Classifications

• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
  • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
  • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
  • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K3/00—Materials not provided for elsewhere
  • C09K3/14—Anti-slip materials; Abrasives
  • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
  • C09K3/1463—Aqueous liquid suspensions

Definitions

• the present invention relates to various glass substrate polishing compositions such as glass substrates for hard disks, glass substrates for optical disks, glass substrates for plasma displays (PDP), glass substrates for liquid crystal displays (LCD), and glass substrates for photomasks (hereinafter referred to as polishing). And a polishing slurry using the same. More specifically, the present invention relates to a polishing composition and polishing slurry excellent in improving finished surface roughness and surface irregularity defects.
• Patent Document 1 proposes a polishing slurry containing an aliphatic amine having a primary amino group or ammonia.
• Patent Document 2 a polishing slurry containing carbonate or sulfate is proposed.
• the polishing composition using the prior art still has a problem in that the finished surface roughness suitable for increasing the recording density is not obtained.
• the subject of this invention is providing the polishing composition for preparing the polishing slurry which can improve a finishing surface roughness and surface unevenness defect, and the said polishing slurry in the process of a glass substrate.
• the present inventor has found that a polishing slurry containing a specific polishing composition and abrasive grains solves the above problems, and has completed the present invention.
• a composition for polishing a glass substrate comprising the components (A) and (B).
• a composition for polishing a glass substrate comprising the components (A) and (B).
• a composition for polishing a glass substrate comprising the components (A), (B) and (C).
• A) a tetrazole derivative having at least one group selected from a mercapto group, an alkylthio group and an alkyl group B
• C a high molecular polysaccharide
• a composition for polishing a glass substrate comprising the components (A), (B), (C) and (D).
• A a tetrazole derivative having at least one group selected from a mercapto group, an alkylthio group and an alkyl group
• B water
• C a high molecular polysaccharide
• Any of the above items 1 to 3 comprising (A) 0.01 to 20% by weight, (C) 0.01 to 20% by weight, (D) 0.01 to 20% by weight, and (B) the remainder.
• a polishing slurry comprising the polishing composition according to any one of the above and polishing abrasive grains.
• the present invention it is possible to improve finished surface roughness and surface irregularity defects in the processing of various glass substrates. Furthermore, the polishing rate can be improved.
• composition for glass substrate polishing of this invention is demonstrated in detail below.
• alkylthio group include a lower alkylthio group having 1 to 4 carbon atoms
• examples of the alkyl group include carbon. Examples thereof include lower alkyl groups of 1 to 4.
• the water is preferably purified water such as ion exchange water or pure water.
• Examples of the (C) high molecular polysaccharide include pullulan, amylose, amylopectin, glycogen, dextrin, hyaluronic acid and the like.
• the amine is not particularly limited, and examples thereof include linear or cyclic alkylamines having 1 to 10 carbon atoms such as isopropylamine, cyclohexylamine, diethylamine, triethylamine, monoethanolamine, diethanolamine, triethanolamine, monoisopropanol.
• polyhydric alcohols include polyhydric alcohols and alkyl ethers of polyhydric alcohols, such as ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, butyl carbitol, Xylene glycol, butanediol, butyl diglycol, glycerin, ethylene glycol monomethyl ether, diethylene glycol dimethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, propylene glycol monobutyl ether Jie Glycol dimethyl ether, diethylene glycol diethyl ether, sorbitol, sucrose and the like.
• polyhydric alcohols such as ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol,
• the content of components (A) to (D) in the polishing composition is not particularly limited, but the content of component (A) is preferably 0.01 to 20% by weight, more preferably 0.05 to 10% by weight. Preferably, 0.1 to 5% by weight is more preferable, and 1 to 5% by weight is most preferable. If content of a component (A) is the said range, the finishing surface roughness and the improvement effect of a surface uneven
• the content of the polymeric polysaccharide (C) is preferably 0.01 to 20% by weight, more preferably 0.05 to 10% by weight, further preferably 0.1 to 5% by weight, and 1 to 5% by weight. Most preferred.
• the amine (D) content is preferably 0.01 to 20% by weight, more preferably 0.05 to 10% by weight, still more preferably 0.1 to 5% by weight, and most preferably 1 to 5% by weight. If content of a component (D) is the said range, pH can be adjusted to alkalinity and the finishing surface roughness and the improvement effect of a surface uneven
• the polishing slurry of the present invention can be obtained by dispersing abrasive grains in the polishing composition of the present invention.
• abrasive grains for example, various known abrasive grains such as colloidal silica, fumed silica, diamond, alumina, ceria, zirconia, and titania can be applied. Of these, colloidal silica and zirconia are preferred as the abrasive grains.
• the size of the colloidal silica is generally about 0.001 to 1 ⁇ m, preferably 0.001 to 0.5 ⁇ m, more preferably about 0.001 to 0.2 ⁇ m.
• the colloidal silica content in the polishing slurry is not particularly limited, but is usually 40% by weight or less, preferably 0.1 to 20% by weight.
• the size of zirconia is generally about 0.1 to 15 ⁇ m, preferably about 0.1 to 10 ⁇ m, more preferably about 0.1 to 5 ⁇ m.
• the content of zirconia in the polishing slurry is not particularly limited, but is usually 20% by weight or less, preferably 0.1 to 10% by weight.
• the glass substrate polished by the glass substrate polishing composition of the present invention and the polishing slurry is not particularly limited.
• the main component is silicic acid, and the glass contains a metal compound such as alumina, sodium oxide, or potassium oxide. May be.
• the polishing slurry of the present invention is a polishing slurry for processing a glass substrate, and is a polishing slurry for processing a hard disk NiP alloy substrate, a water-soluble cutting process of a normal iron or aluminum material, a water-soluble grinding process, a water-soluble polishing process Liquid is to be distinguished.
• circulation is generally used, and the required performance differs greatly in secondary performance such as antiseptic, antifoaming, and rust prevention.
• Examples 1 to 8 and Comparative Examples 1 to 6 Compositions for polishing a glass substrate were prepared by blending the components shown in Tables 1 to 3 below (numerical values are% by weight). Pure water was used as the water.
• N- (2-aminoethyl) piperazine (AEP) of Comparative Example 1 is an aliphatic amine having a primary amino group used in WO2004 / 100242 (Patent Document 1).
• the potassium carbonate of Comparative Example 2 is a carbonate used in JP-A-2006-315160 (Patent Document 2).
• 1H-tetrazole, imidazole, and benzotriazole are heterocyclic compounds that are generally used in polishing slurries of metal materials.
• the polishing slurry for glass substrate contains colloidal silica by adding 1875 g of colloidal silica slurry (Adelite AT-40: silica concentration 40%, primary particle diameter 10-20 nm) after diluting 250 g of the polishing composition with 2875 g of pure water. A polishing slurry having an amount of 15% by weight was prepared. Polishing evaluation of the hard disk glass substrate was performed using this polishing slurry. The results are shown in Tables 1-3.
• the results of the surface roughness after polishing (finished surface roughness), the maximum height difference and the polishing rate in Tables 1 to 3 indicate that the performance of N- (2-aminoethyl) piperazine (AEP) in Comparative Example 1
• the relative comparison is 00.
• the characteristics of Examples 1 to 8 and Comparative Examples 1 to 6 were measured by the following method. Polishing characteristics evaluation A suede pad (Supreme RN-R manufactured by Nitta Haas Co., Ltd.) is installed in a CMP polishing apparatus (NF-300 manufactured by Nano Factor), and the platen rotation speed is 30 rpm and the head rotation speed is 30 rpm.
• Polishing evaluation was performed on a hard disk glass substrate having a diameter of 2.5 inches with a polishing time of 5 minutes while supplying the polishing slurry at a rate of 150 ml / min under the condition of a pressure of 90 g / cm 2 .
• Polishing evaluation was performed by evaluating the surface roughness after polishing (finished surface roughness), the maximum height difference, and the polishing rate.
• polishing, the maximum height difference, and the measuring method of polishing rate were measured with the following method.
• the maximum height difference is the distance between the maximum peak (Rp) and the maximum valley (Rv) on the glass surface, and is a method for evaluating surface irregularities.
• the maximum height difference after polishing was measured in the AFM mode using a scanning probe microscope (SPA-400).
• Polishing rate The weight change of the glass substrate before and after polishing was measured with an electronic balance (LE225D manufactured by Sartorius) to determine the polishing amount, and the polishing rate was determined. From Table 1, it can be confirmed that the polishing compositions of Examples 1 to 3 are improved from Comparative Examples 1 to 3 in terms of surface roughness (finished surface roughness) and maximum height difference.
• the polishing compositions of Examples 2 and 4 to 6 are improved from 1H-tetrazole, imidazole, and benzotriazole of Comparative Examples 4 to 6 in terms of surface roughness (finished surface roughness) and maximum height difference. I can confirm that. From Table 3, it can be confirmed that the maximum height difference is greatly improved by the addition of the polymeric polysaccharide. Furthermore, it can be confirmed that both the surface roughness (finished surface roughness) and the maximum height difference can be achieved by adding the polymer polysaccharide and the amine. Examples 9 to 10 and Comparative Example 7 A composition for polishing a glass substrate was prepared by blending the components shown in Table 4 below (numerical values are% by weight). Pure water was used as the water. Comparative Example 7 is only water.
• the glass substrate polishing slurry was prepared by diluting 10 g of the polishing composition with 170 g of pure water and then adding 20 g of zirconia (manufactured by Kishida Chemical Co., Ltd .: particle diameter of about 4 ⁇ m) to prepare a polishing slurry having a zirconia content of 10 wt%. . Polishing evaluation of the hard disk glass substrate was performed using this polishing slurry. The results are shown in Table 4. The results of surface roughness after polishing (finished surface roughness), maximum height difference, and polishing rate in Table 4 were shown by relative comparison with each performance of Comparative Example 1 being 1.00. The characteristics of Examples 9 to 10 and Comparative Example 7 were measured by the following method.
• Polishing characteristic evaluation Urethane pad (IC1000 manufactured by Nitta Haas Co., Ltd.) is installed in a CMP polishing apparatus (NF-300 manufactured by Nano Factor), platen rotation speed 50 rotations / minute, head rotation speed 50 rotations / minute, polishing pressure 360 g / Polishing evaluation was performed on a hard disk glass substrate having a diameter of 2.5 inches with a polishing time of 2 minutes while supplying the polishing slurry at a rate of 50 ml / min under the condition of cm 2 . Polishing evaluation was performed by evaluating the surface roughness after polishing (finished surface roughness), the maximum height difference, and the polishing rate.
• polishing, the maximum height difference, and the measuring method of polishing rate were measured with the following method.
• Surface Roughness Surface roughness (Ra) after polishing was measured in a DFM mode using a scanning probe microscope (SPM-9700, manufactured by Shimadzu Corporation).
• Maximum height difference The maximum height difference is the distance between the maximum peak (Rp) and the maximum valley (Rv) on the glass surface, and is a method for evaluating surface irregularities.
• the maximum height difference after polishing was measured in a DFM mode using a scanning probe microscope (SPM-9700, manufactured by Shimadzu Corporation).
• Polishing rate The weight change of the glass substrate before and after polishing was measured with an electronic balance (LE225D manufactured by Sartorius) to determine the polishing amount, and the polishing rate was determined. From Table 4, it can be confirmed that the polishing compositions of Examples 9 to 10 are improved from Comparative Example 7 in terms of surface roughness (finished surface roughness), maximum height difference and polishing rate.
• the glass substrate for hard disk the glass substrate for optical disk, the glass substrate for plasma display (PDP), the glass substrate for liquid crystal display (LCD), the glass substrate for photomask, etc. Applicable.

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• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Manufacturing & Machinery (AREA)
• Materials Engineering (AREA)
• Organic Chemistry (AREA)
• Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
• Manufacturing Of Magnetic Record Carriers (AREA)

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• 2011
  • 2011-11-30 SG SG2013043716A patent/SG191038A1/en unknown
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  • 2011-11-30 JP JP2012547881A patent/JP5531236B2/ja not_active Expired - Fee Related
  • 2011-11-30 WO PCT/JP2011/078231 patent/WO2012077693A1/ja active Application Filing
  • 2011-11-30 CN CN201180058490.5A patent/CN103249525B/zh not_active Expired - Fee Related

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