WO2012111540A1 - Ruban adhésif résistant à la chaleur pour la fabrication de dispositifs semiconducteurs, et procédé de fabrication de puces à semiconducteurs à l'aide du ruban - Google Patents

Ruban adhésif résistant à la chaleur pour la fabrication de dispositifs semiconducteurs, et procédé de fabrication de puces à semiconducteurs à l'aide du ruban Download PDF

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Publication number
WO2012111540A1
WO2012111540A1 PCT/JP2012/053048 JP2012053048W WO2012111540A1 WO 2012111540 A1 WO2012111540 A1 WO 2012111540A1 JP 2012053048 W JP2012053048 W JP 2012053048W WO 2012111540 A1 WO2012111540 A1 WO 2012111540A1
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Prior art keywords
heat
adhesive tape
manufacturing
semiconductor device
resin
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PCT/JP2012/053048
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English (en)
Japanese (ja)
Inventor
下川　大輔
雄太 島崎
栄一 井本
高正 平山
和樹 副島
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日東電工株式会社
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Publication of WO2012111540A1 publication Critical patent/WO2012111540A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/067—Polyurethanes; Polyureas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
    • C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
    • C08G18/757—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing at least two isocyanate or isothiocyanate groups linked to the cycloaliphatic ring by means of an aliphatic group
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/40—Compositions for pressure-sensitive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat-resistant adhesive tape for manufacturing a semiconductor device for temporarily fixing a chip used in a method for manufacturing a substrate-less semiconductor package that does not use a metal lead frame, and a semiconductor device manufacturing method using the same.
  • CSP Chip Size / Scale Package
  • WLP Wafer Level Package
  • a chip-only package that does not use a substrate such as WLP (Wafer Level Package)
  • WLP Wafer Level Package
  • a plurality of semiconductor Si wafer chips arranged in an orderly manner without using a substrate are collectively sealed with a sealing resin, and then cut into individual structures by cutting, so that the conventional method using a substrate is used. Even small packages can be produced efficiently.
  • Patent Document 1 discloses a step of attaching an acrylic resin-based adhesive means that has adhesive strength before processing but decreases adhesive strength after processing on a substrate, and a plurality or a plurality of the adhesive means on the adhesive means.
  • a step of fixing a semiconductor chip of a seed type with its electrode face down, a step of depositing a protective substance on the entire surface including a plurality of or a plurality of types of semiconductor chips, and applying a predetermined treatment to the adhesive means Reducing the adhesive force of the adhesive means and peeling the pseudo-wafer to which the semiconductor chip is fixed; and cutting the protective substance between the plurality or types of semiconductor chips to each semiconductor chip or chip-like electronic component A method of manufacturing a chip-shaped electronic component having a step of separating the components is described.
  • Patent Document 2 discloses a step of attaching an acrylic resin-based adhesive means that has adhesive strength before processing but decreases in adhesive strength after processing on a substrate, and a plurality or a plurality of the adhesive means on the adhesive means.
  • a step of fixing a semiconductor chip of a seed type with its electrode surface facing down, a step of depositing a protective substance on the entire surface including the plurality or types of semiconductor chips, and the protection from the side opposite to the electrode surface Removing the substance up to the opposite surface of the semiconductor chip, reducing the adhesive force of the adhesive means by applying a predetermined treatment to the adhesive means, and peeling the pseudo wafer to which the semiconductor chip is fixed;
  • a method for manufacturing a chip-shaped electronic component is described, which includes a step of cutting the protective substance between the plurality or types of semiconductor chips to separate each semiconductor chip or chip-shaped electronic component.
  • Patent Document 3 describes a method of adhering a semiconductor element obtained by dicing to a support member, including an epoxy resin and acrylic rubber in an adhesive layer, although it is a dicing die bonding tape.
  • the pressure-sensitive adhesive layer is selected in consideration of adhesiveness to the substrate, not the method of the substrate-less semiconductor device.
  • FIG. 1 shows a method for manufacturing a substrate-less semiconductor package, and the problems will be described below.
  • a structure shown in (a) in which a plurality of chips 1 are attached to a heat-resistant adhesive tape 2 for manufacturing a semiconductor device having adhesive layers on both sides, and the heat-resistant adhesive tape 2 for manufacturing a semiconductor device is fixed to a substrate 3. To do.
  • a heat-resistant adhesive tape 2 for manufacturing a semiconductor device is attached on the substrate 3, and the chip 1 is fixed to obtain a structure shown in (a).
  • a plurality of chips are sealed with a sealing resin 4 from above the chip 1 having the structure shown in (a), and shown in (b).
  • the heat resistant adhesive tape 2 for manufacturing a semiconductor device and the substrate 3 are further integrated, and a plurality of chips 1 sealed with the sealing resin 4 are separated, or the sealing resin 4 is formed by peeling off the chip 1 and the heat-resistant adhesive tape 2 for manufacturing a semiconductor device 2 from the substrate 3 and further removing only the heat-resistant adhesive tape 2 for manufacturing a semiconductor device.
  • a plurality of chips 1 sealed by 4 are obtained.
  • the electrode 5 is formed at a required position to obtain the structure shown in (d).
  • a dicing tape 8 provided with a dicing ring 7 is bonded to the sealing resin side as necessary, and a plurality of chips 1 sealed with the sealing resin 4 for a dicing process are fixed.
  • dicing is performed by the dicing blade 6, and finally, a plurality of substrate-less packages in which a plurality of chips are sealed with resin as shown in (f) are obtained.
  • the heat-resistant adhesive tape 2 for manufacturing a semiconductor device has high adhesiveness even under the temperature at the time of resin sealing so that the position of the chip 1 on the tape does not move due to the pressure of resin sealing. Must have.
  • the general pressure-sensitive pressure-sensitive adhesive has such problems that it is difficult to peel without being lightly peeled at the time of peeling, adhesive residue is generated as shown in FIG. 2, or peeling charging occurs. Further, when peeling becomes difficult, it takes time, and thus productivity is lowered. When the adhesive residue 9 is generated, it becomes impossible to carry out subsequent steps such as electrode formation. Inconveniences in the process may occur.
  • the present invention provides a chip temporary fixing pressure-sensitive adhesive tape that is used by being stuck when resin-sealing a substrateless semiconductor chip contains a urethane polymer component and a vinyl polymer.
  • a heat-resistant adhesive tape for manufacturing semiconductor devices which has a heat-expandable adhesive layer containing heat-expandable microspheres on one side of the resin layer, and without using a metal lead frame A method of manufacturing a semiconductor chip was adopted.
  • the present invention relates to an adhesive tape for temporarily fixing a chip used in a substrate-less semiconductor package manufacturing method (for example, a WLP manufacturing method) that does not use a metal lead frame, and the chip is designated by pressure at the time of resin sealing.
  • a substrate-less semiconductor package manufacturing method for example, a WLP manufacturing method
  • the chip is designated by pressure at the time of resin sealing.
  • the schematic diagram of a base material-less package manufacturing method The figure which a charge and adhesive residue generate
  • Chip 2 Heat-resistant adhesive tape 3 for manufacturing semiconductor device 3: Substrate 4: Sealing resin 5: Electrode 6: Dicing blade 7: Dicing ring 8: Dicing tape 9: Residual residue 10: Smooth release sheet 11: Resin layer 12: Rubbery organic elastic layer 13: Thermally expandable pressure-sensitive adhesive layer
  • a heat-resistant adhesive tape for manufacturing semiconductor devices comprising a thermally expandable adhesive layer containing thermally expandable microspheres on one surface of a resin layer containing a urethane polymer component and a vinyl polymer. It was found that the above-mentioned problems can be solved by using, and the present invention has been completed.
  • FIG. 3 illustrates a heat resistant adhesive tape 2 for manufacturing a semiconductor device used in the present invention.
  • 10 is a smooth release sheet
  • 11 is a resin layer
  • 12 is a rubber-like organic elastic layer
  • 13 is a thermally expandable pressure-sensitive adhesive layer.
  • each of the resin layer and the rubbery organic elastic layer may be composed of a plurality of layers.
  • the resin layer 11 is a layer made of a resin containing a urethane polymer component and a vinyl polymer.
  • the urethane polymer used for the resin layer is obtained by reacting a polyol and diisocyanate.
  • a catalyst generally used in a urethane reaction such as dibutyltin dilaurate, tin octoate, 1,4-diazabicyclo (2,2,2) octane is used. Also good.
  • Polyols include polyether polyols obtained by addition polymerization of ethylene oxide, propylene oxide, tetrahydrofuran, etc., or polycondensation of the above-mentioned dihydric alcohols with divalent basic acids such as adipic acid, azelaic acid, and sepatic acid.
  • polyester polyols acrylic polyols, carbonate polyols, epoxy polyols, and caprolactone polyols.
  • polyether polyols such as polyoxytetramethylene glycol (PTMG) and polyoxypropylene glycol (PPG), non-crystalline polyester polyols, non-crystalline polycarbonate polyols and the like are preferably used. These polyols can be used alone or in combination.
  • diisocyanate examples include aromatic, aliphatic, and alicyclic diisocyanates.
  • Aromatic, aliphatic, and alicyclic diisocyanates include tolylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, isophorone diisocyanate, hydrogenated diphenylmethane diisocyanate, 1,5-naphthylene diisocyanate.
  • These diisocyanates can be used alone or in combination. From the viewpoint of urethane reactivity, compatibility with acrylic, and the like, the type and combination of polyisocyanates can be appropriately selected.
  • the amount of the polyol component and the diisocyanate component used to form the urethane polymer is not particularly limited.
  • the amount of the polyol component used is NCO / OH (equivalent ratio) of 1 with respect to the diisocyanate component. It is preferably 0.0 or more, and more preferably 2.0 or less.
  • NCO / OH is 1.0 or more, the terminal functional group of the urethane molecular chain becomes a hydroxyl group, and the strength of the temporary fixing layer can be prevented from being lowered.
  • NCO / OH is 2.0 or less, moderate elongation and intensity
  • the urethane polymer is an acryloyl group-terminated urethane polymer.
  • an acryloyl group By having such an acryloyl group, it is possible to adjust the cohesive force by crosslinking with the vinyl polymer.
  • the molecular weight of the urethane polymer component in the present invention can be appropriately determined according to the type of polyol or diisocyanate used and the NCO / OH ratio.
  • the molecular weight is not particularly limited, but the number average molecular weight (Mw) is preferably 5000 or more, more preferably 10,000 or more.
  • a hydroxyl group-containing acrylic monomer it is desirable to add a hydroxyl group-containing acrylic monomer to the urethane polymer separately from the vinyl polymer in the present invention.
  • a hydroxyl group-containing acrylic monomer By adding a hydroxyl group-containing acrylic monomer, an acryloyl group can be introduced into the molecule of the urethane polymer, and copolymerizability with the acrylic monomer can be imparted.
  • the hydroxyl group-containing acrylic monomer hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxyhexyl (meth) acrylate, or the like is used.
  • the amount of the hydroxyl group-containing acrylic monomer used is desirably 0.1 to 10 parts by weight, and more desirably 0.1 to 5 parts by weight with respect to 100 parts by weight of the urethane polymer.
  • the vinyl polymer used in the resin layer in the present invention may be obtained by polymerizing only the vinyl compound constituting the vinyl monomer, and in this case, a single monomer or a mixture of two or more monomers is used for polymerization. It is obtained by attaching.
  • the polymerization can be performed by any method such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like.
  • the pressure-sensitive adhesive layer preferably has a low content of low molecular weight substances from the viewpoint of preventing contamination of semiconductor wafers and the like. In this respect, the weight average molecular weight of the acrylic polymer is preferably 300,000 or more, more preferably about 400,000 to 3,000,000.
  • the resin layer may be obtained by blending the urethane polymer with the following vinyl polymer. Alternatively, it may be obtained by preparing a mixture of a urethane polymer and a vinyl monomer and then polymerizing the vinyl polymer. Among these, from the viewpoint of the types of monomers that can be used and the processability of sheeting, the urethane obtained by reacting a polyol and an isocyanate in a vinyl monomer alone or in a mixture of two or more to form a urethane polymer. It is preferable that a mixture containing a polymer and a vinyl monomer is applied on a substrate, cured by irradiation with radiation, and formed.
  • the vinyl monomer is preferably a (meth) acrylic monomer.
  • the vinyl monomer is polymerized, whereby the acryloyl group is polymerized with the vinyl group, and the urethane polymer and the It is also possible to use a resin formed by bonding a vinyl polymer.
  • the vinyl polymer in the present invention is a polymer obtained by polymerizing a vinyl monomer.
  • a (meth) acrylic monomer is preferably used as described above.
  • the (meth) acrylic monomer for example, , Ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, sec-butyl (meth) acrylate, t-butyl (meth) acrylate, n-octyl (meta ) Acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isononyl (meth) acrylate, dodecyl (meth) acrylate, n-octadecyl (meth) acrylate, acrylic acid, methacrylic acid, carboxyethyl acrylate Car
  • amide monomers such as N-substituted (meth) acrylamide such as (meth) acrylamide and N-methylolacrylamide, N- (meth) acryloyloxymethylene succinimide, N- (meth) acryloyl-6-oxyhexamethylene succinimide, Succinimide monomers such as N- (meth) acryloyl-8-oxyoctamethylenesuccinimide, vinyl monomers such as vinyl acetate, N-vinylpyrrolidone, N-vinylcarboxylic acid amides, N-vinylcaprolactam; acrylonitrile, methacrylonitrile Cyanoacrylate monomers such as glycidyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, polyethylene glycol (meth) acrylate, polypropylene glycol (meth) acrylate , Acrylic ester monomers such as fluorine (meth)
  • (meth) acrylic monomers are appropriately determined in kind, combination, amount of use, etc. in consideration of compatibility with urethane, polymerizability at the time of photocuring such as radiation, and characteristics of the high molecular weight obtained.
  • The it is desirable to use a monomer having a carboxyl group so that the vinyl polymer can contain a carboxyl group in consideration of the adhesive strength at the time of heating and peeling, and (meth) acrylic acid If a monomer having a polar group such as is used, the balance of the adhesive force during heating and cooling peeling is good.
  • the addition amount of (meth) acrylic acid is preferably 5 parts by weight or more and less than 80 parts by weight, and more preferably 10 parts by weight or more when the total amount of urethane polymer and vinyl polymer is 100 parts by weight. Less than 70 parts by weight.
  • polyfunctional monomers can be added as long as the characteristics are not impaired.
  • examples of the polyfunctional monomer include hexanediol diacrylate, trimethylolpropane triacrylate, dipentaerythritol hexaacrylate, and the like.
  • the resin layer in the present invention contains a urethane polymer and a vinyl polymer as active ingredients.
  • the ratio of the urethane polymer and the vinyl polymer is not particularly limited, but the weight of the urethane polymer is preferably 10% or more and 90% or less, and more preferably 20% or more and less than 80% with respect to the total amount of the urethane polymer and the vinyl polymer. It is.
  • the proportion of the urethane polymer is 10% or more, the elastic modulus at high temperature is not lowered and sufficient processing accuracy can be obtained. On the other hand, if it is 90% or less, the handling property and productivity at the time of producing the sheet are good.
  • a vinyl monomer constituting a vinyl polymer by polymerization is used alone or in a mixture of two or more to form a urethane polymer by reacting a polyol and an isocyanate, and the urethane polymer and the vinyl monomer Is applied onto a support substrate, and depending on the type of photopolymerization initiator, ionizing radiation such as ⁇ rays, ⁇ rays, ⁇ rays, neutron rays, electron rays, radiation such as ultraviolet rays, visible light, etc. It can be obtained by being cured by irradiating the like. Moreover, it is also possible to form by blending a urethane polymer and a vinyl polymer, and applying and drying this on a support substrate.
  • hydroxyl group-containing acrylic monomer when using the above hydroxyl group-containing acrylic monomer, after forming a urethane polymer by reacting a polyol and an isocyanate in a vinyl monomer alone or in a mixture of two or more constituting a vinyl polymer by polymerization, A hydroxyl group-containing acrylic monomer is added to react with the urethane polymer, and the resulting mixture is applied onto a support substrate, and ⁇ -rays, ⁇ -rays, ⁇ -rays, neutron rays, depending on the type of photopolymerization initiator, It can be obtained by curing by irradiating ionizing radiation such as an electron beam, radiation such as ultraviolet rays, visible light or the like.
  • ionizing radiation such as an electron beam, radiation such as ultraviolet rays, visible light or the like.
  • the viscosity is adjusted by adding diisocyanate or the like and reacting with the polyol, and this is applied to a support base material, and then a low-pressure mercury lamp or the like is used.
  • a temporarily fixed sheet can be obtained.
  • the vinyl monomer may be added all at once during the urethane synthesis, or may be added in several divided portions.
  • the polyol may be reacted after the diisocyanate is dissolved in the vinyl monomer.
  • the molecular weight is not limited and a high molecular weight polyurethane can be produced, so that the molecular weight of the finally obtained urethane can be designed to an arbitrary size.
  • oxygen may be blocked by placing a further peeled substrate on a mixture of urethane polymer and vinyl monomer coated on a supporting substrate.
  • the oxygen concentration may be lowered by putting a release liner in a container filled with an inert gas.
  • the solvent can be appropriately selected from commonly used solvents, and examples thereof include ethyl acetate, toluene, chloroform, dimethylformamide and the like.
  • the type of radiation and the type of lamp used for irradiation can be selected as appropriate, such as a low-pressure lamp such as a fluorescent chemical lamp, a black light and a sterilization lamp, a high-pressure such as a metal halide lamp and a high-pressure mercury lamp.
  • a lamp or the like can be used.
  • the irradiation amount of ultraviolet rays or the like can be arbitrarily set according to the required characteristics of the temporary fixing layer. In general, the irradiation amount of ultraviolet rays is 50-5000 mJ / cm 2 , preferably 100-4000 mJ / cm 2 , more preferably 100-3000 mJ / cm 2 . If the irradiation amount of ultraviolet rays is in the range of 50 to 5000 mJ / cm 2 , a sufficient polymerization rate can be obtained without deterioration.
  • the mixture mainly composed of a urethane polymer and a vinyl monomer contains a photopolymerization initiator.
  • photopolymerization initiators include benzoin ethers such as benzoin methyl ether, benzoin isopropyl ether, and 2,2-dimethoxy-1,2-diphenylethane-1-one; substituted benzoin ethers such as anisole methyl ether; Substituted acetophenones such as ethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxy-cyclohexyl-phenylketone; substituted alpha-ketols such as 2-methyl-2-hydroxypropiophenone; 2-naphthalenesulfonyl chloride, etc.
  • Aromatic sulfonyl chlorides such as 1-phenyl-1,1-propanedione-2- (o-ethoxycarbonyl) -oxime; 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide And acylphosphine oxides such as bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide.
  • the thickness of the resin layer in the present invention can be appropriately selected according to the purpose and the like, but is generally about 5 to 500 ⁇ m, preferably about 10 to 100 ⁇ m.
  • the resin layer of the present invention has a shear adhesive strength to a silicon chip at 175 ° C. of 100 g / 10 mm 2 or more, preferably 150 g / 10 mm 2 or more, more preferably 200 g / 10 mm 2 or more, further 300 g / 10 mm 2 or more. And 90 ° peel-off adhesive strength to the sealing resin after heating at 175 ° C.
  • the resin sealing / curing step is often performed at a temperature of about 175 ° C., and such a shear adhesive strength is 100 g / 10 mm 2 or more and a peeling adhesive strength is 0.50 N / 20 mm or less.
  • the semiconductor chip can be supported and securely fixed without being displaced at the time of sealing and curing with resin. Further, after cooling to a specific temperature and peeling off the resin layer from the individualized package, the smaller the 90 ° film peeling adhesive force to the sealing resin, the smaller the force required for peeling. The package will not be damaged.
  • the resin layer of the adhesive sheet for manufacturing a semiconductor device has a property of developing an adhesive force at a specific temperature of 40 ° C. or higher and losing the adhesive force below the specific temperature. More preferably, it has an adhesive strength at a specific temperature of 70 ° C or higher, and particularly preferably has an adhesive strength at a specific temperature of 100 ° C or higher.
  • the expression of the adhesive strength at a specific temperature of 40 ° C. or higher means that the adhesive strength is first expressed at a certain temperature of 40 ° C. or higher, and does not exhibit the adhesive strength at a temperature lower than the certain temperature. It means that it does not show adhesive strength at temperature.
  • the storage elastic modulus G ′ at 175 ° C. of the resin layer in the present invention is 1.0 ⁇ 10 5 Pa or more, preferably 2.0 ⁇ 10 5 Pa or more, more preferably 3.0 ⁇ 10 5 Pa or more, Furthermore, it is preferably 4.0 ⁇ 10 5 Pa or more. If the storage elastic modulus G ′ is 1.0 ⁇ 10 5 Pa or more, the stand-off in which the chip is embedded in the resin layer is small, and the yield in the subsequent process does not decrease.
  • the rubber-like organic elastic layer 12 has a function of providing a large adhesion area by following the surface shape of the adherend when the heat-resistant pressure-sensitive adhesive tape for manufacturing a semiconductor device is adhered to the adherend.
  • swelling restraint and the function which promotes the function of encouraging the formation of a jelly structure by the three-dimensional structural change of the heat-expandable adhesive layer 13 is also included.
  • the rubbery organic elastic layer 12 can be provided as necessary, but when it is provided, the thickness is preferably 5 to 50 ⁇ m in order to sufficiently exhibit its characteristics.
  • the rubbery organic elastic layer 12 can be formed of natural rubber or synthetic rubber of 50 or less, preferably 40 or less, based on ASTM D-2240 D-type Sure D-type hardness, or a synthetic resin having rubber elasticity.
  • Examples of the synthetic rubber or synthetic resin include nitrile, diene, and acrylic synthetic rubbers, thermoplastic elastomers such as polyolefins and polyesters, ethylene-vinyl acetate copolymers, polyurethane, polybutadiene, and soft polychlorinated polymers.
  • Examples thereof include synthetic resins having rubber elasticity such as vinyl.
  • an essentially hard polymer such as polyvinyl chloride having rubber elasticity in combination with a compounding agent such as a plasticizer or a softener can be used in the present invention. Further, it can be formed by a generally known pressure-sensitive adhesive such as rubber or resin.
  • the pressure sensitive adhesive an appropriate material such as a rubber pressure sensitive adhesive, an acrylic pressure sensitive adhesive, a styrene / conjugated diene block copolymer based pressure sensitive adhesive, or the like can be used.
  • a resin containing a heat-meltable resin having a melting point of about 200 ° C. or lower and having improved creep properties can be used.
  • the pressure-sensitive adhesive may be a mixture of appropriate additives such as an antistatic agent, a crosslinking agent, a tackifier, a plasticizer, a filler, and an anti-aging agent.
  • a rubber-based pressure-sensitive adhesive based on natural rubber or synthetic rubber, methyl group, ethyl group, propyl group, butyl group, 2-ethylhexyl group, isooctyl group, isononyl group, isodecyl group
  • Acrylic acid such as acrylic acid or methacrylic acid having an alkyl group having 20 or less carbon atoms, typically dodecyl group, lauryl group, tridecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecyl group, eicosyl group
  • Alkyl ester acrylic acid, methacrylic acid, itaconic acid, hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, N-methylolacrylamide, acrylonitrile, acryl
  • the pressure-sensitive adhesive forming the heat-expandable pressure-sensitive adhesive layer 13 needs to allow foaming and / or expansion of the heat-expandable microspheres during heating, and can be used in the rubbery organic elastic layer.
  • the heat-foaming pressure-sensitive adhesive is obtained by blending thermally expandable fine particles with the above general pressure-sensitive pressure-sensitive adhesive.
  • the heat-expandable pressure-sensitive adhesive is such that the adhesive area decreases due to foaming of the heat-expandable fine particles due to heat, and peeling becomes easy.
  • the average particle diameter of the heat-expandable fine particles is preferably about 1 ⁇ m to 25 ⁇ m. More preferably, it is 5 ⁇ m to 15 ⁇ m, particularly about 10 ⁇ m.
  • the heat-expandable pressure-sensitive adhesive layer is appropriately mixed with a tackifier such as a known resin, a plasticizer, a pigment, a filler, a conductive agent, an antistatic agent, etc., and an other functional epoxy compound or an isocyanate compound It is crosslinked with a crosslinking agent such as an aziridine compound, a melamine resin, a urea resin, an anhydrous compound, a polyamine, or a carboxyl group-containing polymer.
  • a tackifier such as a known resin, a plasticizer, a pigment, a filler, a conductive agent, an antistatic agent, etc.
  • an other functional epoxy compound or an isocyanate compound It is crosslinked with a crosslinking agent such as an aziridine compound, a melamine resin, a urea resin, an anhydrous compound, a polyamine, or a carboxyl group-containing polymer.
  • the heat-expandable pressure-sensitive adhesive layer 13 can be formed by blending heat-expandable microspheres with the pressure-sensitive adhesive.
  • Thermally expandable microspheres include, for example, thermal expansion in which a suitable material showing thermal expansion properties such as isobutane, propane and pentane is encapsulated in a shell-forming material by a coacervation method or an interfacial polymerization method. Microspheres can be used.
  • the heat-expandable microspheres used have a volume expansion ratio of 5 times or more, preferably 10 times or more of the heat-expandable microspheres.
  • thermally expandable microspheres examples are generally vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone, and the like. In the present invention, it may be made of a hot-melt material or a material that is destroyed by thermal expansion. Thermally expandable microspheres also have advantages such as excellent dispersibility with the pressure-sensitive adhesive. Examples of commercially available products of thermally expandable microspheres include microspheres (trade name: manufactured by Matsumoto Yushi Seiyaku Co., Ltd.).
  • the blending amount of the heat-expandable microspheres may be appropriately determined according to the degree to which the heat-expandable pressure-sensitive adhesive layer 13 is expanded (foamed) or the degree to which the adhesive force is reduced. In general, 1 to 150 parts by weight, preferably 25 to 100 parts by weight are blended per 100 parts by weight of the base polymer.
  • the thickness of the heat-expandable pressure-sensitive adhesive layer is 5 to 100 ⁇ m, preferably 15 to 50 ⁇ m.
  • the heat treatment conditions for enabling the heat-resistant adhesive tape 2 for manufacturing a semiconductor device of the present invention to be easily peeled off from the adherend are the adhesion area depending on the surface state of the adherend and the type of thermally expandable microspheres.
  • the smooth release sheet 10 is a sheet formed by forming a release agent layer on one side of a base film, and the adhesive layer on each side is exposed before using the heat-resistant adhesive tape 2 for manufacturing a semiconductor device of the present invention. It is a sheet which is peeled to make it happen.
  • the release agent layer can be appropriately selected from known release agent layers such as a long chain alkyl group, a fluororesin, and a silicone resin depending on the pressure sensitive adhesive.
  • This release sheet can also be used as a base when forming a resin layer or a heat-expandable pressure-sensitive adhesive layer, or can be used by being laminated on the surface of the formed resin layer or heat-expandable pressure-sensitive adhesive layer. Good.
  • polyetheretherketone polyetherimide
  • polyarylate polyethylene naphthalate
  • polyethylene film polypropylene film
  • polybutene film polybutadiene film
  • polymethylpentene film polyvinyl chloride film.
  • Vinyl chloride copolymer film polyethylene terephthalate film, polybutylene terephthalate film, polyurethane film, ethylene-vinyl acetate copolymer film, ionomer resin film, ethylene- (meth) acrylic acid copolymer film, ethylene- (meth) Acrylic ester copolymer film, polystyrene film, and plastic film such as polycarbonate film
  • plastic film such as polycarbonate film
  • the release agent layer that can be used is a known release agent such as a fluorinated silicone resin release agent, a fluorine resin release agent, a silicone resin release agent, a polyvinyl alcohol resin, a polypropylene resin, a long chain alkyl compound, It is a layer selected and contained according to the resin of the pressure-sensitive adhesive layer.
  • the heat-resistant adhesive tape 2 for manufacturing a semiconductor device of the present invention can be manufactured by a general manufacturing method.
  • a coating liquid is prepared by dissolving a composition constituting each of the resin layer, the rubbery organic elastic layer 12, and the thermally expandable pressure-sensitive adhesive layer 13 in a predetermined solvent, and these coating liquids have releasability.
  • coating so that it may become the layer structure of the target heat resistant adhesive tape 2 for semiconductor device manufacture on resin layers, such as a separator, the application layer is heated and dried in order on predetermined conditions.
  • a single film may be prepared by casting the resin layer, the rubbery organic elastic layer 12 and the heat-expandable pressure-sensitive adhesive layer 13 on a peelable film or the like, and these may be laminated in order.
  • the solvent is not particularly limited, but a ketone solvent such as methyl ethyl ketone is preferably used in consideration of the good solubility of the constituent materials.
  • the heat-resistant adhesive tape 2 for manufacturing a semiconductor device is used in the process described above with reference to FIG. That is, it is used as a means for fixing the chip in the semiconductor chip bonding process, sealing process, and peeling process described below.
  • the resin used in the sealing step in which the heat-resistant adhesive tape 2 for manufacturing a semiconductor device of the present invention is used can be arbitrarily changed depending on the application, but may be a known sealing resin such as an epoxy resin.
  • the melting temperature and curing temperature of the powdered resin and the curing temperature of the liquid resin are selected in consideration of the heat resistance of the heat-resistant adhesive tape 2 for manufacturing a semiconductor device, but the heat-resistant adhesive tape for manufacturing a semiconductor device of the present invention. 2 has heat resistance at the melting temperature and curing temperature of a normal sealing resin.
  • the sealing step is performed in the mold with the above resin for chip protection, for example, at 170 to 180 ° C. Thereafter, after the heat-resistant adhesive tape 2 for manufacturing a semiconductor device is peeled off, post mold curing is performed.
  • the heat-resistant adhesive tape 2 for manufacturing a semiconductor device is peeled from the layer formed by sealing the chip with a resin. Further, the heat resistant adhesive tape 2 for manufacturing a semiconductor device and the substrate 3 are integrated without being separated, and the plurality of chips 1 sealed with the sealing resin 4 are separated from the resin layer of the heat resistant adhesive tape 2 for manufacturing a semiconductor device. A method may be adopted.
  • Electrode formation process Next, on the side where one surface of the chip 1 formed by sealing the chip 1 with the sealing resin 4 is exposed, that is, on the side where the heat-resistant adhesive tape 2 for manufacturing a semiconductor device is laminated, screen printing or the like
  • the electrode 5 is formed at a predetermined position of each chip by the method.
  • a known material can be used as the electrode material.
  • a layer formed by sealing the chip 1 with the sealing resin 4 is fixed to a dicing tape 8 preferably provided with a dicing ring 7, and then a dicing blade 6 used in a normal dicing process is used for each package. Tidy up. At this time, if each chip 1 does not exist at a predetermined position, in addition to inaccurate electrode formation, if the position of the chip 1 of each package is incorrect or severe, dicing is performed. Sometimes, the dicing blade 6 may come into contact with the chip 1.
  • the heat-resistant adhesive tape 2 for manufacturing a semiconductor device according to the present invention When the heat-resistant adhesive tape 2 for manufacturing a semiconductor device according to the present invention is used, the position of the chip 1 can be prevented from shifting in the sealing process with the sealing resin 4, so that the dicing process is smoothly performed without such trouble. As a result, a package in which the chip 1 is accurately positioned in the sealing resin is obtained. Further, the heat-resistant adhesive tape 2 for manufacturing a semiconductor device can be peeled off from a chip sealed with a sealing resin by light peeling, and since no adhesive residue is produced, it is manufactured while maintaining a high yield. Is possible.
  • the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.
  • Example 1 Poly (tetramethylene) glycol having a number average molecular weight of 650, 50 parts by weight of isobornyl acrylate (IBXA) as a (meth) acrylic monomer and polyol as a (meth) acrylic monomer in a reaction vessel equipped with a condenser, a thermometer, and a stirring device 72.8 parts by weight (PTMG, manufactured by Mitsubishi Chemical Corporation) was added, and 27.2 parts by weight of hydrogenated xylylene diisocyanate (HXDI, manufactured by Mitsui Chemicals Polyurethanes Co., Ltd.) was added dropwise with stirring to 65 ° C. For 10 hours to obtain a urethane polymer-acrylic monomer mixture.
  • IBXA isobornyl acrylate
  • HXDI hydrogenated xylylene diisocyanate
  • the urethane polymer and the acrylic monomer mixture were applied on a PET having a thickness of 38 ⁇ m which was subjected to a release treatment so that the thickness after curing was 100 ⁇ m.
  • the PET film after the release treatment was overlaid and coated, and then the coated PET film surface was cured by irradiating with ultraviolet light (illuminance 5 mW / cm 2 , light amount 1000 mJ / cm 2 ) using a black light, Resin layer 1 (urethane-acrylic composite film) was formed on the PET film.
  • thermally expandable pressure-sensitive adhesive layer 1.0 part of an epoxy-based crosslinking agent was added to 100 parts of a copolymer polymer consisting of ethyl acrylate-butyl acrylate-acrylic acid (20 parts-80 parts-10 parts), A coating solution is prepared by uniformly mixing and dissolving 5 parts of a rosin-based tackifier, 50 parts of thermally expandable microspheres of 200 ° C. foaming expansion type, and toluene.
  • a heat-resistant pressure-sensitive adhesive tape 1 for producing a semiconductor device having a pressure-sensitive adhesive layer of 40 ⁇ m was obtained.
  • this heat-resistant adhesive tape for manufacturing semiconductor devices is crimped and fixed to a smooth base, a 5 mm ⁇ 5 mm Si wafer chip is placed on the resin layer on the opposite surface, and a liquid epoxy-based sealing
  • the resin was poured and molded at 175 ° C. ⁇ 2 min. Thereafter, the curing of the resin was promoted (post mold cure) by heating at 150 ° C. for 60 minutes to produce a package.
  • Example 2 In a reaction vessel equipped with a condenser, a thermometer, and a stirrer, as a (meth) acrylic monomer, 80 parts by weight of isobornyl acrylate (IBXA), 20 parts by weight of butyl acrylate (BA), and several polyols are used. 72.8 parts by weight of poly (tetramethylene) glycol having an average molecular weight of 650 (PTMG, manufactured by Mitsubishi Chemical Corporation) was added, and 27.2 parts by weight of HXDI was added dropwise with stirring, and the mixture was reacted at 65 ° C. for 10 hours. A urethane polymer-acrylic monomer mixture was obtained.
  • IBXA isobornyl acrylate
  • BA butyl acrylate
  • HXDI poly (tetramethylene) glycol having an average molecular weight of 650
  • the PET film after the release treatment was overlaid and coated, and then the coated PET film surface was cured by irradiating with ultraviolet light (illuminance 5 mW / cm 2 , light amount 1000 mJ / cm 2 ) using a black light,
  • ultraviolet light illumination 5 mW / cm 2 , light amount 1000 mJ / cm 2
  • a package was prepared in the same manner as in Example 1 except that the resin layer 2 (urethane-acrylic composite film 2) was formed on the PET film.
  • Example 3 In a reaction vessel equipped with a condenser, a thermometer, and a stirrer, 100 parts by weight of isobornyl acrylate (IBXA) as a (meth) acrylic monomer and poly (tetramethylene) glycol having a number average molecular weight of 650 as a polyol 72.8 parts by weight (PTMG, manufactured by Mitsubishi Chemical Co., Ltd.) was added, and 27.2 parts by weight of HXDI was added dropwise with stirring and reacted at 65 ° C. for 10 hours to obtain a urethane polymer-acrylic monomer mixture. It was.
  • IBXA isobornyl acrylate
  • PTMG poly (tetramethylene) glycol having a number average molecular weight of 650 as a polyol 72.8 parts by weight
  • the PET film that had been subjected to the peeling treatment was overlaid and coated, and then the coated PET film surface was irradiated with ultraviolet rays (illuminance 5 mW / cm 2 , light quantity 1000 mJ / cm 2 ) using a black light, and cured.
  • a package was prepared in the same manner as in Example 1 except that the resin layer 3 (urethane-acrylic composite film 3) was formed on the PET film.
  • Comparative Example 2 100 parts by weight of stearyl acrylate and 0.3 parts by weight of 2,2-dimethoxy-1,2-diphenylethane-1-one are placed in a four-necked flask and partially photopolymerized by exposure to ultraviolet light in a nitrogen atmosphere. As a result, a partially polymerized product (monomer syrup) was obtained. To 40 parts by weight of this partially polymerized product, 54 parts of isooctyl acrylate, 6 parts by weight of acrylic acid and 0.1 part by weight of hexanediol diacrylate as a crosslinking agent were added, and these were uniformly mixed to produce a photopolymerizable composition. Was prepared.
  • the above-mentioned photopolymerizable composition was applied so as to have a thickness of 100 ⁇ m, and further, a polyethylene terephthalate film on which one side having a thickness of 38 ⁇ m was peeled was covered to form a coating layer.
  • This sheet was irradiated with 1000 mJ / cm 2 of UV light with a light intensity of 5 mW / cm 2 (measured with Topcon UVR-T1 having a peak sensitivity maximum wave of 350 nm) using a black light (15 W / cm 2 ), and contains a side chain crystallizable polymer.
  • a temporary fixing sheet was obtained.
  • a package was produced in the same manner as in Example 1, such as applying a thermally expandable adhesive layer to the base material surface of this side chain crystallizable polymer-containing temporary fixing sheet in the same manner as in Example 1.
  • Sheets prepared in Examples and Comparative Examples were cut into 20 mm squares, 10 mm square silicon chips were placed on the resin layer (the opposite side of the thermally expandable adhesive layer), and then a 175 ° C. shear adhesive test with a plate base. After being set in the machine and allowed to stand for 3 minutes, as shown in FIG. 4, the load when the silicon chip was pushed in the horizontal direction at a speed of 0.5 mm / sec was measured.
  • ⁇ Measurement method of storage elastic modulus G '> The storage elastic modulus (G ′) was measured by “ARES” (manufactured by TA Instruments). The measurement was performed in a temperature range of ⁇ 60 ° C. to 200 ° C. under conditions of a temperature rising rate of 5 ° C./min and a frequency of 1 Hz.
  • Comparative Example 1 since the resin layer does not contain a urethane polymer component, it is not possible to suppress chip displacement at the time of molding, and Comparative Example 2 does not contain a vinyl polymer.
  • the elastic modulus at 175 ° C. was low, so that the silicon chip was embedded in the resin layer, and the standoff value was large.
  • a fixing heat-resistant heat-peelable pressure-sensitive adhesive tape could be provided.

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Abstract

L'invention a pour objet de satisfaire l'exigence, lors d'une étape de décollement d'un ruban adhésif résistant à la chaleur pour la fabrication de dispositifs semiconducteurs (2) à partir d'une puce, d'un décollement léger après un enrobage à la résine et un durcissement de la résine. Par conséquent, les adhésifs autocollants ordinaires, qui sont fortement visqueux aux températures élevées, ne sont pas facilement décollés par un décollement léger lorsqu'il est temps de décoller l'adhésif, il reste de l'adhésif comme illustré sur la Figure 2, ou le décollement provoque une accumulation d'électricité statique. Afin de résoudre ce problème, la présente invention concerne un ruban adhésif résistant à la chaleur sans substrat pour la fabrication de dispositifs semiconducteurs, qui est appliqué lors de l'enrobage à la résine d'une puce à semiconducteurs pour immobiliser temporairement la puce, et qui est caractérisé en ce qu'il comprend une couche d'adhésif se dilatant à la chaleur, contenant des microsphères se dilatant à la chaleur sur une surface d'une couche de résine contenant un composant de polymère uréthane et un polymère à base de vinyle.
PCT/JP2012/053048 2011-02-14 2012-02-10 Ruban adhésif résistant à la chaleur pour la fabrication de dispositifs semiconducteurs, et procédé de fabrication de puces à semiconducteurs à l'aide du ruban WO2012111540A1 (fr)

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