WO2012115078A1 - Procédé et dispositif d'enduction - Google Patents

Procédé et dispositif d'enduction Download PDF

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Publication number
WO2012115078A1
WO2012115078A1 PCT/JP2012/054054 JP2012054054W WO2012115078A1 WO 2012115078 A1 WO2012115078 A1 WO 2012115078A1 JP 2012054054 W JP2012054054 W JP 2012054054W WO 2012115078 A1 WO2012115078 A1 WO 2012115078A1
Authority
WO
WIPO (PCT)
Prior art keywords
coating
applicator
open box
bottom plate
coated
Prior art date
Application number
PCT/JP2012/054054
Other languages
English (en)
Japanese (ja)
Inventor
松永　正文
Original Assignee
エムテックスマート株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エムテックスマート株式会社 filed Critical エムテックスマート株式会社
Publication of WO2012115078A1 publication Critical patent/WO2012115078A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B05B13/0405—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads
    • B05B13/041—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads with spray heads reciprocating along a straight line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B05B13/0463—Installation or apparatus for applying liquid or other fluent material to moving work of indefinite length
    • B05B13/0468—Installation or apparatus for applying liquid or other fluent material to moving work of indefinite length with reciprocating or oscillating spray heads
    • B05B13/0473—Installation or apparatus for applying liquid or other fluent material to moving work of indefinite length with reciprocating or oscillating spray heads with spray heads reciprocating along a straight line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
    • B05B14/30—Arrangements for collecting, re-using or eliminating excess spraying material comprising enclosures close to, or in contact with, the object to be sprayed and surrounding or confining the discharged spray or jet but not the object to be sprayed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0486—Operating the coating or treatment in a controlled atmosphere

Abstract

L'invention concerne un procédé et un dispositif d'enduction peu coûteux pouvant être utilisés pour enduire sans danger, de manière hygiénique et automatique, un article devant être enduit à l'intérieur d'une cabine d'enduction par un matériau d'enduction inflammable. Une cabine d'enduction en forme de boîte est formée à partir d'une boîte à fond ouvert fixe et d'une boîte à ouverture supérieure qui est déplacée par un second arbre d'entraînement ou une seconde source d'entraînement; de l'air est aspiré/introduit dans la cabine depuis le haut de ladite cabine d'enduction, puis il est évacué par le fond de celle-ci; une plate-forme destinée à l'article à enduire est disposée à l'intérieur de la boîte à ouverture supérieure; un applicateur est exposé depuis le haut de la cabine d'enduction; puis l'article à enduire est enduit à l'aide du matériau d'enduction.
PCT/JP2012/054054 2011-02-23 2012-02-21 Procédé et dispositif d'enduction WO2012115078A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-037423 2011-02-23
JP2011037423A JP2012170928A (ja) 2011-02-23 2011-02-23 塗布方法及び装置

Publications (1)

Publication Number Publication Date
WO2012115078A1 true WO2012115078A1 (fr) 2012-08-30

Family

ID=46720855

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/054054 WO2012115078A1 (fr) 2011-02-23 2012-02-21 Procédé et dispositif d'enduction

Country Status (2)

Country Link
JP (1) JP2012170928A (fr)
WO (1) WO2012115078A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016508907A (ja) * 2013-03-06 2016-03-24 インボックス ショーケア アクティーゼルスカブ 品物（特にフットウェア）の表面上に含浸剤を塗布するための装置および方法
WO2016158859A1 (fr) * 2015-04-02 2016-10-06 エムテックスマート株式会社 Procédé de projection de fluide et procédé de formation de film de fluide
CN108906379A (zh) * 2018-09-21 2018-11-30 广东兴发铝业（江西）有限公司 一种铝型材自动化连续输送喷漆流水线
CN114769035A (zh) * 2022-06-22 2022-07-22 诸城市圣阳机械有限公司 一种自动化喷漆装置
CN117135782A (zh) * 2023-09-04 2023-11-28 东莞市力可电热科技有限公司 一种石墨烯发热片及其制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6986687B2 (ja) * 2018-10-15 2021-12-22 株式会社不二越 塗布装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61161176A (ja) * 1984-12-29 1986-07-21 Nordson Kk エアレススプレイのスプレイ方法
JPH02227165A (ja) * 1989-02-27 1990-09-10 Nordson Kk 液体又は溶融体の塗布方法
JPH0730221U (ja) * 1993-11-15 1995-06-06 積水化学工業株式会社 コンベアカバー装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61161176A (ja) * 1984-12-29 1986-07-21 Nordson Kk エアレススプレイのスプレイ方法
JPH02227165A (ja) * 1989-02-27 1990-09-10 Nordson Kk 液体又は溶融体の塗布方法
JPH0730221U (ja) * 1993-11-15 1995-06-06 積水化学工業株式会社 コンベアカバー装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016508907A (ja) * 2013-03-06 2016-03-24 インボックス ショーケア アクティーゼルスカブ 品物（特にフットウェア）の表面上に含浸剤を塗布するための装置および方法
WO2016158859A1 (fr) * 2015-04-02 2016-10-06 エムテックスマート株式会社 Procédé de projection de fluide et procédé de formation de film de fluide
CN107614124A (zh) * 2015-04-02 2018-01-19 玛太克司马特股份有限公司 流体的喷出方法以及流体的成膜方法
CN107614124B (zh) * 2015-04-02 2021-07-23 玛太克司马特股份有限公司 流体的喷射方法以及流体的成膜方法
CN108906379A (zh) * 2018-09-21 2018-11-30 广东兴发铝业（江西）有限公司 一种铝型材自动化连续输送喷漆流水线
CN108906379B (zh) * 2018-09-21 2024-04-02 广东兴发铝业（江西）有限公司 一种铝型材自动化连续输送喷漆流水线
CN114769035A (zh) * 2022-06-22 2022-07-22 诸城市圣阳机械有限公司 一种自动化喷漆装置
CN114769035B (zh) * 2022-06-22 2022-09-02 诸城市圣阳机械有限公司 一种自动化喷漆装置
CN117135782A (zh) * 2023-09-04 2023-11-28 东莞市力可电热科技有限公司 一种石墨烯发热片及其制备方法
CN117135782B (zh) * 2023-09-04 2024-03-22 东莞市力可电热科技有限公司 一种石墨烯发热片及其制备方法

Also Published As

Publication number Publication date
JP2012170928A (ja) 2012-09-10

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