JP2010010332A - Wiring connection device and wiring connection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring connection device and a wiring connection method, capable of obtaining sufficient reliability in wiring connection with a simple device configuration. <P>SOLUTION: The wiring connection device includes a punch jig 32, a laser oscillating device 53, and a pressing jig 71. The punch jig 32 has punches 36, and forms bonding portions in an interconnector 21 by the punch 36. The laser oscillating device 53 heats the interconnector 21 and joins electrodes and the bonding portions. The pressing jig 71 is arranged on the interconnector 21 and fixes the interconnector 21 in a forming process by the punch jig 32 and a heating treatment by the laser oscillating device 53. In the pressing jig 71, guide holes for passing the punch 36 in a forming process by the punch jig 32 and a passing hole for passing the laser beam generated from the laser oscillating device 53 in the heating treatment by the laser oscillating device 53 are formed by common through-holes 73. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention generally relates to a wiring connection device and a wiring connection method for connecting a plurality of electrodes formed on a substrate surface by a wiring member, and more specifically, formed on the surface of a solar cell substrate. The present invention relates to a wiring connection device and a wiring connection method for connecting a plurality of electrodes with an interconnector and improving the connection strength between the two electrodes.

  Regarding a conventional wiring connection device, for example, in Japanese Patent Laid-Open No. 4-219990, an IC component is mounted at a predetermined position of a circuit board, and the lead of the IC component is securely bonded to the electrode of the board as it is with high productivity. An IC component lead joining method for the purpose is disclosed (Patent Document 1). In the IC component lead joining method disclosed in Patent Document 1, the lead of the IC component and the electrode of the substrate are joined. At this time, first, the lead of the IC component is previously formed so that the flat portion thereof faces downward toward the tip. Then, the IC component is held by the mounting head and mounted on the substrate. Further, the IC component is pressed by the mounting head, and the lead is irradiated with light in a state where the height variation of the bonding metal on the electrode such as solder is absorbed by the bending of the lead, thereby melting the bonding metal.

Japanese Laid-Open Patent Publication No. 4-199593 discloses an external lead bonding apparatus (OLB apparatus) for a semiconductor device that prevents solder, Sn, or the like from adhering to the lead retainer of the apparatus by bonding and blocking a heat source such as a laser beam. Is disclosed (Patent Document 2). In the OLB device disclosed in Patent Document 2, an opening through which a non-contact heat source such as a laser beam passes is provided in a lead presser that holds the tip of the external lead.
JP-A-4-219990 Japanese Patent Laid-Open No. 4-199593

  As one form of the solar battery, there is a solar battery in a mode in which a plurality of electrodes formed on the surface of the solar battery cell substrate are connected by a wiring member (interconnector). In a solar cell having such a configuration, a bonding portion that protrudes toward the electrode is formed on the wiring member, so that the bonding portion of the wiring member is reliably brought into contact with the electrode on the surface of the substrate, and a laser to the bonding portion is obtained. The electrode and the wiring member can be joined by the irradiation of the light beam.

  However, there is a problem that it is difficult to accurately irradiate the joint with a laser beam when trying to perform wiring connection by the above method. Further, since the wiring member is generally thin and has low rigidity, there is a problem that the wiring member is bent or damaged during handling between the molding process and the joining process. If these problems are not solved, the reliability of wiring connection cannot be sufficiently improved.

  In addition, since a mechanism for fixing the wiring member is required at the time of the molding process of the wiring member and at the time of joining the electrode and the wiring member, there is a problem that the device configuration of the wiring connecting device is complicated. .

  Accordingly, an object of the present invention is to solve the above-described problems, and to provide a wiring connection device and a wiring connection method capable of obtaining sufficient reliability of wiring connection with a simple device configuration.

  A wiring connection device according to the present invention is a wiring connection device for connecting a plurality of electrodes formed on a substrate surface by a wiring member. The wiring connection device includes a molding member, a heating mechanism, and a fixing member. The molding member has a molding projection, and the joint is molded into the wiring member by the molding projection. The heating mechanism heats the wiring member and joins the electrode and the joint. The fixing member is disposed on the wiring member, and fixes the wiring member at the time of molding processing by the molding member and at the time of heat treatment by the heating mechanism. The fixing member has a common guide hole through which the projection for molding passes during molding by the molding member and a through hole through which the heating medium or heating mechanism emitted from the heating mechanism passes during the heating process by the heating mechanism. Formed by holes.

  According to the wiring connection device configured as described above, since the common fixing member is used during the molding process and the heat treatment, the wiring connection device can be simplified. Further, it is not necessary to replace the fixing member between the molding process and the heat treatment, and the wiring member can be prevented from being bent or damaged. Further, since the guide hole through which the molding protrusion passes and the passage hole through which the heating medium or heating mechanism passes are formed by a common hole, the heating medium or heating mechanism is more reliably directed to the joint. The electrode and the joint can be joined. Therefore, according to the present invention, sufficient reliability of wiring connection can be obtained with a simple device configuration.

  Preferably, the wiring connection device includes a molding processing jig on which the wiring member is placed at the time of molding by the molding member, and a heat treatment jig on which the substrate and the wiring member are placed at the time of heat treatment by the heating mechanism. And a tool. The fixing member is provided with a positioning portion for positioning the fixing member with respect to the molding jig and for positioning the fixing member with respect to the heat treatment jig. According to the wiring connecting device configured as described above, the wiring member fixed to the fixing member can be accurately positioned with respect to the molding jig and the heat treatment jig.

  Preferably, the fixing member has an adsorption mechanism that adsorbs the wiring member. According to the wiring connecting device configured as described above, the wiring member can be reliably fixed to the fixing member with a simple configuration.

  Preferably, the suction mechanism includes an adjustment mechanism capable of adjusting a suction force acting on the wiring member. According to the wiring connection device configured as described above, the wiring member can be prevented from being bent or damaged by adjusting the suction force acting on the wiring member from the suction mechanism.

  Preferably, the fixing member is made of a flexible material that comes into contact with the wiring member and has a load distribution mechanism that distributes a load acting on the wiring member from the fixing member. According to the wiring connecting device configured in this way, bending or breakage of the wiring member can be prevented by dispersing the load acting on the wiring member from the fixing member.

  Preferably, the fixing member is in contact with the wiring member and adsorbs the wiring member, and is formed of a flexible material that contacts the wiring member and disperses the load acting on the wiring member from the fixing member. And a load distribution mechanism. The suction mechanism and the load distribution mechanism have substantially the same height based on the contact surface of the wiring member that contacts the suction mechanism and the load distribution mechanism. According to the wiring connection device configured as described above, it is possible to prevent the wiring member in contact with the load distribution mechanism and the suction mechanism from being deformed between them.

  Preferably, the molding protrusion has a rigidity greater than the rigidity in the thickness direction of the wiring member. According to the wiring connection device configured as described above, it is possible to prevent the molding protrusion from being deformed or damaged during molding of the wiring member.

  Preferably, the heating medium that passes through the passage hole is a hot wire or a hot gas. Preferably, the heating mechanism that passes through the passage hole is a soldering iron. According to the wiring connection device configured as described above, the hot wire, the hot gas, or the soldering iron can be more reliably directed to the joint, and the electrode and the joint can be joined.

  The wiring connection method according to the present invention is a wiring connection method in which a plurality of electrodes formed on the substrate surface are connected by a wiring member. In the wiring connection method, a fixing member having a hole is disposed on the wiring member, the wiring member is fixed by the fixing member, and the wiring member is fixed by the fixing member. In the state where the molding member having the projection is disposed, and the molding projection member is passed through the hole, the joint is formed on the wiring member by the molding projection member, and the wiring member is fixed by the fixing member. A heating mechanism is disposed on the heating member, and the heating medium or the heating mechanism emitted from the heating mechanism is directed to the wiring member while passing through the hole, and the electrode and the bonding portion are bonded by heating.

  According to the wiring connection method configured as described above, sufficient reliability of wiring connection can be obtained with a simple device configuration.

  Preferably, the state in which the wiring member is fixed by the fixing member is maintained between the step of molding the bonding portion on the wiring member and the step of bonding the electrode and the bonding portion. According to the wiring connection method configured as described above, the wiring member can be prevented from being bent or damaged by handling the wiring member using the fixing member between the molding step and the joining step. Further, the positional deviation of the wiring member relative to the fixing member can be prevented between the molding process and the joining process.

  As described above, according to the present invention, it is possible to provide a wiring connection device and a wiring connection method capable of obtaining sufficient reliability of wiring connection with a simple device configuration.

  Embodiments of the present invention will be described with reference to the drawings. In the drawings referred to below, the same or corresponding members are denoted by the same reference numerals.

(Embodiment 1)
FIG. 1 is an exploded view showing a manufacturing process of a solar battery cell. With reference to FIG. 1, the structure of the photovoltaic cell manufactured using the wiring connection apparatus in this Embodiment is demonstrated first.

  Solar cell 11 has a solar cell substrate 12 and an interconnector 21. The back surface 12 b of the solar cell substrate 12 is covered with an insulating film 18. The solar cell substrate 12 is formed with a through-hole 13 that opens to the back surface 12b. An opening 19 is formed in the insulating film 18 at a position overlapping the through hole 13. A plurality of electrodes 14 are formed on the solar cell substrate 12. Each electrode 14 is provided so as to fill the through hole 13 and to be exposed to the opening 19.

  FIG. 2 is a plan view showing a layout of electrodes formed on the solar cell substrate in FIG. 1 and 2, the plurality of electrodes 14 includes a p-electrode 14p and an n-electrode 14n. In the column direction, p-electrodes 14p and n-electrodes 14n are alternately arranged with a space therebetween. In the row direction orthogonal to the column direction, a plurality of p electrodes 14p are arranged with a space therebetween, and a plurality of n electrodes 14n are arranged with a space therebetween. With the layout in which the plurality of electrodes 14 having the same pole are arranged linearly in this way, when connecting the plurality of electrodes 14 by laser light irradiation, the laser light can be easily and quickly scanned.

  In addition, the layout which arrange | positions the some electrode 14 is not restricted to the form shown in FIG. 2, You may change suitably.

  Referring to FIG. 1, a plurality of electrodes 14 are connected by an interconnector 21. The interconnector 21 is formed of a three-layer structure of a core material 22, a light absorption layer 24, and a low melting point metal layer 23.

  The core material 22 is made of a material having high electrical conductivity and high thermal conductivity, such as copper. The light absorption layer 24 is formed of a material that absorbs laser light having a predetermined wavelength, for example, a solder material. The light absorption layer 24 is formed on one surface of the core material 22. The low-melting-point metal layer 23 is formed on the other surface of the core member 22 that is disposed facing the solar battery cell substrate 12.

  A junction 26 is formed in the interconnector 21. The joint portion 26 is positioned so as to overlap the electrode 14 and is joined to the electrode 14 by irradiation of the light absorption layer 24 with laser light. The joint portion 26 is formed by molding the interconnector 21 in the plate thickness direction (the stacking direction of the core material 22, the light absorption layer 24, and the low melting point metal layer 23). The interconnector 21 has a surface 21a facing the solar cell substrate 12, and a surface 21b facing the opposite side of the surface 21a. The joint portion 26 has a shape that is convex on the surface 21a and concave on the surface 21b.

  Next, the wiring connection device in the present embodiment will be described. FIG. 3 is a cross-sectional view showing the wiring connection device according to Embodiment 1 of the present invention.

  Referring to FIG. 3, in the wiring connection device according to the present embodiment, molding is performed on interconnector 21, and die device unit 31 for forming joint 26 is joined to joint 26 and electrode 14. And a pressing jig 71 for fixing the interconnector 21 in the mold device unit 31 and the laser irradiation device unit 51.

  Referring to FIG. 3A, the mold apparatus unit 31 includes a molding jig 37 and a punch jig 32. The molding jig 37 is a lower mold on which the interconnector 21 is set, and the punch jig 32 is a movable upper mold that is disposed facing the molding jig 37.

  A more detailed structure of the mold apparatus unit 31 will be described. The molding jig 37 includes a base unit 38 and guide pins 40. The base portion 38 has a placement surface 38a on which the interconnector 21 is placed. The interconnector 21 is set so that the surface 21a and the mounting surface 38a face each other, and the surface 21b and the punch jig 32 face each other.

  The base portion 38 is provided with pins 41 for positioning the interconnector 21 on the placement surface 38a. The pin 41 is provided in a form protruding from the placement surface 38a. The interconnector 21 is positioned by bringing the peripheral edge of the interconnector 21 placed on the placement surface 38 a into contact with the pin 41. A molding recess 39 is formed in the base portion 38. The molding recess 39 is formed so as to be recessed from the placement surface 38a. The molding recess 39 is formed at a position facing a punch 36 described later. The guide pin 40 is formed to extend from the base portion 38 in a direction away from the placement surface 38a.

  The punch jig 32 moves toward the molding jig 37 when the joint portion 26 is molded. The punch jig 32 includes a base portion 33 and a punch 36. A guide hole 34 is formed in the base portion 33. During the molding process, the guide pin 40 is inserted into the guide hole 34, so that the punch jig 32 moves toward the molding jig 37 while being guided by the guide pin 40.

  The punch 36 has a shape protruding from the base portion 33 toward the molding jig 37. The punch 36 abuts on the interconnector 21 as the punch jig 32 moves, and molds the joint portion 26. The punch 36 has a rigidity greater than the rigidity of the interconnector 21 in the plate thickness direction. In other words, a force in the thickness direction is applied to the interconnector 21, and the force applied to the punch 36 and the force when the punch 36 starts to deform is larger than the force magnitude F1 when the interconnector 21 starts to deform. F2 is larger. With such a configuration, the molding process can be performed on the interconnector 21 without deforming or damaging the punch 36.

  Referring to FIG. 3B, the laser irradiation device section 51 includes a laser oscillator 53, a galvano scanner 54, and a heating jig 57.

  The heating jig 57 includes a base portion 58 and a guide pin 60. Base portion 58 has a mounting surface 58a on which solar cell substrate 12 and interconnector 21 are mounted. The base portion 58 is provided with pins 61 for positioning the solar cell substrate 12 on the placement surface 58a. The pin 61 is provided in a form protruding from the placement surface 58a. The solar cell substrate 12 is positioned by bringing the peripheral edge of the solar cell substrate 12 placed on the placement surface 58a into contact with the pin 61. The guide pin 60 is formed to extend from the base portion 58 in a direction away from the placement surface 58a.

  The laser oscillator 53 and the galvano scanner 54 are provided on the placement surface 58a at a position spaced apart from the solar cell substrate 12 and the interconnector 21. The laser oscillator 53 oscillates a laser beam having a wavelength that is absorbed by the light absorption layer 24 in FIG. The galvano scanner 54 scans the laser beam emitted from the laser oscillator 53 to a predetermined position.

  By irradiating the light absorption layer 24 of the interconnector 21 with the laser light emitted from the laser oscillator 53, the low melting point metal layer 23 is heated and melted. As a result, the electrode 14 of the solar cell substrate 12 and the interconnect 14 are interconnected. The joint portion 26 of the connector 21 is joined.

  As a method of moving the heating position by the laser beam, an optical scanning method in which the heating position is scanned using the galvano scanner 54 while the laser oscillator 53 and the heating jig 57 are fixed (high-speed movement is possible, but irradiation is possible. In addition to a narrow area, the stage on which the heating jig 57 is placed is mechanically moved while the laser oscillation position is fixed (the irradiation area is wide, but the moving speed is slow, vibration, etc.) (Easy to be affected), mechanically moving the laser oscillation position itself (the irradiation area is wide, but the moving speed is slow and susceptible to vibration), the above optical scanning method, stage moving method , A method that appropriately combines the methods of moving the laser oscillation position (after a certain area is irradiated with a laser at high speed by the optical scanning method, By repeating the laser irradiation by the optical scanning system the limited region adjacent to move the optical scanning system + stage moving system such that it is possible to relatively high speed laser irradiation a large area) can be considered like. Further, as a heating method other than laser light, it is possible to use light rays such as an infrared lamp and a halogen lamp.

  Referring to FIG. 3, the holding jig 71 includes a base portion 72, a suction mechanism 75, and a load distribution mechanism 74.

  The structure will be described in detail. A guide hole 76 is formed in the base portion 72. At the time of molding by the mold apparatus unit 31, the pressing jig 71 is positioned with respect to the molding jig 37 by inserting the guide pins 40 into the guide holes 76. Further, the holding jig 71 is positioned with respect to the heating jig 57 by inserting the guide pin 60 into the guide hole 76 during the heat treatment by the laser irradiation device section 51.

  The suction mechanism 75 sucks the interconnector 21. In the present embodiment, the suction mechanism 75 is formed from a vacuum suction pad. The suction mechanism 75 is connected to the vacuum pump 81 and the suction force adjustment mechanism 82 (illustration is omitted in FIG. 3 (B) and in the subsequent drawings). When the vacuum pump 81 is driven, a negative pressure is generated in the suction mechanism 75, whereby the interconnector 21 is sucked and fixed to the holding jig 71. The suction force adjusting mechanism 82 adjusts the suction force acting on the interconnector 21 from the suction mechanism 75. For example, the suction force adjusting mechanism 82 is disposed on a path between the vacuum pump 81 and the suction mechanism 75 and is formed by a variable orifice that can change the flow path cross-sectional area.

  The suction mechanism 75 is not limited to a vacuum suction pad, and may be formed from a non-contact suction pad that draws the interconnector 21 by utilizing Bernoulli's principle, for example. In this case, the adsorption mechanism 75 is connected to an intake / exhaust device for forming an air flow such as air or nitrogen gas along the adsorption surface of the interconnector 21.

  The load distribution mechanism 74 contacts the interconnector 21 adsorbed by the adsorption mechanism 75 and disperses the load acting on the interconnector 21 from the holding jig 71. The load distribution mechanism 74 is formed of one or a plurality of block pieces formed of a flexible material such as silicone rubber or urethane rubber.

  In general, the interconnector 21 is formed from a thin copper foil or a thin copper wire plated with solder or the like, and is very soft and easily deforms during handling. In this embodiment, since the holding jig 71 includes the load distribution mechanism 74 and further includes the adsorption force adjusting mechanism 82 that adjusts the adsorption force acting on the interconnector 21, the interconnector fixed by the holding jig 71 is used. 21 can be prevented from being deformed or cut.

  In the present embodiment in which a vacuum suction pad is used as the suction mechanism 75, both the suction mechanism 75 and the load distribution mechanism 74 are in contact with the surface 21b of the interconnector 21. In this case, it is preferable that the adsorption mechanism 75 and the load distribution mechanism 74 have the same height with respect to the surface 21b of the interconnector 21. With such a configuration, the interconnector 21 fixed by the holding jig 71 is not curved due to the height difference between the suction mechanism 75 and the load distribution mechanism 74.

  A through hole 73 is formed in the holding jig 71. The through hole 73 is formed so as to penetrate the base portion 72 and the load distribution mechanism 74.

  When the interconnector 21 is molded, the punch 36 passes through the through-hole 73 and reaches the surface 21 b of the interconnector 21 as the punch jig 32 moves toward the molding jig 37. Further, during the heat treatment of the interconnector 21, the laser light emitted from the laser oscillator 53 passes through the through hole 73 and reaches the surface 21 b of the interconnector 21. That is, a hole for guiding the punch 36 to the interconnector 21 and a hole for guiding the laser beam to the interconnector 21 are formed by the common through hole 73.

  In the wiring connection device according to Embodiment 1 of the present invention, a plurality of electrodes 14 formed on the back surface 12b of the solar cell substrate 12 as the substrate surface are connected by an interconnector 21 as a wiring member. The wiring connection device includes a punch jig 32 as a molding member, a laser oscillator 53 as a heating mechanism, and a pressing jig 71 as a fixing member. The punch jig 32 has a punch 36 as a molding protrusion, and the joint 26 is molded into the interconnector 21 by the punch 36. The laser oscillator 53 heats the interconnector 21 and joins the electrode 14 and the joint 26. The holding jig 71 is disposed on the interconnector 21 and fixes the interconnector 21 at the time of molding processing by the punch jig 32 and heat treatment by the laser oscillator 53. The holding jig 71 has a guide hole through which the punch 36 passes during molding by the punch jig 32 and a through hole through which laser light as a heating medium emitted from the laser oscillator 53 passes during heat treatment by the laser oscillator 53. Are formed by a through hole 73 as a common hole.

  In the wiring connection device according to the present embodiment, the molding jig 37 as a molding processing jig on which the interconnector 21 is placed and the solar oscillator 53 during the heat treatment by the laser oscillator 53 during the molding process by the punch jig 32. A heating jig 57 as a heating processing jig on which the battery cell substrate 12 and the interconnector 21 are placed is further provided. The holding jig 71 is provided with a guide hole 76 as a positioning portion for positioning the holding jig 71 with respect to the molding jig 37 and positioning the holding jig 71 with respect to the heating jig 57. It is done.

  In this embodiment, the holding jig 71 is provided with the guide hole 76, and the molding jig 37 and the heating jig 57 are provided with the guide pin 40 and the guide pin 60, respectively. A guide pin may be provided, and a guide hole may be provided in the molding jig 37 and the heating jig 57.

  Then, the wiring connection method of the photovoltaic cell 11 in FIG. 1 is demonstrated. FIG. 4 is a flowchart showing the steps of the solar cell wiring connection method in FIG. 1. 5 to 8 are cross-sectional views for explaining each step of the solar cell wiring connection method in FIG.

  4 and 5, first, the interconnector 21 is set in the molding jig 37 (S101). At this time, the interconnector 21 is placed on the placement surface 38 a while the peripheral edge of the interconnector 21 is brought into contact with the pin 41. The presser jig 71 is disposed on the interconnector 21 while the guide pins 40 are inserted into the guide holes 76. 4 and 6, next, the interconnector 21 is fixed by the holding jig 71 (S102). At this time, the interconnector 21 is vacuum-sucked to the suction mechanism 75 by driving a vacuum pump 81 (not shown).

  With reference to FIG. 4 and FIG. 3 (A), next, the junction part 26 is shape | molded by the interconnector 21 (S103). At this time, the guide pin 40 is inserted into the guide hole 34, and the punch jig 32 is moved toward the molding jig 37 while the punch 36 is passed through the through hole 73. The joint portion 26 is formed at a position overlapping the opening position of the through hole 73. In the present embodiment, the joining portion 26 can be formed at an appropriate position of the interconnector 21 by a positioning mechanism using the guide holes 76 and 34 and the guide pins 40.

  4 and 7, next, the interconnector 21 is retracted from the molding jig 37 (S104). At this time, by continuing the driving of the vacuum pump 81, the interconnector 21 is retracted while being fixed by the holding jig 71.

  Referring to FIGS. 4 and 8, next, solar cell substrate 12 and interconnector 21 are set on heating jig 57 (S105). At this time, the solar cell substrate 12 is placed on the placement surface 58 a while bringing the peripheral edge of the solar cell substrate 12 into contact with the pins 61. While inserting the guide pin 60 into the guide hole 76, the holding jig 71 in a state where the interconnector 21 is fixed is disposed on the solar cell substrate 12.

  In the present embodiment, since the interconnector 21 is delivered while being fixed to the holding jig 71, there is no problem that the interconnector 21 is bent or damaged during the movement of S104 and S105. . In addition, since the holding jig 71 is used in common between the molding process in S103 and the bonding process in S106 described below, the structure of the apparatus is simplified.

  Referring to FIG. 4 and FIG. 3B, next, the joining portion 26 formed on the interconnector 21 and the electrode 14 on the substrate surface are joined (S106). At this time, laser light emitted from the laser oscillator 53 is irradiated to the interconnector 21 through the through hole 73, and the interconnector 21 is subjected to a heat treatment.

  In the present embodiment, the interconnector 21 is maintained in a state of being fixed to the holding jig 71 from the molding process shown in S103 to the joining process shown in S106. For this reason, the interconnector 21 does not cause a positional shift with respect to the holding jig 71. As a result, the joint 26 formed in the interconnector 21 and the electrode 14 on the substrate surface can be accurately overlapped by the positioning mechanism using the guide hole 76 and the guide pin 60. Further, since the laser light is directed to the interconnector 21 through the through hole 73, the laser light can be reliably irradiated to the joint portion 26.

  In the present embodiment, the through hole 73 is formed so as to penetrate the load distribution mechanism 74. Since a good contact state between the interconnector 21 and the solar cell substrate 12 can be obtained at the position where the load distribution mechanism 74 is provided, the laser beam is guided to a position closer to the load distribution mechanism 74, whereby the joint portion 26 and the electrode 14 can be improved in reliability.

  In the wiring connection method according to the first embodiment of the present invention, the pressing jig 71 in which the through hole 73 is formed is arranged on the interconnector 21, and the interconnector 21 is fixed by the pressing jig 71 (S101 to S102). And a punch jig 32 having a punch 36 is disposed on the interconnector 21 in a state where the interconnector 21 is fixed by a holding jig 71, and the punch 36 passes through the through-hole 73 and the interconnector is connected by the punch 36. A laser oscillator 53 is arranged on the interconnector 21 in a state where the interconnector 21 is fixed by the holding jig 71 (S 103) and the step of forming the joint portion 26 on the laser 21, and the laser beam emitted from the laser oscillator 53. Is directed to the interconnector 21 while passing through the through-hole 73, and the electrode 14 and the joint portion 26 are heated. And a step (S104 to S106) to be joined.

  According to the wiring connecting device and the wiring connecting method according to the first embodiment of the present invention configured as described above, the joining portion 26 formed in the interconnector 21 and the electrode 14 on the substrate surface can be formed with a simple device configuration. The reliability of the connection can be improved.

(Embodiment 2)
In the present embodiment, a modification of the wiring connection device in FIG. 3 will be described. Hereinafter, description of the same structure as that of the wiring connection device according to the first embodiment will not be repeated.

  FIG. 9 is a cross-sectional view showing a first modification of the wiring connection device in FIG. Referring to FIG. 9, in this modification, a hot air injector 86 for injecting hot air as a heating medium is provided in place of laser oscillator 53 and galvano scanner 54 in FIG. The suction mechanism 75 and the load distribution mechanism 74 are formed with cuts or holes for exhausting the injected hot air. In the step shown in S106 in FIG. 4, the hot air jetted from the hot air jet 86 passes through the through hole 73 and reaches the surface 21b of the interconnector 21. The hot air has a temperature equal to or higher than the melting point of the low melting point metal layer 23, and the joining portion 26 of the interconnector 21 and the electrode 14 are joined by heating with the hot air.

  FIG. 10 is a cross-sectional view showing a second modification of the wiring connection device in FIG. Referring to FIG. 10, in this modification, a soldering iron 87 is provided in place of laser oscillator 53 and galvano scanner 54 in FIG. 4, the soldering iron 87 passes through the through hole 73 and reaches the surface 21b of the interconnector 21. By the heating by the soldering iron 87, the joint portion 26 of the interconnector 21 and the electrode 14 are joined.

  FIG. 11 is a cross-sectional view showing a third modification of the wiring connection device in FIG. Referring to FIG. 11, a plurality of laser oscillators 53 are provided in the present modification. With such a configuration, during the step shown in S106 in FIG. 4, the interconnector 21 is irradiated with a plurality of laser beams at the same time, and the joint portion 26 of the interconnector 21 and the electrode 14 are joined.

  In addition, as a method of making a plurality of laser light irradiation positions, a method of branching a light beam from one laser oscillator 53 using a transmission line such as an optical fiber (effective when the number of the electrodes 14 is small, the apparatus cost is reduced. Although the power per unit decreases, the time required for bonding increases, and a method of preparing a plurality of laser oscillators 53 (example shown in FIG. 11, when the number of electrodes 14 is large) The time required for joining can be kept short, but the cost of the apparatus increases. Further, after splitting the light beam from one laser oscillator 53 using a transmission line such as an optical fiber and irradiating a relatively small number of plural points simultaneously, the irradiation position of the laser beam is moved to increase the number of electrodes. 14 can also be joined.

  According to the wiring connecting device according to the second embodiment of the present invention configured as described above, the effects described in the first embodiment can be similarly obtained.

  Note that a new wiring connection device may be configured by appropriately combining the structures of the wiring connection devices described in the first and second embodiments.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is an exploded assembly figure which shows the manufacturing process of a photovoltaic cell. It is a top view which shows the layout of the electrode formed in the photovoltaic cell board | substrate in FIG. It is sectional drawing which shows the wiring connection apparatus in Embodiment 1 of this invention. It is a flowchart showing the process of the wiring connection method of the photovoltaic cell in FIG. It is sectional drawing for demonstrating the process of S101 of the wiring connection method of the photovoltaic cell in FIG. It is sectional drawing for demonstrating the process of S102 of the wiring connection method of the photovoltaic cell in FIG. It is sectional drawing for demonstrating the process of S104 of the wiring connection method of the photovoltaic cell in FIG. It is sectional drawing for demonstrating the process of S105 of the wiring connection method of the photovoltaic cell in FIG. It is sectional drawing which shows the 1st modification of the wiring connection apparatus in FIG. It is sectional drawing which shows the 2nd modification of the wiring connection apparatus in FIG. It is sectional drawing which shows the 3rd modification of the wiring connection apparatus in FIG.

Explanation of symbols

  12 solar cell substrate, 12a back surface, 14 electrodes, 21 interconnector, 21b surface, 26 joint, 32 punch jig, 36 punch, 37 molding jig, 53 laser oscillator, 57 heating jig, 71 presser Tool, 73 through hole, 74 load distribution mechanism, 75 suction mechanism, 76 guide hole, 82 suction force adjustment mechanism, 86 hot air injector, 87 soldering iron.

Claims (11)

A wiring connection device for connecting a plurality of electrodes formed on a substrate surface by a wiring member,
A molding member having a molding projection, and molding the joint to the wiring member by the molding projection;
A heating mechanism for heating the wiring member and joining the electrode and the joint;
A fixing member that is disposed on the wiring member and fixes the wiring member at the time of molding by the molding member and at the time of heat treatment by the heating mechanism;
The fixing member has a guide hole through which the molding protrusion passes during molding by the molding member, and a passage through which the heating medium emitted from the heating mechanism or the heating mechanism passes during heat treatment by the heating mechanism. A wiring connection device, wherein the holes are formed by a common hole. A molding jig on which a wiring member is placed during molding by the molding member;
A heat treatment jig on which the substrate and the wiring member are placed during the heat treatment by the heating mechanism;
The positioning portion for positioning the fixing member with respect to the jig for molding processing and positioning the fixing member with respect to the jig for heat treatment is provided on the fixing member. The wiring connection device described.   The wiring connection device according to claim 1, wherein the fixing member has an adsorption mechanism that adsorbs the wiring member.   The wiring connection device according to claim 3, wherein the suction mechanism includes an adjustment mechanism capable of adjusting a suction force acting on the wiring member.   5. The device according to claim 1, wherein the fixing member is made of a flexible material that contacts the wiring member and has a load distribution mechanism that distributes a load acting on the wiring member from the fixing member. The wiring connection device described. The fixing member is in contact with the wiring member and adsorbs the wiring member, and is formed of a flexible material that contacts the wiring member and distributes the load acting on the wiring member from the fixing member. A mechanism,
6. The apparatus according to claim 1, wherein the suction mechanism and the load distribution mechanism have substantially the same height based on a contact surface of a wiring member that contacts the suction mechanism and the load distribution mechanism. The wiring connection device described.   The wiring connection device according to claim 1, wherein the molding protrusion has a rigidity greater than a rigidity in a thickness direction of the wiring member.   The wiring connection device according to claim 1, wherein the heating medium that passes through the passage hole is a hot wire or a hot gas.   The wiring connection device according to claim 1, wherein the heating mechanism that passes through the passage hole is a soldering iron. A wiring connection method for connecting a plurality of electrodes formed on a substrate surface by a wiring member,
Arranging a fixing member having a hole formed on the wiring member, and fixing the wiring member by the fixing member;
With the wiring member fixed by the fixing member, a molding member having a molding projection is disposed on the wiring member, and the molding projection member passes the molding projection member through the hole. A step of molding the joint on the wiring member;
With the wiring member fixed by the fixing member, a heating mechanism is disposed on the wiring member, and the heating medium emitted from the heating mechanism or the heating mechanism is directed to the wiring member while passing through the hole. And a step of joining the electrode and the joint by heating.   11. The wiring according to claim 10, wherein the state in which the wiring member is fixed by the fixing member is maintained between the step of molding the bonding portion on the wiring member and the step of bonding the electrode and the bonding portion. Connection method.

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