WO2012128094A1 - Method for securing light-emitting device and light-emitting device - Google Patents

Method for securing light-emitting device and light-emitting device Download PDF

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Publication number
WO2012128094A1
WO2012128094A1 PCT/JP2012/056246 JP2012056246W WO2012128094A1 WO 2012128094 A1 WO2012128094 A1 WO 2012128094A1 JP 2012056246 W JP2012056246 W JP 2012056246W WO 2012128094 A1 WO2012128094 A1 WO 2012128094A1
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WIPO (PCT)
Prior art keywords
light emitting
light
emitting device
jig
positioning
Prior art date
Application number
PCT/JP2012/056246
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French (fr)
Japanese (ja)
Inventor
目見田　裕一
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シャープ株式会社
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Publication of WO2012128094A1 publication Critical patent/WO2012128094A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/027—Mountings, adjusting means, or light-tight connections, for optical elements for lenses the lens being in the form of a sphere or ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Definitions

  • the present invention relates to a light emitting device fixing method and a light emitting device, and more particularly to a light emitting device fixing method and a light emitting device that perform fixing by reflow.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2004-22245 is a prior art document that discloses a light emitting device package that increases the efficiency of light incident on a light guide plate and enables the backlight unit to be thinned.
  • the light emitting element package described in Patent Document 1 includes a main body on which the light emitting element is mounted and a pair of projecting portions projecting from the main body.
  • the pair of protrusions are positioned so as to sandwich the light exit surface, and are set at an interval at which the light guide plate can be inserted.
  • the light guide plate is inserted between the pair of projecting portions, the central portion in the thickness direction of the light guide plate and the central portion of the light emitting element's emission surface are aligned and faced, and the light guide plate is brought close to the light emitting element's emission surface By holding in the state, the positional relationship between the light guide plate and the light emitting element is set to an optimum state.
  • a plurality of light emitting devices such as a light emitting element package are arranged on a substrate.
  • the positional accuracy of the plurality of light emitting devices on the substrate is important.
  • the positional relationship between the center of the plurality of light emitting elements and the substrate cannot be optimized.
  • the present invention has been made in view of the above-described problems, and an object of the present invention is to provide a light emitting device fixing method and a light emitting device capable of accurately fixing a plurality of light emitting devices on a substrate.
  • a fixing method of a light emitting device includes a step of arranging a plurality of light emitting devices including a terminal mounted with a light emitting element and a reflector surrounding the periphery of the light emitting element at a predetermined position on a substrate on which a solder pattern is formed; A step of contacting a part of each of the plurality of light emitting devices with a positioning portion of one rod-shaped jig for maintaining the arrangement of each of the plurality of light emitting devices; And reflowing by spraying heating and hot air in a state where the tool is in contact.
  • a line connecting the center positions of the light emitting elements of the plurality of light emitting devices becomes parallel to the axis center of the jig. .
  • a notch corresponding to the shape of the positioning portion of the jig is formed at the tip of the reflector.
  • the positioning portion has an arcuate cross-sectional shape in a cross section in a direction perpendicular to the axial direction of the jig.
  • the notch has an outer surface along the positioning portion.
  • the positioning portion has a V-shaped cross-sectional shape in a cross section in a direction orthogonal to the axial direction of the jig.
  • the notch has an outer surface along the positioning portion.
  • the positioning portion has an inverted V-shaped cross section in a cross section in a direction perpendicular to the axial direction of the jig.
  • the notch has an outer surface along the positioning portion.
  • a plurality of light emitting devices are fixed to a predetermined position on the substrate on which the solder pattern is formed.
  • the light emitting device includes a light emitting element, a terminal on which the light emitting element is mounted, and a reflector surrounding the periphery of the light emitting element.
  • the reflector connects the center positions of the light emitting elements of each of the plurality of light emitting devices by contacting a part of the reflector with a positioning portion of one rod-shaped jig for maintaining the arrangement of each of the plurality of light emitting devices.
  • the ellipse has a shape that is parallel to the axis center of the jig.
  • a plurality of light emitting devices can be fixed on a substrate with high accuracy.
  • FIG. 2 is a cross-sectional view seen from the direction of arrows II-II in FIG.
  • FIG. 3 is a cross-sectional view seen from the direction of arrows III-III in FIG.
  • FIG. 6 is an enlarged partial plan view showing a VI part in FIG. 5.
  • FIG. 8 is a cross-sectional view as seen from the direction of arrows VIII-VIII in FIG. It is a figure which shows typically the state in which reflow is performed in a reflow furnace. It is a graph which shows an example of reflow conditions. It is a side view which shows the state which has arrange
  • FIG. 1 is a plan view showing a configuration of a light emitting device according to Embodiment 1 of the present invention.
  • FIG. 2 is a cross-sectional view seen from the direction of arrows II-II in FIG. 3 is a cross-sectional view as seen from the direction of arrows III-III in FIG.
  • the light emitting device 100 includes a terminal 110 including a first lead terminal 111 and a second lead terminal 112, a light emitting diode chip 120 that is a light emitting element, A resin portion 130, a first bonding wire 141, and a second bonding wire 142 are provided.
  • the first lead terminal 111 is made of a plate-like metal member having a J-shape when viewed from the side.
  • the second lead terminal 112 is made of a plate-like metal member having a J-shape when viewed from the side.
  • the first lead terminal 111 and the second lead terminal 112 are disposed so as to be spaced apart from each other so that their main surfaces are located on substantially the same plane.
  • Resin portion 130 supports terminal 110.
  • the resin portion 130 is formed by insert molding the first lead terminal 111 and the second lead terminal 112.
  • the part located on the main surface side of the terminal 110 becomes a reflector 131 surrounding the light emitting diode chip 120.
  • the reflector 131 reflects the light emitted from the light emitting diode chip 120 and emits the light toward the opening, because the surface of the opening provided in the resin part 130 has light reflectivity.
  • a notch 132 corresponding to the shape of a positioning portion of a positioning jig described later is formed.
  • the size of the resin portion 130 is, for example, 2 mm or less on the short side and 6 mm or less on the long side in plan view.
  • the thickness of the end of the reflector 131 provided with the notch 132 is, for example, not less than 0.1 mm and not more than 0.5 mm.
  • Each of the first lead terminal 111 and the second lead terminal 112 is bent so that a part of the first lead terminal 111 and the second lead terminal 112 protrudes from the side of the resin part 130 along the side and bottom surfaces of the resin part 130.
  • a part of each of the first lead terminal 111 and the second lead terminal 112 located along the bottom surface of the resin portion 130 is joined to a solder pattern of a substrate described later.
  • the main surfaces of the first lead terminal 111 and the second lead terminal 112 are in contact with the opening of the resin portion 130.
  • the shape of the terminal 110 is not limited to the above, and may be any shape as long as the light-emitting diode chip 120 can be mounted and the light-emitting device 100 can be bonded to the solder pattern of the substrate.
  • the light emitting diode chip 120 is mounted on the first lead terminal 111. Specifically, a die bonder on which the light emitting diode chip 120 is mounted on the first lead terminal 111 is used while recognizing an alignment mark provided in advance on the first lead terminal 111 and the outer shape of the light emitting diode chip 120.
  • the positional accuracy between the light emitting diode chip 120 and the first lead terminal 111 is determined by the device accuracy of the die bonder, and is, for example, a positional accuracy of about ⁇ 50 ⁇ m. Since the light emitting diode chip 120 is fixed by curing the adhesive applied between the light emitting diode chip 120 and the first lead terminal 111 at a high temperature in an oven, the position is shifted by hot air during reflow. Does not happen.
  • the light emitting diode chip 120 is connected to the first lead terminal 111 by the first bonding wire 141.
  • the light emitting diode chip 120 is connected to the second lead terminal 112 by the second bonding wire 142.
  • the light emitting diode chip 120 irradiates light to the opening side of the resin portion 130.
  • FIG. 4 is a flowchart showing a method of fixing the light emitting device according to this embodiment.
  • a step (S100) of arranging a plurality of light emitting devices 100 at predetermined positions on the substrate and a step of bringing a positioning part into contact with the reflector ( S110) and a reflow process (S120).
  • FIG. 5 is a plan view showing a state in which the light emitting device is arranged at a predetermined position on the substrate.
  • FIG. 6 is a partial plan view showing the VI part of FIG. 5 in an enlarged manner. 5 and 6, the configuration of the light emitting device 100 is simplified.
  • a plurality of light emitting devices 100 are arranged at predetermined positions on a substrate 200 on which a solder pattern is formed. Specifically, a mounter on which the light emitting device 100 is mounted on the substrate 200 is used while recognizing an alignment mark provided in advance on the substrate 200 and the outer shape of the light emitting device 100.
  • the positional accuracy of the light emitting device 100 on the substrate 200 is determined by the mounting accuracy of the mounter, and is, for example, a positional accuracy of about ⁇ 50 ⁇ m. Therefore, the center line 201 in the longitudinal direction of the substrate 200 and the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 100 substantially coincide with each other.
  • the positioning portion 310 of one rod-shaped positioning jig 300 for maintaining the arrangement of each of the plurality of light emitting devices 100 in the notch 132 that is a part of the reflector 131 of each of the plurality of light emitting devices 100.
  • an iron round bar is used as the positioning jig 300.
  • the positioning jig 300 is not limited to this, and has an appropriate weight, uniform outer dimensions, and is difficult to be thermally deformed. Any rod-shaped member may be used.
  • FIG. 7 is a front view showing a state in which the positioning part of the positioning jig is brought into contact with the notch part of the reflector.
  • FIG. 8 is a cross-sectional view as seen from the direction of arrows VIII-VIII in FIG.
  • the positioning jig 300 has a cylindrical shape. Therefore, the positioning part 310 has an arcuate cross-sectional shape in a cross section in a direction orthogonal to the axial direction of the positioning jig 300.
  • the notch 132 of the reflector 131 has an outer surface along the positioning part 310 of the positioning jig 300. Therefore, by bringing the positioning portion 310 of the positioning jig 300 into contact with the notch portion 132 of the reflector 131, the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 100 is connected to the positioning jig 300. It becomes parallel to the axis center 320.
  • the solder pattern 220 of the substrate 200 and the terminal 110 of the light emitting device 100 are in contact with each other, and the line 121 connecting the central positions of the light emitting diode chips 120 of the plurality of light emitting devices 100 and FIG.
  • the positions of the plurality of light emitting devices 100 are maintained by the positioning jig 300 in a state where the center line 201 of the substrate 200 shown is substantially coincident. In this state, reflow is performed.
  • FIG. 9 is a diagram schematically showing a state in which reflow is performed in a reflow furnace.
  • FIG. 10 is a graph showing an example of reflow conditions.
  • the vertical axis represents the temperature (° C.) of the solder pattern 220 and the horizontal axis represents the processing time (s).
  • the reflow furnace 400 has five temperature areas.
  • the process of the I section shown in FIG. 10 is performed. Specifically, a weak wind having a temperature of 150 ° C. is blown in the direction indicated by the arrow 421 in the figure, and the temperature of the solder pattern 220 is increased at a rate of 1 ° C./s to 5 ° C./s.
  • the processing of section II shown in FIG. 10 is performed. Specifically, the temperature of the solder pattern 220 is set to 180 ° C. or higher and 200 ° C. or lower and maintained for 120 seconds or less.
  • the process of section III shown in FIG. 10 is performed. Specifically, a strong wind at a temperature of 260 ° C. is sprayed in the direction indicated by the arrow 441 in the figure, and the temperature of the solder pattern 220 is increased at a rate of 1 ° C./s to 5 ° C./s.
  • the processing of the IV section shown in FIG. 10 is performed. Specifically, the temperature of the solder pattern 220 is maintained at a maximum of 260 ° C. for 10 seconds or less.
  • the process of the V section shown in FIG. 10 is performed. Specifically, a slight wind of 50 ° C. is blown in the direction indicated by the arrow 461 in the figure, and the temperature of the solder pattern 220 is lowered at a speed of 10 ° C./s to 25 ° C./s.
  • the substrate 200 is transported in the direction indicated by the arrow 411 in the drawing by the transport conveyor 410 in a state where the position of the substrate 200 and the plurality of light emitting devices 100 is maintained by the positioning jig 300, whereby the first temperature area 420. To the fifth temperature area 460, the reflow is performed.
  • the molten state of the solder pattern 220 of the substrate 200 due to the heating of the reflow furnace 400 and the sprayed state of hot air in the reflow furnace 400 are various.
  • any of the plurality of light emitting devices 100 on the substrate 200 due to the influence of the molten solder state and the hot air blowing state may vary.
  • the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 100 are constrained on the axial direction of the positioning jig 300 by the positioning jig 300. Therefore, variation in the positional relationship between the substrate 200 and the plurality of light emitting devices 100 can be suppressed.
  • the plurality of light emitting devices 100 are placed on the substrate 200 in a state where the line 121 connecting the center positions of the respective light emitting diode chips 120 of the plurality of light emitting devices 100 and the center line 201 of the substrate 200 substantially coincide with each other. Can be fixed.
  • FIG. 11 is a side view showing a state in which the light guide plate is disposed so as to face a plurality of light emitting devices fixed on the substrate by the light emitting device fixing method according to the present embodiment.
  • the notch part 132 of the reflector 131 is simplified and illustrated.
  • the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 100 and the line 501 passing through the center in the thickness direction of the light guide plate 500 are positioned in substantially the same plane.
  • a plurality of light emitting devices 100 and a light guide plate 500 are arranged.
  • the light 122 from the plurality of light emitting diode chips 120 toward the center of the light guide plate 500, the light 123 toward the upper surface of the light guide plate 500, and the light 124 toward the lower surface of the light guide plate 500 are all guided.
  • the light can enter the light plate 500.
  • the utilization efficiency of light emitted from the plurality of light emitting devices 100 can be increased.
  • a plurality of light emitting devices 100 can be fixed on the substrate 200 with high positional accuracy using a simple positioning jig 300.
  • the light-emitting device fixing method and the light-emitting device according to the second embodiment are different from those of the first embodiment only in the shape of the positioning jig and the shape of the cutout portion of the reflector.
  • FIG. 12 is a diagram showing a cross section of the light emitting device according to Embodiment 2 of the present invention.
  • FIG. 13 is a front view showing a state in which the positioning portion of the positioning jig is brought into contact with the notch portion of the reflector according to the present embodiment.
  • FIG. 14 is a cross-sectional view as seen from the direction of arrows XIV-XIV in FIG.
  • a positioning jig 700 having a pentagonal prism shape is used.
  • the positioning portion 710 of the positioning jig 700 has a V-shaped cross-sectional shape in a cross section in a direction orthogonal to the axial direction of the positioning jig 700.
  • the notch 632 formed at the tip of the reflector 631 of the resin part 630 of the light emitting device 600 has an outer surface along the positioning part 710. Therefore, by bringing the positioning part 710 of the positioning jig 700 into contact with the notch part 632 of the reflector 631, the line 121 connecting the center positions of the respective light emitting diode chips 120 of the plurality of light emitting devices 600 is connected to the positioning jig 700. It is parallel to the axis center 720.
  • the solder pattern 220 of the substrate 200 and the terminal 110 of the light emitting device 600 are in contact with each other, and the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 600 and FIG.
  • the positions of the plurality of light emitting devices 600 can be maintained by the positioning jig 700 in a state where the center line 201 of the substrate 200 shown is substantially coincident. In this state, since reflow can be performed, the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 600 and the center line 201 of the substrate 200 shown in FIG. Thus, the plurality of light emitting devices 600 can be fixed on the substrate 200.
  • the utilization efficiency of light emitted from the plurality of light emitting devices 600 can be increased.
  • a plurality of light emitting devices 600 can be fixed on the substrate 200 with high positional accuracy using a simple positioning jig 700.
  • the light-emitting device fixing method and the light-emitting device according to the third embodiment are different from those in the first embodiment only in the shape of the positioning jig and the shape of the cutout portion of the reflector.
  • FIG. 15 is a diagram showing a cross section of a light emitting device according to Embodiment 3 of the present invention.
  • FIG. 16 is a side view showing a state in which the positioning part of the positioning jig is brought into contact with the notch part of the reflector according to the present embodiment.
  • 17 is a cross-sectional view seen from the direction of the arrow XVII-XVII in FIG.
  • a positioning jig 900 having a pentagonal concave portion is used in a side view.
  • the positioning portion 910 of the positioning jig 900 has an inverted V-shaped cross section in a cross section in a direction orthogonal to the axial direction of the positioning jig 900.
  • the notch 832 formed at the tip of the reflector 831 of the resin part 830 of the light emitting device 800 has an outer surface along the positioning part 910. For this reason, by bringing the positioning portion 910 of the positioning jig 900 into contact with the notch portion 832 of the reflector 831, the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 800 is connected to the positioning jig 900. It becomes parallel to the axis center 920.
  • the solder pattern 220 of the substrate 200 and the terminal 110 of the light emitting device 800 are in contact with each other, and the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 800 and FIG.
  • the positions of the plurality of light emitting devices 800 can be maintained by the positioning jig 900 in a state where the center line 201 of the substrate 200 shown is substantially coincident. In this state, since reflow can be performed, the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 800 and the center line 201 of the substrate 200 shown in FIG. Thus, the plurality of light emitting devices 800 can be fixed on the substrate 200.
  • a plurality of light emitting devices 800 can be fixed on the substrate 200 with high positional accuracy using a simple positioning jig 900.
  • 100, 600, 800 light emitting device 110 terminal, 111 first lead terminal, 112 second lead terminal, 120 light emitting diode chip, 130, 630, 830 resin part, 131, 631, 831 reflector, 132, 632, 832 notch Part, 141 first bonding wire, 142 second bonding wire, 200 substrate, 220 solder pattern, 300, 700, 900 positioning jig, 310, 710, 910 positioning part, 400 reflow furnace, 410 transport conveyor, 420 first temperature Area, 430 second temperature area, 440 third temperature area, 450 fourth temperature area, 460 fifth temperature area, 500 light guide plate.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention comprises the following steps: a step of disposing a plurality of light-emitting devices (100), each of which comprises a terminal (111) on which a light-emitting element (120) is mounted and a reflector (131) that surrounds the periphery of the light-emitting element (120), at prescribed locations on a board (200) on which a soldering pattern (220) is formed; a step in which a positioning section (310) of a single rod-shaped positioning jig (300) that maintains the disposition of each of the plurality of light-emitting devices (100) is brought into contact with part of each reflector (131) of the plurality of light-emitting devices (100); and a step of performing reflow soldering by means of heating and the application of a hot airflow, in a state where the positioning jig (300) is in contact with each of the plurality of light-emitting devices (100). By bringing the positioning section (310) of the positioning jig (300) into contact with part of the reflector (131), a line (121) joining the central positions of each of the light-emitting elements (120) of the plurality of light-emitting devices (100) becomes parallel with the central axis (320) of the positioning jig (300).

Description

発光装置の固定方法および発光装置Fixing method of light emitting device and light emitting device
　本発明は、発光装置の固定方法および発光装置に関し、特に、リフローにより固定を行なう発光装置の固定方法および発光装置に関する。 The present invention relates to a light emitting device fixing method and a light emitting device, and more particularly to a light emitting device fixing method and a light emitting device that perform fixing by reflow.
　導光板への光の入射効率を高め、バックライトユニットの薄型化を可能とする発光素子用パッケージを開示した先行文献として、特開２００４－２２２４５号公報(特許文献１)がある。特許文献１に記載された発光素子用パッケージは、発光素子が実装される本体と本体から突出する一対の突出部を有している。 Japanese Unexamined Patent Application Publication No. 2004-22245 (Patent Document 1) is a prior art document that discloses a light emitting device package that increases the efficiency of light incident on a light guide plate and enables the backlight unit to be thinned. The light emitting element package described in Patent Document 1 includes a main body on which the light emitting element is mounted and a pair of projecting portions projecting from the main body.
　一対の突出部は、出射面を挟むように位置づけられ、導光板が挿入可能な間隔に設定されている。一対の突出部の間に導光板を挿入し、導光板の厚み方向の中心部と発光素子の出射面の中心部とを揃えて対面させると共に、導光板を発光素子の出射面に接近させた状態で保持することで、導光板と発光素子との位置関係を最適な状態に設定している。 The pair of protrusions are positioned so as to sandwich the light exit surface, and are set at an interval at which the light guide plate can be inserted. The light guide plate is inserted between the pair of projecting portions, the central portion in the thickness direction of the light guide plate and the central portion of the light emitting element's emission surface are aligned and faced, and the light guide plate is brought close to the light emitting element's emission surface By holding in the state, the positional relationship between the light guide plate and the light emitting element is set to an optimum state.
特開２００４－２２２４５号公報JP 2004-22245 A
　発光素子用パッケージなどの発光装置は、基板上に複数配置される。複数の発光装置の各々の発光素子と導光板との位置精度を向上するためには、基板上における複数の発光装置の位置精度が重要である。複数の発光素子の中心と基板との位置関係にばらつきがある場合、導光板と複数の発光素子の各々との位置関係を最適な状態にすることができない。 A plurality of light emitting devices such as a light emitting element package are arranged on a substrate. In order to improve the positional accuracy of each light emitting element and the light guide plate of the plurality of light emitting devices, the positional accuracy of the plurality of light emitting devices on the substrate is important. When there is variation in the positional relationship between the center of the plurality of light emitting elements and the substrate, the positional relationship between the light guide plate and each of the plurality of light emitting elements cannot be optimized.
　本発明は上記の問題点に鑑みてなされたものであって、複数の発光装置を基板上に精度良く固定することができる、発光装置の固定方法および発光装置を提供することを目的とする。 The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a light emitting device fixing method and a light emitting device capable of accurately fixing a plurality of light emitting devices on a substrate.
　本発明に基づく発光装置の固定方法は、発光素子を実装した端子および発光素子の周囲を囲むリフレクタを含む複数の発光装置を、半田パターンが形成された基板上の所定の位置に配置する工程と、複数の発光装置の各々のリフレクタの一部に、複数の発光装置の各々の配置を維持するための１つの棒状の治具の位置決め部を接触させる工程と、複数の発光装置の各々に治具を接触させた状態で、加熱および熱風を噴き付けることによりリフローする工程とを備える。位置決め部を接触させる工程において、リフレクタの一部に治具の位置決め部を接触させることにより、複数の発光装置の各々の発光素子の中心位置を結んだ線が治具の軸中心と平行になる。 A fixing method of a light emitting device according to the present invention includes a step of arranging a plurality of light emitting devices including a terminal mounted with a light emitting element and a reflector surrounding the periphery of the light emitting element at a predetermined position on a substrate on which a solder pattern is formed; A step of contacting a part of each of the plurality of light emitting devices with a positioning portion of one rod-shaped jig for maintaining the arrangement of each of the plurality of light emitting devices; And reflowing by spraying heating and hot air in a state where the tool is in contact. In the step of bringing the positioning part into contact, by bringing the jig positioning part into contact with a part of the reflector, a line connecting the center positions of the light emitting elements of the plurality of light emitting devices becomes parallel to the axis center of the jig. .
　本発明の一形態においては、リフレクタの先端に、治具の位置決め部の形状に対応した切欠き部が形成されている。 In one embodiment of the present invention, a notch corresponding to the shape of the positioning portion of the jig is formed at the tip of the reflector.
　本発明の一形態においては、位置決め部は、治具の軸方向に直交する方向の断面において円弧状の断面形状を有する。切欠き部は、位置決め部に沿う外表面を有する。 In one embodiment of the present invention, the positioning portion has an arcuate cross-sectional shape in a cross section in a direction perpendicular to the axial direction of the jig. The notch has an outer surface along the positioning portion.
　本発明の一形態においては、位置決め部は、治具の軸方向に直交する方向の断面においてＶ字状の断面形状を有する。切欠き部は、位置決め部に沿う外表面を有する。 In one embodiment of the present invention, the positioning portion has a V-shaped cross-sectional shape in a cross section in a direction orthogonal to the axial direction of the jig. The notch has an outer surface along the positioning portion.
　本発明の一形態においては、位置決め部は、治具の軸方向に直交する方向の断面において逆Ｖ字状の断面形状を有する。切欠き部は、位置決め部に沿う外表面を有する。 In one embodiment of the present invention, the positioning portion has an inverted V-shaped cross section in a cross section in a direction perpendicular to the axial direction of the jig. The notch has an outer surface along the positioning portion.
　本発明に基づく発光装置においては、半田パターンが形成された基板上の所定の位置に複数固定される発光装置である。発光装置は、発光素子と、発光素子が実装される端子と、発光素子の周囲を囲むリフレクタとを備える。リフレクタは、リフレクタの一部が複数の発光装置の各々の配置を維持するための１つの棒状の治具の位置決め部と接触することにより、複数の発光装置の各々の発光素子の中心位置を結んだ線が治具の軸中心と平行になる形状を有する。 In the light emitting device according to the present invention, a plurality of light emitting devices are fixed to a predetermined position on the substrate on which the solder pattern is formed. The light emitting device includes a light emitting element, a terminal on which the light emitting element is mounted, and a reflector surrounding the periphery of the light emitting element. The reflector connects the center positions of the light emitting elements of each of the plurality of light emitting devices by contacting a part of the reflector with a positioning portion of one rod-shaped jig for maintaining the arrangement of each of the plurality of light emitting devices. The ellipse has a shape that is parallel to the axis center of the jig.
　本発明によれば、複数の発光装置を基板上に精度良く固定することができる。 According to the present invention, a plurality of light emitting devices can be fixed on a substrate with high accuracy.
本発明の実施形態１に係る発光装置の構成を示す平面図である。It is a top view which shows the structure of the light-emitting device which concerns on Embodiment 1 of this invention. 図１のＩＩ－ＩＩ線矢印方向から見た断面図である。FIG. 2 is a cross-sectional view seen from the direction of arrows II-II in FIG. 図１のＩＩＩ－ＩＩＩ線矢印方向から見た断面図である。FIG. 3 is a cross-sectional view seen from the direction of arrows III-III in FIG. 同実施形態に係る発光装置の固定方法を示すフローチャートである。It is a flowchart which shows the fixing method of the light-emitting device which concerns on the same embodiment. 発光装置を基板上の所定の位置に配置した状態を示す平面図である。It is a top view which shows the state which has arrange | positioned the light-emitting device in the predetermined position on a board | substrate. 図５のＶＩ部を拡大して示す一部平面図である。FIG. 6 is an enlarged partial plan view showing a VI part in FIG. 5. リフレクタの切欠き部に位置決め治具の位置決め部を接触させた状態を示す正面図である。It is a front view which shows the state which made the positioning part of the positioning jig contact the notch part of a reflector. 図７のＶＩＩＩ－ＶＩＩＩ線矢印方向から見た断面図である。FIG. 8 is a cross-sectional view as seen from the direction of arrows VIII-VIII in FIG. リフロー炉においてリフローが行なわれる状態を模式的に示す図である。It is a figure which shows typically the state in which reflow is performed in a reflow furnace. リフロー条件の一例を示すグラフである。It is a graph which shows an example of reflow conditions. 同実施形態に係る発光装置の固定方法により基板上に固定された複数の発光装置と対向するように導光板を配置した状態を示す側面図である。It is a side view which shows the state which has arrange | positioned the light-guide plate so that the several light-emitting device fixed on the board | substrate with the fixing method of the light-emitting device concerning the embodiment may be opposed. 本発明の実施形態２に係る発光装置の横断面を示す図である。It is a figure which shows the cross section of the light-emitting device which concerns on Embodiment 2 of this invention. 同実施形態に係るリフレクタの切欠き部に位置決め治具の位置決め部を接触させた状態を示す正面図である。It is a front view which shows the state which made the positioning part of the positioning jig contact the notch part of the reflector which concerns on the same embodiment. 図１３のＸＩＶ－ＸＩＶ線矢印方向から見た断面図である。It is sectional drawing seen from the XIV-XIV line arrow direction of FIG. 本発明の実施形態３に係る発光装置の横断面を示す図である。It is a figure which shows the cross section of the light-emitting device which concerns on Embodiment 3 of this invention. 同実施形態に係るリフレクタの切欠き部に位置決め治具の位置決め部を接触させた状態を示す側面図である。It is a side view which shows the state which made the positioning part of the positioning jig contact the notch part of the reflector which concerns on the same embodiment. 図１６のＸＶＩＩ－ＸＶＩＩ線矢印方向から見た断面図である。It is sectional drawing seen from the XVII-XVII line arrow direction of FIG.
　以下、本発明の実施形態１に係る発光装置の固定方法および発光装置について図面を参照して説明する。以下の実施形態の説明においては、図中の同一または相当部分には同一符号を付して、その説明は繰り返さない。 Hereinafter, a light emitting device fixing method and a light emitting device according to Embodiment 1 of the present invention will be described with reference to the drawings. In the following description of the embodiments, the same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated.
　(実施形態１)
　図１は、本発明の実施形態１に係る発光装置の構成を示す平面図である。図２は、図１のＩＩ－ＩＩ線矢印方向から見た断面図である。図３は、図１のＩＩＩ－ＩＩＩ線矢印方向から見た断面図である。 (Embodiment 1)
FIG. 1 is a plan view showing a configuration of a light emitting device according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view seen from the direction of arrows II-II in FIG. 3 is a cross-sectional view as seen from the direction of arrows III-III in FIG.
　図１から図３に示すように、本発明の実施形態１に係る発光装置１００は、第１リード端子１１１および第２リード端子１１２を含む端子１１０と、発光素子である発光ダイオードチップ１２０と、樹脂部１３０と、第１ボンディングワイヤ１４１および第２ボンディングワイヤ１４２とを備える。 As shown in FIGS. 1 to 3, the light emitting device 100 according to the first embodiment of the present invention includes a terminal 110 including a first lead terminal 111 and a second lead terminal 112, a light emitting diode chip 120 that is a light emitting element, A resin portion 130, a first bonding wire 141, and a second bonding wire 142 are provided.
　第１リード端子１１１は、側面視においてＪ字状の形状を有する板状の金属部材からなる。第２リード端子１１２は、側面視においてＪ字状の形状を有する板状の金属部材からなる。第１リード端子１１１と第２リード端子１１２とは、互いに間隔を置いて、それぞれの主表面が略同一平面上に位置するように配置される。 The first lead terminal 111 is made of a plate-like metal member having a J-shape when viewed from the side. The second lead terminal 112 is made of a plate-like metal member having a J-shape when viewed from the side. The first lead terminal 111 and the second lead terminal 112 are disposed so as to be spaced apart from each other so that their main surfaces are located on substantially the same plane.
　樹脂部１３０は、端子１１０を支持している。樹脂部１３０は、第１リード端子１１１および第２リード端子１１２をインサート成型することにより形成される。 Resin portion 130 supports terminal 110. The resin portion 130 is formed by insert molding the first lead terminal 111 and the second lead terminal 112.
　樹脂部１３０において、端子１１０の主表面側に位置する部分は、発光ダイオードチップ１２０の周囲を囲むリフレクタ１３１となる。リフレクタ１３１は、樹脂部１３０に設けられた開口部の表面が光反射性を有することにより、発光ダイオードチップ１２０から照射された光を反射して開口部側に出射させる。リフレクタ１３１の先端には、後述する位置決め治具の位置決め部の形状に対応した切欠き部１３２が形成されている。 In the resin part 130, the part located on the main surface side of the terminal 110 becomes a reflector 131 surrounding the light emitting diode chip 120. The reflector 131 reflects the light emitted from the light emitting diode chip 120 and emits the light toward the opening, because the surface of the opening provided in the resin part 130 has light reflectivity. At the tip of the reflector 131, a notch 132 corresponding to the shape of a positioning portion of a positioning jig described later is formed.
　樹脂部１３０の大きさは、たとえば、平面視において、短辺が２ｍｍ以下、長辺が６ｍｍ以下である。切欠き部１３２が設けられるリフレクタ１３１の端部の厚さは、たとえば、０．１ｍｍ以上０．５ｍｍ以下である。 The size of the resin portion 130 is, for example, 2 mm or less on the short side and 6 mm or less on the long side in plan view. The thickness of the end of the reflector 131 provided with the notch 132 is, for example, not less than 0.1 mm and not more than 0.5 mm.
　第１リード端子１１１および第２リード端子１１２の各々は、一部が樹脂部１３０の側方から突出して樹脂部１３０の側面および底面に沿うように曲折している。樹脂部１３０の底面に沿って位置する第１リード端子１１１および第２リード端子１１２の各々の一部は、後述する基板の半田パターンと接合される。第１リード端子１１１および第２リード端子１１２の各々の主表面は、樹脂部１３０の開口部と接している。なお、端子１１０の形状は上記に限られず、発光ダイオードチップ１２０を実装でき、かつ、発光装置１００を基板の半田パターンに接合可能な形状であればよい。 Each of the first lead terminal 111 and the second lead terminal 112 is bent so that a part of the first lead terminal 111 and the second lead terminal 112 protrudes from the side of the resin part 130 along the side and bottom surfaces of the resin part 130. A part of each of the first lead terminal 111 and the second lead terminal 112 located along the bottom surface of the resin portion 130 is joined to a solder pattern of a substrate described later. The main surfaces of the first lead terminal 111 and the second lead terminal 112 are in contact with the opening of the resin portion 130. Note that the shape of the terminal 110 is not limited to the above, and may be any shape as long as the light-emitting diode chip 120 can be mounted and the light-emitting device 100 can be bonded to the solder pattern of the substrate.
　発光ダイオードチップ１２０は、第１リード端子１１１に実装されている。具体的には、予め第１リード端子１１１上に設けられた位置合わせマークと発光ダイオードチップ１２０の外形とを認識しつつ、第１リード端子１１１上に発光ダイオードチップ１２０を搭載するダイボンダーを用いる。 The light emitting diode chip 120 is mounted on the first lead terminal 111. Specifically, a die bonder on which the light emitting diode chip 120 is mounted on the first lead terminal 111 is used while recognizing an alignment mark provided in advance on the first lead terminal 111 and the outer shape of the light emitting diode chip 120.
　発光ダイオードチップ１２０と第１リード端子１１１との位置精度は、ダイボンダーの装置精度により決定され、たとえば、±５０μｍ程度の位置精度である。なお、発光ダイオードチップ１２０の固定は、発光ダイオードチップ１２０と第１リード端子１１１との間に塗布した接着剤をオーブンで高温にして硬化させることにより行なうため、リフロー時のような熱風による位置ずれは起こらない。 The positional accuracy between the light emitting diode chip 120 and the first lead terminal 111 is determined by the device accuracy of the die bonder, and is, for example, a positional accuracy of about ± 50 μm. Since the light emitting diode chip 120 is fixed by curing the adhesive applied between the light emitting diode chip 120 and the first lead terminal 111 at a high temperature in an oven, the position is shifted by hot air during reflow. Does not happen.
　発光ダイオードチップ１２０は、第１ボンディングワイヤ１４１により第１リード端子１１１と接続されている。また、発光ダイオードチップ１２０は、第２ボンディングワイヤ１４２により第２リード端子１１２と接続されている。発光ダイオードチップ１２０は、樹脂部１３０の開口部側に光を照射する。 The light emitting diode chip 120 is connected to the first lead terminal 111 by the first bonding wire 141. The light emitting diode chip 120 is connected to the second lead terminal 112 by the second bonding wire 142. The light emitting diode chip 120 irradiates light to the opening side of the resin portion 130.
　ここで、本実施形態に係る発光装置の固定方法について説明する。図４は、本実施形態に係る発光装置の固定方法を示すフローチャートである。図４に示すように、本実施形態に係る発光装置の固定方法においては、複数の発光装置１００を基板上の所定の位置に配置する工程(Ｓ１００)と、リフレクタに位置決め部を接触させる工程(Ｓ１１０)と、リフロー工程(Ｓ１２０)とを備える。 Here, a method for fixing the light emitting device according to the present embodiment will be described. FIG. 4 is a flowchart showing a method of fixing the light emitting device according to this embodiment. As shown in FIG. 4, in the fixing method of the light emitting device according to the present embodiment, a step (S100) of arranging a plurality of light emitting devices 100 at predetermined positions on the substrate, and a step of bringing a positioning part into contact with the reflector ( S110) and a reflow process (S120).
　以下、本実施形態に係る発光装置１００を半田パターンが形成された基板上の所定の位置に複数固定する方法について説明する。 Hereinafter, a method of fixing a plurality of light emitting devices 100 according to the present embodiment to predetermined positions on a substrate on which a solder pattern is formed will be described.
　図５は、発光装置を基板上の所定の位置に配置した状態を示す平面図である。図６は、図５のＶＩ部を拡大して示す一部平面図である。なお、図５，６においては、発光装置１００の構成を簡略化して示している。 FIG. 5 is a plan view showing a state in which the light emitting device is arranged at a predetermined position on the substrate. FIG. 6 is a partial plan view showing the VI part of FIG. 5 in an enlarged manner. 5 and 6, the configuration of the light emitting device 100 is simplified.
　図５，６に示すように、まず、半田パターンが形成された基板２００上の所定の位置に複数の発光装置１００を配置する。具体的には、予め基板２００上に設けられた位置合わせマークと発光装置１００の外形とを認識しつつ、基板２００上に発光装置１００を搭載するマウンターを用いる。 As shown in FIGS. 5 and 6, first, a plurality of light emitting devices 100 are arranged at predetermined positions on a substrate 200 on which a solder pattern is formed. Specifically, a mounter on which the light emitting device 100 is mounted on the substrate 200 is used while recognizing an alignment mark provided in advance on the substrate 200 and the outer shape of the light emitting device 100.
　発光装置１００の基板２００上における位置精度は、マウンターの装置精度により決定され、たとえば、±５０μｍ程度の位置精度である。よって、基板２００の長手方向における中心線２０１と、複数の発光装置１００の各々の発光ダイオードチップ１２０の中心位置を結んだ線１２１とは略一致している。 The positional accuracy of the light emitting device 100 on the substrate 200 is determined by the mounting accuracy of the mounter, and is, for example, a positional accuracy of about ± 50 μm. Therefore, the center line 201 in the longitudinal direction of the substrate 200 and the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 100 substantially coincide with each other.
　次に、複数の発光装置１００の各々のリフレクタ１３１の一部である切欠き部１３２に、複数の発光装置１００の各々の配置を維持するための１つの棒状の位置決め治具３００の位置決め部３１０を接触させる。本実施形態においては、位置決め治具３００として鉄製の丸棒を使用したが、位置決め治具３００はこれに限られず、適度な重さを有し、外形寸法が均一であり、熱変形しにくい材料からなる棒状部材であればよい。 Next, the positioning portion 310 of one rod-shaped positioning jig 300 for maintaining the arrangement of each of the plurality of light emitting devices 100 in the notch 132 that is a part of the reflector 131 of each of the plurality of light emitting devices 100. Contact. In the present embodiment, an iron round bar is used as the positioning jig 300. However, the positioning jig 300 is not limited to this, and has an appropriate weight, uniform outer dimensions, and is difficult to be thermally deformed. Any rod-shaped member may be used.
　図７は、リフレクタの切欠き部に位置決め治具の位置決め部を接触させた状態を示す正面図である。図８は、図７のＶＩＩＩ－ＶＩＩＩ線矢印方向から見た断面図である。 FIG. 7 is a front view showing a state in which the positioning part of the positioning jig is brought into contact with the notch part of the reflector. FIG. 8 is a cross-sectional view as seen from the direction of arrows VIII-VIII in FIG.
　図７，８に示すように、本実施形態においては、位置決め治具３００は、円柱状の形状を有している。そのため、位置決め部３１０は、位置決め治具３００の軸方向に直交する方向の断面において円弧状の断面形状を有している。 7 and 8, in this embodiment, the positioning jig 300 has a cylindrical shape. Therefore, the positioning part 310 has an arcuate cross-sectional shape in a cross section in a direction orthogonal to the axial direction of the positioning jig 300.
　リフレクタ１３１の切欠き部１３２は、位置決め治具３００の位置決め部３１０に沿う外表面を有している。そのため、リフレクタ１３１の切欠き部１３２に位置決め治具３００の位置決め部３１０を接触させることにより、複数の発光装置１００の各々の発光ダイオードチップ１２０の中心位置を結んだ線１２１が位置決め治具３００の軸中心３２０と平行になる。 The notch 132 of the reflector 131 has an outer surface along the positioning part 310 of the positioning jig 300. Therefore, by bringing the positioning portion 310 of the positioning jig 300 into contact with the notch portion 132 of the reflector 131, the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 100 is connected to the positioning jig 300. It becomes parallel to the axis center 320.
　このようにすることにより、基板２００の半田パターン２２０と発光装置１００の端子１１０とが接触して、複数の発光装置１００の各々の発光ダイオードチップ１２０の中心位置を結んだ線１２１と図６に示す基板２００の中心線２０１とが略一致している状態で、位置決め治具３００により複数の発光装置１００の位置が維持される。その状態で、リフローが行われる。 By doing so, the solder pattern 220 of the substrate 200 and the terminal 110 of the light emitting device 100 are in contact with each other, and the line 121 connecting the central positions of the light emitting diode chips 120 of the plurality of light emitting devices 100 and FIG. The positions of the plurality of light emitting devices 100 are maintained by the positioning jig 300 in a state where the center line 201 of the substrate 200 shown is substantially coincident. In this state, reflow is performed.
　図９は、リフロー炉においてリフローが行なわれる状態を模式的に示す図である。図１０は、リフロー条件の一例を示すグラフである。図１０においては、縦軸に半田パターン２２０の温度(℃)、横軸に処理時間(ｓ)を示している。 FIG. 9 is a diagram schematically showing a state in which reflow is performed in a reflow furnace. FIG. 10 is a graph showing an example of reflow conditions. In FIG. 10, the vertical axis represents the temperature (° C.) of the solder pattern 220 and the horizontal axis represents the processing time (s).
　図９に示すように、本実施形態に係るリフロー炉４００は、５つの温度エリアを有している。第１温度エリア４２０においては、図１０に示すＩ区間の処理が行なわれる。具体的には、図中の矢印４２１で示す方向に１５０℃の温度の弱風を噴き付け、半田パターン２２０の温度を１℃／ｓ～５℃／ｓの速度で上昇させる。 As shown in FIG. 9, the reflow furnace 400 according to the present embodiment has five temperature areas. In the first temperature area 420, the process of the I section shown in FIG. 10 is performed. Specifically, a weak wind having a temperature of 150 ° C. is blown in the direction indicated by the arrow 421 in the figure, and the temperature of the solder pattern 220 is increased at a rate of 1 ° C./s to 5 ° C./s.
　第２温度エリア４３０においては、図１０に示すＩＩ区間の処理が行なわれる。具体的には、半田パターン２２０の温度を１８０℃以上２００℃以下にして１２０ｓ以内の間維持する。 In the second temperature area 430, the processing of section II shown in FIG. 10 is performed. Specifically, the temperature of the solder pattern 220 is set to 180 ° C. or higher and 200 ° C. or lower and maintained for 120 seconds or less.
　第３温度エリア４４０においては、図１０に示すＩＩＩ区間の処理が行なわれる。具体的には、図中の矢印４４１で示す方向に２６０℃の温度の強風を噴き付け、半田パターン２２０の温度を１℃／ｓ～５℃／ｓの速度で上昇させる。 In the third temperature area 440, the process of section III shown in FIG. 10 is performed. Specifically, a strong wind at a temperature of 260 ° C. is sprayed in the direction indicated by the arrow 441 in the figure, and the temperature of the solder pattern 220 is increased at a rate of 1 ° C./s to 5 ° C./s.
　第４温度エリア４５０においては、図１０に示すＩＶ区間の処理が行なわれる。具体的には、半田パターン２２０の温度を最大２６０℃にして１０ｓ以内の間維持する。 In the fourth temperature area 450, the processing of the IV section shown in FIG. 10 is performed. Specifically, the temperature of the solder pattern 220 is maintained at a maximum of 260 ° C. for 10 seconds or less.
　第５温度エリア４６０においては、図１０に示すＶ区間の処理が行なわれる。具体的には、図中の矢印４６１で示す方向に５０℃の温度の微風を噴き付け、半田パターン２２０の温度を１０℃／ｓ～２５℃／ｓの速度で下降させる。 In the 5th temperature area 460, the process of the V section shown in FIG. 10 is performed. Specifically, a slight wind of 50 ° C. is blown in the direction indicated by the arrow 461 in the figure, and the temperature of the solder pattern 220 is lowered at a speed of 10 ° C./s to 25 ° C./s.
　位置決め治具３００により基板２００と複数の発光装置１００との位置が維持された状態で基板２００が、搬送コンベア４１０で図中の矢印４１１で示す方向に搬送されることにより、第１温度エリア４２０から第５温度エリア４６０までの温度条件でリフローが行なわれる。 The substrate 200 is transported in the direction indicated by the arrow 411 in the drawing by the transport conveyor 410 in a state where the position of the substrate 200 and the plurality of light emitting devices 100 is maintained by the positioning jig 300, whereby the first temperature area 420. To the fifth temperature area 460, the reflow is performed.
　リフロー炉４００の加熱による基板２００の半田パターン２２０の溶融状態、および、リフロー炉４００内における熱風の噴き付け状態は様々である。位置決め治具３００を用いずに基板２００上に複数の発光装置１００を配置してリフローした場合、半田の溶融状態および熱風の噴き付け状態の影響により複数の発光装置１００のいずれかが基板２００上で移動して、基板２００と複数の発光装置１００との位置関係がばらつくことがある。 The molten state of the solder pattern 220 of the substrate 200 due to the heating of the reflow furnace 400 and the sprayed state of hot air in the reflow furnace 400 are various. When a plurality of light emitting devices 100 are arranged on the substrate 200 without using the positioning jig 300 and reflow is performed, any of the plurality of light emitting devices 100 on the substrate 200 due to the influence of the molten solder state and the hot air blowing state. The positional relationship between the substrate 200 and the plurality of light emitting devices 100 may vary.
　本実施形態においては、位置決め治具３００により複数の発光装置１００の発光ダイオードチップ１２０の中心位置が、位置決め治具３００の軸方向上で拘束されている。そのため、基板２００と複数の発光装置１００との位置関係がばらつくことを抑制できる。 In this embodiment, the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 100 are constrained on the axial direction of the positioning jig 300 by the positioning jig 300. Therefore, variation in the positional relationship between the substrate 200 and the plurality of light emitting devices 100 can be suppressed.
　その結果、複数の発光装置１００の各々の発光ダイオードチップ１２０の中心位置を結んだ線１２１と基板２００の中心線２０１とが略一致している状態で、複数の発光装置１００を基板２００上に固定することができる。 As a result, the plurality of light emitting devices 100 are placed on the substrate 200 in a state where the line 121 connecting the center positions of the respective light emitting diode chips 120 of the plurality of light emitting devices 100 and the center line 201 of the substrate 200 substantially coincide with each other. Can be fixed.
　図１１は、本実施形態に係る発光装置の固定方法により基板上に固定された複数の発光装置と対向するように導光板を配置した状態を示す側面図である。なお、図１１においては、リフレクタ１３１の切欠き部１３２を簡略化して図示している。 FIG. 11 is a side view showing a state in which the light guide plate is disposed so as to face a plurality of light emitting devices fixed on the substrate by the light emitting device fixing method according to the present embodiment. In addition, in FIG. 11, the notch part 132 of the reflector 131 is simplified and illustrated.
　図１１に示すように、複数の発光装置１００の発光ダイオードチップ１２０の中心位置を結ぶ線１２１と導光板５００の厚さ方向における中心を通る線５０１とが略同一平面内に位置するように、複数の発光装置１００および導光板５００を配置する。 As shown in FIG. 11, the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 100 and the line 501 passing through the center in the thickness direction of the light guide plate 500 are positioned in substantially the same plane. A plurality of light emitting devices 100 and a light guide plate 500 are arranged.
　そのようにした場合、複数の発光ダイオードチップ１２０から導光板５００の中心に向かう光１２２、導光板５００の上面に向かう光１２３、および、導光板５００の下面に向かう光１２４のいずれもが、導光板５００内に入射することができる。その結果、複数の発光装置１００から照射される光の利用効率を高めることができる。 In such a case, the light 122 from the plurality of light emitting diode chips 120 toward the center of the light guide plate 500, the light 123 toward the upper surface of the light guide plate 500, and the light 124 toward the lower surface of the light guide plate 500 are all guided. The light can enter the light plate 500. As a result, the utilization efficiency of light emitted from the plurality of light emitting devices 100 can be increased.
　本実施形態においては、簡易な位置決め治具３００を用いて、複数の発光装置１００を基板２００上に位置精度良く固定することができる。 In this embodiment, a plurality of light emitting devices 100 can be fixed on the substrate 200 with high positional accuracy using a simple positioning jig 300.
　以下、本発明の実施形態２に係る発光装置の固定方法および発光装置について説明する。なお、実施形態２に係る発光装置の固定方法および発光装置は、位置決め治具の形状およびリフレクタの切欠き部の形状のみ実施形態１と異なるため、他の構成については説明を繰り返さない。 Hereinafter, a fixing method and a light-emitting device according to Embodiment 2 of the present invention will be described. The light-emitting device fixing method and the light-emitting device according to the second embodiment are different from those of the first embodiment only in the shape of the positioning jig and the shape of the cutout portion of the reflector.
　(実施形態２)
　図１２は、本発明の実施形態２に係る発光装置の横断面を示す図である。図１３は、本実施形態に係るリフレクタの切欠き部に位置決め治具の位置決め部を接触させた状態を示す正面図である。図１４は、図１３のＸＩＶ－ＸＩＶ線矢印方向から見た断面図である。 (Embodiment 2)
FIG. 12 is a diagram showing a cross section of the light emitting device according to Embodiment 2 of the present invention. FIG. 13 is a front view showing a state in which the positioning portion of the positioning jig is brought into contact with the notch portion of the reflector according to the present embodiment. FIG. 14 is a cross-sectional view as seen from the direction of arrows XIV-XIV in FIG.
　図１２から図１４に示すように、本発明の実施形態２に係る発光装置の固定方法においては、５角柱形状を有する位置決め治具７００を用いる。位置決め治具７００の位置決め部７１０は、位置決め治具７００の軸方向に直交する方向の断面においてＶ字状の断面形状を有している。 As shown in FIGS. 12 to 14, in the method for fixing the light emitting device according to the second embodiment of the present invention, a positioning jig 700 having a pentagonal prism shape is used. The positioning portion 710 of the positioning jig 700 has a V-shaped cross-sectional shape in a cross section in a direction orthogonal to the axial direction of the positioning jig 700.
　発光装置６００の樹脂部６３０のリフレクタ６３１の先端に形成された切欠き部６３２は、位置決め部７１０に沿う外表面を有している。そのため、リフレクタ６３１の切欠き部６３２に位置決め治具７００の位置決め部７１０を接触させることにより、複数の発光装置６００の各々の発光ダイオードチップ１２０の中心位置を結んだ線１２１が位置決め治具７００の軸中心７２０と平行になる。 The notch 632 formed at the tip of the reflector 631 of the resin part 630 of the light emitting device 600 has an outer surface along the positioning part 710. Therefore, by bringing the positioning part 710 of the positioning jig 700 into contact with the notch part 632 of the reflector 631, the line 121 connecting the center positions of the respective light emitting diode chips 120 of the plurality of light emitting devices 600 is connected to the positioning jig 700. It is parallel to the axis center 720.
　このようにすることにより、基板２００の半田パターン２２０と発光装置６００の端子１１０とが接触して、複数の発光装置６００の各々の発光ダイオードチップ１２０の中心位置を結んだ線１２１と図６に示す基板２００の中心線２０１とが略一致している状態で、位置決め治具７００により複数の発光装置６００の位置を維持できる。その状態で、リフローすることができるため、複数の発光装置６００の各々の発光ダイオードチップ１２０の中心位置を結んだ線１２１と図６に示す基板２００の中心線２０１とが略一致している状態で、複数の発光装置６００を基板２００上に固定することができる。 By doing so, the solder pattern 220 of the substrate 200 and the terminal 110 of the light emitting device 600 are in contact with each other, and the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 600 and FIG. The positions of the plurality of light emitting devices 600 can be maintained by the positioning jig 700 in a state where the center line 201 of the substrate 200 shown is substantially coincident. In this state, since reflow can be performed, the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 600 and the center line 201 of the substrate 200 shown in FIG. Thus, the plurality of light emitting devices 600 can be fixed on the substrate 200.
　本実施形態においても、複数の発光装置６００から照射される光の利用効率を高めることができる。また、簡易な位置決め治具７００を用いて、複数の発光装置６００を基板２００上に位置精度良く固定することができる。 Also in the present embodiment, the utilization efficiency of light emitted from the plurality of light emitting devices 600 can be increased. In addition, a plurality of light emitting devices 600 can be fixed on the substrate 200 with high positional accuracy using a simple positioning jig 700.
　以下、本発明の実施形態３に係る発光装置の固定方法および発光装置について説明する。なお、実施形態３に係る発光装置の固定方法および発光装置は、位置決め治具の形状およびリフレクタの切欠き部の形状のみ実施形態１と異なるため、他の構成については説明を繰り返さない。 Hereinafter, a light emitting device fixing method and a light emitting device according to Embodiment 3 of the present invention will be described. The light-emitting device fixing method and the light-emitting device according to the third embodiment are different from those in the first embodiment only in the shape of the positioning jig and the shape of the cutout portion of the reflector.
　(実施形態３)
　図１５は、本発明の実施形態３に係る発光装置の横断面を示す図である。図１６は、本実施形態に係るリフレクタの切欠き部に位置決め治具の位置決め部を接触させた状態を示す側面図である。図１７は、図１６のＸＶＩＩ－ＸＶＩＩ線矢印方向から見た断面図である。 (Embodiment 3)
FIG. 15 is a diagram showing a cross section of a light emitting device according to Embodiment 3 of the present invention. FIG. 16 is a side view showing a state in which the positioning part of the positioning jig is brought into contact with the notch part of the reflector according to the present embodiment. 17 is a cross-sectional view seen from the direction of the arrow XVII-XVII in FIG.
　図１５から図１７に示すように、本発明の実施形態３に係る発光装置の固定方法においては、側面視において、５角形状の凹部を有する位置決め治具９００を用いる。位置決め治具９００の位置決め部９１０は、位置決め治具９００の軸方向に直交する方向の断面において逆Ｖ字状の断面形状を有している。 As shown in FIGS. 15 to 17, in the method for fixing the light emitting device according to the third embodiment of the present invention, a positioning jig 900 having a pentagonal concave portion is used in a side view. The positioning portion 910 of the positioning jig 900 has an inverted V-shaped cross section in a cross section in a direction orthogonal to the axial direction of the positioning jig 900.
　発光装置８００の樹脂部８３０のリフレクタ８３１の先端に形成された切欠き部８３２は、位置決め部９１０に沿う外表面を有している。そのため、リフレクタ８３１の切欠き部８３２に位置決め治具９００の位置決め部９１０を接触させることにより、複数の発光装置８００の各々の発光ダイオードチップ１２０の中心位置を結んだ線１２１が位置決め治具９００の軸中心９２０と平行になる。 The notch 832 formed at the tip of the reflector 831 of the resin part 830 of the light emitting device 800 has an outer surface along the positioning part 910. For this reason, by bringing the positioning portion 910 of the positioning jig 900 into contact with the notch portion 832 of the reflector 831, the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 800 is connected to the positioning jig 900. It becomes parallel to the axis center 920.
　このようにすることにより、基板２００の半田パターン２２０と発光装置８００の端子１１０とが接触して、複数の発光装置８００の各々の発光ダイオードチップ１２０の中心位置を結んだ線１２１と図６に示す基板２００の中心線２０１とが略一致している状態で、位置決め治具９００により複数の発光装置８００の位置を維持できる。その状態で、リフローすることができるため、複数の発光装置８００の各々の発光ダイオードチップ１２０の中心位置を結んだ線１２１と図６に示す基板２００の中心線２０１とが略一致している状態で、複数の発光装置８００を基板２００上に固定することができる。 By doing so, the solder pattern 220 of the substrate 200 and the terminal 110 of the light emitting device 800 are in contact with each other, and the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 800 and FIG. The positions of the plurality of light emitting devices 800 can be maintained by the positioning jig 900 in a state where the center line 201 of the substrate 200 shown is substantially coincident. In this state, since reflow can be performed, the line 121 connecting the center positions of the light emitting diode chips 120 of the plurality of light emitting devices 800 and the center line 201 of the substrate 200 shown in FIG. Thus, the plurality of light emitting devices 800 can be fixed on the substrate 200.
　本実施形態においても、複数の発光装置８００から照射される光の利用効率を高めることができる。また、簡易な位置決め治具９００を用いて、複数の発光装置８００を基板２００上に位置精度良く固定することができる。 Also in this embodiment, it is possible to improve the utilization efficiency of light emitted from the plurality of light emitting devices 800. In addition, a plurality of light emitting devices 800 can be fixed on the substrate 200 with high positional accuracy using a simple positioning jig 900.
　なお、今回開示した上記実施形態はすべての点で例示であって、限定的な解釈の根拠となるものではない。したがって、本発明の技術的範囲は、上記した実施形態のみによって解釈されるものではなく、請求の範囲の記載に基づいて画定される。また、請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。 In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It does not become the basis of a limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiments, but is defined based on the description of the scope of claims. In addition, meanings equivalent to the claims and all modifications within the scope are included.
　１００，６００，８００　発光装置、１１０　端子、１１１　第１リード端子、１１２　第２リード端子、１２０　発光ダイオードチップ、１３０，６３０，８３０　樹脂部、１３１，６３１，８３１　リフレクタ、１３２，６３２，８３２　切欠き部、１４１　第１ボンディングワイヤ、１４２　第２ボンディングワイヤ、２００　基板、２２０　半田パターン、３００，７００，９００　位置決め治具、３１０，７１０，９１０　位置決め部、４００　リフロー炉、４１０　搬送コンベア、４２０　第１温度エリア、４３０　第２温度エリア、４４０　第３温度エリア、４５０　第４温度エリア、４６０　第５温度エリア、５００　導光板。 100, 600, 800 light emitting device, 110 terminal, 111 first lead terminal, 112 second lead terminal, 120 light emitting diode chip, 130, 630, 830 resin part, 131, 631, 831 reflector, 132, 632, 832 notch Part, 141 first bonding wire, 142 second bonding wire, 200 substrate, 220 solder pattern, 300, 700, 900 positioning jig, 310, 710, 910 positioning part, 400 reflow furnace, 410 transport conveyor, 420 first temperature Area, 430 second temperature area, 440 third temperature area, 450 fourth temperature area, 460 fifth temperature area, 500 light guide plate.

Claims (10)

  1. 　発光素子(１２０)を実装した端子(１１１)および該発光素子(１２０)の周囲を囲むリフレクタ(１３１，６３１，８３１)を含む複数の発光装置(１００，６００，８００)を、半田パターン(２２０)が形成された基板(２００)上の所定の位置に配置する工程(Ｓ１００)と、
    　前記複数の発光装置(１００，６００，８００)の各々の前記リフレクタ(１３１，６３１，８３１)の一部に、前記複数の発光装置(１００，６００，８００)の各々の配置を維持するための１つの棒状の治具(３００，７００，９００)の位置決め部(３１０，７１０，９１０)を接触させる工程(Ｓ１１０)と、
    　前記複数の発光装置(１００，６００，８００)の各々に前記治具(３００，７００，９００)を接触させた状態で、加熱および熱風を噴き付けることによりリフローする工程(Ｓ１２０)と
    を備え、
    　前記位置決め部(３１０，７１０，９１０)を接触させる工程(Ｓ１１０)において、前記リフレクタ(１３１，６３１，８３１)の前記一部に前記治具(３００，７００，９００)の前記位置決め部(３１０，７１０，９１０)を接触させることにより、前記複数の発光装置(１００，６００，８００)の各々の前記発光素子(１２０)の中心位置を結んだ線(１２１)が前記治具(３００，７００，９００)の軸中心(３２０，７２０，９２０)と平行になる、発光装置の固定方法。     A plurality of light emitting devices (100, 600, 800) including a terminal (111) on which the light emitting element (120) is mounted and reflectors (131, 631, 831) surrounding the light emitting element (120) are connected to a solder pattern (220). ) (S100) to be arranged at a predetermined position on the substrate (200) on which is formed)
    For maintaining the arrangement of each of the plurality of light emitting devices (100, 600, 800) in a part of the reflector (131, 631, 831) of each of the plurality of light emitting devices (100, 600, 800) A step (S110) of contacting the positioning portions (310, 710, 910) of one rod-shaped jig (300, 700, 900);
    A step of reflowing by heating and blowing hot air in a state where the jig (300, 700, 900) is in contact with each of the plurality of light emitting devices (100, 600, 800) (S120),
    In the step (S110) of bringing the positioning portions (310, 710, 910) into contact with each other, the positioning portion (310, 700, 900) of the jig (300, 700, 900) is attached to the part of the reflector (131, 631, 831). 710, 910) are brought into contact with each other, a line (121) connecting the center positions of the light emitting elements (120) of each of the plurality of light emitting devices (100, 600, 800) becomes the jig (300, 700, 900) is fixed in parallel to the axial center (320, 720, 920) of the light emitting device.
  2. 　前記リフレクタ(１３１，６３１，８３１)の先端に、前記治具(３００，７００，９００)の前記位置決め部(３１０，７１０，９１０)の形状に対応した切欠き部(１３２，６３２，８３２)が形成されている、請求項１に記載の発光装置の固定方法。 At the tip of the reflector (131, 631, 831), a notch (132, 632, 832) corresponding to the shape of the positioning part (310, 710, 910) of the jig (300, 700, 900) is provided. The light emitting device fixing method according to claim 1, wherein the light emitting device is formed.
  3. 　前記位置決め部(３１０)は、前記治具(３００)の軸方向に直交する方向の断面において円弧状の断面形状を有し、
    　前記切欠き部(１３２)は、前記位置決め部(３１０)に沿う外表面を有する、請求項２に記載の発光装置の固定方法。     The positioning portion (310) has an arcuate cross-sectional shape in a cross section in a direction perpendicular to the axial direction of the jig (300),
    The light-emitting device fixing method according to claim 2, wherein the notch (132) has an outer surface along the positioning part (310).
  4. 　前記位置決め部(７１０)は、前記治具(７００)の軸方向に直交する方向の断面においてＶ字状の断面形状を有し、
    　前記切欠き部(６３２)は、前記位置決め部(７１０)に沿う外表面を有する、請求項２に記載の発光装置の固定方法。     The positioning portion (710) has a V-shaped cross-sectional shape in a cross section perpendicular to the axial direction of the jig (700),
    The light-emitting device fixing method according to claim 2, wherein the notch (632) has an outer surface along the positioning part (710).
  5. 　前記位置決め部(９１０)は、前記治具(９００)の軸方向に直交する方向の断面において逆Ｖ字状の断面形状を有し、
    　前記切欠き部(８３２)は、前記位置決め部(９１０)に沿う外表面を有する、請求項２に記載の発光装置の固定方法。     The positioning part (910) has an inverted V-shaped cross-sectional shape in a cross section in a direction perpendicular to the axial direction of the jig (900),
    The light-emitting device fixing method according to claim 2, wherein the notch (832) has an outer surface along the positioning part (910).
  6. 　半田パターン(２２０)が形成された基板(２００)上の所定の位置に複数固定される発光装置(１００，６００，８００)であって、
    　発光素子(１２０)と、
    　前記発光素子(１２０)が実装される端子(１１１)と、
    　前記発光素子(１２０)の周囲を囲むリフレクタ(１３１，６３１，８３１)と
    を備え、
    　前記リフレクタ(１３１，６３１，８３１)は、前記リフレクタ(１３１，６３１，８３１)の一部が複数の前記発光装置(１００，６００，８００)の各々の配置を維持するための１つの棒状の治具(３００，７００，９００)の位置決め部(３１０，７１０，９１０)と接触することにより、前記複数の発光装置(１００，６００，８００)の各々の前記発光素子(１２０)の中心位置を結んだ線(１２１)が前記治具(３００，７００，９００)の軸中心(３２０，７２０，９２０)と平行になる形状を有する、発光装置。     A plurality of light emitting devices (100, 600, 800) fixed to a predetermined position on a substrate (200) on which a solder pattern (220) is formed,
    A light emitting element (120);
    A terminal (111) on which the light emitting element (120) is mounted;
    A reflector (131, 631, 831) surrounding the light emitting element (120),
    The reflector (131, 631, 831) is a single bar-shaped treatment for maintaining the arrangement of each of the plurality of light emitting devices (100, 600, 800) in a part of the reflector (131, 631, 831). The center position of the light emitting element (120) of each of the plurality of light emitting devices (100, 600, 800) is connected by contacting the positioning part (310, 710, 910) of the tool (300, 700, 900). The light emitting device having a shape in which the elliptical line (121) is parallel to the axial center (320, 720, 920) of the jig (300, 700, 900).
  7. 　前記リフレクタ(１３１，６３１，８３１)の先端に、前記治具(３００，７００，９００)の前記位置決め部(３１０，７１０，９１０)の形状に対応した切欠き部(１３２，６３２，８３２)を有する、請求項６に記載の発光装置。 A notch (132, 632, 832) corresponding to the shape of the positioning part (310, 710, 910) of the jig (300, 700, 900) is provided at the tip of the reflector (131, 631, 831). The light emitting device according to claim 6.
  8. 　前記位置決め部(３１０)は、前記治具(３００)の軸方向に直交する方向の断面において円弧状の断面形状を有し、
    　前記切欠き部(１３２)は、前記位置決め部(３１０)に沿う外表面を有する、請求項７に記載の発光装置。     The positioning portion (310) has an arcuate cross-sectional shape in a cross section in a direction perpendicular to the axial direction of the jig (300),
    The light emitting device according to claim 7, wherein the notch (132) has an outer surface along the positioning part (310).
  9. 　前記位置決め部(７１０)は、前記治具(７００)の軸方向に直交する方向の断面においてＶ字状の断面形状を有し、
    　前記切欠き部(６３２)は、前記位置決め部(７１０)に沿う外表面を有する、請求項７に記載の発光装置。     The positioning portion (710) has a V-shaped cross-sectional shape in a cross section perpendicular to the axial direction of the jig (700),
    The light emitting device according to claim 7, wherein the notch (632) has an outer surface along the positioning portion (710).
  10. 　前記位置決め部(９１０)は、前記治具(９００)の軸方向に直交する方向の断面において逆Ｖ字状の断面形状を有し、
    　前記切欠き部(８３２)は、前記位置決め部(９１０)に沿う外表面を有する、請求項７に記載の発光装置。     The positioning part (910) has an inverted V-shaped cross-sectional shape in a cross section in a direction perpendicular to the axial direction of the jig (900),
    The light emitting device according to claim 7, wherein the notch (832) has an outer surface along the positioning part (910).
PCT/JP2012/056246 2011-03-18 2012-03-12 Method for securing light-emitting device and light-emitting device WO2012128094A1 (en)

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US10217675B2 (en) 2013-02-28 2019-02-26 A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Placement method for circuit carrier and circuit carrier
JP2019523560A (en) * 2016-07-28 2019-08-22 リンゼンス・ホールディング Light emitting device and manufacturing method thereof
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US10217675B2 (en) 2013-02-28 2019-02-26 A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Placement method for circuit carrier and circuit carrier
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