WO2012099361A2 - Appareil permettant la fixation d'un bloc de substrats - Google Patents

Appareil permettant la fixation d'un bloc de substrats Download PDF

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Publication number
WO2012099361A2
WO2012099361A2 PCT/KR2012/000329 KR2012000329W WO2012099361A2 WO 2012099361 A2 WO2012099361 A2 WO 2012099361A2 KR 2012000329 W KR2012000329 W KR 2012000329W WO 2012099361 A2 WO2012099361 A2 WO 2012099361A2
Authority
WO
WIPO (PCT)
Prior art keywords
substrate block
beam member
substrate
fixing
adhesive
Prior art date
Application number
PCT/KR2012/000329
Other languages
English (en)
Other versions
WO2012099361A3 (fr
Inventor
Eun Seok Oh
Keum Young Lee
Kuk Seon LEE
Original Assignee
Nexolon Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nexolon Co., Ltd. filed Critical Nexolon Co., Ltd.
Publication of WO2012099361A2 publication Critical patent/WO2012099361A2/fr
Publication of WO2012099361A3 publication Critical patent/WO2012099361A3/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present disclosure relates to an apparatus for fixing a substrate block, and more particularly, to an apparatus for fixing a substrate block for fixing the substrate block while a slicing process for slicing a substrate block to form a plurality of substrates is performed.
  • a slicing process for thinly slicing a substrate block in a silicon block shape is performed.
  • an apparatus for fixing a substrate block is used.
  • Fig. 1 is a conceptual diagram of an apparatus 1 for fixing a substrate block according to related art.
  • a substrate block 10 generally has a rectangular block shape overall.
  • the four corner portions of the substrate block 10 are chamfered, and the substrate block 10 includes a side surface 11 having a plane shape and corner surfaces 12 formed to be inclined with respect to the side surface 11 at both ends of the side surface 11.
  • the substrate block 10 is adhered and fixed to a beam member 20 of the fixing apparatus. Specifically, an adhesive 30 is applied to an adhesion surface 21 of the beam member 21, and the side surface 11 of the substrate block 10 is pressed and attached to the adhesion surface 21.
  • a wire saw 40 enters a surface opposite to the side surface 11 and slices the substrate block 10 while moving in the direction of an arrow 51.
  • the wire saw 40 is coated with a slurry 41 for providing frictional force needed to slide the substrate block 10 (that is, providing a blade for slicing the substrate block 10).
  • the wire saw 40 slices the substrate block 10 while rapidly moving in the direction of an arrow 52 relative to the substrate block 10 at the same time when the overall wire saw 40 is moved in the direction of the arrow 51. That is, as shown in Fig. 1, on the basis of a predetermined length of the wire saw 40, the wire saw 40 goes into the substrate block 10 from the left and goes out to the right.
  • a process of pressing and attaching the side surface 11 of the substrate block 10 to the adhesion surface 21 of the beam member 20 is performed.
  • the adhesive 30 is pressed and flows down to cover the corner surfaces 12.
  • the wire saw 40 in a case where the wire saw 40 is moved to the vicinity of the corner surface 12 of the substrate block 10 and slices the substrate block 10, the wire saw 40 comes into contact with the adhesive 30 applied to the corner surface 12.
  • the slurry 41 coated on the wire saw 40 is peeled off by the adhesive 30, and thus the number of effective blades for slicing the substrate block 10 is reduced. Consequently, the slicing ability of the wire saw 40 is significantly reduced, and a large number of saw marks occur on the sliced surfaces. Therefore, the quality of the substrates is degraded as such.
  • the substrate block 10 and the beam member 20 are simultaneously sliced. After the slicing process is completed, the substrates sliced as sheets and the beam member 20 are separated from each other, and then a detaching process for removing the adhesive 30 remaining on the substrate is performed.
  • the adhesive 30 is applied to not only the side surface 11 of the substrate block 10 but also the corner surfaces 12, the area of the substrate block 10 coming into contact with the adhesive 30 is wider than that of the beam member 20. Therefore, when the substrate and the beam member 20 are separated from each other, most of the adhesive 30 remains on the substrate due to a surface tension with the adhesive 30.
  • the present disclosure is directed to providing an apparatus for fixing a substrate block capable of preventing an occurrence of saw marks on a substrate during a slicing process, and minimizing a damage of the substrate that occurs during a process for removing an adhesive from the substrate.
  • the present disclosure provides an apparatus for fixing a substrate block for slicing a substrate block which includes a side surface having a plane shape and corner surfaces formed at both ends of the side surface to be inclined with respect to the side surface, and fixing the substrate block so as to form a plurality of substrates, including: a beam member in which an adhesion surface to be adhered to the side surface of the substrate block is formed, wherein a mucous adhesive to adhere the side surface of the substrate block to the adhesion surface is applied to the adhesion surface, and a width of the adhesion surface is formed to be smaller than a width of the side surface of the substrate block, so as to prevent the adhesive from flowing to the corner surfaces of the substrate block and being applied to the corner surfaces when the substrate block is adhered to the beam member.
  • the beam member may include inclined surfaces formed at both ends of the adhesion surface to be inclined with respect to the adhesion surface in a direction away from the substrate block.
  • the inclined surface may be formed to be inclined at 10 degrees to 80 degrees with respect to the adhesion surface. More specifically, the inclined surface may be formed to be inclined at 45 degrees with respect to the adhesion surface.
  • the beam member may be formed of any one of glass, steel, a carbon composite material, and a plastic material.
  • the adhesive does not flow along the corner surfaces of the substrate block, and peeling of the slurry from the wire saw is prevented, so that an occurrence of saw marks on the substrate can be prevented.
  • Fig. 1 shows an apparatus for fixing a substrate block according to related art.
  • Fig. 2 is a perspective view of an apparatus for fixing a substrate block according to an embodiment of the disclosure.
  • Fig. 3 is a plan view of the apparatus for fixing a substrate block according to an embodiment of the disclosure.
  • Fig. 4 is a graph of performance experiment results of comparison between the apparatus for fixing a substrate block according to the related art and the apparatus for fixing a substrate block according to an embodiment of the disclosure.
  • substrate block 11 side surface
  • Fig. 2 is a perspective view of an apparatus 100 for fixing a substrate block according to an embodiment of the disclosure.
  • the apparatus 100 for fixing a substrate block includes a beam member 110 to which a substrate block 130 may be fixed and a mounting member 101 joined to the upper surface of the beam member 110.
  • the mounting member 101 is a member for fixing the beam member 110 and a substrate block 130 fixed to the beam member 110 to an apparatus (not shown) for slicing a substrate block and includes a joining portion 102 that may be joined to the apparatus for slicing a substrate block.
  • the configuration of the mounting member 101 departs from the scope of the technical concept of the disclosure, so that detailed description thereof will be omitted here.
  • the beam member 110 includes an adhesion surface 111 to which the substrate block 130 is adhered, and inclined surfaces 112 formed at both ends of the adhesion surface 111 to be inclined with respect to the adhesion surface 111 in a direction away from the substrate block 130.
  • the width of the upper surface may be 100 mm to 300 mm, the length may be 200 mm to 2000 mm, the thickness may be 3 to 80 mm, and the length of the inclined surface 112 may be 2.5 to 100 mm.
  • the width of the upper surface is 158 mm, the length is 820 mm, the width of the adhesion surface 111 is 138 mm, and the thickness is 15 mm.
  • the inclined surface 112 may be formed to be inclined at 10 degrees to 80 degrees with respect to the adhesion surface 111 according to process conditions. In this embodiment, the inclined surface 112 is formed to be inclined at 45 degrees with respect to the adhesion surface 111.
  • the beam member 110 may be formed of any one of glass, steel, a carbon composite material, and a plastic material. In this embodiment, the beam member 110 is formed of a glass material.
  • Fig. 3 is a plan view of the apparatus 100 for fixing a substrate block according to this embodiment. In Fig. 3, illustration of the mounting member 101 is omitted.
  • the apparatus 100 for fixing a substrate block fixes the substrate block 130 having a rectangular shape overall.
  • the four corner portions of the substrate block 130 are chamfered, and the substrate block 130 includes a side surface 131 having a plane shape and corner surfaces 132 formed at both ends of the side surface 131 to be inclined with respect to the side surface 131.
  • the width of the adhesion surface 111 provided in the beam member 110 is smaller than the width of the side surface 131 of the substrate block 130.
  • the substrate block 130 is adhered and fixed to the beam member 110 of the fixing apparatus 100. Specifically, an adhesive 120 is applied to the adhesion surface 111 of the beam member 110, and the side surface 131 of the substrate block 130 is pressed and attached to the adhesion surface 111.
  • a glue in a mucous state is used as the adhesive 120.
  • the adhesive 120 In order to firmly fix the substrate block 130 onto the beam member 110, the adhesive 120 needs to be uniformly applied on the entire adhesion surface 111.
  • a wire saw 140 enters a surface opposite to the side surface 131 of the substrate block 130 and slices the substrate block 130 while moving in the direction of an arrow 151.
  • the wire saw 140 is coated with a slurry 141 for providing frictional force needed to slice the substrate block 130 (that is, providing a blade for slicing the substrate block 130).
  • the wire saw 140 slices the substrate block 130 while rapidly moving in the direction of an arrow 152 relative to the substrate block 130 at the same time when the overall wire saw 140 is moved in the direction of the arrow 151. That is, as shown in Fig. 3, on the basis of a predetermined length of the wire saw 140, the wire saw 140 goes into the substrate block 130 from the left and goes out to the right.
  • the width of the adhesion surface 111 provided in the beam member 110 is smaller than the width of the side surface 131 of the substrate block 130, and the inclined surfaces 112 are formed on both sides of the adhesion surface 111. Therefore, as shown in Fig. 3, when the substrate block 130 is pressed and attached to the adhesion surface 111 of the beam member 110, a part of the adhesive 120 deviates from the adhesion surface 111 while the adhesive 120 is pressed.
  • the overflowing adhesive 120 is applied onto the inclined surface 112 while flowing along the inclined surface 112 due to a surface tension with the inclined surface 112. Therefore, when the substrate block 130 is adhered to the beam member 110, the adhesive 120 does not flow toward the corner surfaces 132 of the substrate block 130.
  • the wire saw 140 does not come into contact with the adhesive 120, so that the amount of the slurry 141 coated on the wire saw 140 is maintained as it is. Therefore, the slicing ability of the wire saw 140 is maintained as it is, and the possibility of saw mark formation is reduced as such, thereby enhancing the quality of the substrate.
  • the adhesive 120 when the adhesive 120 is pressed, the adhesive 120 flows along the inclined surface 112 and is simultaneously coated on the adhesive surface 111 and inclined surface 112. Therefore, a contact area of the beam member 110 and the adhesive 120 is greater than a contact area of the substrate block 130 and the adhesive 120, so that a surface tension with the beam member 110 is greater than that with the substrate block 130.
  • the detaching process for removing the adhesive 120 remaining on the block is performed much more easily, and the substrate can be prevented from being damaged or bent during the detaching process.
  • Fig. 4 is a graph of performance experiment results of comparison between the apparatus for fixing a substrate block according to the related art and the apparatus 100 for fixing a substrate block according to an embodiment of the disclosure.
  • the width of the adhesion surface of the beam member is greater than the width of the side surface of the substrate block, and the beam member is not provided with the inclined surface.
  • Other process conditions are set in the same manner except for the differences.
  • the graph on the left with respect to the dotted line at the center shows the results of inspection of the states of substrates formed by fixing a single substrate block to the fixing apparatus 100 according to this embodiment, performing the slicing process, and then completing the detaching process (the results of this embodiment).
  • the graph on the right with respect to the dotted line at the center shows the results of inspection of the states of substrates formed by fixing a single substrate block to the fixing apparatus according to the related art, performing the slicing process, and then completing the detaching process (the results of the related art).

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Un appareil permettant la fixation d'un bloc de substrats afin de couper un bloc de substrats en rondelles comprenant une surface latérale présentant une forme plate et des surfaces de coin formées au niveau des deux extrémités de la surface latérale devant être inclinées par rapport à la surface latérale, et la fixation du bloc de substrats de manière à former une pluralité de substrats, comprend : un élément de poutre dans lequel une surface d'adhésion destinée à adhérer à la surface latérale du bloc de substrats est formée, un adhésif muqueux destiné à faire adhérer la surface latérale du bloc de substrats à la surface d'adhésion étant appliqué sur la surface d'adhésion, et une largeur de la surface d'adhésion étant formée de manière à être inférieure à une largeur de la surface latérale du bloc de substrats.
PCT/KR2012/000329 2011-01-21 2012-01-13 Appareil permettant la fixation d'un bloc de substrats WO2012099361A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR2020110000623U KR200464626Y1 (ko) 2011-01-21 2011-01-21 기판 블록 고정장치
KR20-2011-0000623 2011-01-21

Publications (2)

Publication Number Publication Date
WO2012099361A2 true WO2012099361A2 (fr) 2012-07-26
WO2012099361A3 WO2012099361A3 (fr) 2012-11-22

Family

ID=46516206

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Application Number Title Priority Date Filing Date
PCT/KR2012/000329 WO2012099361A2 (fr) 2011-01-21 2012-01-13 Appareil permettant la fixation d'un bloc de substrats

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KR (1) KR200464626Y1 (fr)
TW (1) TWI440128B (fr)
WO (1) WO2012099361A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103522428A (zh) * 2013-10-16 2014-01-22 内蒙古中环光伏材料有限公司 一种太阳能硅片加工方法及装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11262852A (ja) 1998-03-19 1999-09-28 Shin Etsu Handotai Co Ltd 切断終了検知装置付ワイヤーソー装置 及びワークの切断方法
CH696431A5 (fr) * 2003-04-01 2007-06-15 Hct Shaping Systems Sa Procédé et dispositif de sciage par fil.
JP4721743B2 (ja) * 2005-03-29 2011-07-13 京セラ株式会社 半導体ブロックの保持装置
JP5117880B2 (ja) 2008-02-21 2013-01-16 セイコーインスツル株式会社 ウエハの作製方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103522428A (zh) * 2013-10-16 2014-01-22 内蒙古中环光伏材料有限公司 一种太阳能硅片加工方法及装置

Also Published As

Publication number Publication date
WO2012099361A3 (fr) 2012-11-22
KR20120005507U (ko) 2012-07-31
TW201243993A (en) 2012-11-01
KR200464626Y1 (ko) 2013-01-21
TWI440128B (zh) 2014-06-01

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