WO2012124663A1 - 板状体の研磨方法 - Google Patents

板状体の研磨方法 Download PDF

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Publication number
WO2012124663A1
WO2012124663A1 PCT/JP2012/056308 JP2012056308W WO2012124663A1 WO 2012124663 A1 WO2012124663 A1 WO 2012124663A1 JP 2012056308 W JP2012056308 W JP 2012056308W WO 2012124663 A1 WO2012124663 A1 WO 2012124663A1
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WO
WIPO (PCT)
Prior art keywords
plate
polishing
sticking
holding
stage
Prior art date
Application number
PCT/JP2012/056308
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
裕一 女部田
準一 齋藤
英生 中村
木村　宏
Original Assignee
旭硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旭硝子株式会社 filed Critical 旭硝子株式会社
Priority to CN201280013296.XA priority Critical patent/CN103429383B/zh
Priority to KR1020187016539A priority patent/KR20180069925A/ko
Priority to JP2013504723A priority patent/JPWO2012124663A1/ja
Priority to KR1020137024240A priority patent/KR20140010073A/ko
Publication of WO2012124663A1 publication Critical patent/WO2012124663A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/48—Flattening arrangements

Definitions

  • the present invention relates to a method for polishing a plate-like body.
  • a flexible film body is provided at a lower portion of a carrier, a pressurized gas is supplied between the film body and the carrier, and the film body is generated by the pressure of the pressurized gas.
  • the glass plate affixed to is pressed against the polishing cloth and polished. According to this polishing apparatus, since the pressure applied to each part of the glass plate by the pressurized gas existing in the space between the film body and the carrier becomes a uniform pressure, the glass plate is polished while being flatly polished. There is an advantage that minute unevenness on the surface can be removed.
  • the present invention has been made in view of such circumstances, and can remove minute irregularities and undulations on the surface of the plate-like body and suppress local polishing unevenness due to the grooves of the polishing pad.
  • An object of the present invention is to provide a method for polishing a plate-like body.
  • the present invention polishes the plate-like body holding member that holds the non-polishing surface of the plate-like body and performs either one of revolution and rotation, and the polishing surface of the plate-like body.
  • the plate-like body held by the plate-like body holding member is relatively close to a polishing tool that has a plurality of grooves along one direction on the surface to be rotated and performs the other operation of revolution and rotation.
  • the revolution operation and the rotation operation by the plate-shaped body holding member and the polishing tool are independently controlled, and the angular velocity of the rotation is changed during the polishing of the plate-shaped body.
  • a method for polishing a plate-like body is provided.
  • the main force for removing irregularities on the surface of the plate-like body can be obtained by the revolving operation, so that minute irregularities and undulations on the surface of the plate-like body can be removed.
  • the quality of the polished surface of the plate-like body can be controlled by the rotation operation.
  • the rotation operation when polishing is continued at a constant angular velocity, local polishing unevenness due to the grooves of the polishing tool occurs in the plate-like body. Therefore, the present invention changes the angular velocity of rotation during polishing of the plate-like body. Thereby, since the polishing pattern by the polishing tool is changed, local polishing unevenness due to the groove of the polishing tool can be suppressed.
  • the method for polishing a plate-like body of the present invention includes a sticking step of sticking a non-polished surface of the plate-like body to a plate-like body sticking member at the sticking position of the plate-like body, the sticking position, and the The polishing is performed from the sticking position by a holding unit that is movably attached along a guide member disposed between the plate member and the polishing position, and reciprocates between the sticking position and the polishing position.
  • the plate-like body removing step, or removing the plate-like body attaching member from the plate-like body holding member A plate-like body removing step of removing the plate-like body from the plate-like body sticking member, and a returning step of returning the plate-like body sticking member from which the plate-like body has been removed to the sticking position.
  • the method for polishing a plate-like body of the present invention includes a sticking step of sticking a non-polished surface of the plate-like body to a plate-like body sticking member at the sticking position of the plate-like body, the sticking position, and the A first holding member that is movably attached along a guide member disposed between the plate-like body and the first polishing position, and reciprocates between the sticking position and the first polishing position.
  • a plate-like body conveying step for conveying the plate-like body adhering member from the adhering position to the first polishing position, and the plate on the plate-like body holding member located at the first polishing position.
  • the first polishing is attached movably along a guide member disposed between the polishing position and the second polishing position.
  • polishing tool among these,
  • the said plate-shaped object removes the said plate-shaped object from the said plate-shaped object adhesion member, and removes this plate-shaped object adhesion member from the said plate-shaped object holding member
  • the first holding part that transported the plate-like member adhering member to the polishing position is returned to the adhering position, and in the second polishing step, the plate-like member adhering member It is preferable to return the second holding part that has been transported to the second polishing position to the first polishing position.
  • a plate-like member attaching member having a plate-like member attached thereto In a batch-type polishing apparatus, it is necessary to hold a plate-like member attaching member having a plate-like member attached thereto at the attaching position and to convey it to the polishing position.
  • the plate-shaped body holding member was moved from the polishing position to the sticking position, where the plate-shaped body holding member was attached to the plate-shaped body holding member, and then the plate-shaped body holding member was moved from the sticking position to the polishing position.
  • the plate-like body adhering member is conveyed by being moved to.
  • the plate-shaped body holding member that has finished polishing the plate-shaped body is moved back and forth between the polishing position and the pasting position.
  • the present invention installs a small dedicated conveyor for holding and conveying the plate-like member adhering member in the polishing apparatus.
  • a polishing method in which productivity of a plate-like body is improved. That is, the object of the present invention is to improve the productivity of a plate-like body on the premise of removing minute irregularities and waviness on the surface of the plate-like body and suppressing local polishing unevenness caused by the groove of the polishing pad. There is to increase.
  • the present invention provides a polishing method using a dedicated conveying machine provided with a dedicated conveying machine comprising a guide member and a holding unit in the polishing apparatus.
  • the present invention provides a polishing method using a dedicated conveying machine including a guide member, a first holding unit, and a second holding unit installed in a polishing apparatus. provide.
  • the polishing method of the present invention comprises a sticking step, a plate-like body conveying step, a first polishing step, a second polishing step, a plate-like body removing step, and a returning step, and the plate-like body in the first polishing step.
  • the polishing time including the time for attaching the plate-like member attaching member to the plate-like member holding member
  • the first holding portion that transported the plate-like member attaching portion to the first polishing position is used as a guide member. Along the way, return it to the sticking position.
  • the plate-like body attaching portion is conveyed to the second polishing position.
  • the returned second holding portion is returned to the first polishing position along the guide member.
  • the next holding plate is attached using the polishing time by returning the first holding part to the sticking position.
  • the attached plate-like body sticking member can be held by the first holding portion.
  • the plate-like member attaching member to which the next plate-like member is attached can be conveyed to the first polishing position by the first holding unit.
  • the second holding unit is returned to the first polishing position by using the polishing time, and the second holding unit is moved to the first polishing position. It is possible to wait at the first polishing position. Then, as soon as the first polishing step is completed, the plate-like member attaching member can be transported from the first polishing position to the second polishing position by the second holding unit.
  • the step of returning the first holding part from the first polishing position to the sticking position, and the plate-like body sticking member to which the next plate-like body is stuck are used as the holding part. Since the holding step and the step of returning the second holding member from the second polishing position to the first polishing position can be performed during the polishing time, the plate-like body holding member is attached to the polishing position. The productivity of the plate-like body is greatly improved as compared with the conventional polishing method of reciprocating between the landing positions.
  • the plate-like body adhering member is configured in a rectangular shape, the plate-like body holding member is revolved, and the polishing tool swivels within a predetermined angle range, or the swivel It is preferable that a relative motion is generated between the plate-like body and the polishing tool by an operation of combining the oscillation of the plate-like body in the direction along the polishing surface.
  • the plate-like body attaching member is configured in a rectangular shape, the plate-like body holding member is revolved, and the first polishing tool and the second polishing member
  • the tool swivels within a predetermined angle range, or a combination of the swiveling and swinging in the direction along the polishing surface of the plate-like body, between the plate-like body and the first polishing tool, and the It is preferable to cause relative movement between the plate-like body and the second polishing tool.
  • the length of one side of the plate-like body polished by the polishing method of the present invention is preferably more than 1000 mm, more preferably 2000 mm (for example, 2200 ⁇ 2500 mm) or more, and 2800 mm (for example, 2800 ⁇ 3000 mm) or more. Further preferred.
  • a polishing method is adopted in which the plate-like member holding member holding the plate-like member attaching member to which the large plate-like member is attached is revolved and the polishing tool is turned.
  • the operation range of a plate-shaped object sticking member becomes small compared with the above-mentioned operation range, injection
  • the operating range of the plate-like body adhering member is reduced, it is possible to install a dedicated transporter in a narrow space of a polishing apparatus in which a large number of column members and beam members are installed.
  • corrugation on the surface of a plate-shaped body can be obtained by revolving the plate-shaped body holding member holding the plate-shaped body sticking member to which the plate-shaped body was bonded.
  • the surface condition of the polishing tool for example, the groove formed on the surface of the polishing tool is prevented from being transferred to the polishing surface of the plate-like body. it can.
  • the efficiency of transporting the plate-shaped body is achieved by the dedicated transport machine while realizing the revolution of the plate-shaped body holding member and the turning operation of the polishing tool, so the productivity of the plate-shaped body is compared with the previous one. Can be improved.
  • the guide member includes a pair of guide rails arranged in parallel, and the plate-like body attaching member is conveyed by the holding portion between the pair of guide rails.
  • the length (L1) of the plate-like body adhering member in the direction orthogonal to the direction in which the guide rails are arranged, and the distance from the end of the plate-like adhering member to the guide rail (L2, L3) (L2 / L1, L3 / L1) are preferably 0.28 to 0.35.
  • the size and rigidity of the holding part can be optimized, and the high-speed turning operation of the holding part and the high-speed conveyance of the plate-like body attaching member can be realized.
  • the optimization means that the size of the holding part can be reduced, and the bending of the holding part and the vibration of the holding part can be suppressed.
  • the guide member includes a pair of guide rails arranged in parallel, and the plate-like body attaching member is between the pair of guide rails, the first holding portion, And the length (L'1) of the direction orthogonal to the arrangement
  • the ratio (L′ 2 / L′ 1, L′ 3 / L′ 1) to the distance (L′ 2) from the portion to the guide rail is preferably 0.28 to 0.35.
  • the dimensions and rigidity of the first and second holding portions can be optimized, and the high-speed turning operation of the first and second holding portions and the high-speed conveyance of the plate-like body attaching member are realized. be able to.
  • the optimization can reduce the size of the first and second holding portions, the deflection of the first and second holding portions, and the first and second holding portions. This means that vibration can be suppressed.
  • the returning step returns the plate-like body attaching member in a horizontal direction, a vertical direction, or an inclined direction inclined with respect to the horizontal direction.
  • the return process equipment when the plate-like body adhering member is returned in the horizontal direction, the return process equipment can be simplified and the return time can be shortened. That is, since the plate-like body is polished with a horizontal posture, the plate-like body sticking member also has a horizontal posture. Accordingly, after the polishing of the plate-like body, if the plate-like body adhering member is returned as it is (in a horizontal state), the posture of the plate-like body adhering member is not made vertical or inclined, so that the return time can be shortened. . Moreover, when returning a plate-shaped object sticking member in the inclination direction inclined with respect to the vertical direction or the horizontal direction, washing and drying of the plate-shaped object sticking member in the returning step can be performed efficiently.
  • the plate-like body attaching member is washed, so that moisture used for washing remains on the surface.
  • the moisture can flow down, the plate-like body adhering member can be efficiently dried, and the drying time can be shortened.
  • the present invention it is possible to remove minute irregularities and undulations on the surface of the plate-like body, and to suppress local polishing unevenness due to the groove of the polishing pad. Further, the productivity of the plate-like body can be improved.
  • FIG. 1 is a plan view showing an overall structure of a polishing apparatus according to an embodiment.
  • FIG. 2 is an assembled perspective view of the carrier and the membrane frame.
  • FIG. 3 is a side view showing an embodiment of a polishing head and a polishing stage.
  • FIG. 4 is a perspective view including a partially broken portion showing the configuration of the polishing surface plate.
  • FIG. 5 is an enlarged cross-sectional view of a main part showing a structure for attaching the film frame to the carrier.
  • FIG. 6A is a diagram illustrating an initial state in which the glass plate is removed from the film frame by expanding the film body.
  • FIG. 6B is a diagram in which compressed air is injected from the compressed air injection nozzle onto the boundary between the edge of the glass plate and the film body.
  • FIG.6 (c) is explanatory drawing which a glass plate peels from a film body.
  • FIG. 6D is an explanatory diagram in which the glass plate is completely removed from the film body and placed on the table.
  • FIG. 6E is an explanatory view in which the membrane frame is removed from the carrier by the removal device and the membrane frame is placed on the jack.
  • FIG. 7 is a perspective view showing the configuration of the transport apparatus.
  • FIG. 8 is an enlarged perspective view of a main part showing the configuration of the transport device.
  • FIG. 9 is a plan view showing the configuration of the transport apparatus.
  • FIG. 10 is a plan view of the polishing pad.
  • FIG. 11 is an enlarged cross-sectional view of a main part of the polishing pad.
  • FIG. 12 is an explanatory diagram in which the membrane frame collides with the housing of the guide rail.
  • FIG. 13 is an explanatory view showing the revolution trajectory of the glass plate.
  • FIG. 14 is a graph in which the roughness after polishing of the glass plate is normalized and compared.
  • FIG. 15 is a plan view showing the relationship between the size of the film body and the guide rail.
  • FIG. 1 is a plan view showing an overall structure of a polishing apparatus 10 according to an embodiment.
  • FIG. 2 is an assembled perspective view of the carrier 52 and the membrane frame 14.
  • FIG. 3 is a side view showing an embodiment of the polishing head 50 and the polishing stage.
  • the polishing apparatus 10 is a polishing apparatus that polishes the polishing surface of a large glass plate G having a side exceeding 1000 mm and a thickness of 0.2 mm to 0.7 mm to a flatness necessary for a glass plate for a liquid crystal display, for example.
  • the polishing apparatus 10 includes a glass plate carrying conveyor 12 for carrying a glass plate G before polishing, and a glass plate sticking stage (sticking position) for sticking the glass plate G to a film frame (plate-like body sticking member) 14.
  • Sticking step) 16 first polishing stage (first polishing position: first polishing step) 18, second polishing stage (second polishing position: second polishing step) 20, polishing completed Glass plate removal stage (plate body removing step) 22 for removing glass plate G from membrane frame 14, glass plate carry-out conveyor 24, membrane frame cleaning stage 26, membrane frame drying stage 28, and membrane frame return conveyor (return step) 30 is mainly provided.
  • the glass plate attaching stage 16 the first polishing stage 18, the second polishing stage 20, the glass plate removing stage 22, the film frame cleaning stage 26, and the film frame drying stage 28 will be described.
  • stages 16, 18, 20, 22, 26, 28 are simply described as stages 16, 18, 20, 22, 26, 28.
  • the polishing apparatus 10 includes a transport apparatus (dedicated transport machine) 150 that transports the film frame 14 from the stage 16 to the stage 18, a transport apparatus 152 that transports the film frame 14 from the stage 18 to the stage 20, and the stage 20 to the stage 22.
  • a transport device 154 for transporting the film frame 14 is provided.
  • These transfer devices 150, 152, and 154 have the same configuration, and their operations are controlled by a control unit 200 that controls the polishing apparatus 10 in an integrated manner, and are reciprocated synchronously in the left-right direction in FIG.
  • the unpolished glass plate G carried in by the glass plate carrying-in conveyor 12 is sucked and held by a suction pad 34 provided on the arm 33 of the robot 32. Then, it is transferred from the glass plate carry-in conveyor 12 to the conveyor 36 by the rotation operation of the arm 33, and is conveyed to the stage 16 by the conveyor 36.
  • the glass plate G before polishing is stuck to the film frame 14.
  • the sticking method will be described.
  • the film frame 14 is held by a lifting device (not shown) on the stage 16, and when the glass plate G is positioned below the film frame 14, the film frame 14 is moved downward by the lifting device. Then, the flexible and self-adsorbing film body 38 stretched on the film frame 14 shown in FIG. 2 is pressed against the non-polished surface of the glass plate G. With this pressing force, the non-polished surface of the glass plate G is adhered to the film body 38. Thereafter, the film frame 14 is held by the transfer device 150 of FIG. 1 and transferred to the stage 18 of FIG. 3, where it is attached to the carrier (plate-like body holding member) 52 of the polishing head 50.
  • the film frame 14 described below refers to the whole of the film body 38 stretched.
  • the transport device 150 will be described later.
  • the film frame 14 is formed by stretching a rectangular film body 38 to which the glass plate G can be attached between an upper frame 40 and a lower frame 42 that are also rectangular, and then the upper frame 40. And the lower frame 42 are fastened by bolts (not shown).
  • polishing head 50 shown in FIG. 3 Since the polishing head 50 of the stage 18 and the polishing head 50 of the stage 20 have the same structure, the same reference numerals are used for explanation.
  • the polishing head 50 includes a main body casing 51, and a revolving drive mechanism (not shown) is built in the main body casing 51.
  • the revolution drive mechanism is composed of a planetary gear mechanism and a motor, and the output shaft of the planetary gear mechanism driven by the motor is connected to a spindle 56 that is suspended in the vertical direction.
  • a carrier 52 is connected to the spindle 56. Therefore, when the planetary gear mechanism is driven, the carrier 52 and the film frame 14 are revolved around a predetermined revolution center P (see FIG. 13).
  • the main body casing 51 shown in FIG. 3 is connected to an elevating mechanism 156 via a slider 158.
  • the main body casing 51 is moved up and down with respect to the slider 158 by the lifting mechanism 156, so that the carrier 52 has a circular polishing pad (first polishing tool) 58 of the stage 18 and a circular polishing pad (second polishing tool) of the stage 20.
  • the polishing surface of the glass plate G adhered to the film frame 14 is pressed against the polishing pads 58 and 60 with a predetermined polishing pressure.
  • the slider 158 may be removed from the polishing apparatus 10 and the main body casing 51 may be directly coupled to the lifting mechanism 156.
  • the polishing table 64 is slidably supported by a pair of guide rails 69 and 69 arranged in parallel. By providing a drive unit (not shown) for reciprocating the polishing table 64 along the guide rails 69, 69, the polishing pad 58 is swung horizontally when necessary.
  • the swinging direction of the polishing pad 58 may be a direction orthogonal to the transport direction by the transport device 150 of FIG. 1 or may be a direction parallel to the transport direction. That is, any direction that swings the polishing pad 58 in the horizontal direction may be used.
  • hoses (not shown) for supplying slurry to the back side of the polishing pad 58 are connected to the polishing surface plate 62 of FIG.
  • the rotation of the polishing pad 58 is regulated so as to turn within a predetermined angle range from a predetermined reference position.
  • the slurry supplied from the hose to the back side of the polishing pad 58 is supplied to the surface of the polishing pad 58 through a slurry supply hole penetrating the inside of the polishing pad 58.
  • the range of the turning angle of the polishing pad 58, the turning operation such as the turning speed, and the revolution operation such as the revolution number per unit time are independently controlled by the control unit 200 of FIG.
  • each part of the polishing pad 60 is the same as the configuration of the polishing pad 58 described above, the description thereof is omitted here.
  • linear guides 70 and 70 are attached to the slider 158 of the stage 18.
  • the linear motion guides 70, 70 are fitted to the guide rails 72, 72.
  • the guide rails 72 and 72 are disposed toward a maintenance stage 74 for maintaining the spindle 56 of the stage 18 and the carrier 52 as indicated by broken lines in FIG.
  • linear motion guides 70, 70 are similarly attached to the slider 158 of the stage 20, and the linear motion guides 70, 70 are fitted to the guide rails 160, 160.
  • the guide rails 160 and 160 are arranged toward a maintenance stage 76 for maintaining the spindle 56 and the carrier 52 of the stage 20 as indicated by broken lines in FIG.
  • FIG. 5 is an enlarged cross-sectional view of a main part showing a structure for attaching the film frame 14 to the carrier 52.
  • a lifting frame 78 is fixed to the upper outer periphery of the carrier 52 by bolts (not shown). Through holes 80, 80... Are opened at predetermined equal intervals in the flange portion of the lifting frame 78, and project through the through holes 80, 80... On the upper surface of a slide frame 82 (slide-contact frame).
  • the slidable frame suspension 84 is penetrated from below as shown in FIG. Further, as shown in FIG. 5, the sliding frame lifting tool 84 is penetrated by a lifting spring 88 disposed between the lifting frame 78 and the lifting disk spring 86, and the lifting disk spring 86. And is connected to a screw jack 92.
  • the sliding frame 82 is lifted with respect to the carrier 52 by operating the screw jack 92 and pulling the sliding frame suspension 84 upward against the urging force of the lifting spring 88.
  • the membrane frame 14 detachably attached to the sliding frame 82 is pulled up, and a predetermined tension is applied to the membrane body 38.
  • a plurality of pins 108, 108... are projected at equal intervals on the upper frame 40 of the membrane frame 14, and a large-diameter head portion 110 provided at the upper end of these pins 108 is provided at the bottom of the sliding frame 82.
  • the membrane frame 14 is attached to the sliding frame 82 by being engaged with the hook 112 fixed to the sliding frame 82.
  • the engaging force between the head portion 110 and the hook 112 is strengthened by the reaction force of the film body 38 when the film body 38 is lifted by the screw jack 92, and the polishing resistance received from the film body 38 during polishing causes the head portion from the hook 112. 110 does not come off.
  • the film frame 14 to which the glass plate G is attached is transferred from the stage 16 to the stage 18 by the transfer device 150 as shown in FIG. 3, and the polished surface of the glass plate G is polished on the stage 18 and then transferred.
  • the film frame 14 on which the glass plate G is pasted by the apparatus 152 is sequentially conveyed from the stage 18 to the stage 20, and the polishing surface of the glass plate G is polished on the stage 20 in two stages. Further, when the polishing of the glass plate G is completed at the stage 20, the film frame 14 is removed from the carrier 52 and conveyed to the stage 22 by the conveying device 154.
  • the polishing stage may be one or two or more depending on the application. In consideration of efficiency and cost, it is preferable to provide two stages of a rough polishing stage and a finish polishing stage, but a finish polishing stage may be added for high quality purposes in some cases.
  • the glass plate G that has been polished is removed from the film frame 14 that has been transported by the transport device 154.
  • the removed glass plate G is conveyed by the conveyor 138, and is adsorbed by the adsorption head 144 attached to the arm 142 of the robot 140, and is transferred to the glass plate carry-out conveyor 24 by the operation of the robot 140. 10 to the outside.
  • FIG. 6 (a) to 6 (d) show a process of removing the polished glass plate G from the film frame 14, which is performed in the stage 22.
  • FIG. 6 (a) to 6 (d) illustrate an example in which the glass frame G is removed from the film frame 14 and then the film frame 14 is removed from the carrier 52. As described above, the film frame 14 is removed from the carrier 52. After removal, the glass plate G may be removed from the membrane frame 14.
  • the compressed air is supplied to the edge of the glass plate G from a plurality of compressed air injection nozzles 206, 206 disposed opposite to the edge of the glass plate G. It sprays on the boundary part of a part and the film body 38.
  • FIG. Thereby, the glass plate G is peeled from the film body 38 as shown in FIG. Since the adsorption force of the film body 38 is reduced by the compressed air, the glass plate G is easily removed from the film body 38. In addition, it may replace with compressed air and may inject water, and the same effect can be acquired even if it injects water and compressed air together.
  • the nozzle 206 is omitted.
  • FIG. 6D shows a state in which the glass plate G is completely removed from the film body 38 and placed on the table 204. Thereafter, the glass plate G is conveyed by the conveyor 138 shown in FIG. 1, and then transferred to the glass plate carry-out conveyor 24 by the robot 140 and carried out of the polishing apparatus 10.
  • the film frame 14 is then removed from the carrier 52 by the removal device as shown in FIG. 14 is placed on the jacks 208 and 208.
  • the film frame 14 is conveyed to the film frame cleaning stage 26 by the conveyor 146 shown in FIG.
  • the film frame 14 conveyed to the stage 26 is washed with water here.
  • the film frame 14 that has been cleaned is conveyed to the stage 28 by the conveyor 148, where it is heated and dried. Then, the dried film frame 14 is transported to the stage 16 by the film frame return conveyor 30 and reused for attaching the glass plate G.
  • FIGS. 7, 8 and 9 are a perspective view, a main part enlarged perspective view and a plan view showing the configuration of the transfer device 150 (152, 154), respectively.
  • the transfer device 150 includes four holding portions 162, 162,... That hold the protrusions 43 provided at the four corners of the film frame 14 from below. These holding portions 162, 162... Are arranged on both sides of the conveyance path of the film frame 14 formed between the stage 16 and the stage 18, and are connected to the shaft 166 of the small robot 164. The shaft 166 is driven in the vertical direction and the horizontal direction by the small robot 164, and thereby the holding unit 162 is driven in the vertical direction and the horizontal direction. Note that the holding unit 162 that conveys the film frame 14 from the stage 16 to the stage 18 is a first holding unit, and the holding unit 162 that conveys the film frame 14 from the stage 18 to the stage 20 is a second holding unit.
  • the film frame 14 transported to the stage 18 can be placed on the polishing pad 58 of the stage 18 by the downward movement operation of the holding parts 162, 162, and then the horizontal direction of the holding parts 162, 162,.
  • the holding portions 162, 162... Can be retracted from the film frame 14 by the moving operation.
  • the holding portions 162, 162... Evacuated from the film frame 14 are returned toward the stage 16 during the polishing of the glass plate G.
  • the film frame 14 to which the next glass plate G placed on the stage 16 is stuck is held by the holding parts 162, 162, and waits until the next conveyance.
  • the movement of the holding unit 162 between the stages, the vertical direction with respect to the film frame 14, and the horizontal operation are controlled by the control unit 200 shown in FIG.
  • the guide rails 170 are disposed on both sides of the conveyance path of the film frame 14, but the number of the guide rails 170 is not limited to a pair (two). It may be disposed only on one side of the conveyance path of the film frame 14. However, when the guide rails 170 are disposed on both sides of the conveyance path, the glass plate G can be held from both sides facing the guide rail 170, so that the glass plate G can be stably held.
  • Polishing pressure 2 kPa to 25 kPa
  • Polishing slurry A polishing slurry in which cerium oxide is dispersed in water is supplied from a slurry supply hole of a polishing surface plate.
  • Polishing pad 58 Made of foamed polyurethane, with grooves for flowing slurry on the surface (groove pitch 4.5 mm, groove width 1.5 mm) , Groove depth 1-5mm)
  • Polishing pad 60 Suede made of soft urethane, with grooves to flow slurry on the surface (groove pitch 4.5mm, groove width 1.5mm, groove depth 1-5mm)
  • Glass plate G thickness 0.2 mm to 0.7 mm
  • Shape of glass plate G Rectangular glass plate with a side exceeding 3000 mm
  • Non-polished surface of glass plate G Adherently held by an adsorption pad made of polyurethane constituting film body 38 As shown in FIG.
  • Polishing time determined by required flatness and necessary machining allowance (for example, 2 minutes) Revolving diameter of carrier 52: 150 mm Revolving speed of carrier 52: 110 rpm Swing speed of the polishing table 64: 180 mm / min The swing stroke of the polishing table 64: ⁇ 100 mm Turning range of polishing surface plate 62: ⁇ 80 ° Swivel speed of polishing surface plate 62: 7.4 ° / sec [Second polishing step by stage 20] Polishing time: last 30 sec Revolving diameter of carrier 52: 150 mm Revolving speed of carrier 52: 110 rpm Swing speed of the polishing table 64: 180 mm / min The swing stroke of the polishing table 64: ⁇ 100 mm Turning range of polishing surface plate 62: ⁇ 80 ° Swivel speed of polishing surface plate 62: 0.1 ° / sec The above is the specifications of the stages 18 and 20, and by polishing the glass plate G with these stages 18 and 20, minute irregularities
  • the revolution operation of the carrier 52 and the turning operation of the polishing platen 62 are independently controlled in this way, and the turning speed (angular velocity) of the polishing platen 62 is changed to a low speed during the polishing time of the glass plate G. Local polishing unevenness due to the grooves 59 of the polishing pads 58 and 60 could be suppressed.
  • the force by the revolution operation becomes a force for removing minute irregularities on the surface of the glass plate G
  • the force by the turning operation becomes a force for controlling the quality of the polished surface.
  • FIG. 14 is a graph in which the roughness of the glass plate polished by the conventional polishing method and the polishing method of the embodiment is normalized and compared.
  • the thick line A in the graph is the roughness normalized by the polishing method of the embodiment
  • the thin line B is the roughness normalized by the conventional polishing method.
  • the vertical axis of the graph is normalized by setting the maximum roughness value by the conventional polishing method to 1.0
  • the horizontal axis is normalized by setting the maximum value to 10.0.
  • a stylus shape measuring instrument product name: Surfcom manufactured by Tokyo Seimitsu Co., Ltd. was used.
  • the roughness of the glass plate was improved as compared with the conventional polishing method.
  • the turning speed is preferably 30 ° / sec or less, and more preferably 10 ° / sec or less.
  • finish polishing it is preferably 10 ° / sec or less, more preferably 3 ° / sec or less.
  • the same effect could be obtained even when the carrier 52 was turned and the polishing surface plate 62 was turned. Further, the same effect could be obtained even if the angular velocity of rotation was changed during polishing in the rotational operation, not limited to turning. Furthermore, the change of the angular velocity is not limited from high speed to low speed, but may be changed from low speed to high speed.
  • the conveying apparatus 150 including the holding portions 162, 162, and a pair of guide rails 170, 170 is installed in the polishing apparatus 10. Yes.
  • the holding unit 162 that has transported the film frame 14 to the stage 18 is moved along the pair of guide rails 170 and 170 during the polishing time of the glass plate G in the polishing process (including the time for attaching the film frame 14 to the carrier 52). And return to stage 16.
  • the holding part 162 is returned from the stage 18 to the stage 16, so that the film frame 14 to which the next glass plate G is adhered is used by using the polishing time. It can be held by the holding part 162. Then, as soon as the polishing of the front glass plate G is completed, the film frame 14 to which the next glass plate G is adhered can be conveyed to the stage 18 by the holding unit 162.
  • the holding unit 162 that has transported the film frame 14 from the stage 18 to the stage 20 is returned from the stage 20 toward the stage 18. Accordingly, the holding unit 162 can be made to wait on the stage 18 by using the polishing time. Further, as soon as the polishing process is completed in the stage 18, the film frame 14 can be conveyed from the stage 18 to the stage 20 by the holding unit 162. Before the holding unit 162 is returned from the stage 20 to the stage 18, the holding unit 162 is moved to the retracted position indicated by the two-dot chain line in FIG. As a result, the holding portion 162 is returned without interfering with the polishing pad 60.
  • the productivity of the glass plate G can be greatly improved.
  • the film frame 14 is configured in a rectangular shape according to the shape of the glass plate G. Then, the carrier 52 is revolved, and the polishing pad 58 (60) is swung within a predetermined angle range, or a combination of the swiveling and swinging in the direction along the polishing surface of the glass plate G is performed. The glass plate G is polished by causing relative movement between the plate G and the polishing pad 58 (60).
  • the large film frame 14 (glass plate G) side is revolved around the revolution center P, and the polishing pad 58 (60) side is turned as shown in FIG. It's a way.
  • the operating range of the membrane frame 14 becomes smaller than the above-described operating range, so that the membrane frame 14 can be loaded into and removed from the carrier 52 in a short time, and the membrane frame 14 is a housing of the guide rail 170. 174 can be prevented from colliding.
  • the transfer device 150 can be installed in a narrow space of the polishing apparatus 10 in which a large number of pillar materials and beam materials are installed.
  • the force required for polishing can be obtained by revolving the film frame 14 side, and the quality of the polishing surface can be controlled by turning the polishing pad 58 (60) side.
  • the groove (60) can be prevented from being transferred to the glass plate G.
  • the efficiency of the conveyance time of the glass plate G is achieved while realizing the polishing operation of revolution and turning, the productivity of the glass plate G can be improved.
  • the ratios (L2 / L1, L3 / L1) to the distances L2 and L3 are preferably 0.28 to 0.35.
  • the membrane frame 14 In the step of returning the membrane frame 14, it is preferable to return the membrane frame 14 in the horizontal direction, the vertical direction, or the inclined direction inclined with respect to the horizontal direction.
  • G Glass plate, 10 ... Polishing device, 12 ... Conveyor for carrying glass plate, 14 ... Film frame, 16 ... Glass plate sticking stage, 18 ... First polishing stage, 20 ... Second polishing stage, 22 ... Glass Plate removal stage, 24 ... Glass plate carry-out conveyor, 26 ... Membrane frame cleaning stage, 28 ... Membrane frame drying stage, 30 ... Membrane frame return conveyor, 32 ... Robot, 33 ... Arm, 34 ... Suction pad, 36 ... Conveyor, 38 ... Film body, 40 ... Upper frame, 42 ... Lower frame, 43 ... Projection, 50 ... Polishing head, 51 ... Body casing, 52 ... Carrier, 54 ... Air chamber, 56 ... Spindle, 58 ...
  • Polishing pad 60 ... Polishing pad, 62 ... Polishing platen, 64 ... Polishing table, 65 ... Bearing, 66 ... Gear part, 67 ... Gear, 68 ... Motor, 69 ... Guide rail, 70 ... Linear guide, 72 ... Guide 74, maintenance stage, 76 ... maintenance stage, 78 ... lifting frame, 80 ... through hole, 82 ... sliding frame, 84 ... sliding frame lifting tool, 86 ... lifting spring, 88 ... lifting spring , 90 ... Through hole, 92 ... Screw jack, 98 ... Injection port, 100 ... Air chamber, 102 ... Air supply path, 104 ... Valve, 106 ... Air pump, 108 ... Pin, 110 ... Head part, 112 ...

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
PCT/JP2012/056308 2011-03-15 2012-03-12 板状体の研磨方法 WO2012124663A1 (ja)

Priority Applications (4)

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CN201280013296.XA CN103429383B (zh) 2011-03-15 2012-03-12 板状体的研磨方法
KR1020187016539A KR20180069925A (ko) 2011-03-15 2012-03-12 판상체의 연마 방법
JP2013504723A JPWO2012124663A1 (ja) 2011-03-15 2012-03-12 板状体の研磨方法
KR1020137024240A KR20140010073A (ko) 2011-03-15 2012-03-12 판상체의 연마 방법

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JP6357260B2 (ja) * 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
IT201600130117A1 (it) 2016-12-22 2018-06-22 Breton Spa Macchina e metodo per la levigatura e/o lucidatura di lastre di materiale lapideo, quale pietra naturale o agglomerata, ceramico e vetro
KR102027814B1 (ko) * 2018-05-23 2019-10-02 주식회사 앤아이윈 디스플레이용 대면적 글라스의 cmp 장치의 상정반
JP7217202B2 (ja) * 2019-05-31 2023-02-02 株式会社荏原製作所 温度調整装置および研磨装置
CN110707670B (zh) * 2019-10-24 2020-12-01 南方电网科学研究院有限责任公司 一种变电站小电阻接地装置的控制方法
CN111300240B (zh) * 2020-02-22 2021-02-19 深圳市盛鸿运科技有限公司 一种钢板表面处理设备及钢板表面处理工艺

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CN105856061B (zh) 2019-06-11
JPWO2012124663A1 (ja) 2014-07-24
KR20180069925A (ko) 2018-06-25
TW201247362A (en) 2012-12-01
CN105856061A (zh) 2016-08-17
CN105798767A (zh) 2016-07-27
CN105798767B (zh) 2018-01-30
CN103429383B (zh) 2016-05-11
CN103429383A (zh) 2013-12-04
KR20140010073A (ko) 2014-01-23

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