WO2012104937A1 - Ｌｅｄモジュールおよび照明装置 - Google Patents

Ｌｅｄモジュールおよび照明装置 Download PDF

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Publication number
WO2012104937A1
WO2012104937A1 PCT/JP2011/004779 JP2011004779W WO2012104937A1 WO 2012104937 A1 WO2012104937 A1 WO 2012104937A1 JP 2011004779 W JP2011004779 W JP 2011004779W WO 2012104937 A1 WO2012104937 A1 WO 2012104937A1
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Prior art keywords
light
phosphor
color
green
less
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Application number
PCT/JP2011/004779
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English (en)
French (fr)
Japanese (ja)
Inventor
利雄 森
裕美 田中
Original Assignee
パナソニック株式会社
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Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to CN201180065762.4A priority Critical patent/CN103329293B/zh
Priority to EP11857477.1A priority patent/EP2672532B1/de
Priority to JP2012503812A priority patent/JPWO2012104937A1/ja
Priority to US13/978,890 priority patent/US8933620B2/en
Publication of WO2012104937A1 publication Critical patent/WO2012104937A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Definitions

  • the present invention relates to a high-saturation LED (Light Emitting Diode) module and an illumination device that can improve the vividness of the color of an illuminated object.
  • a high-saturation LED Light Emitting Diode
  • Patent Document 1 presupposes a lamp for general illumination (see paragraph 0002).
  • the application range of LED lamps will expand, and may be applied to product display lamps such as lamps provided in showcases. is assumed.
  • LED lamps that have improved color rendering using the technology of Patent Document 1 or the like that is, LED lamps having a high color rendering index Ra, emit light in the yellow region of the emission spectrum of LEDs. Vivid colors of foods and articles may appear yellowish or dull as a whole due to the influence of a large amount of components, and as a result, color reproduction may not be preferable.
  • an object of the present invention is to provide a high-saturation LED module and an illumination device that can improve the vividness of the color of an illuminated object even when the color temperature of ambient light is high, and as a result, can preferably reproduce the color.
  • An LED module includes a blue LED that emits blue light, a green phosphor that absorbs part of the emitted light from the blue LED and emits green light, a part of the emitted light from the blue LED, and A red phosphor that absorbs at least one part of the emitted light of the green phosphor and emits red light, and the peak wavelength of the emission spectrum of the blue LED is 420 nm to 470 nm,
  • the full width at half maximum is greater than 0 nm to 50 nm or less
  • the peak wavelength of the emission spectrum of the green phosphor is from 500 nm to 535 nm
  • the half width is from 100 nm to 110 nm
  • the emission spectrum has a peak wavelength of 610 nm to 670 nm or less, a half width of 85 nm to 95 nm, and a correlated color temperature Tc of the mixed light of the blue light, the green light, and the red light is 4600.
  • the lighting device according to the present invention has the same configuration as the LED module.
  • duv Distance from perfect radiator locus on uv-ordinates
  • ⁇ uv chromaticity deviation
  • the correlation color temperature Tc in the above configuration is 4600K or more and 7200K or less corresponds to the range of daylight color (4600K or more and 5500K or less) to daylight color (5700K or more and 7100K or less) specified in Japanese Industrial Standard JIS ⁇ Z9112. That is, the correlated color temperature of the mixed color light is high. Further, duv is -12 or more and -6 or less, on the xy chromaticity diagram, corresponds to a range below the chromaticity range of the light source color defined in the same standard (that is, y value is small), This means that the reddish component contained in the mixed color light increases, and as a result, the saturation increases.
  • the saturation can be improved by limiting the peak wavelength and half-value width of each of the red phosphor and the green phosphor to a specific range. Due to the synergistic effect of such conditions, even when the correlated color temperature of ambient light is high, it is possible to improve the vividness of the color of the illuminated object, and as a result, it is possible to realize a high-saturation LED module that can preferably reproduce colors.
  • Sectional drawing which shows the structure of the LED module which concerns on embodiment of this invention
  • Xy chromaticity diagram for explaining a chromaticity range of an LED module according to an embodiment of the present invention
  • Diagram showing U * V * uniform color space for sample with color temperature Tc of 6200K and duv of -10
  • the figure which shows an example of the data of color gamut area ratio Ga Figure illustrating the range that satisfies Equation 1 when duv is fixed
  • the figure which illustrates the structure of an illuminating device The figure which illustrates the structure of an illuminating device
  • Fig.1 (a) is sectional drawing which shows the structure of the LED module which concerns on embodiment of this invention.
  • the LED module 11 includes a package base 12, a lead 13, a blue LED 14, a transparent sealing material 15, a green phosphor 16, and a red phosphor 17.
  • the package base 12 is made of an insulating material such as ceramics
  • the lead 13 is made of a conductive material such as metal
  • the transparent sealing material 15 is made of a transparent material such as silicone.
  • the blue LED 14 emits blue light by the power supplied through the lead 13.
  • An example of such an LED is a gallium nitride LED.
  • the green phosphor 16 absorbs a part of the light emitted from the blue LED 14 and emits green light.
  • An example of such a phosphor is a YAG phosphor.
  • the YAG phosphor for example, (Y 1-x Ce x ) 3 (Al 1-y Ga y) 5 O 12, however, make use of 0.01 ⁇ x ⁇ 5,0 ⁇ y ⁇ 5, However, other known ones may be used.
  • the red phosphor 17 absorbs at least one of part of the emitted light from the blue LED 14 and part of the emitted light from the green phosphor 16 and emits red light.
  • An example of such a phosphor is CASN phosphor.
  • CASN phosphor for example, (Sr 1-x Ca x ) AlSiN 3 : Eu 2+ , where 0 ⁇ x ⁇ 1, can be used. Good.
  • the blue LED 14 is covered with the transparent sealing material 15, and the green phosphor 16 and the red phosphor 17 are dispersed in the transparent sealing material 15. Therefore, the light emitted from the LED module 11 is a mixed color light of blue light, green light, and red light.
  • the color temperature and chromaticity range of the mixed color light are adjusted by adjusting the total amount of the green phosphor 16 and the red phosphor 17 per blue LED 14 and the mixing ratio of the green phosphor 16 and the red phosphor 17. Can be set as appropriate.
  • the peak wavelengths and the half-value widths of the emission spectra of the blue LED, the green phosphor and the red phosphor are within the following ranges.
  • the color temperature Tc of the mixed color light and its duv are adjusted so as to be within the following ranges.
  • Blue LED Peak wavelength 420nm to 470nm Half width greater than 0nm to 50nm or less
  • Green phosphor Peak wavelength 500nm to 535nm Half width 100nm to 110nm
  • Red phosphor Peak wavelength 610nm to 670nm Half width 85nm to 95nm
  • Mixed color light Color temperature Tc 4600K or more and 7200K or less duv -12 or more and -6 or less
  • FIG. 3 shows the measurement results of the emission spectra of these mixed color lights.
  • Various characteristics obtained from these are as follows. Various characteristics obtained from the measurement results are all within the target range. Therefore, it has been shown that an LED module within the above range can actually be manufactured.
  • FIG. 4 is an xy chromaticity diagram for explaining a chromaticity range of the LED module according to the embodiment of the present invention.
  • a region A in the figure is the chromaticity range of the mixed color light of the present embodiment.
  • Figure 4 shows the light bulb color L (2600K to 3250K), warm white WW (3250K to 3800K), white W (3800K to 4500K), day white N (4600K) as defined in Japanese Industrial Standard JIS Z9112.
  • the chromaticity range of daylight color D (5700K or more and 7100K or less) is also shown.
  • the chromaticity range of the mixed light according to the present embodiment is such that the color temperature Tc is 4600K or more and 7200K or less, and corresponds to the range of daylight white N to daylight color D. That is, the color temperature of the mixed color light is high. Further, since the duv of the mixed color light in the present embodiment is -12 or more and -6 or less, the xy chromaticity diagram has a lower range than the chromaticity range of the light source color defined in the same standard. The mixed color light under this condition has a lot of redness components included in the chromaticity range of JISZ9112, which means that color reproducibility is improved.
  • a highly saturated LED module can be realized.
  • the range of duv of mixed color light in this embodiment is determined using the isochromaticity region defined by MacAdam. Therefore, if it is in the range of the region A in FIG. 4, it can be said that the light color is almost equivalent, and the desired effect can be obtained.
  • the definition of the isochromaticity region is described in, for example, Color Science Handbook, 2nd edition, page 273.
  • the LED module capable of realizing high saturation has been described, but higher saturation may be required in some cases.
  • an LED module capable of realizing further high saturation will be described.
  • the color gamut area ratio Ga which is an index that quantitatively shows the color vividness of the illuminated object, will be described, and then, to achieve the high saturation obtained by using the color gamut area ratio Ga. Means will be described. Since the structure of the LED module itself is the same as described above, description thereof is omitted.
  • the color gamut area ratio Ga is described in JIS Z8726-1990, and the calculation method is as follows.
  • the reference light source is black body radiation having the same correlated color temperature as the sample light source, or CIE daylight.
  • the test colors numbered 1 to 8 used to calculate the color gamut area ratio Ga have various hues, and their Munsell lightness is all 6. This is a color sample with medium vividness. Therefore, the color gamut area ratio Ga is used as an index of average vividness for all colors.
  • the color gamut area ratio Ga is less than 100, the saturation tends to decrease, so the color tends to look dull.
  • the color gamut area ratio Ga is greater than 100, the saturation tends to increase, so the color tends to look vivid. It is in. Since general object colors generally feel finer as the saturation appears to increase, it is effective to use the color gamut area ratio Ga as an index for evaluating whether the color looks preferable.
  • FIG. 5 shows a U * V * uniform color space for a sample having a color temperature Tc of 6200K and a duv of -10.
  • the color gamut area ratio Ga at this time was 105.
  • the blue LED, green phosphor and red phosphor are the same as those already described. That is, the peak wavelength of the green phosphor is 500 nm to 535 nm, and the peak wavelength of the red phosphor is 610 nm to 670 nm.
  • the green is 520nm and is red in the middle 640nm intermediate, i.e., a data of the case where the difference [Delta] [lambda] R-G a moderate 120 nm.
  • Figure 6 (d) green is is red minimum 610nm minimum 520 nm, that is, data of the case where the difference [Delta] [lambda] R-G a moderate 110 nm.
  • FIG. 6 (e) green is the smallest 500nm red is the largest 670 nm, that is, data of the case where the difference [Delta] [lambda] R-G is the maximum of 170 nm.
  • the color gamut area ratio Ga is less than 100 in only four examples. In all other cases, the color gamut area ratio Ga is 100 or more, so that high saturation can be realized. The inventors have found that the color gamut area ratio Ga is 100 or more using the enormous amount of the obtained data of the color gamut area ratio Ga when the following condition is satisfied. .
  • FIGS. 7A to 7C show ⁇ RB with respect to the color temperature Tc when duv is fixed to ⁇ 6, ⁇ 9, and ⁇ 12, respectively, and the ranges satisfying the following formulas 2 to 4 Is shown.
  • FIGS. 8A to 8C show ⁇ RB with respect to duv when the color temperature Tc is fixed to 4600K, 6000K, and 7200K, respectively. The ranges satisfying the following expressions 5 to 7 are satisfied. Show.
  • the color gamut area ratio Ga can be increased to 100 or more by adjusting the color temperature and chromaticity range of the mixed color light so as to satisfy the formula 1, and as a result, an LED module with higher saturation can be obtained. Can be realized.
  • ⁇ Supplement> 1 Structure of LED Module
  • the structure of the LED module has been described with reference to FIG. 1A.
  • the present invention is not limited as long as it includes a blue LED, a green phosphor, and a red phosphor.
  • the structure can also be applied.
  • the one shown in FIG. 1B includes a circuit board 22, a wiring pattern 23, a blue LED 24, a transparent sealing material 25, a green phosphor 26, and a red phosphor 27.
  • a bullet-type LED module may be used.
  • Lighting device A The LED module can be applied to a lighting device as shown below.
  • FIG. 9A shows an example in which the LED module 11 is applied to a straight tube type lighting device 101.
  • the lighting device 101 includes a straight tubular transparent member 102, a base 103, a substrate 104, and an LED module 11.
  • a straight tube type is used, but it is naturally applicable to a circular tube type.
  • FIG. 9B shows an example in which the LED module 21 is applied to a light bulb-shaped illumination device 111.
  • the lighting device 111 includes a body 112, a base 113, a substrate 114, a globe 115, and an LED module 21.
  • FIG. 9C shows an example in which the LED module 11 is applied to a cylindrical illumination device 121.
  • the lighting device 121 includes a cylindrical casing 122, a substrate 123, a transparent member 124, and the LED module 11.
  • Lighting device B Although the said illuminating device applies the LED module which radiate
  • FIG. 10A shows an example in which the LED module 31 that emits blue light is applied to the straight tube type illumination device 201.
  • the lighting device 201 includes a straight tubular transparent member 102, a base 103, a substrate 104, a phosphor layer 202, and an LED module 31.
  • the phosphor layer 202 includes a green phosphor and a red phosphor, and is formed on the inner surface of the transparent member 102.
  • the phosphor layer 202 is not limited to the inner surface of the transparent member 102 and may be formed on the outer surface. Further, the transparent member 102 itself may include a green phosphor and a red phosphor.
  • FIG. 10B shows an example in which the LED module 41 that emits blue light is applied to the light bulb-shaped illumination device 211.
  • the lighting device 211 includes a body 112, a base 113, a substrate 114, a globe 115, a phosphor layer 212, and an LED module 41.
  • the phosphor layer 212 includes a green phosphor and a red phosphor, and is formed on the inner surface of the globe 115.
  • the phosphor layer 212 is not limited to the inner surface of the globe 115 and may be formed on the outer surface.
  • the globe 115 itself may include a green phosphor and a red phosphor.
  • FIG. 10C shows an example in which the LED module 31 is applied to a cylindrical illumination device 221.
  • the lighting device 221 includes a cylindrical casing 122, a substrate 123, a transparent member 124, a phosphor layer 222, and an LED module 31.
  • the phosphor layer 222 includes a green phosphor and a red phosphor, and is formed on the inner surface of the transparent member 124.
  • the phosphor layer 222 is not limited to the inner surface of the transparent member 124 but may be formed on the outer surface. Further, the transparent member 124 itself may include a green phosphor and a red phosphor.
  • the lighting device can be applied to, for example, a product display lamp.
  • the lamps for displaying merchandise include lamps built in merchandise display devices such as showcases, and lamps provided on ceiling surfaces, wall surfaces, and shelves of stores and warehouses.
  • the LED module is also suitable for producing spot light, it can be substituted for a field in which a halogen lamp with a reflector has been conventionally used.
  • the present invention can be used for a lamp.
  • LED module 12 Package base 13 Lead 14 Blue LED DESCRIPTION OF SYMBOLS 15 Transparent sealing material 16 Green fluorescent substance 17 Red fluorescent substance 21 LED module 22 Circuit board 23 Wiring pattern 24 Blue LED 25 Transparent sealing material 26 Green phosphor 27 Red phosphor 31 LED module 41 LED module 101 Illumination device 102 Transparent member 103 Base 104 Substrate 111 Illumination device 112 Body 113 Base 114 Substrate 115 Globe 121 Illumination device 122 Housing 123 Substrate 124 Transparent Member 201 Illuminating device 202 Phosphor layer 211 Illuminating device 212 Phosphor layer 221 Illuminating device 222 Phosphor layer

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
PCT/JP2011/004779 2011-02-03 2011-08-29 Ｌｅｄモジュールおよび照明装置 WO2012104937A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201180065762.4A CN103329293B (zh) 2011-02-03 2011-08-29 Led模块以及照明装置
EP11857477.1A EP2672532B1 (de) 2011-02-03 2011-08-29 Led-modul und beleuchtungsvorrichtung damit
JP2012503812A JPWO2012104937A1 (ja) 2011-02-03 2011-08-29 Ｌｅｄモジュールおよび照明装置
US13/978,890 US8933620B2 (en) 2011-02-03 2011-08-29 White light LED module with green and red phosphors and illumination device having the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011021797 2011-02-03
JP2011-021797 2011-02-03

Publications (1)

Publication Number Publication Date
WO2012104937A1 true WO2012104937A1 (ja) 2012-08-09

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PCT/JP2011/004779 WO2012104937A1 (ja) 2011-02-03 2011-08-29 Ｌｅｄモジュールおよび照明装置

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US (1) US8933620B2 (de)
EP (1) EP2672532B1 (de)
JP (1) JPWO2012104937A1 (de)
CN (1) CN103329293B (de)
WO (1) WO2012104937A1 (de)

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JP2014186998A (ja) * 2013-02-25 2014-10-02 Rohm Co Ltd Ｌｅｄ照明器具およびショーケース
JP2014197673A (ja) * 2013-03-04 2014-10-16 三菱化学株式会社 半導体発光素子を含む発光装置、発光装置の設計方法、発光装置の駆動方法、および照明方法
JP2017143782A (ja) * 2016-02-17 2017-08-24 ウシオ電機株式会社 集魚灯装置
US9797576B2 (en) 2014-09-12 2017-10-24 Panasonic Intellectual Property Management Co., Ltd. Luminaire
US9923126B2 (en) 2014-04-30 2018-03-20 Sharp Kabushiki Kaisha Light emitting device having high color rendering using three phosphor types
JP2018147895A (ja) * 2013-12-27 2018-09-20 シチズン電子株式会社 発光装置及び発光装置の設計方法
US10187954B2 (en) 2016-11-29 2019-01-22 Panasonic Intellectual Property Management Co., Ltd. Lighting apparatus for display illumination
US11450789B2 (en) 2013-12-27 2022-09-20 Citizen Electronics Co., Ltd. Illumination method using a light-emitting device

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US8933478B2 (en) * 2013-02-19 2015-01-13 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
CN107018593B (zh) 2013-03-04 2020-01-07 西铁城电子株式会社 发光装置
TWI483045B (zh) * 2013-06-20 2015-05-01 Au Optronics Corp 顯示器
KR20150125120A (ko) * 2014-04-29 2015-11-09 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
EP3274423B1 (de) * 2015-03-24 2019-09-18 Koninklijke Philips N.V. Blauemittierende phosphorkonvertierte led mit blauem pigment
EP3289283B1 (de) * 2015-04-27 2022-11-02 B/E Aerospace, Inc. Flexibles led-beleuchtungselement
JP6640852B2 (ja) 2015-06-24 2020-02-05 株式会社東芝 白色光源システム
WO2017062817A1 (en) * 2015-10-07 2017-04-13 B/E Aerospace, Inc. Flexible led lighting element
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EP2672532A4 (de) 2016-10-26
EP2672532A1 (de) 2013-12-11
EP2672532B1 (de) 2019-05-22
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US8933620B2 (en) 2015-01-13

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