en forme de tige simple (300) qui maintient la disposition de chaque dispositif de la pluralité de dispositifs électroluminescents (100) est amenée en contact avec une partie de chaque réflecteur (131) de la pluralité de dispositifs électroluminescents (100) ; et une étape consistant à réaliser un soudage par refusion au moyen d'un chauffage et l'application d'un flux d'air chaud, dans un état où le gabarit de positionnement (300) est en contact avec chaque dispositif de la pluralité de dispositifs électroluminescents (100). Par la mise en contact de la section de positionnement (310) du gabarit de positionnement (300) avec une partie du réflecteur (131), une ligne (121) rejoignant les positions centrales de chaque élément électroluminescent (120) de la pluralité de dispositifs électroluminescents (100) devient parallèle avec l'axe central (320) du gabarit de positionnement (300).
PCT/JP2012/056246 2011-03-18 2012-03-12 Procédé pour la fixation d'un dispositif électroluminescent, et dispositif électroluminescent WO2012128094A1 (fr)

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JP2011061201 2011-03-18
JP2011-061201 2011-03-18

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Cited By (4)

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CN106908961A (zh) * 2017-04-24 2017-06-30 上海航天控制技术研究所 基于红外成像的光学组件调试方法及工具
US10217675B2 (en) 2013-02-28 2019-02-26 A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Placement method for circuit carrier and circuit carrier
JP2019523560A (ja) * 2016-07-28 2019-08-22 リンゼンス・ホールディング 発光デバイス及びその製造方法
US10634325B2 (en) 2014-08-04 2020-04-28 Fuji Corporation Mounting device

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JP2001111068A (ja) * 1999-10-04 2001-04-20 Japan Aviation Electronics Industry Ltd 光モジュール
JP2010139630A (ja) * 2008-12-10 2010-06-24 Nikon Corp 表示装置及びその製造方法
JP3166538U (ja) * 2010-12-24 2011-03-10 睿騰光電科技股▲ふん▼有限公司 Ｌｅｄモジュールのアセンブリ構造

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Publication number Priority date Publication date Assignee Title
JP2001111068A (ja) * 1999-10-04 2001-04-20 Japan Aviation Electronics Industry Ltd 光モジュール
JP2010139630A (ja) * 2008-12-10 2010-06-24 Nikon Corp 表示装置及びその製造方法
JP3166538U (ja) * 2010-12-24 2011-03-10 睿騰光電科技股▲ふん▼有限公司 Ｌｅｄモジュールのアセンブリ構造

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10217675B2 (en) 2013-02-28 2019-02-26 A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Placement method for circuit carrier and circuit carrier
US10672672B2 (en) 2013-02-28 2020-06-02 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Placement method for circuit carrier and circuit carrier
US10991632B2 (en) 2013-02-28 2021-04-27 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Assembly process for circuit carrier and circuit carrier
US10634325B2 (en) 2014-08-04 2020-04-28 Fuji Corporation Mounting device
JP2019523560A (ja) * 2016-07-28 2019-08-22 リンゼンス・ホールディング 発光デバイス及びその製造方法
CN106908961A (zh) * 2017-04-24 2017-06-30 上海航天控制技术研究所 基于红外成像的光学组件调试方法及工具
CN106908961B (zh) * 2017-04-24 2019-05-03 上海航天控制技术研究所 基于红外成像的光学组件调试方法及工具

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