Classifications

• • A—HUMAN NECESSITIES
  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
  • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
  • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
  • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
• • A—HUMAN NECESSITIES
  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
  • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
  • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
  • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
  • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
  • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
  • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
  • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
  • B06B1/0629—Square array
• • G—PHYSICS
  • G10—MUSICAL INSTRUMENTS; ACOUSTICS
  • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
  • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
  • G10K11/002—Devices for damping, suppressing, obstructing or conducting sound in acoustic devices

Definitions

• This invention relates to medical diagnostic ultrasound systems and, in particular, to backing materials for an ultrasonic transducer array.
• Two dimensional array transducers are used in ultrasonic imaging to scan in three dimensions.
• Two dimensional arrays have numerous rows and columns of transducer elements in both the azimuth and elevation directions, which would require a large number of cable conductors to couple signals between the probe and the mainframe ultrasound system.
• a preferred technique for minimizing the number of signal conductors in the probe cable is to perform at least some of the beamforming in the probe in a
• microbeamformer ASIC application specific integrated circuit. This technique requires only a relatively few number of partially beamformed signals to be coupled to the mainframe ultrasound system, thereby reducing the required number of signal conductors in the cable. However a large number of signal
• connections must be made between the two dimensional array and the microbeamformer ASIC.
• An efficient way to make these connections is to design the transducer array and the ASIC to have flip-chip
• the high density electronic circuitry of the microbeamformer ASIC can, however, produce a
• the preferred thermal conduction direction is to the rear, away from the lens and toward a heat spreader (typically aluminum) at the rear of the probe.
• a heat spreader typically aluminum
• An acoustic backing block is generally located behind the transducer stack, the array elements and the microbeamformer ASIC.
• the purpose of the acoustic backing block is to attenuate ultrasonic energy emanating from the rear of the acoustic stack and prevent this energy from causing reverberations that are reflected toward the acoustic stack.
• An acoustic backing block is generally made of a
• an acoustic backing block for an ultrasound probe which exhibits good acoustic attenuation of acoustic energy entering the block, good thermal conductivity toward the rear of the probe and away from the lens, good mechanical
• a backing block for an ultrasonic transducer array stack is formed of a matrix of a highly thermally conductive material with internal acoustic damping members.
• a preferred material for the thermally conductive material is graphite
• the graphite can be formed into a rigid block with the mechanical stability to support a transducer array stack.
• the internal acoustic damping members which can be formed by drilling holes in the graphite block which are filled with acoustic damping material, are preferably located such that an acoustic wave
• transducer array stack must encounter an acoustic damping member and be acoustically attenuated.
• An electrically isolating layer can be located on the top or bottom of the backing block as needed.
• FIGURE 1 illustrates an acoustic stack with a thermally conductive backing block constructed in accordance with the principles of the present
• FIGURE 2 illustrates the acoustic stack of FIGURE 1 when assembled in a transducer probe with a lens cover.
• FIGURE 3 is a perspective view of a thermally conductive backing block constructed in accordance with the principles of the present invention.
• FIGURE 4 is a top plan view of a thermally conductive backing block constructed in accordance with the principles of the present invention.
• FIGURE 5 is a side cross-sectional view of a thermally conductive backing block constructed in accordance with the principles of the present
• an acoustic stack 100 with a thermally conductive backing block which is constructed in accordance with the principles of the present invention is shown schematically.
• a piezoelectric layer 110 such as PZT and two matching layers bonded to the piezoelectric layer are diced by dicing cuts 75 to form an array 170 of individual transducer elements 175, four of which are seen in FIGURE 1.
• the array 170 may comprise a single row of transducer elements (a 1-D array) or be diced in two orthogonal directions to form a two-dimensional (2D) matrix array of transducer elements.
• the matching layers match the acoustic impedance of the
• the first matching layer 120 is formed as an electrically conductive graphite composite and the second matching layer 130 is formed of a polymer loaded with electrically conductive particles.
• a ground plane 180 is bonded to the top of the second matching layer, and is formed as a conductive layer on a film 150 of low density
• LDPE polyethylene
• the LDPE film 150 forms the third and final matching layer 140 of the stack.
• an integrated circuit 160 below the transducer elements is an integrated circuit 160, an ASIC, which provides transmit signals for the transducer elements 175 and receives and processes signals from the elements.
• Conductive pads on the upper surface of the integrated circuit 160 are electrically coupled to conductive pads on the bottoms of the transducer elements by stud bumps 190, which may be formed of solder or conductive epoxy. Signals are provided to and from the integrated circuit 160 by connections to the flex circuit 185.
• a backing block 165 below the integrated circuit 160 is a backing block 165 which attenuates acoustic energy emanating from the bottom of the transducer stack. In accordance with the principles of the present invention, the backing block also conducts heat generated by the integrated circuit away from the integrated circuit and the transducer stack and away from the patient- contacting end of the transducer probe.
• FIGURE 2 illustrates the transducer stack assembly of FIGURE 1 when assembled inside a
• the third matching layer 140 is bonded to the acoustic lens 230.
• Ultrasound waves are transmitted through the lens 230 and into the patient's body during imaging, and echoes received in response to these waves are received by the transducer stack through the lens 230.
• the LDPE film 150 serves to enclose the
• a preferred backing block 165 starts with a block of graphite 20.
• Other alternatives include graphite loaded with metals such as nickel or copper which provide good machinability and favorable thermal properties.
• the graphite block 20 is used to form a composite backing structure which satisfies a number of performance objectives.
• the backing structure must have good Z-axis thermal conductivity.
• Graphite has good thermal conductivity, a Tc of 80 to 240 W/m°K at 0°C-100°C. For conduction parallel to the crystal layers, Tc will approach 1950 W/m°K at 300°K.
• the Z-axis direction is the direction back and away from the transducer stack 100 and the integrated circuit 160.
• the thermal conductivity of the backing block be comparable to or better than that of
• Aluminum has a comparable Tc of 237 W/m°K at room temperature, so this performance objective is well met by a graphite block 20.
• a second objective is that the backing block provide structural support for the acoustic stack 100 and integrated circuit 160.
• a graphite block is structurally sound, satisfying this objective.
• a third objective is to provide electrical isolation of the integrated circuit 160 from the aluminum member or frame of the probe.
• Graphite being electrically conductive, can satisfy this objective by coating the backing block with a non- conductive insulative coating.
• the fourth objective is that the backing block must dampen acoustic energy entering the block.
• Graphite is a good conductor of acoustic energy and provides very little inherent acoustic damping. This objective is satisfied by employing the graphite block as the framework for a composite structure of internal acoustic dampening members as shown in
• FIGURES 3, 4, and 5 In these drawings the graphite is rendered translucent for clarity of illustration of the internal composite structure of the block.
• the dampening members are formed as a plurality of angled cylinders 30 of backing material in the backing block.
• the cylinders 30 are cut or drilled into the graphite block 20, then filled with acoustic dampening material such as epoxy filled with micro balloons or other acoustic damping particles.
• acoustic dampening material such as epoxy filled with micro balloons or other acoustic damping particles.
• the tops of the cylinders 30 present a large area of acoustic dampening material to the back of the integrated circuit. A considerable amount of the undesired acoustic energy emanating from the back of the integrated circuit and acoustic stack will thus pass immediately into the dampening material.
• the angling of the cylinders as seen in FIGURE 3 and best seen in the cross-section view of FIGURE 5 assures that acoustic energy traveling in the Z-axis direction will have to intersect dampening material at some point in the path of travel.
• there is no path in the Z-axis direction formed entirely of graphite and the angling of the cylinders does not promote reflection of energy back to the integrated circuit but provides scattering angles downward and away from the integrated circuit.
• the angling of the cylinders assures damping of all or substantially all of the Z-axis directed energy.
• Heat will find continuous pathways through the graphite between the cylinders 30. Since the flow of heat is from higher temperature regions to lower (greater thermal density to lesser) , heat will flow away from the integrated circuit 160 and acoustic stack 100 to structures below the backing block 165 where it may be safely dissipated.
• thermally conductive material of the backing block such as aluminum, graphite foam, or aluminum nitride.
• the pattern, size and spacing of the holes filled with dampening material can also be varied and optimized for performance and manufacturability . While
• drilling will produce circular holes, other hole shapes such as rectangular or triangular may
• a layer of non-conductive materials such as parylene, aluminum nitride, or polyimide can be added to one or more external surfaces of the backing block or constructed internal to the block.
• a lateral composite structure of dampening materials which is not arranged in
• cylindrical angled holes can alternatively be used, so long as there are no flat surfaces in parallel with the top and bottom surfaces of the block which would reflect acoustic energy back toward the integrated circuit and acoustic stack.

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• Health & Medical Sciences (AREA)
• Life Sciences & Earth Sciences (AREA)
• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Radiology & Medical Imaging (AREA)
• Medical Informatics (AREA)
• Veterinary Medicine (AREA)
• Biophysics (AREA)
• Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
• Pathology (AREA)
• Public Health (AREA)
• Biomedical Technology (AREA)
• Heart & Thoracic Surgery (AREA)
• Gynecology & Obstetrics (AREA)
• Molecular Biology (AREA)
• Surgery (AREA)
• Animal Behavior & Ethology (AREA)
• General Health & Medical Sciences (AREA)
• Acoustics & Sound (AREA)
• Multimedia (AREA)
• Mechanical Engineering (AREA)
• Ultra Sonic Daignosis Equipment (AREA)
• Transducers For Ultrasonic Waves (AREA)

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• 2012
  • 2012-03-08 US US13/415,377 patent/US9237880B2/en active Active
  • 2012-03-14 WO PCT/IB2012/051208 patent/WO2012123908A2/en not_active Ceased
  • 2012-03-14 JP JP2013558556A patent/JP5972296B2/ja active Active
  • 2012-03-14 CN CN2012800137431A patent/CN103443850A/zh active Pending
  • 2012-03-14 US US14/003,240 patent/US9943287B2/en active Active
  • 2012-03-14 JP JP2013558554A patent/JP2014508022A/ja not_active Withdrawn
  • 2012-03-14 EP EP12715724.6A patent/EP2686116A2/en not_active Withdrawn
  • 2012-03-14 CN CN201280013752.0A patent/CN103429359B/zh active Active
  • 2012-03-14 EP EP12715725.3A patent/EP2686117B1/en active Active
  • 2012-03-14 WO PCT/IB2012/051205 patent/WO2012123906A2/en not_active Ceased

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